TW201407173A - Through impedance standard substrate and manufacture method thereof - Google Patents

Abstract

The present invention relates to a through impedance standard substrate and a manufacture method thereof, being, respectively, provided with a first outer plate and a second outer plate on upper and lower surfaces of a conductor. The upper surface of the conductor has a first probing area. A first window is formed on the first outer plate at a location corresponding to the first probing area to expose the first probing area. The lower surface of the conductor has a second probing area. A second window is formed on the second outer plate at a location corresponding to the second probing area to expose the second probing area. Because the first and second probing areas are, respectively, located on opposing surfaces of the through impedance standard substrate, after a probe performs a calibration process via the through impedance standard substrate, a chip with signal connection ports on both sides may be directly measured so as to obtain good measurement accuracy.

Description

Through-impedance standard substrate and its preparation method

The invention relates to an impedance standard substrate and a preparation method thereof, in particular to a through-impedance standard substrate and a preparation method thereof.

The vector network analyzer is a measuring instrument that measures the response of the wafer to be tested to the Transmitted Coefficient and the Reflected Coefficient by a vector network analyzer to evaluate the high frequency of the wafer to be tested. Electrical characteristics.

Before using the vector network analyzer, the error correction of the test fixture of the vector network analyzer itself must be performed. When the error of the test fixture is corrected, a more accurate amount can be obtained when measuring the wafer to be tested. Test results. The errors are determined by measuring impedance characteristics of an Impedance Standard Substrate (ISS), and the impedance standard substrate includes a short circuit substrate, a load circuit substrate, and an open circuit substrate. There are four types, such as a through circuit substrate.

For example, the through-substrate includes a plate body, a first electrode and a second electrode. The first electrode and the second electrode are disposed on the same surface of the plate body.

The test fixture of the vector network analyzer includes a first probe and a second probe. When the calibration operation is performed by using the through substrate, the first probe is electrically connected to the first electrode, and the second probe is electrically connected to the first electrode. The needle is electrically connected to the second electrode, and the test fixture generates a detection signal to measure the impedance between the first electrode and the second electrode, and uses the measured impedance as a reference for correction; After the test fixture is calibrated, the wafer can be measured.

With the evolution of integrated circuit technology, various technologies such as miniaturization of system circuits, System in Pack (SiP), and Through Silicon Via (TSV) have flourished, resulting in a signal connection between the wafers ( The I/O Port) position is not limited to a single surface, for example, signal connections may be located on opposite upper and lower surfaces of the wafer to be tested, respectively.

In this way, when the probe is first calibrated through the through-substrate, and then the wafer is officially measured, one of the probes must be flipped over to the other surface of the wafer before the signal connection can be electrically connected to the other surface. . However, the process of flipping the movement involves a complicated mechanism, and since the calibration work of the known test fixture is based on the electrodes formed on the same surface of the board, the signal connections of the wafer to be tested are respectively located on different surfaces, so the foregoing The correction value does not apply to the wafer to be tested, which in turn affects the accuracy of wafer measurement.

The main object of the present invention is to provide a through-impedance standard substrate, and the opposite surfaces of the through-substrate are respectively provided with electrodes for the test fixture to perform calibration and detection operations.

For the purpose of the prior art, the technical means adopted by the present invention is that the through-impedance standard substrate comprises: an electric conductor having a first needle measuring area defined on the upper surface and a second needle measuring area on the lower surface; The first outer panel is fixed to the upper surface of the electric conductor by a first adhesive layer, and a first window is formed in a region corresponding to the first needle measuring area, and the first needle measuring area is exposed in the first window And a second outer panel fixed to the lower surface of the electrical conductor by a second adhesive layer And a region corresponding to the second needle measuring area forms a second window, and the second needle measuring area is exposed in the second window.

