CN102601711B - Plate polishing apparatus - Google Patents

Plate polishing apparatus Download PDF

Info

Publication number
CN102601711B
CN102601711B CN 201210075020 CN201210075020A CN102601711B CN 102601711 B CN102601711 B CN 102601711B CN 201210075020 CN201210075020 CN 201210075020 CN 201210075020 A CN201210075020 A CN 201210075020A CN 102601711 B CN102601711 B CN 102601711B
Authority
CN
China
Prior art keywords
polishing
pressure
plate
surface
pressing
Prior art date
Application number
CN 201210075020
Other languages
Chinese (zh)
Other versions
CN102601711A (en
Inventor
李建翔
Original Assignee
友达光电(苏州)有限公司
友达光电股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 友达光电(苏州)有限公司, 友达光电股份有限公司 filed Critical 友达光电(苏州)有限公司
Priority to CN 201210075020 priority Critical patent/CN102601711B/en
Publication of CN102601711A publication Critical patent/CN102601711A/en
Application granted granted Critical
Publication of CN102601711B publication Critical patent/CN102601711B/en

Links

Abstract

一种板体研磨装置,包括升降平台、研磨模块及加压模块。 A board-body polishing apparatus, comprising a lifting platform, and a pressure module polishing module. 研磨模块与升降平台的承载部相对且包括研磨带与驱动组件。 Polishing module carrier portion relative to the lifting platform and comprises a polishing tape and the drive assembly. 驱动组件连接研磨带以驱使研磨带转动。 Polishing tape drive assembly connected to drive the rotation of the polishing belt. 加压模块包括加压头与压力调整组件。 Pressing module comprises a pressing head pressure adjustment assembly. 加压头适于移动而接触在升降平台与加压头间的部分研磨带的背面。 The pressing head adapted to move into contact with the back surface of the polishing portion between the lifting platform and the pressing head. 压力调整组件连接加压头并适于移动加压头。 Head pressing pressure adjusting assembly is coupled and adapted to move the pressing heads. 压力调整组件包括腔体、电磁线圈、永久磁铁及连接件,永久磁铁可移动地设置于电磁线圈与腔体顶侧间。 Pressure adjustment assembly includes a cavity, an electromagnetic coil, permanent magnets and the connecting member, the permanent magnet may be movably disposed in the cavity between the electromagnetic coil and the top side. 电磁线圈固定于腔体,并位于加压头与永久磁铁间。 The electromagnetic coil is fixed to the cavity and located between the pressing head and the permanent magnet. 连接件连接于永久磁铁与加压头。 Connecting member connecting the permanent magnet and the pressing head. 所述板体研磨装置可精准控制研磨厚度。 The plate polishing apparatus can accurately control the grinding thickness. 本发明还提出另一可降低维护成本的板体研磨装置。 The present invention also provides another polishing apparatus plate can be reduced maintenance costs.

Description

板体研磨装置 Plate polishing apparatus

技术领域 FIELD

[0001] 本发明是有关于一种研磨装置,且特别是有关于一种板体研磨装置。 [0001] The present invention relates to a polishing apparatus, and more particularly relates to a polishing plate means.

背景技术 Background technique

[0002] 随着平面显示技术的进步,各种平面显示面板已被广泛应用于日常生活中常见的电子产品,如电视、计算机、行动电话、卫星导航装置等。 [0002] As the plane display technology, a variety of flat panel display has been widely used in daily life of common electronic products, such as televisions, computers, mobile phones, satellite navigation devices.

[0003] 在制作平面显示面板的过程中,需要对平面显示面板的表面进行研磨清洁,而现有的研磨装置如图1所示。 [0003] In the production process of the flat display panel, the need for abrasive cleaning of the surface of the flat display panel, the conventional polishing apparatus shown in Fig. 现有研磨装置100包括驱动件110以驱使移动平台120沿水平方向D1左右移动,而移动平台120上设有研磨布130。 Conventional polishing apparatus 100 includes a driving member 110 in order to drive mobile platform 120 moves in a horizontal direction D1 left, and with the polishing cloth 130 on the platform 120 moves. 此外,研磨装置100更包括气缸140 以及研磨头150,研磨头150用以吸附平面显示面板50,而气缸140连接研磨头150,以驱使研磨头150沿垂直方向D2上下移动。 Further, the polishing apparatus 100 further comprises a cylinder 140 and a polishing head 150, the polishing head 150 for adsorbing the flat display panel 50, and the polishing head 150 connected to the cylinder 140 to drive the polishing head 150 moves up and down in the vertical direction D2. 当要进行研磨的步骤时,气缸140驱使研磨头150向下移动,以使平面显示面板50接触研磨布130,而驱动件110驱使移动平台120左右移动, 以对平面显示面板50的表面进行研磨。 When the step of grinding to be performed, the polishing head 150 is driven by the cylinder 140 is moved downward, so that the flat display panel 50 contacts the polishing cloth 130, and the driver 110 drives the moving platform 120 moves about, a surface of the flat display panel 50 is polished .

[0004] 现有技术中,在研磨时气缸140的上升压不稳定,且容易产生漏气的情形,导致研磨清洁的效果变差。 [0004] In the prior art, an unstable pressure rise during polishing cylinder 140, and the case where air leakage is likely to occur, resulting in deterioration of the effect of cleaning the polishing. 此外,研磨厚度不易精准掌控,容易出现表面刮伤或损坏平面显示面板50的情形。 Further, the polishing is not easy to precisely control the thickness, surface scratches or damage the case of the flat display panel 50 easily occurs.

