CN110788710B - Tellurium-zinc-cadmium crystal surface grinding and polishing device - Google Patents
Tellurium-zinc-cadmium crystal surface grinding and polishing device Download PDFInfo
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- CN110788710B CN110788710B CN201910981894.XA CN201910981894A CN110788710B CN 110788710 B CN110788710 B CN 110788710B CN 201910981894 A CN201910981894 A CN 201910981894A CN 110788710 B CN110788710 B CN 110788710B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
- B24B21/02—Machines or devices using grinding or polishing belts; Accessories therefor for grinding rotationally symmetrical surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
- B24B21/18—Accessories
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
- B24B21/18—Accessories
- B24B21/20—Accessories for controlling or adjusting the tracking or the tension of the grinding belt
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/061—Work supports, e.g. adjustable steadies axially supporting turning workpieces, e.g. magnetically, pneumatically
- B24B41/062—Work supports, e.g. adjustable steadies axially supporting turning workpieces, e.g. magnetically, pneumatically between centres; Dogs
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
- B24B47/12—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by mechanical gearing or electric power
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention provides a tellurium-zinc-cadmium crystal surface grinding and polishing device, which is used for solving the problem of low manual grinding efficiency in the process of grinding and polishing the surface of a soft and crisp tellurium-zinc-cadmium crystal ingot. Tellurium zinc cadmium crystal surface grinding and polishing device, including frame, perpendicular and horizontal drive mechanism, crystal centre gripping and rotary mechanism and abrasive band rotary processing mechanism, perpendicular and horizontal drive mechanism and crystal centre gripping and rotary mechanism are fixed in the frame, and abrasive band rotary processing mechanism is fixed in on perpendicular and horizontal drive mechanism through the support frame, wherein: the crystal clamping and rotating mechanism is used for clamping a crystal to be processed and driving the crystal to be processed to rotate at a set speed under the control of the first motor; the vertical and horizontal transmission mechanisms are used for controlling the abrasive belt rotary processing mechanism to move in the horizontal direction and the vertical direction; and the abrasive belt rotating machining mechanism is used for approaching the crystal to be machined under the control of the vertical and horizontal transmission mechanisms, rotating under the control of the second motor and grinding and polishing the surface of the crystal to be machined.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a tellurium-zinc-cadmium crystal surface grinding and polishing device.
Background
During the growth process of the CZT (cadmium zinc telluride) crystal, a quartz ampoule is directly used as a crucible for growth, CdO in the crystal reacts with the surface of the quartz to generate CdSiO3, so that the crystal is adhered to the surface of the quartz, the mechanical stress is increased, and dislocation is propagated. In the later stage of crystal growth, the quartz ampoule can be directly cracked. The common solution is to coat a layer of carbon film on the inner wall of the quartz ampoule. The carbon film coating can prevent reaction, prevent adhesion, reduce contact stress, reduce dislocation and simultaneously block the diffusion of impurity elements into crystals or melts. However, as the solidification process is carried out, the carbon film can be directly attached to the surface of the ingot, and after the ingot is taken out, the surface is in a bright state, so that the crystal forming state of the ingot cannot be directly observed, and the carbon film needs to be removed; in addition, during the growth process, the meteorological transport growth process also exists, which causes the position of the ingot part to present a rough surface and also needs to be polished and removed. The appearance of the quartz crucible for the growth of the tellurium-zinc-cadmium crystal is special, the surface processing is difficult, in addition, the tellurium-zinc-cadmium is easy to crack in the typical soft and brittle material processing process, the manual grinding (polishing) is generally adopted, and the efficiency is low.
Disclosure of Invention
The invention aims to solve the technical problem that the manual grinding efficiency is low in the grinding and polishing process of the surface of a soft and crisp tellurium-zinc-cadmium crystal ingot, and provides a tellurium-zinc-cadmium crystal surface grinding and polishing device.
