TWM537215U - Testing device for testing electrical property of probe head - Google Patents
Testing device for testing electrical property of probe head Download PDFInfo
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- TWM537215U TWM537215U TW105217771U TW105217771U TWM537215U TW M537215 U TWM537215 U TW M537215U TW 105217771 U TW105217771 U TW 105217771U TW 105217771 U TW105217771 U TW 105217771U TW M537215 U TWM537215 U TW M537215U
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Description
本創作是關於一種電測裝置,特別是關於一種用於電測探針頭的電測裝置。 The present invention relates to an electrical measuring device, and more particularly to an electrical measuring device for an electrical probe head.
近年來,隨著電子產品朝向精密與多功能化發展,應用在電子產品內的積體電路之晶片結構也趨於複雜。在製造時為了確保晶片的電氣品質,在將晶片封裝前會先進行晶片級量測。現今的晶片量測方法係採用探針卡(Probe card)來測試晶片,並且根據探針的型態可分為懸臂式探針卡(cantilever probe card)與垂直式探針卡(vertical probe card)。在使用上,藉由將探針卡的探針直接與晶片的接觸墊(pad)或凸塊(bump)電性接觸,再經由探針卡的電路板將電氣訊號連接到測試機(Tester),使測試機傳送測試訊號到晶片或接收來自晶片的輸出訊號,進而達到量測晶片的電氣特性之功效,並且使用者可根據量測的結果將不良晶片剔除,以節省不必要的封裝成本。 In recent years, as electronic products have advanced toward precision and multi-functionality, the wafer structure of integrated circuits applied in electronic products has also become complicated. In order to ensure the electrical quality of the wafer during fabrication, wafer level measurement is performed prior to packaging the wafer. Today's wafer measurement methods use a probe card to test the wafer, and can be classified into a cantilever probe card and a vertical probe card depending on the type of the probe. . In use, by electrically contacting the probe of the probe card directly with a pad or bump of the wafer, the electrical signal is connected to the tester via the circuit board of the probe card. The test machine transmits the test signal to the chip or receives the output signal from the chip, thereby measuring the electrical characteristics of the wafer, and the user can reject the defective wafer according to the measurement result, thereby saving unnecessary packaging cost.
再者,隨著晶片結構的複雜化,在探針卡之探針頭中的探針數量可高達上千或上萬根,且探針的尺寸也趨於細小。當藉由探針檢測儀 器將該等探針進行逐一檢測時,雖然可獲得精確度較高的檢測結果,但往往會花費數十小時以上的時間。另外,當藉由手動將探針頭的該等探針進行檢測時,雖然具有速度快、花費時間較短的優點,然而檢測的準確度較低,且容易造成探針損傷。舉例來說,請參照第1圖和第2圖,第1圖顯示一種習知的探針頭的電測裝置10之上視示意圖,以及第2圖顯示第1圖之該電測裝置10的側視圖。該電測裝置10包含一電路板110和一電性檢測儀器120。該電路板110包含複數個接觸墊111以及複數個排列在一側邊的導電通道112,其中每一該導電通道112是藉由該電路板110內的走線與其中之一該接觸墊111電性連接。在量測時,先將探針頭20放置在該電路板110上,且將該探針頭20之複數個探針之第一端211與對應之該接觸墊111對準且接觸。接著,藉由將該電性檢測儀器120之第一檢測端121與其中之一探針21之第二端212接觸,以及將該電性檢測儀器120之第二檢測端122與該其中之一探針21對應之該導電通道112接觸,以判斷該探針21是否與對應之該接觸墊111導通,若檢測結果為不導通時,再將該探針21做進一步檢查或更換。 Furthermore, as the structure of the wafer is complicated, the number of probes in the probe head of the probe card can be as high as thousands or tens of thousands, and the size of the probe also tends to be small. Probe detector When the probes are individually detected, although a highly accurate detection result can be obtained, it often takes several tens of hours or more. In addition, when the probes of the probe head are manually detected, although the speed is fast and the time is short, the accuracy of the detection is low, and the probe is easily damaged. For example, please refer to FIG. 1 and FIG. 2 , which shows a top view of a conventional probe head of the electrical measuring device 10 , and FIG. 2 shows a schematic view of the electrical measuring device 10 of FIG. 1 . Side view. The electrical testing device 10 includes a circuit board 110 and an electrical detecting instrument 120. The circuit board 110 includes a plurality of contact pads 111 and a plurality of conductive channels 112 arranged on one side, wherein each of the conductive channels 112 is electrically connected to one of the contact pads 111 by a trace in the circuit board 110. Sexual connection. In the measurement, the probe head 20 is first placed on the circuit board 110, and the first end 211 of the plurality of probes of the probe head 20 is aligned and contacted with the corresponding contact pad 111. Then, the first detecting end 121 of the electrical detecting instrument 120 is brought into contact with the second end 212 of one of the probes 21, and the second detecting end 122 of the electrical detecting instrument 120 is connected to one of the probe terminals 120. The probe 21 is in contact with the conductive channel 112 to determine whether the probe 21 is electrically connected to the corresponding contact pad 111. If the detection result is non-conducting, the probe 21 is further inspected or replaced.
