TW201349256A - Conductive paste, laminated ceramic electronic component and method for manufacturing laminated ceramic electronic component - Google Patents

Abstract

Provided is a conductive paste which has good printability, shows a high filling ratio of a conductive metal powder in a conductive paste film after printing, and, after baking, enables the formation of a conductor film (an internal electrode) that has high flatness and high continuity and leaves little residue. Also provided is a highly reliable laminated ceramic electronic component provided with an internal electrode that is formed using the conductive paste. The conductive paste comprises a conductive metal powder, an organic solvent and an acrylic resin, wherein the average particle size of the conductive metal powder is 50-200 nm, the weight-average molecular weight of the acrylic resin is 160,000-1,000,000 and the content of the acrylic resin is within a range of 20-200 vol% relative to the metal powder. The conductive paste further comprises a ceramic powder the average particle diameter of which is preferably 5-100 nm. As the conductive metal powder, at least one kind of powder selected from the group consisting of copper, nickel, silver and palladium or a powder of an alloy that comprises at least one kind of metal selected from the aforesaid group is used.

Description

Conductive paste, laminated ceramic electronic component, and manufacturing method of the laminated ceramic electronic component

The present invention relates to a conductive paste and a laminated ceramic electronic component using the same, and more particularly to a conductive paste suitable for use in the manufacture of laminated ceramic electronic parts, laminated ceramic electronic parts manufactured using the same, and A method of manufacturing the laminated ceramic electronic component.

As one of the representative ceramic electronic components, for example, a multilayer ceramic capacitor having the structure shown in Fig. 1 is provided.

As shown in FIG. 1, the multilayer ceramic capacitor has a configuration in which two end faces 4a, 4b of a multilayer ceramic capacitor element 1 in which a plurality of internal electrodes 2 (2a, 2b) are laminated via a ceramic layer 3 as a dielectric layer are used. The external electrodes 5 (5a, 5b) are disposed to be electrically connected to the internal electrodes 2 (2a, 2b).

Here, the above laminated ceramic capacitor is usually manufactured through the following series of steps:

(a) a step of preparing a green sheet having an internal electrode pattern and a green sheet not having an internal electrode pattern, wherein the green sheet on which the internal electrode pattern is formed is obtained by kneading an organic medium containing an organic binder and a solvent, and conducting A conductive paste made of a metallic powder is printed on the surface to form an internal electrode pattern.

(b) A step of forming a laminate in which a green sheet having an internal electrode pattern and a green sheet not having an internal electrode pattern are laminated in a specific order.

(c) A step of dividing the layered body formed in the above (b) into individual elements (unfired multilayer ceramic capacitor elements) for a multilayer ceramic capacitor.

(d) a step of subjecting the uncalcined laminated ceramic capacitor element to heat treatment at a specific temperature and de-bonding, followed by calcination.

(e) a step of forming an external electrode on the laminated ceramic capacitor element after calcination.

In addition, in the field of laminated ceramic capacitors, thinning and multilayering of ceramic layers or internal electrodes have been progressing in recent years due to miniaturization and high performance of electronic components.

In addition, the conductive paste used for the formation of the internal electrode is required to have good printability and a high smoothness of the coating film, and a thick film electrode (conductor film) having low residue and high filling property can be formed, that is, it is required to be used. The internal electrode formed of the conductive paste can achieve compactness, high reliability, high coverage of a thin layer, and the like.

In this case, as the conductive paste for forming a conductor film such as an internal electrode, a conductive metal powder having an average particle diameter of 0.2 μm or less, a ceramic powder having an average particle diameter of not more than the conductive metal powder, and an organic material are disclosed. Conductive paste of a vehicle (refer to Patent Document 1).

Further, according to Patent Document 1, it is pointed out that it is possible to provide a conductive paste suitable for forming an internal electrode (conductor film) having high surface smoothness and high coverage. As an embodiment, ethyl cellulose is exemplified. A conductive paste constituting a binder resin of an organic vehicle.

Further, as another conductive paste, there is disclosed a conductive paste for gravure printing containing a conductive powder, a binder resin, and an additive. The binder resin has an acid value of 3 to 15 mgKOH/g and a weight average molecular weight Mw of 50,000. ~150000 acrylic resin having a carboxyl group (see Patent Document 2).

Further, according to Patent Document 2, it is pointed out that a conductive paste having a viscosity most suitable for gravure printing can be provided, and as an embodiment, nickel having an average particle diameter of 0.3 μm is exemplified. Conductive paste of powder and acrylic resin.