发明内容 SUMMARY

[0005] 有鉴于此,本发明提供一种板体研磨装置,以精准控制研磨厚度。 [0005] Accordingly, the present invention provides a plate polishing apparatus to precisely control the grinding thickness.

[0006] 本发明另提供一种板体研磨装置,以降低维护成本。 [0006] The present invention further provides a polishing plate means to reduce maintenance costs.

[0007] 为达上述优点至少其中之一,本发明提出一种板体研磨装置,包括升降平台、研磨模块以及加压模块。 [0007] In order to achieve the advantages described above wherein at least one of, the present invention provides a plate polishing apparatus including lifting platform, the polishing module and a pressure module. 升降平台具有承载部,研磨模块与承载部相对,且研磨模块包括研磨带与驱动组件。 Lifting platform has a support portion, the bearing portion opposite the grinding module, and the module comprises a polishing abrasive belt drive assembly. 研磨带具有相对的研磨面与背面,而驱动组件连接研磨带,以驱使研磨带转动。 Polishing tape having a polishing surface opposite to the back surface, and the polishing tape drive assembly connected to drive the rotation of the polishing belt. 加压模块包括加压头与压力调整组件。 Pressing module comprises a pressing head pressure adjustment assembly. 加压头适于移动而接触至位于升降平台与加压头之间的部分研磨带的背面,而压力调整组件连接加压头,并适于移动加压头以调整加压头施加于研磨带的压力。 Moving the pressing head is adapted to contact the back portion of the lifting platform between the polishing tape and the pressing head, the pressing head pressure adjustment assembly is connected, and the pressing head adapted to move the head to adjust the pressure applied to the polishing tape pressure. 压力调整组件包括腔体、电磁线圈、永久磁铁以及连接件,腔体具有远离加压头的顶侧,永久磁铁可移动地设置于电磁线圈与顶侧之间,且永久磁铁与顶侧之间形成密封气密室。 Pressure adjustment assembly includes a cavity, an electromagnetic coil, a permanent magnet and a connecting member, the cavity having a top side remote from the pressing head, the permanent magnet is movably disposed between the electromagnetic coil and the top side, and between the permanent magnet and the top side forming a seal gas chamber. 电磁线圈固定于腔体,并位于加压头与永久磁铁之间,而连接件连接于永久磁铁与加压头。 The electromagnetic coil is fixed to the cavity, and positioned between the pressing head and the permanent magnet, the permanent magnet is connected to the connecting member and the pressing head.

[0008] 在本发明的一实施例中,上述的板体研磨装置更包括配置于承载部的压力侦测模块,而压力调整组件更包括电性连接至压力侦测模块与电磁线圈的控制单元。 [0008] In an embodiment of the present invention, the above-described polishing apparatus further comprises a plate disposed in a pressure bearing portion of the detection module, the pressure adjustment assembly further comprises a control unit electrically connected to the pressure detecting module and the solenoid .

[0009] 在本发明的一实施例中,上述的研磨面为粗糙面。 [0009] In an embodiment of the present invention, the above-described polished surface is a rough surface.

[0010] 在本发明的一实施例中,上述的加压模块更包括多个滚珠,设置于加压头内,且加压头包括接触面用于接触研磨带,接触面上设有多个孔洞,滚珠分别经由孔洞伸出接触面外以接触研磨带。 [0010] In an embodiment of the present invention, the above-described pressurized module further comprises a plurality of balls disposed in the pressing head, the pressing head and includes a contact surface for contacting the polishing belt, the contact surface provided with a plurality of holes, the balls are projected via the contact holes to contact the outer surface of the polishing belt.

[0011] 在本发明的一实施例中,上述的加压头包括接触面用于接触研磨带,接触面设有多个出液孔,研磨带设有多个贯孔,贯孔从研磨面延伸至背面。 [0011] In an embodiment of the present invention, the above-described pressing head comprises a contact surface for contacting the polishing belt, the contact surface provided with a plurality of outlet hole, the polishing belt is provided with a plurality of through holes, the through hole from the polishing surface extending to the back.

[0012] 在本发明的一实施例中,上述的驱动组件包括滚轮组。 [0012] In an embodiment of the present invention, the above-described drive assembly includes a roller set.

[0013] 在本发明的一实施例中,上述的承载部包括第一承载面与位于第一承载面边缘的第二承载面,第一承载面与加压头之间的距离不同于第二承载面与加压头之间的距离。 [0013] In an embodiment of the present invention, the aforementioned bearing portion includes a first bearing surface and second bearing surface located at a first edge of the carrying surface, the distance between the first bearing surface is different from a second pressing heads the distance between the bearing surface and the pressing head.

[0014] 在本发明的一实施例中,上述的升降平台包括平台本体与驱动元件。 [0014] In an embodiment of the present invention, said lifting platform including a platform body and the drive member. 平台本体具有承载部,而驱动元件连接平台本体,以驱使平台本体朝接近或远离研磨模块的方向移动。 Platform body has a support portion and the drive element connected to the body platform, the platform body to urge toward a direction close to or away from the polishing module movement.

