TW201334908A - Controller for pin mounting machine and its program product - Google Patents
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Abstract
Description
本發明是有關於一種用於加工機之控制器,特別是指一種用於上銷加工機(pinning machine)之控制器及其程式產品。The present invention relates to a controller for a processing machine, and more particularly to a controller for a pinning machine and a program product thereof.
在基板的製作流程中,上銷作業主要是為了讓各基板藉由銷(pin)而對位並固定;常見的上銷作業包括一鑽(drill)銷孔程序、一植(insert)銷程序,及一擊(hammer)銷程序;一般而言,前述上銷作業的各程序間並不連貫,需由作業員介入操作、分段進行;而且,該植銷程序通常是由作業員以手動的方式完成。因此,前述上銷作業整體的花費時間,大幅地受限於人工作業所需之時間。In the manufacturing process of the substrate, the loading operation is mainly for the substrates to be aligned and fixed by pins; common uploading operations include a drill pin hole program and an insert pin program. And the hammering procedure; generally speaking, the procedures of the aforementioned sales operations are inconsistent, and the operation is performed by the operator, and the segmentation is performed; and the planting procedure is usually manually performed by the operator. The way to complete. Therefore, the overall time taken for the above-mentioned sales operation is greatly limited by the time required for manual work.
又,如日本特開2006-339318號案所揭露的一種印刷機板外形加工機與擊銷單元,該印刷機板外形加工機可進行一鑽銷孔程序及一擊銷程序;其中,在完成該鑽銷孔程序之加工後,與該鑽銷孔程序相關的資訊(例如,加工的銷孔位置、加工的銷孔數目等)會被更新,以供後續的該擊銷程序所用。然而,該鑽銷孔程序及該擊銷程序間亦不連貫,仍需由作業員介入操作、分段進行。Further, a printing machine board profile processing machine and a pinning unit disclosed in Japanese Laid-Open Patent Publication No. 2006-339318, wherein the printing plate shape processing machine can perform a drilling pin hole program and a pinning program; After processing the drill hole program, information related to the drill hole program (eg, the position of the machined pin hole, the number of machined pin holes, etc.) is updated for subsequent use by the attorney program. However, the drill hole hole program and the hitting program are also inconsistent, and still need to be intervened by the operator and segmented.
因此,本發明之第一目的,即在提供一種可自動產生一加工程式碼的用於上銷加工機之控制器。該上銷加工機適用於對一基板進行一上銷作業,該上銷作業包括一鑽銷孔程序及一植銷程序,該鑽銷孔程序用以於該基板上的一鑽銷孔位置鑽一銷孔,該植銷程序用以於該基板上的該鑽銷孔位置植入一銷。Accordingly, it is a first object of the present invention to provide a controller for an upper processing machine that automatically generates a machining program code. The upper pin processing machine is adapted to perform an upper pinning operation on a substrate, the upper pin working operation comprising a drilling pin hole program and a planting pin program, wherein the drilling pin hole program is used for drilling a drill hole hole on the substrate a pin hole for implanting a pin at the drill hole location on the substrate.
於是,本發明用於上銷加工機之控制器包含一記憶單元、一解析模組,及一程式碼產生模組。Therefore, the controller for the upper processing machine of the present invention comprises a memory unit, an analysis module, and a code generation module.
該記憶單元儲存有一預設資料組,該預設資料組包括相對於一工作原點的一銷座標,及該銷的一銷直徑,其中,該銷座標對應於該鑽銷孔位置。該解析模組解析該預設資料組以得到該銷座標及該銷直徑。該程式碼產生模組根據該銷座標及該銷直徑產生一加工程式碼,並將該加工程式碼儲存於該記憶單元;其中,該程式碼產生模組根據該銷座標及該銷直徑產生相關於該鑽銷孔程序的一鑽銷孔程式碼區段,該程式碼產生模組還根據該銷座標產生相關於該植銷程序的一植銷程式碼區段,該加工程式碼包括該鑽銷孔程式碼區段及該植銷程式碼區段。The memory unit stores a preset data set, the preset data set includes a pin coordinate relative to a working origin, and a pin diameter of the pin, wherein the pin coordinate corresponds to the drill hole position. The parsing module parses the preset data set to obtain the pin coordinate and the pin diameter. The code generating module generates a processing code according to the pin coordinate and the pin diameter, and stores the processing code in the memory unit; wherein the code generating module generates a correlation according to the pin coordinate and the pin diameter In the drill hole code section of the drill hole hole program, the code generation module further generates a plant code segment corresponding to the planting program according to the pin coordinate, the machining code including the drill Pinhole code section and the code segment.
本發明之第二目的,即在提供一種內儲用於上銷加工機的加工程式碼之程式產品。該上銷加工機包括一主軸模組、一夾持模組,一容置有多個刀具的刀庫,及一容置有多個銷的銷庫。A second object of the present invention is to provide a program product for storing a machining program code for a loading machine. The upper pin processing machine comprises a spindle module, a clamping module, a magazine housing the plurality of tools, and a pin magazine housing the plurality of pins.
