JP5967193B2 - Conductive paste and method for producing multilayer ceramic electronic component - Google Patents

Description

The present invention relates to a conductive paste and a method for manufacturing a multilayer ceramic electronic component using the same, and more particularly, to a conductive paste suitable for use in manufacturing a multilayer ceramic electronic component, and to manufacture a multilayer ceramic electronic component using the same. Regarding the method.

One typical ceramic electronic component is, for example, a multilayer ceramic capacitor having a structure as shown in FIG.
As shown in FIG. 1, this multilayer ceramic capacitor is provided on both end faces 4a and 4b of a multilayer ceramic capacitor element 1 in which a plurality of internal electrodes 2 (2a and 2b) are laminated via a ceramic layer 3 which is a dielectric layer. The external electrode 5 (5a, 5b) is disposed so as to be electrically connected to the internal electrode 2 (2a, 2b).

By the way, such a multilayer ceramic capacitor is usually
(a) a green sheet formed with an internal electrode pattern by printing on the surface thereof a conductive paste obtained by kneading an organic vehicle containing an organic binder and a solvent and a conductive metal powder, and the internal electrode pattern A step of preparing a green sheet in which no is formed,
(b) a step of laminating a green sheet on which an internal electrode pattern is formed and a green sheet on which no internal electrode pattern is formed in a predetermined order to form a laminate;
(c) a step of dividing the multilayer body formed in (b) above into individual multilayer ceramic capacitor elements (unfired multilayer ceramic capacitor elements);
(d) a step of firing an unfired multilayer ceramic capacitor element after heat-treating at a predetermined temperature to remove the binder;
(e) Manufactured through a series of processes such as a process of forming external electrodes on the fired multilayer ceramic capacitor element.

  In recent years, ceramic layers and internal electrodes have been made thinner and multilayered in the field of multilayer ceramic capacitors in order to reduce the size and performance of electronic components.

  In addition, the conductive paste used to form the internal electrode also has good printability, high coating film smoothness, and a conductive material capable of forming a thick film electrode (conductor film) with low residue and high filling properties. There is a need for a conductive paste, that is, a conductive paste that can realize denseness, high reliability, thin layer high coverage, and the like in an internal electrode formed using the paste.

  Under such circumstances, as a conductive paste for forming a conductor film such as an internal electrode, a conductive metal powder having an average particle size of 0.2 μm or less and a ceramic powder having an average particle size of the conductive metal powder or less And a conductive paste containing an organic vehicle has been proposed (see Patent Document 1).

  And according to this patent document 1, it is supposed that the conductive paste suitable for forming the internal electrode (conductor film) with high surface smoothness and high coverage can be provided, and as an embodiment An example of a conductive paste using ethyl cellulose as a binder resin constituting an organic vehicle is shown.

  In addition, as another conductive paste, it contains conductive powder, a binder resin and an additive, and the binder resin is an acrylic having a carboxyl group with an acid value of 3 to 15 mgKOH / g and a weight average molecular weight Mw of 50,000 to 150,000. A conductive paste for gravure printing, which is a resin, has been proposed (see Patent Document 2).

  And according to this patent document 2, it is supposed that the conductive paste which has the optimal viscosity for gravure printing can be provided, and nickel powder with an average particle diameter of 0.3 micrometer and acrylic resin are used as embodiment. An example of a conductive paste was shown.

  However, as in the case of the conductive paste disclosed in Patent Document 1, when ethyl cellulose is used as the binder resin, the thermal decomposition is low, and in the laminate in which the internal electrode is formed using this conductive paste, There is a problem that carbon residues are likely to remain, structural defects may occur, and reliability is not always sufficient.

  Moreover, when the nickel powder with an average particle diameter of 0.3 micrometer is used as an electroconductive metal powder like the electroconductive paste currently disclosed by patent document 2, the surface roughness of the printed coating film is coarse, and a laminated body There is a problem that the reliability is lowered when the film is formed.

  Therefore, in order to solve these problems, it is conceivable to prepare a conductive paste using a metal powder having an average particle size of 0.2 μm or less and an acrylic resin. However, there is a problem that good printability cannot be obtained with a normal amount of binder resin.

  Further, when the amount of the binder resin is increased in order to ensure printability, there is a problem that the metal filling rate of the coating film is lowered and the continuity of the coating film is lowered.

