CN217360171U

CN217360171U - PCB board

Info

Publication number: CN217360171U
Application number: CN202220096581.3U
Authority: CN
Inventors: 郭丹
Original assignee: Hangzhou Guangli Microelectronics Co ltd
Current assignee: Hangzhou Guangli Test Equipment Co ltd
Priority date: 2022-01-14
Filing date: 2022-01-14
Publication date: 2022-09-02
Anticipated expiration: 2032-01-14

Abstract

The utility model discloses a PCB (printed circuit board), which comprises a substrate, wherein the upper surface of the substrate is provided with at least two first golden fingers, and each first golden finger is provided with a first test connection point, a device connection point and an isolation groove; the first test connection point is connected with the device connection point to form a first test channel, and the first test channel is positioned in the isolation groove and is disconnected with the first golden finger through the isolation groove; the device connection point is located between the center of the substrate and the first test connection point and is used for connecting a probe or a component. The utility model provides a PCB board can regard as the probe card to use, also can regard as the verification board to use, promotes measuring speed and accuracy, realizes that the reliability of equipment is verified, has reduced the loss of probe card, has reduced use cost.

Description

PCB board

Technical Field

The utility model belongs to the technical field of semiconductor design, manufacturing and test, in particular to PCB board.

Background

In the semiconductor integrated circuit industry, a probe card (probe card) is commonly used to perform auxiliary testing when performing wafer-level electrical testing on a tester.

In the conventional probe card, one end of a probe (probe) is fixed on a circuit board (PCB), and then the probe is connected to a test machine through the PCB and a test head, and the other end of the probe is in contact with a probe on each test unit (DUT) on a wafer, thereby forming a complete test system. The probe card is used for communicating the testing machine table with the tested structure through the needle inserting welding pad.

Most of probe cards used by a test machine at the present stage are communicated with signals of a wafer through flying wires, and when a low-leakage product is tested, the leakage test of the product may be influenced by external factors such as the flying wires.

Meanwhile, the PCB of the probe card can also be used as a verification board. In order to verify the testing accuracy and the testing accuracy of the wafer electrical testing equipment, a series of verification works are usually performed before the testing equipment leaves a factory, the modes of verifying the testing equipment are different from the used instruments, one important verification mode is to measure different components by using the just-built testing equipment, the measured value is compared with the actual component value to see the difference, and if the measured value is closer to the actual value, the higher the accuracy of the testing equipment is.

At present, the verification work of electrical test equipment is to directly weld a component on a probe card for measurement, and the measurement has several defects, firstly, a probe card which is universal in the industry is selected as a verification board, and the component is welded on the probe card for measurement, so that the operation can damage the original probe card; secondly, since the welding position of the component is not communicated with the measurement pressure point, the probe card needs to be provided with flying wires for measurement, and the external factors of the flying wires and the like can influence the final measurement result; thirdly, the position of the probe card for welding components is limited, the types of the components which can be measured are few, and if some larger components are replaced, for example, some precision components with larger volume are tested, the welding position may be insufficient.

Therefore, it is desirable to provide a PCB with low leakage and high test accuracy, which can be used as a probe card and also as a verification board to expand the selection range of the measurement device, increase the measurement speed and accuracy, and more accurately complete the verification of the wafer electrical test equipment.

SUMMERY OF THE UTILITY MODEL

The utility model provides a multi-functional PCB board can regard as the probe card to use, also can regard as the verification board to use, can promote wafer electrical test's speed and accuracy greatly, realizes that the reliability of equipment is verified, has reduced the loss of probe card, the cost is reduced.

Other objects and advantages of the present invention can be further understood from the technical features disclosed in the present invention.

In order to achieve one or part or all of the purposes or other purposes, the PCB provided by the technical scheme of the utility model comprises a substrate, wherein the upper surface of the substrate is provided with at least two first golden fingers, and each first golden finger is provided with a first test connection point, a device connection point and an isolation groove; the first test connection point is connected with the device connection point to form a first test channel, and the first test channel is positioned in the isolation groove and is disconnected with the first golden finger through the isolation groove; the device connection point is located between the center of the substrate and the first test connection point and is used for connecting a probe or a component. The isolation groove ensures that a test signal of a first test channel formed by the first test connection point and the device connection point is not interfered by external factors, so that the test is more accurate.