於是,本發明內儲用於上銷加工機的加工程式碼之程式產品,經由一控制器的一解譯模組解譯該加工程式碼以產生一鑽銷孔指令集,及一植銷指令集;其中,該鑽銷孔指令集用以使該上銷加工機進行一鑽銷孔程序,該鑽銷孔程序包括:使該夾持模組抓取該刀庫的其中一刀具,並將其所抓取的該刀具載入該主軸模組;及使該主軸模組移動至對準一基板上的一鑽銷孔位置,並於該基板上的該鑽銷孔位置鑽一銷孔。Therefore, the program product for storing the processing code of the processing machine of the present invention interprets the processing code through an interpreting module of a controller to generate a drill hole command set and a planting instruction The drill hole command set is configured to cause the upper pin processing machine to perform a drill hole hole program, the drill hole hole program comprising: causing the clamping module to grab one of the tool magazines, and The tool captured by the tool is loaded into the spindle module; and the spindle module is moved to a position of a drill hole on a substrate, and a pin hole is drilled in the drill hole position on the substrate.
其中,該植銷指令集用以使該上銷加工機進行一植銷程序,該植銷程序包括:使該夾持模組抓取該銷庫的其中一銷;及使該夾持模組移動至對準該基板上的該鑽銷孔位置,並將該其所抓取的該銷植入該基板上的該鑽銷孔位置。Wherein, the planting instruction set is used to cause the loading machine to perform a planting process, the planting process comprising: causing the clamping module to grasp one of the pins of the pin magazine; and making the clamping module Moving to align the drill hole location on the substrate and implanting the pin that it grips into the drill hole location on the substrate.
本發明之功效在於:由於該加工程式碼可由本發明之控制器根據該預設資料組自動地產生,因此,降低了需要訓練作業員以使其具備撰寫加工程式碼的能力之時間;再者,由於該上銷加工機所進行的該上銷作業為全自動一貫作業,因此,該上銷作業整體的花費時間不再受限於人工作業所需之時間。The effect of the present invention is that since the processing code can be automatically generated by the controller of the present invention according to the preset data set, the time required to train the operator to have the ability to write the processing code is reduced; Since the up-selling operation performed by the loading machine is a fully automatic operation, the overall time spent on the sales operation is no longer limited by the time required for manual work.
有關本發明之前述及其他技術內容、特點與功效,在以下配合參考圖式之二個較佳實施例的詳細說明中,將可清楚的呈現。The above and other technical contents, features and advantages of the present invention will be apparent from the following detailed description of the preferred embodiments of the invention.
在本發明被詳細描述之前,要注意的是,在以下的說明內容中,類似的元件是以相同的編號來表示。Before the present invention is described in detail, it is noted that in the following description, similar elements are denoted by the same reference numerals.
請參閱圖1,本發明用於上銷加工機1之控制器2的一第一較佳實施例包含一記憶單元21、一解析模組(parser)22、一程式碼產生模組(code generator)23,及一解譯模組(interpreter)24;該上銷加工機1電連接於該控制器2且適用於對一基板進行一上銷作業。本第一較佳實施例中,該基板係指一墊板(back-up board)。Referring to FIG. 1, a first preferred embodiment of the controller 2 for the upper processing machine 1 of the present invention comprises a memory unit 21, a parser 22, and a code generator. 23, and an interpreter 24; the upper processing machine 1 is electrically connected to the controller 2 and is adapted to perform a loading operation on a substrate. In the first preferred embodiment, the substrate refers to a back-up board.
其中,該記憶單元21儲存有一預設資料組;該解析模組22用以解析該預設資料組;該程式碼產生模組23用以根據該解析模組22的解析結果產生一加工程式碼,並將該加工程式碼儲存於該記憶單元21;該解譯模組24用以解譯該加工程式碼,以使該上銷加工機1進行該上銷作業。在本第一較佳實施例中,該加工程式碼係採用標準的數控(Numerical Control,簡稱NC)程式碼來實現。The memory unit 21 stores a preset data set; the parsing module 22 is configured to parse the preset data set; the code generating module 23 is configured to generate a processing code according to the parsing result of the parsing module 22 And storing the processing code in the memory unit 21; the interpretation module 24 is configured to interpret the processing code to enable the loading machine 1 to perform the loading operation. In the first preferred embodiment, the processing code is implemented by using a standard numerical control (NC) code.
請參閱圖2與圖3,整體來說,該上銷作業包括一鑽銷孔程序、一鑽導引孔程序、一植銷程序,及一擊銷程序;然,每次的上銷作業中所需進行的程序與其作業環境及條件(例如,一基板31的材質有關);舉例來說,如圖2所示,當該基板31的材質屬於軟質(例如,壓合板),由於一銷41可輕易地被植入該基板31的一銷孔311,故,該上銷作業中可以僅進行該鑽銷孔程序及該植銷程序;當該基板31的材質屬於硬質(例如,酚醛樹脂(bakelite)板(俗稱尿素板)),為了使該銷41可穩固地被植入該基板31的該銷孔311,在該銷41被植入該銷孔311後需進一步被擊打,故,該上銷作業中除了進行該鑽銷孔程序及該植銷程序之外,還於該植銷程序之後進行該擊銷程序;較佳地,如圖3所示,針對該基板31的材質屬於硬質的情況,為了使在該銷41在被植入該銷孔311的過程中不易掉出,以降低漏(miss)植的機率,該上銷作業中除了進行該鑽銷孔程序、該植銷程序,及該擊銷程序之外,還於該植銷程序之前進行該鑽導引孔程序。Referring to FIG. 2 and FIG. 3, in general, the loading operation includes a drill hole hole program, a drill guide hole program, a planting program, and a hitting program; The required procedure is related to the working environment and conditions (for example, the material of a substrate 31); for example, as shown in FIG. 2, when the material of the substrate 31 is soft (for example, a plywood), due to a pin 41 The pin hole 311 of the substrate 31 can be easily implanted, so that the drill hole hole program and the planting program can be performed only in the upper pin operation; when the material of the substrate 31 is hard (for example, phenolic resin ( a bakelite plate (commonly known as a urea plate)), in order to enable the pin 41 to be stably implanted in the pin hole 311 of the substrate 31, after the pin 41 is implanted into the pin hole 311, it needs to be further hit, so In the loading operation, in addition to performing the drilling hole hole program and the planting program, the marking process is performed after the planting program; preferably, as shown in FIG. 3, the material for the substrate 31 belongs to In a rigid case, in order to prevent the pin 41 from falling out during the process of being inserted into the pin hole 311, Probability (miss) plant, which in addition to the operation of the pin pin hole drilling program, the program outside of the planting pin, and the pin hit program, also the drill guide hole in the program before the program planting pin.