For the purpose of the prior art, the technical method adopted by the present invention is that the method for manufacturing the through-impedance standard substrate comprises the steps of: preparing a substrate, forming a conductor on the surface of the substrate, the upper surface of the conductor defining a first pin a first protection device is disposed on the first needle measurement area of the electrical conductor, so that the first protection device covers the first needle measurement area; and a first outer plate is disposed on the upper surface of the electrical conductor, wherein The first outer panel has a first window for penetrating the first protection device; the first protection device is removed to expose the first needle measurement region to the first window; and the substrate is removed to expose the electrical conductor The lower surface of the conductor defines a second needle measurement area; a second protection device is disposed on the second needle measurement area of the conductor, so that the second protection device covers the second needle measurement area; A second outer panel is disposed on the lower surface of the electrical conductor, wherein the second outer panel has a second window for penetrating the second protection device; and the second protection device is removed to complete the through-impedance standard substrate.

According to the structure of the through-impedance correcting substrate of the present invention, the upper surface and the lower surface of the through-impedance standard substrate respectively have a needle measuring area, and when the probe performs the correcting operation using the through-impedance standard substrate, the probes are respectively positioned in the through-impedance standard The upper and lower surfaces of the substrate are electrically connected to the first needle measuring area and the second needle measuring area respectively; after the probe is corrected, the probes can be directly detected on the wafer without further complicated flipping movement Signal connection 埠, effectively improve the measurement quality of the wafer.

In addition, the method of the present invention is compatible with existing printed circuit board processes and has the advantage of being easy to implement.

Referring to FIG. 1 , in the process of the present invention, a substrate 12 is first prepared, and a surface of the substrate 12 is formed with a conductor 13 , which may be a wire or a conductive sheet, and the conductor 13 has an opposite one. The first end portion and a second end portion define an upper surface of the first needle portion 14 for contacting the probe.

As shown in FIG. 2, a first protection device 15 is disposed on the first pin measurement area 14 of the electrical conductor 13, so that the first protection device 15 covers the first needle measurement area 14, and the first protection device 15 can be As a columnar body, the material is not limited to a conductor or an insulator. Then, a first adhesive layer 16 is formed on the upper surface of the electrical conductor 13 . Since the first protection device 15 is disposed on the first needle measurement region 14 , the first adhesive layer 16 does not adhere to the first needle measurement region 14 . s surface.

Referring to FIGS. 3A and 3B , after the first adhesive layer 16 is formed, a first outer panel 17 is disposed on the upper surface of the first adhesive layer 16 , wherein the first outer panel 17 has a first window 18 . The first protection device 15 is provided for wearing. After the first outer panel 17 is disposed on the first adhesive layer 16, in order to make the first outer panel 17 and the conductor 13 more securely coupled, the first outer panel 17 and the conductor 13 may be pressed together. The first adhesive layer 16 is fixed to the first outer panel 17 and the electrical conductor 13. The conductive body 13 and the first outer plate 17 respectively form corresponding positioning holes; in the electrical conductor 13, the relative position between the positioning hole and the first protection device 15 is known, so Before the pressure cooperation, the first outer panel 17 can pre-form the first window 18 according to the positioning hole, so that the position of the first window 18 corresponds to the position of the first protection device 15, and the first outer panel 17 is positioned through The hole and the electric conductor 13 are disposed opposite to each other and disposed on the electric conductor 13 , and the first protection device 15 can be inserted into the first window 18 .

If the height of the first protection device 15 is higher than the height of the first outer panel 17, the first protection device 15 protrudes from the outer surface of the first outer panel 17, and at this time, when the pressure cooperation is performed, the pressing fixture can be A groove is formed corresponding to the position of the first protection device 15 to accommodate the protruding first protection device 15, so that the pressing fixture can smoothly press the first outer panel 17.

Referring to FIG. 4, after the electrical conductor 13 and the first outer panel 17 are fixed to each other, the first protection device 15 is removed. After the first protection device 15 is removed, the first conductor 13 is removed. The needle test area 14 will be exposed to the first window 18.

Referring to FIG. 5, the substrate 12 is removed to expose the lower surface of the conductor 13. The lower surface of the second end of the conductor 13 defines a second pinning area 19, which is preferably implemented. In the example, the substrate 12 is removed by grinding.

