TW201340780A - Organic electroluminescent device and organic electroluminescent device manufacturing method - Google Patents

Abstract

To provide an organic electroluminescent device and an organic electroluminescent device manufacturing method capable of reducing driving mechanisms and increasing the precision of evaporation. The invention allows more than N (N is more than two) substrates to be rightly aligned with the evaporation sources, thereby forwardly and backwardly moving in a direction of the evaporation. The aforementioned organic electroluminescent device or the organic electroluminescent device manufacturing method on the substrate subjected to the evaporation material is characterized in that the N substrates are sequentially vapor deposited while moving only in the aforementioned direction.

Description

Organic electroluminescence device manufacturing device and organic electroluminescence device manufacturing method

The present invention relates to an organic electroluminescence light-generating device and a method of manufacturing an organic electro-optic device, and more particularly to an organic electroluminescence device and a method for producing an organic electroluminescence device which are capable of vapor-depositing a vapor deposition material with high precision.

As a powerful method for manufacturing organic electroluminescent devices, there is a vacuum evaporation method. At the time of vacuum vapor deposition, a pattern having a high precision is deposited with a mask for forming a glass substrate (hereinafter simply referred to as a substrate) to be vapor-deposited and a vapor deposition pattern, and vapor deposition is performed. As such a prior art, there is Patent Document 1. In Patent Document 1, the evaporation source is moved two-dimensionally up and down, left and right, and the substrates of the two production lines are alternately vapor-deposited.

[Previous Technical Literature]

[Patent Document]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2010-86956

In the past, the market for organic electroluminescence has been expected to be more refined. Patent Document 1 has an advantage in that it can achieve a reduction in vapor deposition material that is not related to vapor deposition by mutual vapor deposition. However, in order to move the evaporation source two-dimensionally, three drive mechanisms were used. When there are many drive mechanisms, there are many components that repeatedly move in the vacuum processing chamber, and dust or degassing from the components may increase, which may hinder high-definition vapor deposition.

The present invention has been made in view of the above problems, and provides an organic electroluminescence device manufacturing apparatus or a method of manufacturing an organic electroluminescence device which can reduce the driving mechanism and can be deposited at a higher precision.

The present invention has at least the following features in order to achieve the above object.

According to the present invention, an organic electroluminescence device for depositing a vapor deposition material on the substrate may be provided in the substrate by including N (N 2 or more) in the substrate, and moving the substrate toward the evaporation source via one of the evaporation sources. In the manufacturing apparatus or the method of manufacturing an organic electroluminescence device, the evaporation source is characterized by sequentially depositing N pieces of the substrate in a single direction.

Further, the aforementioned N may be 2.

Further, the substrate is vapor-deposited in a state of being vertical or nearly vertical, and the evaporation source is a discharge port of the vapor deposition material that ejects evaporation to the vertical direction. The vertical evaporation source may be formed by moving the vertical evaporation source in the one direction and vapor-depositing the substrate.

Further, a transfer means for carrying the substrate horizontally into the vacuum vapor deposition process chamber, and a vacuum vapor deposition process chamber for vertically or nearly perpendicularly forming the substrate from the horizontal direction, and a substrate for the vertical evaporation source Surface control means are also available.

Further, the substrate is vapor-deposited in a horizontal state, and the evaporation source is a horizontal evaporation source in which a discharge port of the vapor deposition material that evaporates is discharged in a row direction, and the horizontal type is formed. The evaporation source is moved in the aforementioned direction, and the plurality of substrates may be vapor-deposited.

Further, in the evaporation of the evaporation source, the substrate of the first one of the N substrates is carried into the vacuum deposition processing chamber, and the substrate of the second substrate is In the evaporation source evaporation, the first substrate may be carried out from the vacuum deposition processing chamber.

In addition, the first substrate is transferred into the vacuum deposition processing chamber by the evaporation source during vapor deposition, and the second substrate is vapor-deposited. The substrate may be carried out from the vacuum vapor deposition processing chamber.

According to the present invention, it is possible to provide an organic electroluminescence device manufacturing apparatus or a method of manufacturing an organic electroluminescence device which can reduce the driving mechanism and can be more highly vapor-deposited.

1‧‧‧Processing room

1bu‧‧‧vacuum evaporation chamber

2‧‧‧Vacuum transfer processing room

5, 5a ~ 5d, 5R‧‧‧ transport robot arm

6‧‧‧Substrate

7‧‧‧Decanting Department

8‧‧‧Orientation Department

9‧‧‧Handling Department

10‧‧‧ gate valve

71‧‧‧Vertical evaporation source

71Y‧‧‧Horizontal evaporation source

74‧‧‧ moving mechanism

76R, 76L‧‧‧Up and down moving mechanism

81‧‧‧ mask

92‧‧‧Substrate surface control

A~D‧‧‧ combination equipment

Fig. 1 is a view showing the configuration of an apparatus for manufacturing an organic electroluminescent device according to an embodiment of the present invention.