[0015] 为达上述优点至少其中之一,本发明另提出一种板体研磨装置,其包括升降平台、 研磨模块以及加压模块。 [0015] In order to achieve the advantages described above wherein at least one of, the present invention further provides a polishing plate means, which comprises a lifting platform, the polishing module and a pressure module. 升降平台具有承载部,而研磨模块与承载部相对。 Lifting platform has a support portion, and the grinding module relative to the carrier portion. 研磨模块包括研磨带及驱动组件。 Grinding and polishing tape module includes a drive assembly. 研磨带具有相对的研磨面与背面。 Polishing tape having a polishing surface opposite to the back surface. 驱动组件连接研磨带,以驱使研磨带转动。 Polishing tape drive assembly connected to drive the rotation of the polishing belt. 加压模块包括加压头、多个滚珠以及压力调整组件。 Pressing module comprises a pressing head, a plurality of balls and a pressure adjustment assembly. 加压头适于移动而接触至升降平台与加压头之间的部分研磨带的背面。 The pressing head adapted to be moved to the back contact portion between the polishing tape and the pressing head lifting platform. 滚珠设置于加压头内,且加压头包括接触面用于接触研磨带,接触面上设有多个孔洞,滚珠分别经由孔洞伸出接触面外以接触研磨带。 A ball disposed within the pressure head and the pressing head comprises a contact surface for contacting the polishing belt, the contact surface provided with a plurality of holes, the balls are projected via the contact holes to contact the outer surface of the polishing belt. 压力调整组件连接加压头,并适于移动加压头以调整加压头施加于研磨带的压力。 Head pressing pressure adjusting assembly is connected, and the pressing head adapted to move the head to adjust the pressing pressure applied to the polishing tape.

[0016] 本发明一实施例的板体研磨装置中,板体设置于升降平台上,并通过加压模块将研磨带加压至板体,以对板体进行研磨,而这样的方式有助于精准控制研磨厚度。 [0016] plate of the polishing apparatus of an embodiment of the present invention, the plate is provided on the lifting platform, and the module by pressing the polishing tape to the pressing plate to be polished plate, and in such a way to help precise control in grinding thickness. 此外,本发明另一实施例的板体研磨装置中,因加压头内设有滚珠以减少研磨带与加压头的之间的摩擦力,所以能延长研磨带的使用寿命,以降低维护成本。 Further, the plate body polishing apparatus according to another embodiment of the present invention, since the pressing head equipped with a ball to reduce friction between the polishing tape and the pressing head, it is possible to extend the life of the polishing tape, to reduce maintenance cost.

[0017] 上述说明仅是本发明技术方案的概述,为了能够更清楚了解本发明的技术手段, 而可依照说明书的内容予以实施,并且为了让本发明的上述和其它目的、特征和优点能够更明显易懂,以下特举较佳实施例,并配合附图,详细说明如下。 [0017] The above description is only an overview of the technical solution of the present invention, in order to more fully understood from the present invention, but may be implemented in accordance with the contents of the specification, and in order to make the aforementioned and other objects, features and advantages of the present invention can be more apparent from the following Patent cited preferred embodiments accompanied with figures are described in detail below.

附图说明 BRIEF DESCRIPTION

[0018] 图1为现有一种研磨装置的示意图。 [0018] FIG. 1 is a schematic view of conventional a polishing apparatus.

[0019] 图2是本发明一实施例的一种板体研磨装置的示意图。 [0019] FIG. 2 is a schematic diagram of a plate body polishing apparatus according to an embodiment of the present invention.

[0020] 图3是图2的加压头的接触面的示意图。 [0020] FIG. 3 is a schematic diagram of a contact surface of the pressing head of FIG. 2.

[0021] 图4是图2的研磨带的研磨面的示意图。 [0021] FIG. 4 is a schematic diagram of the polishing surface of the polishing tape 2 FIG.

[0022] 图5是本发明另一实施例的承载部及其所承载的板体的俯视示意图。 [0022] FIG. 5 is a schematic top view of the carrier portion of the embodiment of the plate and carried to another embodiment of the present invention.

[0023] 图6是沿图5的I-Ι线的剖面示意图。 [0023] FIG. 6 is a cross-sectional view taken along the line I-Ι FIG. 5.

具体实施方式 Detailed ways

[0024]为更进一步阐述本发明为达成预定发明目的所采取的技术手段及功效,以下结合附图及较佳实施例,对依据本发明提出的板体研磨装置的具体实施方式、结构、特征及功效,详细说明如后。 [0024] To further elaborate the technical means and effects the present invention is predetermined to achieve the object of the invention taken in conjunction with the accompanying drawings and the following preferred embodiments, the plate of the polishing apparatus according to the present invention provides a specific embodiment, the structure, characterized in and effectiveness, as will be described in detail.

[0025]图2是本发明一实施例的一种板体研磨装置的示意图。 [0025] FIG. 2 is a schematic diagram of a plate body polishing apparatus according to an embodiment of the present invention. 请参照图2,本实施例的板体研磨装置200包括升降平台210、研磨模块220以及加压模块230,其中升降平台210具有承载部211以承载板体60,而研磨模块220与承载部211相对。 Referring to FIG. 2, the polishing plate 200 of this embodiment includes an elevator platform 210 of the polishing module 220 and the pressurizing block 230, wherein the lifting platform 210 has a support portion 211 to the carrier plate 60 while polishing module 220 and the carrier portion 211 relatively. 此升降平台210例如包括平台本体212与驱动元件213。 This lifting platform 210 includes a platform body 212, for example, the drive member 213. 上述的承载部211属于平台本体212,而驱动元件213连接平台本体212。 Bearing portion 211 above the platform belonging to body 212, and the drive member 213 connected to the platform body 212. 驱动元件213例如是马达,其用以驱使平台本体212沿方向D3移动以接近或远离研磨模块220。 The drive element 213, for example, a motor for driving the platform body 212 to move in the direction D3 toward or away from the polishing module 220. 板体60例如为显示面板、玻璃基板等元件,但不限于此。 Plate element 60, for example, a display panel, a glass substrate or the like, but is not limited thereto.

