CN206677689U - A kind of burnishing device of substrate - Google Patents

A kind of burnishing device of substrate Download PDF

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Publication number
CN206677689U
CN206677689U CN201720125087.4U CN201720125087U CN206677689U CN 206677689 U CN206677689 U CN 206677689U CN 201720125087 U CN201720125087 U CN 201720125087U CN 206677689 U CN206677689 U CN 206677689U
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China
Prior art keywords
polishing
burnishing device
substrate
pedestal
belt
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CN201720125087.4U
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Chinese (zh)
Inventor
张民井
洪耀
毛成飞
曹瑞丰
郭丰
高裕弟
孙剑
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Zaozhuang Ruinuo Electronic Technology Co., Ltd
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Zaozhuang Weixinnuo Electronic Technology Co Ltd
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Abstract

A kind of burnishing device of substrate, it includes:Pedestal, the pedestal support polishing portion, the polishing pad for placing the substrate are provided with the pedestal;Polishing portion, it includes the polishing plate contacted with the substrate, and the polishing plate is arranged on the pedestal and positioned at the top of the polishing pad;Drive division, the drive division are fixed on the pedestal, and the drive division drives the polishing portion straight reciprocating motion.The burnishing device of substrate of the present utility model, ITO surfaces are polished using the form of straight reciprocating motion, can avoid using excessive wear caused by the polishing plate of rotation at a high speed and cause PIN HOLE phenomenon.