The invention provides a tellurium-zinc-cadmium crystal surface grinding and polishing device, which comprises a rack, a vertical and horizontal transmission mechanism, a crystal clamping and rotating mechanism and an abrasive belt rotating and processing mechanism, wherein the vertical and horizontal transmission mechanism and the crystal clamping and rotating mechanism are fixed on the rack, the abrasive belt rotating and processing mechanism is fixed on the vertical and horizontal transmission mechanism through a support frame, and the tellurium-zinc-cadmium crystal surface grinding and polishing device comprises a vertical and horizontal transmission mechanism, a crystal clamping and rotating mechanism and an abrasive belt rotating and processing mechanism:
the crystal clamping and rotating mechanism is used for clamping a crystal to be processed and driving the crystal to be processed to rotate at a set speed under the control of a first motor;
the vertical and horizontal transmission mechanisms are used for controlling the abrasive belt rotary processing mechanism to move in the horizontal direction and the vertical direction;
and the abrasive belt rotating and processing mechanism is used for approaching the crystal to be processed under the control of the vertical and horizontal transmission mechanisms, rotating under the control of a second motor and grinding and polishing the surface of the crystal to be processed.
In one embodiment, the crystal clamping and rotating mechanism comprises a three-jaw chuck and a clamping sleeve, the crystal to be processed is placed in the clamping sleeve, the middle lower end of the clamping sleeve is fixed on the three-jaw chuck, and the three-jaw chuck is fixed on the rack.
In one embodiment, the shape of the inner surface of the clamping sleeve is the same as that of the outer surface of the crystal to be processed, and two ends of the clamping sleeve are respectively grooved along the direction parallel to the axis in a plurality of preset angle directions.
In one embodiment, the abrasive belt rotary processing mechanism comprises an abrasive belt and 4 guide wheels, the abrasive belt is mounted on the 4 guide wheels, one of the guide wheels is directly connected with the second motor, the second motor drives the whole abrasive belt to rotate, and the other guide wheel is a tensionable structure.
In one embodiment, a spring, a thimble and a jackscrew structure are arranged in the guide wheel fixing device of the tensionable structure and used for controlling the guide wheel of the tensionable structure to rotate along a preset direction.
In one embodiment, a displacement sensor is arranged on the abrasive belt and is connected with a control circuit;
the displacement sensor is used for detecting the displacement of the abrasive belt rotary machining mechanism in the horizontal direction, sending a control signal to the control circuit according to the displacement of the abrasive belt rotary machining mechanism in the horizontal direction, and the control circuit controls the vertical transmission mechanism and the horizontal transmission mechanism to move in the horizontal direction according to the received control signal, so that the distance between the crystal to be machined and the abrasive belt is kept within a preset range.
In one embodiment, a water tank is arranged below the crystal clamping and rotating device and used for collecting waste water generated by cooling in the crystal grinding and polishing process to be processed.
In one embodiment, the lower end of the three-jaw chuck is provided with at least one groove, and the inside of the water tank is provided with the same number of convex parts, each of which is inserted into a corresponding groove but is not in contact with the three-jaw chuck.
By adopting the technical scheme, the invention at least has the following advantages:
according to the tellurium-zinc-cadmium crystal surface grinding and polishing device, the relative positions of the abrasive belt and the crystal to be processed are adjusted through the vertical transmission mechanism and the horizontal transmission mechanism, so that the abrasive belt and the crystal surface are kept in a contact state, and the crystal to be processed and the abrasive belt rotating and processing mechanism are controlled to rotate through the motor, so that the crystal surface grinding and polishing is realized. In the process, manual participation is not needed, the automation of the tellurium-zinc-cadmium crystal surface grinding and polishing is realized, and the tellurium-zinc-cadmium crystal surface grinding and polishing efficiency is improved.