However, when ethyl cellulose is used as the binder resin as in the conductive paste disclosed in Patent Document 1, there is a problem that the thermal decomposition property is low, and the conductive paste is used to form the internal electrode laminated body. Residual carbon residue, in the case of structural defects, reliability may not be sufficient.

Further, when a nickel powder having an average particle diameter of 0.3 μm is used as the conductive metal powder as in the conductive paste disclosed in Patent Document 2, the surface roughness of the printed coating film is coarse, and it is reliable when the laminated body is formed. The problem of reduced sexuality.

Therefore, in order to solve such problems, it is conceivable to use a metal powder having an average particle diameter of 0.2 μm or less and an acrylic resin to produce a conductive paste. However, when a metal powder of 0.2 μm or less is used, the structural viscosity is increased, and a usual adhesive is used. The amount of resin cannot provide a problem of good printability.

Moreover, if the amount of the binder resin is increased in order to ensure printability, there is a problem that the metal filling ratio of the coating film is lowered and the continuity of the coating film is lowered.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2003-115416

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2006-244845

The present invention has been made in view of the above problems, and an object of the invention is to provide a conductive paste, a laminated ceramic electronic component having a low structural defect and a high coverage of an internal electrode, and a laminated ceramic electronic component. In the method for producing a part, the conductive paste has good printability, and the conductive metal powder in the conductive paste film after printing has high filling property, and after firing, a conductor film having excellent smoothness and continuity and having less residue can be formed. (internal electrode).

In order to solve the above problems, the conductive paste of the present invention is characterized by comprising a conductive metal powder, an organic solvent, and an acrylic resin, wherein the conductive metal powder has an average particle diameter of 50 to 200 nm, and the acrylic acid The weight average molecular weight of the resin is in the range of 160,000 to 1,000,000, and the content of the acrylic resin is in the range of 20 to 200% by volume based on 100% by volume of the metal powder.

Further, the average particle diameter of the conductive metal powder is determined by image analysis based on an SEM (Scanning Electron Microscope) image of the powder, and an average value of 100 particles is obtained as an average particle diameter. .

Further, the weight average molecular weight of the acrylic resin is a value measured by gel permeation chromatography.

In the conductive paste of the present invention, the average particle diameter of the conductive metal powder is in the range of 50 to 200 nm. When the average particle diameter of the conductive metal powder is less than 50 nm, the cohesiveness is high and it is difficult to be good. Since the sinterability is high, the sintered film having high continuity cannot be obtained due to spheroidization, and if it exceeds 200 nm, the surface roughness of the coating film becomes coarse, and the thickness of the ceramic layer is thin. Reliability is reduced in the field.

In addition, the content ratio (addition amount) of the acrylic resin is in the range of 20 to 200% by volume based on 100% by volume of the metal powder, because the amount of the acrylic resin added is less than 20% by volume. When the conductive paste is not stable in rheology, the printability is lowered. When the amount is more than 200% by volume, the amount of the acrylic resin in the coating film is too large, and the filling property of the metal powder is lowered, so that it is difficult to obtain a continuous sintered film.

In addition, the weight average molecular weight of the acrylic resin is in the range of 160,000 to 1,000,000 because the molecular weight of the acrylic resin is less than 160,000, and the structural viscosity due to the use of the fine particle powder as the conductive metal powder becomes high. Can't get good The printing property is good, and if it exceeds 1,000,000, the fluidity of the conductive paste is lowered, and good printability cannot be obtained.

Moreover, it is preferable that the electrically conductive paste of this invention contains ceramic powder further.

When the conductive paste is applied to a ceramic substrate (ceramic green sheet or the like) to form an electrode pattern and is fired, the sintering of the conductive metal powder can be suppressed, and the film thickness after calcination can be obtained. A thinner, denser, and more continuous conductor film (electrode).

Further, the conductive metal powder is preferably at least one powder selected from the group consisting of copper, nickel, silver, and palladium, or a powder containing at least one alloy selected from the group.

When copper, nickel, silver or palladium is used as the conductive metal powder, when the conductive paste is applied onto a ceramic substrate (ceramic green sheet or the like) to form an electrode pattern and is fired, the electrode material can be prevented from being diffused. A conductor film (electrode) having a thin film thickness and high continuity can be obtained by a ceramic element, and the present invention can further exert practical effects.