Fig. 2 is a schematic view and an operation explanatory view showing a configuration of a vacuum transfer processing chamber and a vacuum vapor deposition processing chamber according to the present embodiment.

Fig. 3 is a view showing the configuration of a vacuum vapor deposition processing chamber as viewed in the direction of the arrow H shown in Fig. 2;

Fig. 4 is a view showing in detail a vacuum vapor deposition processing chamber of the prior art.

Fig. 5 is a flow chart showing the vapor deposition process of this embodiment.

Fig. 6 is a view showing another embodiment of the vacuum vapor deposition processing chamber of the present invention.

Embodiments of the present invention will be described using the drawings. The organic electroluminescent device manufacturing device is not simply forming a layer of luminescent material (EL layer), and is held by an electrode, forming a hole implant layer or a transport layer on the anode, forming an electron implant layer on the cathode or transporting Various materials such as layers are used as a multilayer structure of the film, and the substrate is washed. Fig. 1 shows an embodiment of the manufacturing apparatus.

The organic electroluminescent device manufacturing apparatus 100 of the present embodiment is widely divided, and the combination device 3 for transporting the substrate 6 to be processed and the four combined devices (A to D) for processing the substrate 6 are provided. Each combination device or combination device is composed of five receiving rooms 4 (4a to 4d) between the loading combination device 3 or the next project (closed project). In the present embodiment, the vapor deposition surface of the substrate is transported on the upper surface, and at the time of vapor deposition, the substrate is erected and vapor-deposited.

Loading the combined device 3 is to maintain the true The load lock chamber vacuum chamber 31 having the gate valve 10 and the transfer robot arm 5R that receives the substrate 6 from the load lock chamber 31 and the cassette 6 into the substrate 6 are transported. Each of the load lock chambers 31 and the receiving chambers 4 is provided in front and rear, and has a gate valve 10, and the switch of the gate valve 10 is controlled to maintain the vacuum, and the substrate is received and loaded to the loading assembly device 3 or the next combined device.

Each combination device (A~D) has one transfer machine The vacuum transfer processing chamber 2 of the arm 5 (5a to 5d) and the substrate 6 are received from the transport robot 5, and the specific processing is performed on the upper and lower processing chambers 1 on the drawing surface (the first additional word a to d system) The combination device is displayed, and the second additional words u and d show the upper side of the upper side). A gate valve 10 is provided between the vacuum transfer processing chamber 2 (2a to 2d) and the processing chamber 1.

The configuration of the processing chamber 1 differs depending on the processing contents, and a vacuum vapor deposition processing chamber 1bu in which an EL layer is formed by vacuum-depositing a luminescent material of a vapor deposition material will be described as an example.

FIG. 2 is a schematic view and an operation explanatory diagram showing a configuration of the vacuum transfer processing chamber 2b and the vacuum vapor deposition processing chamber 1bu. Fig. 3 is a view showing the configuration of the vacuum vapor deposition processing chamber 1bu as viewed in the direction of the arrow H shown in Fig. 2, and more detailed. Fig. 4 is a view showing the vacuum evaporation processing chamber of the prior art in the same detail. Figure. The R and L lines shown in Figs. 3 and 4 are seen from the back side of Fig. 2, and are opposite to the R and L lines of Fig. 2 . In FIGS. 3 and 4, the same components or functions as those in FIG. 2 are denoted by the same reference numerals. However, in order to prevent the symbols shown in FIG. 2 and FIG. 4 from becoming complicated, the additional characters indicating the vacuum transfer processing chamber 2b and the vacuum vapor deposition processing chamber 1bu are not attached to the respective constituent elements.

The transport robot arm 5 of Figure 2 has an overall up and down movement (see arrow 54), the two links 51 and 52 that can be twisted left and right, and the comb-shaped handle 53 for transporting the front end substrate.

On the other hand, the vacuum evaporation processing chamber shown in Fig. 2 and Fig. 3 1b is a vapor deposition unit 7 which is formed by a plurality of discharge ports 73 of a vapor deposition material that evaporates and evaporates in a vertical direction, and is vapor-deposited on the vertical evaporation source 71 of the substrate 6 by a vapor deposition material. Positioning of the substrate 6 and the mask 81 is performed, and the orientation portion 8 which is required to be vapor-deposited on the substrate 6 and the substrate 5 and the substrate are transferred, and the processing receiving portion 9 of the substrate 6 is moved to the vapor deposition portion 7. The orientation unit 8 and the processing receiver unit 9 are provided with two systems of a right R line and a left L line.

