TW201340780A - Organic electroluminescent device and organic electroluminescent device manufacturing method - Google Patents

Organic electroluminescent device and organic electroluminescent device manufacturing method Download PDF

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TW201340780A
TW201340780A TW102108037A TW102108037A TW201340780A TW 201340780 A TW201340780 A TW 201340780A TW 102108037 A TW102108037 A TW 102108037A TW 102108037 A TW102108037 A TW 102108037A TW 201340780 A TW201340780 A TW 201340780A
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substrate
vapor deposition
evaporation source
vapor
vacuum
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Kenji Katagiri
Iori Zushi
Hiroki Kameyama
Jae-Hoon Jung
Sang-Woo Lee
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Hitachi High Tech Corp
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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • C23C14/243Crucibles for source material
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12Organic material
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568Transferring the substrates through a series of coating stations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10Deposition of organic active material
    • H10K71/16Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

To provide an organic electroluminescent device and an organic electroluminescent device manufacturing method capable of reducing driving mechanisms and increasing the precision of evaporation. The invention allows more than N (N is more than two) substrates to be rightly aligned with the evaporation sources, thereby forwardly and backwardly moving in a direction of the evaporation. The aforementioned organic electroluminescent device or the organic electroluminescent device manufacturing method on the substrate subjected to the evaporation material is characterized in that the N substrates are sequentially vapor deposited while moving only in the aforementioned direction.

Description

有機電激發光裝置製造裝置及有機電激發光裝置製造方法 Organic electroluminescence device manufacturing device and organic electroluminescence device manufacturing method

本發明係有關有機電激發光製造裝置及有機電激發光裝置製造方法,尤其關於可高精細地蒸鍍蒸鍍材料的有機電激發光製造裝置及有機電激發光裝置製造方法。 The present invention relates to an organic electroluminescence light-generating device and a method of manufacturing an organic electro-optic device, and more particularly to an organic electroluminescence device and a method for producing an organic electroluminescence device which are capable of vapor-depositing a vapor deposition material with high precision.

做為製造有機電激發光裝置之有力方法,有真空蒸鍍法。進行真空蒸鍍之時,為得精度佳之圖案,進行與為了形成蒸鍍對象之玻璃基板(以下,單稱之為基板)與蒸鍍圖案之掩膜定位,而加以蒸鍍。做為如此以往技術,有專利文獻1。專利文獻1中,使蒸發源向上下、左右2維地加以移動,交互蒸鍍2條生產線之基板。 As a powerful method for manufacturing organic electroluminescent devices, there is a vacuum evaporation method. At the time of vacuum vapor deposition, a pattern having a high precision is deposited with a mask for forming a glass substrate (hereinafter simply referred to as a substrate) to be vapor-deposited and a vapor deposition pattern, and vapor deposition is performed. As such a prior art, there is Patent Document 1. In Patent Document 1, the evaporation source is moved two-dimensionally up and down, left and right, and the substrates of the two production lines are alternately vapor-deposited.

〔先前技術文獻〕 [Previous Technical Literature]

〔專利文獻〕 [Patent Document]

〔專利文獻1〕日本特開2010-86956號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2010-86956

以往之有機電激發光市場中,期望能得到更高的精細化。專利文獻1係經由交互蒸鍍,在可達成不關連於蒸鍍之蒸鍍材料之減低之部分,具有優點。但是,為予使蒸發源2維地加以移動,使用了3個驅動機構。驅動機構多之時,在真空處理室中重覆移動之構成要素會變多,而來自該構成要素之粉塵或脫氣會變多,有妨礙高精細蒸鍍之可能性。 In the past, the market for organic electroluminescence has been expected to be more refined. Patent Document 1 has an advantage in that it can achieve a reduction in vapor deposition material that is not related to vapor deposition by mutual vapor deposition. However, in order to move the evaporation source two-dimensionally, three drive mechanisms were used. When there are many drive mechanisms, there are many components that repeatedly move in the vacuum processing chamber, and dust or degassing from the components may increase, which may hinder high-definition vapor deposition.

本發明係有鑑於上述之課題而成者,提供減少驅動機構,可更高精細蒸鍍之有機電激發光裝置製造裝置或有機電激發光裝置製造方法者。 The present invention has been made in view of the above problems, and provides an organic electroluminescence device manufacturing apparatus or a method of manufacturing an organic electroluminescence device which can reduce the driving mechanism and can be deposited at a higher precision.

本發明係為達成上述目的,至少具有以下之特徵。 The present invention has at least the following features in order to achieve the above object.

本發明係可使基板內含有N(N係2以上)枚,令前述基板正對於蒸發源,經由前述蒸發源之一方向之往返移動,於前述基板蒸鍍蒸鍍材料的有機電激發光裝置製造裝置或有機電激發光裝置製造方法中,前述蒸發源係僅以前述一方向之移動,順序蒸鍍N枚前述基板為特徵者。 According to the present invention, an organic electroluminescence device for depositing a vapor deposition material on the substrate may be provided in the substrate by including N (N 2 or more) in the substrate, and moving the substrate toward the evaporation source via one of the evaporation sources. In the manufacturing apparatus or the method of manufacturing an organic electroluminescence device, the evaporation source is characterized by sequentially depositing N pieces of the substrate in a single direction.

又,前述N可以是2。 Further, the aforementioned N may be 2.