然而,在上述習知的探針頭的電測裝置10中,由於該電性檢測儀器120是將該第一檢測端121與該探針21之該第二端212直接接觸,因此當施加的角度或力道不當時,容易造成該探針21之該第二端212的表面受損或者是造成該探針21彎折導致針位偏移。另一方面,若該等探針21在組裝時,該等探針21的針面水平不一致,容易導致當將該探針頭20放置在該電路板110時,部分之探針21之第一端211沒有與對應之該接觸墊111接觸,使得量測的結果為不導通,進而導致將該探針21誤判為不良品。 However, in the above-described electrical probe device 10 of the probe head, since the electrical detecting device 120 directly contacts the first detecting end 121 with the second end 212 of the probe 21, when applied If the angle or force is not correct, the surface of the second end 212 of the probe 21 is easily damaged or the probe 21 is bent to cause the needle position to shift. On the other hand, if the probes 21 are assembled, the needle surface levels of the probes 21 are inconsistent, which tends to cause the first probe 21 to be partially placed when the probe head 20 is placed on the circuit board 110. The end 211 is not in contact with the corresponding contact pad 111, so that the measurement result is non-conducting, thereby causing the probe 21 to be misjudged as a defective product.
有鑑於此,有必要提供一種改良的探針頭的電測裝置及電測 方法,以解決習知技術所存在的問題。 In view of this, it is necessary to provide an improved probe head electrical measuring device and electrical measurement Methods to solve the problems of the prior art.
為解決上述技術問題,本創作之目的在於提供一種探針頭的電測裝置,並且在該電測裝置中在待量測的探針頭上放置一個導電塊。藉由導電塊的重量對該探針頭之複數個探針施加一垂直向下的壓力,以確保該等探針能與電路板上之相對應的接觸墊接觸。再者,藉由該導電塊做為探針之一端的訊號傳遞媒介,使得只需藉由將電性檢測儀器之一端與該導電塊接觸,另一端與電路板上之每一探針對應之導電通道接觸,即可達到快速檢測每一探針之功效。 In order to solve the above technical problems, the object of the present invention is to provide an electrical measuring device for a probe head, and a conductive block is placed on the probe head to be measured in the electrical measuring device. A vertical downward pressure is applied to the plurality of probes of the probe head by the weight of the conductive block to ensure that the probes are in contact with corresponding contact pads on the circuit board. Furthermore, the conductive block is used as a signal transmission medium at one end of the probe, so that only one end of the electrical detecting instrument is in contact with the conductive block, and the other end corresponds to each probe on the circuit board. The conductive channel is in contact to achieve fast detection of each probe.
為達成上述目的,本創作提供一種探針頭的電測裝置,包含:一電路板,具有複數個接觸墊以及複數個排列在一側邊的導電通道,其中每一該些導電通道與其中之一接觸墊電性連接;一定位治具,組裝在該電路板上,用於將一探針頭定位在該電路板上,使得該探針頭之複數個探針之一端與對應的該接觸墊電性接觸;一導電塊,設置在該探針頭上,使得該探針頭之該複數個探針之另一端與該導電塊電性接觸;以及一電性檢測儀器,具有第一檢測端和第二檢測端,其中該第一檢測端與該導電塊接觸,且該第二檢測端與其中之一導電通道接觸,使得該第一檢測端的電流經由該導電塊傳遞至該複數個探針,並且藉由將該第二檢測端與該其中之一導電通道接觸,以判斷在該探針頭中與該其中之一導電通道對應之該探針是否異常。 In order to achieve the above object, the present invention provides an electrical measuring device for a probe head, comprising: a circuit board having a plurality of contact pads and a plurality of conductive channels arranged on one side, wherein each of the conductive channels and the conductive channel thereof a contact pad electrically connected; a positioning fixture assembled on the circuit board for positioning a probe head on the circuit board such that one end of the plurality of probes of the probe head is in contact with the corresponding one a conductive contact; a conductive block disposed on the probe head such that the other end of the plurality of probes of the probe head is in electrical contact with the conductive block; and an electrical detecting instrument having a first detecting end And a second detecting end, wherein the first detecting end is in contact with the conductive block, and the second detecting end is in contact with one of the conductive paths, so that current of the first detecting end is transmitted to the plurality of probes via the conductive block And contacting the second detecting end with the one of the conductive paths to determine whether the probe corresponding to the one of the conductive paths in the probe head is abnormal.
