TW201338920A - Grinding apparatus for plates - Google Patents
Grinding apparatus for plates Download PDFInfo
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- TW201338920A TW201338920A TW101110386A TW101110386A TW201338920A TW 201338920 A TW201338920 A TW 201338920A TW 101110386 A TW101110386 A TW 101110386A TW 101110386 A TW101110386 A TW 101110386A TW 201338920 A TW201338920 A TW 201338920A
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本發明是有關於一種研磨裝置,且特別是有關於一種板體研磨裝置。This invention relates to a polishing apparatus, and more particularly to a plate body polishing apparatus.
隨著平面顯示技術的進步,各種平面顯示面板已被廣泛應用於日常生活中常見的電子產品,如電視、電腦、行動電話、衛星導航裝置等。With the advancement of flat display technology, various flat display panels have been widely used in electronic products commonly seen in daily life, such as televisions, computers, mobile phones, satellite navigation devices, and the like.
在製作平面顯示面板的過程中,需要對平面顯示面板的表面進行研磨清潔,而習知的研磨裝置如圖1所示。習知研磨裝置100包括驅動件110以驅使移動平台120沿水平方向D1左右移動,而移動平台120上設有研磨布130。此外,研磨裝置100更包括氣缸140以及研磨頭150,研磨頭150用以吸附平面顯示面板50,而氣缸140連接研磨頭150,以驅使研磨頭150沿垂直方向D2上下移動。當要進行研磨的步驟時,氣缸140驅使研磨頭150向下移動,以使平面顯示面板50接觸研磨布130,而驅動件110驅使移動平台120左右移動,以對平面顯示面板50的表面進行研磨。In the process of making a flat display panel, the surface of the flat display panel needs to be ground and cleaned, and the conventional grinding device is shown in FIG. The conventional grinding apparatus 100 includes a driving member 110 to drive the moving platform 120 to move left and right in the horizontal direction D1, and the moving platform 120 is provided with a polishing cloth 130. In addition, the polishing apparatus 100 further includes a cylinder 140 for absorbing the flat display panel 50, and a cylinder 140 for connecting the polishing head 150 to drive the polishing head 150 to move up and down in the vertical direction D2. When the step of grinding is to be performed, the cylinder 140 drives the polishing head 150 to move downward to bring the flat display panel 50 into contact with the polishing cloth 130, and the driving member 110 drives the moving platform 120 to move left and right to grind the surface of the flat display panel 50. .
習知技術中,在研磨時氣缸140的上升壓不穩定,且容易產生漏氣的情形,導致研磨清潔的效果變差。此外,研磨厚度不易精準掌控,容易出現表面刮傷或損壞平面顯示面板50的情形。In the prior art, the upper pressurization of the cylinder 140 is unstable at the time of grinding, and air leakage is likely to occur, resulting in deterioration of the effect of polishing cleaning. In addition, the grinding thickness is not easy to control accurately, and it is prone to surface scratching or damage to the flat display panel 50.
本發明提供一種板體研磨裝置,以精準控制研磨厚度。The invention provides a plate body grinding device for precisely controlling the grinding thickness.
本發明另提供一種板體研磨裝置,以降低維護成本。The invention further provides a plate body grinding device to reduce maintenance costs.
為達上述優點至少其中之一,本發明提出一種板體研磨裝置,包括升降平台、研磨模組以及加壓模組。升降平台具有承載部,研磨模組與承載部相對,且研磨模組包括研磨帶與驅動組件。研磨帶具有相對的研磨面與背面,而驅動組件連接研磨帶,以驅使研磨帶轉動。加壓模組包括加壓頭與壓力調整組件。加壓頭適於移動而接觸至位於升降平台與加壓頭之間的部分研磨帶的背面,而壓力調整組件連接加壓頭,並適於移動加壓頭以調整加壓頭施加於研磨帶的壓力。壓力調整組件包括腔體、電磁線圈、永久磁鐵以及連接件,腔體具有遠離加壓頭的頂側,永久磁鐵可移動地設置於電磁線圈與頂側之間,且永久磁鐵與頂側之間形成密封氣密室。電磁線圈固定於腔體,並位於加壓頭與永久磁鐵之間,而連接件連接於永久磁鐵與加壓頭。In order to achieve at least one of the above advantages, the present invention provides a plate grinding device comprising a lifting platform, a grinding module and a pressing module. The lifting platform has a bearing portion, the grinding module is opposite to the bearing portion, and the grinding module comprises a grinding belt and a driving assembly. The abrasive belt has opposing abrasive and back faces, and the drive assembly is coupled to the abrasive belt to drive the abrasive belt to rotate. The pressurizing module includes a pressurizing head and a pressure adjusting component. The pressing head is adapted to move to contact a back surface of a portion of the abrasive belt between the lifting platform and the pressing head, and the pressure adjusting assembly is coupled to the pressing head and adapted to move the pressing head to adjust the pressing head to be applied to the polishing belt pressure. The pressure adjusting assembly comprises a cavity, an electromagnetic coil, a permanent magnet and a connecting member, the cavity has a top side away from the pressing head, the permanent magnet is movably disposed between the electromagnetic coil and the top side, and between the permanent magnet and the top side Form a sealed airtight chamber. The electromagnetic coil is fixed to the cavity and located between the pressing head and the permanent magnet, and the connecting member is connected to the permanent magnet and the pressing head.