Further, the average particle diameter of the ceramic powder is preferably in the range of 5 to 100 nm.

By setting the average particle diameter of the ceramic powder to a range of 5 to 100 nm, for example, when a coating film is formed on a ceramic member and calcined, excessive sintering of the conductive metal powder can be suppressed, and the film thickness after calcination can be obtained. The conductor film (electrode) which is thin and has higher continuity can further exert the practical effect of the present invention.

Further, the average particle diameter of the above ceramic powder is calculated from the specific surface area by the BET (Brunauer-Emmett-Teller) method.

Further, as the ceramic powder, a powder having a composite oxide having a perovskite structure represented by the general formula: ABO ₃ is preferably used.

By using a powder of a composite oxide having a perovskite structure represented by the general formula: ABO ₃ as a ceramic powder, for example, when the conductive paste of the present invention is used for forming an internal electrode of a laminated ceramic capacitor, it can be used. The conductive paste containing the same type of ceramic powder as the ceramic material constituting the ceramic layer functioning as the dielectric layer can suppress the characteristics of the ceramic layer and the laminated ceramic when the internal electrode pattern is formed by firing the internal electrode pattern. Capacitor components cause undesirable effects.

Further, the internal electrode forming paste of the multilayer ceramic electronic component of the present invention is characterized in that a laminated ceramic electronic body having a structure including a plurality of ceramic layers and a plurality of internal electrodes and having the internal electrodes passed through the ceramic laminated layer is manufactured. When the part is used, it is used to form the above internal electrode.

By using the conductive paste of the present invention for forming the internal electrodes of the laminated ceramic electronic component, it is possible to obtain a laminated ceramic electronic component having high characteristics and high reliability of the internal electrode which is excellent in smoothness, continuity, and few residues.

Further, the multilayer ceramic electronic component of the present invention is characterized in that it has a structure including a plurality of ceramic layers and a plurality of internal electrodes, and the internal electrodes are laminated via the ceramic layers, and the internal electrodes are used in the above-described present invention. It is formed by a conductive paste.

Moreover, the method for producing a multilayer ceramic electronic component according to the present invention includes a method of manufacturing a laminated ceramic electronic component including a plurality of ceramic layers and a plurality of internal electrodes, and the internal electrode is laminated via the ceramic layer And comprising: a step of forming an uncalcined laminated body having a structure comprising: a ceramic green sheet which is obtained as the ceramic layer after firing, and formed by printing the conductive paste of the present invention and calcined to become the inner portion An internal electrode pattern of the electrode, wherein the internal electrode pattern is laminated via the ceramic green sheet; and a step of firing the unfired laminate.

In the invention of the conductive paste of the present invention, the conductive metal powder, the organic solvent, and the acrylic resin are contained, and the average particle diameter of the conductive metal powder is 50 to 200 nm, and the weight average molecular weight of the acrylic resin is 160,000. 1000000, and Since the content ratio of the acrylic resin is in the range of 20 to 200% by volume based on 100% by volume of the metal powder, it is possible to provide a conductive paste which is excellent in printability and which is electrically conductive in a conductive paste formed by printing. The metal powder has a high filling property, and by firing, a conductor film (internal electrode) having excellent smoothness, excellent continuity, and less residue can be formed.

In other words, by satisfying the requirements of the present invention, it is possible to achieve good printability and high filling property in the use of the metal powder of the fine particles and the conductive paste of the acrylic resin, and it is excellent in smoothness and continuity. And a conductor film with less residue.

As a result, the laminated body in which the internal electrode is formed by using the conductive paste of the present invention can improve the characteristics by including the internal electrode having high reliability, low defect rate, and high coverage of the thin layer.

In addition, the multilayer ceramic electronic component of the present invention including the internal electrode formed using the conductive paste of the present invention can be provided with a desired internal electrode system which is excellent in smoothness and continuity and has a small amount of residual conductor film. High-performance laminated ceramic electronic parts with characteristics.

Further, in the method for producing a multilayer ceramic electronic component of the present invention, the conductive paste of the present invention is used to form an internal electrode pattern on a ceramic green sheet and calcined thereby forming an internal electrode, thereby forming a desired shape. The internal electrodes, which are excellent in size, smoothness, and continuity, and have a small amount of residue, can reliably produce a multilayer ceramic electronic component having high reliability and having desired characteristics.

