TWI447243B - Thin film antenna and the method of forming the same - Google Patents
Thin film antenna and the method of forming the same Download PDFInfo
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Description
本發明係關於一種天線,尤其是有關於一種薄膜式天線。The present invention relates to an antenna, and more particularly to a thin film antenna.
近年來無線傳輸技術乃普遍發展於世界各地,而絕大部分之無線裝置,如行動電話、個人數位助理以及數位電視等,均需使用接收傳輸訊號之接收裝置。由於資訊傳遞之數位化,使得如聲音訊號、影像訊號等之各種資訊得以輕易地由個人電腦、行動裝置等處理,而藉由聲音與影像編解碼技術,更可增進上述資訊種類之頻帶壓縮。而數位通訊與數位傳播能製造容易且有效地傳遞此種資訊至終端裝備之環境,例如將聲音影像資料(AV資料)傳遞至一可攜式電話。In recent years, wireless transmission technology has been widely developed all over the world, and most wireless devices, such as mobile phones, personal digital assistants, and digital televisions, need to use receiving devices that receive transmission signals. Due to the digitization of information transmission, various information such as audio signals and video signals can be easily processed by personal computers, mobile devices, etc., and audio and video encoding and decoding technologies can enhance the frequency band compression of the above information types. Digital communication and digital communication can create an environment that easily and efficiently delivers such information to terminal equipment, such as transmitting audiovisual material (AV data) to a portable telephone.
無線傳輸利用外部突出之天線進行裝置間訊號交換。射頻電路、傳輸線與天線元件通常製造在特別設計之基板上,針對這些電路之用途特殊,維持阻抗特性之控制乃不容忽視,所以在這些電路中,傳輸線與發射天線的長度便為關鍵之設計要素。兩個影響基底材料效能之重要關鍵因素為介電常數(有時稱作相對介電常數)以及介電損失(有時稱作散逸係數),其中介電常數決定訊號於基底材料中之傳遞速度,以及傳輸線與其他施作在基板上之零件的訊號收發相關長度。而介電損失係為訊號於基底材料中傳遞所造成之耗損,此耗損會隨頻率之變大而增多。Wireless transmission uses an externally protruding antenna for signal exchange between devices. RF circuits, transmission lines and antenna elements are usually fabricated on specially designed substrates. For the purpose of these circuits, the control of maintaining impedance characteristics cannot be ignored. Therefore, in these circuits, the length of transmission lines and transmitting antennas is a key design element. . Two important key factors affecting the performance of the substrate material are the dielectric constant (sometimes referred to as the relative dielectric constant) and the dielectric loss (sometimes referred to as the dissipation factor), where the dielectric constant determines the rate at which the signal is transmitted in the substrate material. And the length of the transmission line associated with the transmission and transmission of other components applied to the substrate. The dielectric loss is the loss caused by the transmission of the signal in the base material, and the loss increases as the frequency becomes larger.
微帶(micro-strip)天線結構,將訊號線放置在板狀物表面並提供一導電層,此導電層一般稱為接地面。另一種為埋式微帶線(buried micro-strip)天線結構,除了其訊號線被一介電基底材料覆蓋外,其餘均與第一種結構相似。第三種為帶狀線(strip-line)結構,其訊號線乃夾在兩導電(接地)面之間,並且天線配置在印刷電路板之主要平面上。對於車輛之應用,此類系統絕大部分的解決方式均為將鞭狀天線安裝在車頂,而相對於現今汽車設計之潮流,乃將這些天線嵌入車輛結構中,以減少天線對於車輛美觀上與空氣動力上之影響。並且,將數種電信服務整合進單一天線將可降低製造之成本。天線可接收頻帶包含:調頻(Frequency Modulation;FM)、個人手機系統(Personal Handyphone System;PHS)、Wireless car aperture、全球移動通信系統(System For Mobile;GSM 900、GSM 1800)、分碼多重存取(Code Division Multiple Access;CDMA)、一般封包式無線服務(General Package Radio Service;GPRS)、藍芽(Bluetooth)、無線網路(Wireless Local Area Network;WLAN)以及數位電視之頻帶。A micro-strip antenna structure places a signal line on the surface of the board and provides a conductive layer, which is generally referred to as a ground plane. The other is a buried micro-strip antenna structure, which is similar to the first structure except that its signal line is covered by a dielectric substrate material. The third type is a strip-line structure in which the signal lines are sandwiched between two conductive (ground) planes, and the antennas are disposed on the main plane of the printed circuit board. For vehicle applications, most of the solutions for such systems are to mount the whip antenna on the roof of the car. Compared to the current trend of car design, these antennas are embedded in the vehicle structure to reduce the antenna aesthetics. With the influence of aerodynamics. Moreover, the integration of several telecommunications services into a single antenna will reduce the cost of manufacturing. The antenna receiving frequency band includes: Frequency Modulation (FM), Personal Handyphone System (PHS), Wireless car aperture, Global System for Mobile Communications (GSM Former; GSM 900, GSM 1800), code division multiple access (Code Division Multiple Access; CDMA), General Package Radio Service (GPRS), Bluetooth, Wireless Local Area Network (WLAN), and the band of digital television.