於本創作其中之一較佳實施例中,該導電塊與該探針頭之該複數個探針接觸之表面的平坦度小於4微米。 In one preferred embodiment of the present invention, the surface of the conductive block that contacts the plurality of probes of the probe head has a flatness of less than 4 microns.
於本創作其中之一較佳實施例中,該導電塊具有一對位螺絲,以及該定位治具上具有至少一定位點,其中當該導電塊設置在該探針頭上時,該導電塊之該對位螺絲與該定位治具之該至少一定位點對準。 In a preferred embodiment of the present invention, the conductive block has a pair of bit screws, and the positioning fixture has at least one positioning point, wherein when the conductive block is disposed on the probe head, the conductive block The alignment screw is aligned with the at least one positioning point of the positioning fixture.
於本創作其中之一較佳實施例中,該導電塊具有至少一手把件。 In one preferred embodiment of the present invention, the conductive block has at least one handle member.
本創作還提供一種探針頭的電測方法,包含:提供一電路板,具有複數個矩陣排列的接觸墊以及複數個排列在一側邊的導電通道,其中每一該導電通道與其中之一該接觸墊電性連接;將一探針頭放置在該電路板上,使得該探針頭之複數個探針之一端與對應的該接觸墊電性接觸;將一導電塊放置在該探針頭上,使得該探針頭之該複數個探針之另一端與該導電塊電性接觸;將一電性檢測儀器之第一檢測端與該導電塊接觸,且將該電性檢測儀器之第二檢測端與其中之一該導電通道接觸,使得該第一檢測端的電流經由該導電塊傳遞至該複數個探針,並且藉由將該第二檢測端與該其中之一導電通道接觸,以量測在該探針頭中與該其中之一導電通道對應之該探針是否異常。 The present invention also provides an electrical measurement method for a probe head, comprising: providing a circuit board, a plurality of matrix-arranged contact pads, and a plurality of conductive channels arranged on one side, wherein each of the conductive channels and one of the conductive channels The contact pad is electrically connected; a probe head is placed on the circuit board such that one end of the plurality of probes of the probe head is in electrical contact with the corresponding contact pad; and a conductive block is placed on the probe a head, the other end of the plurality of probes of the probe head is in electrical contact with the conductive block; a first detecting end of an electrical detecting device is in contact with the conductive block, and the electrical detecting device is The second detecting end is in contact with one of the conductive paths, so that current of the first detecting end is transmitted to the plurality of probes via the conductive block, and by contacting the second detecting end with one of the conductive paths, Measure whether the probe corresponding to one of the conductive paths in the probe head is abnormal.
於本創作其中之一較佳實施例中,在將一探針頭放置在該電路板上之前還包含:將一定位治具組裝在該電路板上;以及將一探針頭放置在該定位治具中。 In a preferred embodiment of the present invention, before placing a probe head on the circuit board, the method further comprises: assembling a positioning fixture on the circuit board; and placing a probe head in the positioning In the fixture.
於本創作其中之一較佳實施例中,當該電性檢測儀器判斷該探針與對應之該接觸墊為不導通時,還包含:對該導電塊施加一垂直於該探針頭的壓力,且再次進行量測該探針是否導通的步驟。 In a preferred embodiment of the present invention, when the electrical detecting device determines that the probe is non-conducting with the corresponding contact pad, the method further comprises: applying a pressure perpendicular to the probe head to the conductive block And measuring the step of whether the probe is turned on again.