Here, in the process of the present embodiment, during the vapor deposition on one line (for example, the R line), the substrate is carried out to the other L line, and the substrate 6 and the mask 81 are aligned to complete the vapor deposition. By sequentially performing this process interaction, this embodiment is not vapor-deposited on the substrate 6, and the time for unnecessary evaporation can be reduced.

The processing receiving unit 9 has an interference with the comb-shaped handle 53 of the transport robot arm 5, and receives the substrate 6, and fixes the substrate 6. The handle 91 of the means 94, and the handle 91 are rotated, and the substrate 6 is moved to move the substrate to the substrate surface control means 92 opposite to the orientation portion 8 and the vapor deposition portion 7. As a means of fixing as described above, it is considered to be a method of using electromagnetic adsorption or a jig in a vacuum. The orientation 8 series has positioning driving portions (not shown) for positioning the substrate 6 and the mask 81 via the mask 81 and the alignment masks 86 and 85 on the substrate 6.

The vapor deposition unit 7 has a discharge port 73 for ejecting the vapor-deposited material, and a vertical evaporation source 71 provided in a plurality of rows in the longitudinal direction and a vertical evaporation source 71 are moved between the R and L lines. The left and right moving mechanism 74. The substrate 6 of the R and L lines is alternately vapor-deposited by the left and right moving mechanism 74.

The right and left moving mechanism 74 shown in FIG. 3 generally has a driving portion 74B that moves the vertical evaporation source 71 left and right, and a traveling portion 74M that supports the vertical evaporation source 71 and moves left and right via the driving portion 74B. The traveling portion 74M has two traveling rails 74r that are disposed in parallel to the rail mount 74q, two sliding members 74d that are moved on the traveling rail, and a fixing plate 74f that is fixed to the slider, and a vertical fixed to the fixing plate 74f. The evaporation source of the type evaporation source 71 is fixed to the plate 74v.

On the other hand, the driving unit 74B includes a driving motor 74m provided in the atmosphere outside the vacuum vapor deposition processing chamber 1bu, a vacuum closing portion 74s provided on the wall surface of the vacuum vapor deposition processing chamber 1bu, and a vacuum sealing portion. a rotating bar 74b for transmitting the rotation of the driving motor 74m, a pinion 74p provided at the front end of the rotating bar, a lower side of the rail mounting table 74q via the pinion, a rack 74k fixed to the slider 74d, and a connecting rack and a fixing plate 74f connected body 74j.

With this configuration, the rack 74k moves to the right and left via the pinion gear 74p, and the fixed plate 74f connected by the connecting body 74j moves to the left and right with the rack, and the vertical evaporation source 71 fixed to the fixed plate 74f moves left and right. In the present embodiment, the left and right moving mechanism 74 is a rack-and-pinion type, and as shown in FIG. 4, the ball screw nut may be used in the same manner as the vertical moving mechanisms 76R and 76L.

As a result, in the present embodiment, the vertical evaporation source 71 can be simply moved left and right, and the substrates of the R and L lines can be alternately vapor-deposited.

Further, it is not related to the vapor deposition of the pair of substrates 6 in the present embodiment, that is, the evaporation of the vapor deposition material in the field between the R and L lines and the movement time in the direction of the direction of the R and L lines.

However, FIG. 3 is a state in which the vertical evaporation source 71 is at the center of the R and L lines, and the state of the substrate 6 of the vapor deposition line L is displayed. At this time, in the R line, the vapor-deposited substrate 6 is leveled by the substrate surface control means 92, and is carried out from the vacuum vapor deposition processing chamber 1bu. Further, the vertical evaporation source 71 located at the left and right positions indicated by a single dotted line shows a state in which the left end of the R line and the right end of the L line are respectively displayed.

On the other hand, in the horizontal evaporation source 71Y shown in Fig. 4, the left and right moving mechanism 74' which is slightly different from the driving portion of Fig. 3 and the running portion is slightly different, and the horizontal evaporation source 71Y needs to be moved up and down in the R and L lines. The moving mechanisms 76R, 76L are moved up and down. However, the vertical movement mechanisms 76R and 76L have a drive motor 76m provided in the atmosphere outside the vacuum vapor deposition treatment chamber 1bu, and a vacuum closure portion provided on the wall surface of the vacuum vapor deposition treatment chamber 1bu. 76s, and a ball screw 76b that transmits the rotation of the drive motor 76m via the vacuum closing portion. The horizontal evaporation source 71Y is held up and down by being held by a claw 76t having a nut (not shown) that moves up and down via the ball screw 76b.

