TW201332922A - Method of processing a tempered glass substrate for touch screens - Google Patents

Abstract

In a method of processing a tempered glass substrate for touch screens, conductive structures may be formed on each of unit cells of an original tempered glass substrate. The original tempered glass substrate may be physically cut along boundary lines between the unit cells to form preliminary tempered glass substrates having cut faces. Minute cracks formed the cut faces of the preliminary tempered glass substrates may be removed by a chemical etching process to form the tempered glass substrate. Thus, the tempered glass substrate for the touch screen may have reinforced bending strength.

Description

Method of processing a tempered glass substrate for a touch screen

The embodiments herein are directed to a method of processing a tempered glass substrate for a touch screen. Embodiments herein are particularly directed to methods of processing tempered glass substrates for use with touch screens that can be used to fabricate panels for electronic devices, such as a cell phone.

In general, the touch screen panel can be applied to a display device such as a cell phone, an MP3 player, a personal digital assistant (PDA), and the like. The touch screen panel can be an input device, and the user selects an image on the screen of the display device with a finger to input an instruction.

The touch screen panel can be disposed on an upper surface of the display device to convert the touch contact of the user's finger into an electronic signal. The image touched by the user's finger can be accepted as an input signal by the display device. Therefore, the touch screen panel can replace the separate input device connected to the display device, so that the touch screen panel may have been widely used.

The touch screen panel can include a sensing unit, and the sensing unit is disposed on a glass substrate. In order to reinforce the touch screen panel, the glass substrate may include a tempered glass substrate. The tempered glass for the touch screen panel can be cut into a plurality of unit cells of the touch screen panel. The cut tempered glass can be used in the process of manufacturing a touch screen panel. The tempered glass can be cut by an etching process using a laser or a sand blast process. Tempered glass The thickness can range from about 0.3 mm (mm) to about 0.8 mm. This thickness of tempered glass can be cut using a laser. The method of using laser-cut tempered glass can have the advantages of a neat cutting surface and mass production. However, the cut face may be discolored due to the heat treatment of the laser. Therefore, an additional process is required to remove the discolored cut surface, which increases the time and cost of making the touch screen panel.

In a method of physically cutting a raw tempered glass having a touch screen structure by using a sand blasting process, it is possible to uniformly spray an abrasive on the original tempered glass using a mask film layer. When it is up, the convex portion of the side may become large. Furthermore, arcing or physical collisions can cause damage to an electrode or a jumper. Therefore, the blasting process may not be suitable for processing tempered glass with a touch screen structure.

In addition, Korean Patent No. 1023794 discloses a method of cutting a tempered glass substrate by a sand blasting process, which may include forming a pattern on the tempered glass substrate, rapidly spraying the abrasive on the tempered glass substrate to expose the pattern. An impact is applied to the area to cut the tempered glass substrate. However, due to the impact of the abrasive, it is possible to generate minute cracks on the cut surface of one of the strengthened glass substrates. These micro-cracks may severely reduce the bending strength of the strengthened glass substrate, so that the strengthened glass substrate may be damaged by a slight impact.

Embodiments herein provide a method of processing a tempered glass substrate for a touch screen by removing the original reinforced glass that may be physically cut The small cracks generated by the glass and the projections of the cut surface without destroying the touch screen structure formed on the unit elements of the glass substrate can improve the side strength and ensure mass production.

In accordance with some embodiments, a method of processing a tempered glass substrate for a touch screen is provided. In a method of processing a tempered glass substrate of a touch screen, a plurality of conductive structures may be formed on a plurality of unit elements of an original tempered glass substrate. The original tempered glass substrate can be physically cut along several boundaries of the unit elements to form a primary tempered glass substrate having a cut surface. The microcracks formed on the cut surface of the primary tempered glass substrate can be removed by a chemical etching process to form a tempered glass substrate.

In several embodiments, the physical cutting step may include a laser cutting process, a waterjet cutting process, a sandblasting process, a cutting process, and the like.

In several embodiments, the blasting process can include rapidly spraying an abrasive and air onto the original tempered glass substrate with a nozzle to cut the original tempered glass substrate, the nozzle having an inner diameter of from about 0.3 mm to about 3 mm.