Drawings
FIG. 1a is a first schematic view of a structure of a CdZnTe crystal surface polishing device according to an embodiment of the present invention;
FIG. 1b is a second schematic view of a structure of a CdZnTe crystal surface polishing device according to an embodiment of the present invention;
FIG. 1c is a schematic view of the installation of the vertical and horizontal transmission mechanisms and the abrasive belt rotary processing mechanism in the structure of the CdZnTe crystal surface polishing device in the embodiment of the present invention;
FIG. 2a is a schematic view of a positive clamp sleeve according to an embodiment of the present invention;
FIG. 2b is a first schematic diagram of a cadmium zinc telluride crystal according to an embodiment of the present invention;
FIG. 2c is a second schematic diagram of a cadmium zinc telluride crystal in accordance with an embodiment of the present invention;
FIG. 2d is a first schematic view of the embodiment of the present invention in a forward clamping state;
FIG. 2e is a second schematic view of the embodiment of the present invention in a forward clamping state;
FIG. 3a is a first schematic view of a reverse clamping sleeve according to an embodiment of the present invention;
FIG. 3b is a second schematic view of the reverse clamping sleeve of the embodiment of the present invention;
FIG. 3c is a schematic cross-sectional view of a head clamp slot according to an embodiment of the present invention;
FIG. 3d is a first schematic view of reverse clamping according to the embodiment of the present invention;
FIG. 3e is a first schematic view of reverse clamping according to the embodiment of the present invention;
FIG. 3f is a third schematic view of reverse clamping according to an embodiment of the present invention;
fig. 4a is a schematic structural view of a belt rotating processing mechanism according to an embodiment of the present invention;
FIG. 4b is a schematic diagram of a tensionable idler of an embodiment of the present invention;
figure 4c shows a schematic view of a belt rotation machining mechanism after installation of a belt according to an embodiment of the present invention;
FIG. 5a is a first schematic view of a displacement sensor in relation to a belt guide wheel mechanism according to an embodiment of the present invention;
FIG. 5b is a second schematic view of a displacement sensor in relation to a belt guide wheel mechanism according to an embodiment of the present invention;
FIG. 5c is a schematic structural diagram of a displacement sensor according to an embodiment of the present invention;
FIG. 6a is a first schematic diagram illustrating adjustment of a sand band during a manufacturing process according to an embodiment of the present invention;
FIG. 6b is a schematic diagram of adjusting the abrasive belt during the processing according to the embodiment of the present invention;
FIG. 6c is a third schematic diagram of the adjustment of the sand band during the processing according to the embodiment of the present invention;
figure 6d is a fourth schematic diagram of abrasive belt adjustment during processing according to an embodiment of the present invention;
FIG. 7 is a schematic diagram of a position adjustment process along the horizontal direction according to an embodiment of the present invention;
FIG. 8a is a first schematic view of a sink mounting structure according to an embodiment of the present invention;
FIG. 8b is a second schematic view of a sink mounting structure according to an embodiment of the present invention;
FIG. 8c is a schematic view of a first configuration of a raised portion of a groove in accordance with an embodiment of the present invention;
FIG. 8d is a diagram illustrating a second structure of the protruding portion of the groove according to the embodiment of the present invention.
Detailed Description
To further explain the technical means and effects of the present invention adopted to achieve the intended purpose, the present invention will be described in detail with reference to the accompanying drawings and preferred embodiments.
It should be noted that the terms "first", "second", and the like in the description and the claims of the embodiments of the present invention and in the drawings described above are used for distinguishing similar objects and not necessarily for describing a particular order or sequence. It will be appreciated that the data so used may be interchanged under appropriate circumstances such that the embodiments described herein may be practiced otherwise than as specifically illustrated or described herein.
Reference herein to "a plurality or a number" means two or more. "and/or" describes the association relationship of the associated objects, meaning that there may be three relationships, e.g., a and/or B, which may mean: a exists alone, A and B exist simultaneously, and B exists alone. The character "/" generally indicates that the former and latter associated objects are in an "or" relationship.