Description

A kind of burnishing device of substrate
Technical field
It the utility model is related to substrate surface process technical field, and in particular to a kind of burnishing device of substrate.
Background technology
OLED Display Techniques have self luminous characteristic, the very thin coating of organic material of use and glass substrate, when having Electric current by when, these organic materials will light, and OLED display screen visible angle is big and saves electric energy, and this is aobvious in recent years Show that equipment has been obtained for increasing extensive utilization.Wherein OLED basic structure is special by a thin, transparent tool semiconductor The indium tin oxide (ITO) of property is used as anode, and along with metallic cathode, the structure such as sandwich is bundled into organic material.
Wherein ITO has been widely used to be manufactured in commercialized display pannel, and it has high-transmission rate, low-resistivity and height The advantages that work function.In general, the ITO manufactured by using radio frequency sputtering method (RF sputtering), easily by technology controlling and process because Element is bad and causes surface irregularity, and then produces the sophisticated material or thrust on surface.Other high-temperature calcination and recrystallization Process can also produce protrusion of surface layer.The path formed between the particulate of these uneven flood can provide hole and be emitted directly toward the moon The chance of pole, and these complicated paths can increase leakage current, therefore the control to ITO surface smoothness is particularly heavy Will.
OLED luminescent devices have higher requirement to the roughness on the surface ITO surfaces of its transparent anode, general in the industry at present All over reprocessing can be polished to the ITO material surfaces, improve yield of devices to improve roughness.Generally use in the prior art The mode (rotation polishing) for being analogous to polished glass substrate anode surface is handled.
Such as a kind of polishing dress of ito thin film for OLED is disclosed in Korean patent document KR1020060029332A Put, the burnishing device of the wherein ito thin film of the OLED is used for improve the polishing precision on ITO surfaces, and it includes spinning control Device, loading controls and guidance panel processed.The burnishing device of the ito thin film of the OLED mainly includes lower platen, polishing pad, tool There are platen, cylinder, the rotary drive unit of polishing fixator, wherein rotary drive unit is used to rotate the lower platen, pushed Plate is pressed on the platen, and polishing solution feeding unit is used to provide polishing solution to the lower platen, and the controller that spins is used for The rotary drive unit is controlled, the loading controls of the cylinder are used for the motion for adjusting the cylinder, and Rotation Controllers is used In the control rotary drive unit.
But the burnishing device in above-mentioned patent document is mainly handled ITO surfaces by rotating polishing mode, above-mentioned Rotation polishing mode has the following disadvantages:(1) rotary speed is too fast, can not effectively control the polishing on substrate ITO surfaces to peel off thickness Degree, and due to be the polishing plate using small area rotatably come polished back monolith substrate, therefore complete polish a substrate surface Time is longer, polishing efficiency is low, and the overall roughness of substrate surface is difficult to control;(2) polishing of burnishing device collocation Sheet material matter is harder, suitable for glass substrate, but for ITO polishing when, to the semiconductor materials such as ITO damage it is larger, on ITO surfaces Substantial amounts of PIN HOLE (perforation) bad phenomenon is easily caused, polishing process poor controllability, influences device light emitting efficiency.
Utility model content
Therefore, the technical problems to be solved in the utility model is to overcome that polishing efficiency of the prior art is low, controllability Difference, the defects of product surface polishing is bad is had resulted in, it is a kind of simple to operate so as to provide, reduce substrate surface polishing inordinate wear Substrate burnishing device.
Therefore, list whole technical schemes of claims record successively herein;
A kind of burnishing device of substrate, it includes:Pedestal, the pedestal support polishing portion, are provided with and put on the pedestal Put the polishing pad of the substrate;Polishing portion, it includes the polishing plate contacted with the substrate, and the polishing plate is arranged at the base On seat and positioned at the top of the polishing pad;Drive division, the drive division are fixed on the pedestal, and the drive division drives institute State polishing portion straight reciprocating motion.
Further, the polishing pad is square pad, and the polishing plate is set parallel to a line of the polishing pad, and Its length is consistent with the side of the polishing pad, and the polishing plate carries out linear reciprocation along the another a line vertical with the side Motion.
Further, the burnishing device also includes driving section and guide device, and the driving section connects the drive division With the polishing portion, the polishing portion is connected with the driving section and the guide device respectively by connector.
Further, the driving section includes horizontal belt driver, and the horizontal belt driver is included positioned at described The horizontal belt wheel of polishing pad rear and front end and along the polishing plate direction of motion set horizontal conveyor belt, the connector it is upper Surface is fixedly connected with the horizontal conveyor belt.
Further, the guide device is slide rail, and the lower surface of the connector is provided with what is coordinated with the slide rail The chute, the roller abutted with the slide rail is provided with the chute.
Further, the horizontal belt driver and the slide rail are arranged at least side of the polishing pad.
Further, the driving section also includes vertical belt driver, a belt wheel of the vertical belt driver Be connected with the output end of the drive division, another belt wheel and the horizontal belt driver of the vertical belt driver its The active water flat tyre wheel of middle one end is coaxially disposed.
Further, the pedestal is frame body, and the drive division is arranged in the frame body, the frame body upper table Face is additionally provided with the cell body for allowing the transmission belt of the vertical transmission device to pass through.
Further, the polishing portion also includes the pressure-regulating device and pressure detecting part being connected with the polishing plate, The pressure-regulating device controls the contact of the polishing plate and the substrate surface.
