CN103506956B - A kind of for the polishing pad trimmer in wafer chemical CMP apparatus - Google Patents
A kind of for the polishing pad trimmer in wafer chemical CMP apparatus Download PDFInfo
- Publication number
- CN103506956B CN103506956B CN201310443621.2A CN201310443621A CN103506956B CN 103506956 B CN103506956 B CN 103506956B CN 201310443621 A CN201310443621 A CN 201310443621A CN 103506956 B CN103506956 B CN 103506956B
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- China
- Prior art keywords
- polishing pad
- decelerator
- swing arm
- pad trimmer
- polishing
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
Abstract
The invention discloses a kind of for the polishing pad trimmer in wafer chemical CMP apparatus, form primarily of the parts such as frame, motor, decelerator, air bag, Timing Belt and belt wheel, swing arm, back shaft, support baseboard, bulb universal structure, detecting sensor.This device mainly by leverage to airbag aeration to drive swing arm lifting, decline and to apply Dressing Force to polishing block.Adopt pulley drive mode motor and decelerator to be placed away from polishing area, whole trimmer outside is provided with stainless steel protective cover to avoid the corrosion of internal electronic component simultaneously.In order to solve the contact problems of freeing wheel and polishing table top, be designed with bulb universal structure at finishing end.Polishing pad trimmer of the present invention can realize structure and control mode is simple, and without cross pollution, finishing effect is good, simultaneously the service life of significant prolongation polishing pad.
Description
Technical field
The present invention relates to wafer chemical machinery planarization (CMP) equipment technical field, particularly relate to a kind of for the polishing pad trimmer in wafer chemical CMP apparatus.
Background technology
Along with the development of large scale integrated circuit, improving constantly of integrated level, the continuous reduction of live width, also more and more higher to the quality requirement of wafer, particularly more and more stricter to the surface quality requirements of polishing wafer sheet.In wafer chemical mechanical planarization, polishing pad is the important consumptive material of another kind except polishing fluid.With regard to the application of polishing pad, the chemical characteristic General Requirements polishing pad of pad material possesses acid-fast alkali-proof, lasting stability.But in planarization process, pad interface material is easily consumed, is out of shape, meanwhile, a certain amount of chemical reactant of surface sediment, if do not have suitable process, pad interface will present quick aging, cause the phenomenons such as clearance decline, and the mechanical performance of polishing pad can have influence on flatness and the uniformity of crystal column surface, therefore in order to solve the problem of aging of polishing pad, flattening device all possesses trimming device for polishing cushion, possesses and the function that polishing process is synchronously repaired or timing is repaired.
Summary of the invention
In order to better solve the problem of aging of polishing pad, the present invention proposes a kind of for the polishing pad trimmer in wafer chemical CMP apparatus.
The present invention adopts following technical scheme:
Of the present invention for the polishing pad trimmer in wafer chemical CMP apparatus comprise frame, backplanes support axle, support baseboard, air bag, rotary decelerator, flange plate type decelerator, rotating servo motor, wobble servo motor, bulb universal structure, swing arm, photoelectric sensor and proximity transducer composition; Frame is connected by backplanes support axle with support baseboard; Air bag is positioned on support baseboard; Proximity transducer is positioned on support baseboard, and support baseboard (103) is provided with leverage, and one end and the leverage of swing arm are connected by screw, other end connecting ball head universal structure; Rotary decelerator is positioned at above swing arm; Rotating servo motor is positioned at above rotary decelerator; Flange plate type decelerator is positioned at frame top; Photoelectric sensor is positioned at frame top edges; Wobble servo motor is positioned at below flange plate type decelerator, is positioned at machine frame inside simultaneously.
A catch is provided with bottom backplanes support axle.
One end near support baseboard above swing arm is provided with driving pulley, and the top of bulb universal structure is provided with driven pulley, is connected between driving pulley and driven pulley by Timing Belt, and driving pulley side is provided with belt pre-tightening apparatus.
The below of bulb universal structure is provided with freeing wheel.
Decelerator fixed mount is provided with below rotary decelerator.
The junction of leverage and swing arm is provided with levers support axle.
Bulb universal structure is made up of ball bearing one, ball bearing two, sealing felt collar, ball head structure and O type circle, ball head structure is connected with ball bearing one with the ball bearing two of top, sealing felt collar is coated with the outside that ball bearing two, O type circle is positioned at ball bearing one and ball bearing two.
The top of support baseboard is provided with back cover, and the top of swing arm is provided with front shroud.
By leverage to airbag aeration with drive swing arm lifting, decline and to polishing block apply Dressing Force, wherein proximity transducer control system can be made automatically to identify swing arm is in lifting or decline state.
After providing the airbag aeration of power, while volume expands, air bag itself also axle line there occurs the bending of certain angle wherein, and this meets the needs of structural design.
Belt pulley (driving pulley, driven pulley, the Timing Belt) kind of drive is adopted rotating servo motor and rotary decelerator to be placed away from polishing area, to avoid because being chronically exposed in polishing fluid environment the corrosion that rotating servo motor and rotary decelerator cause.
