TW201622931A - Substrate hole drilling device and control method thereof - Google Patents

Substrate hole drilling device and control method thereof Download PDF

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Publication number
TW201622931A
TW201622931A TW104142221A TW104142221A TW201622931A TW 201622931 A TW201622931 A TW 201622931A TW 104142221 A TW104142221 A TW 104142221A TW 104142221 A TW104142221 A TW 104142221A TW 201622931 A TW201622931 A TW 201622931A
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Taiwan
Prior art keywords
tool holder
spindle
light
drill
drill bit
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TW104142221A
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Chinese (zh)
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TWI674181B (en
Inventor
Keisuke Ota
Keiichi Kamoshida
Hirofumi Kado
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Via Mechanics Ltd
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Publication of TWI674181B publication Critical patent/TWI674181B/en

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0044Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047Drilling of holes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0008Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0221Perforating

Abstract

An objective of the invention is to prevent the tool holder and the spindle from being damaged under condition of delivering the drill between the spindle and the tool holder. The invention is a substrate hole drilling device. The substrate hole drilling device is disposed with a tool holder temporarily holding the drill that is delivered with the spindle on the working table. Its characteristics are consisted of a light emitter, a sensor, a control portion. The foregoing light emitter generates a tool holder check light interrupted by the drill held at the tool holder in the state where the working table is in a specified position. The sensor senses the tool holder check light. The control portion allows the working table to move toward the specific position under condition of trying to deliver the drill between the spindle and the tool holder and issues an alarm in case that the sensor is unable to sense the tool holder check light.

Description

基板開孔裝置及其控制方法 Substrate opening device and control method thereof

本發明係有關於基板開孔裝置及其控制方法,所述基板開孔裝置設置有刀架,所述刀架用於在例如交換用於進行在印刷基板上開孔的鑽頭的情況下等,暫時保持鑽頭。 The present invention relates to a substrate opening device and a control method thereof, the substrate opening device being provided with a tool holder for, for example, exchanging a drill for performing a hole in a printed substrate, etc. Keep the drill bit temporarily.

在基板開孔裝置中,存在具備供給用刀架和退出用刀架的基板開孔裝置,在交換鑽頭的情況下等,所述供給用刀架用於在欲將已從鑽頭盒(drill cassette)取出的新鑽頭移至主軸上之前暫時保持前述新鑽頭,所述退出用刀架用於在將主軸保持著的舊鑽頭收納至鑽頭盒中之前暫時保持前述舊鑽頭。 In the substrate opening device, there is a substrate opening device including a supply tool holder and an exit tool holder. In the case of exchanging a drill, the supply tool holder is used to be used from a drill case. The new drill bit is temporarily held until the new drill bit is removed, and the exit tool holder is used to temporarily hold the old drill bit before the old drill bit holding the spindle is received in the drill bit.

在這樣的基板開孔裝置中,如果由於某些原因,在欲從供給用刀架將新鑽頭移至主軸上的情況下,在主軸上留有舊鑽頭,或者在欲將主軸保持著的舊鑽頭移至退出用刀架上的情況下,在退出用刀架上留有鑽頭,就會存在下述可能:在刀架或主軸上鑽頭彼此碰撞,損壞刀架或主軸。 In such a substrate opening device, if, for some reason, a new drill bit is to be moved from the supply tool holder to the main shaft, an old drill bit is left on the main shaft, or the old one is to be held in the main shaft. In the case where the drill bit is moved to the exit tool holder, the drill bit is left on the exit tool holder, and there is a possibility that the drill bit collides with each other on the tool holder or the spindle, damaging the tool holder or the spindle.

在專利文獻1中,公開了具備供給用刀架和退出用刀架的基板開孔裝置,但關於如上所述的刀架和主軸的損壞未有提及。 Patent Document 1 discloses a substrate opening device including a supply tool holder and an exit tool holder. However, damage to the tool holder and the main shaft as described above has not been mentioned.

專利文獻1:日本特許第3038114號公報。 Patent Document 1: Japanese Patent No. 3038114.

因此,本發明的目的在於,防止在欲在主軸與刀架之間進行鑽頭的交接的情況下的刀架和主軸的損壞。 Accordingly, it is an object of the present invention to prevent damage to the tool holder and the main shaft in the case where the transfer of the drill bit is to be performed between the main shaft and the tool holder.

為了解決上述問題,在技術方案1中記載的基板開孔裝置中,在加工臺上設置有將在與主軸之間進行交接的鑽頭暫時保持的刀架,其特徵在於:前述基板開孔裝置具備發光器、感測器、控制部;前述發光器產生刀架校對光,前述刀架校對光在前述加工台處於特定位置的狀態下被保持在前述刀架上的鑽頭遮擋;前述感測器感知前述刀架校對光;前述控制部在欲在前述主軸和前述刀架間進行鑽頭的交接的情況下,使前述加工台向前述特定位置移動,若前述感測器不能夠感知前述刀架校對光,則發出警報。 In the substrate opening device according to the first aspect of the invention, the tool holder is provided with a holder for temporarily holding a drill that is transferred between the spindle and the spindle, wherein the substrate opening device is provided. The illuminator, the sensor, and the control unit; the illuminator generates the tool holder collating light, and the tool holder collating the light is blocked by the drill bit held on the tool holder in a state where the processing table is at a specific position; the sensor senses The tool holder corrects light; when the control unit is to transfer the drill between the spindle and the tool holder, the processing unit moves the processing table to the specific position, and the sensor does not sense the tool holder calibration light. , an alert is issued.

在技術方案2中記載的基板開孔裝置中,在技術方案1中記載的基板開孔裝置中,其特徵在於:前述發光器能夠產生主軸校對光,在前述主軸處於既定位置的狀態下,若在該主軸上保持有鑽頭,則前述主軸校對光被該鑽頭遮擋;前述感測器能夠感知前述主軸校對光;前述控制部使前述主軸向前述既定位置移動,若前述感測器不能夠感知到前述主軸校對光,則發出警報。 In the substrate hole drilling device according to the first aspect of the invention, the substrate illuminating device according to the first aspect of the invention, wherein the illuminator is capable of generating spindle alignment light, and if the spindle is at a predetermined position, Holding the drill on the main shaft, the spindle collating light is blocked by the drill; the sensor can sense the spindle collating light; and the control unit moves the main axis to the predetermined position, if the sensor is not capable of sensing When the aforementioned spindle collates the light, an alarm is issued.

