TW201330036A - Device and method for manufacturing device - Google Patents

Abstract

This device (1) has: a capacitor unit (50) that includes capacitor components (5); a packaging member (99) for covering the capacitor unit (50); and external connection electrodes that are electrically connected to the capacitor components (5). Each capacitor component (5) includes: a base body (10) serving as an anode; a functional layer (31) that covers both a part of the front surface (11) and a part of the back surface (12) of the base body (10); a first uncovered region (11a) that is not covered by the functional layer (31) on the front surface (11) of the base body (10); and a second uncovered region (12a) that is not covered by the functional layer (31) on the back surface (12) of the base body (10). The external connection electrodes include a first external connection electrode (91) that covers a first surface (71) which is formed so as to pass through a part of the packaging member (99) as well as a part of the base body (10) including a part of the first uncovered region (11a) and a part of the second uncovered region (12a).

Description

Device and device manufacturing method

The present invention relates to a device having a built-in capacitor element.

Japanese Laid-Open Patent Publication No. 2003-264125 discloses that a wafer-like solid electrolytic capacitor is provided which has a height difference when connecting a capacitor element and a convex portion of a lead frame, and is not manufactured to relax a bending of an anode substrate. Under the high-priced metal mold, in order to avoid bending of the anode substrate, a step is placed on the convex portion of the lead frame, and a wafer-shaped solid electrolytic capacitor having a low cost and a good leakage current value is obtained. The wafer-shaped solid electrolytic capacitor described in this document is an anode base composed of a flat valve action metal having a dielectric oxide film layer on its surface, and an end portion thereof is an anode portion, and the remaining portion of the anode substrate is A semiconductor layer is sequentially disposed on the dielectric oxide film layer, and a solid electrolytic capacitor element having a conductor layer disposed thereon is connected to the lead frame, and a portion of the lead frame is left to be sealed with an external resin to form a wafer. A solid electrolytic capacitor in which at least the anode portion of the valve-acting metal substrate is connected to the anode side of the lead frame through a metal wire.

[Previous Technical Literature] [Patent Literature]

Japanese Patent Publication No. 2003-264125

With the high performance and small size and weight reduction of electronic devices including mobile information terminals such as smart phones, capacitor devices used around the CPU of electronic devices are also required to be smaller and larger. In the wafer-like solid electrolytic capacitor disclosed in the above document, the anode portion of the capacitor element and the anode side of the lead frame are connected by a metal wire inside the exterior resin. Therefore, the exterior resin is formed so as to cover the capacitor element and cover a region (volume) including a metal wire and a connection portion with the wire lead frame, that is, a region other than the capacitor element which does not contribute to the expansion of the capacity of the capacitor device. .

One aspect of the present invention is a device having a capacitor unit including a capacitor element, a package member covering the capacitor unit, and a plurality of external connection electrodes electrically connected to the capacitor element. The capacitor element comprises: a plate-shaped substrate as an anode; a functional layer formed to cover a pair of opposite sides of the substrate and a part of the other surface; and a functional layer containing a solid electrolyte layer and an electrode layer; one side of the substrate a first non-covered area partially covered by the functional layer; and a second non-covered area partially covered by the functional layer and not covered by the functional layer. The plurality of external connection electrodes include a first external connection electrode that covers a portion of the package member together with a portion of the substrate to pass a portion of the first non-covered region and a portion of the second non-covered region The way through the first surface formed.

The device includes a part of the capacitor unit after being covered by a package member such as a stamper resin. The first external connection electrode covered by the formed first surface. The first external connection electrode is electrically connected to the substrate exposed on the first surface. The first external connection electrode is directly connected to the substrate by cutting off the package member. Therefore, the space of the metal wire or the package member which does not contribute to the expansion of the capacitor capacity can be reduced, and the space efficiency can be improved.