更且,前述基板係在垂直或幾近垂直之狀態下加以蒸鍍,前述蒸發源係使噴出蒸發之蒸鍍材料的噴出口,向縱 方向成為列狀複數而備有之縱型蒸發源,經由將前述縱型蒸發源向前述一方向移動,蒸鍍前述基板亦可。 Further, the substrate is vapor-deposited in a state of being vertical or nearly vertical, and the evaporation source is a discharge port of the vapor deposition material that ejects evaporation to the vertical direction. The vertical evaporation source may be formed by moving the vertical evaporation source in the one direction and vapor-depositing the substrate.

又,具有將前述基板水平搬入至前述真空蒸鍍處理室的搬送手段、和前述真空蒸鍍處理室係將前述基板從水平成為垂直或幾近垂直之狀態,正對於前述縱型蒸發源的基板面控制手段亦可。 Further, a transfer means for carrying the substrate horizontally into the vacuum vapor deposition process chamber, and a vacuum vapor deposition process chamber for vertically or nearly perpendicularly forming the substrate from the horizontal direction, and a substrate for the vertical evaporation source Surface control means are also available.

更且,前述基板係在水平狀態下加以蒸鍍,前述蒸發源係使噴出蒸發之蒸鍍材料的噴出口,向橫方向成為列狀複數而備有之橫型蒸發源,經由將前述橫型蒸發源向前述一方向移動,蒸鍍複數之前述基板亦可。 Further, the substrate is vapor-deposited in a horizontal state, and the evaporation source is a horizontal evaporation source in which a discharge port of the vapor deposition material that evaporates is discharged in a row direction, and the horizontal type is formed. The evaporation source is moved in the aforementioned direction, and the plurality of substrates may be vapor-deposited.

又,將N枚之前述基板中之第1枚之前述基板,以前述蒸發源蒸鍍中,將第N枚之前述基板,搬入前述真空蒸鍍處理室內,將第2枚之前述基板,以前述蒸發源蒸鍍中,將第1枚之前述基板從前述真空蒸鍍處理室內加以搬出亦可。 Further, in the evaporation of the evaporation source, the substrate of the first one of the N substrates is carried into the vacuum deposition processing chamber, and the substrate of the second substrate is In the evaporation source evaporation, the first substrate may be carried out from the vacuum deposition processing chamber.

又,將第1枚之基板,以前述蒸發源於蒸鍍中,將第2枚之前述基板,搬入前述真空蒸鍍處理室內,將第2枚之前述基板,於蒸鍍中,將第1枚之前述基板從前述真空蒸鍍處理室內加以搬出亦可。 In addition, the first substrate is transferred into the vacuum deposition processing chamber by the evaporation source during vapor deposition, and the second substrate is vapor-deposited. The substrate may be carried out from the vacuum vapor deposition processing chamber.

根據本發明,可提供減少驅動機構,可更高精細蒸鍍之有機電激發光裝置製造裝置或有機電激發光裝置製造方法。 According to the present invention, it is possible to provide an organic electroluminescence device manufacturing apparatus or a method of manufacturing an organic electroluminescence device which can reduce the driving mechanism and can be more highly vapor-deposited.

1‧‧‧處理室 1‧‧‧Processing room

1bu‧‧‧真空蒸鍍處理室 1bu‧‧‧vacuum evaporation chamber

2‧‧‧真空搬送處理室 2‧‧‧Vacuum transfer processing room

5、5a~5d、5R‧‧‧搬送機器手臂 5, 5a ~ 5d, 5R‧‧‧ transport robot arm

6‧‧‧基板 6‧‧‧Substrate

7‧‧‧蒸鍍部 7‧‧‧Decanting Department

8‧‧‧定向部 8‧‧‧Orientation Department

9‧‧‧處理收受部 9‧‧‧Handling Department

10‧‧‧閘閥 10‧‧‧ gate valve

71‧‧‧縱型蒸發源 71‧‧‧Vertical evaporation source

71Y‧‧‧橫型蒸發源 71Y‧‧‧Horizontal evaporation source

74‧‧‧左右移動機構 74‧‧‧ moving mechanism

76R、76L‧‧‧上下移動機構 76R, 76L‧‧‧Up and down moving mechanism

81‧‧‧掩膜 81‧‧‧ mask

92‧‧‧基板面控制手段 92‧‧‧Substrate surface control

A~D‧‧‧組合設備 A~D‧‧‧ combination equipment

〔圖1〕顯示本發明之一實施形態之有機電激發光裝置製造裝置之構成圖。 Fig. 1 is a view showing the configuration of an apparatus for manufacturing an organic electroluminescent device according to an embodiment of the present invention.

〔圖2〕顯示本實施形態之真空搬送處理室與真空蒸鍍處理室之構成的模式圖與動作說明圖。 Fig. 2 is a schematic view and an operation explanatory view showing a configuration of a vacuum transfer processing chamber and a vacuum vapor deposition processing chamber according to the present embodiment.

〔圖3〕將圖2所示箭頭H方向所視之真空蒸鍍處理室之構成,更詳細揭示之圖。 Fig. 3 is a view showing the configuration of a vacuum vapor deposition processing chamber as viewed in the direction of the arrow H shown in Fig. 2;

〔圖4〕詳細顯示以往技術之真空蒸鍍處理室之圖。 Fig. 4 is a view showing in detail a vacuum vapor deposition processing chamber of the prior art.

〔圖5〕顯示本實施形態之蒸鍍處理流程圖。 Fig. 5 is a flow chart showing the vapor deposition process of this embodiment.

〔圖6〕顯示本發明之真空蒸鍍處理室之其他之實施形態圖。 Fig. 6 is a view showing another embodiment of the vacuum vapor deposition processing chamber of the present invention.