When the probe card is used as a probe card, a corresponding probe is fixed at the center of a substrate, a first test connection point on a first golden finger is connected with a test pressure point of a test head, a device connection point on the corresponding first golden finger is connected with the probe, and an electrical test is completed through a first test channel. When the test board is used as a verification board, two ends of the resistor are connected with two device connection points by using a known quantity of electronic components such as resistors, the first test connection points on the two corresponding first golden fingers are respectively connected with the test pressure points of the test head, the resistance value of the resistor is measured through the first test channel, and the accuracy and precision of the test equipment can be judged by comparing the test result with the actual resistance value. Because the device connection point on the PCB can be connected with the probe and can also be connected with the device, the device does not need to be welded on a probe card in the verification work, and the waste caused by the damage of the probe can not be caused; meanwhile, the probe is directly connected with the device connection point, so that the influence of electric leakage on the test can be reduced.

The first test connection point is provided with a first through hole for electric connection, the first golden finger is also provided with a second test connection point, the second test connection point is positioned on one side of the first test connection point, which is far away from the device connection point, and the second test connection point is provided with a second through hole for electric connection; the lower surface of the substrate is provided with a second golden finger, and the first test connection point and the second test connection point are electrically communicated with the second golden finger through the first through hole and the second through hole respectively, so that the second test point is connected with the device connection point to form a second test channel. In use, the test pressure point of the test head can be selectively connected with the first test connection point or the second test connection point, and a proper test connection point is selected according to the actual spatial position. When the number of the test pressure points of the required test head is large, the number of the corresponding first golden fingers and the number of the corresponding second golden fingers are correspondingly increased, at the moment, the test pressure points of the test head can be respectively connected with the first test point and the second test point on the adjacent first golden fingers, namely, the electric conduction is realized through the first test channel and the second test channel respectively, the distance between the adjacent test pressure points is increased, the space of the test pressure points is increased, the mutual interference is prevented, and the test precision is improved.

The second golden finger is provided with a signal channel used for communicating the first through hole with the second through hole, an isolation groove is arranged around the signal channel, the signal channel is connected with the second golden finger through the isolation groove, and the isolation groove enables a test signal in the signal channel not to be interfered by external factors, so that the test is more accurate.

An isolation groove is formed around the second test connection point, the second test connection point is disconnected with the first golden finger through the isolation groove, and interference of external factors on the second test connection point is avoided.

And a third through hole communicated with the second golden finger is formed in the first golden finger and is positioned outside the isolation groove. When the first golden finger is grounded, the grounding protection of the first golden finger and the second golden finger is realized through the third through hole, so that the test is more accurate.

When the number of the first golden fingers is multiple, the device connecting points on the adjacent first golden fingers are arranged in a staggered mode, and connection of devices with larger sizes is facilitated.

The upper surface and the lower surface of the substrate are paved by ceramic materials, so that the electric leakage of the PCB in the use process is greatly reduced, the parasitic capacitance of the PCB is almost zero, and the stability and the accuracy of the test process are greatly improved; the middle layer between the upper surface and the lower surface is made of FR4 material, so that the cost is saved.

The PCB testing device comprises a probe station, a PCB board, a base plate and a probe card, wherein the probe station is provided with a probe card, and the probe card is provided with a probe card hole.

The base plate is provided with a convenient holding device mounting hole which is used for mounting a convenient holding device. The portable device can be a single device, and can also be a ring, a square, a circle, an arch or an irregular shape formed by a plurality of structures. The PCB board is convenient to hold, can be taken and put by a user, avoids polluting and damaging the surface of the PCB board, causes the problem of overhigh electric leakage of the PCB board, and can play a certain role in protecting parts on the PCB board.

The substrate is also provided with a direction indication mark. The installation direction of the PCB can be more conveniently determined by a user, and the PCB can be positioned and installed more quickly.

Compared with the prior art, the beneficial effects of the utility model mainly include: the PCB provided by the technical scheme realizes multifunctional use of the PCB; when the probe card is used as a probe card, low electric leakage and low parasitic capacitance can be ensured, the selection range of a measuring device can be ensured when the probe card is used as a verification board, the measuring speed and accuracy are improved, the reliability verification of equipment is realized, the loss of the probe card is reduced, and the use cost is reduced.

In order to make the aforementioned and other objects, features and advantages of the present invention comprehensible, preferred embodiments accompanied with figures are described in detail below.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly described below, and it is obvious that the drawings described below are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic view of an upper surface of a PCB board according to a first embodiment of the present invention;

FIG. 2 is an enlarged view of a portion of FIG. 1;

fig. 3 is a schematic view of a lower surface of a PCB board according to a first embodiment of the present invention.

