TWI586019B - Cluster type evaporation device for manufacturing of oled - Google Patents

Description

Cluster type deposition device for manufacturing organic light emitting element

The present invention relates to a cluster type deposition apparatus for manufacturing an organic light emitting element, and more particularly to a method of disposing a plurality of process chambers, a buffer chamber, and a stacking chamber around a transfer chamber to shorten the organic light emitting element A cluster type deposition apparatus for manufacturing an organic light-emitting element having an overall length of a manufacturing process equipment.

The organic electroluminescence display is a self-luminous type display, and has a wide viewing angle, excellent contrast, and fast response speed, and therefore has attracted attention as a next-generation display.

As is widely known, an organic electroluminescence device provided in an organic electroluminescence display is composed of first and second electrodes (anode electrodes and cathode electrodes) opposed to each other and an intermediate layer formed between the electrodes. The intermediate layer may be provided with a plurality of layers, for example, a hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer, an electron injection layer, and the like.

When the organic electroluminescent element having the above structure is produced, an organic thin film or an electrode such as the hole injecting layer, the hole transporting layer, the light emitting layer, the electron transporting layer, and the electron injecting layer formed on the substrate can be deposited by deposition using a deposition device The method is formed.

The organic matter deposition method is usually carried out by heating a heating vessel containing a substance to be deposited after mounting a substrate in a vacuum chamber to evaporate or raise a substance to be evaporated inside. That is, a mask having an opening portion having the same shape as that of the organic substance pattern to be formed on the substrate is arranged in front of the substrate, and an organic substance is evaporated or raised on the substrate to deposit an organic thin film or the like on the substrate.

As described above, in order to perform an organic substance deposition process on a substrate, an organic substance deposition system is required, which is a process chamber for performing an organic substance deposition process on the substrate, a transfer chamber for transferring the substrate to and from the process chamber, and A load/unload chamber or a load lock chamber that loads or unloads the substrate from the transfer chamber.

In addition, recent efforts have been made to load two substrates in the process chamber, and the organic substrate deposition process is performed simultaneously or sequentially on the two substrates to increase the research on the organic matter deposition yield of the substrate.

1 is a plan view showing a conventional organic substance deposition system, FIG. 2 is a front view of a process chamber for performing an organic substance deposition process on two substrates, and FIG. 3 is a view showing a substrate arrangement process of a conventional process chamber. Figure.

As shown in FIGS. 1 and 2, a conventional conventional organic deposition system is provided by loading/unloading chambers 1a, 1b and a column disposed at both ends of a manufacturing process for loading or unloading the substrate P therefrom. A plurality of clusters 2 are formed between the loading chamber 1a and the unloading chamber 1b. Each cluster 2 is composed of a process chamber 120 that performs an organic material deposition process on two substrates, and a transfer chamber 130 that carries in/out the substrate P into the process chamber 120.

Further, an opening/closing door is provided between the loading/unloading chambers 1a and 1b and the transfer chamber 130, and an opening and closing door is also provided between the transfer chamber 130 and the processing chamber 120 to transfer the substrate P while maintaining a vacuum.

A substrate support frame 121a, 121b for supporting the substrate P is disposed on both sides of the processing chamber 120, and the inner bottom surface is provided with a reciprocating movement on both side substrate support frames 121a, 121b for depositing organic substances on the substrate P. The deposition source 122 of the lower region is reciprocated in the horizontal direction by the transfer device 123 in the lower region of the substrate support frames 121a, 121b.

The organic matter evaporated from the organic substance deposition source 122 disposed on the bottom side of the processing chamber 120 is deposited on the two substrates P transferred into the processing chamber 120 constructed as above.

Therefore, the organic thin film can be deposited simultaneously or sequentially on the two substrates P supported by the substrate supporting frames 121a and 121b disposed on one side and the other upper portion of the processing chamber 120.

In addition, the two substrates P transferred into the processing chamber 120 are transferred by a transfer unit 140 disposed inside the transfer chamber 130, and the rear end portion 141 of the transfer unit 140 is rotatably disposed in the transfer chamber 130. At the center, the substrate holder 144 of the distal end portion 143 is advanced or retracted from the center point C1 of the transfer chamber 130 by folding the joint portion 142. Therefore, the substrate P transferred by the transfer unit 140 is radially moved forward and backward from the center point C1 of the transfer chamber 130.

Therefore, a rotation unit 124 for rotating the substrate support frames 121a and 121b is disposed inside the processing chamber 120 so that the substrate P passes through the transfer unit 140 to move forward and backward in parallel with the direction of loading and unloading, or Arranged in a direction juxtaposed with the moving direction of the deposition source 122.