某些天線結構僅能在預設之頻帶中運作,此乃頻率受限於天線之特性因而不適合多頻運作之緣故,並且天線之材質不外乎金屬或合金,其若形成於玻璃之上將影響能見度。此外,目前之天線大都採用電鍍製程製作平面天線,而其中之電鍍液將對環境造成污染,且金屬塊材原物料成本較高。Some antenna structures can only operate in a preset frequency band, which is limited by the characteristics of the antenna and thus is not suitable for multi-frequency operation, and the material of the antenna is nothing more than metal or alloy. If it is formed on glass, it will be formed on the glass. Affect visibility. In addition, most of the current antennas use electroplating processes to make planar antennas, and the electroplating solution therein will cause environmental pollution, and the cost of raw materials of metal blocks is relatively high.
本發明係有關於具有下列特性之薄膜天線。The present invention relates to a film antenna having the following characteristics.
本發明提出薄膜式天線製作方法,其主要步驟包含以轉軸至轉軸式裝置驅動一基材水平移動,藉由物理性濺鍍(sputter)、沉積(deposition)或蒸鍍形成天線之材質,以利於形成薄膜於受該轉軸至轉軸式裝置所驅動之基材上,隨後以機械力或蝕刻或雷射施加於天線薄膜以製作天線圖案。其中該天線材質包含選自下列族群之一或其組合金、鋅、銀、鈀、鉑、銠、釕、銅、鐵、鎳、鈷、錫、鈦、銦、鋁、鉭、鎵、鍺及銻。天線材質亦可包含非金屬氧化物,例如氧化銦錫或氧化鋅,亦可以為導電高分子。所述之薄膜式天線製作方法包含對該天線薄膜加熱或/及提升天線薄膜之表面能量。天線圖案包含單極、偶極、對數周期天線、雙螺線、碎形或倒F天線圖案、矩形、峰形、直線、三角形、六邊形、圓形、梯形、梳子狀、城垛形或樹枝狀。The invention provides a method for fabricating a thin film antenna, the main steps of which comprise driving a substrate horizontally by a rotating shaft to a rotating shaft device, and forming a material of the antenna by physical sputtering, deposition or evaporation to facilitate the material. A film is formed on the substrate driven by the spindle to the spindle device, and then applied to the antenna film by mechanical force or etching or laser to form an antenna pattern. Wherein the antenna material comprises one or a combination of the following groups of gold, zinc, silver, palladium, platinum, rhodium, iridium, copper, iron, nickel, cobalt, tin, titanium, indium, aluminum, lanthanum, gallium, lanthanum and antimony. The antenna material may also contain a non-metal oxide such as indium tin oxide or zinc oxide, or may be a conductive polymer. The method for fabricating the thin film antenna comprises heating or/or lifting the surface energy of the antenna film. Antenna patterns include monopole, dipole, logarithmic period antennas, double spirals, fractal or inverted F antenna patterns, rectangles, peaks, lines, triangles, hexagons, circles, trapezoids, combs, scorpions or branches shape.
在其他實施例中,薄膜式天線製作方法特徵包含提供具有天線薄膜附著於其上的軟質基材,該軟質基材上天線薄膜係採濺鍍、物理性沉積、蒸鍍、塗佈、噴灑方式所製作;以機械力或蝕刻或雷射施加於該天線薄膜以製作天線圖案。為提升兩者間附著力或提升基材平坦度,可以於基材與天線薄膜間製作一層緩衝層。其中上述之天線薄膜以轉軸至轉軸式裝置驅動基材水平移動,使該天線薄膜形成於該軟質基材上。In other embodiments, the method of fabricating a thin film antenna includes providing a soft substrate having an antenna film attached thereto, wherein the antenna film is sputtered, physically deposited, vapor deposited, coated, sprayed. The antenna film is applied by mechanical force or etching or laser to form an antenna pattern. In order to improve the adhesion between the two or to improve the flatness of the substrate, a buffer layer may be formed between the substrate and the antenna film. The antenna film described above is horizontally moved by a rotating shaft to a rotating shaft device to form the antenna film on the soft substrate.