將本發明之實施形態,使用圖面加以說明。有機電激發光裝置製造裝置係非單純形成發光材料層(EL層),以電極加以挾持之構造,係於陽極上形成電洞植入層或輸送層、於陰極上形成電子植入層或輸送層等各種材料做為薄膜之多層構造,並洗淨基板而成。圖1係顯示該製造裝置之一實施形態者。 Embodiments of the present invention will be described using the drawings. The organic electroluminescent device manufacturing device is not simply forming a layer of luminescent material (EL layer), and is held by an electrode, forming a hole implant layer or a transport layer on the anode, forming an electron implant layer on the cathode or transporting Various materials such as layers are used as a multilayer structure of the film, and the substrate is washed. Fig. 1 shows an embodiment of the manufacturing apparatus.

本實施形態之有機電激發光裝置製造裝置100係大為區分,由搬送處理對象之基板6之載入組合設備3、處理前述基板6之4個組合設備(A~D)、各設置於 各組合設備間或組合設備與載入組合設備3或下個工程(封閉工程)間的5個收受室4(4a~4d)所構成。本實施形態中,令基板之蒸鍍面為上面加以搬送,於蒸鍍時,立起基板加以蒸鍍。 The organic electroluminescent device manufacturing apparatus 100 of the present embodiment is widely divided, and the combination device 3 for transporting the substrate 6 to be processed and the four combined devices (A to D) for processing the substrate 6 are provided. Each combination device or combination device is composed of five receiving rooms 4 (4a to 4d) between the loading combination device 3 or the next project (closed project). In the present embodiment, the vapor deposition surface of the substrate is transported on the upper surface, and at the time of vapor deposition, the substrate is erected and vapor-deposited.

載入組合設備3係由為了在於前後維持真 空,具有閘閥10之加載互鎖真空室31、和從前述加載互鎖真空室31收到基板6,迥旋向收受室4a搬入基板6之搬送機器手臂5R所成。各加載互鎖真空室31及各收受室4係於前後,具有閘閥10,控制該閘閥10之開關,維持真空下,向載入組合設備3或下個組合設備等,進行基板之收受。 Loading the combined device 3 is to maintain the true The load lock chamber vacuum chamber 31 having the gate valve 10 and the transfer robot arm 5R that receives the substrate 6 from the load lock chamber 31 and the cassette 6 into the substrate 6 are transported. Each of the load lock chambers 31 and the receiving chambers 4 is provided in front and rear, and has a gate valve 10, and the switch of the gate valve 10 is controlled to maintain the vacuum, and the substrate is received and loaded to the loading assembly device 3 or the next combined device.

各組合設備(A~D)係具有一台之搬送機器 手臂5(5a~5d)之真空搬送處理室2、和從搬送機器手臂5接收基板6,進行特定處理在圖面上配置於上下之2個處理室1(第1之附加字a~d係顯示組合設備,第2之附加字u、d係顯示上側下側)。真空搬送處理室2(2a~2d)與處理室1之間,設有閘閥10。 Each combination device (A~D) has one transfer machine The vacuum transfer processing chamber 2 of the arm 5 (5a to 5d) and the substrate 6 are received from the transport robot 5, and the specific processing is performed on the upper and lower processing chambers 1 on the drawing surface (the first additional word a to d system) The combination device is displayed, and the second additional words u and d show the upper side of the upper side). A gate valve 10 is provided between the vacuum transfer processing chamber 2 (2a to 2d) and the processing chamber 1.

處理室1之構成雖由於處理內容而有所不同,以在真空蒸鍍蒸鍍材料之發光材料,形成EL層之真空蒸鍍處理室1bu為例加以說明。 The configuration of the processing chamber 1 differs depending on the processing contents, and a vacuum vapor deposition processing chamber 1bu in which an EL layer is formed by vacuum-depositing a luminescent material of a vapor deposition material will be described as an example.

圖2係真空搬送處理室2b與真空蒸鍍處理室1bu之構成的模式圖與動作說明圖。圖3係將圖2所示箭頭H方向所視之真空蒸鍍處理室1bu之構成,更詳細揭示之圖。圖4係同樣詳細顯示以往技術之真空蒸鍍處理室之 圖。圖3、圖4所示R、L線係從圖2之背面側所視之故,與圖2之R、L線呈相反者。圖3、圖4中,顯示與圖2相同之構成或機能者係附上同一之符號。惟,為防止圖2乃至圖4所示符號變得複雜,於各構成要素中,不附上顯示真空搬送處理室2b及真空蒸鍍處理室1bu之附加字。 FIG. 2 is a schematic view and an operation explanatory diagram showing a configuration of the vacuum transfer processing chamber 2b and the vacuum vapor deposition processing chamber 1bu. Fig. 3 is a view showing the configuration of the vacuum vapor deposition processing chamber 1bu as viewed in the direction of the arrow H shown in Fig. 2, and more detailed. Fig. 4 is a view showing the vacuum evaporation processing chamber of the prior art in the same detail. Figure. The R and L lines shown in Figs. 3 and 4 are seen from the back side of Fig. 2, and are opposite to the R and L lines of Fig. 2 . In FIGS. 3 and 4, the same components or functions as those in FIG. 2 are denoted by the same reference numerals. However, in order to prevent the symbols shown in FIG. 2 and FIG. 4 from becoming complicated, the additional characters indicating the vacuum transfer processing chamber 2b and the vacuum vapor deposition processing chamber 1bu are not attached to the respective constituent elements.