Further, the polishing fluid of the burnishing device of described substrate is alumina polishing solution.
Technical solutions of the utility model, have the following advantages that:
1. the burnishing device of substrate of the present utility model, substrate surface is thrown using the form of straight reciprocating motion Light, it can avoid using excessive wear caused by the polishing plate of rotation at a high speed and cause PIN HOLE phenomenon.
2. the burnishing device of substrate of the present utility model, using high-density sponge polishing cotton polishing, to substrate anode surface Damage is smaller during processing, can effectively control PIN HOLE generation.
3. the burnishing device of the utility model substrate, mainly by New Type Material polish cotton, polishing pad, orientation horizontal guide rail, Drive motor, pressure inductor, pressure-regulating device etc. form, adjustable in the presence of pressure inductor and pressure-regulating device The equidistant active force of the polishing pad of section polishing cotton and bottom, so as to ensure the roughness levels one of all areas of glass substrate Cause.
4. the burnishing device of the utility model substrate, with the use of alumina in Nano level polishing fluid, the alumina in Nano level The crystalline phase of polishing fluid is stable, hardness is high, particle is small, suspension is high and is evenly distributed;And grinding force is strong, flatness after polishing Height, suitable for high-accuracy processing industry;The viscosity of the polishing fluid is small simultaneously, and Ce is compared in media coating absorption2O3Slightly, it is easily removed.
Brief description of the drawings
, below will be right in order to illustrate more clearly of the utility model embodiment or technical scheme of the prior art The required accompanying drawing used is briefly described in embodiment or description of the prior art, it should be apparent that, describe below In accompanying drawing be some embodiments of the present utility model, for those of ordinary skill in the art, do not paying creativeness On the premise of work, other accompanying drawings can also be obtained according to these accompanying drawings.
Fig. 1 is the structural representation of the burnishing device of substrate of the present utility model;
Description of reference numerals:
1- polishing plates;2- polishing pads;3- slide rails;4- support plates;5- cell bodies, 6- pressure sensors;7- pressure tops;8- spring branch Strut;9- frame bodies;10- control panels;11- pressure-regulating devices;12- drive divisions;13- transmission belts;14- connectors;
Embodiment
The technical solution of the utility model is clearly and completely described below in conjunction with accompanying drawing, it is clear that described Embodiment is the utility model part of the embodiment, rather than whole embodiments.Based on the embodiment in the utility model, sheet The every other embodiment that field those of ordinary skill is obtained under the premise of creative work is not made, belongs to this practicality Novel protected scope.
, it is necessary to explanation in description of the present utility model, term " " center ", " on ", " under ", it is "left", "right", " perpendicular Directly ", the orientation of the instruction such as " level ", " interior ", " outer " or position relationship are based on orientation shown in the drawings or position relationship, are only Described for the ease of description the utility model and simplifying, rather than instruction or imply signified device or element must have it is specific Orientation, with specific azimuth configuration and operation, therefore it is not intended that to limitation of the present utility model.In addition, term " the One ", " second ", " the 3rd " are only used for describing purpose, and it is not intended that instruction or hint relative importance.
, it is necessary to which explanation, unless otherwise clearly defined and limited, term " are pacified in description of the present utility model Dress ", " connected ", " connection " should be interpreted broadly, for example, it may be fixedly connected or be detachably connected, or integratedly Connection;Can be mechanical connection or electrical connection;Can be joined directly together, can also be indirectly connected by intermediary, It can be the connection of two element internals.For the ordinary skill in the art, above-mentioned art can be understood with concrete condition Concrete meaning of the language in the utility model.
In addition, as long as technical characteristic involved in the utility model different embodiments disclosed below is each other Conflict can is not formed to be combined with each other.
Specific embodiment
For the present embodiment using ito substrate as most preferred embodiment, substrate described below is ito substrate;As shown in Figure 1 For the burnishing device of substrate of the present utility model, including pedestal, polishing portion, absorption type polishing pad 2, drive division, driving section And guide device.
Pedestal in the present embodiment is arranged to frame body 9, and the burnishing device is arranged at the top of the frame body 9, institute Frame body 9 is stated to be used to support polishing portion;The upper surface of the frame body 9 is provided with the polishing pad 2 of absorption type, and the polishing pad 2 is used In placing and adsorb the ito substrate;Polishing portion, it includes the polishing plate 1 contacted with the ito substrate, and the polishing plate 1 is set It is placed on the pedestal and positioned at the top of the polishing pad 2;Drive division 12, the drive division 12 are fixed on the pedestal, It is used to drive the polishing portion to move;It can be opposite in the polishing pad 2 and appointed by the straight reciprocating motion of the polishing plate 1 The substrate of meaning size is polished.
The polishing pad 2 is square pad, and the polishing plate 1 is set parallel to a line of the polishing pad 2, and its length It is consistent with the side of the polishing pad 2, it is to be understood that being consistent herein refers to that the length of polishing plate is approximately equal to polishing pad The length on 2 side, the polishing plate 1 carry out straight reciprocating motion along the another a line vertical with the side of polishing pad 2. Drive division 12 uses drive motor in the present embodiment, and the frame body 9 is internally provided with the drive for driving the burnishing device work Dynamic motor, drive motor are installed on the inside of the frame body 9 by installing plate, and drive motor passes through driving section and the polishing Portion connects.