在本發明之一實施例中,上述之板體研磨裝置更包括配置於承載部的壓力偵測模組,而壓力調整組件更包括電性連接至壓力偵測模組與電磁線圈的控制單元。In one embodiment of the present invention, the plate body polishing apparatus further includes a pressure detecting module disposed on the carrying portion, and the pressure adjusting component further includes a control unit electrically connected to the pressure detecting module and the electromagnetic coil.
在本發明之一實施例中,上述之研磨面為粗糙面。In an embodiment of the invention, the abrasive surface is a rough surface.
在本發明之一實施例中,上述之加壓模組更包括多個滾珠,設置於加壓頭內,且加壓頭包括接觸面用於接觸研磨帶,接觸面上設有多個孔洞,滾珠分別經由孔洞伸出接觸面外以接觸研磨帶。In an embodiment of the present invention, the pressure module further includes a plurality of balls disposed in the pressing head, and the pressing head includes a contact surface for contacting the grinding belt, and the contact surface is provided with a plurality of holes. The balls extend out of the contact surface via the holes respectively to contact the polishing tape.
在本發明之一實施例中,上述之加壓頭包括接觸面用於接觸研磨帶,接觸面設有多個出液孔,研磨帶設有多個貫孔,貫孔從研磨面延伸至背面。In an embodiment of the invention, the pressing head comprises a contact surface for contacting the polishing tape, the contact surface is provided with a plurality of liquid outlet holes, and the polishing tape is provided with a plurality of through holes extending from the polishing surface to the back surface .
在本發明之一實施例中,上述之驅動組件包括滾輪組。In an embodiment of the invention, the drive assembly includes a roller set.
在本發明之一實施例中,上述之承載部包括第一承載面與位於第一承載面邊緣的第二承載面,第一承載面與加壓頭之間的距離不同於第二承載面與加壓頭之間的距離。In an embodiment of the present invention, the carrying portion includes a first bearing surface and a second bearing surface at an edge of the first bearing surface, and the distance between the first bearing surface and the pressing head is different from the second bearing surface and The distance between the pressurizing heads.
在本發明之一實施例中,上述之升降平台包括平台本體與驅動元件。平台本體具有承載部,而驅動元件連接平台本體,以驅使平台本體朝接近或遠離研磨模組的方向移動。In an embodiment of the invention, the lifting platform comprises a platform body and a driving component. The platform body has a carrier portion, and the driving component is coupled to the platform body to drive the platform body to move toward or away from the polishing module.
為達上述優點至少其中之一,本發明另提出一種板體研磨裝置,其包括升降平台、研磨模組以及加壓模組。升降平台具有承載部,而研磨模組與承載部相對。研磨模組包括研磨帶及驅動組件。研磨帶具有相對的研磨面與背面。驅動組件連接研磨帶,以驅使研磨帶轉動。加壓模組包括加壓頭、多個滾珠以及壓力調整組件。加壓頭適於移動而接觸至升降平台與加壓頭之間的部分研磨帶的背面。滾珠設置於加壓頭內,且加壓頭包括接觸面用於接觸研磨帶,接觸面上設有多個孔洞,滾珠分別經由孔洞伸出接觸面外以接觸研磨帶。壓力調整組件連接加壓頭,並適於移動加壓頭以調整加壓頭施加於研磨帶的壓力。In order to achieve at least one of the above advantages, the present invention further provides a plate grinding device comprising a lifting platform, a grinding module and a pressing module. The lifting platform has a bearing portion, and the grinding module is opposite to the bearing portion. The grinding module includes a grinding belt and a driving assembly. The abrasive belt has a relatively abrasive surface and a back surface. The drive assembly is coupled to the abrasive belt to drive the abrasive belt to rotate. The pressurizing module includes a pressurizing head, a plurality of balls, and a pressure adjusting assembly. The pressing head is adapted to move to contact the back side of a portion of the abrasive belt between the lifting platform and the pressing head. The ball is disposed in the pressing head, and the pressing head includes a contact surface for contacting the polishing tape, and the contact surface is provided with a plurality of holes, and the balls respectively protrude out of the contact surface through the holes to contact the polishing tape. The pressure adjustment assembly is coupled to the pressure head and is adapted to move the pressure head to adjust the pressure applied by the pressure head to the abrasive belt.