Referring to FIG. 6 , a second protection device 21 is disposed on the second needle measuring area 19 at the second end of the electrical conductor 13 , so that the second protection device 21 covers the second needle measuring area 19 , and the second protection device 21 may be a columnar body, and the material thereof is not limited to a conductor or an insulator. Then, a second adhesive layer 22 is formed on the lower surface of the conductor 13. Since the second protection device 21 is already disposed on the surface of the second needle measurement area 19, the second adhesive layer 22 does not adhere to the surface of the second needle measurement area 19. .

Referring to FIG. 7 , a second outer panel 23 is disposed on the lower surface of the second adhesive layer 22 , and the second outer panel 23 has a second window 24 for the second protection device 21 . The second outer panel 23 is pressed against the conductor 13 , and the second adhesive layer 22 is used to fix the conductor 13 and the second outer panel 23 . The conductive body 13 and the second outer plate 23 can respectively form corresponding positioning holes; in the electrical conductor 13, the relative position between the positioning hole and the second protection device 21 is known, so the pressure cooperation is performed. The second outer panel 23 can pre-form the second window 24 according to the positioning hole, so that the position of the second window 24 corresponds to the position of the second protection device 21, and the second outer panel 23 passes through the positioning hole and is electrically conductive. The bodies 13 are disposed opposite each other on the electrical conductor 13 , and the second protection device 21 can be disposed in the second window 24 .

Referring to FIG. 8 , when the electrical conductor 13 and the second outer panel 23 are fixed to each other, the second protection device 21 is removed. When the second protection device 21 is removed, the electrical conductor 13 is The two-needle test area 19 is exposed; when the second protection device 21 is removed, the Impedance Standard Substrate (ISS) of the present invention is completed.

Referring to FIG. 9, the structure of the straight-through impedance standard substrate of the present invention comprises an electrical conductor 30, a first outer panel 32 and a second outer panel 33.

The electric conductor 30 has a first end portion and a second end portion. The upper surface of the first end portion defines a first needle measuring area 301, and the lower surface of the second end portion defines a second needle measuring portion. Area 302. The electrical conductor 30 can be a copper foil, copper wire or other metal.

The first outer panel 32 is fixed to the upper surface of the conductor 30 by a first adhesive layer 311, and a first window 321 is formed corresponding to the area of the first needle measuring area 301. The first needle measuring area 301 is exposed. In the first window 321 The first adhesive layer 311 is an adhesive used in a general printed circuit board process, such as a polypropylene (PP) adhesive.

The second outer panel 33 is fixed to the lower surface of the conductor 30 by a second adhesive layer 312, and a second window 331 is formed corresponding to the area of the second needle measuring area 302. The second needle detecting area 302 is exposed. In the second window 331, the second adhesive layer 312 is an adhesive used in a general printed circuit board process, such as a polypropylene (PP) adhesive.

Referring to FIG. 10, when the probe is corrected by the through-impedance standard substrate 50 of the present invention, since the first needle measuring area 301 and the second needle measuring area 302 are respectively located on the opposite surfaces of the through-impedance standard substrate 50, Therefore, the probes 41, 42 must be adjusted to the corresponding positions in advance to be electrically connected to the first and second needle-measuring regions 301, 302, respectively, for correcting work.

After the calibration operation is completed, since the probes 41, 42 are still in a relatively set state, the probes 41, 42 can be directly used to detect a wafer having a double-sided signal connection port (I/O port), compared to the prior art. The through-impedance standard substrate 50 of the present invention allows a large amount of flipping movement after the probes 41, 42 are corrected, and the wafer to be tested is measured while maintaining the original up and down relative position.