The capacitor unit may further include a plurality of laminated capacitor elements, and the plurality of laminated capacitor elements are electrically connected through at least a portion of the functional layer, and the first external connection electrode may further include at least one capacitor element covering the plurality of capacitor elements. The electrode of the first surface exposed by the substrate. Even in a device including a capacitor unit in which a plurality of capacitor elements are stacked, the substrate and the external connection electrode can be directly connected to each other, thereby improving space efficiency.

It is preferable that the first non-covered region and the second non-covered region are disposed at positions facing each other on the one surface and the other surface. The distance between the portion of the first non-covered region and a portion of the second non-covered region of the first external connection electrode can be shortened. Therefore, the current path can be shortened. Therefore, a device with a low ESL can be provided.

The first surface is formed by including a portion of the package member together with a portion of the substrate through an end portion of the first non-covered region and a portion of the second non-covered region. The first external connection electrode may further include an electrode covering the end surface while covering a part of the capacitor member to cover a part of the capacitor unit. The space for wiring inside the package member can be reduced or omitted. Therefore, it is possible to reduce or omit the space for wiring which does not contribute to the expansion of the capacitor capacity in the space covered by the package member. Therefore, the space covered by the packaged member can be effectively used as an empty function of the capacitor. between. Therefore, it is possible to provide a device that is space efficient, small, and large in capacity.

Further, in this device, the wiring space occupied by the space covered by the package member such as the mold resin can be reduced or omitted, and the current path can be shortened. Therefore, a device with a low ESL can be provided.

Preferably, the capacitor element includes: a first insulating layer that insulates the first non-covered region of the substrate from the functional layer; and a second insulating layer that insulates the second non-covered region of the substrate from the functional layer, the first external connection The electrode system includes an electrode covering the first surface formed by penetrating a portion including the first insulating layer and a portion of the second insulating layer.

The base of the capacitor element may have a square shape, and the first external connection electrode may include an electrode covering the first surface formed by exposing at least one of the four corners of the base. Further, the capacitor element includes a through electrode that penetrates the substrate and electrically connects the electrode layers on one surface and the other surface, and the first external connection electrode may include plural numbers covering each of four corners or four sides formed on the substrate. A plurality of electrodes on the first side.

Preferably, the first external connection electrode includes at least one of a metal layer that is melted on the first surface, a metal layer that is vapor-deposited on the first surface, and a conductive paste-coated metal layer that is applied to the first surface. . A typical external connection electrode is a metallization electrode formed by melting a powdery conductive metal on a first surface.

Preferably, the device has a substrate on which the capacitor unit is mounted, and the package member covers the capacitor unit mounted on the substrate.

One of the different aspects of the present invention is a printed wiring board having the above-described device and printed wiring for mounting the device and having the printed wiring board thereof Electronic equipment.

One of the other different aspects of the present invention is a method of fabricating a device having a capacitor unit, comprising the following steps.

1. A portion of the package member is formed to pass through a portion of the first non-covered region and a portion of the second non-covered region together with a portion of the substrate to form a first surface.

2. The first surface is covered with a conductive member, and the first external connection electrode included in the plurality of external connection electrodes is formed.

The capacitor unit may further include a plurality of laminated capacitor elements including a plurality of laminated capacitor elements, and the plurality of laminated capacitor elements are electrically connected via at least a portion of the functional layer, and the first surface may be formed to The first surface is formed such that the base of at least one of the plurality of capacitor elements is exposed.

Forming the first surface may also include forming a portion of the package member together with a portion of the substrate through a portion of the first non-covered region of the substrate and a portion of the second non-covered region The first external connection electrode may be formed on one side, and the electrode may be formed to cover the end surface while covering a part of the capacitor member to cover a part of the capacitor unit.

The capacitor element includes: a first insulating layer that insulates the first non-covered region of the substrate from the functional layer; and a second insulating layer that insulates the second non-covered region of the substrate from the functional layer, and the first surface may be formed by The first surface is formed by penetrating a portion including the first insulating layer and a portion of the second insulating layer.