本發明之薄膜式天線製作裝置,其包含物理性濺鍍、沉積或蒸鍍能量源,以利於產生濺鍍、沉積或蒸鍍粒子或氣體;轉軸至轉軸式裝置,以驅動基材水平移動,藉由物理性濺鍍、沉積或蒸鍍天線薄膜於該基材上。所述之薄膜式天線製作裝置,其中更包含加熱裝置、真空幫浦。The thin film antenna manufacturing device of the present invention comprises a physical sputtering, deposition or evaporation energy source to facilitate sputtering, deposition or evaporation of particles or gas; and a shaft to a rotating shaft device for driving the substrate to move horizontally, The antenna film is deposited onto the substrate by physical sputtering, deposition or evaporation. The thin film antenna manufacturing device further includes a heating device and a vacuum pump.
本發明揭露一種使用於車輛、電子裝置或可攜式裝置之薄膜天線。本天線系製作於軟質基材之上,有別於傳統天線基材。因此基材具備撓區性,有利於貼附於不規則表面或不平之表面,且適合於本發明之轉軸式製程。為提升兩者間附著力或提升基材平坦度,可於基材與天線薄膜間製作一層緩衝層。其中上述之天線薄膜以轉軸至轉軸式裝置驅動基材水平移動,使該天線薄膜形成於軟質基材上,且可以利用轉軸速度控制薄膜成長厚度。上述天線係可以採用物理性沉積濺鍍、蒸鍍、噴墨(inkjet)、塗佈、噴灑。The invention discloses a film antenna for use in a vehicle, an electronic device or a portable device. This antenna is fabricated on a soft substrate, which is different from traditional antenna substrates. Therefore, the substrate has a flexible region, which is advantageous for attaching to an irregular surface or an uneven surface, and is suitable for the rotary shaft process of the present invention. In order to improve the adhesion between the two or to improve the flatness of the substrate, a buffer layer may be formed between the substrate and the antenna film. The antenna film described above is horizontally moved by a rotating shaft to a rotating shaft device, so that the antenna film is formed on a soft substrate, and the thickness of the film can be controlled by the shaft speed. The above antenna system can be physically deposited by sputtering, evaporation, inkjet, coating, and spraying.
舉一實施例而言,本發明薄膜式天線之製作裝置,其主要特徵包含:一腔體或製程室100,其中備置天線靶材(target)102,能量源(power source)104用以提供物理性濺鍍(physical sputter)或物理性沉積之能量源,用以物理性撞擊靶材,以利於形成物理性濺鍍(sputter)或物理性氣相沉積(physical vapor deposition;PVD)。物理性氣相沉積其方法可以包含電子槍、雷射(激光)、電漿源、物理性濺鍍可以採用射頻濺鍍(RF-sputter)、直流濺鍍(DC-sputter)。亦可以採用蒸鍍製作薄膜,其包含一乾鍋用以承載待加熱材料,以利於形成氣體。一轉軸至轉軸式(roll to roll)裝置106配置於腔體內100對應於上述靶材位置或於其下側。轉軸至轉軸式裝置106得藉由驅動裝置,例如馬達等加以驅動使其依據一轉軸旋轉,而牽動軟質基材移動,例示如圖中之旋轉箭頭方向旋轉,使得基材110可由一端捲至另一端。於此過程中將帶動基材110水平移動(如圖示水平箭頭),於沉積、蒸鍍或濺鍍過程中,材料粒子(形成天線之材質)112將沉積或鍍於上述之水平移動基材110之上。可以控制轉軸之轉速,利於控制水平移動速率,進而控制天線材料厚度。加熱裝置108對應配置於水平移動材質之下側,可以選擇性開啟加熱裝置,提供形成天線薄膜所需熱源。為利於蒸鍍、濺鍍或沉積程序之進行,一真空幫浦114連接於腔體100,以利於將腔體內之氣壓降低,以達到適合之真空度,例如0.0001-0.1托耳(torr)。為利於氣體之導入與導出,所述之腔體100亦配置氣體進入口118與排出口116。基材110材質以具有軟性或撓曲性為佳,可以為PET、PC、PVC、PI、PMMA、高分子或軟性電路板。加熱裝置108可以為燈泡、電磁輻射或是紅外線加熱器。靶材102可以選用,導電碳(conductive carbon),其中該導電碳包含奈米碳管(carbon nano-tube;CNT);其亦可以選用包含選自下列族群之一或其組合:金、鋅、銀、鈀、鉑、銠、釕、銅、鐵、鎳、鈷、錫、鈦、銦、鋁、鉭、鎵、鍺及銻。亦可以選用銦錫氧化物或銦鋅氧化物、導電高分子(conductive polymer)作為天線靶材之材質。In one embodiment, the apparatus for fabricating a thin film antenna of the present invention, the main features of which include: a cavity or process chamber 100 in which an antenna target 102 is disposed, and a power source 104 is used to provide physical A physical sputter or a physically deposited source of energy that physically strikes a target to facilitate the formation of physical sputters or physical vapor deposition (PVD). The physical vapor deposition method may include an electron gun, a laser (laser), a plasma source, and physical sputtering. RF-sputter, DC-sputter may be used. It is also possible to use a vapor deposition film to form a dry pan for carrying the material to be heated to facilitate the formation of a gas. A shaft to roll to roll device 106 is disposed in the chamber 100 corresponding to or at a lower side of the target position. The shaft-to-spindle device 106 is driven by a driving device, such as a motor, to rotate according to a rotating shaft, and the soft substrate is moved, for example, rotating in the direction of the rotating arrow, so that the substrate 110 can be rolled from one end to the other. One end. During this process, the substrate 110 is driven to move horizontally (as shown by a horizontal arrow). During deposition, evaporation or sputtering, material particles (forming the material of the antenna) 112 will be deposited or plated on the horizontal moving substrate described above. Above 110. The speed of the rotating shaft can be controlled to control the horizontal moving speed and thus the thickness of the antenna material. The heating device 108 is