TW201401334A - 維修系統與基板處理裝置 - Google Patents
維修系統與基板處理裝置 Download PDFInfo
- Publication number
- TW201401334A TW201401334A TW102110589A TW102110589A TW201401334A TW 201401334 A TW201401334 A TW 201401334A TW 102110589 A TW102110589 A TW 102110589A TW 102110589 A TW102110589 A TW 102110589A TW 201401334 A TW201401334 A TW 201401334A
- Authority
- TW
- Taiwan
- Prior art keywords
- living body
- substrate processing
- monitoring target
- maintenance system
- unit
- Prior art date
Links
- 238000012423 maintenance Methods 0.000 title claims abstract description 89
- 238000012545 processing Methods 0.000 title claims abstract description 58
- 239000000758 substrate Substances 0.000 title claims abstract description 53
- 238000012544 monitoring process Methods 0.000 claims description 64
- 230000007274 generation of a signal involved in cell-cell signaling Effects 0.000 abstract description 10
- 230000032258 transport Effects 0.000 description 16
- 238000001514 detection method Methods 0.000 description 11
- 238000012546 transfer Methods 0.000 description 9
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 7
- 230000007246 mechanism Effects 0.000 description 5
- 229910002092 carbon dioxide Inorganic materials 0.000 description 4
- 239000001569 carbon dioxide Substances 0.000 description 4
- 230000036760 body temperature Effects 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000029058 respiratory gaseous exchange Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Classifications
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B9/00—Safety arrangements
- G05B9/02—Safety arrangements electric
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
- B25J19/0066—Means or methods for maintaining or repairing manipulators
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/10—Plc systems
- G05B2219/14—Plc safety
- G05B2219/14007—Plc as standalone for safety control of machine
Landscapes
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Automation & Control Theory (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Quality & Reliability (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Emergency Alarm Devices (AREA)
- Safety Devices In Control Systems (AREA)
- Testing And Monitoring For Control Systems (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012071743A JP2013206962A (ja) | 2012-03-27 | 2012-03-27 | 保守システム及び基板処理装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201401334A true TW201401334A (zh) | 2014-01-01 |
Family
ID=49259864
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102110589A TW201401334A (zh) | 2012-03-27 | 2013-03-26 | 維修系統與基板處理裝置 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20150012124A1 (enExample) |
| JP (1) | JP2013206962A (enExample) |
| KR (1) | KR20140138768A (enExample) |
| TW (1) | TW201401334A (enExample) |
| WO (1) | WO2013146611A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111372735A (zh) * | 2017-11-17 | 2020-07-03 | 三菱电机株式会社 | 3维空间监视装置、3维空间监视方法及3维空间监视程序 |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6026362B2 (ja) * | 2013-07-09 | 2016-11-16 | 東京エレクトロン株式会社 | 基板処理システム、基板処理システムの制御方法、及び記憶媒体 |
| US9918180B2 (en) * | 2014-04-28 | 2018-03-13 | Johnson Controls Technology Company | Systems and methods for detecting and using occupant location in a building management system |
| JP6865079B2 (ja) * | 2017-03-23 | 2021-04-28 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理方法 |
| JP6625597B2 (ja) * | 2017-11-13 | 2019-12-25 | 平田機工株式会社 | 搬送チャンバ |
| KR102045826B1 (ko) * | 2018-04-27 | 2019-11-18 | 주식회사 선익시스템 | 진공챔버용 비상 스위치 장치와 이를 포함하는 증착장치 |
| KR102150450B1 (ko) * | 2018-05-11 | 2020-09-01 | 주식회사 선익시스템 | 비상 탈출이 가능한 진공챔버 및 이를 포함하는 증착장치 |
| KR102259282B1 (ko) * | 2019-07-18 | 2021-06-01 | 세메스 주식회사 | 물류 저장 시스템 및 그 제어 방법 |
| JP7388896B2 (ja) * | 2019-12-04 | 2023-11-29 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理装置 |
| CN114162450B (zh) | 2020-09-11 | 2023-05-23 | 长鑫存储技术有限公司 | 曝光机台的门板密闭监测系统、方法、装置、介质和设备 |
| KR102378366B1 (ko) * | 2020-10-13 | 2022-03-25 | 주식회사 새한산업 | 안전펜스설비 |
| CN118241174B (zh) * | 2024-05-27 | 2024-08-06 | 上海米蜂激光科技有限公司 | 一种真空镀膜机安全控制方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4101166B2 (ja) * | 2003-12-11 | 2008-06-18 | 大日本スクリーン製造株式会社 | 基板処理装置 |
| JP5415832B2 (ja) * | 2009-05-29 | 2014-02-12 | 株式会社竹中工務店 | 入退管理システム |
| JP5531003B2 (ja) * | 2009-10-05 | 2014-06-25 | 株式会社日立国際電気 | 基板処理装置、基板処理装置のメンテナンス方法および半導体装置の製造方法 |
-
2012
- 2012-03-27 JP JP2012071743A patent/JP2013206962A/ja not_active Withdrawn
-
2013
- 2013-03-22 KR KR20147026644A patent/KR20140138768A/ko not_active Withdrawn
- 2013-03-22 WO PCT/JP2013/058375 patent/WO2013146611A1/ja not_active Ceased
- 2013-03-26 TW TW102110589A patent/TW201401334A/zh unknown
-
2014
- 2014-09-24 US US14/495,353 patent/US20150012124A1/en not_active Abandoned
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111372735A (zh) * | 2017-11-17 | 2020-07-03 | 三菱电机株式会社 | 3维空间监视装置、3维空间监视方法及3维空间监视程序 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20140138768A (ko) | 2014-12-04 |
| WO2013146611A1 (ja) | 2013-10-03 |
| JP2013206962A (ja) | 2013-10-07 |
| US20150012124A1 (en) | 2015-01-08 |
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