In several embodiments, the cut surface of the primary tempered glass substrate formed by the blasting process may have a projection having a length from the cut surface of no more than about 280 microns.

In several embodiments, the original tempered glass substrate can have a thickness of from about 0.5 mm to about 3 mm.

In several embodiments, the method may further include disposing a metal mask on the tempered glass substrate and physically etching the portion of the original tempered glass substrate that is not covered by the metal mask to form a plurality of openings through the original reinforcement. glass substrate.

In several embodiments, the step of chemical etching may etch the depth of the cut face to between about 100 microns and about 700 microns using an etching solution. The etching solution includes a hydrofluoric acid.

In several embodiments, the method may further include forming a mask pattern on the strengthened glass substrate to selectively expose the plurality of boundaries to the strengthened glass substrate. The mask pattern may include at least one layer.

According to several embodiments, the original strengthened glass substrate can be physically cut. The cut surface of the tempered glass substrate can be chemically etched using hydrofluoric acid to remove microcracks and bulges. As such, the tempered glass substrate for the touch screen can have increased bending strength.

Therefore, since the tempered glass substrate of the touch screen can have improved side strength and bending strength, the touch screen can be not damaged during the manufacturing process. Furthermore, several touch screens can be made from a single original tempered glass substrate, so the mass production of the touch screen can be significantly improved.

Furthermore, the conductive structure of the unit elements on the original tempered glass substrate may not be damaged during physical cutting. Therefore, the tempered glass substrate can be manufactured at a reduced cost and in a short time.

In addition, the method can be applied to the edge of the tempered glass substrate so that the conductive structure can be prevented from being damaged. Therefore, the mass production of the touch screen can be greatly improved.

A more complete description of various embodiments will be provided in conjunction with the accompanying drawings, which are set However, the invention is capable of many different embodiments and is not limited to the embodiments set forth herein. These realities The present invention is to be used in a thorough and complete manner, and the scope of the present invention is fully understood by those of ordinary skill in the art. The size and relative sizes of layers and regions in the drawings may be exaggerated in order to clearly illustrate the embodiments of the invention.

When a component or layer is described as being "on", "connected" or "coupled" to another element or layer, the element or layer can be directly contiguous on the other element or layer, The other element or layer may be coupled to the other element or layer, or an intervening element or interposer may also be present. In contrast, when an element or layer is described as "directly on", "directly connected" or "directly coupled" to another element or layer, there are no intervening elements or intervening layers. Like components have similar component symbols throughout the specification. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.

The elements, components, regions, layers, and/or portions may be used to describe various elements, components, regions, layers and/or portions, and are not limited to these descriptions. word. These descriptions are only used to identify one element, component, region, layer and/or portion, and other elements, components, regions, layers and/or parts. Thus, the first element, component, region, layer and/or portion of the following discussion may also be referred to as a second element, component, region, layer and/or portion, without departing from the teachings of the invention.

Space-related terms such as "under", "below", "below", "above", "above" and other similar terms can be used here to simplify one of the patterns. A description of the relationship between an element or feature and another element or feature. In addition to indicating the orientation in the drawings, spatially related terms are used to encompass different orientations of the device in use or operation. For example, a component Originally below or below other components or features, if the device is flipped upside down, the component will become positioned above other components or features. Therefore, the exemplified word "below" can include both upper and lower directions. It is also possible to flip the device in other directions (eg by 90° or to other directions) and to interpret the spatially relevant terms used in this situation.

The terminology used herein is for the purpose of description and the embodiments The singular forms "a" and "the" are used to include the plural. In the present specification, the use of the word "comprising" and its variants is used to mean the presence of the features, the whole, the steps, the operation, the components and/or the composition, and not to exclude one or more other features, The presence or addition of a combination of steps, operations, components, and/or components.