請參閱圖1與圖3,在進行該上銷作業之前,該基板31的材質係預先選定,因此該上銷作業所需進行的程序亦隨之確定;而且,該基板31的一基板厚度(以d board 表示)、該銷41的一銷直徑(以Φ pin 表示)及一銷長度(以l pin 表示),及相對於一工作原點的至少一銷座標皆為已知,其中,每一銷座標對應於該鑽銷孔程序中在該基板31上鑽該銷孔311的一鑽銷孔位置。更進一步來說,該記憶單元21內所儲存的該預設資料組係在進行該上銷作業前即已預先設定,該預設資料組包括一鑽導引孔旗標(flag)、一擊銷旗標、該基板厚度、該銷直徑、該銷長度,及該銷座標。Referring to FIG. 1 and FIG. 3, before the loading operation, the material of the substrate 31 is pre-selected, so the procedure required for the loading operation is also determined; and the thickness of a substrate of the substrate 31 ( a pin diameter of the pin 41 (in d board shown) in Φ pin) and a pin length (expressed in l pin), and at least one pin with respect to the coordinate origin of a work are all known, wherein each A pin coordinate corresponds to a drill hole position of the pin hole 311 drilled in the substrate 31 in the drill hole hole program. Further, the preset data group stored in the memory unit 21 is pre-set before the uploading operation, and the preset data group includes a drill guide hole flag and a blow. A pin flag, a thickness of the substrate, a diameter of the pin, a length of the pin, and a pin coordinate.
請參閱圖1與圖4,該控制器2係進行以下步驟,以產生該加工程式碼。Referring to FIG. 1 and FIG. 4, the controller 2 performs the following steps to generate the processing code.
在步驟501中,該控制器2的該解析模組22解析該記憶單元21內所儲存的該預設資料組,以得到該鑽導引孔旗標、該擊銷旗標、該基板厚度、該銷直徑、該銷長度,及該銷座標。In step 501, the parsing module 22 of the controller 2 parses the preset data set stored in the memory unit 21 to obtain the drill guide hole flag, the hit flag, the thickness of the substrate, The pin diameter, the pin length, and the pin coordinates.
在步驟502中,該控制器2的該程式碼產生模組23根據步驟501所解析出的該鑽導引孔旗標進行判斷,若該鑽導引孔旗標等於一第一設定值,則繼續進行步驟503;否則(該鑽導引孔旗標等於一第二設定值)繼續進行步驟504。在本第一較佳實施例中,該第一設定值為1,且該第二設定值為0。In step 502, the code generation module 23 of the controller 2 determines according to the drill guide hole flag parsed in step 501, and if the drill guide hole flag is equal to a first set value, Proceed to step 503; otherwise (the drill guide hole flag is equal to a second set value) proceed to step 504. In the first preferred embodiment, the first set value is 1, and the second set value is 0.
在步驟503中,該程式碼產生模組23根據步驟501所解析出的該銷直徑及該銷座標,產生相關於該鑽導引孔程序的一鑽導引孔程式碼區段,該加工程式碼包括該鑽導引孔程式碼區段。在本第一較佳實施例中,該程式碼產生模組23係根據步驟501所解析出的該銷直徑、該銷座標,及該基板厚度,產生該鑽導引孔程式碼區段;更進一步來說,該程式碼產生模組23係根據該銷直徑產生一導引孔直徑,再根據該導引孔直徑決定一鑽導引孔刀具資料(例如,用於鑽導引孔的刀具編號),並根據該基板厚度產生一導引孔深度,然後,根據該銷座標、該鑽導引孔刀具資料,及該導引孔深度產生該鑽導引孔程式碼區段。In step 503, the code generation module 23 generates a drill guide hole code segment associated with the drill guide hole program according to the pin diameter and the pin coordinate resolved in step 501. The code includes the drill guide hole code section. In the first preferred embodiment, the code generating module 23 generates the drill guide hole code segment according to the pin diameter, the pin coordinate, and the substrate thickness analyzed in step 501; Further, the code generation module 23 generates a guide hole diameter according to the diameter of the pin, and then determines a drill guide hole tool data according to the diameter of the guide hole (for example, a tool number for drilling the guide hole) And generating a guiding hole depth according to the thickness of the substrate, and then generating the drilling guiding hole code segment according to the pin coordinate, the drilling guiding hole tool data, and the guiding hole depth.
