CN103737472A - Polishing device of curved surface polisher - Google Patents
Polishing device of curved surface polisher Download PDFInfo
- Publication number
- CN103737472A CN103737472A CN201310734762.XA CN201310734762A CN103737472A CN 103737472 A CN103737472 A CN 103737472A CN 201310734762 A CN201310734762 A CN 201310734762A CN 103737472 A CN103737472 A CN 103737472A
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- workpiece
- polishing disk
- polishing
- curved surface
- workbench
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- 238000005498 polishing Methods 0.000 title claims abstract description 136
- 238000006073 displacement reaction Methods 0.000 claims description 12
- 238000004364 calculation method Methods 0.000 claims description 7
- 230000001174 ascending effect Effects 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 230000007547 defect Effects 0.000 abstract description 2
- 230000003028 elevating effect Effects 0.000 abstract 1
- 238000001816 cooling Methods 0.000 description 6
- 239000012530 fluid Substances 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000000498 cooling water Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000006062 fragmentation reaction Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B39/00—Burnishing machines or devices, i.e. requiring pressure members for compacting the surface zone; Accessories therefor
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention discloses a polishing device of a curved surface polisher. The polishing device of the curved surface polisher can exert set pressure on a workpiece on a moving working platform and comprises a frame, and a rotatable polishing disc is arranged on the frame. The polishing device of the curved surface polisher is characterized in that the machine frame is provided with a dynamic pressure exertion device for exerting the set pressure on the workpiece on the moving working platform, and the dynamic pressure exertion device can maintain the set pressure exerted on the workpiece through the polishing disc mounted on the elevating frame. The polishing device of the curved surface polisher is simple in structure; the polishing disc can exert the set pressure on the workpiece for polishing through a PLC (programmable logic controller), so that the defects existing in existing polishing can be overcome; meanwhile, the movement of the working platform can greatly improve the production efficiency and lay foundation for achieving flow line production.
Description
Technical field
The present invention relates to a kind of curved surface polishing machine, the burnishing device of curved surface polishing machine for a kind of ultra-thin, fragility workpiece specifically, particularly relates to the burnishing device of the workpiece use curved surface polishing machines such as a kind of as glass, sapphire, piezoelectric quartz, monocrystalline silicon piece.
Background technology
, fragility workpiece ultra-thin in order to make becomes smooth, transparent as the surface of the workpiece such as glass, sapphire, piezoelectric quartz, monocrystalline silicon piece, and has gloss, conventionally to its surface, need carry out polishing.At present, the basic structure of the existing curved surface polishing machine that uses is upper dish (polishing disk), lower disc, and polishing disk is rotated, and the workbench that is placed with workpiece is lower wall polishing disk reverse rotation relatively, the one, increase grinding speed, the 2nd, make workpiece polishing even.Simultaneously, in whole motion process, because the contact area of polishing disk and workbench remains unchanged, so when press polish is worked, cylinder can apply constant pressure to the workpiece on workbench by polishing disk, to guarantee keeping constant pressure between polishing disk and workpiece.But, because polishing disk, workbench are all rotated, in the outer ring of polishing disk, workbench and inner ring on-line velocity, there are differences, cause like this polishing uniformity of workpiece on workbench poor, on workpiece, leave blemishes, as polishing line etc., affect polishing effect and efficiency., can adopt when polishing disk is rotated, the workbench that is placed with workpiece moves horizontally for this reason.But when workbench moves horizontally, the contact area of polishing disk and workpiece is in continuous variation, thereby can not keep constant pressure between polishing disk and workpiece, seriously affects polishing effect, even defective work piece.
Summary of the invention
The object of this invention is to provide a kind of burnishing device of the curved surface polishing machine of setting pressure that workpiece on mobile workbench applied by polishing disk.
The present invention adopts following technical scheme to realize its goal of the invention, a kind of burnishing device of curved surface polishing machine, it comprises frame, frame is provided with rotatable polishing disk, frame is provided with and realizes polishing disk and the workpiece on mobile workbench is applied to the dynamic pressurized device of setting pressure, and described dynamic pressurized device keeps applying the pressure of setting by the polishing disk being arranged on elevator platform to workpiece.