That is, in the process of loading or unloading the substrate P into the process chamber 120, the conventional deposition device rotates in parallel with the direction A1 in which the substrate P and the deposition source 122 move, or moves back and forth with the mechanical arm. The direction A2 rotates side by side. Therefore, the process equipment and the process control are complicated, and it is necessary to provide the rotating unit 124 for rotating the substrate supporting frames 121a, 121b in the processing chamber 120 for realizing deposition, and therefore, it is necessary to additionally not only have the deposition preventing deposition substance to be transferred to the rotating unit. The structure of 124 will also add maintenance items.

Accordingly, the present invention has been made in view of the above problems, and an object thereof is to provide a cluster type deposition apparatus for manufacturing an organic light-emitting element, which is provided with a plurality of process chambers, a buffer chamber, and a stack around a transfer chamber. The chamber can shorten the overall length of the process equipment for manufacturing the organic light emitting element.

Further, an object of the invention is to provide a cluster type deposition apparatus for manufacturing an organic light-emitting element, which can freely design a cluster constituting a process equipment without moving the substrate loading/unloading direction of the processing chamber toward the center of the transfer unit.

Further, an object of the present invention is to provide a cluster type deposition apparatus for manufacturing an organic light-emitting element, which can omit a structure for arranging a moving direction of a transfer unit and a loading/unloading direction of a substrate in a process chamber as in the related art, thereby simplifying the process And process control, and can minimize maintenance projects that stop the overall manufacturing process line and release the process chamber vacuum.

In order to achieve the above object, the present invention provides a cluster type deposition apparatus for manufacturing an organic light emitting element, comprising: a loading chamber for supplying a substrate for an organic light emitting element; and a plurality of clusters each having a substrate transfer transfer a transfer chamber of the unit; and a process chamber disposed around the transfer chamber, the process chamber receives a substrate from the load chamber and deposits the plurality of clusters connected to a buffer chamber for transporting and rotating the substrate Providing a substrate support frame for supporting the substrate on both sides of the processing chamber, the bottom surface of the processing chamber is provided with a deposition source for reciprocating the lower portion of the substrate support frame on both sides of the substrate for depositing organic substances on the substrate. The transfer unit includes: a substrate holder; a multi-joint link for moving forward and backward, the front end portion of which is connected to the substrate holder; and a rotation link having one end connected to the center of the transfer chamber and the other end connected to the multi-joint a rear end portion of the connecting rod such that the front end portion and the rear end portion of the multi-joint link are disposed from the front center of the substrate support frame and the deposition source Direction orthogonal to the substrate transfer line.

Here, the rear end portion of the multi-joint link rotates in a direction opposite to the rotation direction of the rotation link with respect to the rotation of one end portion of the rotation link, and the rotation angle of the rear end portion of the multi-joint link is preferably rotated. It is at the same angle as the rotation angle of the rotating link.

Moreover, a plurality of the process chambers are preferably disposed along the circumference of the transfer chamber, and may further include a plurality of stacking chambers disposed along the circumference of the transfer chamber.

According to the present invention, there is provided a cluster type deposition apparatus for manufacturing an organic light-emitting element, which is provided with a plurality of process chambers, a buffer chamber, and a stacking chamber around a transfer chamber, which can shorten the manufacturing process of the organic light-emitting element The overall length of the equipment.

Further, there is provided a cluster type deposition apparatus for manufacturing an organic light-emitting element, which is capable of moving a multi-joint link of a transfer unit from a center of a transfer chamber through a rotary link, and respectively disposed on both side substrate support frames of the process chamber The front side eliminates the need to move the substrate loading/unloading direction of the process chamber toward the center of the transfer unit, thereby making it possible to freely design a cluster constituting the process equipment.

Further, there is provided a cluster type deposition apparatus for manufacturing an organic light-emitting element, which can omit a structure for arranging a moving direction of a transfer unit and a loading/unloading direction of a substrate in a process chamber as in the related art, thereby simplifying process and process control And can minimize the maintenance project that stops the overall manufacturing process line and releases the vacuum of the process chamber.

10a, 10b‧‧‧ loading/unloading chamber

20‧‧‧ cluster

21‧‧‧Transport chamber

22‧‧‧Processing chamber

23‧‧‧Stacking chamber

24‧‧‧buffer chamber

25‧‧‧Transfer unit

221a, 221b‧‧‧ substrate support

222‧‧‧Sedimentary source

223‧‧‧Transfer device

251‧‧‧Substrate support

252‧‧‧Multi-joint linkage

252a‧‧‧ front end

252b‧‧‧ back end

252c‧‧‧Intermediate joint

253‧‧‧Rotary link

253a‧‧‧ one end

253b‧‧‧Other end

L1, L2‧‧‧ substrate transfer line

P‧‧‧Substrate

Figure 1 is a top plan view of a conventional conventional organic deposition system.