在技術方案3中記載的基板開孔裝置中,在技術方案1中記載的基板開孔裝置中,其特徵在於:前述刀架包括供給用刀架和退出用刀架,前述供給用刀架暫時保持向前述主軸供給的鑽頭,前述退出用刀架暫時保持從前述主軸退出的鑽頭,前述供給用刀架及前述退出用刀架設置成在前述刀架校對光的方向上排列在一條直線上。 The substrate boring device according to the first aspect of the invention, wherein the tool holder includes a supply turret and a detaching turret, and the supply turret temporarily The drill that is supplied to the spindle is held, and the exit tool holder temporarily holds the drill that has withdrawn from the spindle, and the supply tool holder and the exit tool holder are arranged in a line in the direction in which the tool holder corrects light.

在技術方案4中記載的基板開孔裝置中,在技術方案1至3中任意一項記載的基板開孔裝置中,其特徵在於:前述發光器和前述感測器安裝在可動地搭載前述主軸的柱上。 In the substrate boring device according to any one of the first to third aspects of the present invention, the illuminator and the sensor are movably mounted on the spindle. On the column.

在技術方案5中記載的基板開孔裝置的控制方法中,前述基板開孔裝置在加工臺上設置有將在與主軸之間進行交接的鑽頭暫時保持的刀架,其特徵在於:包括以下步驟:使刀架校對光產生的步驟,前述刀架校對光在前述加工台處於特定位置的狀態下,在鑽頭保持在前述刀架上的情況下,被該鑽頭遮擋;在欲在前述主軸和前述刀架間進行鑽頭的交接的情況下使前述加工台移動至前述特定位置的步驟;判定在前述加工台處於前述特定位置的狀態下前述刀架校對光是否被遮擋的刀架校對步驟;在前述刀架校對步驟中前述刀架校對光被遮擋的情況下發出警報的步驟。 In the method of controlling a substrate opening device according to the fifth aspect of the invention, the substrate opening device includes a tool holder for temporarily holding a drill bit that is transferred between the main shaft and the workpiece, and the method includes the following steps a step of causing the tool holder to collate the light, wherein the tool holder collimating light is blocked by the drill bit while the drill bit is held on the tool holder in a state where the processing table is at a specific position; a step of moving the processing table to the specific position when the drill bit is transferred between the tool holders; and a tool holder proofreading step of determining whether the tool holder collision light is blocked in a state where the processing table is at the specific position; The step of issuing an alarm in the case where the tool holder collimates the light in the tool holder proofreading step.

在技術方案6中記載的基板開孔裝置的控制方法中,在技術方案5中記載的基板開孔裝置的控制方法中,其特徵在於:包括以下步驟:產生主軸校對光的步驟,前述主軸校對光在前述主軸處於既定位置的狀態下,若在該主軸上保持有鑽頭,則被該鑽頭遮擋;使前述主軸向前述既定位置移動的步驟;判定在前述主軸處於前述既定位置的狀態下前述主軸校對光是否被遮擋的主軸校對步驟;在前述主軸校對步驟中前述主軸校對光被遮擋的情況下發出警報的步驟。 The method for controlling a substrate opening device according to the invention of claim 5, further comprising the step of: generating a spindle collating light, the spindle alignment a state in which the drill is blocked by the drill while the spindle is at a predetermined position, and the step of moving the predetermined position of the main axis; and determining that the spindle is in the predetermined position A step of collating the spindle for correcting whether the light is blocked; a step of issuing an alarm in the case where the aforementioned collimator collation light is blocked in the aforementioned spindle proofreading step.

在技術方案7中記載的基板開孔裝置的控制方法中,在技術方案5中記載的基板開孔裝置的控制方法中,其特徵在於:前述刀架包括供給用刀架和退出用刀架,前述供給用 刀架暫時保持向前述主軸供給的鑽頭,前述退出用刀架暫時保持從前述主軸退出的鑽頭,前述供給用刀架及前述退出用刀架設置成在前述刀架校對光的方向上排列在一條直線上。 The method of controlling a substrate opening device according to the invention of claim 5, wherein the tool holder includes a supply tool holder and an exit tool holder, The aforementioned supply The tool holder temporarily holds the drill bit supplied to the spindle, and the exit tool holder temporarily holds the drill bit that is withdrawn from the spindle. The supply tool holder and the exit tool holder are arranged in a direction in which the tool holder corrects light. On the line.

根據本發明,能夠防止欲在主軸和刀架之間進行鑽頭的交接的情況下的刀架和主軸的損壞。 According to the present invention, it is possible to prevent damage of the tool holder and the main shaft in the case where the transfer of the drill bit is to be performed between the main shaft and the tool holder.

1‧‧‧裝置基台 1‧‧‧ device abutment

2‧‧‧加工台 2‧‧‧Processing table

3‧‧‧印刷基板 3‧‧‧Printing substrate

4‧‧‧門型柱 4‧‧‧Door column

5‧‧‧橫向滑板 5‧‧‧ Horizontal skateboarding

6‧‧‧主軸 6‧‧‧ Spindle

7‧‧‧鑽頭 7‧‧‧ drill bit

8‧‧‧副夾具 8‧‧‧Sub-clamp

9‧‧‧供給用刀架 9‧‧‧Supply tool holder

10‧‧‧退出用刀架 10‧‧‧Without tool holder

11‧‧‧鑽頭盒 11‧‧‧Drill box

13‧‧‧發光器 13‧‧‧ illuminator

14‧‧‧感測器 14‧‧‧Sensor

15‧‧‧光線(刀架校對光、主軸校對光) 15‧‧‧Light (knife proofreading light, spindle proofing light)

16‧‧‧顯示部 16‧‧‧Display Department

20‧‧‧整體控制部(控制部) 20‧‧‧ overall control department (control department)

圖1是作為本發明的一實施例的基板開孔裝置的結構示意圖。 1 is a schematic view showing the structure of a substrate opening device as an embodiment of the present invention.