JP 2003-115416 A JP 2006-244845 A

The present invention solves the above-mentioned problems, has good printability, high filling property of conductive metal powder in the conductive paste film after printing, excellent smoothness and continuity after firing, and residue A conductive paste capable of forming a small number of conductor films (internal electrodes), and a method for manufacturing a highly reliable multilayer ceramic electronic component using the conductive paste and high coverage internal electrodes using the conductive paste The purpose is to provide.

In order to solve the above problems, the invention of the conductive paste of the present invention is
A conductive paste containing a conductive metal powder, an organic solvent, and an acrylic resin,
The conductive metal powder has an average particle size in the range of 50 to 200 nm;
The acrylic resin has a weight average molecular weight in the range of 160000-200000, and
The acrylic resin content is in the range of 20 to 200% by volume with respect to 100% by volume of the metal powder.

In addition, the average particle diameter of the said conductive metal powder calculates a particle diameter by image analysis from the SEM image of a powder, calculates | requires the average value of 100 particles, and made it an average particle diameter.
The weight average molecular weight of the acrylic resin is a value measured by gel permeation chromatography.

  In the conductive paste of the present invention, the average particle size of the conductive metal powder is in the range of 50 to 200 nm because when the average particle size of the conductive metal powder is less than 50 nm, the cohesiveness increases and the conductive particle powder is good. Dispersion is not only difficult, but also high sinterability makes it impossible to obtain a sintered film with high continuity due to spheroidization, and if it exceeds 200 nm, the surface roughness of the coating becomes rough and ceramic This is because the reliability is lowered in the region where the layer is thin.

  In addition, the acrylic resin content (addition amount) is in the range of 20 to 200% by volume with respect to 100% by volume of the metal powder. When the addition amount of the acrylic resin is less than 20% by volume, the conductive paste is stable. Rheology is not obtained, printability is reduced, and if it exceeds 200% by volume, the amount of acrylic resin in the coating film is excessively increased, the filling property of the metal powder is reduced, and a continuous sintered film is obtained. Because it becomes difficult.

  Moreover, the reason why the weight average molecular weight of the acrylic resin is in the range of 160000 to 200,000 is that when the molecular weight of the acrylic resin is less than 160000, the structural viscosity is increased due to the use of the fine powder as the conductive metal powder. This is because printability is not obtained, and good printability is obtained in the above range.

Moreover, it is preferable that the electrically conductive paste of this invention contains a ceramic powder further.
When ceramic powder is included, conductive paste is applied to a ceramic substrate (ceramic green sheet, etc.) to form an electrode pattern, and when this is fired, sintering of the conductive metal powder is suppressed and fired. It becomes possible to obtain a conductor film (electrode) having a thinner film thickness, a dense film, and high continuity.

The conductive metal powder is preferably at least one powder selected from the group consisting of copper, nickel, silver, and palladium, or an alloy powder containing at least one selected from the above group.
By using copper, nickel, silver, or palladium as the conductive metal powder, a conductive paste is applied to a ceramic substrate (ceramic green sheet, etc.) to form an electrode pattern, which is then fired. It is possible to prevent the material from diffusing into the ceramic element, and to obtain a conductive film (electrode) having a thin film thickness and high continuity, which can make the present invention more effective.

Moreover, it is preferable that the average particle diameter of a ceramic powder exists in the range of 5-100 nm.
By setting the average particle size of the ceramic powder in the range of 5 to 100 nm, for example, when a coating film is formed on the ceramic element and fired, excessive sintering of the conductive metal powder is suppressed and after firing. Thus, it is possible to obtain a conductor film (electrode) having a thinner film thickness and higher continuity, and the present invention can be further effectively realized.
In addition, the average particle diameter of said ceramic powder is the value computed from the specific surface area by BET method.

As the ceramic powder, it is preferable to use a composite oxide powder having a perovskite structure represented by the general formula: ABO ₃ .
By using a powder of a composite oxide having a perovskite structure represented by the general formula: ABO ₃ as the ceramic powder, for example, when the conductive paste of the present invention is used for forming an internal electrode of a multilayer ceramic capacitor, It becomes possible to use a conductive paste containing the same kind of ceramic powder as the ceramic material constituting the ceramic layer that functions as the dielectric layer. When the internal electrode pattern is fired to form the internal electrode, It is possible to suppress an undesirable influence on the characteristics and, consequently, the multilayer ceramic capacitor element.