The cross-sectional views of the embodiments (and internal structures) under ideal conditions are shown here to describe the embodiments. As such, it is contemplated that there may be variations in the shapes of the illustrations due to, for example, manufacturing techniques and/or tolerances. Thus, the embodiments do not limit the regions to the particular shapes shown herein, but include, for example, the resulting differences in the. For example, an ion implantation region, described as a rectangle, typically has a circular or curved feature and/or has an implant concentration gradient at the edge rather than exhibiting a binary change in the implanted and non-implanted regions. Likewise, the formation of a buried region by ion implantation may result in some ion implantation between the buried region and the surface being implanted. Therefore, the regions illustrated in the figures are for illustrative purposes only, and are not intended to depict the actual shapes of the regions of the device, and are not intended to limit the scope of the invention.

Unless otherwise defined, all terms used herein (including technology and subjects) The term "speech" has the same meaning as understood by those of ordinary skill in the art to which the invention pertains. In addition, the terms used in this article, such as those that are defined in the general dictionary, have the same meaning as the idioms in the related art, and should not be idealized or too formal unless otherwise defined. The way to explain it.

The embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

Method for processing a tempered glass substrate of a touch screen

1 is a block diagram of a method of processing a tempered glass substrate for a touch screen in accordance with several embodiments. 2A to 2E are cross-sectional flowcharts showing a method of processing a tempered glass substrate in Fig. 1.

Referring to FIGS. 1 and 2A, in step S210, the conductive structure 110 for the touch screen can be formed on a plurality of unit cells R of an original tempered glass 100. .

In several embodiments, the original tempered glass substrate 100 can have different thicknesses and sizes depending on the application of the original tempered glass substrate 100. For example, the original tempered glass substrate 100 may have a size of about 370 mm x 470 mm and a thickness of about 0.5 mm to about 3 mm.

In several embodiments, the original strengthened glass substrate 100 can compress a heated glass substrate by heating a glass substrate to a softening temperature between about 670 ° C and about 710 ° C, and rapidly cooling the compressed glass substrate using a cold air. The surface of the glass substrate to be cooled is compressed and stretched to form the inside of the cooled glass substrate. Alternatively, the original tempered glass substrate can be immersed in a potassium nitrate solution through a glass substrate at about 400 ° C to about The glass substrate was heated at 450 ° C for about 18 hours to form.

In several embodiments, the electrically conductive structure 110 can be formed on the original strengthened glass substrate 100. In particular, the conductive structure 110 may be formed on the unit element R of the strengthened glass substrate before the original tempered glass substrate 100 is physically cut. Here, the size of each unit element may correspond to the size of the touch panel or the touch screen.

In several embodiments, the conductive structure 110 can include a plurality of sensing patterns, a plurality of ground electrodes, a plurality of jumpers, and the like, including a transparent electrode, such as indium tin oxide (ITO).

Although not shown in the drawings, a process of forming a hole through the original strengthened glass substrate 100 having the conductive structure 110 may be additionally performed. The opening may be formed by disposing a metal mask having an opening on the original strengthened glass substrate 100 and physically etching the original tempered glass substrate 100 of the uncovered portion of the metal mask. The opening can correspond to the sound hole or button hole of a smart phone or a smart tablet.

Referring to FIGS. 1 and 2B, in step S220, a mask pattern 120 may be formed on the original strengthened glass substrate 100.

In several embodiments, the mask pattern 120 may have openings that expose the boundaries between the unit elements of the original strengthened glass substrate 100.

In several embodiments, in order to prevent the original strengthened glass substrate 100 from being etched in the subsequent chemical etching process, the two mask patterns 120 may be formed on the upper surface and the lower surface of the original strengthened glass substrate 100. Also, the mask pattern 120 may include at least one layer.

In addition, when the cut surface is etched using the etching solution, the mask pattern 120 may cover the remaining of the cut surface of the original strengthened glass substrate 100. Partly to prevent the remainder of the tempered glass cut surface from being etched.

In several embodiments, the mask pattern 120 can include a mask film that can be etched away from the etching solution. For example, the mask film can have chemical resistance.

In several embodiments, the mask pattern 120 may include a first mask pattern (not shown) and a second mask pattern (not shown) stacked in sequence. The first mask pattern and the second mask pattern may comprise substantially the same material. Alternatively, the mask pattern 120 may include a first mask pattern (not shown), a second mask pattern (not shown), and a third mask pattern (not shown) stacked in sequence. The first to third mask patterns may substantially comprise the same material having chemical resistance.