在步驟504中,該程式碼產生模組23根據步驟501所解析出的該銷直徑及該銷座標,產生相關於該鑽銷孔程序的一鑽銷孔程式碼區段,該加工程式碼還包括該鑽銷孔程式碼區段。在本第一較佳實施例中,該程式碼產生模組23係根據步驟501所解析出的該銷直徑、該銷座標、該基板厚度,及該銷長度,產生該鑽銷孔程式碼區段;更進一步來說,該程式碼產生模組23係根據該銷直徑決定一鑽銷孔刀具資料(例如,用於鑽銷孔的刀具編號),再根據該基板厚度及該銷長度產生一銷孔深度,然後,根據該銷座標、該銷孔深度,及該鑽銷孔刀具資料產生該鑽銷孔程式碼區段。In step 504, the code generation module 23 generates a drill hole code segment associated with the drill hole program according to the pin diameter and the pin coordinate resolved in step 501, and the processing code is further The drill hole code code section is included. In the first preferred embodiment, the code generating module 23 generates the drill hole code area according to the pin diameter, the pin coordinate, the substrate thickness, and the pin length analyzed in step 501. Further, the code generation module 23 determines a drill hole tool data (for example, a tool number for the drill hole) according to the pin diameter, and generates a one according to the thickness of the substrate and the length of the pin. The pin hole depth, and then the drill hole code segment is generated based on the pin coordinate, the pin hole depth, and the drill hole tool data.
更進一步來說,如圖3所示,假設對應於一導引孔312的該導引孔直徑以Φ guide _ hole 表示,其符合:Φ pin +Δ1 Φ guide _ hole ,其中,Δ1>0;假設對應於該導引孔311的該銷孔深度以d pin _ hole 表示,其符合:d pin _ hole =d board -Δ2且d pin _ hole <l pin ,其中,Δ2>0;假設對應於該導引孔312的該導引孔深度以d guide _ hole 表示,其符合:d guide _ hole =d pin _ hole ×α=(d board -Δ2)×α,其中,0<α<1。在本第一較佳實施例中,Δ1、Δ2,及α皆為預設值。Further, as shown in FIG. 3, it is assumed that the diameter of the guiding hole corresponding to a guiding hole 312 is represented by Φ guide _ hole , which conforms to: Φ pin + Δ 1 Φ guide _ hole , where Δ 1 >0; it is assumed that the pin hole depth corresponding to the guiding hole 311 is represented by d pin _ hole , which conforms to: d pin _ hole = d board - Δ 2 and d pin _ hole < l pin , where Δ 2 >0; it is assumed that the depth of the guiding hole corresponding to the guiding hole 312 is represented by d guide _ hole , which conforms to: d guide _ hole = d pin _ hole × α = ( d board - Δ 2 ) × α, where 0 < α < 1. In the first preferred embodiment, Δ 1 , Δ 2 , and α are all preset values.
請參閱圖1,值得一提的是,雖然在本第一較佳實施例中,該銷孔深度及該導引孔深度是由該程式碼產生模組23根據該基板厚度自動地決定;然,該銷孔深度及該導引孔深度亦可被預先設定於該預設資料組中,且由該解析模組22解析而得,並不限於本第一較佳實施例所揭露。Referring to FIG. 1 , it is worth mentioning that, in the first preferred embodiment, the pin hole depth and the depth of the guiding hole are automatically determined by the code generating module 23 according to the thickness of the substrate; The depth of the pinhole and the depth of the guiding hole may be preset in the preset data set and analyzed by the analyzing module 22, and is not limited to the first preferred embodiment.
請參閱圖1與圖4,在步驟505中,該程式碼產生模組23根據步驟501所解析出的該銷座標,產生相關於該植銷程序的一植銷程式碼區段,該加工程式碼還包括該植銷程式碼區段。Referring to FIG. 1 and FIG. 4, in step 505, the code generation module 23 generates a plant code segment related to the planting program according to the pin coordinates parsed in step 501. The code also includes the planting code section.
在步驟506中,該程式碼產生模組23根據步驟501所解析出的該擊銷旗標進行判斷,若該擊銷旗標等於該第一設定值,則繼續進行步驟507;否則(該擊銷旗標等於該第二設定值)繼續進行步驟508。In step 506, the code generating module 23 determines according to the pinning flag parsed in step 501. If the pinning flag is equal to the first set value, proceeding to step 507; otherwise (the hit The pin flag is equal to the second set value) and step 508 is continued.
在步驟507中,該程式碼產生模組23根據步驟501所解析出的該銷座標,產生相關於該擊銷程序的一擊銷程式碼區段,該加工程式碼還包括該擊銷程式碼區段。In step 507, the code generating module 23 generates a pin code segment associated with the pinning program according to the pin coordinate parsed in step 501, and the processing code further includes the pin code. Section.
在步驟508中,該控制器2送出一訊號,以通知該上銷加工機1該加工程式碼已產生且可進行該上銷作業。In step 508, the controller 2 sends a signal to inform the loading machine 1 that the processing code has been generated and can be performed.