Workbench of the present invention is square.
Dynamic pressurized device of the present invention comprises and is arranged on the lift cylinder of being controlled by PLC in frame, the displacement transducer of testing platform displacement, and the cylinder block of lift cylinder is arranged in frame, and the piston rod of lift cylinder is connected with elevator platform; PLC is according to the displacement calculation polishing disk of workbench and the contact area of workpiece, and passing ratio reversal valve is determined the ascending, descending control to lift cylinder, realizes polishing disk and workpiece is applied to the pressure of setting.
Simple for calculating, the pressure that described polishing disk of the present invention applies setting to workpiece is P=(F-G)/S, F is the pressure that polishing disk imposes on workpiece, the weight that G is elevator platform, the working face that S is polishing disk and the contact area of workpiece; The contact area approximate calculation of the working face of described polishing disk and workpiece is:
In formula, S represents the approximate contact area of polishing disk and workpiece, and R represents the radius of polishing disk, and H represents the relative shift of workbench, R >=H, cos α=(R-H)/R; Or
In formula, S represents the approximate contact area of polishing disk and workpiece, and R represents the radius of polishing disk, and H represents the relative shift of workbench, H > R, cos α=(H-R)/R.
For polishing disk is revolved round the sun in rotation, polishing disk of the present invention is arranged in mounting disc, and polishing disk is driven by the polishing motor being arranged on elevator platform, and described mounting disc is driven by the revoluting motor being arranged on elevator platform.
Polishing disk of the present invention is 2～8, and the driving shaft of polishing disk connects with the main shaft of polishing motor by gear train.
Owing to adopting technique scheme, the present invention has realized goal of the invention preferably, it is simple in structure, by PLC, can realize the pressure that polishing disk applies setting to workpiece and carry out polishing, overcome the defect that existing polishing exists, meanwhile, the movement of workbench, has greatly improved production efficiency and has laid the foundation for realizing streamline production.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention;
Fig. 2 is electric control theory schematic diagram of the present invention;
Fig. 3 is the calculating schematic diagram (workbench displacement H is less than or equal to the radius R of polishing disk) of the working face of polishing disk of the present invention and the approximate contact area S of workpiece;
Fig. 4 is the calculating schematic diagram (workbench displacement H is greater than the radius R of polishing disk) of the working face of polishing disk of the present invention and the approximate contact area S of workpiece;
Fig. 5 is tonnage curve map of the present invention.
The specific embodiment
Below in conjunction with drawings and Examples, the invention will be further described.
As seen from Figure 1, Figure 2, a kind of burnishing device of curved surface polishing machine, it comprises frame 1, frame 1 is provided with rotatable polishing disk 16, frame 1 is provided with workpiece 17 on the workbench 8 of realizing 16 pairs of movements of polishing disk and applies the dynamic pressurized device of setting pressure, and described dynamic pressurized device keeps applying the pressure of setting by being arranged on 16 pairs of workpiece of polishing disk 17 on elevator platform 5.
Dynamic pressurized device of the present invention comprises and is arranged on the lift cylinder 2 of being controlled by PLC in frame 1, the displacement transducer of testing platform 8 displacements, and the cylinder block of lift cylinder 2 is arranged in frame 1, and the piston rod of lift cylinder 2 is connected with elevator platform 5; PLC is the contact area with workpiece 17 according to the displacement calculation polishing disk 16 of workbench 8, and passing ratio reversal valve is determined the ascending, descending control to lift cylinder 2, realizes the pressure that 16 pairs of workpiece 17 of polishing disk apply setting.