correspondingly disposed on the lower side of the horizontal moving material, and can selectively turn on the heating device to provide a heat source for forming an antenna film. To facilitate evaporation, sputtering or deposition procedures, a vacuum pump 114 is coupled to the cavity 100 to facilitate lowering the gas pressure within the chamber to achieve a suitable degree of vacuum, such as 0.0001 - 0.1 torr. In order to facilitate the introduction and derivation of the gas, the cavity 100 is also provided with a gas inlet port 118 and a discharge port 116. The material of the substrate 110 is preferably soft or flexible, and may be PET, PC, PVC, PI, PMMA, polymer or a flexible circuit board. The heating device 108 can be a light bulb, electromagnetic radiation or an infrared heater. The target material 102 may be selected from a conductive carbon, wherein the conductive carbon comprises a carbon nano-tube (CNT); it may also optionally comprise one or a combination of the following groups: gold, zinc, Silver, palladium, platinum, rhodium, ruthenium, copper, iron, nickel, cobalt, tin, titanium, indium, aluminum, antimony, gallium, antimony and antimony. Indium tin oxide or indium zinc oxide and conductive polymer can also be used as the material of the antenna target.
其中天線圖案包含單極、偶極、對數形天線或倒F天線圖案。其中該天線圖案包含碎形、矩形、峰形、直線、三角形、六邊形、圓形、梯形、梳子狀、城垛形或樹枝狀。其中此碎形元件為碎形基本圖案至少一次疊代之疊置。上述之疊代乃將碎形基本圖案以下列方法之一或其組合來放置於基底圖案上:(1)旋轉,(2)伸長,以及(3)平移。其可配置於手持裝置、行動電話、筆記型電腦、個人數位助理、可攜式裝置、交通載具、NFC應用。上述之具天線裝置,其中天線可製作於一裝置殼體之外表面或內表面,其特徵包含一屏蔽結構配置於該天線與電路板之間。而某些以此方法製成之導電材質為透明,且假使此天線附著於玻璃或窗戶上,其將具有視覺穿透力。此天線亦可附著於車輛中燈泡之外殼上,由於此外殼之透明度低於窗戶,所以本發明可形成在車輛中燈泡之外殼上。或者,此天線可形成在筆記型電腦或行動電話等等之外殼或螢幕上可避免屏蔽效應。在此情形下,導電層通常以具有金屬之氧化物所構成,其中該金屬最好為一個或以上選自金、鋅、銀、鈀、鉑、銠、釕、銅、鐵、鎳、鈷、錫、鈦、銦、鋁、鉭、鎵、鍺以及銻之金屬。上述透明天線材料如銦錫氧化物或銦鋅氧化物可以摻雜氧化鋁(Al2 O3 )。饋入結構可藉由一電容耦合來達成,此饋入機制乃為本領域之習知技術,並可藉由使用空間變異(space-diversity)或極化變異技術來改進接收系統。在此亦可採用兩個或數個之多頻天線或一天線陣列,而使用本發明所述之技術其優點在於複數個附著於同一透明窗戶之天線可以低成本來含括不同之結構。此饋入結構乃為本領域習知之技術,其他多頻天線之結構亦可應用於本發明相同之領域與精神中。天線以不同之結構呈現(如陣列具不同轉向方位)。當利用極化變異來補償因快速變換傳輸環境所造成之訊號衰減時,可選擇多角形為基底之結構作為替代之形狀。銦鋅氧化物(indium zinc oxide,IZO)與銦錫氧化物(indium tin oxide,ITO)等類透明導電薄膜材料可利用束離子輔助(ion-beam assisted)濺鍍系統,可安裝高能離子源,使鍍膜過程中達到基板清潔與改質,獲得較佳薄膜附著力。此離子輔助機制亦可作為輔助能量,提高鍍膜原子動能,使得沉積薄膜形成高緻密性、高均勻性和連續性微觀組織的膜層結構。The antenna pattern includes a monopole, dipole, logarithmic antenna or inverted F antenna pattern. Wherein the antenna pattern comprises a fractal, a rectangle, a peak shape, a straight line, a triangle, a hexagon, a circle, a trapezoid, a comb shape, a city shape or a dendritic shape. Wherein the fractal element is a stack of fractal basic patterns stacked at least once. The above-described iterations place the fractal basic pattern on the base pattern in one or a combination of the following methods: (1) rotation, (2) elongation, and (3) translation. It can be configured in handheld devices, mobile phones, notebook computers, personal digital assistants, portable devices, transportation vehicles, NFC applications. In the above antenna device, the antenna can be fabricated on an outer surface or an inner surface of a device housing, and the feature includes a shielding structure disposed between the antenna and the circuit board. Some conductive materials made in this way are transparent, and if the antenna is attached to a glass or window, it will have visual penetration. The antenna can also be attached to the outer casing of the bulb in the vehicle. Since the outer casing is less transparent than the window, the present invention can be formed on the outer casing of the bulb in the vehicle. Alternatively, the antenna can be formed on a housing or screen of a notebook or mobile phone or the like to avoid shielding effects. In this case, the conductive layer is usually composed of an oxide having a metal, wherein the metal is preferably one or more selected from the group consisting of gold, zinc, silver, palladium, platinum, rhodium, ruthenium, copper, iron, nickel, cobalt, Tin, titanium, indium, aluminum, antimony, gallium, antimony and antimony metals. The above transparent antenna material such as indium tin oxide or indium zinc oxide may be doped with aluminum oxide (Al 2 O 3 ). The feed structure can be achieved by a capacitive coupling, which is a well-known technique in the art, and can be improved by using spatial-diversity or polarization variation