小結上述,由於該加工程式碼可由該控制器2根據該預設資料組自動地產生,當作業環境及條件有所不同而使該上銷作業所需進行的程序隨之不同時,僅需更新該預設資料組,該控制器2即可再次根據已更新的該預設資料組自動地產生新的加工程式碼;換言之,操作該上銷加工機1的作業員不需自行撰寫新的加工程式碼,甚至,作業員根本不需具備撰寫加工程式碼的能力;因此,降低了需要訓練作業員以使其具備撰寫加工程式碼的能力之時間。Summary In the above, since the processing code can be automatically generated by the controller 2 according to the preset data group, when the operating environment and conditions are different, and the programs required for the sales operation are different, only the update is required. The preset data group, the controller 2 can automatically generate a new processing code according to the updated preset data group; in other words, the operator operating the loading machine 1 does not need to write a new processing. The code, even the operator does not need to have the ability to write the machining code at all; therefore, it reduces the time required to train the operator to have the ability to write the machining code.
在完成上述步驟501~508之後,該控制器2的該解譯模組24解譯儲存於該記憶單元21的該加工程式碼,以使該上銷加工機1進行該上銷作業。After the steps 501 to 508 are completed, the interpreting module 24 of the controller 2 interprets the processing code stored in the memory unit 21 to cause the loading machine 1 to perform the loading operation.
在進一步說明該上銷作業之前,以下先對該上銷加工機1之構件進行簡述。Before further explaining the above-mentioned loading operation, the components of the upper processing machine 1 will be briefly described below.
請參閱圖5與圖6,該上銷加工機1包括一機身10、一X軸工作台11、一Y軸滑座12、一Z軸鞍座13,及至少一上銷裝置14。在本第一較佳實施例中,該上銷加工機1包括六個上銷裝置14。Referring to FIGS. 5 and 6, the upper pin processing machine 1 includes a body 10, an X-axis table 11, a Y-axis slide 12, a Z-axis saddle 13, and at least one upper pin device 14. In the first preferred embodiment, the upper pin processing machine 1 includes six upper pin devices 14.
其中,該機身10具有一床台101,及一跨設於該床台101上方的橫樑102。該X軸工作台11沿一X軸向可移動地設置於該床台101,並具有一基板放置區111,及一配件放置區112。在本第一較佳實施例中,該基板放置區111沿一Y軸向放置有六個基板31,該配件放置區112沿該Y軸向間隔放置有六個配件庫單元113,每一配件庫單元113具有一銷庫114及一刀庫115。該Y軸滑座12沿該Y軸向可移動地設置於該橫樑102。該Z軸鞍座13沿一Z軸向可移動地設置於該Y軸滑座12。The body 10 has a bed 101 and a beam 102 spanning the bed 101. The X-axis table 11 is movably disposed on the bed 101 along an X-axis and has a substrate placement area 111 and a fitting placement area 112. In the first preferred embodiment, the substrate placement area 111 is provided with six substrates 31 along a Y-axis. The accessory placement area 112 is spaced apart from the Y-axis by six accessory library units 113, each of which is provided. The library unit 113 has a pin library 114 and a magazine 115. The Y-axis slide 12 is movably disposed on the beam 102 along the Y-axis. The Z-axis saddle 13 is movably disposed in the Y-axis slide 12 along a Z-axis.
如圖6所示,每一銷庫114具有兩個銷盤116,每一刀庫115具有兩個刀盤117,每一銷盤116分別容置有不同規格的多個銷41,每一刀盤117分別容置有不同規格的多個刀具42。As shown in FIG. 6, each of the pin magazines 114 has two pin trays 116, each of which has two cutterheads 117, each of which has a plurality of pins 41 of different specifications, each of which is 117 A plurality of cutters 42 of different specifications are respectively accommodated.
每一上銷裝置14具有一設置於該Z軸鞍座13的主軸模組141、一設置於該Z軸鞍座13的夾持模組142,及一設置於該Y軸滑座12的擊鎚模組143;其中,該主軸模組141係位於該夾持模組142的旁側。更進一步來說,該主軸模組141具有一第一驅動單元144,及一主軸單元145,其中,該主軸單元145係受該第一驅動單元144驅動而沿該Z軸向昇降,並可用於在該等基板31上進行鑽孔程序;該夾持模組142具有一第二驅動單元146,及一夾持單元147,其中,該夾持單元147係受該第二驅動單元146驅動而沿該Z軸向昇降,並可用於抓取該等銷41、該等刀具42;該擊鎚模組143具有一打擊動力單元148,及一鎚頭149,其中,該鎚頭149係受該打擊動力單元148帶動而沿該Z軸向昇降,並可用於打擊位於該基板31上的其中一鑽銷孔位置32的該銷41。Each of the upper pinning devices 14 has a spindle module 141 disposed on the Z-axis saddle 13 , a clamping module 142 disposed on the Z-axis saddle 13 , and a striking disposed on the Y-axis sliding seat 12 . The hammer module 143 is located on the side of the clamping module 142. Further, the spindle module 141 has a first driving unit 144 and a spindle unit 145, wherein the spindle unit 145 is driven by the first driving unit 144 to move up and down along the Z axis, and can be used for Drilling procedures are performed on the substrates 31. The clamping module 142 has a second driving unit 146 and a clamping unit 147, wherein the clamping unit 147 is driven by the second driving unit 146. The Z-axis is raised and lowered, and can be used to grasp the pins 41 and the cutters 42. The hammer module 143 has a striking power unit 148 and a hammer head 149, wherein the hammer head 149 is subjected to the striking The power unit 148 is driven to move up and down the Z-axis and can be used to strike the pin 41 of one of the drill hole locations 32 on the substrate 31.
