CN103506956A - Polishing pad finisher used for wafer chemical-mechanical planarization equipment - Google Patents

Polishing pad finisher used for wafer chemical-mechanical planarization equipment Download PDF

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Publication number
CN103506956A
CN103506956A CN201310443621.2A CN201310443621A CN103506956A CN 103506956 A CN103506956 A CN 103506956A CN 201310443621 A CN201310443621 A CN 201310443621A CN 103506956 A CN103506956 A CN 103506956A
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China
Prior art keywords
polishing pad
swing arm
polishing
decelerator
pad trimmer
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CN201310443621.2A
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CN103506956B (en
Inventor
柳滨
高文泉
陈威
郭强生
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Beijing Semiconductor Equipment Institute
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Beijing Semiconductor Equipment Institute
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017Devices or means for dressing, cleaning or otherwise conditioning lapping tools

Abstract

The invention discloses a polishing pad finisher used for wafer chemical-mechanical planarization equipment. The polishing pad finisher is mainly composed of a rack, a motor, a speed reducer, an air bag, a synchronous belt, belt wheels, a swing arm, a supporting shaft, a supporting bottom plate, a ball universal structure, a detecting sensor and other components. A lever mechanism inflates the air bag to drive the swing arm to rise, fall and exert finishing force on a polishing bench. By the adoption of the belt wheel transmission mode, the motor and the speed reducer are placed away from a polishing area, and meanwhile a stainless steel protective cover is installed outside the whole finisher to prevent internal electronic components from being corroded. The ball universal structure is arranged at the finishing end to solve the contact problem of a finishing wheel and the polishing bench surface. The polishing pad finisher is simple in structure and control mode, free of cross pollution and good in finishing effect and meanwhile remarkably prolongs service life of a polishing pad.