圖2之搬送機器手臂5係具有可整體上下移 動(參照箭頭54),可向左右迥旋之2連桿51、52、和於前端基板搬送用之梳齒狀手柄53。 The transport robot arm 5 of Figure 2 has an overall up and down movement (see arrow 54), the two links 51 and 52 that can be twisted left and right, and the comb-shaped handle 53 for transporting the front end substrate.

另一方面,圖2、圖3所示真空蒸鍍處理室 1bu係大體區分,具有由將噴出蒸發之蒸鍍材料的噴出口73,向縱方向成為列狀而複數具備,將蒸鍍材料蒸鍍於基板6之縱型蒸發源71的蒸鍍部7、和進行基板6與掩膜81之定位,蒸鍍於基板6之必要部分之定向部8、和進行搬送機器手臂5與基板之收受,向蒸鍍部7移動基板6之處理收受部9。定向部8與處理收受部9係設有右側R線與左側L線之2系統。 On the other hand, the vacuum evaporation processing chamber shown in Fig. 2 and Fig. 3 1b is a vapor deposition unit 7 which is formed by a plurality of discharge ports 73 of a vapor deposition material that evaporates and evaporates in a vertical direction, and is vapor-deposited on the vertical evaporation source 71 of the substrate 6 by a vapor deposition material. Positioning of the substrate 6 and the mask 81 is performed, and the orientation portion 8 which is required to be vapor-deposited on the substrate 6 and the substrate 5 and the substrate are transferred, and the processing receiving portion 9 of the substrate 6 is moved to the vapor deposition portion 7. The orientation unit 8 and the processing receiver unit 9 are provided with two systems of a right R line and a left L line.

在此,本實施形態之處理中,在一方之線上(例如R線)蒸鍍之期間,向另一方之L線搬出入基板,定向基板6與掩膜81,完成蒸鍍之準備。經由將此處理交互順序地進行,本實施形態係不蒸鍍於基板6,可減少無謂蒸發之時間。 Here, in the process of the present embodiment, during the vapor deposition on one line (for example, the R line), the substrate is carried out to the other L line, and the substrate 6 and the mask 81 are aligned to complete the vapor deposition. By sequentially performing this process interaction, this embodiment is not vapor-deposited on the substrate 6, and the time for unnecessary evaporation can be reduced.

處理收受部9係具有擁有可不與搬送機器手臂5之梳齒狀手柄53有所干涉,收受基板6,固定基板6 之手段94的手柄91、和旋迥前述手柄91,直立基板6,將基板移動至定向部8及蒸鍍部7加以對向之基板面控制手段92。做為前述固定之手段,考量到為真空中,使用電磁吸附或夾具之手段等。定向8係具有經由掩膜81與基板6上之定向掩膜86、85,定位基板6與掩膜81之定位驅動部(未圖示)。 The processing receiving unit 9 has an interference with the comb-shaped handle 53 of the transport robot arm 5, and receives the substrate 6, and fixes the substrate 6. The handle 91 of the means 94, and the handle 91 are rotated, and the substrate 6 is moved to move the substrate to the substrate surface control means 92 opposite to the orientation portion 8 and the vapor deposition portion 7. As a means of fixing as described above, it is considered to be a method of using electromagnetic adsorption or a jig in a vacuum. The orientation 8 series has positioning driving portions (not shown) for positioning the substrate 6 and the mask 81 via the mask 81 and the alignment masks 86 and 85 on the substrate 6.

蒸鍍部7係具有將噴出蒸發之蒸鍍材料的噴出口73,向縱方向成為列狀加以複數具備之縱型蒸發源71、和將縱型蒸發源71,在R、L線間加以移動之左右移動機構74。經由此左右移動機構74,交互蒸鍍R、L線之基板6。 The vapor deposition unit 7 has a discharge port 73 for ejecting the vapor-deposited material, and a vertical evaporation source 71 provided in a plurality of rows in the longitudinal direction and a vertical evaporation source 71 are moved between the R and L lines. The left and right moving mechanism 74. The substrate 6 of the R and L lines is alternately vapor-deposited by the left and right moving mechanism 74.

圖3所示左右移動機構74係大體具有左右移動縱型蒸發源71之驅動部74B、和支持縱型蒸發源71,經由驅動部74B左右移動之行走部74M。行走部74M係具有平行設於軌道架台74q之2條行走軌道74r、和移動在行走軌道上之2個滑件74d、和固定於滑件之固定板74f、和直立固定於固定板74f之縱型蒸發源71的蒸發源固定板74v。 The right and left moving mechanism 74 shown in FIG. 3 generally has a driving portion 74B that moves the vertical evaporation source 71 left and right, and a traveling portion 74M that supports the vertical evaporation source 71 and moves left and right via the driving portion 74B. The traveling portion 74M has two traveling rails 74r that are disposed in parallel to the rail mount 74q, two sliding members 74d that are moved on the traveling rail, and a fixing plate 74f that is fixed to the slider, and a vertical fixed to the fixing plate 74f. The evaporation source of the type evaporation source 71 is fixed to the plate 74v.