請參閱圖1、圖6與圖7,該控制器2的該解譯模組24解譯該加工程式碼,以使該上銷加工機1進行該上銷作業。值得一提的是,在以下說明中,係以包括該鑽導引孔程序、該鑽銷孔程序、該植銷程序,及該擊銷程序的該上銷作業作為一範例進行說明;然,實際上,該上銷作業所需進行的步驟係視其所需進行的程序而調整,並不限於本範例所揭露。再者,為了便於說明,在本範例中,僅針對其中一基板31上的其中一鑽銷孔位置32進行描述;其中,該鑽銷孔位置32與該銷座標相對應。Referring to FIG. 1 , FIG. 6 and FIG. 7 , the interpreting module 24 of the controller 2 interprets the processing code to enable the loading processing machine 1 to perform the loading operation. It is worth mentioning that, in the following description, the above-mentioned sales operation including the drill guide hole program, the drill hole hole program, the planting program, and the hitting program are described as an example; In fact, the steps required for the sales operation are adjusted according to the procedures that are required to be performed, and are not limited to the examples. Moreover, for convenience of explanation, in the present example, only one of the drill hole positions 32 on one of the substrates 31 is described; wherein the drill hole position 32 corresponds to the pin coordinates.
首先,該解譯模組24解譯該加工程式碼的該鑽導引孔程式碼區段得到一鑽導引孔指令集(command set),使該上銷加工機1進行該鑽導引孔程序61,即,使該上銷加工機1在該基板31上的該鑽銷孔位置32鑽一導引孔312;其中,該鑽導引孔程序61包括下列步驟。First, the interpreting module 24 interprets the drill guide hole code segment of the machining program code to obtain a drill guide hole command set, so that the upper pin processing machine 1 performs the drill guide hole. The program 61, that is, the upper pin processing machine 1 drills a guide hole 312 at the drill hole position 32 of the substrate 31; wherein the drill guide hole program 61 includes the following steps.
在步驟611中,使該夾持模組142與該等刀具42相對移動至該夾持模組142對準其中一刀具42,並抓取其所對準的該刀具42;在此步驟中,該夾持模組142所對準並抓取的該刀具42係與該鑽導引孔刀具資料相對應。In step 611, the clamping module 142 is moved relative to the cutters 42 to the clamping module 142 to align one of the cutters 42 and grasp the cutter 42 to which it is aligned; in this step, The tool 42 aligned and grasped by the clamping module 142 corresponds to the drill guide hole tool data.
在步驟612中,將該夾持模組142於步驟611中所抓取的該刀具42載入該主軸模組141。In step 612, the tool 42 captured by the clamping module 142 in step 611 is loaded into the spindle module 141.
在步驟613中,使該主軸模組141與該基板31相對移動至該主軸模組141對準該基板31上的該鑽銷孔位置32,並於該基板31上的該鑽銷孔位置32鑽一深度為該導引孔深度的該導引孔312。In step 613, the spindle module 141 is moved relative to the substrate 31 to the spindle module 141 for aligning the drill hole position 32 on the substrate 31, and the drill hole position 32 on the substrate 31. A guiding hole 312 having a depth of the guiding hole is drilled.
接著,該解譯模組24解譯該加工程式碼的該鑽銷孔程式碼區段得到一鑽銷孔指令集,使該上銷加工機1進行該鑽銷孔程序62,即,使該上銷加工機1在該基板31上的該鑽銷孔位置32鑽一銷孔311;其中,該鑽銷孔程序62包括下列步驟。Then, the interpreting module 24 interprets the drill hole code segment of the processing code to obtain a drill hole command set, so that the upper pin processing machine 1 performs the drill hole program 62, that is, The upper pin processing machine 1 drills a pin hole 311 at the drill hole position 32 of the substrate 31; wherein the drill hole hole program 62 includes the following steps.
在步驟621中,使該夾持模組142與該等刀具42相對移動至該夾持模組142對準其中一刀具42,並抓取其所對準的該刀具42;在此步驟中,該夾持模組142所對準並抓取的該刀具42係與該鑽銷孔刀具資料相對應。In step 621, the clamping module 142 is moved relative to the cutters 42 to the clamping module 142 to align one of the cutters 42 and grasp the cutter 42 to which it is aligned; in this step, The tool 42 aligned and grasped by the clamping module 142 corresponds to the tool hole tool data.
在步驟622中,將該夾持模組142於步驟621中所抓取的該刀具42載入該主軸模組141。In step 622, the tool 42 captured by the clamping module 142 in step 621 is loaded into the spindle module 141.
在步驟623中,使該主軸模組141與該基板31相對移動至該主軸模組141對準該基板31上的該鑽銷孔位置32,並於該基板31上的該鑽銷孔位置32鑽一深度為該銷孔深度的該銷孔311。In step 623, the spindle module 141 is moved relative to the substrate 31 until the spindle module 141 is aligned with the drill hole position 32 on the substrate 31, and the drill hole position 32 on the substrate 31 is A pin hole 311 having a depth of the pin hole is drilled.