圖2是表示在本發明的一實施例中主軸與光線的位置關係的圖。 Fig. 2 is a view showing a positional relationship between a main shaft and light rays in an embodiment of the present invention.

圖3是在本發明的一實施例中、在加工開始時用主軸重新保持鑽頭的情況的流程圖。 Fig. 3 is a flow chart showing a state in which the drill bit is re-held by the spindle at the start of machining in an embodiment of the present invention.

圖4是在本發明的一實施例中、在加工途中交換鑽頭的情況的流程圖。 4 is a flow chart showing a state in which a drill bit is exchanged during processing in an embodiment of the present invention.

圖5是在本發明的一實施例中、使加工動作結束的情況的流程圖。 Fig. 5 is a flow chart showing a state in which a machining operation is completed in an embodiment of the present invention.

以下,對本發明的一實施例進行說明。 Hereinafter, an embodiment of the present invention will be described.

圖1是作為本發明的一實施例的基板開孔裝置的結構示意圖。在圖1中,附圖標記1表示作為裝置的基部的裝置基台,附圖標記2表示在裝置基台1上被圖中未示出的驅動機構在X方向上驅動的加工台。作為被加工件的印刷基板3被載置在加工台2上。附圖標記4表示安設在裝置基台1上的 門型柱,所述門型柱以跨加工台2的方式配置,在其一個垂直面上搭載有被圖中未示出的驅動機構在Y方向上驅動的橫向滑板5。在該橫向滑板5上,搭載有被圖中未示出的驅動機構在Z方向(上下方向)上驅動的主軸6,主軸6可動地搭載在門型柱4上。附圖標記7表示用於加工印刷基板3的鑽頭,所述鑽頭被保持在主軸6上。附圖標記8表示與主軸6一同在Z方向上移動的副夾具,所述副夾具安裝在主軸6上。附圖標記9、10、11分別表示供給用刀架、退出用刀架、區別新鑽頭和舊鑽頭地進行收納的鑽頭盒,所述供給用刀架、退出用刀架、鑽頭盒分別在加工台2上設置在應該加工的印刷基板3的附近。附圖標記16表示起到向操作者傳遞各種資訊的作用的顯示部。附圖標記20表示進行裝置各部的控制的整體控制部,例如由程式控制的處理裝置來實現。 1 is a schematic view showing the structure of a substrate opening device as an embodiment of the present invention. In Fig. 1, reference numeral 1 denotes a device base as a base of the apparatus, and reference numeral 2 denotes a processing table which is driven on the apparatus base 1 by a drive mechanism not shown in the X direction. The printed substrate 3 as a workpiece is placed on the processing table 2. Reference numeral 4 denotes a device mounted on the apparatus base 1. A gantry type column is disposed across the processing table 2, and a horizontal sliding plate 5 driven in the Y direction by a driving mechanism not shown is mounted on one vertical surface thereof. A spindle 6 that is driven in the Z direction (up and down direction) by a drive mechanism (not shown) is mounted on the lateral slider 5, and the spindle 6 is movably mounted on the portal post 4. Reference numeral 7 denotes a drill bit for processing the printed substrate 3, which is held on the main shaft 6. Reference numeral 8 denotes a sub jig that moves in the Z direction together with the main shaft 6, and the sub jig is mounted on the main shaft 6. Reference numerals 9, 10, and 11 denote a drill bit for supplying a tool holder, a withdrawal tool holder, and a new drill bit and an old drill bit, respectively, and the supply tool holder, the exit tool holder, and the drill box are respectively processed. The stage 2 is placed in the vicinity of the printed circuit board 3 to be processed. Reference numeral 16 denotes a display portion that functions to transmit various kinds of information to the operator. Reference numeral 20 denotes an overall control unit that performs control of each unit of the apparatus, and is realized by, for example, a program-controlled processing unit.

附圖標記13表示發出例如鐳射等光的發光器,附圖標記14表示感知來自發光器13的鐳射的感測器,發光器13和感測器14設置在門型柱4的兩端。由發光器13產生的光線15朝向Y方向,其X座標與保持在主軸6上的鑽頭7的X座標一致。如圖2所示,光線15通過比主軸6更靠下方的位置。由此,在已使主軸6下降的情況下,若在主軸6上保持有鑽頭7,則鑽頭7的柄部遮擋光線15。換言之,發光器13能夠產生檢測光(主軸校對光),若在位於既定位置的主軸6上保持有鑽頭7,則所述檢測光被該鑽頭7遮擋。 Reference numeral 13 denotes an illuminator that emits light such as laser light, reference numeral 14 denotes a sensor that senses laser light from the illuminator 13, and the illuminator 13 and the sensor 14 are disposed at both ends of the portal pillar 4. The light ray 15 generated by the illuminator 13 faces the Y direction, and its X coordinate coincides with the X coordinate of the drill bit 7 held on the main shaft 6. As shown in FIG. 2, the light ray 15 passes through a position lower than the main shaft 6. Thus, when the spindle 6 has been lowered, if the drill 7 is held on the spindle 6, the shank of the drill 7 blocks the light 15 . In other words, the illuminator 13 is capable of generating detection light (spindle calibration light), and if the drill 7 is held on the main shaft 6 at a predetermined position, the detection light is blocked by the drill 7.