[0026] 研磨模块220包括研磨带221与驱动组件222。 [0026] The polishing module 220 includes drive assembly 221 and the polishing belt 222. 研磨带221具有相对的研磨面223 与背面224,研磨面223例如为粗糙面,且位在承载部211与加压模块230之间的部分研磨面223面对承载部211。 Polishing tape having a polishing surface 221 and back surface 224 opposite to 223, for example, polishing surface 223 is a rough surface, and the bit in the portion between the polishing surface 230 bearing portion 211 and the pressing portion 211 facing the supporting module 223. 驱动组件222连接研磨带221,以驱使研磨带221转动。 The drive assembly 222 is connected to the polishing belt 221, to drive the polishing belt 221 is rotated. 本实施例的驱动组件222例如包括滚轮组222,而滚轮组222转动时可带动研磨带221转动。 The drive assembly 222 of the present embodiment includes, for example roller assembly 222, the roller assembly 222 may be rotated to drive the polishing belt 221 rotates.

[0027] 加压模块230包括加压头231与压力调整组件232。 [0027] The pressurized module 230 includes a pressing head 231 and a pressure adjustment assembly 232. 加压头231适于移动而接触至位于升降平台211与加压头231之间的部分研磨带221的背面224,而压力调整组件232 连接加压头231,并适于移动加压头231以调整加压头231施加于研磨带221的压力。 The pressing head 231 is adapted to move into contact with the lifting platform 211 between the pressing head portion 231 with the back surface grinding 224,221, and 232 connected to the pressure adjustment unit 231 pressing head, the pressing head 231 and adapted to move in adjusting the pressure applied to the polishing head 231 with a pressure of 221.

[0028] 在本实施例中,当要对板体60进行研磨时,通过驱动组件222驱动研磨带221转动,并通过驱动元件213驱使平台本体212沿着方向B3朝接近研磨模块220的方向移动,使板体60接触研磨带221的研磨面223或是与研磨带221的研磨面223保持适当间距。 [0028] In the present embodiment, when the plate body 60 to be polished, the polishing by the drive assembly 222 drive belt 221 is rotated and driven by the driving element 213 moves the platform body 212 B3 direction approaching the grinding module 220 along the direction polished surface, so that plate 60 contacts the polishing tape 221 or 223 and the polishing surface 221 of polishing tape 223 to maintain proper spacing. 接着,通过压力调整组件232使加压头231施加压力于研磨带221,以使研磨带221对板体60 的表面进行研磨。 Subsequently, the pressing head 232 by the pressure adjustment unit 231 applies pressure to the polishing tape 221, so that the polishing surface 221 with a pair of plates 60 are polished.

[0029] 有别于现有技术,本实施例的板体研磨装置200在设计上是通过升降平台210来承载板体60,并通过加压模块230将研磨带221加压至板体60以对板体60进行研磨。 [0029] Unlike the prior art, the plate polishing device 200 of the present embodiment is designed to carry the plate member 60 by the lift platform 210, the module 230 by pressing the polishing tape 221 to the pressure plate 60 of the plate 60 is polished. 升降平台210的驱动元件213可准确控制平台本体212上升的高度,有助于精准控制研磨厚度。 The drive member 210 lifting platform 213 of platform body 212 can accurately control the height of rise helps precise control grinding thickness. 此外,为了更精准控制研磨厚度,升降平台210的驱动元件213可配合用以感测板体60 位置的高度传感器(图未示)来控制平台本体212上升的高度。 Further, in order to more precisely control the thickness of the polishing, the driving element 213 of the lifting platform 210 can be used with a height sensor (not shown) to sense the position of plate 60 of the platform body 212 to control the height of rise.

[0030] 为了更精准且稳定地控制施加于研磨带221的压力,本实施例所选用的压力调整组件232例如包括腔体233、电磁线圈234、永久磁铁235以及连接件236。 [0030] For a more precise and stable control of the pressure applied to the polishing belt 221, in this embodiment chosen, for example, pressure regulating assembly 232 includes a cavity 233, a solenoid 234, a permanent magnet 235 and a connecting member 236. 腔体233具有远离加压头231的顶侧237,永久磁铁235可移动地设置于电磁线圈234与顶侧237之间, 且永久磁铁235与顶侧237之间形成密封气密室S。 233 having a cavity 231 away from the top side of the pressing head 237, the permanent magnet 235 is movably disposed between the electromagnetic coil 234 and the top side 237, and 237 form a seal between the gas chamber and the top side of the permanent magnet 235 S. 此密封气密室S内的气压例如为可调整。 This sealing gas pressure within the gas chamber S, for example, adjustable. 电磁线圈234固定于腔体233,并位于加压头231与永久磁铁235之间,而连接件236 例如是穿过电磁线圈234并连接于永久磁铁235与加压头231。 The electromagnetic coil 234 is fixed to the cavity 233, and is located between the pressing head 231 and the permanent magnets 235, 236 are connected, for example, through the electromagnetic coil 234 and the permanent magnet 235 and is connected to the pressing head 231.