1‧‧‧Multilayer ceramic capacitor components

2 (2a, 2b) ‧ ‧ internal electrodes

3‧‧‧Ceramic layer

4a, 4b‧‧‧ end faces of laminated ceramic capacitor components

5 (5a, 5b) ‧ ‧ external electrodes

Fig. 1 is a cross-sectional view showing the structure of a multilayer ceramic capacitor in which an internal electrode is formed using the conductive paste of the present invention.

Hereinafter, embodiments of the present invention will be described, and features which are characteristic of the present invention will be described in further detail.

[Embodiment 1] <Preparation for preparing raw materials for conductive paste>

The conductive paste for the conditions shown in Table 1, that is, the conductive paste of sample Nos. 1 to 8 (Example) having the requirements of the present invention, and the sample number not having the requirements of the present invention In the conductive paste of 9 to 14 (Comparative Example), conductive metal powder, ceramic powder, acrylic resin, and solvent were prepared as the raw materials constituting the conductive paste (see Table 1).

(1) Conductive metal powder

The conductive metal powder was prepared as shown in Table 1: a) copper (Cu) having an average particle diameter of 40 nm, 50 nm, 150 nm, 180 nm, 200 nm, and 210 nm, and b) nickel having an average particle diameter of 200 nm (Ni) ), c) silver (Ag) having an average particle diameter of 150 nm, and d) palladium (Pd) having an average particle diameter of 150 nm.

The average particle diameter of the conductive metal powder in the present invention ranges from 50 to 200 nm.

The conductive metal powder was blended in a ratio of 6.5% by volume in the conductive paste in each of the samples of Table 1.

In addition, the average particle diameter of the conductive metal powder was calculated from image analysis based on the SEM image of the powder, and the average value of 100 particles was determined as the average particle diameter.

(2) Ceramic powder

As the ceramic powder, a) a calcium zirconate (CaZrO ₃ ) powder having an average particle diameter of 5 nm, 50 nm, and 100 nm, and b) barium titanate (BaTiO ₃ ) powder having an average particle diameter of 50 nm were prepared.

Further, the average particle diameter of the ceramic powder is a value obtained by a BET method.

(3) Acrylic resin

As an acrylic resin, a weight average molecular weight of 150,000 to 1,200,000 is prepared. Six different acrylic resins (molecular weights of 150,000, 160,000, 200,000, 800,000, 1,000,000, and 1,200,000) in the range.

The weight average molecular weight of the acrylic resin in the present invention ranges from 1,600,000 to 1,000,000.

Further, the weight average molecular weight of the acrylic resin is a value measured by gel permeation chromatography.

(4) Solvent

As a solvent, dihydroterpineol was prepared. Further, each of the samples in Table 1 used dihydroterpineol as a solvent.

However, as a solvent, diethyl ether, dipropyl ether, diisopropyl ether, anisole, phenethyl ether, benzyl ethyl ether, diphenyl ether, dibenzyl ether, and the like may also be used. Alkane, tetrahydrofuran, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, acetal, acetone, methyl ethyl ketone, methyl propyl ketone, methyl butyl ketone, methyl amyl ketone, diethyl ketone , methyl isobutyl ketone, diisobutyl ketone, acetonyl acetone, isophorone, cyclohexanone, methylcyclohexanone, acetophenone, camphor, methyl acetate, ethyl acetate, n-propyl acetate , butyl acetate, hexyl acetate, heptyl acetate, octyl acetate, dodecyl acetate, isopropyl acetate, isobutyl acetate, 2-ethylhexyl acetate, cyclohexyl acetate, benzyl acetate , methyl propionate, ethyl propionate, butyl propionate, butyl butyrate, butyl stearate, butyl benzoate, benzyl benzoate, ethylene glycol monoacetate, ethylene glycol diacetate , monoacetin, diacetin, triacetin, dihydroerythritol acetate, hexane, octane, dodecane, toluene, xylene, cyclohexane, methylcyclohexane, alpha - terpene, D-limonene, and the like.

<Production of conductive paste>

According to the method described below, each raw material was prepared in the following range, pre-mixed by a planetary mixer, and then dispersed by a three-roll mill to prepare a conductive paste.