此外,如圖2所示,將在與主軸6之間進行交接的鑽頭暫時保持的供給用刀架9及退出用刀架10位於相同的 X座標,在Y方向上排列在一條直線上,光線15通過比供給用刀架9及退出用刀架10更靠上方的位置。因此,在使加工台2向供給用刀架9及退出用刀架10的X座標與光線15的X座標一致的特定位置移動、使得從上方觀察供給用刀架9及退出用刀架10重合於光線15的情況下,若在供給用刀架9及退出用刀架10的至少一個上保持有鑽頭7,則鑽頭7的柄部將光線15遮擋。換言之,發光器13能夠產生檢測光(刀架校對光),若在位於特定位置的加工台的刀架(9、10)上保持有鑽頭7,則所述檢測光(刀架校對光)被該鑽頭7遮擋。 Further, as shown in FIG. 2, the supply tool holder 9 and the exit tool holder 10 that temporarily hold the drill bit that is transferred between the main shaft 6 and the exit tool holder 10 are located in the same manner. The X coordinates are arranged in a straight line in the Y direction, and the light ray 15 passes above the supply tool holder 9 and the exit tool holder 10. Therefore, the processing table 2 is moved to a specific position at which the X coordinate of the supply tool holder 9 and the exit tool holder 10 coincides with the X coordinate of the light beam 15, so that the supply tool holder 9 and the exit tool holder 10 are overlapped from above. In the case of the light ray 15, when the drill 7 is held on at least one of the supply turret 9 and the exit turret 10, the shank of the drill 7 blocks the light 15 . In other words, the illuminator 13 is capable of generating detection light (tool holder collating light), and if the drill bit 7 is held on the tool holder (9, 10) of the processing table located at a specific position, the detection light (tool holder collating light) is The drill bit 7 is blocked.

圖1的基板開孔裝置在整體控制部20的控制下如下所述地動作。另外,在以下的說明中,主軸6的位置以相對於加工台2的相對座標(將加工台2的適當的點設為原點、將X方向、Y方向、及Z方向作為軸向的直角坐標系)來說明。即,在本實施例的情況下,主軸6的使X座標變化的動作通過使加工台2在X方向上移動來完成,使Y座標變化的動作通過使橫向滑板5在Y方向上移動來完成,此外,使Z座標變化的動作借助主軸6其自身的向Z方向的移動來完成。另外,使主軸6相對於載置在加工台2上的印刷基板相對移動的驅動結構不限於上述裝置,例如也可以構成為主軸在X方向、Y方向、及Z方向的所有方向上都能夠移動的結構。 The substrate opening device of Fig. 1 operates as follows under the control of the overall control unit 20. In the following description, the position of the main shaft 6 is a relative coordinate with respect to the processing table 2 (the appropriate point of the processing table 2 is an origin, and the X direction, the Y direction, and the Z direction are orthogonal directions of the axial direction. Coordinate system) to illustrate. That is, in the case of the present embodiment, the operation of changing the X coordinate of the main shaft 6 is completed by moving the processing table 2 in the X direction, and the action of changing the Y coordinate is performed by moving the lateral slider 5 in the Y direction. Further, the action of changing the Z coordinate is accomplished by the movement of the main shaft 6 in the Z direction. Further, the driving structure for relatively moving the main shaft 6 with respect to the printed circuit board placed on the processing table 2 is not limited to the above-described device. For example, the main shaft may be movable in all directions of the X direction, the Y direction, and the Z direction. Structure.

首先,對在加工開始時用主軸6重新保持鑽頭7的情況進行說明。如在圖3中所示的流程,首先使主軸6移動至X1、Y1(以下將該座標位置稱作位置A)(步驟A1)。位置A的X座標X1設為,即使在供給用刀架9或退出用刀架10 上留有鑽頭7、它們也不會將光線15遮擋的位置。接著使主軸6下降至既定位置(步驟A2)。所謂既定位置設為在下述情況下的主軸6的位置:在X方向及Y方向上位於A位置,並且位於在主軸6上裝配有鑽頭7的情況下鑽頭7的柄部將光線15遮擋的Z座標上。之後,在步驟A3中,整體控制部20從發光器13產生鐳射,判定在主軸6位於既定位置的狀態下感測器14是否將鐳射(主軸校對光)感知(主軸校對步驟)。若感測器14未感知到鐳射(接通(ON)),則意味著在主軸6上留有鑽頭7,所以視作異常,將“在主軸上保持有鑽頭。請取除”這一錯誤資訊(警報)在顯示部16上顯示,向操作者催促不需要的鑽頭的取除作業(步驟A4)。然後,在進行了由操作者進行的鑽頭的除去作業之後,接收來自操作者的再開始指示(步驟A5),進入至步驟A6。 First, a case where the drill 7 is re-held by the spindle 6 at the start of machining will be described. As in the flow shown in Fig. 3, the spindle 6 is first moved to X1, Y1 (hereinafter this coordinate position is referred to as position A) (step A1). The X coordinate X1 of the position A is set even in the supply tool holder 9 or the exit tool holder 10 There are drill bits 7 on them, and they do not block the light 15 at all. The spindle 6 is then lowered to a predetermined position (step A2). The predetermined position is set to the position of the main shaft 6 in the case where the X position is located in the X direction and the Y direction, and the Z of the drill bit 7 blocks the light 15 when the drill 7 is mounted on the main shaft 6. On the coordinates. Thereafter, in step A3, the overall control unit 20 generates laser light from the illuminator 13, and determines whether or not the sensor 14 senses the laser (spindle proofing light) in a state where the spindle 6 is at a predetermined position (spindle proofreading step). If the sensor 14 does not sense the laser (ON), it means that the drill 7 is left on the main shaft 6, so it is regarded as an abnormality, and the error "Keep the drill on the main shaft. Please remove it" The information (alarm) is displayed on the display unit 16, and the operator is urged to remove the unnecessary drill (step A4). Then, after the removal operation of the drill by the operator is performed, the restart instruction from the operator is received (step A5), and the process proceeds to step A6.

另一方面,若在步驟A3中感測器14感知到鐳射,則意味著在主軸6上未留有鑽頭7,所以視作正常,進入至步驟A6,使主軸6移動至X2、Y1(以下將該座標位置稱作位置B)。位置B的X座標X2是如果在供給用刀架9或退出用刀架10上存在鑽頭7就會將光線15遮擋的位置。換言之,在步驟A3中,整體控制部20使加工台2向上述特定位置移動。 On the other hand, if the sensor 14 senses the laser in step A3, it means that the drill 7 is not left on the main shaft 6, so it is regarded as normal, and the process proceeds to step A6 to move the main shaft 6 to X2 and Y1 (below). This coordinate position is referred to as position B). The X coordinate X2 of the position B is a position where the light 15 is blocked if the drill 7 is present on the supply tool holder 9 or the exit tool holder 10. In other words, in step A3, the overall control unit 20 moves the processing table 2 to the above-described specific position.