In the prior art, the vapor deposition material which is not related to the vapor deposition of the counter substrate 6, that is, the evaporation is unnecessary, is the same as the embodiment of the present invention, and the field between the R and L lines and the direction of the R and L line ends are converted. The time of movement. However, even if the moving time of the direction of the direction of the upper end of the R and L lines is the same, the moving distance between the lines of the embodiment of the present invention is the distance from the right end of the R line to the left end of the L line, that is, the distance between the lines. Compared with the prior art, the moving distance from the right end of the R line to the right end of the L line is shorter than the amount of the line width. Therefore, the vapor deposition material with unnecessary evaporation can be reduced.

According to the present embodiment described above, the drive mechanism can be reduced from three mechanisms to one mechanism, and the dust can be reduced or degassed, thereby providing a device for manufacturing a higher-grade vapor-deposited organic electroluminescence device.

Further, according to the present embodiment described above, the vertical evaporation source is moved to the left and right, and the two-line substrate is alternately vapor-deposited, and an organic electroluminescence device manufacturing apparatus capable of achieving a reduction in vapor deposition material that is not related to vapor deposition is provided. .

Next, the vapor deposition process flow of this embodiment will be described with reference to Fig. 5 . The vapor deposition process shown in FIG. 5 shows a state in which the vertical evaporation source 71 is vapor-deposited on the R line, moved to the center position of the R and L lines, and the substrate 6 of the L line which is ready for vapor deposition is vapor-deposited ( S0). First, the vertical evaporation source 71, as shown by the arrows J1, J2, will take the L line from the center. The position reaches the right end of the paper surface, and the direction after the conversion is repeated once to the center position, and the substrate 6 (SL1) of the L line is evaporated. At this time, in the R line, the substrate 6 is carried out from the vacuum vapor deposition processing chamber 1bu (SR1), and the new substrate 6 is carried into the processing receiving portion 9 (SR2). After that, the new substrate 6 is vertically or nearly vertically (to the extent of a few degrees in the vertical direction) via the substrate surface control means 92, and the positioning of the new substrate 6 and the mask 81 (SR4) is performed. Prepare for the next evaporation.

On the other hand, after the vertical evaporation source 71 is connected to the L line, as indicated by arrows J3 and J4, the R and L lines are from the center to the left end of the R line, and the direction after the conversion is repeated to the center position. The substrate 6 (SR5) of the R line is vapor-deposited. At this time, in the L line, the processing (SL2 to SL5) shown in steps R1 to SR4 of the R line is performed.

Then repeat the above steps for a specific number of times.

According to the processing flow of the present embodiment described above, in the vacuum vapor deposition processing chamber 1bu, it is possible to provide a vapor deposition process in which only the vertical evaporation source is moved to the left and right, and the vapor deposition is performed on one of the wires while the substrate is being vapor-deposited. The substrate can be moved into a new substrate, and a vapor deposition method that can be used as a vapor deposition material without any vapor deposition process can be reduced compared with the prior art.

Further, according to the processing flow of the present embodiment described above, the moving time of the vertical evaporation source can be shortened compared to the movement time of the conventional horizontal evaporation source 71Y, and the vacuum evaporation can be provided with high throughput. method.

Figure 6 is a view showing the other of the vacuum evaporation processing chamber of the present invention. Embodiment figure. When the embodiment described above is the first embodiment, in the first embodiment, two vapor deposition lines are provided in one vacuum vapor deposition processing chamber 1bu. The other embodiment is an example in which three vapor deposition lines are provided in one vacuum vapor deposition processing chamber 1bu. Even if there are three vapor deposition lines, the vertical evaporation source 71 is placed under the three vapor deposition lines, and as shown by the arrow G, only the left and right movement is required, and in the same manner as in the first embodiment, the substrate is vapor-deposited on one of the lines. In the meantime, by carrying out the vapor-deposited substrate of the other line or carrying in a new substrate, it is possible to provide a vacuum vapor deposition method in which the vapor deposition material which is not related to the vapor deposition process is reduced. In the above case, the same applies to the case where one vacuum deposition processing chamber is provided in four or more lines.

However, in the same manner as in the first embodiment, when the vapor deposition is required to be carried out, the substrate on the center line is returned to the vertical evaporation source again, and after the vapor deposition, it is necessary to start the substrate unloading operation, and the standby period is standby. . When there is no need for round-trip evaporation, the substrates of each line can be removed immediately after vapor deposition.