本發明一實施例之板體研磨裝置中,板體設置於升降平台上,並藉由加壓模組將研磨帶加壓至板體,以對板體進行研磨,而這樣的方式有助於精準控制研磨厚度。此外,本發明另一實施例之板體研磨裝置中,因加壓頭內設有滾珠以減少研磨帶與加壓頭的之間的摩擦力,所以能延長研磨帶的使用壽命,以降低維護成本。In the plate grinding device according to an embodiment of the present invention, the plate body is disposed on the lifting platform, and the polishing tape is pressed to the plate body by the pressing module to grind the plate body, and the manner helps Precise control of the thickness of the grinding. In addition, in the plate grinding device according to another embodiment of the present invention, since the ball is provided in the pressing head to reduce the friction between the polishing tape and the pressing head, the service life of the polishing tape can be prolonged to reduce maintenance. cost.
為讓本發明之上述和其他目的、特徵和優點能更明顯易懂,下文特舉較佳實施例,並配合所附圖式,作詳細說明如下。The above and other objects, features and advantages of the present invention will become more <RTIgt;
圖2是本發明一實施例之一種板體研磨裝置的示意圖。請參照圖2,本實施例之板體研磨裝置200包括升降平台210、研磨模組220以及加壓模組230,其中升降平台210具有承載部211以承載板體60,而研磨模組220與承載部211相對。此升降平台210例如包括平台本體212與驅動元件213。上述之承載部211屬於平台本體212,而驅動元件213連接平台本體212。驅動元件213例如是馬達,其用以驅使平台本體212沿方向D3移動以接近或遠離研磨模組220。板體60例如為顯示面板、玻璃基板等元件,但不限於此。2 is a schematic view of a plate body polishing apparatus according to an embodiment of the present invention. Referring to FIG. 2, the plate grinding apparatus 200 of the embodiment includes a lifting platform 210, a polishing module 220, and a pressing module 230. The lifting platform 210 has a bearing portion 211 for carrying the plate body 60, and the grinding module 220 and the polishing module 220 The carrying portion 211 is opposed to each other. This lifting platform 210 includes, for example, a platform body 212 and a drive element 213. The above-mentioned carrying portion 211 belongs to the platform body 212, and the driving element 213 is connected to the platform body 212. The drive element 213 is, for example, a motor that drives the platform body 212 to move in the direction D3 to approach or move away from the polishing module 220. The plate body 60 is, for example, an element such as a display panel or a glass substrate, but is not limited thereto.
研磨模組220包括研磨帶221與驅動組件222。研磨帶221具有相對的研磨面223與背面224,研磨面223例如為粗糙面,且位在承載部211與加壓模組230之間的部分研磨面223面對承載部211。驅動組件222連接研磨帶221,以驅使研磨帶221轉動。本實施例之驅動組件222例如包括滾輪組222,而滾輪組222轉動時可帶動研磨帶221轉動。The polishing module 220 includes a polishing tape 221 and a driving assembly 222. The polishing tape 221 has a facing polishing surface 223 and a back surface 224. The polishing surface 223 is, for example, a rough surface, and a portion of the polishing surface 223 between the carrier portion 211 and the pressurizing module 230 faces the carrier portion 211. The drive assembly 222 is coupled to the abrasive belt 221 to drive the abrasive belt 221 to rotate. The driving assembly 222 of this embodiment includes, for example, a roller set 222, and the roller set 222 can rotate the grinding belt 221 when rotated.