Referring to FIGS. 1 and 2C, in step S230, the original strengthened glass substrate 100 may be physically cut into a preliminary tempered glass substrate 101 along a boundary line between the unit elements R.

In several embodiments, the physical cutting process includes a laser cutting process, a water jet cutting process, a sand blast cutting process, or a trim cutting process. Process) and so on. The original strengthened glass substrate 100 can be cut only by a sandblasting process. Alternatively, the original tempered glass substrate 100 can be cut by a laser cutting process and a cutting process.

Here, as shown in FIG. 3, the primary tempered glass substrate 101 may have a cut surface. In addition, the impact caused by the physical cutting process may cause minute cracks C on the cut surface.

Figure 3 is a diagram showing the tempered glass substrate cut by a physical cutting process An enlarged view of the section of the cut surface.

Referring to Fig. 3, the micro cracks C on the cut surface may lower the bending strength and side strength of the primary strengthened glass substrate 101. Therefore, the primary tempered glass substrate 101 having minute cracks C may be easily damaged during subsequent processing.

Furthermore, a protrusion may be formed on the cutting surface. The projection may protrude from the cutting face with a length D. The projections may also lower the bending strength and the side strength of the primary tempered glass substrate 101. In particular, the side strength of the primary strengthened glass substrate 101 and the length D of the projections may be proportional. That is, the longer the length D of the projection, the lower the strength of the side of the primary tempered glass substrate 101. Conversely, the shorter the length D of the projection, the greater the strength of the side of the primary tempered glass substrate 101.

In several embodiments, the cutting face can be a rounded shape, a rounded corner, or a side plane having a rounded projection. When the cut surface can have the above-described shape, the primary tempered glass substrate 101 can have a relatively strong structure with respect to the impact applied to the side surface of the primary tempered glass substrate 101. Conversely, when the cutting mask has a sharp corner or a sharp projection, the strengthened glass substrate may have a relatively fragile structure with respect to the impact applied to the side surface of the strengthened glass substrate. Therefore, the projections may preferably have a short length D. In addition, the cutting face may be circular, in particular circular in the central portion.

In several embodiments, the physical cutting process can be a sandblasting process performed using a sandblasting machine. For example, the blasting process can include rapidly spraying the abrasive onto the original strengthened glass substrate 100 through a nozzle at a pressure of from about 7 kgf/cm ² to about 11 kgf/cm ² . The abrasive can comprise a metal or a non-metal. The inner diameter of the nozzle can be from about 0.3 mm to about 3 mm. The blasting process using nozzles eliminates the need for an etch mask, so the time to process the tempered glass substrate can be shortened.

As described above, the original strengthened glass substrate 100 can be cut to form the primary strengthened glass substrate 101. A minute crack C may be generated on the cut surface of the primary tempered glass substrate 101.

In several embodiments, the projections project from the cutting face to a length of no more than 280 microns. The projections may vary depending on the thickness of the mask pattern 120 and the inner diameter of the nozzle. The projections may be produced by densely concentrating the abrasive material on the central portion of the cutting surface and sparsely concentrating the abrasive material on the edge of the cutting surface.

Referring to FIGS. 1 and 2D, in step S240, minute cracks C and projections on the cut surface of the primary tempered glass substrate 101 may be removed by a chemical etching process to form the tempered glass substrate 102.

In several embodiments, the chemical etching process may use an etching solution comprising hydrofluoric acid, and the cut surface may be removed to a depth of from about 100 microns to about 700 microns.

In several embodiments, the primary primary tempered glass substrate 101 may be immersed in an etching solution containing hydrofluoric acid to etch microcracks C and protrusions. Alternatively, an etching solution containing hydrofluoric acid may be sprayed on the cut surface of the primary original tempered glass substrate 101.

In several embodiments, the etching solution may comprise a mixed solution containing hydrofluoric acid. For example, the etching solution may comprise a hydrofluoric acid solution. Alternatively, the etching solution may contain a mixed solution of hydrofluoric acid, nitric acid, and water. In addition, the etching solution may comprise hydrofluoric acid, hydrochloric acid, A mixed solution of ammonium hydrogen fluoride and water.