techniques. Two or more multi-frequency antennas or an antenna array can also be used herein, and the technique described in the present invention has the advantage that a plurality of antennas attached to the same transparent window can include different structures at low cost. This feedthrough structure is a technique well known in the art, and the structure of other multi-frequency antennas can also be applied to the same fields and spirits of the present invention. The antennas are presented in different configurations (eg, the array has different steering orientations). When polarization variation is utilized to compensate for signal attenuation due to fast transition transmission environments, a polygonal base structure can be selected as an alternative shape. A transparent conductive film material such as indium zinc oxide (IZO) and indium tin oxide (ITO) can be equipped with a high-energy ion source by using an ion-beam assisted sputtering system. The substrate is cleaned and modified during the coating process to obtain better film adhesion. This ion-assisted mechanism can also be used as an auxiliary energy to increase the atomic kinetic energy of the coating, so that the deposited film forms a high-density, high-uniformity and continuous microstructure structure.
本發明形成透明天線之製程可以在低溫下形成薄膜結構,舉例來說,薄膜可在室溫下形成而其透光度可高於82%。製程溫度可以控制室溫至200度之間,若選用PET做為軟質基材,則可以在室溫下製作,減省製程熱成本。第二圖所示為本發明之製作流程,首先將靶材102配置於腔體內100,將腔體氣壓以真空幫浦114抽氣將氣壓降低至一預設真空度,利於減少雜質,步驟200。隨之,若有需求則步驟205導入所需氣體,隨後啟動物理氣相沉積、濺鍍或蒸鍍程序210,以產生形成天線的粒子或氣體於腔體內,利用轉軸至轉軸式裝置106牽動基材水平移動,利用控制轉軸速度可以控制基材移動速度,天線材質將沉積或佈於基材表面,步驟215。故本發明可以採大量沉積、蒸鍍或濺鍍方式將天線材料沉積於受到轉軸至轉軸式裝置106驅動之水平移動基材之上面。隨著製程之進展,基材由未沉積之一端移轉至另一端,此時已完成天線材質之沉積或濺鍍之基材將被捲至此端。基於所採基材具有撓曲性,故可以將其捲曲於另一端。若有必要,則可以開啟加熱裝置提供天線薄膜所需熱能,步驟220或提升天線薄膜表面能量(surface energy)205。隨後可將此具有天線薄膜之基材移轉至緩衝腔體後再將其氣壓提升至常壓取出(步驟235)或直接提升至常壓取出(步驟230)。此時,成捲之天線薄膜已完成製作,隨後依據需求可將此成捲之天線薄膜展開利用機器加壓以製具裁切或壓印出所需天線圖案,亦可以蝕刻或雷射切割形成天線圖案,步驟240。若有需要,則可以於軟質基材上塗佈緩衝層。The process for forming a transparent antenna of the present invention can form a thin film structure at a low temperature. For example, the film can be formed at room temperature and its transmittance can be higher than 82%. The process temperature can be controlled from room temperature to 200 degrees. If PET is used as a soft substrate, it can be fabricated at room temperature, reducing process cost. The second figure shows the manufacturing process of the present invention. First, the target 102 is disposed in the cavity 100, and the air pressure of the cavity is pumped by the vacuum pump 114 to lower the air pressure to a preset vacuum to facilitate the reduction of impurities. Step 200 . Accordingly, if desired, step 205 introduces the desired gas, followed by physical vapor deposition, sputtering or evaporation process 210 to produce particles or gases forming the antenna within the cavity, utilizing the spindle to spindle device 106 to actuate the substrate. The material moves horizontally, and the speed of the substrate can be controlled by controlling the speed of the shaft. The material of the antenna will be deposited or laid on the surface of the substrate, step 215. Therefore, the present invention can deposit a large amount of deposition, evaporation or sputtering on the planar moving substrate which is driven by the rotating shaft to the rotary shaft device 106. As the process progresses, the substrate is transferred from one of the undeposited ends to the other end, at which point the substrate from which the deposition or sputtering of the antenna material has been completed will be wound to the end. Since the substrate to be used has flexibility, it can be crimped to the other end. If necessary, the heating device can be turned on to provide the thermal energy required for the antenna film, step 220 or to raise the surface energy of the antenna film 205. The substrate having the antenna film can then be transferred to the buffer chamber and then lifted to atmospheric pressure (step 235) or directly raised to atmospheric pressure (step 230). At this time, the roll of the antenna film has been completed, and then the roll of the antenna film can be unrolled by a machine to cut or emboss the desired antenna pattern, or can be formed by etching or laser cutting. Antenna pattern, step 240. If necessary, a buffer layer can be applied to the soft substrate.