Simple for calculating, the pressure that 16 pairs of workpiece 17 of described polishing disk of the present invention apply setting is P=(F-G)/S, F is the pressure that polishing disk 16 imposes on workpiece 7, and G is the weight of elevator platform 5, and S is the contact area of working face and the workpiece 17 of polishing disk 16; The contact area approximate calculation of the working face of described polishing disk 16 and workpiece 17 is:
In formula, S represents the approximate contact area of polishing disk 16 and workpiece 17, and R represents the radius of polishing disk 16, and H represents the relative shift of workbench 8, R >=H, cos α=(R-H)/R; Or
In formula, S represents the approximate contact area of polishing disk 16 and workpiece 17, and R represents the radius of polishing disk 16, and H represents the relative shift of workbench 8, H > R, cos α=(H-R)/R.
For polishing disk 16 is revolved round the sun in rotation, polishing disk 16 of the present invention is arranged in mounting disc 7, and polishing disk 16 is driven by the polishing motor 3 being arranged on elevator platform 5, and described mounting disc 7 is driven by the revoluting motor 6 being arranged on elevator platform 5.Described polishing disk 16 is 2～8, and the polishing disk 16 of the present embodiment is 3, and the driving shaft of polishing disk 16 connects with the main shaft of polishing motor 3 by gear train.
It is driven the workbench 8 of movement of the present invention by drive unit, and described drive unit comprises the frame 1 that is provided with guide rail 10, and workbench 8 is provided with the slide block 9 coordinating with guide rail 10, and workbench 8 can be slided on guide rail 10; Workbench 8 is provided with chain mount pad 21, frame 1 is provided with and moves horizontally drive motors 12, driven sprocket 15, by the drive sprocket 13 that moves horizontally drive motors 12 and drive, chain 14 is on drive sprocket 13 and driven sprocket 15, and two ends are connected with chain mount pad 21 respectively.Simple for controlling, the movement of workbench 8 of the present invention is horizontal linear uniform motion.For workpiece 17 is had, stablize good polishing effect, workbench 8 of the present invention is provided with the adsorbing mechanism that workbench 8 is carried out to cooling cooling body and installation workpiece 17.
Cooling body of the present invention comprises the serpentine waterways 19 being located in workbench 8, the water supply connector, the water out adapter that are communicated with serpentine waterways 19, water inlet pipe, outlet pipe are arranged on drag chain and are connected with water supply connector, water out adapter respectively, drag chain one end is fixed in frame 1, and the other end is fixed on workbench 8; Described adsorbing mechanism comprises the vacuum air-channel 20 that is located in workbench 8, is arranged on the vacuum cup being communicated with vacuum air-channel 20 on workbench 8.
On workbench 8 of the present invention, have tank and air drain, and seal by shrouding 11, thereby form serpentine waterways 19 and vacuum air-channel 20; Be provided with substrate 18 with the corresponding position of vacuum air-channel 20, on substrate 18, vacuum cup be installed.
The present embodiment is provided with lift cylinder 2 in frame 1, the piston rod of lift cylinder 2 is connected with elevator platform 5, the polishing disk 16 of the present embodiment is 6, by mounting disc 7, be arranged on elevator platform 5 respectively, and driven by polishing motor 3, the centre bore on polishing disk 16 is connected with polishing fluid part flow arrangement 4 respectively; Described mounting disc 7 is driven by the revoluting motor 6 being arranged on elevator platform 5.
When the present invention works, manipulator moves to vacuum cup by workpiece 17, under the control of PLC, workbench 8 at the uniform velocity moves by moving horizontally drive motors 12 drive levels, according to the pressure of setting, PLC is the contact area S with workpiece 17 according to the displacement approximate calculation polishing disk 16 of workbench 8, passing ratio reversal valve is determined the ascending, descending control to lift cylinder 2, polishing disk 16 revolves round the sun by mounting disc 7 in rotation, workpiece 17 is carried out to polishing, Figure 5 shows that tonnage curve map of the present invention.
Because polishing disk 16 be take the speed High Rotation Speed (existing polishing velocity is 300 revs/min of left and right) of 1000 revs/min of left and right, produce a large amount of heats, therefore, emulsus polishing fluid enters respectively the centre bore of polishing disk 16 and flows out through polishing fluid part flow arrangement 4 and carries out cooling to workpiece 17, simultaneously, cooling water also carries out cooling to workbench 8, the best effort environment when keeping polishing operation is between 25 ± 5 ℃.Emulsus polishing fluid is through reclaiming, recycling after cooling processing.