In the embodiment of the invention, the tellurium-zinc-cadmium crystal clamping mechanism is used for clamping a crystal by adopting a softer clamping sleeve and rotating the crystal according to a set speed; the abrasive belt grinding and polishing mechanism starts to approach the outer surface of the crystal according to the set rotating speed for grinding and polishing, and the moving distance, the moving speed and the like along the axial direction of the crystal ingot can be set through programs; the distance between the grinding and polishing abrasive belt and the crystal can be automatically adjusted, and finally the crystal surface grinding and polishing is completed.
The following describes a surface polishing device for a cadmium zinc telluride crystal according to an embodiment of the present invention with reference to specific embodiments.
Fig. 1a is a first schematic view of a structure of a cadmium zinc telluride crystal surface polishing apparatus according to an embodiment of the present invention. The device comprises a rack 11, a vertical and horizontal transmission mechanism 12, a crystal clamping and rotating mechanism 13 and an abrasive belt rotating and processing mechanism 14, wherein the vertical and horizontal transmission mechanism 12 and the crystal clamping and rotating mechanism 13 are fixed on the rack, the abrasive belt rotating and processing mechanism 14 is fixed on the vertical and horizontal transmission mechanism 12 through a support frame, and the abrasive belt rotating and processing mechanism comprises:
the crystal clamping and rotating mechanism 13 is used for clamping a crystal to be processed and driving the crystal to be processed to rotate at a set speed under the control of a first motor;
the vertical and horizontal transmission mechanism 12 is used for controlling the movement of the abrasive belt rotary processing mechanism in the horizontal direction and the vertical direction;
and the abrasive belt rotating and processing mechanism 14 is used for approaching the crystal to be processed under the control of the vertical and horizontal transmission mechanisms 12 and rotating under the control of a second motor to polish the surface of the crystal to be processed.
Fig. 1b is a second schematic view of a structure of a cadmium zinc telluride crystal surface polishing apparatus according to an embodiment of the present invention. Fig. 1c is a schematic view showing the installation of the vertical and horizontal transmission mechanisms and the abrasive belt rotating and processing mechanism in the structure of the surface polishing device for cadmium zinc telluride according to the embodiment of the present invention.
In one embodiment, the vertical and horizontal transmission mechanisms 12 can be controlled by a screw and rail structure. The crystal clamping and rotating mechanism 13 comprises a three-jaw chuck and a clamping sleeve, the crystal to be processed is placed in the clamping sleeve, the lower end of the clamping sleeve is fixed on the three-jaw chuck, and the three-jaw chuck is fixed on the rack 11.
In specific implementation, the crystal clamping and rotating mechanism can adopt a three-jaw chuck to clamp the crystal to be processed, but the soft and brittle material is directly contacted with the chuck and is easy to crack, so that in the embodiment of the invention, the clamping sleeve is additionally arranged between the crystal and the chuck so as to enable the crystal to be stressed uniformly. As shown in fig. 2a, which is a schematic view of the positive clamping sleeve.
Due to the particularity of the shape of the crystal, the upper part and the lower part of the crystal can be processed respectively by adopting a twice processing mode in the embodiment of the invention. FIG. 2b is a first schematic diagram of a cadmium zinc telluride crystal; as shown in fig. 2c, which is a second schematic diagram of a cadmium zinc telluride crystal. When the small end of the crystal faces upward, as shown in fig. 2d, it is the first schematic diagram of forward clamping of the cadmium zinc telluride crystal. Fig. 2e is a second schematic diagram of the forward clamping of the cadmium zinc telluride crystal, wherein fig. 2d shows a schematic diagram of a clamping state of the forward clamping sleeve and the cadmium zinc telluride crystal, and fig. 2e shows a schematic diagram of a state of fixing the clamping sleeve with the cadmium zinc telluride crystal clamped thereon on the three-jaw chuck.
And after the processing is finished, clamping in the opposite direction, and grinding and polishing the other end of the crystal.