相較於習知技術,本創作藉由在該電測裝置中在待量測的探 針頭上放置一個導電塊。藉由導電塊的重量對該探針頭之複數個探針施加一垂直向下的壓力,以避免習知技術中由於該等探針的針面水平不一致,導致當將探針頭放置在電路板時,部分之探針沒有與對應之接觸墊接觸,使得量測的結果為不導通,進而導致將該探針誤判為不良品。再者,藉由該導電塊做為探針之一端的訊號傳遞媒介,使得只需藉由將電性檢測儀器之一端與該導電塊接觸,另一端與電路板上之每一探針對應之導電通道接觸,進而避免習知技術中由於將電性檢測儀器之檢測端與探針直接接觸,當施加的角度或力道不當時,容易造成該探針的表面受損或者是造成該探針彎折導致針位偏移。 Compared with the prior art, this creation is based on the measurement to be measured in the electrical measuring device. Place a conductive block on the needle. Applying a vertical downward pressure to the plurality of probes of the probe head by the weight of the conductive block to avoid misalignment of the needle surface level of the probes in the prior art, when the probe head is placed in the circuit When the plate is in use, part of the probe is not in contact with the corresponding contact pad, so that the measurement result is non-conducting, thereby causing the probe to be misjudged as a defective product. Furthermore, the conductive block is used as a signal transmission medium at one end of the probe, so that only one end of the electrical detecting instrument is in contact with the conductive block, and the other end corresponds to each probe on the circuit board. The conductive channel is in contact, thereby avoiding the direct contact between the detecting end of the electrical detecting instrument and the probe in the prior art. When the applied angle or force is not proper, the surface of the probe is easily damaged or the probe is bent. The fold causes the needle position to shift.
10、30‧‧‧電測裝置 10, 30‧‧‧Electrical measuring device
110、310‧‧‧電路板 110, 310‧‧‧ circuit board
111、311‧‧‧接觸墊 111, 311‧‧‧ contact pads
112、312‧‧‧導電通道 112, 312‧‧‧ conductive channels
120、320‧‧‧電性檢測儀器 120, 320‧‧‧Electrical testing equipment
121、321‧‧‧第一檢測端 121, 321‧‧‧ first detection end
122、322‧‧‧第二檢測端 122, 322‧‧‧ second detection end
330‧‧‧導電塊 330‧‧‧Electrical block
331‧‧‧第一表面 331‧‧‧ first surface
332‧‧‧第二表面 332‧‧‧ second surface
333‧‧‧手把件 333‧‧‧Hands
334‧‧‧對位螺絲 334‧‧‧ alignment screw
340‧‧‧定位治具 340‧‧‧ positioning fixture
341‧‧‧第一定位點 341‧‧‧First anchor point
342‧‧‧第二定位點 342‧‧‧Second anchor point
20‧‧‧探針頭 20‧‧‧Probe head
21‧‧‧探針 21‧‧‧ probe
211‧‧‧第一端 211‧‧‧ first end
212‧‧‧第二端 212‧‧‧ second end
F‧‧‧壓力 F‧‧‧ Pressure
S11~S14‧‧‧步驟 S11~S14‧‧‧Steps
第1圖顯示一種習知的探針頭的電測裝置之上視示意圖;第2圖顯示第1圖之該電測裝置的側視圖;第3圖顯示一種根據本創作之較佳實施例的探針頭的電測裝置之示意圖;第4圖顯示第3圖之該電測裝置之上視圖;第5圖顯示第3圖之該電測裝置之導電塊之立體示意圖;以及第6圖顯示一種根據本創作之較佳實施例的探針頭的電測方法之流程圖。 1 is a top plan view of an electrical measuring device of a conventional probe head; FIG. 2 is a side view of the electrical measuring device of FIG. 1; and FIG. 3 is a view showing a preferred embodiment according to the present invention. Schematic diagram of the electrical measuring device of the probe head; FIG. 4 is a top view of the electrical measuring device of FIG. 3; FIG. 5 is a perspective view showing the conductive block of the electrical measuring device of FIG. 3; A flow chart of an electrical measurement method for a probe head in accordance with a preferred embodiment of the present invention.
為了讓本創作之上述及其他目的、特徵、優點能更明顯易懂,下文將特舉本創作較佳實施例,並配合所附圖式,作詳細說明如下。 In order to make the above and other objects, features and advantages of the present invention more comprehensible, the preferred embodiments of the present invention will be described in detail below.