加壓模組230包括加壓頭231與壓力調整組件232。加壓頭231適於移動而接觸至位於升降平台211與加壓頭231之間的部分研磨帶221的背面224,而壓力調整組件232連接加壓頭231,並適於移動加壓頭231以調整加壓頭231施加於研磨帶221的壓力。The pressurizing module 230 includes a pressurizing head 231 and a pressure adjusting assembly 232. The pressing head 231 is adapted to move to contact the back surface 224 of the partial grinding belt 221 between the lifting platform 211 and the pressing head 231, and the pressure adjusting assembly 232 is coupled to the pressing head 231 and is adapted to move the pressing head 231 The pressure applied to the polishing tape 221 by the pressurizing head 231 is adjusted.
在本實施例中,當要對板體60進行研磨時,藉由驅動組件222驅動研磨帶221轉動,並藉由驅動元件213驅使平台本體212沿著方向B3朝接近研磨模組220的方向移動,使板體60接觸研磨帶221的研磨面223或是與研磨帶221的研磨面223保持適當間距。接著,藉由壓力調整組件232使加壓頭231施加壓力於研磨帶221,以使研磨帶221對板體60的表面進行研磨。In the present embodiment, when the plate body 60 is to be ground, the grinding belt 221 is driven to rotate by the driving assembly 222, and the driving body 213 is driven to move the platform body 212 in the direction of approaching the grinding module 220 along the direction B3. The plate body 60 is brought into contact with the polishing surface 223 of the polishing tape 221 or at an appropriate distance from the polishing surface 223 of the polishing tape 221. Next, the pressurizing head 231 applies pressure to the polishing tape 221 by the pressure adjusting unit 232 to cause the polishing tape 221 to polish the surface of the plate body 60.
有別於習知技術,本實施例之板體研磨裝置200在設計上是藉由升降平台210來承載板體60,並藉由加壓模組230將研磨帶221加壓至板體60以對板體60進行研磨。升降平台210的驅動元件213可準確控制平台本體212上升的高度,有助於精準控制研磨厚度。此外,為了更精準控制研磨厚度,升降平台210的驅動元件213可配合用以感測板體60位置的高度感測器(圖未示)來控制平台本體212上升的高度。Different from the prior art, the plate grinding device 200 of the present embodiment is designed to carry the plate body 60 by the lifting platform 210, and pressurize the grinding belt 221 to the plate body 60 by the pressing module 230. The plate body 60 is ground. The driving element 213 of the lifting platform 210 can accurately control the rising height of the platform body 212, which helps to accurately control the grinding thickness. In addition, in order to control the grinding thickness more precisely, the driving component 213 of the lifting platform 210 can cooperate with a height sensor (not shown) for sensing the position of the plate body 60 to control the height of the platform body 212 rising.
為了更精準且穩定地控制施加於研磨帶221的壓力,本實施例所選用的壓力調整組件232例如包括腔體233、電磁線圈234、永久磁鐵235以及連接件236。腔體233具有遠離加壓頭231的頂側237,永久磁鐵235可移動地設置於電磁線圈234與頂側237之間,且永久磁鐵235與頂側237之間形成密封氣密室S。此密封氣密室S內的氣壓例如為可調整。電磁線圈234固定於腔體233,並位於加壓頭231與永久磁鐵235之間,而連接件236例如是穿過電磁線圈234並連接於永久磁鐵235與加壓頭231。In order to more precisely and stably control the pressure applied to the abrasive belt 221, the pressure adjusting assembly 232 selected in the present embodiment includes, for example, a cavity 233, an electromagnetic coil 234, a permanent magnet 235, and a connecting member 236. The cavity 233 has a top side 237 away from the pressurizing head 231, the permanent magnet 235 is movably disposed between the electromagnetic coil 234 and the top side 237, and a sealed airtight chamber S is formed between the permanent magnet 235 and the top side 237. The gas pressure in the sealed airtight chamber S is, for example, adjustable. The electromagnetic coil 234 is fixed to the cavity 233 and located between the pressing head 231 and the permanent magnet 235, and the connecting member 236 is passed through the electromagnetic coil 234 and connected to the permanent magnet 235 and the pressing head 231, for example.