The etching solution can flow to the micro cracks C to remove the micro cracks C and the protrusions. As a result, when the cut surface having the micro cracks C may be etched, the length of the protrusions may be reduced, thereby improving the strength and bending strength of the side of the strengthened glass substrate 102.

Therefore, the tempered glass substrate 102 does not have the micro cracks C and the convex portions, and the side strength and the bending strength of the tempered glass substrate 102 can be improved. Therefore, the damage of the tempered glass substrate 102 caused by the impact is suppressed. The mask pattern 120 can protect the upper surface and the lower surface of the strengthened glass substrate 102. Therefore, the upper surface and the lower surface of the strengthened glass substrate 102 may not be etched by the etching solution.

Referring to FIGS. 1 and 2E, in step S250, the mask pattern 120 can be removed from the strengthened glass substrate 120.

In several embodiments, the mask pattern 120 can be removed by stripping or etching. For example, when the mask pattern 120 may include a photoresist pattern, the mask pattern 120 may be removed by an ashing process and a stripping process. When the mask pattern 120 may include a thin sheet, the mask pattern 120 may be removed by an etching process using an etching solution.

The strengthened glass substrate 102 can then be cleaned using deionized water. The strengthened glass substrate 102 can have good side strength. In several embodiments, the touch screen including the tempered glass substrate 102 may include a touch screen having an integrally formed tempered glass, a touch screen having an integrally formed cover glass, and a touch using tempered glass. Screen and so on.

According to this embodiment, the tempered glass substrate may have no micro cracks and Protrusion. Therefore, the strength and bending strength required for the tempered glass substrate in fabricating the touch panel can be enhanced.

Moreover, this method can be applied to the edge of the original tempered glass substrate, so that the conductive structure can be not damaged. Therefore, the mass production of the touch screen can be greatly improved.

Analysis of the corresponding shape change of the inner diameter of the nozzle of the blasting cutting process and the cut surface of the tempered glass substrate

A first tempered glass having a thickness of 0.7 mm was prepared. A second tempered glass having a thickness of 1.1 mm was prepared. A first tempering glass and a second tempered glass are subjected to a blasting process using an abrasive to cut the first tempered glass and the second tempered glass, and the nozzle inner diameter is changed. In the sand blasting process, the distance between the first and second tempered glass substrates and the nozzle is 500 micrometers. The pressure at which the abrasive was sprayed was 9 kgf/cm ² . The speed of the moving nozzle is 5 mm/s. The length D of the projections from the cut faces of the first and second tempered glass substrates was measured. The measured length D is listed in Table 1.

As shown in Table 1, it can be found that the length D of the projection gradually increases in proportion to the increase in the inner diameter of the nozzle. In particular, when the inner diameter of the nozzle may exceed 3 mm, it can be noted that the length D is rapidly increased to not less than 0.3 mm. Therefore, the inner diameter of the nozzle is not more than 3 mm, which is a preferred design in the sandblasting process.

Analysis of the change of bending strength corresponding to the amount of chemical etching and the strengthened glass substrate

The original tempered glass substrate was physically cut to a tempered glass substrate having a size of 4 inches and a thickness of 0.55 mm. The tempered glass substrate has a photoresist mask pattern. The etched surface of the tempered glass substrate is chemically etched using an etching solution, and the etching depth is controlled. The bending strength of the strengthened glass substrate in relation to the etching depth of the cut surface was measured. The measured bending strengths are shown in Table 2.

As shown in Table 2, when the etching depth was from 100 μm to 700 μm, it was noted that the bending strength of the strengthened glass substrate was not less than 180 Newtons (N). Conversely, when the etching depth is less than 100 μm, the tempered glass substrate does not have a bending strength of not less than 180 Newtons (N). Further, when the etching depth exceeds 700 μm, the bending strength does not increase and the mask pattern peels off from the strengthened glass substrate. Therefore, in order to provide a stable bending strength of the tempered glass substrate of not less than 180 Newtons (N), it is preferred that the cut surface has an etching depth of from 100 μm to 700 μm.