The internal electrode forming paste of the multilayer ceramic electronic component of the present invention comprises a plurality of ceramic layers and a plurality of internal electrodes, and the multilayer ceramic electronic has a structure in which the internal electrodes are stacked via the ceramic layers. It is characterized in that it is used for forming the internal electrode when manufacturing a component.
By using the above-described conductive paste of the present invention for the formation of internal electrodes of multilayer ceramic electronic components, it has excellent smoothness, continuity, and has few internal residues, and has high characteristics and high reliability. It becomes possible to obtain parts.

In addition, the method for manufacturing the multilayer ceramic electronic component of the present invention includes:
A method for manufacturing a multilayer ceramic electronic component comprising a plurality of ceramic layers and a plurality of internal electrodes, wherein the internal electrodes are stacked via the ceramic layers,
A ceramic green sheet that becomes the ceramic layer after firing and an internal electrode pattern that is formed by printing the conductive paste of the present invention described above and becomes the internal electrode after firing, the internal electrode pattern being the ceramic green Forming an unfired laminate having a structure laminated through sheets;
And firing the green laminate.

The invention of the conductive paste of the present invention includes a conductive metal powder, an organic solvent, and an acrylic resin, an average particle size of the conductive metal powder of 50 to 200 nm, and a weight average molecular weight of the acrylic resin of 160000 to 200000. In addition, since the content of the acrylic resin is in the range of 20 to 200% by volume with respect to 100% by volume of the metal powder, the printability is good and the conductive metal powder in the conductive paste film formed by printing It is possible to provide a conductive paste that can form a conductive film (internal electrode) that has a high filling property, is excellent in smoothness and continuity by firing, and has few residues.
That is, by satisfying the requirements of the present invention, it becomes possible to achieve both good printability and high fillability in the conductive paste using fine metal powder and acrylic resin, and smoothness and continuity can be achieved. It is possible to form a conductor film that is excellent and has few residues.
As a result, the laminate in which the internal electrode is formed using the conductive paste of the present invention can achieve improvement in characteristics by including the internal electrode with high reliability, low defect rate, and thin layer and high coverage.

  Further, in the method for manufacturing a multilayer ceramic electronic component of the present invention, an internal electrode pattern is formed on a ceramic green sheet using the above-described conductive paste of the present invention, and this is fired to form an internal electrode. Therefore, it is possible to form an internal electrode having a desired shape and dimensions, excellent smoothness and continuity, and with less residue, and a highly reliable multilayer ceramic electronic component having desired characteristics. It can be manufactured reliably.

It is sectional drawing which shows the structure of the multilayer ceramic capacitor in which the internal electrode was formed using the electrically conductive paste of this invention.

  Embodiments of the present invention will be described below to describe the features of the present invention in more detail.

[Embodiment 1]
<Preparation of raw material for producing conductive paste>
The conductive paste of the conditions as shown in Table 1, that is, the conductive pastes of Sample Nos. 1 to 8 (Examples) having the requirements of the present invention, and Sample Nos. 9 to 14 (Nos. Of the present invention) In order to produce the conductive paste of Comparative Example, conductive metal powder, ceramic powder, acrylic resin, and solvent under the following conditions were prepared as raw materials constituting the conductive paste (see Table 1).

(1) Conductive metal powder As shown in Table 1, as the conductive metal powder,
a) Copper (Cu) having an average particle size of 40 nm, 50 nm, 150 nm, 180 nm, 200 nm, and 210 nm,
b) Nickel (Ni) having an average particle diameter of 200 nm,
c) Silver (Ag) having an average particle size of 150 nm,
d) Palladium (Pd) with an average particle size of 150 nm
Prepared.
However, the range of the average particle diameter of the conductive metal powder in the present invention is in the range of 50 to 200 nm.

The conductive metal powder was blended in such a ratio that the content in the conductive paste occupies 6.5% by volume in any of the samples in Table 1.
The average particle diameter of the conductive metal powder is obtained by calculating the particle diameter from the SEM image of the powder by image analysis and obtaining the average value of 100 particles to obtain the average particle diameter.

(2) Ceramic powder As ceramic powder,
a) Calcium zirconate (CaZrO ₃ ) powder having an average particle size of 5 nm, 50 nm, and 100 nm,
b) Barium titanate (BaTiO ₃ ) powder having an average particle diameter of 50 nm was prepared.
In addition, the average particle diameter of said ceramic powder is the value calculated | required by BET method.

(3) Acrylic resin As the acrylic resin, six kinds of acrylic resins having different weight average molecular weights in the range of 150,000 to 1200000 (molecular weights of 150,000, 160000, 200000, 800,000, 1000000, 1200000) were prepared.
The weight average molecular weight of the acrylic resin is a value measured by gel permeation chromatography.