藉由控制通入電磁線圈234的電流方向及強弱,使電磁線圈234與永久磁鐵235之間產生排斥力,且此排斥力恰可支撐永久磁鐵235、連接件236與加壓頭231。並且,藉由控制密封氣密室S內的氣壓可驅使永久磁鐵235向下移動,並帶動連接件236與加壓頭231移動,藉以調整加壓頭231施加於研磨帶221的壓力。有別於習知技術,本實施例所選用的壓力調整組件232可採用磁力混用壓力缸的方式來驅使加壓頭231移動,所以能較為精準且穩定地控制加壓頭231施加於研磨帶221的壓力,以避免研磨效果不佳或損傷板體60的情形。By controlling the direction and strength of the current flowing into the electromagnetic coil 234, a repulsive force is generated between the electromagnetic coil 234 and the permanent magnet 235, and this repulsive force can directly support the permanent magnet 235, the connecting member 236, and the pressing head 231. Moreover, by controlling the air pressure in the sealed airtight chamber S, the permanent magnet 235 can be driven to move downward, and the connecting member 236 and the pressing head 231 are moved to adjust the pressure applied to the grinding belt 221 by the pressing head 231. Different from the prior art, the pressure adjusting component 232 selected in the embodiment can drive the pressing head 231 by using a magnetic mixing cylinder, so that the pressing head 231 can be more accurately and stably controlled to be applied to the grinding belt 221. The pressure is to avoid poor grinding or damage to the plate 60.
需說明的是,本發明並不限定壓力調整組件232的驅動方式。在另一實施例中,亦可藉由電磁線圈234與永久磁鐵235之間產生的超距力來驅使永久磁鐵235移動,而連接件236與加壓頭231則隨著永久磁鐵235移動。更詳細地說,可僅藉由控制通入電磁線圈234之電流的方向與強弱來調整電磁線圈234所產生之磁力的方向與強弱,以使電磁線圈234與永久磁鐵235之間產生適當的吸引力或排斥力,從而控制永久磁鐵235的移動方向,以調整加壓頭231施加在研磨帶221的壓力。在其他實施例中,亦可選用其他的壓力調整組件來取代上述之壓力調整組件232。It should be noted that the present invention does not limit the driving mode of the pressure adjusting component 232. In another embodiment, the permanent magnet 235 can also be driven by the over-force generated between the electromagnetic coil 234 and the permanent magnet 235, and the connecting member 236 and the pressing head 231 move along with the permanent magnet 235. In more detail, the direction and strength of the magnetic force generated by the electromagnetic coil 234 can be adjusted only by controlling the direction and intensity of the current flowing into the electromagnetic coil 234, so that an appropriate attraction is generated between the electromagnetic coil 234 and the permanent magnet 235. The force or repulsive force controls the moving direction of the permanent magnet 235 to adjust the pressure applied to the grinding belt 221 by the pressing head 231. In other embodiments, other pressure adjustment components may be used in place of the pressure adjustment assembly 232 described above.
此外,板體研磨裝置200可進一步包括配置於承載部211的壓力偵測模組240,而壓力調整組件230更包括電性連接至壓力偵測模組240與電磁線圈234的控制單元(圖未示)。壓力偵測模組240例如包括多個壓力偵測器242,其用以感測壓力,而控制單元可根據壓力偵測模組240的感測結果來控制通入電磁線圈234之電流的強弱與方向或是調整密封氣密室S內的氣壓,以更準確且穩定地控制加壓頭231施加於研磨帶221的壓力。In addition, the plate body polishing apparatus 200 further includes a pressure detecting module 240 disposed on the bearing portion 211, and the pressure adjusting component 230 further includes a control unit electrically connected to the pressure detecting module 240 and the electromagnetic coil 234 (not shown) Show). The pressure detecting module 240 includes a plurality of pressure detectors 242 for sensing pressure, and the control unit can control the strength of the current flowing into the electromagnetic coil 234 according to the sensing result of the pressure detecting module 240. The direction or the air pressure in the sealed airtight chamber S is adjusted to more accurately and stably control the pressure applied to the grinding belt 221 by the pressurizing head 231.
圖3是圖2之加壓頭的接觸面的示意圖。請參照圖2與圖3,為了減低加壓頭231之接觸面239與其所接觸的研磨帶221之間的摩擦力,加壓模組230可更包括設置於加壓頭231內的多個滾珠251,且加壓頭231的接觸面239上可設有多個孔洞252,這些滾珠251分別經由孔洞252伸出接觸面239外以接觸研磨帶221。如此,可降低研磨帶221轉動的阻力並提升研磨帶221的使用壽命,進而降低板體研磨裝置200的維護成本。Figure 3 is a schematic illustration of the contact surface of the pressurizing head of Figure 2. Referring to FIG. 2 and FIG. 3 , in order to reduce the friction between the contact surface 239 of the pressing head 231 and the polishing tape 221 that the plasticizing head 221 contacts, the pressing module 230 may further include a plurality of balls disposed in the pressing head 231 . 251, and a plurality of holes 252 may be disposed on the contact surface 239 of the pressing head 231. The balls 251 extend out of the contact surface 239 via the holes 252 to contact the grinding belt 221, respectively. Thus, the resistance to the rotation of the polishing tape 221 can be reduced and the service life of the polishing tape 221 can be increased, thereby reducing the maintenance cost of the plate body polishing apparatus 200.