Analysis of the change of bending strength corresponding to the amount of chemical etching and the strengthened glass substrate

The original tempered glass substrate was physically cut to a tempered glass substrate having a size of 4 inches and a thickness of 0.7 mm. The tempered glass substrate has a photoresist mask pattern. An etching solution is used to chemically etch the cut surface of the strengthened glass substrate and control the etching depth. The bending strength of the strengthened glass substrate related to the etching depth of the cut surface was measured. The measured flexural strengths are listed in Table 3.

As shown in Table 3, when the etching depth is from 100 μm to 700 μm, it is noted that the bending strength of the strengthened glass substrate is not less than 230 Newtons (N). Conversely, when the etching depth is less than 100 μm, the tempered glass substrate does not have a bending strength of not less than 230 Newtons (N). Further, when the etching depth exceeds 700 μm, the bending strength does not increase and the mask pattern peels off from the strengthened glass substrate. Therefore, in order to provide a stable bending strength of the tempered glass substrate of not less than 230 Newtons (N), it is preferred that the cut surface has an etching depth of from 100 μm to 700 μm.

Analysis of the change of bending strength corresponding to the amount of chemical etching and the strengthened glass substrate

The original tempered glass substrate was physically cut to a tempered glass substrate having a size of 7 inches and a thickness of 0.85 mm. The tempered glass substrate has a photoresist mask pattern. An etching solution is used to chemically etch the cut surface of the strengthened glass substrate and control the etching depth. Strong for the depth of etching of the cut surface The bending strength of the glass substrate was measured. The measured bending strengths are shown in Table 4.

As shown in Table 4, when the etching depth was from 100 μm to 700 μm, it was noted that the bending strength of the strengthened glass substrate was not less than 340 Newtons (N). Conversely, when the etching depth is less than 100 μm, the tempered glass substrate does not have a bending strength of not less than 340 Newtons (N). Further, when the etching depth exceeds 700 μm, the bending strength does not increase, and the mask pattern is peeled off from the strengthened glass substrate. Therefore, in order to provide a stable bending strength of the tempered glass substrate of not less than 340 Newtons (N), it is preferred that the cut surface has an etching depth of from 100 μm to 700 μm.

Analysis of the change of bending strength corresponding to the amount of chemical etching and the strengthened glass substrate

The original tempered glass substrate was physically cut to a tempered glass substrate having a size of 7 inches and a thickness of 1.5 mm. The tempered glass substrate has a photoresist mask pattern. An etching solution is used to chemically etch the cut surface of the strengthened glass substrate and control the etching depth. The bending strength of the strengthened glass substrate related to the etching depth of the cut surface was measured. The measured flexural strengths are listed in Table 5.

As shown in Table 5, when the etching depth was from 100 μm to 700 μm, it was noted that the bending strength of the strengthened glass substrate was not less than 700 Newtons (N). Conversely, when the etch depth is less than 100 microns, the tempered glass substrate does not have Bending strength below 700 Newtons (N). Further, when the etching depth exceeds 700 μm, the bending strength does not increase and the mask pattern peels off from the strengthened glass substrate. Therefore, in order to provide a stable bending strength of the tempered glass substrate of not less than 700 Newtons (N), it is preferred that the etched depth of the cut surface is from 100 micrometers to 700 micrometers.

Analysis of the change of bending strength corresponding to the amount of chemical etching and the strengthened glass substrate

The original tempered glass substrate was physically cut to a tempered glass substrate having a size of 7 inches and a thickness of 3.0 mm. The tempered glass substrate has a photoresist mask pattern. An etching solution is used to chemically etch the cut surface of the strengthened glass substrate and control the etching depth. The bending strength of the strengthened glass substrate related to the etching depth of the cut surface was measured. The measured bending strengths are shown in Table 6.

As shown in Table 6, when the etching depth was from 100 μm to 700 μm, it was noted that the flexural strength of the strengthened glass substrate was not less than 1,500 Newtons (N). Conversely, when the etching depth is less than 100 μm, the tempered glass substrate does not have a bending strength of not less than 1500 Newtons (N). Further, when the etching depth exceeds 700 μm, the bending strength does not increase, and the mask pattern is peeled off from the strengthened glass substrate. Therefore, in order to provide a stable bending strength of the tempered glass substrate of not less than 1500 Newtons (N), it is preferred that the cut surface has an etching depth of from 100 μm to 700 μm.