之後,在步驟A7中判定感測器14是否將鐳射(刀架校對光)感知(刀架校對步驟)。若感測器14未感知到鐳射,則意味著在供給用刀架9或退出用刀架10上留有鑽頭7,所以視作異常,將“請取除刀架上的鑽頭”這一錯誤資訊(警報)在顯示部16上顯示,向操作者催促不需要的鑽頭的取除作業(步 驟A8)。然後,在進行了由操作者進行的鑽頭的除去作業之後,接收來自操作者的再開始指示(步驟A9),進入至步驟A10。 Thereafter, it is determined in step A7 whether the sensor 14 senses the laser (tool holder collating light) (tool holder collating step). If the sensor 14 does not sense the laser, it means that the drill 7 is left on the supply tool holder 9 or the exit tool holder 10. Therefore, it is regarded as an abnormality, and the error "Please remove the drill bit on the tool holder" The information (alarm) is displayed on the display unit 16, and urges the operator to remove the unnecessary drill (step) Step A8). Then, after the removal operation of the drill by the operator is performed, the restart instruction from the operator is received (step A9), and the process proceeds to step A10.

另一方面,若在步驟A7中感測器14感知到鐳射,則至少在供給用刀架9上未留有鑽頭7,所以視作正常,雖省略圖3中的圖示,但使主軸6及加工台2適當移動,借助副夾具8從鑽頭盒11取出新鑽頭7,將其置於供給用刀架9上(步驟A10),之後執行使位於供給用刀架9的鑽頭7用主軸6保持的鑽頭的裝配動作(步驟A11),使主軸6的旋轉開始(步驟A12)。之後,整體控制部20使主軸6及加工台2適當移動,同時執行對於載置在加工台2上的被加工件(印刷基板3)的加工作業。 On the other hand, if the sensor 14 senses the laser in step A7, at least the drill 7 is not left on the supply tool holder 9, so that it is regarded as normal, and although the illustration in Fig. 3 is omitted, the main shaft 6 is omitted. The processing table 2 is appropriately moved, and the new drill 7 is taken out from the drill box 11 by the sub-clamp 8, and placed on the supply tool holder 9 (step A10), and then the drill 7 for the supply tool holder 9 is used for the spindle 6. The assembly operation of the held drill bit (step A11) starts the rotation of the spindle 6 (step A12). After that, the overall control unit 20 appropriately moves the spindle 6 and the processing table 2 while performing a machining operation on the workpiece (printed substrate 3) placed on the processing table 2.

接著,對在加工途中交換鑽頭的情況進行說明。如在圖4中所示的流程,首先使主軸6的旋轉停止(步驟B1),接著使主軸6移動至位置B(步驟B2)。換言之,在步驟B2中,整體控制部20使加工台2向上述特定位置移動。之後,在步驟B3中判定感測器14是否將鐳射(刀架校對光)感知(刀架校對步驟)。若感測器14未感知鐳射,則意味著在供給用刀架9或退出用刀架10上留有鑽頭7,所以視作異常,將“請取除刀架上的鑽頭”這一錯誤資訊(警報)在顯示部16上顯示,向操作者催促不需要的鑽頭的取除作業(步驟B4)。然後,在進行了由操作者進行的鑽頭的除去作業之後,接收來自操作者的再開始指示(步驟B5),進入至步驟B6。 Next, a case where the drill bit is exchanged during the machining will be described. As in the flow shown in Fig. 4, the rotation of the spindle 6 is first stopped (step B1), and then the spindle 6 is moved to the position B (step B2). In other words, in step B2, the overall control unit 20 moves the processing table 2 to the specific position described above. Thereafter, it is determined in step B3 whether or not the sensor 14 senses the laser (tool holder collating light) (tool holder collating step). If the sensor 14 does not sense the laser, it means that the drill 7 is left on the supply tool holder 9 or the exit tool holder 10. Therefore, it is regarded as an abnormality, and the error message "Please remove the drill bit on the tool holder" is given. The (alarm) is displayed on the display unit 16, and the operator is urged to remove the unnecessary drill (step B4). Then, after the removal operation of the drill by the operator is performed, the restart instruction from the operator is received (step B5), and the process proceeds to step B6.

另一方面,若在步驟B3中感測器14感知到鐳射,則意味著在供給用刀架9及退出用刀架10上未留有鑽頭7,所以視作正常,雖省略圖4中的圖示,但使主軸6及加工台2適 當移動,借助副夾具8從鑽頭盒11取出新鑽頭7,將其置於供給用刀架9上(步驟B6),之後執行將主軸6保持著的鑽頭7置於退出用刀架10上的鑽頭的拆下動作(步驟B7)。 On the other hand, if the sensor 14 senses the laser in step B3, it means that the drill 7 is not left on the supply tool holder 9 and the exit tool holder 10. Therefore, it is regarded as normal, and the illustration in FIG. 4 is omitted. Illustration, but make the spindle 6 and the processing table 2 suitable When moving, the new drill bit 7 is taken out from the drill bit cartridge 11 by means of the sub-clamp 8, and placed on the supply tool holder 9 (step B6), after which the drill bit 7 holding the spindle 6 is placed on the exit tool holder 10. The removal operation of the drill bit (step B7).