(4) Solvent Dihydroterpineol was prepared as a solvent. In each sample in Table 1, dihydroterpineol was used as a solvent.
However, as solvents, diethyl ether, dipropyl ether, diisopropyl ether, anisole, phenetole, benzyl ethyl ether, diphenyl ether, dibenzyl ether, dioxane, tetrahydrofuran, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, acetal, acetone, methyl ethyl ketone, methyl Propyl ketone, methyl butyl ketone, methyl pentyl ketone, diethyl ketone, methyl isobutyl ketone, diisobutyl ketone, acetonyl acetone, isophorone, cyclohexanone, methyl cyclohexanone, acetophenone, camphor, methyl acetate, ethyl acetate, n-propyl acetate, butyl acetate, Hexyl acetate, heptyl acetate, octyl acetate, dodecyl acetate, isopate Pill, isobutyl acetate, 2-ethylhexyl acetate, cyclohexyl acetate, benzyl acetate, methyl propionate, ethyl propionate, butyl propionate, butyl butyrate, butyl stearate, butyl benzoate, benzyl benzoate, ethylene glycol monoacetate, 2 Ethylene acetate, monoacetin, diacetin, triacetin, dihydroterpineol acetate, hexane, octane, dodecane, toluene, xylene, cyclohexane, methylcyclohexane, α-pinene, D limonene and the like can also be used.

<Preparation of conductive paste>
By the method described below, each raw material was blended within the following range, premixed with a planetary mixer, and then dispersed with a three-roll mill to prepare a conductive paste.
(1) Conductive metal powder (copper, nickel, silver, or palladium powder): 6.5% by volume
(2) Ceramic powder (CaZrO ₃ or BaTiO ₃ ): 0 or 1% by volume
(3) Solvent (dihydroterpineol): 79.0 to 92.2% by volume
(4) Acrylic resin having a weight average molecular weight of 150,000 to 1200000: 1.0 to 14.5% by volume

  Sample No. 1 (conductive paste) in Table 1 is a sample according to an example of the present invention, 6.5% by volume of copper powder having an average particle diameter of 200 nm, 84.5% by volume of dihydroterpineol, and a weight average molecular weight of 160000. This is a sample in which 9.0% by volume of acrylic resin is blended, and the ceramic powder is not blended.

  Sample No. 2 (conductive paste) in Table 1 is a sample according to an example of the present invention, 6.5% by volume of copper powder having an average particle diameter of 180 nm, 83.5% by volume of dihydroterpineol, and a weight average molecular weight of 200,000. This sample is a sample in which 9.0% by volume of acrylic resin is blended, and as a ceramic powder, calcium zirconate having an average particle size of 100 nm is blended in a proportion of 1% by volume.

  Sample Nos. 3 and 4 in Table 1 are samples according to the reference examples, and samples Nos. 5 to 8 are samples according to the examples of the present invention. The conductive metal powder type and the particle size thereof, the ceramic powder type and the particle size thereof are used. The sample was prepared with the weight average molecular weight of the acrylic resin and the added amount thereof as shown in Table 1.

  Samples Nos. 9 to 14 (conductive paste) in Table 1 are comparative samples that do not have the requirements of the present invention, and are conductive metal powder species and their particle sizes, ceramic powder species and their particle sizes. Table 1 shows combinations of weight average molecular weight of acrylic resin and addition amount thereof as shown in Table 1.

<Production of multilayer ceramic electronic components (multilayer ceramic capacitors)>
Using the conductive pastes of the above sample numbers 1 to 14, multilayer ceramic electronic components (multilayer ceramic capacitors) were produced by the method described below.

(1) Production of ceramic green sheet First, a ball mill is prepared by adding a polyvinyl butyral binder and an organic solvent such as ethanol to a reduction-resistant dielectric ceramic raw material powder mainly composed of calcium zirconate having an average particle size of 100 to 500 nm. To obtain a ceramic slurry.
Then, the ceramic slurry was formed into a sheet shape by a doctor blade method so that the thickness after firing was 2 μm, and a ceramic green sheet was produced.
(2) Printing of conductive paste Next, the above-mentioned conductive paste is screen-printed on the ceramic green sheet produced as described above, thereby forming a conductive paste film (internal electrode pattern) that becomes an internal electrode after firing. ) Was formed.