Reference numerals: 1-substrate, 2-first gold finger, 31-first test connection point, 32-second test connection point, 4-device connection point, 5-part connection area, 6-second gold finger, 7-signal channel, 81-first through hole, 82-second through hole, and 83-third through hole.

Detailed Description

The foregoing and other technical and scientific aspects, features and advantages of the present invention will be apparent from the following detailed description of a preferred embodiment, which is to be read in connection with the accompanying drawings. Directional terms as referred to in the following examples, for example: up, down, left, right, front or rear, etc., are referred to only in the direction of the attached drawings. Accordingly, the directional terminology is used for purposes of illustration and is in no way limiting.

The first embodiment of the present invention provides a PCB board, wherein the upper surface is shown in fig. 1, the lower surface is shown in fig. 3, and fig. 2 shows an enlarged view of a portion of the structure of the upper surface in fig. 1. Referring to fig. 1 to 3, the PCB of the present embodiment includes a substrate 1, an upper surface and a lower surface of the substrate 1 are made of a ceramic material, an intermediate layer located between the upper surface and the lower surface is made of FR4 material, and the substrate 1 is circular, but may be square or other shapes in other embodiments.

As shown in fig. 1, at least two first gold fingers 2 are disposed on the upper surface of the substrate 1, and in this embodiment, the number of the first gold fingers is multiple, so that connection of multiple test pressure points is facilitated. Each first golden finger 2 is provided with a first test connection point 31, a device connection point 4 and an isolation groove; the first test connection point 31 is connected with the device connection point 4 to form a first test channel, and the first test channel is positioned in the isolation groove and is disconnected with the first golden finger 2 through the isolation groove; the center of the substrate 1 is provided with a part connecting area 5, and the device connecting point 4 is positioned between the part connecting area 5 and the first test connecting point 31 and used for connecting a probe or a component, so that the use of flying leads is avoided, and the electric leakage problem of the test is greatly reduced.

When the probe card is used as a probe card, a probe is fixed on the part connecting area 5, the probe is connected with the device connecting point 4 on the first golden finger 2, and correspondingly, the first testing connecting point 31 on the first golden finger 2 is connected with the testing pressure point of the testing head.

When the test board is used as a verification board, two ends of a component are respectively connected with the two component connection points 4, and the first test connection points 31 on the two corresponding first golden fingers 2 are respectively connected with the test pressure points of the test head. When two first golden fingers 2 that choose for use are in diagonal position, components and parts can be placed on part joining region 5, and when two first golden fingers 2 that choose for use were in adjacent or PCB board one side position, components and parts also can be placed in PCB board outside, and convenient connection measurement can.

The first golden finger 2 is further provided with a second testing connection point 32, and the second testing connection point 32 is located on one side of the first testing connection point 31 far away from the device connection point 4. As shown in fig. 2, the first test connection point 31 is provided with a first through hole 81 for electrical connection, and the second test connection point 32 is provided with a second through hole 82 for electrical connection. As shown in fig. 3, the lower surface of the substrate 1 is provided with a second gold finger 6, and the first test connection point 31 and the second test connection point 32 are electrically connected to the second gold finger 6 through a first through hole 81 and a second through hole 82, respectively, so that the second test point 32 is connected to the device connection point 4 to form a second test channel. In operation, the test pressure point of the test head is selectively connected to the first test connection point 31 or the second test connection point 32, i.e. the first test channel or the second test channel is selected, or simultaneously connected to perform measurements of different parameters.

As shown in fig. 1 and 2, an isolation groove is formed around the second test connection point 32, and the second test connection point 32 is disconnected from the first gold finger 2 through the isolation groove. As shown in fig. 3, the second gold finger 6 is provided with a signal channel 7 for communicating the first through hole 81 and the second through hole 82, an isolation groove is provided around the signal channel 7, and the signal channel 7 is disconnected from the second gold finger 6 through the isolation groove. The isolation groove can ensure that the test signal in the test channel is not interfered by external factors, so that the test is more accurate.

As shown in fig. 2, the first gold finger 2 is provided with a third through hole 83 communicated with the second gold finger 6, and the third through hole 83 is located outside the isolation groove.

In this embodiment, the device connection points 4 on the adjacent first gold fingers 2 are arranged in a staggered manner, so that the distance between the device connection points is increased, the interference is reduced, and the connection of devices with larger sizes is facilitated.