接著使主軸6移動至位置A,之後使主軸6下降至既定位置,在步驟B10中判定感測器14是否將鐳射(主軸校對光)感知(主軸校對步驟)。若感測器14未感知到鐳射,則意味著在主軸6上留有鑽頭7,所以視作異常,將“在主軸上保持有鑽頭。請取除”這一錯誤資訊(警報)在顯示部16上顯示,向操作者催促不需要的鑽頭的取除作業(步驟B11)。然後,在進行了由操作者進行的鑽頭的除去作業之後,接收來自操作者的再開始指示(步驟B12),進入至步驟B13。 Next, the spindle 6 is moved to the position A, and then the spindle 6 is lowered to a predetermined position, and it is determined in step B10 whether or not the sensor 14 senses the laser (spindle proofing light) (spindle proofreading step). If the sensor 14 does not sense the laser, it means that the drill 7 is left on the main shaft 6, so it is regarded as abnormal, and the error message (alarm) of "holding the drill on the main shaft. Please remove it" is displayed on the display unit. It is shown on the 16 that the operator is urged to take out the unnecessary drill (step B11). Then, after the removal operation of the drill by the operator is performed, the restart instruction from the operator is received (step B12), and the process proceeds to step B13.

另一方面,若在步驟B10中感測器14感知到鐳射,則意味著在主軸6上未留有鑽頭7,所以視作正常,雖省略圖4中的圖示,但使主軸6及加工台2適當移動,執行將位於供給用刀架9的鑽頭7用主軸6保持的鑽頭的裝配動作(步驟B13),之後借助副夾具8將位於退出用刀架10的鑽頭7向鑽頭盒11收納(步驟B14),使主軸6的旋轉開始(步驟B15)。之後,整體控制部20再次開始相對於載置於加工台2的被加工件(印刷基板3)的加工作業。 On the other hand, if the sensor 14 senses the laser in step B10, it means that the drill 7 is not left on the main shaft 6, so it is regarded as normal. Although the illustration in Fig. 4 is omitted, the main shaft 6 and the machining are performed. The table 2 is appropriately moved, and the assembling operation of the drill bit held by the spindle 7 of the supply tool holder 9 is performed (step B13), and then the drill 7 located in the exit tool holder 10 is stored in the drill box 11 by the sub-clamp 8. (Step B14), the rotation of the spindle 6 is started (step B15). After that, the overall control unit 20 restarts the machining operation with respect to the workpiece (printed substrate 3) placed on the processing table 2.

另外,在最後的步驟B15中的主軸6的旋轉的開始也可以在將位於退出用刀架10的鑽頭7向鑽頭盒11收納的動作(步驟B14)之前進行。這種做法能夠較快地再次開始將加工中斷後的加工動作,提高效率。 Further, the start of the rotation of the main shaft 6 in the last step B15 may be performed before the operation of storing the drill 7 located in the exit tool holder 10 into the drill box 11 (step B14). This approach can quickly start the machining operation after the machining interruption, and improve the efficiency.

接著,對使加工動作結束的情況進行說明。如圖5 所示的流程,首先使主軸6的旋轉停止(步驟C1),接著使主軸6移動至位置B(步驟C2)。換言之,在步驟C2中,整體控制部20使加工台2向上述特定位置移動。之後,在步驟C3中判定感測器14是否將鐳射(刀架校對光)感知(刀架校對步驟)。若感測器14未感知到鐳射,則意味著在供給用刀架9或退出用刀架10上留有鑽頭7,所以視作異常,將“請取除刀架上的鑽頭”這一錯誤資訊(警報)在顯示部16上顯示,向操作者催促不需要的鑽頭的取除作業(步驟C4)。然後,在進行了由操作者進行的鑽頭的除去作業之後,接收來自操作者的再開始指示(步驟C5),進入至步驟C6。 Next, a case where the machining operation is completed will be described. Figure 5 In the flow shown, the rotation of the spindle 6 is first stopped (step C1), and then the spindle 6 is moved to the position B (step C2). In other words, in step C2, the overall control unit 20 moves the processing table 2 to the specific position. Thereafter, it is determined in step C3 whether or not the sensor 14 senses the laser (tool holder collating light) (tool holder collating step). If the sensor 14 does not sense the laser, it means that the drill 7 is left on the supply tool holder 9 or the exit tool holder 10. Therefore, it is regarded as an abnormality, and the error "Please remove the drill bit on the tool holder" The information (alarm) is displayed on the display unit 16, and the operator is urged to remove the unnecessary drill (step C4). Then, after the removal operation of the drill by the operator is performed, the restart instruction from the operator is received (step C5), and the process proceeds to step C6.

另一方面,若在步驟C3中感測器14感知到鐳射,則意味著至少在退出用刀架10上未留有鑽頭7,所以視作正常,雖省略圖5中的圖示,但使主軸6及加工台2適當移動,執行將用主軸6保持著的鑽頭7置於退出用刀架10的鑽頭的拆下動作(步驟C6)。 On the other hand, if the sensor 14 senses the laser in step C3, it means that the drill 7 is not left at least on the exit tool post 10, so it is regarded as normal, and although the illustration in Fig. 5 is omitted, The spindle 6 and the machining table 2 are appropriately moved, and the bit 7 held by the spindle 6 is placed in the detaching operation of the drill for the ejector blade 10 (step C6).

接著使主軸6移動至位置A(步驟C7),之後,使主軸6下降至既定位置(步驟C8),在步驟C9中判定感測器14是否將鐳射(主軸校對光)感知(主軸校對步驟)。若感測器14未感知到鐳射,則意味著在主軸6上留有鑽頭7,所以視作異常,將“在主軸上保持有鑽頭。請取除”這一錯誤資訊(警報)在顯示部16上顯示,向操作者催促不需要的鑽頭的取除作業(步驟C10)。然後,在進行了由操作者進行的鑽頭的除去作業之後,接收來自操作者的再開始指示(步驟C11),進入至步驟C12。 Next, the spindle 6 is moved to the position A (step C7), after which the spindle 6 is lowered to a predetermined position (step C8), and it is determined in step C9 whether the sensor 14 senses the laser (spindle proofing light) (spindle proofreading step). . If the sensor 14 does not sense the laser, it means that the drill 7 is left on the main shaft 6, so it is regarded as abnormal, and the error message (alarm) of "holding the drill on the main shaft. Please remove it" is displayed on the display unit. As shown in Fig. 16, the operator is urged to take out the unnecessary drill bit (step C10). Then, after the removal operation of the drill by the operator is performed, the restart instruction from the operator is received (step C11), and the process proceeds to step C12.