(1) Conductive metal powder (powder of any one of copper, nickel, silver, and palladium): 6.5% by volume

(2) Ceramic powder (CaZrO ₃ or BaTiO ₃ ): 0 or 1% by volume

(3) Solvent (dihydroterpineol): 79.0~92.2 vol%

(4) Acrylic resin having a weight average molecular weight of 150,000 to 1,200,000: 1.0 to 14.5 vol%

The sample (conductive paste) of the sample No. 1 of Table 1 is a sample of the embodiment of the present invention, which is formulated with a copper powder having an average particle diameter of 200 nm of 6.5% by volume, dihydroterpineol of 84.5 % by volume, and weight. The acrylic resin having an average molecular weight of 160,000 was 9.0% by volume, and the ceramic powder was not formulated.

The sample (conductive paste) of the sample No. 2 of Table 1 is a sample of the embodiment of the present invention, which is prepared by mixing 6.5% by volume of copper powder having an average particle diameter of 180 nm, and 8.5% by volume of dihydroterpineol. The acrylic resin having an average molecular weight of 200,000 was 9.0% by volume, and calcium zirconate having an average particle diameter of 100 nm was prepared as a ceramic powder in a ratio of 1% by volume.

The sample (conductive paste) of the sample Nos. 3 to 8 in Table 1 is a sample of the embodiment of the present invention, which is a type of the conductive metal powder and its particle diameter, the type of the ceramic powder, and the particles thereof. The diameter, the weight average molecular weight of the acrylic resin, the amount of addition thereof, and the like were prepared as shown in Table 1.

Further, the sample (conductive paste) of the sample Nos. 9 to 14 in Table 1 is a sample of a comparative example which does not have the requirements of the present invention, and the sample is a type of the conductive metal powder and its particle diameter, The combination of the kind of the ceramic powder, the particle diameter thereof, the weight average molecular weight of the acrylic resin, and the added amount thereof were prepared as shown in Table 1.

<Production of laminated ceramic electronic parts (multilayer ceramic capacitors)>

A laminated ceramic electronic component (multilayer ceramic capacitor) was produced by the method described below using the conductive pastes of the sample Nos. 1 to 14 described above.

(1) Production of ceramic green sheets

First, a polyvinyl butyral-based binder and an organic solvent such as ethanol are added to a reduction-resistant dielectric ceramic raw material powder containing calcium zirconate having an average particle diameter of 100 to 500 nm as a main component, and wet-mixed by a ball mill. A ceramic slurry was obtained.

Then, the ceramic slurry was formed into a sheet shape by a doctor blade method so that the thickness after firing was 2 μm, and a ceramic green sheet was produced.

(2) Printing of conductive paste

Next, the conductive paste was screen-printed on the ceramic green sheet produced as described above to form a conductive paste (internal electrode pattern) which was an internal electrode after firing.

Then, based on the shape of the printed pattern when the conductive paste is printed on the ceramic green sheet, the printing quality such as blurring and blooming is determined, and the printability of the conductive paste is evaluated.

In addition, as for the printability of the conductive paste, it is evaluated that the printability is not good (○), the blurring, and the smudge are evaluated as poor printability (×).

The evaluation results of the printability of the conductive paste are collectively shown in Table 1.

Moreover, the conductor filling property (metal filling property) of the coating film was evaluated based on the ratio of the coating thickness of the conductor measured by the fluorescent X-ray film thickness meter to the physical thickness of the actual coating film.

In addition, as for the conductor filling property, it is evaluated that the conductor coating thickness is 31% or more of the physical thickness, and the conductor filling property is good (○), and the conductor filling property is not good (×).

The evaluation results of the conductor filling properties are collectively shown in Table 1.

(3) Lamination of ceramic green sheets

When a ceramic green sheet (ceramic green sheet having an internal electrode pattern) printed with a conductive paste is produced as described above, in this embodiment, the printed conductive paste (internal electrode pattern) is irradiated with fluorescent X-rays. The conductive paste was printed by setting the printing conditions so that the thickness measured by the film thickness meter was 0.6 μm, thereby forming a conductive paste film (internal electrode pattern) on the surface of the ceramic green sheet.

Then, a plurality of ceramic green sheets including ceramic green sheets on which a conductive paste film (internal electrode pattern) is formed are laminated in a specific order, and hot pressed and integrated to form a hot press block.

Thereafter, the hot compact is cut into a specific size, thereby obtaining a green layer body (uncalcined) Burned layer).

(4) Calcination

Next, the uncalcined laminate is heated to 200-300 ° C in a nitrogen atmosphere to decompose the binder, and the highest calcination temperature is 1200-1300 in a reducing environment containing H ₂ -N ₂ -H ₂ O gas. Calcination was carried out at ° C to obtain a sintered body (sintered laminate).