Then, print quality such as blurring and blurring was determined from the shape of the printed pattern when the conductive paste was printed on the ceramic green sheet, and the printability of the conductive paste was evaluated.
In addition, regarding the printability of the conductive paste, specifically, those with no blur or blur are evaluated as having good printability (○), and those with blur or blur are poor in printability (×). It was evaluated that.
The evaluation results of the printability of the conductive paste are also shown in Table 1.

Moreover, the conductor filling property (metal filling property) of the coating film was evaluated from the ratio of the conductor coating thickness measured using a fluorescent X-ray film thickness meter and the actual physical thickness of the coating film.
As for the conductor filling property, specifically, the conductor coating thickness occupying 31% or more of the physical thickness is evaluated as having good conductor filling property (◯), and the conductor filling thickness is less than 31%. The conductor filling property was evaluated as poor (x).
The evaluation results of the conductor filling properties are also shown in Table 1.

(3) Lamination of ceramic green sheets In producing a ceramic green sheet (ceramic green sheet having an internal electrode pattern) printed with a conductive paste as described above, in this embodiment, the printed conductive By setting the printing conditions so that the thickness of the paste film (internal electrode pattern) measured by the fluorescent X-ray film thickness meter is 0.6 μm and printing the conductive paste, the conductive paste film ( Internal electrode pattern) was formed.

Then, a plurality of ceramic green sheets including a ceramic green sheet on which a conductive paste film (internal electrode pattern) was formed were laminated in a predetermined order and integrated by hot pressing to produce a hot press block.
Thereafter, this hot press block was cut into a predetermined size to obtain a raw laminate (unfired laminate).

(4) Firing Next, this unfired laminate is heated to 200 to 300 ° C. in a nitrogen atmosphere to decompose the binder, and then in a reducing atmosphere composed of H ₂ —N ₂ —H ₂ O gas. , Firing at a maximum firing temperature of 1200 to 1300 ° C. to obtain a sintered body (sintered laminate).

(5) Formation of external electrode Then, a conductive paste containing copper as a conductive component is applied on the exposed inner conductor surfaces (both end surfaces) of the sintered laminate, and the temperature is 600 to 800 ° C. in a nitrogen atmosphere. By baking, an external electrode electrically connected to the internal electrode (internal conductor film) was formed.

  As shown in FIG. 1, the multilayer ceramic capacitor manufactured in this embodiment has both ends of a multilayer ceramic capacitor element 1 in which a plurality of internal electrodes 2 (2a, 2b) are stacked via a ceramic layer 3 that is a dielectric layer. The external electrodes 5 (5a, 5b) are arranged on the surfaces 4a, 4b so as to be electrically connected to the internal electrodes 2 (2a, 2b).

<Evaluation of the reliability of multilayer ceramic capacitors>
The multilayer ceramic capacitor produced as described above was evaluated for reliability (chip reliability).
The chip reliability is specifically evaluated by measuring the insulation resistance. The resistance value after 1 minute when the rated DC voltage is applied is defined as the insulation resistance, and the insulation resistance is 100 kΩ or less. A chip having a chip ratio of less than 1% was evaluated as having good reliability (◯), and a chip having a chip ratio of 1% or more was evaluated as having poor reliability (×).
The evaluation results are also shown in Table 1.

  However, since the multilayer ceramic capacitors of Sample Nos. 10 to 13 (Comparative Example) have poor printability and could not be processed into good chips and the reliability could not be evaluated, it was set to (−) in Table 1. .

  As shown in Table 1, in the case of the sample No. 13 (Comparative Example) in which the average particle size of the conductive metal powder is less than 50 nm and does not satisfy the requirements of the present invention, the conductive metal powder has high cohesiveness, Dispersion is difficult and printability and conductor filling properties are insufficient, while sinterability is high, resulting in spheroidization and difficulty in obtaining a sintered film (conductor film) with high continuity. confirmed.

  Moreover, in the case of the sample of sample number 14 (comparative example) in which the average particle diameter of the conductive metal powder exceeds 200 nm and does not satisfy the requirements of the present invention, the printability and the conductor filling property were good. It was confirmed that the chip reliability was lowered in a region where the surface roughness of the ceramic layer was rough and the thickness of the ceramic layer as the base material layer was thin.

  In addition, in the case of the sample No. 12 (comparative example) in which the amount of the acrylic resin added is 15.4% by volume with respect to the metal powder and falls below the range of the present invention (20 to 200% by volume), the paste is stable. It was confirmed that the rheology was not obtained, the printability was lowered, and the conductor filling property was insufficient.