另一方面,若在步驟C9中感測器14感知到鐳射, 則意味著在主軸6上未留有鑽頭7,所以視作正常,雖省略圖5中的圖示,但使主軸6及加工台2適當移動,借助副夾具8將位於退出用刀架10的鑽頭7向鑽頭盒11收納(步驟C12)。 On the other hand, if the sensor 14 senses the laser in step C9, This means that the drill 7 is not left on the main shaft 6, so it is regarded as normal. Although the illustration in Fig. 5 is omitted, the main shaft 6 and the machining table 2 are appropriately moved, and the sub-clamp 8 is placed on the exit tool holder 10. The drill bit 7 is stored in the drill box 11 (step C12).

根據上述實施例,如果在欲從供給用刀架9將新鑽頭移至主軸6上的情況下,在主軸6上留有舊鑽頭,或者在欲將主軸6保持著的舊鑽頭移至退出用刀架10上的情況下,在退出用刀架10上留有鑽頭,或者在欲從鑽頭盒11將鑽頭移至供給用刀架9上的情況下,在供給用刀架9上留有鑽頭,則檢測為異常,發出錯誤資訊(警報),向操作者催促不需要的鑽頭的取除作業,所以能夠消除在刀架和主軸上鑽頭彼此碰撞、損壞刀架和主軸的可能。 According to the above embodiment, if the new drill bit is to be moved from the supply tool holder 9 to the main shaft 6, the old drill bit is left on the main shaft 6, or the old drill bit to be held by the main shaft 6 is moved to the exit. In the case of the tool holder 10, a drill bit is left on the exit tool holder 10, or when the drill bit is to be moved from the drill box 11 to the supply tool holder 9, a drill bit is left on the supply tool holder 9. Then, the detection is abnormal, and an error message (alarm) is issued to urge the operator to remove the unnecessary drill bit, so that it is possible to eliminate the possibility that the drill bit collides with each other on the tool holder and the spindle, and the tool holder and the spindle are damaged.

另外,在上述實施例中,如圖1所示,發光器13和感測器14在門型柱4的兩側的腳部上互相對置地設置,但也可以是下述回歸反射型的構造:將感測器14與發光器13一同安裝(實裝),安裝在單側的腳部上,在相反側設置反射板。此外,在上述實施例中,將從發光器13在Y方向上照射的光線15兼用作2種檢測光(主軸校對光、刀架校對光),但也可以設置具有能夠照射主軸校對光的第1發光部和能夠照射刀架校對光的第2發光部的發光器。在該情況下,主軸校對光及刀架校對光的照射方向及照射路徑也可以不同。 Further, in the above embodiment, as shown in FIG. 1, the illuminator 13 and the sensor 14 are disposed opposite to each other on the leg portions on both sides of the portal post 4, but may be a retroreflective structure as described below. The sensor 14 is mounted (mounted) together with the illuminator 13, mounted on the one-side leg, and provided on the opposite side. Further, in the above-described embodiment, the light ray 15 irradiated from the illuminator 13 in the Y direction is also used as two types of detection light (spindle proofing light, tool holder proofing light), but it is also possible to provide a light having the ability to illuminate the main axis calibration light. A light-emitting unit and an illuminator capable of illuminating the second light-emitting portion that corrects light of the tool holder. In this case, the direction in which the spindle collimated light and the tool holder collate the light and the irradiation path may be different.

此外在上述實施例中,表示了在門型柱4上搭載的主軸6只有一個的情況。在基板開孔裝置中,已知有多軸型的基板開孔裝置,所述多軸型的基板開孔裝置為了增加一次的加工量,在門型柱4上搭載多個主軸6,並且用這些主軸6共 同地使用一個加工台2,在加工台2上對應主軸6載置多個作為被加工件的印刷基板3。 Further, in the above embodiment, the case where there is only one spindle 6 mounted on the portal post 4 is shown. In the substrate opening device, a multi-axis type substrate opening device is known, and the multi-axis type substrate opening device is provided with a plurality of spindles 6 on the gate column 4 in order to increase the amount of machining once, and These spindles 6 A processing table 2 is used in the same place, and a plurality of printed boards 3 as workpieces are placed on the processing table 2 corresponding to the main spindle 6.

在這樣的多軸型中,對應主軸6設置供給用刀架9、退出用刀架10及鑽頭盒11,但是也可以是,發光器13和感測器14在門型柱4上僅設置一組,基於本發明的動作相對於多個主軸6共同地進行。 In such a multi-axis type, the supply tool holder 9, the exit tool holder 10, and the drill box 11 are provided corresponding to the main shaft 6, but the illuminator 13 and the sensor 14 may be provided only on the door type column 4. The group, the operation based on the present invention is performed collectively with respect to the plurality of spindles 6.

1‧‧‧裝置基台 1‧‧‧ device abutment

2‧‧‧加工台 2‧‧‧Processing table

3‧‧‧印刷基板 3‧‧‧Printing substrate

4‧‧‧門型柱 4‧‧‧Door column

5‧‧‧橫向滑板 5‧‧‧ Horizontal skateboarding

6‧‧‧主軸 6‧‧‧ Spindle

7‧‧‧鑽頭 7‧‧‧ drill bit

8‧‧‧副夾具 8‧‧‧Sub-clamp

9‧‧‧供給用刀架 9‧‧‧Supply tool holder

10‧‧‧退出用刀架 10‧‧‧Without tool holder

11‧‧‧鑽頭盒 11‧‧‧Drill box

13‧‧‧發光器 13‧‧‧ illuminator

14‧‧‧感測器 14‧‧‧Sensor

15‧‧‧光線(刀架校對光、主軸校對光) 15‧‧‧Light (knife proofreading light, spindle proofing light)

16‧‧‧顯示部 16‧‧‧Display Department

20‧‧‧整體控制部(控制部) 20‧‧‧ overall control department (control department)

Claims (7)