繼而,該解譯模組24解譯該加工程式碼的該植銷程式碼區段得到一植銷指令集,使該上銷加工機1進行該植銷程序63,即,使該上銷加工機1在該基板31上的該鑽銷孔位置32植一銷41;其中,該植銷程序63包括下列步驟。Then, the interpreting module 24 interprets the planting code segment of the processing code to obtain a seeding instruction set, so that the loading machine 1 performs the planting program 63, that is, the processing of the processing The machine 1 implants a pin 41 at the drill hole location 32 on the substrate 31; wherein the flocking program 63 includes the following steps.
在步驟631中,使該夾持模組142與該等銷41相對移動至該夾持模組142對準其中一銷41,並抓取其所對準的該銷41。In step 631, the clamping module 142 is moved relative to the pins 41 to the clamping module 142 to align one of the pins 41 and grasp the pin 41 to which it is aligned.
在步驟632中,使該夾持模組142與該基板31相對移動至該夾持模組142對準該基板31上的該鑽銷孔位置32,並將該夾持模組142於步驟631中所抓取的該銷41植於該導引孔312(及/或該銷孔311)。In step 632, the clamping module 142 is moved relative to the substrate 31 to the clamping module 142 to align the drilling hole position 32 on the substrate 31, and the clamping module 142 is in step 631. The pin 41 captured in the guide hole 312 is implanted in the guiding hole 312 (and/or the pin hole 311).
最後,該解譯模組24解譯該加工程式碼的該擊銷程式碼區段得到一擊銷指令集,使該上銷加工機1進行該擊銷程序64,即,使該上銷加工機1打擊該基板31上的該鑽銷孔位置32的該銷41;其中,該擊銷程序64包括下列步驟。Finally, the interpreting module 24 interprets the hitting code section of the processing code to obtain a hitting instruction set, so that the loading machine 1 performs the hitting process 64, that is, processing the upper pin The machine 1 strikes the pin 41 of the drill hole position 32 on the base plate 31; wherein the hitting program 64 includes the following steps.
在步驟641中,使該擊鎚模組143與該基板31相對移動至該擊鎚模組143對準該基板31上的該鑽銷孔位置32。In step 641, the hammer module 143 is moved relative to the substrate 31 until the hammer module 143 is aligned with the drill hole position 32 on the substrate 31.
在步驟642中,使該擊鎚模組143打擊該基板31上的該鑽銷孔位置32的該銷41,以將該銷41擊入該導引孔312(及/或該銷孔311)。In step 642, the hammer module 143 is struck against the pin 41 of the drill hole position 32 on the substrate 31 to drive the pin 41 into the guiding hole 312 (and/or the pin hole 311). .
小結上述,由於上述之上銷作業係為一貫作業,各程序間完全不需由作業員介入操作;因此,該上銷作業整體的花費時間不再受限於人工作業所需之時間。舉例來說,假設每一基板31需進行該上銷作業的一銷數目為192,如表一所示,當加工的軸數(即,同時進行上銷作業的基板31數目)越多,本發明的一貫式的該上銷作業所需的時間並不會隨之增加,且明顯低於習知的上銷作業(手動進行植銷程序及擊銷程序)所需的時間。Summary As described above, since the above-mentioned above-mentioned pinning operation is a consistent operation, there is no need for the operator to intervene in operation between the programs; therefore, the overall time spent on the sales operation is no longer limited by the time required for manual work. For example, assume that the number of pins per substrate 31 to be subjected to the upper pinning operation is 192. As shown in Table 1, the more the number of processed axes (ie, the number of substrates 31 that are simultaneously subjected to the pinning operation), The time required for the consistent sales of the invention is not increased, and is significantly lower than the time required for the conventional sales operation (manually performing the planting procedure and the selling procedure).
請參閱圖8,本發明用於上銷加工機1之控制器7的一第二較佳實施例包含該記憶單元21及該解譯模組24;在本第二較佳實施例中,該加工程式碼係儲存於一機器可讀記錄媒體(machine readable storage medium),其實施態樣為一程式產品(program product)8;類似地,當該控制器7載入該加工程式碼至該記憶單元21並經由該解譯模組24解譯後,使該上銷加工機1進行上述之上銷作業。Referring to FIG. 8, a second preferred embodiment of the controller 7 for the upper processing machine 1 of the present invention comprises the memory unit 21 and the interpretation module 24; in the second preferred embodiment, the second preferred embodiment The processing program code is stored in a machine readable storage medium, and the implementation aspect thereof is a program product 8; similarly, when the controller 7 loads the processing code into the memory After the unit 21 is interpreted by the interpretation module 24, the loading machine 1 performs the above-mentioned over-spinning operation.
綜上所述,由於該加工程式碼可由本發明之控制器2(如圖1所示)根據該預設資料組自動地產生,因此,降低了需要訓練作業員以使其具備撰寫加工程式碼的能力之時間;再者,由於上述之上銷作業為全自動一貫作業(如圖7所示),因此,該上銷作業整體的花費時間不再受限於人工作業所需之時間;故確實能達成本發明之目的。In summary, since the processing code can be automatically generated by the controller 2 (shown in FIG. 1) of the present invention according to the preset data group, it is required to train the operator to have the writing processing code. In addition, since the above-mentioned above-mentioned sales operation is a fully automatic operation (as shown in FIG. 7), the overall time spent on the sales operation is no longer limited by the time required for manual work; It is indeed possible to achieve the object of the invention.