  In addition, in the case of the sample No. 9 (comparative example) in which the amount of the acrylic resin added is 223.1% by volume with respect to the metal powder and exceeds the range of the present invention (20 to 200% by volume), it is stable as a paste. The rheology was obtained, but the conductor filling property was insufficient, and it was confirmed that the electrode was balled by firing and chip reliability was lowered.

  In the case of samples No. 9 (Comparative Example) and 10 (Comparative Example), in which the average molecular weight of the acrylic resin is 150,000, which is below the range of the present invention (160000-200000), Sample No. 10 with a small resin addition Then, the structural viscosity due to the fine powder increased, and good printability was not obtained. Further, Sample No. 9 (Comparative Example) in which the resin addition amount is increased in order to ensure the printability has a poor conductor filling property, which is an undesirable result in terms of chip reliability.

  Moreover, in the case of the sample of sample number 11 (comparative example) whose average molecular weight of an acrylic resin is 1200000 and exceeds the range of the present invention, and sample number 12 (comparative example) whose addition amount is below the range of the present invention, It was confirmed that the fluidity of the paste was lowered and good printability could not be obtained.

  On the other hand, it was confirmed that the conductive pastes of Sample Nos. 1 to 8 have both good printability and high conductor filling properties.

  In addition, by using the conductive paste of Sample Nos. 1-8, small, high performance and high chip reliability with internal electrodes having the characteristics of thin layer, high continuity, high smoothness and low residue It was confirmed that a multilayer ceramic capacitor (multilayer ceramic electronic component) was obtained.

  In addition, about the conductive paste of sample number 2, 3, 5, 6 which mix | blended ceramic powder, when applying them to a ceramic base material (ceramic green sheet) and forming an electrode pattern, when this is baked, It has been confirmed that a conductive film (internal electrode) having a thinner, denser and more continuous film can be obtained by suppressing sintering of the conductive metal powder.

  From the above embodiment, it can be seen that a multilayer ceramic capacitor with small size, high performance and high reliability can be obtained by forming the internal electrode using the conductive paste of the present invention.

  In the above embodiment, the case where the multilayer ceramic capacitor is manufactured using the conductive paste according to the present invention has been described as an example. However, the conductive paste of the present invention is not limited to the multilayer ceramic capacitor, for example, a multilayer type The present invention can be applied to various multilayer ceramic electronic components having electrodes inside a ceramic laminate, such as LC composite components and multilayer varistors.

  The present invention is not limited to the above embodiment in other points, and various applications and modifications can be made within the scope of the invention.

1 Multilayer ceramic capacitor element 1
2 (2a, 2b) Internal electrode 3 Ceramic layer 4a, 4b End face of multilayer ceramic capacitor element 5 (5a, 5b) External electrode

Claims (7)

A conductive paste containing a conductive metal powder, an organic solvent, and an acrylic resin,
The conductive metal powder has an average particle size in the range of 50 to 200 nm;
The acrylic resin has a weight average molecular weight in the range of 160000-200000, and
The conductive paste characterized by the content rate of the said acrylic resin being in the range of 20-200 volume% with respect to the said metal powder.   Furthermore, ceramic powder is contained, The electrically conductive paste of Claim 1 characterized by the above-mentioned.   The conductive metal powder is at least one powder selected from the group consisting of copper, nickel, silver and palladium, or an alloy powder containing at least one selected from the group. Item 3. The conductive paste according to Item 1 or 2.   The conductive paste according to claim 2 or 3, wherein the ceramic powder has an average particle size in the range of 5 to 100 nm. 5. The conductive paste according to claim 2, wherein the ceramic powder is a complex oxide having a perovskite structure represented by a general formula: ABO ₃ .   What is used for forming the internal electrode in manufacturing a multilayer ceramic electronic component having a structure in which a plurality of ceramic layers and a plurality of internal electrodes are provided and the internal electrodes are stacked via the ceramic layers The conductive paste according to claim 1, wherein the conductive paste is a paste. A method for manufacturing a multilayer ceramic electronic component comprising a plurality of ceramic layers and a plurality of internal electrodes, wherein the internal electrodes are stacked via the ceramic layers,
A ceramic green sheet that becomes the ceramic layer after firing, and an internal electrode pattern that is formed by printing the conductive paste according to any one of claims 1 to 5, and that becomes the internal electrode after firing, Forming an unfired laminate having a structure in which internal electrode patterns are laminated via the ceramic green sheets;
And a step of firing the green laminate. A method for producing a multilayer ceramic electronic component comprising:

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