In one embodiment, as shown in fig. 3a, which is a first schematic diagram of a reverse clamping state, the shape of the inner surface of the clamping sleeve is the same as the shape of the outer surface of the crystal to be processed, the two ends of the clamping sleeve are respectively grooved along the direction parallel to the axis in a plurality of preset angle directions, and the tellurium-zinc-cadmium crystal can be smoothly placed into the clamping sleeve. Fig. 3b is a second schematic view of the reverse clamping sleeve according to the embodiment of the present invention.
In one embodiment, the gripping sleeve has 6 slotted positions: one end of the clamping sleeve is grooved along the direction of a parallel axis at 0 degrees, 120 degrees and 240 degrees, and when viewed in the cross section direction, as shown in figure 3c, the sectional view of the clamping sleeve is a schematic view, the angles among the three grooves are 120 degrees, the length of the groove is the radius R of the clamping sleeve, and the groove depth exceeds 1/2 of the length of the clamping sleeve in the axial direction. Similarly, the other section is grooved along 60 degrees, 180 degrees and 300 degrees.
In this embodiment, the cadmium zinc telluride crystal can be placed in the slotted clamp and clamped at the lower end by the three-jaw chuck as shown in fig. 3d, which is a first schematic view of the reverse clamp installation, as shown in fig. 3e, which is a second schematic view of the reverse clamp installation, as shown in fig. 3f, which is a third schematic view of the reverse clamp installation. Wherein, in fig. 3d, a schematic view of a clamping state of the reverse clamping sleeve and the tellurium-zinc-cadmium crystal is shown, fig. 3e shows a schematic view of a state that the clamping sleeve clamping the tellurium-zinc-cadmium crystal is fixed on the three-jaw chuck, and fig. 3f shows a schematic view of a state that the upper end of the reverse clamping sleeve is clamped by a throat hoop.
In specific implementation, the abrasive belt rotating processing mechanism 14 includes an abrasive belt and 4 guide wheels, the abrasive belt is mounted on the 4 guide wheels, one of the guide wheels is directly connected to the second motor, the second motor drives the entire abrasive belt to rotate, and the other guide wheel is a tensionable structure. Wherein the second motor speed is adjustable. Fig. 4a is a schematic structural view of a belt rotating machining mechanism.
In the embodiment of the present invention, since the abrasive belt has no elasticity, one of the guide wheels is designed to be in a tensionable state, as shown in fig. 4b, the tensionable guide wheel can rotate in the direction of the arrow, and the guide wheel fixing device is provided with a spring, a thimble and a jackscrew structure for controlling the guide wheel of the tensionable structure to rotate in a preset direction. Specifically, when the guide wheel rotates downwards in the clockwise direction, the ejector pin is pressed back, the spring is compressed to provide reverse acting force, so that the guide wheel tends to rotate in the counterclockwise direction, and the abrasive belt is tensioned. The jackscrew can be screwed in and out, and the prestress of the spring acting on the thimble is adjusted. The rotating machining mechanism of the abrasive belt after the abrasive belt is installed is shown in fig. 4 c.
In order to accurately control the distance between the abrasive belt and the crystal to be processed, in specific implementation, a displacement sensor can be arranged on the abrasive belt and is connected with a control circuit; the displacement sensor is used for detecting the displacement of the abrasive belt rotary machining mechanism in the horizontal direction, sending a control signal to the control circuit according to the displacement of the abrasive belt rotary machining mechanism in the horizontal direction, and the control circuit controls the vertical transmission mechanism and the horizontal transmission mechanism to move in the horizontal direction according to the received control signal, so that the distance between the crystal to be machined and the abrasive belt is kept within a preset range.
Specifically, a displacement sensor can be arranged at the center of the abrasive belt, the sensor is connected to a control circuit by adopting a capacitor or a resistor for signal feedback, and the abrasive belt on the supporting rod of the sensor, which is close to the crystal processing side, is provided with a roller and rotates along with the rotation of the abrasive belt. Fig. 5a shows a first schematic view of a displacement sensor and belt guide wheel mechanism, and fig. 5a shows a second schematic view of a displacement sensor and belt guide wheel mechanism relationship; such as
Fig. 5c is a schematic diagram of the displacement sensor.