圖4是圖2之研磨帶的研磨面的示意圖。請參照圖2至圖4,為了提升清潔板體60的效果,可使清潔液(如水)經由加壓頭231流至研磨帶221的研磨面223。具體而言,加壓頭231的接觸面239可設有多個出液孔253,加壓頭231的其他表面(如與接觸面239相對的表面)例如設有入液口,以供注入清潔液。此外,研磨帶221設有多個貫孔225,貫孔225從研磨面223延伸至背面224,如此從出液孔253流出的清潔液可經由貫孔225流至研磨面223與板體60之間。Figure 4 is a schematic illustration of the abrasive surface of the abrasive belt of Figure 2. Referring to FIGS. 2 to 4, in order to enhance the effect of cleaning the plate body 60, a cleaning liquid (such as water) may be flowed to the polishing surface 223 of the polishing tape 221 via the pressurizing head 231. Specifically, the contact surface 239 of the pressing head 231 may be provided with a plurality of liquid discharging holes 253, and other surfaces of the pressing head 231 (such as a surface opposite to the contact surface 239) are provided with, for example, a liquid inlet for injection cleaning. liquid. In addition, the polishing tape 221 is provided with a plurality of through holes 225 extending from the polishing surface 223 to the back surface 224, so that the cleaning liquid flowing out from the liquid outlet holes 253 can flow to the polishing surface 223 and the plate body 60 via the through holes 225. between.
圖5是本發明另一實施例之承載部及其所承載的板體的俯視示意圖,而圖6是沿圖5之I-I線的剖面示意圖。請參照圖5與圖6,在板體非均厚的實施例中,承載部之承載面可設計成與板體的形狀相配合。舉例來說,當承載部211a用以承載板體60a(如顯示面板)時,由於板體60a包括基板61與基板62,且基板61突出於基板62之外,為了承載基板61之突出於基板62的部分,承載部211a可被設計成包括第一承載面214與位於第一承載面214邊緣的第二承載面215。第一承載面215與圖2所示之加壓頭231之間的距離不同於第二承載面215與加壓頭231之間的距離。第一承載面215用以承載基板62,而第二承載面215例如是高於第一承載面214,以承載基板61之突出於基板62的部分,如此能避免板體60a受到壓力時產生歪斜的情形,所以能均勻地研磨基板61的表面63。5 is a top plan view of a carrying portion and a plate body carried by the same according to another embodiment of the present invention, and FIG. 6 is a cross-sectional view taken along line I-I of FIG. 5. Referring to FIG. 5 and FIG. 6, in the embodiment in which the plate body is not uniform, the bearing surface of the bearing portion can be designed to match the shape of the plate body. For example, when the carrying portion 211a is used to carry the board 60a (such as a display panel), since the board 60a includes the substrate 61 and the substrate 62, and the substrate 61 protrudes beyond the substrate 62, the substrate 61 protrudes from the substrate. In part of 62, the carrier portion 211a can be designed to include a first bearing surface 214 and a second bearing surface 215 at the edge of the first bearing surface 214. The distance between the first bearing surface 215 and the pressing head 231 shown in FIG. 2 is different from the distance between the second bearing surface 215 and the pressing head 231. The first bearing surface 215 is used to carry the substrate 62, and the second bearing surface 215 is, for example, higher than the first bearing surface 214, so as to carry the portion of the substrate 61 protruding from the substrate 62, so as to avoid skew when the plate 60a is under pressure. In this case, the surface 63 of the substrate 61 can be uniformly polished.