Wherein in the present embodiment, the burnishing device also includes driving section, and the driving section connects the drive division 12 With the polishing portion, the driving section includes horizontal belt driver and vertical belt driver.The horizontal belt driver Horizontally disposed, it includes what is set positioned at the horizontal belt wheel of the rear and front end of polishing pad 2 and along the direction of motion of polishing plate 1 Horizontal conveyor belt 13, wherein horizontal belt wheel includes active water flat tyre wheel and driven horizontal belt wheel, the horizontal conveyor belt 13 connects The active water flat tyre wheel and driven horizontal belt wheel.The drive motor is connected with vertical belt driver, vertical V belt translation dress Put and be vertically arranged, its bottom is provided with the first pulley being connected with the output end of drive motor, and end set has and water thereon Second belt wheel of flat output axis connection, first pulley are connected with the second belt wheel by vertical transmission belt 13, wherein first pulley and Drive motor 12 is set along in the frame body 9, and the upper surface of the second belt wheel through the frame body 9 is arranged on the frame The front end of the top of support body 9, while the cell body 5 for allowing vertical transmission belt 13 to pass through is provided with frame body 9;Vertical V belt translation dress The output shaft for the second belt wheel put is horizontally disposed horizontal output shaft, and the both ends of wherein horizontal output shaft are respectively arranged with level Two active water flat tyre wheels of belt driver, the active water flat tyre wheel is respectively by two horizontal conveyor belts 13 with being arranged on Two driven horizontal belt wheel connections of the top rear end of frame body 9.
Burnishing device is additionally provided with the guide device for guiding polishing portion motion, the guide device in the present embodiment Slide rail is set to, and connector 14 is provided with polishing portion, the connector 14 connection polishing portion, horizontal belt driver and cunning Rail.Specifically, connector 14 is fixedly connected with the end of polishing portion, the upper surface of the connector 14 is for example, by screw etc. Fixture is fixedly connected with horizontal conveyor belt 13, and the lower surface of connector 14 is provided with chute, the chute and the both sides of polishing pad 2 Horizontal slide rail 3 be engaged, the roller abutted with the slide rail 3 is additionally provided with the chute, the polishing plate 1 is thrown Light directing.In the present embodiment, the both sides on absorption type polishing pad 2 are provided with driving and guide the straight line of polishing plate 1 Reciprocating horizontal belt driver and slide rail, therefore it is provided with connector 14 at the both ends of the polishing portion.
The polishing portion also includes the pressure-regulating device 11 and pressure detecting part being connected with the polishing plate 1, the pressure Apparatus for adjusting force 11 controls the contact of the polishing plate 1 and the ito substrate surface.Pressure inspection wherein in the present embodiment Survey part and use pressure sensor 6.The polishing portion also includes the support plate 4 for being arranged on bottom, is fixedly connected in the lower end of support plate 4 There is the polishing plate 1 for polishing, the upper end of the polishing portion is provided with upper board, between the upper board and the support plate 4 Pressure-regulating device 11 is provided with, the pressure-regulating device 11 controls contact pressure of the polishing plate 1 with the ito substrate Power.The pressure-regulating device 11 includes the pressure top 7 being arranged on the upper board and the spiral shell being connected with the pressure top 7 Bar, wherein the both ends of the polishing portion are fixedly connected with the connector 14 respectively, the polishing portion be provided with allow screw rod with And the through hole that the spring supporting bar 8 of the support plate 4 and upper board passes through is connected, it is provided with four spring supporting bars in the present embodiment 8, the spring supporting bar 8 be used for it is steady, equably control the polishing plate 1, make the polishing plate 1 on the ito substrate Active force be uniformly distributed, lower surface and the upper board of the pressure top 7 abut against, the pressure top 7 by screw rod with Support plate 4 connects.Pressure sensor 6 is additionally provided with the support plate 4, is detected by pressure sensor 6 and controls the polishing plate 1 With the contact force on the ito substrate surface and contacting distance, so as to reach rational polishing effect.It is in the present embodiment realization Good polishing effect, the polishing plate 1 are thrown using high-density sponge polishing cotton using alumina in Nano level polishing fluid Light.
The burnishing device of ito substrate of the present utility model, its operation principle are:
The ito substrate for needing to polish is adsorbed on the polishing pad 2 by absorption affinity, by adjusting on polishing plate 1 The pressure top 7 of pressure-regulating device 11 adjusts the distance of the polishing plate 1 and the ito substrate, passes through manipulation after adjustment Panel 10 controls the burnishing device setting in motion, and drive motor drives horizontal output shaft to rotate by vertical transmission belt 13, by This drives two of the horizontal belt driver driving pulley rotations, is further driven to the horizontal biography of the both sides of polishing pad 4 The setting in motion of horizontal conveyor belt 13 of dynamic band 13, thus horizontal belt driver, and drive polishing plate 1 to move along a straight line therewith, By controlling the rotating of drive motor to realize the horizontal reciprocating movement of polishing plate 1, the polishing to ito substrate is achieved in.
The burnishing device of the utility model ito substrate, it is horizontal that cotton, polishing pad, orientation are mainly polished by New Type Material sponge Guide rail, drive motor, pressure sensor, pressure-regulating device etc. form, in the effect of pressure sensor and pressure-regulating device The equidistant active force of the polishing pad of lower adjustable polishing cotton and bottom, so as to ensure the roughness water of all areas of glass substrate It is flat consistent.
Obviously, above-described embodiment is only intended to clearly illustrate example, and is not the restriction to embodiment.It is right For those of ordinary skill in the art, can also make on the basis of the above description it is other it is various forms of change or Change.There is no necessity and possibility to exhaust all the enbodiments.And the obvious change thus extended out or Among the protection domain that variation is created still in the utility model.