[0031] 通过控制通入电磁线圈234的电流方向及强弱,使电磁线圈234与永久磁铁235 之间产生排斥力,且此排斥力恰可支撑永久磁铁235、连接件236与加压头231。 [0031] By controlling the current direction through the electromagnetic coil 234 and the strength of the electromagnetic coil 234 and the permanent magnet 235 is generated between the repulsive force, and this may be supported just repulsive force of the permanent magnet 235, connecting member 236 and the pressing head 231 . 并且,通过控制密封气密室S内的气压可驱使永久磁铁235向下移动,并带动连接件236与加压头231 移动,藉以调整加压头231施加于研磨带221的压力。 Further, by controlling the air pressure within the sealing chamber S can drive a permanent magnet 235 is moved downward, bringing the coupling member 236 and moves with the pressing head 231, 231 so as to adjust the pressure applied to the polishing head 221 with pressure. 有别于现有技术,本实施例所选用的压力调整组件232可采用磁力混用压力缸的方式来驱使加压头231移动,所以能较为精准且稳定地控制加压头231施加于研磨带221的压力,以避免研磨效果不佳或损伤板体60的情形。 Unlike the prior art, for example, the choice of the pressure adjustment unit 232 of the present embodiment can be mixed magnetic embodiment of the pressure cylinder to drive the pressing head 231 moves, it is possible to more precise and stable control of the pressing head 231 is applied to the polishing tape 221 pressure to prevent damage to the case of poor or polishing effect of the plate 60.

[0032] 需说明的是,本发明并不限定压力调整组件232的驱动方式。 [0032] It should be noted that the present invention is not limited to the pressure adjusting assembly 232 drive. 在另一实施例中,也可通过电磁线圈234与永久磁铁235之间产生的超距力来驱使永久磁铁235移动,而连接件236与加压头231则随着永久磁铁235移动。 Embodiment, may also be generated by the electromagnetic coil 234 and between the permanent magnet 235 in a further embodiment of a distance to the drive force of the permanent magnet 235 moves, the connecting member 236 and the pressing head 231 moves with the permanent magnet 235. 更详细地说,可仅通过控制通入电磁线圈234的电流的方向与强弱来调整电磁线圈234所产生的磁力的方向与强弱,以使电磁线圈234与永久磁铁235之间产生适当的吸引力或排斥力,从而控制永久磁铁235的移动方向, 以调整加压头231施加在研磨带221的压力。 More specifically, to adjust the magnetic force generated by the electromagnetic coil 234 can be controlled only by the strength and direction of the current passed through the electromagnetic coil 234 and the strength direction, to the electromagnetic coil 234 is generated between the permanent magnet 235 suitable with attractive or repulsive force, thereby controlling the movement direction of the permanent magnets 235, 231 to adjust the pressure applied to the pressing head 221 of the polishing tape. 在其它实施例中,也可选用其它的压力调整组件来取代上述的压力调整组件232。 In further embodiments, pressure can also be used to adjust the other components instead of the pressure adjustment assembly 232.

[0033] 此外,板体研磨装置200可进一步包括配置于承载部211的压力侦测模块240,而压力调整组件230更包括电性连接至压力侦测模块240与电磁线圈234的控制单元(图未示)。 [0033] Further, the polishing plate 200 may further include means disposed on the supporting portion 240 of the pressure detecting module 211, and a pressure adjustment assembly 230 further comprises electrically connected to the pressure detecting module 240 and the solenoid control unit 234 (FIG. not shown). 压力侦测模块240例如包括多个压力侦测器242,其用以感测压力,而控制单元可根据压力侦测模块240的感测结果来控制通入电磁线圈234的电流的强弱与方向或是调整密封气密室S内的气压,以更准确且稳定地控制加压头231施加于研磨带221的压力。 Pressure detection module 240 comprises a plurality of, for example, a pressure detector 242 for measuring the pressure sense, and the control unit may control the intensity and direction of the current through the electromagnetic coil 234 according to the sensing result of the pressure detection module 240 or adjust air pressure within the sealed gas-tight chamber S, a more accurate and stable control of the pressing head 231 applies pressure to the polishing tape 221.

[0034] 图3是图2的加压头的接触面的示意图。 [0034] FIG. 3 is a schematic diagram of a contact surface of the pressing head of FIG. 2. 请参照图2与图3,为了减低加压头231 的接触面239与其所接触的研磨带221之间的摩擦力,加压模块230可更包括设置于加压头231内的多个滚珠251,且加压头231的接触面239上可设有多个孔洞252,这些滚珠251 分别经由孔洞252伸出接触面239外以接触研磨带221。 Referring to Figures 2 and 3, in order to reduce the contact surface 231 of the pressing heads 239 and 221 the frictional force between the abrasive tape in contact therewith, the pressurized module 230 may further comprise a plurality of balls 251 disposed in the pressurizing head 231 and the pressing head 231 on the contact surface 239 may be provided with a plurality of holes 252, the balls 251 are extended through holes 252 to contact the outer contacting surface 239 of the polishing tape 221. 如此,可降低研磨带221转动的阻力并提升研磨带221的使用寿命,进而降低板体研磨装置200的维护成本。 Thus, the resistance can be reduced and the polishing belt 221 is rotated to enhance the life of the polishing belt 221, thereby reducing maintenance costs of the polishing apparatus 200 of the plate.

[0035] 图4是图2的研磨带的研磨面的示意图。 [0035] FIG. 4 is a schematic diagram of the polishing surface of the polishing tape 2 FIG. 请参照图2至图4,为了提升清洁板体60的效果,可使清洁液(如水)经由加压头231流至研磨带221的研磨面223。 Referring to FIG. 2 to FIG. 4, in order to enhance the cleaning effect of the plate body 60, allows the cleaning liquid (e.g., water) flows to the polishing tape via the polishing surface 221 of the pressing heads 223 231. 具体而言, 加压头231的接触面239可设有多个出液孔253,加压头231的其它表面(如与接触面239 相对的表面)例如设有入液口,以供注入清洁液。 Specifically, the pressing head 231 may be provided with a plurality of contact surfaces 239 outlet hole 253, pressing the other surface of the head 231 (e.g., a surface opposite to the contact surface 239) is provided with a liquid inlet, for example, for injecting clean liquid. 此外,研磨带221设有多个贯孔225,贯孔225从研磨面223延伸至背面224,如此从出液孔253流出的清洁液可经由贯孔225流至研磨面223与板体60之间。 Further, the polishing tape 221 is provided with a plurality of through holes 225, 225 through hole 223 extending from the polishing surface to the back surface 224, so the cleaning liquid flowing out of the liquid inlet 253 can be a polished surface 223 of the plate member 60 via the through hole 225 to flow from the between.