Polishing fluid part flow arrangement 4 of the present invention comprises feed tube, shunting main chamber, and shunting main chamber connects with the main shaft of polishing motor 3, and shunting main chamber connects with the centre bore of polishing disk 16 by isocon; Feed tube and shunting are sealed by seal between main chamber, isocon and the centre bore of polishing disk 16, to guarantee that polishing disk 16 does not spill at rotation emulsus polishing fluid when revolving round the sun.
The present invention is when polishing disk 16 is rotated, and the workbench 8 that is placed with workpiece 17 carries out horizontal linear and moves, and meanwhile, polishing disk 16 revolves round the sun by mounting disc 7 in rotation.Like this, the one, due to the intermittent operation of being finished to of workpiece 17, cool time is longer, can effectively prevent workpiece 17 fragmentations that heat concentrations causes, thus polishing disk 16 can be rotated with a fair speed, thereby realize high speed polishing operation; The 2nd, because the horizontal linear of workbench 8 moves, avoided the linear velocity difference of workpiece 17 long-time grindings, thereby improved finished product rate; The 3rd, because the shape of workpiece 17 is with square in the majority, workbench 8 can be arranged to square, makes the space availability ratio of workbench 8 high, has reduced the requirement to pendulum; The 4th, the workpiece on workbench 8 only has part all the time in polishing disk 16 times, when " stir-fry machine " phenomenon occurs, only has the workpiece 17 under polishing disk 16 to be damaged, thereby has reduced the loss that " stir-fry machine " brings to processing; Meanwhile, the present invention has greatly improved production efficiency and has laid the foundation for realizing streamline production, and burnishing device rational and compact, Operation and Maintenance are simple and convenient, failure rate is low, service life of equipment are long.
Claims (6)
1. the burnishing device of a curved surface polishing machine, it comprises frame, frame is provided with rotatable polishing disk, it is characterized in that frame is provided with realizes polishing disk and the workpiece on mobile workbench is applied to the dynamic pressurized device of setting pressure, and described dynamic pressurized device keeps applying the pressure of setting by the polishing disk being arranged on elevator platform to workpiece.
2. the burnishing device of curved surface polishing machine according to claim 1, is characterized in that described workbench is square.
3. the burnishing device of curved surface polishing machine according to claim 1, it is characterized in that described dynamic pressurized device comprises is arranged on the lift cylinder of being controlled by PLC in frame, the displacement transducer of testing platform displacement, the cylinder block of lift cylinder is arranged in frame, and the piston rod of lift cylinder is connected with elevator platform; PLC is according to the displacement calculation polishing disk of workbench and the contact area of workpiece, and passing ratio reversal valve is determined the ascending, descending control to lift cylinder, realizes polishing disk and workpiece is applied to the pressure of setting.
4. the burnishing device of curved surface polishing machine according to claim 3, it is characterized in that the pressure that described polishing disk applies setting to workpiece is P=(F-G)/S, F is the pressure that polishing disk imposes on workpiece, G is the weight of elevator platform, the working face that S is polishing disk and the contact area of workpiece; The contact area approximate calculation of the working face of described polishing disk and workpiece is:
In formula, S represents the approximate contact area of polishing disk and workpiece, and R represents the radius of polishing disk, and H represents the relative shift of workbench, R >=H, cos α=(R-H)/R; Or
In formula, S represents the approximate contact area of polishing disk and workpiece, and R represents the radius of polishing disk, and H represents the relative shift of workbench, H > R, cos α=(H-R)/R.
5. according to the burnishing device of the curved surface polishing machine described in claim 1 or 2 or 3 or 4, it is characterized in that described polishing disk is arranged in mounting disc, polishing disk is driven by the polishing motor being arranged on elevator platform, and described mounting disc is driven by the revoluting motor being arranged on elevator platform.