本發明可以採用非金屬材質作為天線。利用非金屬材質將使裝置更輕、更小、降低成本以及大量成批製程。非金屬天線在此指的是天線主體不採用金屬原物料,非不含金屬添加物、或顆粒。利用可撓曲式基材,使得材質得透過本發明之轉軸至轉軸式裝置,可以大量製作天線薄膜,無需電鍍液,製程不會污染環境。且利用驅動轉軸之速度控制薄膜成長厚度,且薄膜式天線之期才具撓曲性,使其可以附著於不規則或不平表面。此外,手持裝置之傳統天線均配置於印刷電路板上,故極易與電子元件間造成干擾。但是依據本發明可以將天線自電路板上移走。若其為透明,則可以貼附於銀幕或玻璃或外表面。天線附著於手持裝置殼體之內表面或外表面,一屏蔽結構可配制於天線與電路板間以避免天線與電路板元件間之相互干擾。The invention can use a non-metal material as the antenna. The use of non-metallic materials will make the device lighter, smaller, lower cost, and a large number of batch processes. The non-metallic antenna here means that the antenna body does not use metal raw materials, and does not contain metal additives or particles. By using the flexible substrate, the material can be made into a large number of antenna films through the rotating shaft to the rotating shaft device of the present invention, without plating solution, and the process does not pollute the environment. Moreover, the thickness of the film is controlled by the speed of the driving shaft, and the period of the film antenna is flexible so that it can adhere to an irregular or uneven surface. In addition, the conventional antenna of the handheld device is disposed on the printed circuit board, so that it is easy to cause interference with the electronic components. However, the antenna can be removed from the board in accordance with the present invention. If it is transparent, it can be attached to a screen or glass or outer surface. The antenna is attached to the inner surface or the outer surface of the handle device housing, and a shielding structure can be formed between the antenna and the circuit board to avoid mutual interference between the antenna and the circuit board component.
天線可以利用導電高分子或奈米碳管製作。導電高分子可以選自thiophenes、selenophenes,tellurophenes、pyrroles,anilines、polycyclic aromatics,以此製作高分子可包含但不限於polythiophenes、poly(selenophenes)、poly(tellurophenes)、polypyrroles、polyanilines、polycyclic aromatic polymers等。美國專利US. Patent Application 20080017852 to Huh;Dal Ho et al.,發明名稱為“Conductive Polymer Composition Comprising Organic Ionic Saltand Optoelectronic Device Using the Same”揭露製作導電高分子之方法可做參考。再另一實施例中,導電高分子為有機高分子半導體(organic polymer semiconductor)或有機半導體(organic semiconductor)。導電polyacetylenes型態包含polyacetylene、polypyrrole、polyaniline及其衍生物(derivatives)。導電有機高分子通常具有extended delocalized bonds,此造成導帶結構(band structure),類似於矽但是具有localized states。此零能隙(zero-band gap)導電高分子具有類金屬行為。碳管可以包含多層複壁碳管、單層碳管;其可以參考文獻:Young's modulus in the low TPa range and tensile strengths in excess of 37 GPa,please refer to the Articles:Yakobson etal.,Phys. Rev. Lett. 1996,76,2411;Lourie et al.,J. Mater. Res. 1998,13,2418;lijima et al.,J. Chem. Phys. 1996,104,2089。通常CNT包含交錯之奈米纖維而形成奈米碳管(mutually entangled carbon nanotubes),形成上述奈米碳管之方法之一為infusion有機分子穿透tangled CNTs,因此造成奈米網狀結構(nanotube networks)。接著polymerization以及熱處理有機分子以產生交錯網狀結構或CNT纖維(nanofibers)。The antenna can be made of a conductive polymer or a carbon nanotube. The conductive polymer may be selected from the group consisting of thiophenes, selenophenes, tellurophenes, pyrroles, anilines, and polycyclic aromatics, and the polymer may include, but is not limited to, polythiophenes, poly(selenophenes), poly(tellurophenes), polypyrroles, polyanilines, polycyclic aromatic polymers, and the like. U.S. Patent Application No. 20080017852 to Huh; Dal Ho et al., entitled "Conductive Polymer Composition Comprising Organic Ionic Salt and Optoelectronic Device Using the