Description

A kind of polishing pad trimmer for wafer chemical-mechanical planarization equipment
Technical field
The present invention relates to wafer chemical-mechanical planarization (CMP) equipment technical field, relate in particular to a kind of polishing pad trimmer for wafer chemical-mechanical planarization equipment.
Background technology
Along with the development of large scale integrated circuit, the improving constantly of integrated level, constantly reducing of live width, also more and more higher to the quality requirement of wafer, particularly to the surface quality of polishing wafer sheet, require more and more stricter.In wafer Chemical Mechanical Polishing (CMP), polishing pad is the important consumptive material of the another kind except polishing fluid.With regard to the application of polishing pad, the chemical characteristic General Requirements polishing pad of pad material possesses acid-fast alkali-proof, lasting stability.But in planarization process, pad interface material is easily consumed, is out of shape, meanwhile, surface sediment a certain amount of chemical reactant, if there is no suitable processing, pad interface will present quick aging, cause the phenomenons such as clearance decline, and the mechanical performance of polishing pad can have influence on flatness and the uniformity of crystal column surface, therefore in order to solve the problem of aging of polishing pad, flattening device all possesses trimming device for polishing cushion, possesses the function of synchronizeing finishing with polishing process or regularly repairing.
Summary of the invention
In order better to solve the problem of aging of polishing pad, the present invention proposes a kind of polishing pad trimmer for wafer chemical-mechanical planarization equipment.
The present invention adopts following technical scheme:
Polishing pad trimmer for wafer chemical-mechanical planarization equipment of the present invention comprises that frame, backplanes support axle, support baseboard, air bag, rotary decelerator, flange plate type decelerator, rotating servo motor, wobble servo motor, bulb universal structure, swing arm, photoelectric sensor and proximity transducer form; Frame is connected by backplanes support axle with support baseboard; Air bag is positioned on support baseboard; Proximity transducer is positioned on support baseboard, and support baseboard (103) is provided with leverage, and one end and the leverage of swing arm are connected by screw, other end connecting ball head universal structure; Rotary decelerator is positioned at swing arm top; Rotating servo motor is positioned at rotary decelerator top; Flange plate type decelerator is positioned at frame top; Photoelectric sensor is positioned at frame top edges; Wobble servo motor is positioned at flange plate type decelerator below, is positioned at frame inside simultaneously.
Backplanes support axle bottom is provided with a catch.
Swing arm top is provided with driving pulley near one end of support baseboard, and the top of bulb universal structure is provided with driven pulley, between driving pulley and driven pulley, by Timing Belt, connects, and driving pulley side is provided with belt pre-tightening apparatus.
The below of bulb universal structure is provided with freeing wheel.
Rotary decelerator below is provided with decelerator fixed mount.
The junction of leverage and swing arm is provided with lever back shaft.
Bulb universal structure is comprised of ball bearing one, ball bearing two, sealing felt collar, ball head structure and O type circle, ball head structure is connected with ball bearing one with the ball bearing two of top, sealing felt collar is being coated ball bearing two, and O type circle is positioned at the outside of ball bearing one and ball bearing two.
The top of support baseboard is provided with back cover, and the top of swing arm is provided with front shroud.
By leverage to airbag aeration to drive swing arm lifting, decline and polishing block applied to Dressing Force, wherein proximity transducer can make control system automatically identify swing arm in lifting or decline state.
Provide after the airbag aeration of power when volume expands air bag itself that the bending of certain angle has also occurred on axle line therein, this meets the needs of structural design.
Adopt belt pulley (driving pulley, driven pulley, the Timing Belt) kind of drive that rotating servo motor and rotary decelerator are placed away from polishing area, with avoid because of long term exposure in polishing fluid environment to corrosion that rotating servo motor and rotary decelerator were caused.
Whole polishing pad trimmer outside is provided with stainless steel protective cover (back cover, front shroud) further to avoid the corrosion of internal electronic component.
In order to solve the contact problems of freeing wheel and polishing table top, at finishing end, be designed with bulb universal structure, so that freeing wheel contacts with polishing table top maintenance level all the time under the effect of leverage, consequently obtain Dressing Force relatively uniformly and distribute.
Adopt servomotor (wobble servo motor, rotating servo motor) to realize the swing of trimmer swing arm on polishing block and the rotation of freeing wheel, wherein two photoelectric sensors and catch can be realized swing arm at polishing block edge and at the position-limiting action in polishing block centre position.
Good effect of the present invention is as follows:
Polishing pad trimmer of the present invention can implementation structure and control mode simple, without cross pollution, finishing effect is good, simultaneously the service life of significant prolongation polishing pad.This device adopts servomotor to realize the swing of trimmer swing arm on polishing block and the rotation of freeing wheel, in order to obtain lower swing speed and to increase trim torque, adopts the larger flange output type decelerator of output torque.This device mainly by leverage to airbag aeration to drive swing arm lifting, decline and polishing block is applied to Dressing Force, according to structure, need after airbag aeration used when volume expands air bag itself that the bending of certain angle has also occurred.Because polishing fluid has certain corrosivity, long term exposure can cause certain corrosion to servomotor and decelerator in polishing fluid environment, therefore adopt the belt pulley kind of drive that motor and decelerator are placed away from polishing area, whole trimmer outside is provided with stainless steel protective cover further to avoid the corrosion of internal electronic component simultaneously.In order to solve the contact problems of freeing wheel and polishing table top, at finishing end, be designed with bulb universal structure, so that freeing wheel contacts with polishing table top maintenance level all the time under the effect of leverage, consequently obtain Dressing Force relatively uniformly and distribute.
Accompanying drawing explanation
Fig. 1 is the structural representation of polishing pad trimmer of the present invention.
Fig. 2 is the section of structure of polishing pad trimmer of the present invention.
Fig. 3 is the bulb universal structure profile of polishing pad trimmer of the present invention.
Fig. 4 is the cover structure schematic diagram of polishing pad trimmer of the present invention.
Frame-101, backplanes support axle-102, support baseboard-103, air bag-104, rotary decelerator-105, rotating servo motor-106, bulb universal structure-107, swing arm-108, catch-109, photoelectric sensor-110, wobble servo motor-201, flange plate type decelerator-202, proximity transducer-203, driving pulley-204, Timing Belt-205, driven pulley-206, freeing wheel-207, belt pre-tightening apparatus-208, decelerator fixed mount-209, lever back shaft-210, ball bearing one-301, ball bearing two-302, sealing felt collar-303, ball head structure-304, O type circle-305, back cover-401, front shroud-402.
The specific embodiment
The following examples are to describe in further detail of the present invention.
Below in conjunction with accompanying drawing, structure and methods for using them of the present invention is described.First upper end air bag 104 is slowly inflated, by leverage, make swing arm 108 lifting certain altitudes, under wobble servo motor 201 and 202 effects of swing decelerator, finishing head (bulb universal structure 107) is rotated to polishing block center from polishing block edge, now rotating servo motor 106 and rotary decelerator 105 drive freeing wheel (diamond wheel) 207 rotations by synchronous pulley (204 and 206) and Timing Belt (205), upper end air bag 104 is slowly exitted afterwards, lower end air bag 104 is slowly inflated, dressing bit wheel 207 is tightly pressed on polishing block (polishing pad) under the driving of bulb universal structure 107, guarantee that dressing bit takes turns 207 fronts (finishing face) and polishing block (polishing pad) keeping parallelism state simultaneously, lower end air bag 104 is filled with suitable compressed air and just can realize the pressure finishing of this trimming device to polishing pad, thereby complete the whole polishing pad finishing process of swing arm 108 liftings-rotation-decline-swing finishing-lifting-rotation-decline.Wherein photoelectric sensor 110 and catch 109 can be realized swing arm at polishing block edge and at the position-limiting action in polishing block centre position, and proximity transducer 203 can make control system automatically identify swing arm 108 in the lifting state that still declines.
Although illustrated and described embodiments of the invention, for the ordinary skill in the art, be appreciated that without departing from the principles and spirit of the present invention and can carry out multiple variation, modification, replacement and modification to these embodiment, scope of the present invention is limited by claims and equivalent thereof.