[0036] 图5是本发明另一实施例的承载部及其所承载的板体的俯视示意图,而图6是沿图5的I-Ι线的剖面示意图。 [0036] FIG. 5 is a schematic top view of the carrier portion of the embodiment of the plate and carried to another embodiment of the present invention, and FIG. 6 is a schematic cross-sectional view taken along the line I-Ι FIG. 5. 请参照图5与图6,在板体非均厚的实施例中,承载部的承载面可设计成与板体的形状相配合。 Referring to FIG 5 and FIG 6, in the embodiment of the non-flat plate thickness, the load bearing surface portion can be designed to mate with the shape of the plate member. 举例来说,当承载部211a用以承载板体60a(如显示面板)时,由于板体60a包括基板61与基板62,且基板61突出于基板62之外,为了承载基板61的突出于基板62的部分,承载部211a可被设计成包括第一承载面214与位于第一承载面214边缘的第二承载面215。 For example, when the bearing portion 211a for supporting the plate member 60a (display panel), since the plate member 60a and the substrate 62 includes a substrate 61, and the substrate 61 protrudes beyond the base plate 62, the carrier substrate 61 in order to protrude the substrate portion 62, bearing portion 211a may be designed to include a first bearing surface 214 and second bearing surface 214 located on the edge of the first bearing surface 215. 第一承载面215与图2所示的加压头231之间的距离不同于第二承载面215与加压头231之间的距离。 The distance between the pressing heads 231 and 215 shown in FIG 2 is different from the distance between the first bearing surface 215 of the pressing head 231 and the second bearing surface. 第一承载面215用以承载基板62,而第二承载面215例如是高于第一承载面214,以承载基板61的突出于基板62的部分,如此能避免板体60a受到压力时产生歪斜的情形,所以能均匀地研磨基板61的表面63。 The first supporting surface 215 for supporting a substrate 62, while the second bearing surface 215, for example, higher than the first bearing surface 214 to the carrier substrate 61 on the substrate 62 protruding portion, thus making it possible to avoid distortion when subjected to pressure plate 60a case, it is possible to uniformly polished surface 63 of the substrate 61.

[0037] 综上所述,在本发明的板体研磨装置中,板体设置于升降平台上,并通过加压模块将研磨带加压至板体,以对板体进行研磨。 [0037] As described above, in the apparatus according to the present invention, the polishing plate, the plate disposed on the lifting platform, and the module by pressing the polishing tape to the pressing plate to be polished on the plate. 由于升降平台的驱动元件可准确控制平台本体上升的高度,此有助于精准控制研磨厚度。 Since the driving element of the lifting platform can accurately control the height of the platform body rises, this helps to precisely control the grinding thickness. 此外,在一实施例的板体研磨装置中,因加压头内设有滚珠以减少研磨带与加压头的之间的摩擦力,所以能延长研磨带的使用寿命,以降低板体研磨装置的维护成本。 Further, in a plate body polishing apparatus of the embodiment, because the pressing head equipped with a ball to reduce friction between the polishing tape and the pressing head, it is possible to extend the life of the polishing tape, the polishing plate to reduce the maintenance cost of the device. 另外,有别于现有技术单纯使用气缸驱动的方式,在压力调整组件包括腔体、电磁线圈、永久磁铁以及连接件的实施例中,可采用磁力混用压力缸的方式来驱动加压头,所以能更精准且稳定地控制加压头施加于研磨带的压力。 Further, unlike the prior art in a simple manner using the air cylinder, the adjustment assembly includes a cavity mode, an electromagnetic coil, a permanent magnet and a connecting element embodiment, the magnetic force may be employed to mix the driving cylinder head pressing pressure, it is possible to more precisely and stably control the pressing pressure applied to the polishing head band.

[0038] 以上所述,仅是本发明的较佳实施例而已,并非对本发明作任何形式上的限制,虽然本发明已以较佳实施例揭露如上,然而并非用以限定本发明,任何熟悉本专业的技术人员,在不脱离本发明技术方案范围内,当可利用上述揭示的技术内容作出些许更动或修饰为等同变化的等效实施例,但凡是未脱离本发明技术方案内容,依据本发明的技术实质对以上实施例所作的任何简单修改、等同变化与修饰,均仍属于本发明技术方案的范围内。 [0038] The above are only preferred embodiments of the present invention only, not limitation of the present invention in any form, although the invention has been disclosed above by the preferred embodiments, but not intended to limit the present invention, anyone familiar with Those skilled in the art, without departing from the scope of the technical solution of the present invention, when the content of the above techniques can be used to make minor modifications disclosed as equivalent variations or modifications equivalent embodiments, but all without departing from the technical content of the present invention, according to technical essence of the invention is a simple modification of any of the above embodiments made equivalent modifications and variations, provided they fall within the scope of the present invention.