In fig. 6a, during the processing of the outer surface of the crystal, the abrasive belt is pressed to one side of the displacement sensor, and the capacitance (or resistance) value of the sensor is kept within a certain range. When the outer diameter of the processed crystal is changed (increased), as shown in fig. 6b, the amplitude of pressing the abrasive belt to the sensor side is increased, and the capacitance (or resistance) value of the sensor is changed. After the processor receives the signal change, the vertical and horizontal transmission mechanisms are adjusted to move in the direction away from the crystal in the horizontal direction (x direction), as shown in fig. 6c, the abrasive belt returns to the original state, the capacitance (resistance) value of the sensor also returns to the preset state, and at this time, the adjustment process is finished, as shown in fig. 6 d. When the outer diameter of the crystal is reduced in the machining process, the device is adjusted in the reverse direction.
In specific implementation, the device judges the position adjustment process along the horizontal direction (x-axis direction) as shown in fig. 7, and in the grinding and polishing process of the crystal to be processed, if the capacitance (resistance) value is detected not to meet the preset range, the adjustment is always carried out until the condition is met, the program execution in the vertical direction (z direction) is carried out, so that the condition that the z direction movement is carried out when the surface of the crystal in the x direction is not processed is avoided, and the rework is avoided.
In the embodiment of the invention, a water tank is additionally arranged outside the crystal clamping and rotating mechanism device and is arranged below the crystal clamping and rotating device and used for collecting waste water generated by cooling in the crystal grinding and polishing process.
In specific implementation, the cooling water is supplied to the crystal polishing position by adjusting the universal bamboo joint pipe with the magnetic gauge stand. Because of the existence of water, the crystal clamping device lower part need design the basin and carry out the collection of waste water, guarantees simultaneously that it does not flow down along the main shaft and lead to the main shaft to rust or the partial short circuit of electrical apparatus, has designed the basin to this device and can effectively realize this function. As shown in fig. 8a and 8b, which are schematic views of the installation structure of the water tank, the center of the water tank is a through hole, and the spindle is connected with the chuck and penetrates through the water tank. Preferably, there is the recess at three-jaw chuck lower extreme, and the inboard bulge in basin inserts in the recess, but not with the chuck contact, and the in-process of polishing, crystal surface waste water flows along the metal disc lower surface, has arrived the recess position after, and waste water can't upwards flow, along with the rotation of chuck and gravity action flow in the waste water tank, reaches the purpose that prevents water inflow main shaft in, waste water in the waste water tank flows along the lower part trompil. FIG. 8b is a schematic view of a first structure of the convex portion of the concave trough according to the embodiment of the present invention; in specific implementation, a plurality of groups of groove and protrusion waterproof structures can be manufactured, as shown in fig. 8c, a better waterproof effect is achieved.
The cadmium zinc telluride surface grinding and polishing device provided by the embodiment of the invention can also be configured with a matched digital control system, and displacement programs of the moving mechanism are vertically and horizontally edited through the input end for processing; after the displacement sensor is used, the x-axis defense line position is automatically adjusted through a program, and the operation difficulty is simplified.
Specifically, in the embodiment of the present invention, the surface of cadmium zinc telluride may be polished according to the following process: fixing the small end of the crystal upwards on the three-jaw chuck → measuring the geometrical parameters of the exposed part of the crystal clamping sleeve → programming → determining the starting position of the x direction and the z direction → starting the cooling water running program to process → disassembling the crystal → fixing the small end of the crystal downwards on the three-jaw chuck → measuring the geometrical parameters of the exposed part of the crystal clamping sleeve → programming → determining the starting position of the x direction and the z direction → starting the cooling water running program to process → finishing the processing.