Same" discloses a method of making a conductive polymer. In still another embodiment, the conductive polymer is an organic polymer semiconductor or an organic semiconductor. Conductive polyacetylenes include polyacetylene, polypyrrole, polyaniline and their derivatives. Conductive organic polymers typically have extended delocalized bonds, which result in a band structure similar to 矽 but with localized states. This zero-band gap conductive polymer has a metalloid behavior. The carbon tube may comprise a multi-layered double-walled carbon tube, a single-layer carbon tube; it may be referred to in the literature: Young's modulus in the low TPa range and tensile strengths in excess of 37 GPa, please refer to the Articles: Yakobson et al., Phys. Rev. Lett. 1996, 76, 2411; Lourie et al., J. Mater. Res. 1998, 13, 2418; lijima et al., J. Chem. Phys. 1996, 104, 2089. Generally, CNTs contain interdigitated nanofibers to form mutually entangled carbon nanotubes. One of the methods for forming the above-mentioned carbon nanotubes is that infusion organic molecules penetrate tangled CNTs, thereby causing nanonetworks (nanopipe networks). ). The polymerization and subsequent heat treatment of the organic molecules to produce interlaced network structures or nanofibers.
基於成本於製造之考量,本實施例中形成如銦錫氧化物之天線薄膜的方法可在室溫下潮溼之空氣中形成。在此薄膜形成或圖樣化後,以攝氏50度至220度間之溫度進行熱處理來降低薄膜之電阻並增進其透光度。此實施例參照第三圖與第四圖,首先備置氧化銦錫或氧化鋅溶液400,可以將材質粉末藉由於酒精/水混合溶劑中稀釋而得,而加熱處理之溫度乃高於攝氏一百度,實施熱處理。其中在稀釋過程可以加入稀釋劑,如ferrous sulfate、trisodium citrate、tartaric acid、sodium boron hydride。此實施例之裝置與第一與第二圖類似,不同者為本實施例採用塗佈、噴灑或噴墨(inkjet print),將溶液塗佈於所欲之軟質基板上。備置溶液後,則啟動噴墨、噴灑、印刷或塗佈程序410將材質分佈於軟質基材之上415,若利用噴墨列印式則可以將天線圖案直接噴塗於軟質基板上。其餘步驟類似上實施例,包含選擇性加熱420、提升表面能量425,之後裁切製作天線單元。導電薄膜可藉由將上述之液體施加於基板上而得,並使其乾躁以得到一透明薄膜。金屬溶液得混合分散劑來配置。The method of forming an antenna film such as indium tin oxide in this embodiment can be formed in a humid air at room temperature based on cost considerations for manufacturing. After the film is formed or patterned, heat treatment is performed at a temperature between 50 degrees Celsius and 220 degrees Celsius to reduce the electrical resistance of the film and increase its transmittance. Referring to the third and fourth figures in this embodiment, first, an indium tin oxide or zinc oxide solution 400 is prepared, and the material powder can be obtained by dilution in an alcohol/water mixed solvent, and the temperature of the heat treatment is higher than that of Celsius. , heat treatment is implemented. A diluent such as ferrous sulfate, trisodium citrate, tartaric acid, or sodium boron hydride may be added during the dilution process. The apparatus of this embodiment is similar to the first and second figures, except that in this embodiment, a solution, spray or inkjet print is applied to apply the solution to a desired soft substrate. After the solution is prepared, the inkjet, spray, printing or coating process 410 is initiated to distribute the material over the soft substrate 415. If the inkjet print is used, the antenna pattern can be directly sprayed onto the flexible substrate. The remaining steps are similar to the above embodiment, including selective heating 420, lifting surface energy 425, and then cutting to fabricate the antenna unit. The conductive film can be obtained by applying the above liquid to the substrate and drying it to obtain a transparent film. The metal solution is prepared by mixing a dispersant.