Figure 2 is a front elevational view of a process chamber for performing an organic deposition process on two substrates.

Fig. 3 is a view showing the action of the substrate array process of the conventional process chamber.

Fig. 4 is a plan view showing a cluster type deposition apparatus for manufacturing an organic light-emitting element of the present invention.

Fig. 5 is a front structural view showing a process chamber in a cluster type deposition apparatus for manufacturing an organic light-emitting element of the present invention.

Fig. 6 is an enlarged view showing a cluster in the cluster type deposition apparatus for manufacturing an organic light-emitting element of the present invention.

7 to 10 are views showing the action of the loading/unloading process of the process chamber in the cluster type deposition apparatus for manufacturing an organic light-emitting element of the present invention.

Before explaining the present invention, it should be noted that, in the various embodiments, structural elements having the same structure are collectively described in the first embodiment using the same reference numerals, and in other embodiments, only different descriptions are used. The structure of the first embodiment.

Hereinafter, a cluster type deposition apparatus for manufacturing an organic light-emitting element according to a first embodiment of the present invention will be described in detail with reference to the accompanying drawings.

4 is a plan view of a cluster type deposition apparatus for manufacturing an organic light-emitting element of the present invention, and FIG. 5 is a front view of a process chamber of the cluster type deposition apparatus for manufacturing an organic light-emitting element of the present invention. Fig. 6 is an enlarged view showing a cluster in the cluster type deposition apparatus for manufacturing an organic light-emitting element of the present invention.

The deposition apparatus of the present invention, as shown in FIG. 4, includes: loading/unloading chambers 10a, 10b disposed at both ends of the deposition apparatus to supply and recover the substrate P for manufacturing the organic light-emitting element; A cluster 20, which is disposed between the loading/unloading chambers 10a, 10b, processes the substrate P supplied from the loading chamber 10a in a respective manufacturing process. The diagram in Fig. 4 is provided with four clusters 20, but the number of clusters 20 can be appropriately added and subtracted as needed.

Each cluster 20 is composed of a transfer chamber 21, a process chamber 22, a stacking chamber 23, and a buffer chamber 24.

The transfer chamber 21 is located at a central portion of the cluster 20 and is connected to the loading/unloading chambers 10a, 10b or adjacent clusters 20 through the buffer chamber 24. The substrate P passes through the transfer unit 25 disposed at the center of the transfer chamber 21, and sequentially deposits a plurality of thin films constituting the organic light-emitting element via a plurality of process chambers 22 disposed around the transfer chamber 21.

The process chamber 22 is present in more than one of each cluster, located around the transfer chamber 21. Different types of deposition sources are provided in each of the process chambers 22 to deposit mutually different deposition layers on the substrate P.

The inside of the processing chamber 22 is maintained in a vacuum state, and the two sides of the processing chamber are respectively provided with substrate supporting frames 221a and 221b for supporting the substrate P. The internal surface of the processing chamber 22 is provided with a deposition source 222 for the substrate P. The deposited organic matter moves back and forth in the horizontal direction through the driving device 223 in the lower region of the side substrate support frames 221a, 221b.

According to the cluster type deposition apparatus for manufacturing an organic light-emitting element of the present invention as described above, a plurality of process chambers 22, buffer chambers 24, and stacking chambers 23 are disposed around one transfer chamber 21, which can shorten the overall process equipment. length.

However, since on the inner bottom surface of the process chamber 22, the deposition source 222 is disposed to reciprocate along the normal direction with the process chamber, and the substrate support frames 221a, 221b on the inner sides are disposed as one side of the substrate P Since the direction in which the deposition source 222 moves is arranged in parallel, when the substrate P is carried in and out of the front surface of the substrate support frames 221a and 221b, the transfer direction of the substrate P is separated from the center of the transfer chamber 21.

More specifically, the transfer line for loading or unloading the substrate P to the both side substrate support frames 221a and 221b is made of the substrate P which is orthogonal to the transfer direction of the deposition source 222 from the center of the front surface of the one side substrate support frame 221a. A transfer line (hereinafter referred to as "substrate transfer line L1 of one side substrate support frame 221a") and a substrate transfer line orthogonal to the transfer direction of the deposition source 222 from the front center of the other side substrate support frame 221b (hereinafter referred to as "another The substrate transfer line L2") of the side substrate support frame 221b is configured. The substrate transfer line L1 of the one-side substrate support frame 221a and the substrate transfer line L2 of the other-side substrate support frame 221b are arranged side by side on the basis of the center of the transfer chamber 21.