Preferably, forming the first external connection electrode includes: The metal is sprayed on the first surface, and the metal is vapor-deposited on the first surface and the conductive paste is applied to the first surface.

1‧‧‧ device

2‧‧‧Installation surface

5‧‧‧ capacitor components

10‧‧‧ base

10e‧‧‧ end

11‧‧‧ surface

11a‧‧‧1st non-covered area

12‧‧‧ Back

12a‧‧‧2nd non-covered area

15‧‧‧through holes (through holes)

15c‧‧‧ inner circumference

19‧‧‧through electrodes

20‧‧‧Dielectric oxide film

21‧‧‧Solid electrolyte layer

22a (22) ‧ ‧ electrode layer (cathode layer)

22b (22) ‧ ‧ electrode layer (cathode layer)

31‧‧‧1st functional layer

32‧‧‧2nd functional layer

33‧‧‧3rd Capacitor Functional Layer (Functional Layer)

35‧‧‧ Periphery

36‧‧‧ Periphery

41‧‧‧1st insulation layer

42‧‧‧2nd insulation layer

42e‧‧‧ end

50‧‧‧ capacitor unit

51‧‧‧Anode

60‧‧‧ mould body

62‧‧‧Internal space

63a‧‧‧right side (part of)

71‧‧‧ end face

81‧‧‧Electrode layer

90‧‧‧Substrate

90a‧‧‧Side side

90b‧‧‧Face on the side of the installation

90e‧‧‧ end

91‧‧‧Anode terminal (anode connection electrode, first external connection electrode)

92‧‧‧ cathode terminal (electrode for cathode connection, electrode for second external connection)

92a, 92b‧‧‧ electrode layer

92c‧‧‧ core layer

95‧‧‧electrodes (through holes)

99‧‧‧Molded resin

Fig. 1 is a cross-sectional view showing a part of a printed wiring board on which a device is mounted.

Fig. 2 is a perspective view showing the outline of the apparatus.

Fig. 3 is a perspective view showing the state of the device after the electrode layer is removed.

Fig. 4 is a plan view of the state display device penetrating the stamper resin.

Fig. 5 is a V-V sectional view of the apparatus (V-V section of Fig. 4).

Fig. 6 is a cross-sectional view showing a state in which a capacitor element is mounted on a substrate.

Fig. 7 is a cross-sectional view showing a state in which a substrate and a capacitor unit are integrally molded by a molding resin.

Fig. 8 is a cross-sectional view showing a state in which the molded body is cut.

Fig. 9 is a cross-sectional view showing the state of the electrode layer in the end face layer.

Fig. 10 is a plan view showing different devices in a state of penetrating a stamper resin.

Fig. 11 is a perspective view showing the apparatus shown in Fig. 10 in a state of penetrating the electrode layer.

Figure 12 is a plan view showing still another different device in a state of penetrating the molding resin.

Figure 13 is a plan view showing still another different device in a state of penetrating the molding resin.

Figure 14 is a cross-sectional view of the XIV-XIV of the apparatus shown in Figure 13 (section XIV-XIV of Figure 13).

Fig. 15 is a perspective view showing a state of still another different device after the electrode layer is removed.

Figure 16 is a cross-sectional view taken along the line XVI-XVI of the apparatus shown in Figure 15 (XVI-XVI section of Figure 15).

Figure 17 is a cross-sectional view showing still another different device.

Figure 18 is a cross-sectional view showing still another different device.

Figure 19 is a cross-sectional view showing still another different device.

Fig. 1 is a cross-sectional view showing a part of a printed wiring board on which a device according to the present invention is mounted. The printed wiring board 100 is mounted on a printed circuit board of an electronic device including a mobile information terminal such as a smart phone or a notebook type personal computer. The CPU 200 is mounted on the front surface 100a of the printed wiring board 100, and the device (capacitor device) 1 including the capacitor unit 50 is mounted on the back surface 100b. The power supply terminal 201 of the CPU 200 and the connection electrodes (electrode terminals for the first and second external connection) 91 and 92 of the device 1 are electrically connected by the through electrode 101 penetrating the printed circuit board 100. Therefore, the device 1 functions as a decoupling capacitor or a bypass capacitor.