綜上所述,在本發明之板體研磨裝置中,板體設置於升降平台上,並藉由加壓模組將研磨帶加壓至板體,以對板體進行研磨。由於升降平台的驅動元件可準確控制平台本體上升的高度,此有助於精準控制研磨厚度。此外,在一實施例之板體研磨裝置中,因加壓頭內設有滾珠以減少研磨帶與加壓頭的之間的摩擦力,所以能延長研磨帶的使用壽命,以降低板體研磨裝置的維護成本。另外,有別於習知技術單純使用氣缸驅動的方式,在壓力調整組件包括腔體、電磁線圈、永久磁鐵以及連接件的實施例中,可採用磁力混用壓力缸的方式來驅動加壓頭,所以能更精準且穩定地控制加壓頭施加於研磨帶的壓力。In summary, in the plate grinding device of the present invention, the plate body is disposed on the lifting platform, and the polishing tape is pressed to the plate body by the pressing module to grind the plate body. Since the driving elements of the lifting platform can accurately control the rising height of the platform body, this helps to precisely control the grinding thickness. In addition, in the plate grinding device of an embodiment, since the ball is provided in the pressing head to reduce the friction between the polishing tape and the pressing head, the service life of the polishing tape can be prolonged to reduce the grinding of the plate body. Maintenance costs of the unit. In addition, unlike the conventional technique of simply using the cylinder drive, in the embodiment of the pressure adjustment assembly including the cavity, the electromagnetic coil, the permanent magnet, and the connecting member, the magnetic pressure mixing cylinder can be used to drive the pressing head. Therefore, the pressure applied to the polishing belt by the pressing head can be controlled more accurately and stably.
雖然本發明已以較佳實施例揭露如上,然其並非用以限定本發明,任何熟習此技藝者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。While the present invention has been described in its preferred embodiments, the present invention is not intended to limit the invention, and the present invention may be modified and modified without departing from the spirit and scope of the invention. The scope of protection is subject to the definition of the scope of the patent application.
50...顯示面板50. . . Display panel
60、60a...板體60, 60a. . . Plate body
61、62...基板61, 62. . . Substrate
63...表面63. . . surface
100...研磨裝置100. . . Grinding device
110...驅動件110. . . Drive
120...移動平台120. . . mobile platform
130...研磨布130. . . Abrasive cloth
140...氣缸140. . . cylinder
150...研磨頭150. . . Grinding head
200...板體研磨裝置200. . . Plate grinding device
210...升降平台210. . . Lifting platform
211、211a...承載部211, 211a. . . Carrying part
212...平台本體212. . . Platform ontology
213...驅動元件213. . . Drive component
214...第一承載面214. . . First bearing surface
215...第二承載面215. . . Second bearing surface
220...研磨模組220. . . Grinding module
221...研磨帶221. . . Grinding tape
222...驅動組件222. . . Drive component
223...研磨面223. . . Grinding surface
224...背面224. . . back
225...貫孔225. . . Through hole
230...加壓模組230. . . Pressurized module
231...加壓頭231. . . Pressurizing head
232...壓力調整組件232. . . Pressure adjustment component
233...腔體233. . . Cavity
234...電磁線圈234. . . Electromagnetic coil
235...永久磁鐵235. . . permanent magnet
236...連接件236. . . Connector
237...頂側237. . . Top side
239...接觸面239. . . Contact surfaces
240...壓力偵測模組240. . . Pressure detection module
242...壓力偵測器242. . . Pressure detector
251...滾珠251. . . Ball
252...孔洞252. . . Hole
253...出液孔253. . . Liquid outlet
D1、D2、D3...方向D1, D2, D3. . . direction
S...密封氣密室S. . . Sealed airtight chamber
圖1為習知一種研磨裝置的示意圖。1 is a schematic view of a conventional polishing apparatus.
圖2是本發明一實施例之一種板體研磨裝置的示意圖。2 is a schematic view of a plate body polishing apparatus according to an embodiment of the present invention.
圖3是圖2之加壓頭的接觸面的示意圖。Figure 3 is a schematic illustration of the contact surface of the pressurizing head of Figure 2.
圖4是圖2之研磨帶的研磨面的示意圖。Figure 4 is a schematic illustration of the abrasive surface of the abrasive belt of Figure 2.
圖5是本發明另一實施例之承載部及其所承載的板體的俯視示意圖。FIG. 5 is a top plan view of a load bearing portion and a plate body carried by the same according to another embodiment of the present invention.
圖6是沿圖5之I-I線的剖面示意圖。Figure 6 is a cross-sectional view taken along line I-I of Figure 5.