一種基板開孔裝置,前述基板開孔裝置在加工臺上設置有將在與主軸之間進行交接的鑽頭暫時保持的刀架,其特徵在於:前述基板開孔裝置具備發光器、感測器、控制部;前述發光器產生刀架校對光,前述刀架校對光在前述加工台處於特定位置的狀態下被保持在前述刀架上的鑽頭遮擋;前述感測器感知前述刀架校對光;前述控制部在欲在前述主軸和前述刀架間進行鑽頭的交接的情況下,使前述加工台向前述特定位置移動,若前述感測器不能夠感知到前述刀架校對光,則發出警報。 A substrate opening device, wherein the substrate opening device is provided with a tool holder for temporarily holding a drill bit that is transferred between the spindle and the spindle, wherein the substrate opening device includes an illuminator, a sensor, and a control unit; the illuminator generates tool holder calibration light, wherein the tool holder correcting light is blocked by a drill held on the tool holder in a state where the processing table is at a specific position; and the sensor senses the tool holder collating light; The control unit moves the processing table to the specific position when the drill is to be transferred between the spindle and the tool holder, and an alarm is issued when the sensor cannot sense the tool holder calibration light. 如申請專利範圍第1項所述的基板開孔裝置,其中,前述發光器能夠產生主軸校對光,在前述主軸處於既定位置的狀態下,若在該主軸上保持有鑽頭,則前述主軸校對光被該鑽頭遮擋;前述感測器能夠感知前述主軸校對光;前述控制部使前述主軸向前述既定位置移動,若前述感測器不能夠感知到前述主軸校對光,則發出警報。 The substrate opening device according to claim 1, wherein the illuminator is capable of generating spindle collimation light, and the spindle collimated light is maintained when a spindle is held on the spindle while the spindle is at a predetermined position. The sensor is capable of sensing the spindle alignment light, and the control unit moves the predetermined axis in the main axis. When the sensor is unable to sense the spindle calibration light, an alarm is issued. 如申請專利範圍第1項所述的基板開孔裝置,其中,前述刀架包括供給用刀架和退出用刀架,前述供給用刀架暫時保持向前述主軸供給的鑽頭,前述退出用刀架暫時保持從前述主軸退出的鑽頭,前述供給用刀架及前述退出用刀架設置成在前述刀架校對光的方向上排列在一條直線上。 The substrate opening device according to claim 1, wherein the tool holder includes a supply tool holder and an exit tool holder, and the supply tool holder temporarily holds a drill supplied to the spindle, and the exit tool holder The drill bit that has withdrawn from the spindle is temporarily held, and the supply tool holder and the exit tool holder are arranged in a line in the direction in which the tool holder corrects light. 如申請專利範圍第1至3項中任一項所述的基板開孔裝 置,其中,前述發光器和前述感測器安裝在可動地搭載前述主軸的柱上。 The substrate opening device according to any one of claims 1 to 3 The illuminator and the sensor are mounted on a column on which the spindle is movably mounted. 一種基板開孔裝置的控制方法,前述基板開孔裝置在加工臺上設置有將在與主軸之間進行交接的鑽頭暫時保持的刀架,其特徵在於包括以下步驟:使刀架校對光產生的步驟,前述刀架校對光在前述加工台處於特定位置的狀態下,在鑽頭保持在前述刀架上的情況下,被該鑽頭遮擋;在欲在前述主軸和前述刀架間進行鑽頭的交接的情況下使前述加工台移動至前述特定位置的步驟;判定在前述加工台處於前述特定位置的狀態下前述刀架校對光是否被遮擋的刀架校對步驟;在前述刀架校對步驟中前述刀架校對光被遮擋的情況下發出警報的步驟。 A method for controlling a substrate opening device, wherein the substrate opening device is provided with a tool holder for temporarily holding a drill bit that is transferred between the spindle and the spindle, and the method includes the following steps: correcting the tool holder for correcting light a step of correcting the light of the tool holder in a state where the processing table is at a specific position, and the bit is blocked by the drill bit while the drill bit is held on the tool holder; and the bit is to be transferred between the spindle and the tool holder. a step of moving the processing table to the specific position; determining a tool holder proofreading step of whether the tool holder collision light is blocked in a state where the processing table is in the specific position; and the tool holder in the tool holder proofing step The step of sounding an alarm when the light is blocked. 如申請專利範圍第5項所述的基板開孔裝置的控制方法,其中,包括以下步驟:產生主軸校對光的步驟,前述主軸校對光在前述主軸處於既定位置的狀態下,若在該主軸上保持有鑽頭,則被該鑽頭遮擋;使前述主軸向前述既定位置移動的步驟;判定在前述主軸處於前述既定位置的狀態下前述主軸校對光是否被遮擋的主軸校對步驟;在前述主軸校對步驟中前述主軸校對光被遮擋的情況下發出警報的步驟。 The method for controlling a substrate opening device according to claim 5, further comprising the step of: generating a spindle collating light, wherein the spindle collating light is in a state where the spindle is at a predetermined position, if on the spindle Holding the drill bit, blocking the drill bit; moving the predetermined axial position to the predetermined position; and determining a spindle calibration step of whether the spindle calibration light is blocked in a state where the spindle is in the predetermined position; in the spindle calibration step The step of issuing an alarm in the case where the aforementioned spindle collates the light. 如申請專利範圍第5項所述的基板開孔裝置的控制方法, 其中,前述刀架包括供給用刀架和退出用刀架,前述供給用刀架暫時保持向前述主軸供給的鑽頭,前述退出用刀架暫時保持從前述主軸退出的鑽頭,前述供給用刀架及前述退出用刀架設置成在前述刀架校對光的方向上排列在一條直線上。 The method for controlling a substrate opening device according to claim 5, Wherein the tool holder includes a supply tool holder and a withdrawal tool holder; the supply tool holder temporarily holds a drill supplied to the spindle, and the exit tool holder temporarily holds a drill that is withdrawn from the spindle, the supply tool holder and The aforementioned exit tool holders are arranged to be aligned in a straight line in the direction in which the tool holders collate the light.
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