另一方面,驅動部74B係具有設於真空蒸鍍處理室1bu外部之大氣中之驅動馬達74m、和設於真空蒸鍍處理室1bu之壁面之真空封閉部74s、和隔著真空封閉部,傳達驅動馬達74m之旋轉的旋轉棒74b、和設於旋轉棒之前端之小齒輪74p、經由小齒輪移動軌道架台74q之下面,固定於滑件74d之齒條74k、和連結齒條與固定板 74f之連結體74j。 On the other hand, the driving unit 74B includes a driving motor 74m provided in the atmosphere outside the vacuum vapor deposition processing chamber 1bu, a vacuum closing portion 74s provided on the wall surface of the vacuum vapor deposition processing chamber 1bu, and a vacuum sealing portion. a rotating bar 74b for transmitting the rotation of the driving motor 74m, a pinion 74p provided at the front end of the rotating bar, a lower side of the rail mounting table 74q via the pinion, a rack 74k fixed to the slider 74d, and a connecting rack and a fixing plate 74f connected body 74j.

經由如此構造,經由小齒輪74p,齒條74k向左右移動,伴隨齒條,以連結體74j連結之固定板74f則左右移動,固定於固定板74f之縱型蒸發源71則左右移動。本實施形態中,做為左右移動機構74,雖使用齒條齒輪方式,如圖4所示與上下移動機構76R、76L相同,使用滾珠螺桿螺帽方式亦可。 With this configuration, the rack 74k moves to the right and left via the pinion gear 74p, and the fixed plate 74f connected by the connecting body 74j moves to the left and right with the rack, and the vertical evaporation source 71 fixed to the fixed plate 74f moves left and right. In the present embodiment, the left and right moving mechanism 74 is a rack-and-pinion type, and as shown in FIG. 4, the ball screw nut may be used in the same manner as the vertical moving mechanisms 76R and 76L.

結果,本實施形態中,僅單純左右移動縱型蒸發源71,即可,交互蒸鍍R、L線之基板。 As a result, in the present embodiment, the vertical evaporation source 71 can be simply moved left and right, and the substrates of the R and L lines can be alternately vapor-deposited.

又,不關連於本實施形態所成對基板6之蒸鍍,即蒸發無謂之蒸鍍材料係在R、L線間之領域、和R、L線兩端之方向轉換領域之移動時間。 Further, it is not related to the vapor deposition of the pair of substrates 6 in the present embodiment, that is, the evaporation of the vapor deposition material in the field between the R and L lines and the movement time in the direction of the direction of the R and L lines.

然而,圖3係縱型蒸發源71在R、L線之中央位置,顯示即將蒸鍍線L之基板6之狀態。此時R線中,令蒸鍍之基板6經由基板面控制手段92成為水平,從真空蒸鍍處理室1bu搬出。又,以單點虛線所示位於左右位置之縱型蒸發源71係各別顯示位於R線之左端、L線之右端之狀態。 However, FIG. 3 is a state in which the vertical evaporation source 71 is at the center of the R and L lines, and the state of the substrate 6 of the vapor deposition line L is displayed. At this time, in the R line, the vapor-deposited substrate 6 is leveled by the substrate surface control means 92, and is carried out from the vacuum vapor deposition processing chamber 1bu. Further, the vertical evaporation source 71 located at the left and right positions indicated by a single dotted line shows a state in which the left end of the R line and the right end of the L line are respectively displayed.

對此,圖4所示橫型蒸發源71Y中,加上與圖3之驅動部相同,行走部略有不同之左右移動機構74′,在R、L線,需要上下移動橫型蒸發源71Y之上下移動機構76R、76L。然而,上下移動機構76R、76L係具有設於真空蒸鍍處理室1bu之外部之大氣中之驅動馬達76m、和設於真空蒸鍍處理室1bu之壁面之真空封閉部 76s、和隔著真空封閉部傳達驅動馬達76m之旋轉之滾珠螺桿76b。橫型蒸發源71Y係經由具有經由滾珠螺桿76b上下移動之螺帽(未圖示)之爪76t加以保持而上下移動。 On the other hand, in the horizontal evaporation source 71Y shown in Fig. 4, the left and right moving mechanism 74' which is slightly different from the driving portion of Fig. 3 and the running portion is slightly different, and the horizontal evaporation source 71Y needs to be moved up and down in the R and L lines. The moving mechanisms 76R, 76L are moved up and down. However, the vertical movement mechanisms 76R and 76L have a drive motor 76m provided in the atmosphere outside the vacuum vapor deposition treatment chamber 1bu, and a vacuum closure portion provided on the wall surface of the vacuum vapor deposition treatment chamber 1bu. 76s, and a ball screw 76b that transmits the rotation of the drive motor 76m via the vacuum closing portion. The horizontal evaporation source 71Y is held up and down by being held by a claw 76t having a nut (not shown) that moves up and down via the ball screw 76b.

在以往技術中,不關連於對基板6之蒸鍍,即蒸發無謂之蒸鍍材料係與本發明之實施形態相同,在R、L線間之領域、和R、L線上端之方向轉換領域之移動時間。但是,即使R、L線之上端之方向轉換領域之移動時間相同,本發明之實施形態之線間之移動距離係從R線之右端至L線之左端間距離,即線間之距離之故,較以往技術之移動於從R線之右端至L線之右端之移動距離,短了相當於線寬之份量。因此,可減低無謂蒸發之蒸鍍材料。 In the prior art, the vapor deposition material which is not related to the vapor deposition of the counter substrate 6, that is, the evaporation is unnecessary, is the same as the embodiment of the present invention, and the field between the R and L lines and the direction of the R and L line ends are converted. The time of movement. However, even if the moving time of the direction of the direction of the upper end of the R and L lines is the same, the moving distance between the lines of the embodiment of the present invention is the distance from the right end of the R line to the left end of the L line, that is, the distance between the lines. Compared with the prior art, the moving distance from the right end of the R line to the right end of the L line is shorter than the amount of the line width. Therefore, the vapor deposition material with unnecessary evaporation can be reduced.