60...板體60. . . Plate body
200...板體研磨裝置200. . . Plate grinding device
210...升降平台210. . . Lifting platform
211...承載部211. . . Carrying part
212...平台本體212. . . Platform ontology
213...驅動元件213. . . Drive component
220...研磨模組220. . . Grinding module
221...研磨帶221. . . Grinding tape
222...驅動組件222. . . Drive component
223...研磨面223. . . Grinding surface
224...背面224. . . back
230...加壓模組230. . . Pressurized module
231...加壓頭231. . . Pressurizing head
232...壓力調整組件232. . . Pressure adjustment component
233...腔體233. . . Cavity
234...電磁線圈234. . . Electromagnetic coil
235...永久磁鐵235. . . permanent magnet
236...連接件236. . . Connector
237...頂側237. . . Top side
239...接觸面239. . . Contact surfaces
240...壓力偵測模組240. . . Pressure detection module
242...壓力偵測器242. . . Pressure detector
D3...方向D3. . . direction
S...密封氣密室S. . . Sealed airtight chamber
Claims (15)
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CN201210075020.6A CN102601711B (en) | 2012-03-20 | 2012-03-20 | Board grinding device |
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TWI500477B TWI500477B (en) | 2015-09-21 |
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TWI647061B (en) * | 2015-10-21 | 2019-01-11 | 新加坡商新科宇航有限公司 | A grinding module, a grinding machine and a method for grinding |
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DE102012109071A1 (en) * | 2012-09-26 | 2014-03-27 | Contitech Elastomer-Beschichtungen Gmbh | Grinding process for printing plates in flexo or high pressure area |
CN103612182A (en) * | 2013-11-27 | 2014-03-05 | 苏州道众机械制造有限公司 | Flat belt grinder |
CN105058206A (en) * | 2015-08-07 | 2015-11-18 | 河南鸿昌电子有限公司 | Crystal particle grinding machine |
CN105033821B (en) * | 2015-08-14 | 2017-08-04 | 广州数控设备有限公司 | Position and pressure compensator, method and the sander using the device |
CN105150055B (en) * | 2015-08-27 | 2017-10-10 | 哈尔滨商业大学 | A kind of robot belt grinding machine for large flat class workpiece |
CN105598795B (en) * | 2016-01-29 | 2019-07-26 | 湖州展邦实业有限公司 | A kind of floor sanding device of improvement |
CN106078469B (en) * | 2016-08-01 | 2018-07-27 | 蓝思科技(长沙)有限公司 | A kind of polishing process and its device of the 3D cambered surfaces of ceramic member |
DE102016214568A1 (en) * | 2016-08-05 | 2018-02-08 | Weeke Bohrsysteme Gmbh | Processing device and processing method |
CN108015674B (en) * | 2016-11-04 | 2020-03-31 | 合肥京东方显示技术有限公司 | Grinding device |
CN110788710B (en) * | 2019-10-16 | 2021-02-19 | 中国电子科技集团公司第十一研究所 | Tellurium-zinc-cadmium crystal surface grinding and polishing device |
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CN2033320U (en) * | 1988-03-05 | 1989-03-01 | 重庆大学 | Revolving-stage type plane sandbag grinder with press-grind plate structure |
US5957763A (en) * | 1997-09-19 | 1999-09-28 | Speedfam Corporation | Polishing apparatus with support columns supporting multiple platform members |
JP2001225253A (en) * | 2000-02-16 | 2001-08-21 | Fukuoka Prefecture | Belt sander |
JP4180409B2 (en) * | 2003-03-17 | 2008-11-12 | 株式会社日立ハイテクノロジーズ | Polishing apparatus and magnetic disk manufacturing method using the polishing apparatus |
JP5196709B2 (en) * | 2005-04-19 | 2013-05-15 | 株式会社荏原製作所 | Semiconductor wafer peripheral polishing apparatus and method |
JP2009045679A (en) * | 2007-08-16 | 2009-03-05 | Ebara Corp | Polishing device |
JP5663295B2 (en) * | 2010-01-15 | 2015-02-04 | 株式会社荏原製作所 | Polishing apparatus, polishing method, and pressing member for pressing a polishing tool |
JP5555865B2 (en) * | 2010-02-05 | 2014-07-23 | 株式会社ブイ・テクノロジー | Polishing equipment |
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2012
- 2012-03-20 CN CN201210075020.6A patent/CN102601711B/en not_active Expired - Fee Related
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Cited By (2)
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TWI647061B (en) * | 2015-10-21 | 2019-01-11 | 新加坡商新科宇航有限公司 | A grinding module, a grinding machine and a method for grinding |
US11491606B2 (en) | 2015-10-21 | 2022-11-08 | ST Engineering Aerospace Ltd. | Grinding module, a grinding machine and a method for grinding |
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CN102601711B (en) | 2014-10-08 |
CN102601711A (en) | 2012-07-25 |
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