Claims (9)

1. for a polishing pad trimmer for wafer chemical-mechanical planarization equipment, it is characterized in that: this polishing pad trimmer is to comprise that frame (101), backplanes support axle (102), support baseboard (103), air bag (104), rotary decelerator (105), flange plate type decelerator (202), rotating servo motor (106), wobble servo motor (201), bulb universal structure (107), swing arm (108), photoelectric sensor (110) and proximity transducer (203) form; Frame (101) is connected by backplanes support axle (102) with support baseboard (103); Air bag (104) is positioned on support baseboard (103); It is upper that proximity transducer (203) is positioned at support baseboard (103), and support baseboard (103) is provided with leverage, and one end and the leverage of swing arm (108) are connected by screw, other end connecting ball head universal structure (107); Rotary decelerator (105) is positioned at swing arm (108) top; Rotating servo motor (106) is positioned at rotary decelerator (105) top; Flange plate type decelerator (202) is positioned at frame (101) top; Photoelectric sensor (110) is positioned at frame (101) top edges; Wobble servo motor (201) is positioned at flange plate type decelerator (202) below, is positioned at frame (101) inside simultaneously.
2. polishing pad trimmer as claimed in claim 1, is characterized in that: backplanes support axle (102) bottom is provided with a catch (109).
3. polishing pad trimmer as claimed in claim 1, it is characterized in that: swing arm (108) top is provided with driving pulley (204) near one end of support baseboard (103), the top of bulb universal structure (107) is provided with driven pulley (206), between driving pulley (204) and driven pulley (206), by Timing Belt (205), connect, driving pulley (204) side is provided with belt pre-tightening apparatus (208).
4. polishing pad trimmer as claimed in claim 1, is characterized in that: the below of bulb universal structure (107) is provided with freeing wheel (207).
5. polishing pad trimmer as claimed in claim 1, is characterized in that: rotary decelerator (105) below is provided with decelerator fixed mount (209).
6. polishing pad trimmer as claimed in claim 1, is characterized in that: the junction of leverage and swing arm (108) is provided with lever back shaft (210).
7. polishing pad trimmer as claimed in claim 1, it is characterized in that: bulb universal structure (107) is comprised of ball bearing one (301), ball bearing two (302), sealing felt collar (303), ball head structure (304) and O type circle (305), ball head structure (304) is connected with ball bearing one (301) with the ball bearing two (302) of top, sealing felt collar (303) is being coated ball bearing two (302), and O type circle (305) is positioned at the outside of ball bearing one (301) and ball bearing two (302).
8. polishing pad trimmer as claimed in claim 1, is characterized in that: the top of support baseboard (103) is provided with back cover (401), and the top of swing arm (108) is provided with front shroud (402).
9. polishing pad trimmer as claimed in claim 8, is characterized in that: back cover (401) and front shroud (402) are to be made by stainless steel material.
CN201310443621.2A 2013-09-26 2013-09-26 A kind of for the polishing pad trimmer in wafer chemical CMP apparatus Active CN103506956B (en)

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CN201310443621.2A CN103506956B (en) 2013-09-26 2013-09-26 A kind of for the polishing pad trimmer in wafer chemical CMP apparatus