According to several embodiments, the original strengthened glass substrate can be physically cut. The cut surface of the tempered glass substrate can be chemically etched with hydrofluoric acid to remove microcracks and bulges. Therefore, the bending strength of the tempered glass substrate of the touch screen can be enhanced.

Therefore, since the strength and bending strength of the side of the tempered glass substrate of the touch screen are enhanced, the touch screen can be prevented from being damaged during the manufacturing process. Furthermore, several touch screens can be fabricated from a single tempered glass substrate, so the mass production of the touch screen can be significantly improved.

Furthermore, the conductive structure of the unit elements on the original tempered glass substrate may not be damaged in the physical cutting process. Therefore, the tempered glass substrate can be manufactured at low cost and in a short time.

Furthermore, this method can be used on the edge of the original tempered glass substrate without the conductive structure being damaged. Therefore, the mass production of the touch screen can be greatly improved.

Furthermore, when the original tempered glass substrate may be physically cut, The electrical structure may not be damaged by physical impact, for example, the ashing process may not be applied to jumpers, electrodes, and the like. Therefore, the manufacturing time of the touch screen can be significantly reduced.

Furthermore, the process of physically cutting the original tempered glass substrate and the process of chemically etching the tempered glass substrate cut surface may use only one mask pattern. Thus there is no need to replace a new mask pattern in a chemical etch. Thereby, the manufacturing time of the tempered glass substrate is lowered, and the yield of the tempered glass substrate is further improved.

In conclusion, the present invention has been disclosed in the above embodiments, but it is not intended to limit the present invention. A person skilled in the art can make various changes and modifications without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

S210~S250‧‧‧Steps

100‧‧‧Original tempered glass substrate

101‧‧‧Primary tempered glass substrate

102‧‧‧ Strengthened glass substrate

110‧‧‧Electrical structure

120‧‧‧ mask pattern

C‧‧‧Microcracks

D‧‧‧ Length

R‧‧‧ unit components

1 is a block diagram of a method of processing a tempered glass substrate for a touch screen according to several embodiments.

2A to 2E are cross-sectional flowcharts showing a method of processing a tempered glass substrate in Fig. 1.

Fig. 3 is a cross-sectional enlarged view showing a cut surface of a tempered glass substrate by a physical cutting process.

S210~S250‧‧‧Steps

Claims (8)

A method for processing a tempered glass substrate for a touch screen, the method comprising: preparing an original tempered glass substrate, the original tempered glass substrate having a plurality of unit elements, wherein a plurality of conductive structures for the touch screen are formed Within the unit elements; physically cutting the original tempered glass substrate along a plurality of boundary lines between the unit elements to form a plurality of primary tempered glass substrates, the primary tempered glass substrates having a plurality of cutting faces; The chemical etching process removes minute cracks on the cut faces of the primary strengthened glass substrates to form the strengthened glass substrate. The method of claim 1, wherein the step of physically cutting comprises a laser cutting process, a waterjet cutting process, a sandblasting process or a cutting process. The method of claim 1, wherein the step of physically cutting comprises a sandblasting process comprising rapidly spraying an abrasive and air onto the original strengthened glass substrate with a nozzle, one of the nozzles The inner diameter is from about 0.3 mm (mm) to about 3 mm. The method of claim 3, wherein each of the cutting masks of the primary tempered glass substrates formed by the blasting cutting process has a protrusion, and each of the protrusions starts from each of the cutting surfaces. The length does not exceed about 280 microns (μm). The method of claim 4, wherein the original tempered glass substrate has a thickness of from about 0.5 mm to about 3 mm. For example, the method described in claim 1 further includes forming a A mask pattern is on the original tempered glass substrate, the mask pattern including at least one layer, the mask pattern exposing the boundary lines. The method of claim 1, wherein the chemical etching process uses an etching solution comprising a hydrofluoric acid and having an etching depth of from about 100 microns to about 700 microns from each of the cutting faces. The method of claim 1, further comprising physically etching the original tempered glass substrate using a metal mask to form a plurality of openings, the openings extending through the original tempered glass substrate