Claims (8)

1. 一种板体研磨装置,其特征在于,包括: 一升降平台,具有一承载部; 一研磨模块,与该承载部相对,该研磨模块包括: 一研磨带,具有相对的一研磨面与一背面;以及一驱动组件,连接该研磨带,以驱使该研磨带转动;以及一加压模块,包括: 一加压头,适于移动而接触至位于该升降平台与该加压头之间的部分该研磨带的该背面;以及一压力调整组件,连接该加压头,并适于移动该加压头以调整该加压头施加于该研磨带的压力,该压力调整组件包括一腔体、一电磁线圈、一永久磁铁以及一连接件,该腔体具有一远离该加压头的顶侧,该永久磁铁可移动地设置于该电磁线圈与该顶侧之间,且该永久磁铁与该顶侧之间形成一密封气密室,该电磁线圈固定于该腔体,并位于该加压头与该永久磁铁之间,而该连接件连接于该永久磁铁与该加压头。 A plate polishing apparatus, characterized by comprising: a lift platform having a bearing portion; a grinding module relative to the carrier portion, the polishing module comprising: a polishing tape having a polishing surface and the opposite a back surface; and a driving assembly connected to the abrasive tape, the abrasive tape to drive rotation; and a pressure module, comprising: a pressing head adapted to move into contact with the lifting platform located between the pressing head the portion of the back surface of the polishing belt; and a pressure adjustment unit, connected to the pressing head, the pressing head and adapted to move the head to adjust the pressing pressure applied to the abrasive tape, the assembly comprises a pressure regulating chamber body, an electromagnetic coil, a permanent magnet and a connecting member, the cavity of the pressing head having a top side remote from the permanent magnet is movably disposed between the top side of the electromagnetic coil and the permanent magnet is formed between the top side and a sealing gas-tight chamber, the electromagnetic coil is fixed to the chamber and positioned between the pressing head and the permanent magnet, and the connecting member is connected to the permanent magnet and the pressure head.
2. 如权利要求1所述的板体研磨装置,其特征在于,更包括一压力侦测模块,配置于该承载部,而该压力调整组件更包括一控制单元,电性连接至该压力侦测模块与该电磁线圈。 2. The plate of the polishing apparatus as claimed in claim 1, characterized in that, further comprising a pressure detecting module disposed on the carrier portion, and the pressure adjustment assembly further comprises a control unit electrically connected to the pressure reconnaissance measuring module and the electromagnetic coil.
3. 如权利要求1所述的板体研磨装置,其特征在于,该研磨面为一粗糙面。 Plate polishing apparatus according to claim 1, characterized in that, the abrasive surface is a rough surface.
4. 如权利要求1所述的板体研磨装置,其特征在于,该加压模块更包括多个滚珠,设置于该加压头内,且该加压头包括一接触面用于接触该研磨带,该接触面上设有多个孔洞,该些滚珠分别经由该些孔洞伸出该接触面外以接触该研磨带。 4. The plate polishing apparatus according to claim 1, wherein the module further comprises a plurality of pressurized balls, disposed in the pressure head and the pressing head comprises a contact surface for contacting the grinding with the contact surface provided with a plurality of holes, the plurality of balls respectively extending beyond the contact surface to contact the polishing tape via the plurality of holes.
5. 如权利要求1所述的板体研磨装置,其特征在于,该加压头包括一接触面用于接触该研磨带,该接触面设有多个出液孔,该研磨带设有多个贯孔,该些贯孔从该研磨面延伸至该背面。 5. The plate of the polishing apparatus as claimed in claim 1, characterized in that the pressure head comprises a contact surface for contacting the grinding belt, which contact surface is provided with a plurality of outlet hole, the abrasive belt provided with a plurality a through hole, the plurality of through holes extending from the back surface to the polishing surface.
6. 如权利要求1所述的板体研磨装置,其特征在于,该驱动组件包括一滚轮组。 Said plate polishing apparatus as claimed in claim 1, wherein the driving assembly includes a roller group.
7. 如权利要求1所述的板体研磨装置,其特征在于,该承载部包括一第一承载面与位于该第一承载面边缘的一第二承载面,该第一承载面与该加压头之间的距离不同于该第二承载面与该加压头之间的距离。 7. The plate polishing apparatus according to claim 1, wherein the supporting portion includes a first bearing surface and a second bearing surface located at the edge of the first bearing surface, the bearing surface and the first plus the distance between the indenter different from the distance between the bearing surface and the second pressing head.
8. 如权利要求1所述的板体研磨装置,其特征在于,该升降平台包括: 一平台本体,具有该承载部;以及一驱动元件,连接该平台本体,以驱使该平台本体朝接近或远离该研磨模块的方向移动。 8. The plate of the polishing apparatus as claimed in claim 1, characterized in that the lifting platform comprising: a platform body, having the supporting portions; and a driving member, connected to the platform body to urge the body toward the internet or close moving the direction away from the polishing module.
CN 201210075020 2012-03-20 2012-03-20 Plate polishing apparatus CN102601711B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201210075020 CN102601711B (en) 2012-03-20 2012-03-20 Plate polishing apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN 201210075020 CN102601711B (en) 2012-03-20 2012-03-20 Plate polishing apparatus
TW101110386A TWI500477B (en) 2012-03-20 2012-03-26 Grinding apparatus for plates

Publications (2)

Publication Number Publication Date
CN102601711A CN102601711A (en) 2012-07-25
CN102601711B true CN102601711B (en) 2014-10-08

Family

ID=46519680

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 201210075020 CN102601711B (en) 2012-03-20 2012-03-20 Plate polishing apparatus

Country Status (2)