根據以上說明之本實施形態時,相較於以往技術,可將驅動機構從3機構減至1機構,可減低粉塵或脫氣,提供更高精細蒸鍍之有機電激發光裝置製造裝置。 According to the present embodiment described above, the drive mechanism can be reduced from three mechanisms to one mechanism, and the dust can be reduced or degassed, thereby providing a device for manufacturing a higher-grade vapor-deposited organic electroluminescence device.

又,根據以上說明之本實施形態時,令縱型蒸發源左右移動,交互蒸鍍2線之基板,更提供可達成不關連於蒸鍍之蒸鍍材料之減低的有機電激發光裝置製造裝置。 Further, according to the present embodiment described above, the vertical evaporation source is moved to the left and right, and the two-line substrate is alternately vapor-deposited, and an organic electroluminescence device manufacturing apparatus capable of achieving a reduction in vapor deposition material that is not related to vapor deposition is provided. .

接著,將本實施形態之蒸鍍處理流程,使用圖5加以說明。圖5所示蒸鍍處理流程係顯示終止縱型蒸發源71在R線之蒸鍍,移動至R、L線之中央位置,將蒸鍍準備完成之L線之基板6加以蒸鍍之狀態(S0)。首先,縱型蒸發源71你如箭頭J1、J2所示,將L線從中央 之位置到達紙面之右端,轉換之後的方向,至中央之位置往返一次,蒸鍍L線之基板6(SL1)。此時,R線中,將基板6從真空蒸鍍處理室1bu搬出(SR1),將新基板6搬入處理收受部9(SR2)。之後,經由基板面控制手段92,將新基板6成為垂直或幾近垂直(對於鉛直方向呈數度以內之程度)之狀態(SR3),進行新基板6與掩膜81之定位(SR4),準備下次蒸鍍。 Next, the vapor deposition process flow of this embodiment will be described with reference to Fig. 5 . The vapor deposition process shown in FIG. 5 shows a state in which the vertical evaporation source 71 is vapor-deposited on the R line, moved to the center position of the R and L lines, and the substrate 6 of the L line which is ready for vapor deposition is vapor-deposited ( S0). First, the vertical evaporation source 71, as shown by the arrows J1, J2, will take the L line from the center. The position reaches the right end of the paper surface, and the direction after the conversion is repeated once to the center position, and the substrate 6 (SL1) of the L line is evaporated. At this time, in the R line, the substrate 6 is carried out from the vacuum vapor deposition processing chamber 1bu (SR1), and the new substrate 6 is carried into the processing receiving portion 9 (SR2). After that, the new substrate 6 is vertically or nearly vertically (to the extent of a few degrees in the vertical direction) via the substrate surface control means 92, and the positioning of the new substrate 6 and the mask 81 (SR4) is performed. Prepare for the next evaporation.

另一方面,縱型蒸發源71係一往返L線後,如箭頭J3、J4所示,將R、L線從中央之位置到達R線之左端,轉換之後的方向,至中央之位置往返一次,蒸鍍R線之基板6(SR5)。此時,L線中,進行R線之步驟SR1至SR4所示之處理(SL2至SL5)。 On the other hand, after the vertical evaporation source 71 is connected to the L line, as indicated by arrows J3 and J4, the R and L lines are from the center to the left end of the R line, and the direction after the conversion is repeated to the center position. The substrate 6 (SR5) of the R line is vapor-deposited. At this time, in the L line, the processing (SL2 to SL5) shown in steps R1 to SR4 of the R line is performed.

之後係重覆特定次數上述步驟。 Then repeat the above steps for a specific number of times.

根據以上說明之本實施形態之處理流程,於真空蒸鍍處理室1bu,可提供僅左右移動縱型蒸發源,在一方之線上,於蒸鍍基板之期間,經由搬出另一方之線之蒸鍍之基板,搬入新的基板,可將無關於蒸鍍工程成為損失之蒸鍍材料,較以往技術而言可加以減低的真空蒸鍍方法。 According to the processing flow of the present embodiment described above, in the vacuum vapor deposition processing chamber 1bu, it is possible to provide a vapor deposition process in which only the vertical evaporation source is moved to the left and right, and the vapor deposition is performed on one of the wires while the substrate is being vapor-deposited. The substrate can be moved into a new substrate, and a vapor deposition method that can be used as a vapor deposition material without any vapor deposition process can be reduced compared with the prior art.

又,根據以上說明之本實施形態之處理流程,相較於以往之橫型蒸發源71Y之移動時間,可使縱型蒸發源之移動時間變短之故,可提供吞吐量高之真空蒸鍍方法。 Further, according to the processing flow of the present embodiment described above, the moving time of the vertical evaporation source can be shortened compared to the movement time of the conventional horizontal evaporation source 71Y, and the vacuum evaporation can be provided with high throughput. method.