2 is a perspective view showing an outline of the display device 1. The device 1 includes a substrate 90, a capacitor unit 50 mounted on the mounting surface 90a of the substrate 90, and a substrate 90 and a capacitor unit 50 in addition to the substrate 90 and the one surface (first surface, end surface) 71 of the capacitor unit 50. A member for mounting (packaging member, stamper resin) 99; and an electrode layer 81 covering the end face 71. The end surface 71 is cut so that the substrate 90 and the capacitor unit 50 can be formed by the molding resin 99 One end (one portion, right side surface) 63a of the molded body 60 integrally formed in a thin rectangular parallelepiped shape (plate shape) is formed. The electrode layer 81 covering the end surface 71 is electrically connected to the first electrode portion (anode portion) 51 of the capacitor unit 50 which is exposed in the same plane as the end surface 71. Therefore, the electrode layer 81 has both the extraction electrode layer for external connection and the electrode terminal (first external connection electrode) 91 for the first external connection. The sealing resin 99 may be a sealing resin such as an epoxy resin.

In the device 1, the anode portion 51 of the capacitor unit 50 is electrically connected by the electrode layer 81 which also serves as an exterior. The typical electrode layer 81 is a metallized electrode that is formed (adhered) by being sprayed (adsorbed) on the end surface 71 by a mist atomization method or the like. Examples of the metal to be melted on the end surface 71 include conductive metals such as gold, silver, copper, and aluminum, and copper is suitable in consideration of balance between conductivity and cost. Further, the electrode layer 81 can also be formed by metal deposition or coating of a conductive paste.

Fig. 3 is a perspective view showing the state of the apparatus 1 after the electrode layer 81 is removed. The molded capacitor unit 50 includes two capacitor elements 5 stacked one on another. The capacitor element 5 is a solid electrolytic capacitor element. The capacitor element 5 includes: a valve-shaped substrate (base) 10 cut into a substantially square film shape (plate shape); a dielectric oxide film 20 formed on both sides 11 and 12 of the lower surface of the substrate 10; laminated on the substrate The first capacitor functional layer (functional layer) 31 on the dielectric oxide film 20 on the surface (one surface) 11 side of the surface 10 is laminated on the dielectric oxide film 20 on the back side (the other surface) 12 side of the substrate 10 The second capacitor functional layer (functional layer) 32; the first layer covering the entire periphery (the entire circumference) of the first functional layer 31 on the dielectric oxide film 20 on the surface 11 side of the substrate 10 Insulation layer 41; covering the second function The second insulating layer 42 is directly laminated on the dielectric oxide film 20 on the back surface 12 side of the substrate 10 in the entire periphery (all circumferences) of the layer 32.

The first functional layer 31 and the second functional layer 32, the first insulating layer 41, and the second insulating layer 42 are disposed at positions (ranges) in which the first and second insulating layers 41 and the second insulating layer 42 are placed on the substrate 10 in the vertical direction. The end surface 71 of the apparatus 1 transmits the unevenness (not cut) formed by the notch (cutting or cutting) of the first insulating layer 41, the substrate 10, the second insulating layer 42, and the substrate 90 including the stamper resin 99. Face (same side). Therefore, the end surface 71 includes an end portion 99e in which the stamper resin 99 has a gate shape, a square end portion 90e of the substrate 90, and two capacitor elements 5 which are sequentially stacked from above in the like. The square end portion 41e of the first insulating layer 41; the square end portion 10e of the base body 10; the square end portion 42e of the second insulating layer 42; the square end portion 41e of the first insulating layer 41; the square of the base body 10 The end portion 10e; the square end portion 42e of the second insulating layer 42. Therefore, in the end surface 71, the portion (end portion) 10e including the one side 13a of each of the base members 10 is exposed (exposed) in a state of being sandwiched by the first insulating layer 41 and the second insulating layer 42 to form the capacitor unit 50. Anode portion 51.