Claims (10)

  1. A kind of 1. burnishing device of substrate, it is characterised in that:Including:
    Pedestal, the pedestal support polishing portion, the polishing pad for placing the substrate are provided with the pedestal;
    Polishing portion, it includes the polishing plate contacted with the substrate, and the polishing plate is arranged on the pedestal and positioned at described The top of polishing pad;
    Drive division, the drive division are fixed on the pedestal, and the drive division drives the polishing portion straight reciprocating motion.
  2. 2. the burnishing device of substrate according to claim 1, it is characterised in that:The polishing pad is square pad, the throwing Tabula rasa is set parallel to a line of the polishing pad, and its length is consistent with the side of the polishing pad, the polishing plate Straight reciprocating motion is carried out along the another a line vertical with the side.
  3. 3. the burnishing device of substrate according to claim 2, it is characterised in that:The burnishing device also include driving section and Guide device, the driving section connect the drive division and the polishing portion, the polishing portion by connector respectively with it is described Driving section connects with the guide device.
  4. 4. the burnishing device of substrate according to claim 3, it is characterised in that:The driving section fills including horizontal V belt translation Put, the horizontal belt driver is included positioned at the horizontal belt wheel of the polishing pad rear and front end and along the polishing plate side of moving To the horizontal conveyor belt of setting, the upper surface of the connector is fixedly connected with the horizontal conveyor belt.
  5. 5. the burnishing device of substrate according to claim 4, it is characterised in that:The guide device is slide rail, the company The lower surface of fitting is provided with the chute coordinated with the slide rail, and the roller abutted with the slide rail is provided with the chute.
  6. 6. the burnishing device of substrate according to claim 5, it is characterised in that:The horizontal belt driver and the cunning Rail is arranged at least side of the polishing pad.
  7. 7. the burnishing device of substrate according to claim 4, it is characterised in that:The driving section also includes vertical V belt translation Device, a belt wheel of the vertical belt driver are connected with the output end of the drive division, the vertical belt driver Another belt wheel and the active water flat tyre wheel of the horizontal belt driver wherein one end be coaxially disposed.
  8. 8. the burnishing device of substrate according to claim 7, it is characterised in that:The pedestal is frame body, the driving Portion is arranged in the frame body, what the transmission belt that the frame body upper surface is additionally provided with the permission vertical transmission device passed through Cell body.
  9. 9. the burnishing device of substrate according to claim 4, it is characterised in that:The polishing portion also includes and the polishing The pressure-regulating device and pressure detecting part of plate connection, the pressure-regulating device control the polishing plate and the substrate surface Contact.
  10. 10. the burnishing device of the substrate according to claim 1-9 any one, it is characterised in that:The burnishing device Polishing fluid is alumina polishing solution.
CN201720125087.4U 2017-02-10 2017-02-10 A kind of burnishing device of substrate Active CN206677689U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201720125087.4U CN206677689U (en) 2017-02-10 2017-02-10 A kind of burnishing device of substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201720125087.4U CN206677689U (en) 2017-02-10 2017-02-10 A kind of burnishing device of substrate

Publications (1)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108907929A (en) * 2018-07-16 2018-11-30 任景贤 A kind of full-automatic wood plank processing device
CN108942544A (en) * 2018-07-25 2018-12-07 天津中车风电叶片工程有限公司 A kind of wind turbine blade root grinding device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108907929A (en) * 2018-07-16 2018-11-30 任景贤 A kind of full-automatic wood plank processing device
CN108907929B (en) * 2018-07-16 2020-12-01 郑华 Full-automatic plank processingequipment
CN108942544A (en) * 2018-07-25 2018-12-07 天津中车风电叶片工程有限公司 A kind of wind turbine blade root grinding device

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Address after: No. 3168, Fuyuan Third Road, high tech Zone, Zaozhuang City, Shandong Province

Patentee after: Zaozhuang Ruinuo Electronic Technology Co., Ltd

Address before: 277000, No. 15, building 322, Internet Town, Zaozhuang hi tech Zone, Shandong

Patentee before: ZAOZHUANG VISIONOX ELECTRONIC TECHNOLOGY Co.,Ltd.