請參照第3圖和第4圖,第3圖顯示一種根據本創作之較佳實施例的探針頭的電測裝置30之示意圖,以及第4圖顯示第3圖之該電測裝置30之上視圖。該電測裝置30包含一電路板310、一電性檢測儀器320、一導電塊330和一定位治具340。該電路板110包含複數個矩陣排列的接觸墊311以及複數個排列在一側邊的導電通道312,其中每一該導電通道312是藉由該電路板310內的走線與其中之一該接觸墊311電性連接。在使用時,先將該定位治具340組裝在該電路板310,之後將一探針頭20放置在該定位治具340中。藉由該定位治具340使得該探針頭20被定位在該電路板310上之一特定位置,以將該探針頭20之複數個探針21之第一端211與對應的該接觸墊311對準且電性接觸。接著,將該導電塊330壓放在該探針頭20上,使得該探針頭20之該複數個探針21之第二端212與該導電塊330電性接觸。藉由該導電塊330的重量對該探針頭20之複數個探針21施加一垂直向下的壓力F,以達到整平該等探針之針面的效果,進而確保該等探針21之第一端211能與該電路板310上之相對應的接觸墊311接觸。此外,由於該導電塊330是由導電材料製成,且該導電塊330會與該等探針21接觸,故該導電塊330可作為在量測時該等探針21的訊號傳遞媒介。詳言之,當使用該電性檢測儀器320檢測該等探針21是否有導通時,該電性檢測儀器320之第一檢測端321會與該導電塊330接觸,以及該電性檢測儀器320之第二檢測端322會與其中之一該導電通道312接觸,使得該第一檢測端321的電流經由該導電塊330傳遞至該等探針21,再經由該等探針21傳遞至該電路板310。故只需移動該第二檢測端322的位置即可達到快速檢測每一探針之功效。更明確地說,由於該其中之一導電通道312是與和其中之一探針21接觸的接觸墊311對應。因此, 通過量測結果可判斷在該探針頭20中該其中之一探針21是否異常,若檢測結果為不導通時,表示該其中之一探針21異常,需要將該其中之一探針21做進一步檢查或更換。 Please refer to FIG. 3 and FIG. 4 , which shows a schematic diagram of an electrical measuring device 30 of a probe head according to a preferred embodiment of the present invention, and FIG. 4 shows a third measuring device of the electrical measuring device 30 . Top view. The electrical measuring device 30 includes a circuit board 310, an electrical detecting device 320, a conductive block 330 and a positioning fixture 340. The circuit board 110 includes a plurality of matrix-arranged contact pads 311 and a plurality of conductive channels 312 arranged on one side, wherein each of the conductive channels 312 is in contact with one of the traces in the circuit board 310. The pad 311 is electrically connected. In use, the positioning fixture 340 is first assembled to the circuit board 310, and then a probe head 20 is placed in the positioning fixture 340. The probe head 340 is positioned at a specific position on the circuit board 310 by the positioning fixture 340 to connect the first end 211 of the plurality of probes 21 of the probe head 20 with the corresponding contact pad. 311 is aligned and electrically in contact. Then, the conductive block 330 is pressed onto the probe head 20 such that the second end 212 of the plurality of probes 21 of the probe head 20 is in electrical contact with the conductive block 330. A vertical downward pressure F is applied to the plurality of probes 21 of the probe head 20 by the weight of the conductive block 330 to achieve the effect of leveling the needle faces of the probes, thereby ensuring the probes 21 The first end 211 can be in contact with a corresponding contact pad 311 on the circuit board 310. In addition, since the conductive block 330 is made of a conductive material and the conductive block 330 is in contact with the probes 21, the conductive block 330 can serve as a signal transmission medium for the probes 21 during measurement. In detail, when the electrical detecting device 320 is used to detect whether the probes 21 are turned on, the first detecting end 321 of the electrical detecting device 320 contacts the conductive block 330, and the electrical detecting device 320 The second detecting end 322 is in contact with one of the conductive channels 312, so that the current of the first detecting end 321 is transmitted to the probes 21 via the conductive block 330, and then transmitted to the circuit via the probes 21 Board 310. Therefore, it is only necessary to move the position of the second detecting end 322 to achieve the function of quickly detecting each probe. More specifically, since one of the conductive paths 312 corresponds to the contact pad 311 which is in contact with one of the probes 21. therefore, The measurement result can be used to determine whether one of the probes 21 in the probe head 20 is abnormal. If the detection result is non-conducting, it indicates that one of the probes 21 is abnormal, and one of the probes 21 needs to be used. Do further inspection or replacement.