In specific implementation, the tellurium-zinc-cadmium crystal is fixed in the grinding and polishing process, and the other side of the tellurium-zinc-cadmium crystal is fixed on one side of the crystal and then ground and polished on the other side of the crystal, so that the process is divided into two times, and the outer surfaces of the two sides of the crystal are respectively ground and polished. The outer contour of the cadmium zinc telluride is not equal in diameter and has a diameter-variable area, so that the crystal clamping device needs to be specially designed. This patent can carry out the centre gripping at both ends according to the different centre gripping cover of crystal appearance design to process non-centre gripping position, change the whole surface processing of ingot twice. The crystal rotation speed can be adjusted by a controller in the processing process.
The grinding and polishing process can adopt abrasive belts with different labels for surface processing, the abrasive belts are fixed by adopting a plurality of guide wheels, the motor drives the abrasive belts to move, 1 of the abrasive belt guide wheels can be adjusted, the tension of the abrasive belts can be adjusted, and meanwhile, the abrasive belts can be conveniently detached. The vertical and horizontal transmission mechanisms can be adjusted in the vertical direction (z direction), the relative position of the abrasive belt and the crystal can be adjusted, the abrasive belt can move in the vertical direction at a specified speed, and the abrasive belt stops moving after reaching a specified height. The transmission mechanism can move and adjust in the direction of an x axis (pointing to the crystal), can adjust the contact state of the abrasive belt and the surface of the crystal, and can perform displacement program setting according to the contour of the crystal to process the surface of the crystal ingot. In addition, under the condition that a mechanical sensing mechanism exists at the contact position of the abrasive belt and the crystal, the crystal presses the abrasive belt to cause outward deformation of the abrasive belt, the sensing mechanism can feed back the outward deformation state, the controller adjusts according to a set value and keeps the abrasive belt to be always in contact with the crystal surface according to one state, the setting of an x-direction moving program can be simplified in the process, and single processing of the crystal surface is completed after the z-axis (vertical direction) moves to a specified distance. In specific implementation, abrasive belts with different labels can be used for grinding and polishing according to actual needs, for example, an abrasive belt with smaller roughness can be selected for removing surface materials, and an abrasive belt with larger label can be used for finely grinding and polishing crystal surfaces.
The crystal surface grinding and polishing process needs cooling water medium, so that a water tank is added outside the crystal clamping and rotating device, cooling water is isolated from the spindle through the design of the groove and the protrusion, and the water is isolated from the spindle and the spindle rotating motor. The surface grinding and polishing processing of the cadmium zinc telluride crystal can be completed through the design.
While the invention has been described in connection with specific embodiments thereof, it is to be understood that it is intended by the appended drawings and description that the invention may be embodied in other specific forms without departing from the spirit or scope of the invention.
Claims (6)
1. The tellurium-zinc-cadmium crystal surface grinding and polishing device is characterized by comprising a rack, a vertical and horizontal transmission mechanism, a crystal clamping and rotating mechanism and an abrasive belt rotating and processing mechanism, wherein the vertical and horizontal transmission mechanism and the crystal clamping and rotating mechanism are fixed on the rack, the abrasive belt rotating and processing mechanism is fixed on the vertical and horizontal transmission mechanism through a support frame, and the tellurium-zinc-cadmium crystal surface grinding and polishing device is characterized in that:
the crystal clamping and rotating mechanism is used for clamping a crystal to be processed and driving the crystal to be processed to rotate at a set speed under the control of a first motor;
the vertical and horizontal transmission mechanisms are used for controlling the abrasive belt rotary processing mechanism to move in the horizontal direction and the vertical direction;
the abrasive belt rotating and processing mechanism is used for approaching the crystal to be processed under the control of the vertical and horizontal transmission mechanisms, rotating under the control of a second motor and grinding and polishing the surface of the crystal to be processed;
the abrasive belt rotary machining mechanism comprises an abrasive belt and 4 guide wheels, the abrasive belt is arranged on the 4 guide wheels, one guide wheel is directly connected with the second motor, the whole abrasive belt is driven to rotate under the control of the second motor, and the other guide wheel is of a tension structure;
the guide wheel fixing device with the tension structure is provided with a spring, a thimble and a jackscrew structure, and the spring, the thimble and the jackscrew structure are used for controlling the guide wheel with the tension structure to rotate along a preset direction.