Further, in the buffer chamber 24 and the stacking chamber 23 provided around the transfer chamber 21 together with the processing chamber 22, the transfer direction of the substrate P for loading/unloading the substrate P and the center of the transfer chamber 21 are provided. Point C1 crosses.

Therefore, as shown in FIG. 6, the transfer unit 25 is along the substrate transfer line L1, L2 of the one side substrate support frame 221a and the other side substrate support frame 221b of the process chamber 22, and the buffer chamber 24 and the stacking chamber. The substrate transfer line of 23 moves forward and backward. The transfer unit 25 includes a substrate holder 251, a multi-joint link 252 for moving forward and backward, a front end portion 252a connected to the substrate holder 251, and a rotation link 253 whose one end portion 253a is connected. In the center of the transfer chamber 21, the other end portion 253b is connected to the rear end portion 252b of the multi-joint link 252, and the rotation link 253 causes the multi-joint link 252 to be disposed on the front side of the substrate support frames 221a, 221b. The center is on a line orthogonal to the direction of movement of the deposition source 222.

The process of loading or unloading the substrate P into the process chamber 22 by such a transfer unit 25 is as follows.

In the drawings, FIG. 7 to FIG. 10 are views showing the operation of the process chamber 22 in which the process chamber 22 of the cluster type deposition apparatus for manufacturing an organic light-emitting device of the present invention is carried in and out.

First, as shown in Fig. 7, the multi-joint link 252 is rotated through the intermediate joint portion 252c in a state where the distal end portion 252a and the rear end portion 252b are disposed on the substrate transfer line L1 of the one substrate support frame 221a. The substrate holder 251 of the front end portion 252a advances from the internal space of the transfer chamber 21 to the substrate support frame 221a inside the process chamber 22 along the substrate transfer line L1, or the substrate holder 251 of the front end portion 252a from the inside of the process chamber 22 The substrate support frame 221a is retracted to the internal space of the transfer chamber 21.

Next, as shown in FIG. 8, in order to carry in or out the substrate P to the other substrate support frame 221b of the process chamber 22, the rotation link 253 of the transfer unit 25 is supported from the substrate support frame of the process chamber 22 When the 221a rotates toward the other substrate support frame 221b, the multi-joint link 252 rotates together with the rotation link 253 in the internal space of the transfer chamber 21. At this time, the rotation angle A of the rotation link 253 is set to the other end portion 253b of the rotation link 253 connected to the rear end portion 252 of the multi-joint link 252 from the substrate transfer line L1 with the one side substrate support frame 221a. The angle of the intersection to the point where the substrate transfer line L2 of the other substrate support frame 221b intersects.

Further, as shown in Fig. 9, the rear end portion 252b of the multi-joint link 252 connected to the other end portion 253b of the rotation link 253 is rotated in the opposite direction to the rotation link 253 to match the multi-joint link 252 It is provided on the substrate transfer line L2 of the other substrate support frame 221b. At this time, the rotation angle A of the rear end portion 252b of the multi-joint link 252 connected to the other end portion 253 of the rotation link 253 is set to be the same as the rotation angle A of the one end portion 253a of the rotation link 253. As described above, when the rear end portion 252b of the multi-joint link 252 connected to the other end portion 253b of the rotation link 253 is rotated in the opposite direction to the one end portion 253 of the rotation link 253, the front end of the multi-joint link 252 The rotation centers of the portion 252a and the rear end portion 252b are respectively disposed on the substrate transfer line L2 of the other substrate support frame 221b.

In this state, as shown in Fig. 10, when the intermediate joint portion 252c of the multi-joint link 252 is rotationally driven, the substrate holder 251 connected to the front end portion 252a of the multi-joint link 252 is on the other side substrate support frame 221b. The substrate transfer line L2 is advanced or retracted, so that the substrate P can be carried in or removed from the other substrate support frame 221b.

In addition, in order to facilitate understanding of the driving of the rotation link 253 in FIGS. 8 and 9, the rotation of the one end portion 253a of the rotation link 253 and the rotation of the rear end portion 252b of the multi-joint link 252 are sequentially performed. However, it is preferable to simultaneously rotate the one end portion 253a of the rotation link 253 connected to the center of the transfer chamber 21 and the rear end portion 252b of the multi-joint link 252.