(5) Formation of external electrodes

Then, a conductive paste containing copper as a conductive component is applied onto the exposed surface (both end faces) of the inner conductor of the sintered laminated body, and is baked at a temperature of 600 to 800 ° C in a nitrogen atmosphere, thereby forming and internal An external electrode electrically connected to the electrode (internal conductor film).

As shown in FIG. 1, the multilayer ceramic capacitor produced in this embodiment has a structure in which two of the multilayer ceramic capacitor elements 1 in which a plurality of internal electrodes 2 (2a, 2b) are laminated via a ceramic layer 3 as a dielectric layer are used. External electrodes 5 (5a, 5b) are disposed on the end faces 4a, 4b so as to be electrically connected to the internal electrodes 2 (2a, 2b).

<Evaluation of Reliability of Multilayer Ceramic Capacitors>

The reliability (wafer reliability) of the multilayer ceramic capacitor manufactured as described above was evaluated.

Specifically, the reliability of the wafer is evaluated by measuring the insulation resistance, and the resistance value after 1 minute from the application of the DC voltage of the rated voltage is the insulation resistance, and the ratio of the wafer having the insulation resistance of 100 kΩ or less is less than 1 The % was evaluated as having good reliability (○), and 1% or more was evaluated as poor reliability (×).

The evaluation results are summarized in Table 1.

Among them, the multilayer ceramic capacitors of Sample Nos. 10 to 13 (Comparative Example) were incapable of being processed into a good wafer because of poor printability, and reliability could not be evaluated. Therefore, it is indicated as (-) in Table 1.

As shown in Table 1, when the average particle diameter of the conductive metal powder is less than 50 nm and the sample of sample No. 13 (Comparative Example) which does not have the requirements of the present invention, the aggregation of the conductive metal powder can be confirmed. The film is high in dispersibility, and the printability and the conductor filling property are insufficient. On the other hand, since the sinterability is high, spheroidization occurs, and it is difficult to obtain a sintered film (conductor film) having high continuity.

In the case of the sample of sample No. 14 (comparative example) in which the average particle diameter of the conductive metal powder is more than 200 nm and does not have the requirements of the present invention, it is confirmed that the printability and the conductor filling property are good, but the coating is good. The surface roughness of the film is coarse, and the reliability of the wafer is lowered in the field where the thickness of the ceramic layer as the substrate layer is thin.

In addition, when the amount of the acrylic resin added is 15.4% by volume based on the metal powder and is less than the range of the present invention (20 to 200% by volume), the sample No. 12 (Comparative Example) can be confirmed as The paste cannot obtain stable rheology, the printability is lowered, and the conductor filling property is also insufficient.

In the case of the sample of sample No. 9 (comparative example) in which the amount of the acrylic resin added is 223.1% by volume based on the metal powder and exceeds the range of the present invention (20 to 200% by volume), it can be confirmed that The paste can obtain stable rheology, but the conductor filling property becomes insufficient, the electrode is spheroidized by calcination, and the reliability of the wafer is lowered.

Further, in the case of samples of sample No. 9 (comparative example) and 10 (comparative example) in which the average molecular weight of the acrylic resin is 150,000 and lower than the range of the present invention (160000 to 1,000,000), the amount of resin added is small. In sample No. 10, the structural viscosity due to the fine particle powder became high, and good printability could not be obtained. Further, in sample No. 9 (comparative example) in which the amount of resin added was increased in order to ensure printability, the conductor filling property was lowered, and the result of wafer reliability was not satisfactory.

Further, Sample No. 11 (Comparative Example) in which the average molecular weight of the acrylic resin was 1,200,000 and exceeded the range of the present invention (16,000 to 1,000,000), and Sample No. 12 (Comparative Example) in which the amount of addition was less than the range of the present invention In the case of a sample, it can be confirmed that the fluidity of the paste is lowered. Good printability is not available.

On the other hand, as shown in Table 1, it is possible to confirm the particle diameter (average particle diameter) of the conductive metal powder constituting the conductive paste in the conductive paste using the conductive metal powder of the fine particles and the conductive paste of the acrylic resin, and the acrylic resin. The conductive pastes of Sample Nos. 1 to 8 (Examples) having an average molecular weight and an amount of addition satisfying the requirements of the present invention have both good printability and high conductor filling properties.