Further, in the apparatus 1, the first and second functional layers 31 are passed through the dielectric oxide film 20 covering the both surfaces 11 and 12 of the substrate 10 without providing the first insulating layer 41 and the second insulating layer 42. And 32 may be insulated from the electrode layer 81. In the device 1, the first and second insulating layers 41 and 42 are laminated on the dielectric oxide film 20. Therefore, the insulation properties of the first and second functional layers 31 and 32 and the electrode layer 81 can be further improved. Further, a plurality of capacitor elements 5 can be easily laminated vertically.

4 shows the display device 1 in a state of penetrating the stamper resin 99. Top view. The anode portion 51 of the capacitor unit 50 is formed by exposing a portion (end portion) 10e including one side 13a of the four sides 13a to 13d of the base 10 to the end surface 71. Further, the anode portion 51 may be formed by exposing a portion including the other three sides 13b to 13d of the base 10 in the same manner as described above, or by passing two or more of the four sides 13a to 13d. It is revealed that such an end surface is exposed.

Fig. 5 shows a more detailed configuration of the display device 1 by a V-V sectional view (V-V cross section of Fig. 4). The first functional layer 31 of each capacitor element 5 includes a solid electrolyte layer 21 which is sequentially laminated on the dielectric oxide film 20 formed on the surface 11 of the substrate 10, and an electrode layer (cathode layer) 22a (22). The second functional layer 32 of the capacitor element 5 includes a solid electrolyte layer 21 which is sequentially laminated on the dielectric oxide film 20 formed on the back surface 12 of the substrate 10, and an electrode layer (cathode layer) 22b (22). The surface 11 and the back surface 12 of the base 10 are made porous by etching or the like.

The capacitor element 5 includes a first non-covered region 11a that is not covered by the first functional layer 31 of the surface 11 of the substrate 10, and a second non-covered region 12a that is not covered by the second functional layer 32 of the back surface 12 of the substrate 10. Further, the capacitor element 5 includes a first insulating layer 41 that insulates the first non-covered region 11a of the base 10 from the first functional layer 31, and in which the second non-covered region 12a of the base 10 is insulated from the second functional layer 32. The second insulating layer 42. The first insulating layer 41 is laminated on the dielectric oxide film 20 on the surface 11 side of the substrate 10 so as to cover the entire circumference of the peripheral edge 35 of the first functional layer 31. The second insulating layer 42 is laminated on the dielectric oxide film 20 on the back surface 12 side of the substrate 10 so as to cover the entire circumference of the peripheral edge 36 of the second functional layer 32. Therefore, through the first The second insulating layers 41 and 42 are formed to penetrate through a portion of the first non-covered region 11a of the substrate 10 and a portion of the second non-covered region 12a, whereby the end surface 71 can be formed. Therefore, the base 10 exposed to the end surface 71 and the first and second functional layers 31 and 32 can be insulated by the first and second insulating layers 41 and 42.

Each of the capacitor elements 5 further includes a through hole (through hole) 15 penetrating through the center of the base 10; and a third capacitor functional layer (functional layer) 33 formed on the inner peripheral surface 15c of the through hole 15. The third functional layer 33 includes a solid electrolyte layer 21 which is sequentially stacked on the side in contact with the dielectric oxide film 20 covering the substrate 10, and a through electrode formed by being filled with a conductive paste such as a silver paste in the through hole 15. 19. Therefore, the cathode layer 22a of the first functional layer 31 and the cathode layer 22b of the second functional layer 32 are electrically connected by the through electrode 19 of the third functional layer 33.