圖6係顯示本發明之真空蒸鍍處理室之其他 之實施形態圖。令上述說明之實施形態為實施形態1時,實施形態1中,於1個真空蒸鍍處理室1bu,設有2個蒸鍍線。其他之實施形態係於一個真空蒸鍍處理室1bu,設置3個蒸鍍線的例。即使有3個蒸鍍線,將縱型蒸發源71在3個蒸鍍線下,如箭頭G所示,僅需左右移動,則與實施形態1相同地,在一方之線上,於蒸鍍基板之期間,經由搬出另一方之線之蒸鍍之基板或搬入新的基板,可提供將無關於蒸鍍工程成為損失之蒸鍍材料加以減低的真空蒸鍍方法。上述之情形,在4個以上之線設置1個真空蒸鍍處理室下亦相同。 Figure 6 is a view showing the other of the vacuum evaporation processing chamber of the present invention. Embodiment figure. When the embodiment described above is the first embodiment, in the first embodiment, two vapor deposition lines are provided in one vacuum vapor deposition processing chamber 1bu. The other embodiment is an example in which three vapor deposition lines are provided in one vacuum vapor deposition processing chamber 1bu. Even if there are three vapor deposition lines, the vertical evaporation source 71 is placed under the three vapor deposition lines, and as shown by the arrow G, only the left and right movement is required, and in the same manner as in the first embodiment, the substrate is vapor-deposited on one of the lines. In the meantime, by carrying out the vapor-deposited substrate of the other line or carrying in a new substrate, it is possible to provide a vacuum vapor deposition method in which the vapor deposition material which is not related to the vapor deposition process is reduced. In the above case, the same applies to the case where one vacuum deposition processing chamber is provided in four or more lines.

惟,與實施形態1相同,需要往返所成蒸鍍之時,在於中央之線之基板,縱型蒸發源再一次返回,於蒸鍍後,需要開始基板之搬出動作之故,其期間則待命。無需往返之蒸鍍之時,各線之基板則蒸鍍後可馬上搬出。 However, in the same manner as in the first embodiment, when the vapor deposition is required to be carried out, the substrate on the center line is returned to the vertical evaporation source again, and after the vapor deposition, it is necessary to start the substrate unloading operation, and the standby period is standby. . When there is no need for round-trip evaporation, the substrates of each line can be removed immediately after vapor deposition.

以上之說明中,雖採用立起基板加以蒸鍍之例而加以說明,在將基板成水平加以蒸鍍之時,將噴出蒸發之蒸鍍材料之噴出口向橫方向成列狀複數備有之橫型蒸發源71Y,於線間移動之方向,垂直且水平地加以配置,移動時,亦可發揮與上述實施形態相同之效果。 In the above description, an example in which the substrate is vapor-deposited is used, and when the substrate is vapor-deposited horizontally, the ejection port of the vapor-deposited material that ejects and evaporates is arranged in a row in the lateral direction. The horizontal evaporation source 71Y is disposed vertically and horizontally in the direction in which the lines move, and the same effects as those of the above embodiment can be exhibited when moving.

1bu‧‧‧真空蒸鍍處理室 1bu‧‧‧vacuum evaporation chamber

6‧‧‧基板 6‧‧‧Substrate

8‧‧‧定向部 8‧‧‧Orientation Department

9‧‧‧處理收受部 9‧‧‧Handling Department

71‧‧‧縱型蒸發源 71‧‧‧Vertical evaporation source

74‧‧‧左右移動機構 74‧‧‧ moving mechanism

74B‧‧‧驅動部 74B‧‧‧Driving Department

74M‧‧‧行走部 74M‧‧‧ Walking Department

74b‧‧‧旋轉棒 74b‧‧‧Rotating rod

74d‧‧‧滑件 74d‧‧‧Sliding parts

74f‧‧‧固定板 74f‧‧‧ fixed board

74j‧‧‧連結體 74j‧‧‧Connected body

74k‧‧‧齒條 74k‧‧‧Rack

74m‧‧‧驅動馬達 74m‧‧‧ drive motor

74p‧‧‧小齒輪 74p‧‧‧小小齿轮

74q‧‧‧軌道架台 74q‧‧‧Track stand

74r‧‧‧行走軌道 74r‧‧‧walking track

74s‧‧‧真空封閉部 74s‧‧‧Vacuum Enclosure

74v‧‧‧固定板 74v‧‧‧fixed board

81‧‧‧掩膜 81‧‧‧ mask

92‧‧‧基板面控制手段 92‧‧‧Substrate surface control

Claims (11)