In addition, it was confirmed that the conductive paste containing sample Nos. 1 to 8 (Example) can be used to obtain a small-sized, high-performance internal electrode including a thin layer, high continuity, high smoothness, and low residue. And a multilayer ceramic capacitor (layered ceramic electronic parts) with high wafer reliability.

Further, in the conductive paste which satisfies the requirements of the present invention, the conductive paste of sample Nos. 2, 3, 5, and 6 in which the ceramic powder is blended is applied to the ceramic substrate in the conductive paste. When the electrode pattern is formed on the ceramic green sheet and calcined, it is confirmed that the sintering of the conductive metal powder is suppressed, and a conductor film having a thinner, denser, and higher continuity after firing can be obtained (internal electrode) ).

According to the above embodiment, it is understood that a multilayer ceramic capacitor having a small size, high performance, and high reliability can be obtained by forming the internal electrode using the conductive paste of the present invention.

In the above embodiment, the case where the multilayer ceramic capacitor is produced by using the conductive paste of the present invention has been described as an example. However, the conductive paste of the present invention is not limited to the laminated ceramic capacitor, and may be applied to, for example, a laminated type. LC composite parts, laminated varistor, etc., include various laminated ceramic electronic parts of electrodes inside the ceramic laminate.

Furthermore, the present invention is not limited to the above-described embodiments, and various applications and modifications can be made within the scope of the invention.

1‧‧‧Multilayer ceramic capacitor components

2 (2a, 2b) ‧ ‧ internal electrodes

3‧‧‧Ceramic layer

4a, 4b‧‧‧ end faces of laminated ceramic capacitor components

5 (5a, 5b) ‧ ‧ external electrodes

Claims (12)

A conductive paste comprising a conductive metal powder, an organic solvent, and an acrylic resin, wherein an average particle diameter of the conductive metal powder is in a range of 50 to 200 nm, and a weight average molecular weight of the acrylic resin is 160,000. In the range of ~1000000, the content of the acrylic resin is in the range of 20 to 200% by volume based on the metal powder. The conductive paste of claim 1, which further contains a ceramic powder. The conductive paste according to claim 1, wherein the conductive metal powder is at least one selected from the group consisting of copper, nickel, silver, and palladium, or an alloy containing at least one selected from the group consisting of powder. The conductive paste according to claim 2, wherein the conductive metal powder is at least one selected from the group consisting of copper, nickel, silver, and palladium, or an alloy containing at least one selected from the group consisting of powder. The conductive paste of claim 2, wherein the ceramic powder has an average particle diameter in the range of 5 to 100 nm. The conductive paste of claim 3, wherein the ceramic powder has an average particle diameter in the range of 5 to 100 nm. The conductive paste of claim 4, wherein the ceramic powder has an average particle diameter in the range of 5 to 100 nm. The conductive paste according to any one of claims 2 to 7, wherein the ceramic powder is a composite oxide having a perovskite structure represented by the general formula: ABO ₃ . The conductive paste according to any one of claims 1 to 7, which is manufactured to have a plurality of ceramic layers and a plurality of internal electrodes, and the internal electrodes are passed through the ceramic layer In the case of a laminated ceramic electronic component having a laminated structure, it is used to form the above-mentioned internal electrode. The conductive paste according to claim 8 which is used for forming the above-mentioned internal electrode when manufacturing a laminated ceramic electronic component having a structure including a plurality of ceramic layers and a plurality of internal electrodes and said internal electrodes are laminated via said ceramic layers . A laminated ceramic electronic component characterized by comprising a plurality of ceramic layers and a plurality of internal electrodes, wherein said internal electrodes are structured by said ceramic layer, and said internal electrodes are used as claimed in claims 1 to 10 Formed by any of the conductive pastes. A method for producing a laminated ceramic electronic component, comprising: a method of manufacturing a laminated ceramic electronic component including a plurality of ceramic layers, a plurality of internal electrodes, and a structure in which the internal electrodes are passed through the ceramic laminated layer, and includes a step of forming an uncalcined laminate having a structure comprising: a ceramic green sheet which is obtained as the ceramic layer after calcination, and formed by printing a conductive paste according to any one of claims 1 to 10 and calcined Thereafter, the internal electrode pattern of the internal electrode is formed, and the internal electrode pattern is laminated via the ceramic green sheet; and the step of firing the unfired laminated body.