2. The apparatus as claimed in claim 1, wherein the crystal holding and rotating mechanism comprises a three-jaw chuck and a holding sleeve, the crystal to be processed is placed in the holding sleeve, the middle lower end of the holding sleeve is fixed on the three-jaw chuck, and the three-jaw chuck is fixed on the frame.
3. The apparatus as claimed in claim 2, wherein the shape of the inner surface of the clamping sleeve is the same as the shape of the outer surface of the crystal to be processed, and the two ends of the clamping sleeve are respectively grooved along the direction of the parallel axis in a plurality of preset angle directions.
4. The device of claim 1, wherein a displacement sensor is arranged on the abrasive belt and is connected with a control circuit;
the displacement sensor is used for detecting the displacement of the abrasive belt rotary machining mechanism in the horizontal direction, sending a control signal to the control circuit according to the displacement of the abrasive belt rotary machining mechanism in the horizontal direction, and the control circuit controls the vertical transmission mechanism and the horizontal transmission mechanism to move in the horizontal direction according to the received control signal, so that the distance between the crystal to be machined and the abrasive belt is kept within a preset range.
5. The device according to any one of claims 2 to 3, wherein a water tank is arranged below the crystal holding and rotating device and used for collecting waste water generated by cooling in the grinding and polishing process of the crystal to be processed.
6. The device according to claim 5, characterized in that said three-jaw chuck is provided at its lower end with at least one recess, and that said tank is provided inside with the same number of raised portions, each of said raised portions being inserted in a corresponding recess, without coming into contact with said three-jaw chuck.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910981894.XA CN110788710B (en) | 2019-10-16 | 2019-10-16 | Tellurium-zinc-cadmium crystal surface grinding and polishing device |
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| CN115816264B (en) * | 2022-12-20 | 2023-07-28 | 杭州天桴光电技术有限公司 | Rapid polishing device for cylindrical end face of fluoride crystal ingot |
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| JP5864920B2 (en) * | 2010-12-20 | 2016-02-17 | キヤノン株式会社 | Manufacturing method of diffraction grating |
| CN202356896U (en) * | 2011-11-18 | 2012-08-01 | 安徽鑫龙电器股份有限公司 | Elastic workpiece chuck for turning-lathe threading die machining |
| CN202367571U (en) * | 2011-12-10 | 2012-08-08 | 江苏晶宝光电科技有限公司 | Crystal bar spheronization machine |
| CN102601711B (en) * | 2012-03-20 | 2014-10-08 | 友达光电（苏州）有限公司 | Board grinding device |
| CN103659531B (en) * | 2012-09-21 | 2017-12-08 | 陈松涛 | A kind of outer surface of steel tube grinding system |
| CN103522151B (en) * | 2013-10-31 | 2016-03-02 | 吉林大学 | A kind of pressure controllable abrasive belt tool system for blade grinding and polishing |
| CN105583643A (en) * | 2014-10-23 | 2016-05-18 | 富鼎电子科技(嘉善)有限公司 | Tool clamping device and elastic collet chuck adopted by tool clamping device |
| CN104440474B (en) * | 2014-11-28 | 2017-01-04 | 西安交通大学 | A kind of self adaptation repaiies type blade abrasive band polishing and grinding lathe |
| CN106271986A (en) * | 2015-05-25 | 2017-01-04 | 天津世创机械制造有限公司 | A kind of novel plane sanding and polishing machine |
| CN105415102A (en) * | 2015-12-01 | 2016-03-23 | 中国科学院上海技术物理研究所 | Method for grinding and polishing CdZnTe wafer without wax |
| JP2017148931A (en) * | 2016-02-19 | 2017-08-31 | 株式会社荏原製作所 | Polishing device and polishing method |
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