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Application Number Priority Date Filing Date Title
CN201310443621.2A CN103506956B (en) 2013-09-26 2013-09-26 A kind of for the polishing pad trimmer in wafer chemical CMP apparatus

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106597841A (en) * 2016-12-14 2017-04-26 北京半导体专用设备研究所(中国电子科技集团公司第四十五研究所) Sweeping algorithm for finisher motor in chemical mechanical planarization
CN106670970A (en) * 2016-12-23 2017-05-17 北京半导体专用设备研究所(中国电子科技集团公司第四十五研究所) Pressure applying mechanism of polishing pad activator for CMP equipment and operating method thereof
CN108581843A (en) * 2018-04-28 2018-09-28 北京半导体专用设备研究所(中国电子科技集团公司第四十五研究所) Color-buffing finish device and polishing grinding equipment
CN111872851A (en) * 2019-05-02 2020-11-03 三星电子株式会社 Dresser and chemical mechanical polishing device comprising same
CN114193326A (en) * 2021-12-22 2022-03-18 莱玛特·沃尔特斯(沈阳)精密机械有限公司 Polishing disk finishing device of polishing machine
CN114454095A (en) * 2022-01-18 2022-05-10 北京烁科精微电子装备有限公司 Dressing device for polishing pad

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003048147A (en) * 2001-07-31 2003-02-18 Applied Materials Inc Grinding pad conditioning device, and grinding device using it
CN101218067A (en) * 2005-07-09 2008-07-09 Tbw工业有限公司 Enhanced end effector arm arrangement for CMP pad conditioning
CN101254586A (en) * 2007-01-30 2008-09-03 株式会社荏原制作所 Polishing apparatus
CN101623849A (en) * 2009-07-31 2010-01-13 清华大学 Trimmer for trimming polishing pad
CN101972983A (en) * 2010-08-11 2011-02-16 中国电子科技集团公司第四十五研究所 Chemically mechanical polishing mandrel device
JP2011148046A (en) * 2010-01-22 2011-08-04 Ebara Corp Device and method of polishing, and method of testing dressing unit performance
CN202479968U (en) * 2012-02-21 2012-10-10 清华大学 Polishing pad finishing head and polishing pad finisher provided with the same

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003048147A (en) * 2001-07-31 2003-02-18 Applied Materials Inc Grinding pad conditioning device, and grinding device using it
CN101218067A (en) * 2005-07-09 2008-07-09 Tbw工业有限公司 Enhanced end effector arm arrangement for CMP pad conditioning
CN101254586A (en) * 2007-01-30 2008-09-03 株式会社荏原制作所 Polishing apparatus
CN101623849A (en) * 2009-07-31 2010-01-13 清华大学 Trimmer for trimming polishing pad
JP2011148046A (en) * 2010-01-22 2011-08-04 Ebara Corp Device and method of polishing, and method of testing dressing unit performance
CN101972983A (en) * 2010-08-11 2011-02-16 中国电子科技集团公司第四十五研究所 Chemically mechanical polishing mandrel device
CN202479968U (en) * 2012-02-21 2012-10-10 清华大学 Polishing pad finishing head and polishing pad finisher provided with the same

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
高文泉等: "CMP设备中抛光垫修整机构的研究", 《电子工业专用设备》 *

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106597841A (en) * 2016-12-14 2017-04-26 北京半导体专用设备研究所(中国电子科技集团公司第四十五研究所) Sweeping algorithm for finisher motor in chemical mechanical planarization
CN106670970A (en) * 2016-12-23 2017-05-17 北京半导体专用设备研究所(中国电子科技集团公司第四十五研究所) Pressure applying mechanism of polishing pad activator for CMP equipment and operating method thereof
CN108581843A (en) * 2018-04-28 2018-09-28 北京半导体专用设备研究所(中国电子科技集团公司第四十五研究所) Color-buffing finish device and polishing grinding equipment
CN111872851A (en) * 2019-05-02 2020-11-03 三星电子株式会社 Dresser and chemical mechanical polishing device comprising same
CN111872851B (en) * 2019-05-02 2024-02-06 三星电子株式会社 Trimmer and chemical mechanical polishing device comprising same
CN114193326A (en) * 2021-12-22 2022-03-18 莱玛特·沃尔特斯(沈阳)精密机械有限公司 Polishing disk finishing device of polishing machine
CN114454095A (en) * 2022-01-18 2022-05-10 北京烁科精微电子装备有限公司 Dressing device for polishing pad

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