6. the burnishing device of curved surface polishing machine according to claim 5, is characterized in that described polishing disk is 2～8, and the driving shaft of polishing disk connects with the main shaft of polishing motor by gear train.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310734762.XA CN103737472B (en) | 2013-12-27 | 2013-12-27 | The burnishing device of curved surface polishing machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310734762.XA CN103737472B (en) | 2013-12-27 | 2013-12-27 | The burnishing device of curved surface polishing machine |
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| Publication Number | Publication Date |
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| CN103737472A true CN103737472A (en) | 2014-04-23 |
| CN103737472B CN103737472B (en) | 2016-10-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310734762.XA Active CN103737472B (en) | 2013-12-27 | 2013-12-27 | The burnishing device of curved surface polishing machine |
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| CN (1) | CN103737472B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106378670A (en) * | 2016-12-08 | 2017-02-08 | 宇晶机器（长沙）有限公司 | 3D (Three-Dimensional) concave surface polishing method |
| CN107953247A (en) * | 2017-12-13 | 2018-04-24 | 无锡上机数控股份有限公司 | Numerical control pneumatic lifts bistrique |
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|---|---|---|---|---|
| US5908530A (en) * | 1995-05-18 | 1999-06-01 | Obsidian, Inc. | Apparatus for chemical mechanical polishing |
| CN1228367A (en) * | 1997-12-04 | 1999-09-15 | 日本电气株式会社 | Wafer polishing apparatus and polishing method |
| US20010009843A1 (en) * | 1998-04-24 | 2001-07-26 | Kazuto Hirokawa | Polishing apparatus |
| CN101357447A (en) * | 2008-09-02 | 2009-02-04 | 河南安飞电子玻璃有限公司 | Plate glass surface grinding device and method |
| CN102229093A (en) * | 2011-07-01 | 2011-11-02 | 中国电子科技集团公司第四十五研究所 | Lifting and pressing mechanism applied to wafer polishing equipment |
| CN203680003U (en) * | 2013-12-27 | 2014-07-02 | 湖南宇晶机器股份有限公司 | Polishing device of curved polishing machine |
-
2013
- 2013-12-27 CN CN201310734762.XA patent/CN103737472B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5908530A (en) * | 1995-05-18 | 1999-06-01 | Obsidian, Inc. | Apparatus for chemical mechanical polishing |
| CN1228367A (en) * | 1997-12-04 | 1999-09-15 | 日本电气株式会社 | Wafer polishing apparatus and polishing method |
| US20010009843A1 (en) * | 1998-04-24 | 2001-07-26 | Kazuto Hirokawa | Polishing apparatus |
| CN101357447A (en) * | 2008-09-02 | 2009-02-04 | 河南安飞电子玻璃有限公司 | Plate glass surface grinding device and method |
| CN102229093A (en) * | 2011-07-01 | 2011-11-02 | 中国电子科技集团公司第四十五研究所 | Lifting and pressing mechanism applied to wafer polishing equipment |
| CN203680003U (en) * | 2013-12-27 | 2014-07-02 | 湖南宇晶机器股份有限公司 | Polishing device of curved polishing machine |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106378670A (en) * | 2016-12-08 | 2017-02-08 | 宇晶机器（长沙）有限公司 | 3D (Three-Dimensional) concave surface polishing method |
| CN106378670B (en) * | 2016-12-08 | 2019-04-26 | 宇晶机器（长沙）有限公司 | A kind of method of the concave surface 3D polishing |
| CN107953247A (en) * | 2017-12-13 | 2018-04-24 | 无锡上机数控股份有限公司 | Numerical control pneumatic lifts bistrique |
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| CN103737472B (en) | 2016-10-05 |
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Application publication date: 20140423 Assignee: Hunan Yiyuan New Material Technology Co.,Ltd. Assignor: HUNAN YUJING MACHINE INDUSTRIAL Co.,Ltd. Contract record no.: X2023980050763 Denomination of invention: Polishing device of curved surface polishing machine Granted publication date: 20161005 License type: Common License Record date: 20231213 |