惟以上所述者,僅為本發明之較佳實施例而已,當不能以此限定本發明實施之範圍,即大凡依本發明申請專利範圍及發明說明內容所作之簡單的等效變化與修飾,皆仍屬本發明專利涵蓋之範圍內。The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent.
1...上銷加工機1. . . On-load processing machine
10...機身10. . . body
101...床台101. . . Bed
102...橫樑102. . . beam
11...X軸工作台11. . . X-axis workbench
111...基板放置區111. . . Substrate placement area
112...配件放置區112. . . Accessory placement area
113...配件庫單元113. . . Accessory library unit
114...銷庫114. . . Sales library
115...刀庫115. . . Tool magazine
116...銷盤116. . . Pin tray
117...刀盤117. . . Cutter
12...Y軸滑座12. . . Y-axis slide
13...Z軸鞍座13. . . Z-axis saddle
14...上銷裝置14. . . Selling device
141...主軸模組141. . . Spindle module
142...夾持模組142. . . Clamping module
143...擊鎚模組143. . . Hammer module
144...第一驅動單元144. . . First drive unit
145...主軸單元145. . . Spindle unit
146...第二驅動單元146. . . Second drive unit
147...夾持單元147. . . Clamping unit
148...打擊動力單元148. . . Strike power unit
149...鎚頭149. . . Hammerhead
2...控制器2. . . Controller
21...記憶單元twenty one. . . Memory unit
22...解析模組twenty two. . . Parsing module
23...程式碼產生模組twenty three. . . Code generation module
24...解譯模組twenty four. . . Interpretation module
31...基板31. . . Substrate
311...銷孔311. . . Pin hole
312...導引孔312. . . Guide hole
32...鑽銷孔位置32. . . Drill hole position
41...銷41. . . pin
42...刀具42. . . Tool
501~508...步驟501~508. . . step
61...鑽導引孔程序61. . . Drill guide hole program
611~613...步驟611~613. . . step
62...鑽銷孔程序62. . . Drill hole program
621~623...步驟621~623. . . step
63...植銷程序63. . . Marketing program
631~632...步驟631~632. . . step
64...擊銷程序64. . . Underwriting procedure
641~642...步驟641~642. . . step
7...控制器7. . . Controller
8...程式產品8. . . Program product
圖1是一方塊圖,說明本發明用於上銷加工機之控制器的一第一較佳實施例;Figure 1 is a block diagram showing a first preferred embodiment of the controller for the upper processing machine of the present invention;
圖2是一示意圖,說明鑽有一銷孔的一基板,及該銷孔內的一銷;Figure 2 is a schematic view showing a substrate drilled with a pin hole, and a pin in the pin hole;
圖3是一示意圖,說明鑽有該銷孔與一導引孔的該基板,及該銷孔與該導引孔內的該銷;Figure 3 is a schematic view showing the substrate with the pin hole and a guiding hole, and the pin hole and the pin in the guiding hole;
圖4是一流程圖,說明在本發明的該第一較佳實施例中,產生一加工程式碼的步驟;Figure 4 is a flow chart showing the steps of generating a processing code in the first preferred embodiment of the present invention;
圖5是一立體外觀示意圖,說明應用本發明之控制器的一上銷加工機;Figure 5 is a perspective view showing a top-loading machine for applying the controller of the present invention;
圖6是圖5的一局部放大示意圖;Figure 6 is a partial enlarged view of Figure 5;
圖7是一流程圖,說明在本發明的該第一較佳實施例中,一上銷作業的程序及步驟;及Figure 7 is a flow chart showing the procedure and steps of an up-selling operation in the first preferred embodiment of the present invention;
圖8是一方塊圖,說明本發明用於上銷加工機之控制器的一第二較佳實施例,及一程式產品。Figure 8 is a block diagram showing a second preferred embodiment of the controller for the upper processing machine of the present invention, and a program product.
1...上銷加工機1. . . On-load processing machine
14...上銷裝置14. . . Selling device
141...主軸模組141. . . Spindle module
142...夾持模組142. . . Clamping module
143...擊鎚模組143. . . Hammer module
2...控制器2. . . Controller
21...記憶單元twenty one. . . Memory unit
22...解析模組twenty two. . . Parsing module
23...程式碼產生模組twenty three. . . Code generation module
24...解譯模組twenty four. . . Interpretation module
Claims (10)
Priority Applications (1)
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TW101106002A TW201334908A (en) | 2012-02-23 | 2012-02-23 | Controller for pin mounting machine and its program product |
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TW101106002A TW201334908A (en) | 2012-02-23 | 2012-02-23 | Controller for pin mounting machine and its program product |
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TW201334908A true TW201334908A (en) | 2013-09-01 |
TWI462795B TWI462795B (en) | 2014-12-01 |
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TW101106002A TW201334908A (en) | 2012-02-23 | 2012-02-23 | Controller for pin mounting machine and its program product |
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Family Cites Families (2)
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JP4555092B2 (en) * | 2005-01-05 | 2010-09-29 | 株式会社ディスコ | Laser processing equipment |
TWM416695U (en) * | 2011-07-01 | 2011-11-21 | Dar Harnq Industry Co Ltd | Pin installation device |
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