請參照第3圖和第5圖,第5圖顯示第3圖之該電測裝置30之該導電塊330之立體示意圖。該導電塊330具有一第一表面331和一相對該第一表面331之第二表面332。較佳地,該導電塊330之該第一表面331的平坦度控制在小於4微米。因此,當將該導電塊330壓放在該探針頭20上時,平坦的該第一表面331會與該探針頭20之該複數個探針21接觸,以達到整平該等探針21之針面的功效。此外,該導電塊330還包含一對手把件333,組裝在該第二表面332上,方便使用者握取。 Referring to FIG. 3 and FIG. 5, FIG. 5 is a perspective view showing the conductive block 330 of the electrical measuring device 30 of FIG. The conductive block 330 has a first surface 331 and a second surface 332 opposite the first surface 331. Preferably, the flatness of the first surface 331 of the conductive block 330 is controlled to be less than 4 micrometers. Therefore, when the conductive block 330 is pressed onto the probe head 20, the flat first surface 331 contacts the plurality of probes 21 of the probe head 20 to level the probes. The effect of the needle of 21. In addition, the conductive block 330 further includes a pair of handle members 333 assembled on the second surface 332 for the user to grasp.
如第4圖和第5圖所示,該導電塊330具有一對位螺絲334,以及該定位治具340上具有一第一定位點341和一第二定位點342,其中該第一定位點341和該第二定位點342對應於該探針頭20的中心位置。當該導電塊330放置在該探針頭20上時,該導電塊330之該對位螺絲334與該定位治具340之該第一定位點341和該第二定位點342對準,使得該導電塊330會平均地施壓在該探針頭20上。應當注意的是,該第一定位點341和該第二定位點342可為一鎖固件、一凸塊、一孔洞...等,不侷限於此。 As shown in FIG. 4 and FIG. 5, the conductive block 330 has a pair of position screws 334, and the positioning fixture 340 has a first positioning point 341 and a second positioning point 342, wherein the first positioning point The second positioning point 341 and the second positioning point 342 correspond to the center position of the probe head 20. When the conductive block 330 is placed on the probe head 20, the alignment screw 334 of the conductive block 330 is aligned with the first positioning point 341 and the second positioning point 342 of the positioning fixture 340, so that the The conductive block 330 is evenly pressed against the probe head 20. It should be noted that the first positioning point 341 and the second positioning point 342 can be a lock, a bump, a hole, etc., without being limited thereto.
請參照第6圖,顯示一種根據本創作之較佳實施例的探針頭的電測方法之流程圖。該電測方法是藉由本創作之該電測裝置30實現。該電測方法包含以下步驟:首先,進行步驟S11,提供一電路板310。該電路板310具有複數個矩陣排列的接觸墊311以及複數個排列在一側邊的導電通道312,其中每一該導電通道312藉由該電路板310內的走線與其中之一該接 觸墊311電性連接。接著,進行步驟S12,將一探針頭20放置在該電路板310上。較佳地,該電路板310上組裝有一定位治具340,且該探針頭20放置在該定位治具340中,使得該探針頭20之複數個探針21之第一端211與對應的該接觸墊311電性接觸。接著,進行步驟S13,將一導電塊330放置在該探針頭20上,使得該探針頭20之該複數個探針21之第二端212與該導電塊330電性接觸。藉由該導電塊330的重量對該探針頭20之複數個探針21施加一垂直向下的壓力F,以達到整平該等探針之針面的效果,進而確保該等探針21之第一端211能與該電路板310上之相對應的接觸墊311接觸。此外,由於該導電塊330是由導電材料製成,且該導電塊330會與該等探針21接觸,故該導電塊330可作為在量測時該等探針21的訊號傳遞媒介。詳言之,當將導電塊330放置在該探針頭20之該複數個探針21之第二端212上之後,進行步驟S14,將一電性檢測儀器320之第一檢測端321與該導電塊330接觸,且將該電性檢測儀器320之第二檢測端322與其中之一該導電通道312接觸,使得該第一檢測端321的電流經由該導電塊330傳遞至該等探針21再經由該等探針21傳遞至該電路板310,以量測在該探針頭20中與該其中之一導電通道312對應之該探針21是否異常。也就是說,在本創作的電測方法中只需移動該第二檢測端322的位置即可達到快速檢測每一探針之功效。並且,由於該其中之一導電通道312是與和其中之一探針21接觸的接觸墊311對應。因此,通過量測結果可判斷在該探針頭20中該其中之一探針21是否與對應之該接觸墊311導通,若檢測結果為不導通時,表示該其中之一探針21異常,需要將該其中之一探針21做進一步檢查或更換。應當注意的是,由於在當探針21未完全與該接觸墊311接觸的情況下,可能會導致檢測結果的誤判,因此 當該電性檢測儀器320判斷該探針21與對應之該接觸墊311為不導通時,還可以藉由對該導電塊330施加一垂直於該探針頭20的壓力,且再次進行量測該探針32是否導通的步驟,進而避免誤判的情況發生。 Referring to Figure 6, a flow chart of an electrical measurement method for a probe head in accordance with a preferred embodiment of the present invention is shown. The electrical measurement method is implemented by the electrical measuring device 30 of the present invention. The electrical measurement method comprises the following steps: First, step S11 is performed to provide a circuit board 310. The circuit board 310 has a plurality of matrix-arranged contact pads 311 and a plurality of conductive channels 312 arranged on one side, wherein each of the conductive channels 312 is connected to one of the traces in the circuit board 310. The contact pads 311 are electrically connected. Next, in step S12, a probe