一種有機電激發光裝置製造裝置,具有真空蒸鍍處理室,其係內含:將蒸鍍材料蒸鍍於基板之蒸發源,以及N枚(N係2以上)正對於前述蒸發源,經由前述蒸發源之一方向之往返移動加以蒸鍍之前述基板,其特徵係前述蒸發源係僅以前述一方向之移動,順序蒸鍍N枚之前述基板者。 An apparatus for manufacturing an organic electroluminescence device, comprising: a vacuum deposition processing chamber, wherein: an evaporation source for vapor deposition of a vapor deposition material on a substrate; and N (N system 2 or more) for the evaporation source, via the aforementioned The substrate which is vapor-deposited in one direction of the evaporation source is characterized in that the evaporation source sequentially vapor-deposits the N substrates in the one direction. 如申請專利範圍第1項之有機電激發光裝置製造裝置,其中,前述N為2。 The apparatus for manufacturing an organic electroluminescence device according to claim 1, wherein the N is 2. 如申請專利範圍第1項或第2項之有機電激發光裝置製造裝置,其中,前述基板係在垂直或幾近垂直之狀態下加以蒸鍍,前述蒸發源係噴出蒸發之蒸鍍材料的噴出口,向縱方向成為列狀複數而備有之縱型蒸發源,經由將前述縱型蒸發源向前述一方向移動,蒸鍍前述基板者。 The apparatus for manufacturing an organic electroluminescent device according to the first or second aspect of the invention, wherein the substrate is vapor-deposited in a vertical or nearly vertical state, and the evaporation source ejects a vaporized evaporation material. The outlet is a vertical evaporation source provided in a plurality of rows in the longitudinal direction, and the substrate is vapor-deposited by moving the vertical evaporation source in the one direction. 如申請專利範圍第3項之有機電激發光裝置製造裝置,其中,具有:將前述基板水平搬入至前述真空蒸鍍處理室的搬送手段、和前述真空蒸鍍處理室係將前述基板從水平成為垂直或幾近垂直之狀態,正對於前述縱型蒸發源的基板面控制手段。 The apparatus for manufacturing an organic electroluminescence device according to the third aspect of the invention, further comprising: a transfer means for carrying the substrate horizontally into the vacuum vapor deposition process chamber; and the vacuum vapor deposition process chamber to change the substrate from a level The state of the substrate surface control of the above-mentioned vertical evaporation source is a state of vertical or nearly vertical. 如申請專利範圍第1項或第2項之有機電激發光裝置製造裝置,其中,前述基板係在水平狀態下加以蒸鍍,前述蒸發源係噴出蒸發之蒸鍍材料的噴出口,向橫方向成為列狀複數而備有之橫型蒸發源,經由將前述橫型蒸發源向前述一方向移動,蒸鍍複數之前述基板者。 The apparatus for manufacturing an organic electroluminescence device according to the first or second aspect of the invention, wherein the substrate is vapor-deposited in a horizontal state, and the evaporation source ejects a discharge port of the evaporated vapor deposition material in a lateral direction. The horizontal evaporation source is provided in a plurality of columns, and the plurality of substrates are vapor-deposited by moving the horizontal evaporation source in the one direction. 如申請專利範圍第1項之有機電激發光裝置製造裝置,其中,具有:在將N枚之前述基板中之第1枚之前述基板,以前述蒸發源在蒸鍍中,將第N枚之前述基板,搬入前述真空蒸鍍處理室內,在將第2枚之前述基板,以前述蒸發源在蒸鍍中,將第1枚之前述基板從前述真空蒸鍍處理室內加以搬出的蒸鍍手段。 The apparatus for manufacturing an organic electroluminescence device according to the first aspect of the invention, wherein the substrate of the first one of the N substrates is the first one of the evaporation sources, and the Nth The substrate is carried in the vacuum deposition processing chamber, and a vapor deposition means for transferring the first substrate from the vapor deposition processing chamber to the second substrate is performed by vapor deposition. 如申請專利範圍第2項之有機電激發光裝置製造裝置,其中,具有:在將第1枚之基板,以前述蒸發源在蒸鍍中,將第2枚之前述基板,搬入前述真空蒸鍍處理室內,且在將第2枚之前述基板,在蒸鍍中,將第1枚之前述基板從前述真空蒸鍍處理室內加以搬出的蒸鍍手段。 The apparatus for manufacturing an organic electroluminescence device according to the second aspect of the invention, wherein the substrate of the first one is subjected to vapor deposition, and the substrate of the second one is carried into the vacuum evaporation In the processing chamber, the vapor deposition means for carrying out the first substrate from the vacuum vapor deposition processing chamber during vapor deposition is used. 一種有機電激發光裝置製造方法,可使基板內含有N枚(N係2以上),將前述基板正對於蒸發源,經由前述蒸發源之一方向之往返移動,於前述基板蒸鍍蒸鍍材料的有機電激發光裝置製造方法,其特徵係前述蒸發源係僅以前述一方向之移動,順序蒸鍍N枚之前述基板者。 A method for producing an organic electroluminescence device, wherein N (N system 2 or more) is contained in a substrate, and the substrate is reciprocally moved in the direction of one of the evaporation sources to the evaporation source, and the substrate vapor deposition material is evaporated on the substrate. A method of manufacturing an organic electroluminescence device, characterized in that the evaporation source sequentially deposits N of the substrates in a single direction. 如申請專利範圍第8項之有機電激發光裝置製造方法,其中,前述N為2。 The method of manufacturing an organic electroluminescent device according to claim 8, wherein the N is 2. 如申請專利範圍第8項或第9項之有機電激發光裝置製造方法,其中,前述基板係在垂直或幾近垂直之狀態下加以蒸鍍,前述蒸發源係噴出蒸發之蒸鍍材料的噴出口,向縱方向成為列狀複數而備有之縱型蒸發源,經由將前述縱型蒸發源向前述一方向移動,蒸鍍前述基板者。 The method of manufacturing an organic electroluminescence device according to claim 8 or 9, wherein the substrate is vapor-deposited in a vertical or nearly vertical state, and the evaporation source is a spray of evaporating vapor deposition material. The outlet is a vertical evaporation source provided in a plurality of rows in the longitudinal direction, and the substrate is vapor-deposited by moving the vertical evaporation source in the one direction. 如申請專利範圍第9項之有機電激發光裝置製造方法,其中,在將第1枚之基板,以前述蒸發源在蒸鍍中,將第2枚之前述基板,搬入前述真空蒸鍍處理室內,且在將第2枚之前述基板,在蒸鍍中,將第1枚之前述基板從前述真空蒸鍍處理室內加以搬出者。 The method of manufacturing an organic electroluminescence device according to claim 9, wherein the substrate of the first substrate is vapor-deposited by the evaporation source, and the second substrate is transferred into the vacuum evaporation processing chamber. In the second substrate, in the vapor deposition, the first substrate is carried out from the vacuum vapor deposition processing chamber.
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