TW201349588A - Led package and led light-emitting element - Google Patents

Led package and led light-emitting element

Info

Publication number
TW201349588A
TW201349588A TW102112406A TW102112406A TW201349588A TW 201349588 A TW201349588 A TW 201349588A TW 102112406 A TW102112406 A TW 102112406A TW 102112406 A TW102112406 A TW 102112406A TW 201349588 A TW201349588 A TW 201349588A
Authority
TW
Taiwan
Prior art keywords
led
emitting element
package
reflection surface
led light
Prior art date
Application number
TW102112406A
Other languages
English (en)
Inventor
Yosuke Morita
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp filed Critical Panasonic Corp
Publication of TW201349588A publication Critical patent/TW201349588A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
TW102112406A 2012-04-24 2013-04-08 Led package and led light-emitting element TW201349588A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012099082A JP2013229395A (ja) 2012-04-24 2012-04-24 Ｌｅｄパッケージおよびｌｅｄ発光素子

Publications (1)

Publication Number Publication Date
TW201349588A true TW201349588A (en) 2013-12-01

Family

ID=49482638

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102112406A TW201349588A (en) 2012-04-24 2013-04-08 Led package and led light-emitting element

Country Status (3)

Country Link
JP (1) JP2013229395A (zh)
TW (1) TW201349588A (zh)
WO (1) WO2013161295A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6887255B2 (ja) * 2017-01-13 2021-06-16 シチズン電子株式会社 発光装置及び発光装置を用いた撮像装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0639464Y2 (ja) * 1988-05-13 1994-10-12 シャープ株式会社 発光ダイオード
JP2739269B2 (ja) * 1992-07-29 1998-04-15 三菱電線工業株式会社 表示装置の製造方法
JPH10335709A (ja) * 1997-05-29 1998-12-18 Yazaki Corp 発光ダイオードチップのランプハウス
JP2003303998A (ja) * 2002-04-02 2003-10-24 Korai Kagi Kofun Yugenkoshi 視覚均一度を高めた発光ダイオード
JP3999780B2 (ja) * 2004-11-16 2007-10-31 日電精密工業株式会社 リードフレームの製造方法
JP2007184319A (ja) * 2006-01-04 2007-07-19 Showa Denko Kk 半導体発光装置

Also Published As

Publication number Publication date
JP2013229395A (ja) 2013-11-07
WO2013161295A1 (ja) 2013-10-31

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