In the above description, an example in which the substrate is vapor-deposited is used, and when the substrate is vapor-deposited horizontally, the ejection port of the vapor-deposited material that ejects and evaporates is arranged in a row in the lateral direction. The horizontal evaporation source 71Y is disposed vertically and horizontally in the direction in which the lines move, and the same effects as those of the above embodiment can be exhibited when moving.

1bu‧‧‧vacuum evaporation chamber

6‧‧‧Substrate

8‧‧‧Orientation Department

9‧‧‧Handling Department

71‧‧‧Vertical evaporation source

74‧‧‧ moving mechanism

74B‧‧‧Driving Department

74M‧‧‧ Walking Department

74b‧‧‧Rotating rod

74d‧‧‧Sliding parts

74f‧‧‧ fixed board

74j‧‧‧Connected body

74k‧‧‧Rack

74m‧‧‧ drive motor

74p‧‧‧小小齿轮

74q‧‧‧Track stand

74r‧‧‧walking track

74s‧‧‧Vacuum Enclosure

74v‧‧‧fixed board

81‧‧‧ mask

92‧‧‧Substrate surface control

Claims (11)

An apparatus for manufacturing an organic electroluminescence device, comprising: a vacuum deposition processing chamber, wherein: an evaporation source for vapor deposition of a vapor deposition material on a substrate; and N (N system 2 or more) for the evaporation source, via the aforementioned The substrate which is vapor-deposited in one direction of the evaporation source is characterized in that the evaporation source sequentially vapor-deposits the N substrates in the one direction. The apparatus for manufacturing an organic electroluminescence device according to claim 1, wherein the N is 2. The apparatus for manufacturing an organic electroluminescent device according to the first or second aspect of the invention, wherein the substrate is vapor-deposited in a vertical or nearly vertical state, and the evaporation source ejects a vaporized evaporation material. The outlet is a vertical evaporation source provided in a plurality of rows in the longitudinal direction, and the substrate is vapor-deposited by moving the vertical evaporation source in the one direction. The apparatus for manufacturing an organic electroluminescence device according to the third aspect of the invention, further comprising: a transfer means for carrying the substrate horizontally into the vacuum vapor deposition process chamber; and the vacuum vapor deposition process chamber to change the substrate from a level The state of the substrate surface control of the above-mentioned vertical evaporation source is a state of vertical or nearly vertical. The apparatus for manufacturing an organic electroluminescence device according to the first or second aspect of the invention, wherein the substrate is vapor-deposited in a horizontal state, and the evaporation source ejects a discharge port of the evaporated vapor deposition material in a lateral direction. The horizontal evaporation source is provided in a plurality of columns, and the plurality of substrates are vapor-deposited by moving the horizontal evaporation source in the one direction. The apparatus for manufacturing an organic electroluminescence device according to the first aspect of the invention, wherein the substrate of the first one of the N substrates is the first one of the evaporation sources, and the Nth The substrate is carried in the vacuum deposition processing chamber, and a vapor deposition means for transferring the first substrate from the vapor deposition processing chamber to the second substrate is performed by vapor deposition. The apparatus for manufacturing an organic electroluminescence device according to the second aspect of the invention, wherein the substrate of the first one is subjected to vapor deposition, and the substrate of the second one is carried into the vacuum evaporation In the processing chamber, the vapor deposition means for carrying out the first substrate from the vacuum vapor deposition processing chamber during vapor deposition is used. A method for producing an organic electroluminescence device, wherein N (N system 2 or more) is contained in a substrate, and the substrate is reciprocally moved in the direction of one of the evaporation sources to the evaporation source, and the substrate vapor deposition material is evaporated on the substrate. A method of manufacturing an organic electroluminescence device, characterized in that the evaporation source sequentially deposits N of the substrates in a single direction. The method of manufacturing an organic electroluminescent device according to claim 8, wherein the N is 2. The method of manufacturing an organic electroluminescence device according to claim 8 or 9, wherein the substrate is vapor-deposited in a vertical or nearly vertical state, and the evaporation source is a spray of evaporating vapor deposition material. The outlet is a vertical evaporation source provided in a plurality of rows in the longitudinal direction, and the substrate is vapor-deposited by moving the vertical evaporation source in the one direction. The method of manufacturing an organic electroluminescence device according to claim 9, wherein the substrate of the first substrate is vapor-deposited by the evaporation source, and the second substrate is transferred into the vacuum evaporation processing chamber. In the second substrate, in the vapor deposition, the first substrate is carried out from the vacuum vapor deposition processing chamber.