head 20 is placed on the circuit board 310. Preferably, a positioning fixture 340 is assembled on the circuit board 310, and the probe head 20 is placed in the positioning fixture 340 such that the first end 211 of the plurality of probes 21 of the probe head 20 corresponds to The contact pad 311 is in electrical contact. Next, in step S13, a conductive block 330 is placed on the probe head 20 such that the second end 212 of the plurality of probes 21 of the probe head 20 is in electrical contact with the conductive block 330. A vertical downward pressure F is applied to the plurality of probes 21 of the probe head 20 by the weight of the conductive block 330 to achieve the effect of leveling the needle faces of the probes, thereby ensuring the probes 21 The first end 211 can be in contact with a corresponding contact pad 311 on the circuit board 310. In addition, since the conductive block 330 is made of a conductive material and the conductive block 330 is in contact with the probes 21, the conductive block 330 can serve as a signal transmission medium for the probes 21 during measurement. In detail, after the conductive block 330 is placed on the second end 212 of the plurality of probes 21 of the probe head 20, step S14 is performed to connect the first detecting end 321 of the electrical detecting device 320 with the The conductive block 330 is in contact, and the second detecting end 322 of the electrical detecting device 320 is in contact with one of the conductive channels 312, so that the current of the first detecting end 321 is transmitted to the probes 21 via the conductive block 330. The probe 21 is further transmitted to the circuit board 310 to measure whether the probe 21 corresponding to the one of the conductive paths 312 in the probe head 20 is abnormal. That is to say, in the electrical measurement method of the present invention, it is only necessary to move the position of the second detecting end 322 to achieve the function of quickly detecting each probe. Also, since one of the conductive paths 312 corresponds to the contact pad 311 that is in contact with one of the probes 21. Therefore, whether the one of the probes 21 in the probe head 20 is electrically connected to the corresponding contact pad 311 can be determined by the measurement result. If the detection result is non-conducting, it indicates that one of the probes 21 is abnormal. One of the probes 21 needs to be further inspected or replaced. It should be noted that since the probe 21 may not be completely in contact with the contact pad 311, it may cause misjudgment of the detection result, When the electrical detecting device 320 determines that the probe 21 is not conductive with the corresponding contact pad 311, it can also apply a pressure perpendicular to the probe head 20 to the conductive block 330, and measure again. The step of turning on the probe 32, thereby avoiding the occurrence of a false positive.
在本創作的電測方法中,該導電塊330具有一第一表面331和一相對該第一表面331之第二表面332。較佳地,該導電塊330之該第一表面331的平坦度控制在小於4微米。因此,當將該導電塊330壓放在該探針頭20上時,平坦的該第一表面331會與該探針頭20之該複數個探針21接觸,以達到整平該等探針21之針面的功效。此外,該導電塊330還包含一對手把件333,組裝在該第二表面332上,方便使用者握取。 In the electrical measurement method of the present invention, the conductive block 330 has a first surface 331 and a second surface 332 opposite the first surface 331. Preferably, the flatness of the first surface 331 of the conductive block 330 is controlled to be less than 4 micrometers. Therefore, when the conductive block 330 is pressed onto the probe head 20, the flat first surface 331 contacts the plurality of probes 21 of the probe head 20 to level the probes. The effect of the needle of 21. In addition, the conductive block 330 further includes a pair of handle members 333 assembled on the second surface 332 for the user to grasp.