Whole polishing pad trimmer outside is provided with stainless steel protective cover (back cover, front shroud) to avoid the corrosion of internal electronic component further.
In order to solve the contact problems of freeing wheel and polishing table top, being designed with bulb universal structure at finishing end, to make freeing wheel keep flat contact with polishing table top all the time under the effect of leverage, so that obtaining relatively uniform Dressing Force distribution.
Adopt servomotor (wobble servo motor, rotating servo motor) to realize the swing of trimmer swing arm on polishing block and the rotation of freeing wheel, wherein two photoelectric sensors and a catch can realize swing arm at polishing block edge and the position-limiting action in polishing block centre position.
Good effect of the present invention is as follows:
Polishing pad trimmer of the present invention can realize structure and control mode is simple, and without cross pollution, finishing effect is good, simultaneously the service life of significant prolongation polishing pad.This device adopts servomotor to realize the swing of trimmer swing arm on polishing block and the rotation of freeing wheel, in order to obtain lower swing speed and increase trim torque, adopts the flange output type decelerator that output torque is larger.This device mainly by leverage to airbag aeration to drive swing arm lifting, decline and to apply Dressing Force to polishing block, after the airbag aeration used by needing according to structure, while volume expands, air bag itself also to there occurs the bending of certain angle.Because polishing fluid has certain corrosivity, be chronically exposed in polishing fluid environment and can cause certain corrosion to servomotor and decelerator, therefore adopting pulley drive mode motor and decelerator to be placed away from polishing area, whole trimmer outside is provided with stainless steel protective cover to avoid the corrosion of internal electronic component further simultaneously.In order to solve the contact problems of freeing wheel and polishing table top, being designed with bulb universal structure at finishing end, to make freeing wheel keep flat contact with polishing table top all the time under the effect of leverage, so that obtaining relatively uniform Dressing Force distribution.
Accompanying drawing explanation
Fig. 1 is the structural representation of polishing pad trimmer of the present invention.
Fig. 2 is the section of structure of polishing pad trimmer of the present invention.
Fig. 3 is the bulb universal structure profile of polishing pad trimmer of the present invention.
Fig. 4 is the cover structure schematic diagram of polishing pad trimmer of the present invention.
Frame-101, backplanes support axle-102, support baseboard-103, air bag-104, rotary decelerator-105, rotating servo motor-106, bulb universal structure-107, swing arm-108, catch-109, photoelectric sensor-110, wobble servo motor-201, flange plate type decelerator-202, proximity transducer-203, driving pulley-204, Timing Belt-205, driven pulley-206, freeing wheel-207, belt pre-tightening apparatus-208, decelerator fixed mount-209, levers support axle-210, ball bearing one-301, ball bearing two-302, sealing felt collar-303, ball head structure-304, O type circle-305, back cover-401, front shroud-402.
Detailed description of the invention
The following examples describe in further detail of the present invention.
Below in conjunction with accompanying drawing, structure and methods for using them of the present invention is described.First upper end air bag 104 is slowly inflated, swing arm 108 lifting certain altitude is made by leverage, under wobble servo motor 201 and flange plate type decelerator 202 act on, finishing head (bulb universal structure 107) is rotated to polishing block center from polishing block edge, now rotating servo motor 106 and rotary decelerator 105 drive freeing wheel (diamond wheel) 207 to rotate by synchronous pulley (204 and 206) and Timing Belt (205), upper end air bag 104 is slowly exitted afterwards, lower end air bag 104 is slowly inflated, make dressing bit take turns 207 to be tightly pressed under the driving of bulb universal structure 107 on polishing block (polishing pad), ensure that dressing bit takes turns 207 fronts (finishing face) and polishing block (polishing pad) keeping parallelism state simultaneously, lower end air bag 104 is filled and just can realize this trimming device with suitable compressed air the pressure of polishing pad is repaired, thus complete the whole polishing pad finishing process of swing arm 108 liftings-rotation-decline-swing finishing-lifting-rotation-decline.Wherein photoelectric sensor 110 and catch 109 can realize swing arm at polishing block edge and the position-limiting action in polishing block centre position, proximity transducer 203 control system can be made automatically to identify swing arm 108 is in lifting and still declines state.
Although illustrate and describe embodiments of the invention, for the ordinary skill in the art, be appreciated that and can carry out multiple change, amendment, replacement and modification to these embodiments without departing from the principles and spirit of the present invention, scope of the present invention is by claims and equivalents thereof.