Further, in the present embodiment, the transfer unit 25 is moved to the substrate transfer direction L2 of the other substrate support frame 221b in the state of the substrate transfer direction L1 from the substrate support frame 221a of the process chamber 22 as an example. Although this is merely an example for explaining the action of the transfer unit 25, such a drive sequence is not limited. That is, in order to smoothly perform the deposition process, the driving can be controlled by moving the substrate P from the buffer chamber 24 located on one side to the inside of the transfer chamber 21, and transferring the substrate to the substrate support frame 221a of one side of the process chamber 22. P, the substrate P is carried into the transfer chamber 21 from the buffer chamber 24 on one side, and the substrate P is transferred to the other substrate support frame 221b of the process chamber 22, and the deposition is ended in the process chamber 22 Thereafter, the substrate P is carried out from the one substrate support frame 221a, the substrate P is transferred to the other buffer chamber 24, and the substrate P is carried out from the other substrate support frame 221b, and the substrate is transferred to the other buffer chamber 24. P.

Similarly, when it is necessary to replace the mask disposed inside the processing chamber 22, it can also be driven as follows: the mask is taken out from the stacking chamber 23 on the side of the transfer chamber 21 by the transfer unit 25, and The substrate support frame 221a, 221b side of the process chamber 22 is carried in, or the mask in the process chamber 22 is reversely taken out and transferred to the stacking chamber 23.

According to the present embodiment, in the deposition process of the substrate P and the replacement of the mask as described above, the substrate P or the mask can be transferred by one transfer unit 25, so that the process equipment can be simplified.

In particular, the multi-joint link 252 of the transfer unit 25 can be moved from the center of the transfer chamber 21 through the rotation link 253 to be disposed on the front sides of the substrate support frames 221a and 221b on both sides of the process chamber, respectively. The loading/unloading direction of the substrate P of the processing chamber 22 is directed toward the center of the transfer unit. Therefore, the cluster 20 constituting the process equipment can be freely designed, and the rotation unit for arranging the moving direction of the transfer unit and the loading/unloading direction of the substrate in the processing chamber as in the related art can be omitted, so that the overall manufacturing can be minimized. The process line and the maintenance of the vacuum of the process chamber 22 are released.

The present invention is not limited to the above embodiments, but can be implemented in various forms within the scope of the patent application. Therefore, various changes and modifications may be made by those skilled in the art without departing from the scope of the invention.

20‧‧‧ cluster

21‧‧‧Transport chamber

22‧‧‧Processing chamber

23‧‧‧Stacking chamber

24‧‧‧buffer chamber

25‧‧‧Transfer unit

221a, 221b‧‧‧ substrate support

222‧‧‧Sedimentary source

223‧‧‧Transfer device

251‧‧‧Substrate support

252‧‧‧Multi-joint linkage

252a‧‧‧ front end

252b‧‧‧ back end

252c‧‧‧Intermediate joint

253‧‧‧Rotary link

253a‧‧‧ one end

253b‧‧‧Other end

L1, L2‧‧‧ substrate transfer line

P‧‧‧Substrate

Claims (2)

A cluster type deposition apparatus for manufacturing an organic light-emitting element, comprising: a loading chamber for supplying a substrate for an organic light-emitting element; and a plurality of clusters each having a transfer chamber having a substrate transfer transfer unit; a processing chamber disposed around the transfer chamber, the processing chamber receiving a substrate from the loading chamber and depositing, the plurality of clusters being connected to a buffer chamber for transporting and rotating the substrate, and two chambers inside the processing chamber The substrate has a substrate support frame respectively supporting the substrate, and a bottom surface of the processing chamber is provided with a deposition source for reciprocating the lower portion of the substrate support frame on both sides of the substrate for depositing organic substances on the substrate, the transfer unit comprising: a substrate holder; a multi-joint link for moving forward and backward, the front end portion of which is connected to the substrate holder; and a rotation link having one end connected to the center of the transfer chamber and the other end connected to the rear end portion of the multi-joint link The front end portion and the rear end portion of the multi-joint link are disposed on a substrate transfer line orthogonal to the moving direction of the deposition source from the center of the front surface of the substrate support frame, and The rear end portion of the multi-joint link rotates in a direction opposite to the rotation direction of the rotation link with respect to the rotation of one end portion of the rotation link, and the rotation angle of the rear end portion of the multi-joint link is rotated to be the rotation link The angle of rotation is the same angle. The cluster type deposition apparatus for manufacturing an organic light-emitting element according to claim 1, wherein a plurality of the processing chambers are disposed along a circumference of the transfer chamber, and further including a periphery of the transfer chamber A plurality of stacked chambers are provided.