Country Link
CN (1) CN102601711B (en)
TW (1) TWI500477B (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012109071A1 (en) * 2012-09-26 2014-03-27 Contitech Elastomer-Beschichtungen Gmbh Grinding method for printing plates in flexographic or high-pressure area
CN103612182A (en) * 2013-11-27 2014-03-05 苏州道众机械制造有限公司 Flat belt grinder
CN105058206A (en) * 2015-08-07 2015-11-18 河南鸿昌电子有限公司 Crystal particle grinding machine
CN105033821B (en) * 2015-08-14 2017-08-04 广州数控设备有限公司 Position and pressure compensating means, and a method of using the apparatus sander
CN105150055B (en) * 2015-08-27 2017-10-10 哈尔滨商业大学 Robot belt grinding machine for flat workpieces of large
US20180311785A1 (en) * 2015-10-21 2018-11-01 Singapore Technologies Aerospace Ltd A grinding module, a grinding machine and a method for grinding
CN105598795A (en) * 2016-01-29 2016-05-25 湖州展邦实业有限公司 Improved floor sanding device
CN106078469B (en) * 2016-08-01 2018-07-27 蓝思科技(长沙)有限公司 3d ceramic arc member species polishing process and apparatus
CN108015674A (en) * 2016-11-04 2018-05-11 合肥京东方显示技术有限公司 Grinding device

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2033320U (en) 1988-03-05 1989-03-01 重庆大学 Revolving-stage type plane sandbag grinder with press-grind plate structure
US5957763A (en) 1997-09-19 1999-09-28 Speedfam Corporation Polishing apparatus with support columns supporting multiple platform members
JP2004276175A (en) 2003-03-17 2004-10-07 Hitachi High-Tech Electronics Engineering Co Ltd Polishing apparatus and method for manufacturing magnetic disk using the same
WO2006112531A1 (en) 2005-04-19 2006-10-26 Nihon Micro Coating Co., Ltd. Device for and method of polishing peripheral edge of semiconductor wafer
CN101784369A (en) 2007-08-16 2010-07-21 株式会社荏原制作所 Polishing device
CN102152206A (en) 2010-01-15 2011-08-17 株式会社荏原制作所 Polishing apparatus, polishing method and pressing member for pressing a polishing tool

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001225253A (en) * 2000-02-16 2001-08-21 Fukuoka Prefecture Belt sander
JP5555865B2 (en) * 2010-02-05 2014-07-23 株式会社ブイ・テクノロジー Polishing apparatus

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2033320U (en) 1988-03-05 1989-03-01 重庆大学 Revolving-stage type plane sandbag grinder with press-grind plate structure
US5957763A (en) 1997-09-19 1999-09-28 Speedfam Corporation Polishing apparatus with support columns supporting multiple platform members
JP2004276175A (en) 2003-03-17 2004-10-07 Hitachi High-Tech Electronics Engineering Co Ltd Polishing apparatus and method for manufacturing magnetic disk using the same
WO2006112531A1 (en) 2005-04-19 2006-10-26 Nihon Micro Coating Co., Ltd. Device for and method of polishing peripheral edge of semiconductor wafer
CN101784369A (en) 2007-08-16 2010-07-21 株式会社荏原制作所 Polishing device
CN102152206A (en) 2010-01-15 2011-08-17 株式会社荏原制作所 Polishing apparatus, polishing method and pressing member for pressing a polishing tool

Also Published As

Publication number Publication date
CN102601711A (en) 2012-07-25
TW201338920A (en) 2013-10-01
TWI500477B (en) 2015-09-21

Similar Documents

Publication Publication Date Title
JP3641709B2 (en) Method of assembling the substrate and the device
JP3707990B2 (en) Board assembly equipment
JP3486862B2 (en) Method of assembling the substrate and the device
KR100483518B1 (en) Manufacturing method of liquid crystal display apparatus and substrate assembling apparatus
US20030226633A1 (en) Method and apparatus for fabricating bonded substrate
JP4098705B2 (en) The liquid crystal display device manufacturing process for a substrate bonding device
JP3422291B2 (en) Method of assembling a liquid crystal substrate
JPH07241764A (en) Polishing device and polishing method
JP4245138B2 (en) Laminating a substrate apparatus and a substrate laminating process
TW200830059A (en) Holding unit, position detecting system and exposure system, moving method, position detecting method, exposure method, adjusting method of detection system, and device producing method
CN1697768B (en) Substrate-levitating device
KR100615473B1 (en) Substrate superimposition apparatus
TW495415B (en) Semiconductor wafer, polishing apparatus and method
US20040038625A1 (en) Carrier assemblies, planarizing apparatuses including carrier assemblies, and methods for planarizing micro-device workpieces
JP5024971B2 (en) Substrate holding mechanism and a substrate assembly apparatus having the same
CN102490027A (en) Lifting platform
US20110062641A1 (en) Stage equipped with alignment function, processing apparatus having the stage equipped with alignment function, and method of aligning substrate
JP2004037594A (en) Substrate assembling device
CN102144250A (en) Bonding apparatus and method for controlling same
CN201955592U (en) Multifunctional visual sense automatic contraposition applying machine
US8617343B2 (en) Manufacturing method of flat-panel display device and bonding press apparatus therefor
JP2006027795A (en) Sucking device, method of carrying plate-like member, and method of manufacturing liquid crystal display
JP5434910B2 (en) Bonding apparatus and the bonding method
CN100465737C (en) An apparatus for rubbing alignment layers
CN101900912B (en) Apparatus for bonding substrates

Legal Events

Date Code Title Description
C06 Publication
C10 Request of examination as to substance
C14 Granted