Claims (8)
1. for the polishing pad trimmer in wafer chemical CMP apparatus, it is characterized in that: this polishing pad trimmer comprises frame (101), backplanes support axle (102), support baseboard (103), air bag (104), rotary decelerator (105), flange plate type decelerator (202), rotating servo motor (106), wobble servo motor (201), bulb universal structure (107), swing arm (108), photoelectric sensor (110) and proximity transducer (203) composition; Frame (101) is connected by backplanes support axle (102) with support baseboard (103); Air bag (104) is positioned on support baseboard (103); Proximity transducer (203) is positioned on support baseboard (103), and support baseboard (103) is provided with leverage, and one end and the leverage of swing arm (108) are connected by screw, other end connecting ball head universal structure (107); Rotary decelerator (105) is positioned at swing arm (108) top; Rotating servo motor (106) is positioned at rotary decelerator (105) top; Flange plate type decelerator (202) is positioned at frame (101) top; Photoelectric sensor (110) is positioned at frame (101) top edges; Wobble servo motor (201) is positioned at flange plate type decelerator (202) below, is positioned at frame (101) inner simultaneously;
Bulb universal structure (107) is made up of ball bearing one (301), ball bearing two (302), sealing felt collar (303), ball head structure (304) and O type circle (305), ball head structure (304) is connected with ball bearing one (301) with the ball bearing two (302) of top, sealing felt collar (303) is coated with the outside that ball bearing two (302), O type circle (305) is positioned at ball bearing one (301) and ball bearing two (302).
2. polishing pad trimmer as claimed in claim 1, is characterized in that: backplanes support axle (102) bottom is provided with a catch (109).
3. polishing pad trimmer as claimed in claim 1, it is characterized in that: swing arm (108) top is provided with driving pulley (204) near one end of support baseboard (103), the top of bulb universal structure (107) is provided with driven pulley (206), connected by Timing Belt (205) between driving pulley (204) and driven pulley (206), driving pulley (204) side is provided with belt pre-tightening apparatus (208).
4. polishing pad trimmer as claimed in claim 1, is characterized in that: the below of bulb universal structure (107) is provided with freeing wheel (207).
5. polishing pad trimmer as claimed in claim 1, is characterized in that: rotary decelerator (105) below is provided with decelerator fixed mount (209).
6. polishing pad trimmer as claimed in claim 1, is characterized in that: the junction of leverage and swing arm (108) is provided with levers support axle (210).
7. polishing pad trimmer as claimed in claim 1, it is characterized in that: the top of support baseboard (103) is provided with back cover (401), the top of swing arm (108) is provided with front shroud (402).
8. polishing pad trimmer as claimed in claim 7, is characterized in that: back cover (401) and front shroud (402) are made up of stainless steel material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310443621.2A CN103506956B (en) | 2013-09-26 | 2013-09-26 | A kind of for the polishing pad trimmer in wafer chemical CMP apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310443621.2A CN103506956B (en) | 2013-09-26 | 2013-09-26 | A kind of for the polishing pad trimmer in wafer chemical CMP apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103506956A CN103506956A (en) | 2014-01-15 |
| CN103506956B true CN103506956B (en) | 2016-04-27 |
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| CN201310443621.2A Active CN103506956B (en) | 2013-09-26 | 2013-09-26 | A kind of for the polishing pad trimmer in wafer chemical CMP apparatus |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106597841B (en) * | 2016-12-14 | 2019-09-24 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | The spotting scaming algorithm of trimmer motor in chemical-mechanical planarization |
| CN106670970B (en) * | 2016-12-23 | 2019-01-01 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | A kind of polishing pad activator pressure exerting arrangement and its operation method for CMP tool |
| CN108581843A (en) * | 2018-04-28 | 2018-09-28 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Color-buffing finish device and polishing grinding equipment |
| KR20200127328A (en) * | 2019-05-02 | 2020-11-11 | 삼성전자주식회사 | Conditioner, chemical mechanical polishing apparatus including the same and method of manufacturing a semiconductor device using the apparatus |
| CN114193326A (en) * | 2021-12-22 | 2022-03-18 | 莱玛特·沃尔特斯（沈阳）精密机械有限公司 | Polishing disk finishing device of polishing machine |
| CN114454095A (en) * | 2022-01-18 | 2022-05-10 | 北京烁科精微电子装备有限公司 | Dressing device for polishing pad |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003048147A (en) * | 2001-07-31 | 2003-02-18 | Applied Materials Inc | Grinding pad conditioning device, and grinding device using it |
| CA2614483A1 (en) * | 2005-07-09 | 2007-01-18 | Tbw Industries Inc. | Enhanced end effector arm arrangement for cmp pad conditioning |
| EP1952945B1 (en) * | 2007-01-30 | 2010-09-15 | Ebara Corporation | Polishing apparatus |
| CN101623849B (en) * | 2009-07-31 | 2011-05-11 | 清华大学 | Trimmer for trimming polishing pad |
| JP5528826B2 (en) * | 2010-01-22 | 2014-06-25 | 株式会社荏原製作所 | Polishing apparatus and method, and performance test method for dressing unit |
| CN101972983B (en) * | 2010-08-11 | 2013-01-09 | 中国电子科技集团公司第四十五研究所 | Chemically mechanical polishing mandrel device |
| CN202479968U (en) * | 2012-02-21 | 2012-10-10 | 清华大学 | Polishing pad finishing head and polishing pad finisher provided with the same |
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| CN103506956A (en) | 2014-01-15 |
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