It should be noted that, in other embodiments, structures that facilitate positioning, installation, taking, or calibrating directions may be added to the substrate 1. For example, in some embodiments, positioning holes may be provided on the substrate 1 for positioning the PCB board to fixedly mount the PCB board on the probe station; meanwhile, the positioning hole can also be used as a mounting hole of the fixing structure, and the fixing structure such as a bolt is fixed on the probe station, so that the PCB is more firmly mounted, and the pressure point of the test head is more accurate.

In other embodiments, a mounting hole for mounting a pick-and-place device may be further formed in the substrate 1, the mounting hole may be symmetrically or asymmetrically formed in the substrate 1, the PCB further includes a pick-and-place device mounted in the mounting hole, the pick-and-place device may be mounted and fixed by a single device through a single mounting hole, or may be mounted and fixed by a plurality of mounting holes when the single device is large, or the pick-and-place device may be a combination of a plurality of devices, and when the plurality of devices are combined, the plurality of devices are respectively mounted in different corresponding mounting holes. In addition, in order to adapt to the operation habit of the user or to fit the consideration of the use environment of the PCB and other factors, the taking and placing device can be in a ring shape, a profile shape, a circular shape, an arched shape or other irregular shapes so as to adapt to and fit the test environment. Get the setting of putting the device, can the person of facilitating the use take and put, avoid polluting, harm PCB board face, cause the too high problem of PCB board electric leakage, can play certain guard action to the spare part above the PCB board simultaneously.

In other embodiments, the substrate 1 of the PCB may further be provided with a direction indication mark, for example, an arrow printed on the substrate 1, so that a user may determine the mounting direction of the PCB more conveniently, and may position and mount the PCB more quickly.

The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, i.e., all simple equivalent changes and modifications made by the claims and the specification of the present invention are still within the scope of the present invention. Moreover, it is not necessary for any embodiment or claim of the present invention to address or achieve all of the objects, advantages, or features disclosed herein. In addition, the abstract and the utility model name are only used to assist the retrieval of patent documents, and are not used to limit the scope of the invention. Furthermore, the terms "first", "second", and the like in the description or the claims are used only for naming elements (elements) or distinguishing different embodiments or ranges, and are not used for limiting the upper limit or the lower limit on the number of elements.

Claims

1. A PCB board comprises a substrate (1) and is characterized in that at least two first golden fingers (2) are arranged on the upper surface of the substrate (1), and each first golden finger (2) is provided with a first test connection point (31), a device connection point (4) and an isolation groove; the first test connection point (31) is connected with the device connection point (4) to form a first test channel, and the first test channel is positioned in the isolation groove and disconnected with the first golden finger (2) through the isolation groove; the device connecting point (4) is located between the center of the substrate (1) and the first testing connecting point (31) and used for connecting a probe or a component.

2. The PCB board according to claim 1, wherein a first through hole (81) for electrical connection is provided on the first test connection point (31), a second test connection point (32) is further provided on the first golden finger (2), the second test connection point (32) is located on a side of the first test connection point (31) away from the device connection point (4), and a second through hole (82) for electrical connection is provided thereon; the lower surface of the substrate (1) is provided with a second golden finger (6), and the first test connection point (31) and the second test connection point (32) are electrically communicated with the second golden finger (6) through the first through hole (81) and the second through hole (82) respectively, so that the second test connection point (32) is connected with the device connection point (4) to form a second test channel.

3. The PCB board according to claim 2, wherein the second golden finger (6) is provided with a signal channel (7) for communicating the first through hole (81) with the second through hole (82), an isolation groove is arranged around the signal channel (7), and the signal channel (7) is disconnected from the second golden finger (6) through the isolation groove.

4. A PCB board according to claim 2 or 3, wherein an isolation slot is provided around the second test connection point (32), through which isolation slot the second test connection point (32) is disconnected from the first gold finger (2).

5. The PCB board according to claim 2, wherein a third through hole (83) communicated with the second golden finger (6) is arranged on the first golden finger (2), and the third through hole (83) is positioned outside the isolation groove.

6. The PCB board according to claim 1, wherein when the number of the first golden fingers (2) is multiple, the device connection points (4) on the adjacent first golden fingers (2) are arranged in a staggered manner.

7. The PCB board according to claim 1, wherein the upper and lower surfaces of the substrate (1) are laid out of a ceramic material and the intermediate layer between the upper and lower surfaces is made of FR4 material.

8. The PCB board according to claim 1, wherein the base plate (1) is provided with positioning holes for positioning and mounting of the PCB board.

9. The PCB board according to claim 1, wherein the base plate (1) is provided with a handy holder mounting hole for mounting a handy holder.

10. The PCB board according to claim 1, characterized in that the base plate (1) is further provided with a direction indicator.