在本創作的電測方法中,該導電塊330具有一對位螺絲334,以及該定位治具340上具有一第一定位點341和一第二定位點342,其中該第一定位點341和該第二定位點342對應於該探針頭20的中心位置。當該導電塊330放置在該探針頭20上時,該導電塊330之該對位螺絲334與該定位治具340之該第一定位點341和該第二定位點342對準,使得該導電塊330會平均地施壓在該探針頭20上。應當注意的是,該第一定位點341和該第二定位點342可為一鎖固件、一凸塊、一孔洞...等,不侷限於此。 In the electrical measurement method of the present invention, the conductive block 330 has a pair of position screws 334, and the positioning fixture 340 has a first positioning point 341 and a second positioning point 342, wherein the first positioning point 341 and The second positioning point 342 corresponds to the center position of the probe head 20. When the conductive block 330 is placed on the probe head 20, the alignment screw 334 of the conductive block 330 is aligned with the first positioning point 341 and the second positioning point 342 of the positioning fixture 340, so that the The conductive block 330 is evenly pressed against the probe head 20. It should be noted that the first positioning point 341 and the second positioning point 342 can be a lock, a bump, a hole, etc., without being limited thereto.
綜上所述,在本創作的電測裝置與電測方法中,藉由在待量測的探針頭上放置一個導電塊以藉由導電塊的重量對該探針頭之複數個探針施加一垂直向下的壓力,以避免習知技術中由於該等探針的針面水平不一致,導致當將探針頭放置在電路板時,部分之探針沒有與對應之接觸墊接觸,使得量測的結果為不導通,進而導致將該探針誤判為不良品。再者,藉由該導電塊做為探針之一端的訊號傳遞媒介,使得只需藉由將電性檢測 儀器之一端與該導電塊接觸,另一端與電路板上之每一探針對應之導電通道接觸,進而避免習知技術中由於將電性檢測儀器之檢測端與探針直接接觸,當施加的角度或力道不當時,容易造成該探針的表面受損或者是造成該探針彎折導致針位偏移。 In summary, in the electrical measuring device and the electrical measuring method of the present invention, a conductive block is placed on the probe head to be measured to apply a plurality of probes to the probe head by the weight of the conductive block. a vertically downward pressure to avoid inconsistencies in the pinhole level of the probes in the prior art, such that when the probe head is placed on the circuit board, part of the probes are not in contact with the corresponding contact pads, such that the amount The result of the measurement is non-conducting, which in turn causes the probe to be misjudged as a defective product. Moreover, by using the conductive block as a signal transmission medium at one end of the probe, it is only required to perform electrical detection One end of the instrument is in contact with the conductive block, and the other end is in contact with the corresponding conductive path of each probe on the circuit board, thereby avoiding the prior art when the detecting end of the electrical detecting instrument is directly in contact with the probe, when applied If the angle or force is not correct, it may cause damage to the surface of the probe or cause the probe to bend and cause the needle position to shift.
雖然本創作已用較佳實施例揭露如上,然其並非用以限定本創作,本創作所屬技術領域中具有通常知識者,在不脫離本創作之精神和範圍內,當可作各種之更動與潤飾,因此本創作之保護範圍當視後附之申請專利範圍所界定者為準。 Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the present invention, and those skilled in the art can make various changes without departing from the spirit and scope of the present invention. Retouching, therefore, the scope of protection of this creation is subject to the definition of the scope of the patent application attached.
30‧‧‧電測裝置 30‧‧‧Electrical measuring device
310‧‧‧電路板 310‧‧‧Circuit board
320‧‧‧電性檢測儀器 320‧‧‧Electrical testing equipment
330‧‧‧導電塊 330‧‧‧Electrical block
311‧‧‧接觸墊 311‧‧‧Contact pads
321‧‧‧第一檢測端 321‧‧‧First detection end
322‧‧‧第二檢測端 322‧‧‧second detection end
331‧‧‧第一表面 331‧‧‧ first surface
332‧‧‧第二表面 332‧‧‧ second surface
333‧‧‧手把件 333‧‧‧Hands
20‧‧‧探針頭 20‧‧‧Probe head
21‧‧‧探針 21‧‧‧ probe
211‧‧‧第一端 211‧‧‧ first end
212‧‧‧第二端 212‧‧‧ second end
F‧‧‧壓力 F‧‧‧ Pressure
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