12‧‧‧Substrate

13‧‧‧Electric conductor

14‧‧‧First needle test area

15‧‧‧First protection device

16‧‧‧First adhesive layer

17‧‧‧First outer board

18‧‧‧ first window

19‧‧‧Second needle survey area

21‧‧‧Second protection device

22‧‧‧Second Adhesive Layer

23‧‧‧Second outer board

24‧‧‧ second window

30‧‧‧Electrical conductor

301‧‧‧first needle test area

302‧‧‧Second needle survey area

311‧‧‧First adhesive layer

312‧‧‧Second Adhesive Layer

32‧‧‧First outer board

321‧‧‧ first window

33‧‧‧Second outer board

331‧‧‧ second window

41‧‧‧Probe

42‧‧‧Probe

50‧‧‧through impedance standard substrate

1 to 8 are schematic views of the steps of the present invention.

Figure 9 is a schematic view of a through-impedance standard substrate of the present invention.

Fig. 10 is a view showing the state of use of the through-impedance standard substrate of the present invention.

30‧‧‧Electrical conductor

301‧‧‧first needle test area

302‧‧‧Second needle survey area

311‧‧‧First adhesive layer

312‧‧‧Second Adhesive Layer

32‧‧‧First outer board

321‧‧‧ first window

33‧‧‧Second outer board

331‧‧‧ second window

Claims (8)

A through-impedance standard substrate comprises: a conductor having a first needle measuring area defined on an upper surface thereof and a second needle measuring area defined on a lower surface thereof; a first outer panel fixed to the first adhesive layer An upper surface of the electrical conductor, and a region corresponding to the first needle measuring area forms a first window, the first needle measuring area is exposed in the first window; and a second outer panel is fixed by a second adhesive layer Connected to the lower surface of the electric conductor, and a region corresponding to the second needle measuring area forms a second window, and the second needle measuring area is exposed in the second window. The through-impedance standard substrate according to claim 1, wherein the conductor is a copper foil. A method for manufacturing a through-impedance standard substrate, the method comprising: preparing a substrate, forming a conductor on a surface of the substrate, the upper surface of the conductor defining a first pin measurement area; and providing a first protection device to the conductor The first protection device covers the first needle measurement area; the first outer panel is disposed on the upper surface of the electrical conductor, wherein the first outer panel has a first window for wearing the first needle a first protection device; removing the first protection device to expose the first needle measurement area to the first window; removing the substrate to expose a lower surface of the electrical conductor, the lower surface of the electrical conductor defining a second a second measuring device is disposed on the second needle measuring area of the electrical conductor, so that the second protective device covers the second measuring area; A second outer panel is disposed on the lower surface of the electrical conductor, wherein the second outer panel has a second window for penetrating the second protection device; and the second protection device is removed to complete the through-impedance standard substrate. The method for manufacturing a through-impedance standard substrate according to claim 3, wherein in the step of disposing the first outer plate on the upper surface of the electrical conductor, forming a first adhesive layer on the upper surface of the electrical conductor, the first An outer plate is disposed on the upper surface of the first adhesive layer; and in the step of disposing the second outer plate on the lower surface of the electrical conductor, a second adhesive layer is formed on the lower surface of the electrical conductor. The second outer plate is disposed on the lower surface of the second adhesive layer. The method for manufacturing a through-impedance standard substrate according to claim 3 or 4, wherein in the step of disposing the first outer plate on the upper surface of the electric conductor, the electric conductor and the first outer plate respectively form corresponding positioning holes, and The first outer panel is pre-formed according to the positioning hole, and the first outer panel is disposed on the electric conductor through the positioning hole and the electric conductor. The method for manufacturing a through-impedance standard substrate according to claim 5, wherein in the step of disposing the second outer panel on the lower surface of the conductor, the conductor and the second outer panel respectively form corresponding positioning holes, and the second The second plate is pre-formed according to the positioning hole, and the second outer plate is disposed on the electric conductor through the positioning hole and the electric conductor. In the method of fabricating the through-impedance standard substrate according to claim 6, in the step of removing the substrate, the substrate is removed by grinding. The method of manufacturing the through-impedance standard substrate according to claim 6, wherein the conductor is a copper foil.