對熟悉此領域技藝者,本創作雖以較佳實例闡明如 上,然其並非用以限定本創作精神。在不脫離本創作之精神與範圍內所作之修改與類似的配置,均應包含在下述之申請專利範圍內,此範圍應覆蓋所有類似修改與類似結構,且應做最寬廣的詮釋。For those skilled in the art, this creation is illustrated by better examples. However, it is not intended to limit the spirit of this creation. Modifications and similar configurations made without departing from the spirit and scope of the present invention are intended to be included in the scope of the appended claims.
100‧‧‧腔體100‧‧‧ cavity
102‧‧‧靶材102‧‧‧ Targets
102A‧‧‧溶液102A‧‧‧solution
104‧‧‧能量源104‧‧‧Energy source
106‧‧‧轉軸至轉軸式裝置106‧‧‧Rotary shaft to rotary shaft device
108‧‧‧加熱器108‧‧‧heater
110‧‧‧基材110‧‧‧Substrate
112‧‧‧粒子112‧‧‧ particles
114‧‧‧真空幫浦114‧‧‧vacuum pump
116‧‧‧氣體排出口116‧‧‧ gas discharge
118‧‧‧氣體進入口118‧‧‧ gas inlet
200‧‧‧降低腔體氣壓200‧‧‧Reducing cavity pressure
205‧‧‧導入氣體205‧‧‧Introduction of gas
210‧‧‧啟動物理氣相沉積程序210‧‧‧Starting the physical vapor deposition process
215‧‧‧沉積天線材質於轉軸式基材上215‧‧‧Delayed antenna material on a rotating shaft substrate
220‧‧‧選擇性加熱天線材質220‧‧‧Selective heating antenna material
225‧‧‧提升天線材質表面能量225‧‧‧Raise the surface energy of the antenna material
230‧‧‧提升腔體氣壓230‧‧‧Uplifting chamber pressure
235‧‧‧移轉至緩衝腔體235‧‧‧Transfer to the buffer cavity
240‧‧‧天線圖案成形240‧‧‧Antenna pattern forming
400‧‧‧備置溶液400‧‧‧Preparation solution
410‧‧‧啟動噴塗程序410‧‧‧Start spraying procedure
415‧‧‧塗佈天線材質於轉軸式基材上415‧‧‧ coated antenna material on a rotating shaft substrate
420‧‧‧選擇性加熱天線材質420‧‧‧Selective heating antenna material
425‧‧‧提升天線材質表面能量425‧‧‧Raise the surface energy of the antenna material
430‧‧‧天線圖案成形430‧‧‧Antenna patterning
第一圖為本發明之天線製作裝置。The first figure is an antenna making device of the present invention.
第二圖為本發明之天線製作方法。The second figure is a method of fabricating the antenna of the present invention.
第三圖為本發明之天線製作裝置。The third figure is the antenna manufacturing apparatus of the present invention.
第四圖為本發明之天線製作方法。The fourth figure is a method of fabricating the antenna of the present invention.
100...腔體100. . . Cavity
102...靶材102. . . Target
104...能量源104. . . Energy source
106...轉軸至轉軸式裝置106. . . Rotary shaft to rotary shaft device
108...加熱器108. . . Heater
110...基材110. . . Substrate
112...粒子112. . . particle
114...真空幫浦114. . . Vacuum pump
116...氣體排出口116. . . Gas discharge
118...氣體進入口118. . . Gas inlet
Claims (9)
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TW201421800A (en) * | 2012-11-30 | 2014-06-01 | Diamondtexx Co Ltd | Method of forming conductive pattern on non-conductive substrates |
US11949161B2 (en) | 2021-08-27 | 2024-04-02 | Eagle Technology, Llc | Systems and methods for making articles comprising a carbon nanotube material |
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US20040200061A1 (en) * | 2003-04-11 | 2004-10-14 | Coleman James P. | Conductive pattern and method of making |
TW200520649A (en) * | 2003-10-06 | 2005-06-16 | Fcm Co Ltd | Conductive sheet having metal layer formed on at least a portion of surface of insulating substrate, product using the same, and manufacturing method thereof |
TW200617188A (en) * | 2004-11-23 | 2006-06-01 | Tennmax Inc | Film antenna and method for manufacturing thereof |
CN101104934A (en) * | 2007-08-02 | 2008-01-16 | 武汉华工图像技术开发有限公司 | Plastic film coating method and device used for hologram marking and packing |
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US2005A (en) * | 1841-03-16 | Improvement in the manner of constructing molds for casting butt-hinges | ||
US20040200061A1 (en) * | 2003-04-11 | 2004-10-14 | Coleman James P. | Conductive pattern and method of making |
TW200520649A (en) * | 2003-10-06 | 2005-06-16 | Fcm Co Ltd | Conductive sheet having metal layer formed on at least a portion of surface of insulating substrate, product using the same, and manufacturing method thereof |
TW200617188A (en) * | 2004-11-23 | 2006-06-01 | Tennmax Inc | Film antenna and method for manufacturing thereof |
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