Further, in the capacitor unit 50, the cathode layer 22a of the lower capacitor element 5 and the cathode layer 22b of the upper capacitor element 5 are electrically connected by a conductive paste or the like for fixing the element. The anode portion 51 is covered in a state in which the first insulating layer 41 and the second insulating layer 42 are vertically sandwiched. Therefore, when a plurality of capacitor elements 5 are stacked one on another, there is almost no occurrence of a short circuit between the anode portion 51 and the cathode layer 22. Therefore, it is easy to laminate a plurality of capacitor elements 5. Further, it is easy to increase the electrostatic capacitance of the capacitor unit 50 by increasing the number of laminated sheets, and it is also easy to lower the ESR (Equivalent Series Resistance).

Further, examples of the substrate 10 include an etched aluminum foil, a tantalum sintered body, a tantalum sintered body, and a titanium sintered body. When forming a thin device 1, it is suitable to etch the aluminum foil. In the case where the base 10 is made of an etched aluminum foil, the dielectric oxide film 20 is formed on the surface 11 of the substrate 10 and the alumina of the back surface 12. The solid electrolyte layer 21 may be a conductive material of polypyrrole, polythiophene, polyaniline or the like. The polymer is formed by laminating on the dielectric oxide film 20 by electrolytic polymerization or the like. An example of the electrode layer 22 (22a, 22b) is a cathode layer formed by transmitting a conductive paste such as a silver paste on the solid electrolyte layer 21. The first functional layer 31 and the second functional layer 32 may also contain a highly conductive graphite layer or the like which is laminated between the solid electrolyte layer 21 and the electrode layer (cathode layer) 22, and the contact resistance is easily reduced. An example of the first insulating layer 41 and the second insulating layer 42 is an insulating resin such as a polyimide resin or an epoxy resin.

Further, in the present specification, the electrode layer 22 functioning as the cathode layer 22 is an appearance cathode, and the solid electrolyte layer 21 functions as a function of a true cathode. The same applies to the following embodiments.

The substrate 90 on which the capacitor unit 50 is mounted is cut into a substantially square glass epoxy substrate. The mounting surface 90b on the opposite side of the mounting surface 90a of the substrate 90 is not covered by the molding resin 99. Therefore, the surface 90b on the mounting side of the substrate 90 appears on the mounting surface 2 of the printed circuit board 100 or the like for mounting the device 1 to the outside. The copper foil on the mounting side surface 90a of the substrate 90 and the mounting side surface 90b are patterned by etching or the like. A cathode connection electrode layer 92a connected to the cathode layer 22 of the capacitor unit 50 is formed on the surface 90a on the mounting side. A cathode terminal electrode layer 92b connected to the outside is formed on the mounting surface 90b. The electrode layers 92a and 92b are electrically connected by electrodes (through holes) 95 penetrating through the core layer 92c of the substrate 90.

Therefore, the cathode layer 22 of the capacitor unit 50 is exposed on the mounting surface 2 of the device 1 via the cathode terminals (cathode connecting electrodes, second external connecting electrodes) 92 formed on the electrode layers 92a and 92b of the substrate 90. The anode portion 51 of the capacitor unit 50 is formed by forming an electrode layer 81 of a portion of the exterior. The anode terminal (anode connection electrode, first external connection electrode) 91 is exposed on the mounting surface 2. The anode terminal 91 and the cathode terminal 92 exposed on the mounting surface 2 are electrically connected to a connection terminal provided on the printed circuit board 100 or the like. Therefore, the device 1 functions as a surface mount type device.

Further, the substrate 90 is not limited to this example, and may be a thin and lightweight coreless substrate without the core layer 92c. The inductor component resulting from the reduction of the through hole 95 is easy to improve electrical characteristics, and it is also easy to increase the degree of freedom in design of the wiring. Further, by forming a rewiring layer in the capacitor unit 50, a substrate without the substrate 90 can be formed.

In this apparatus 1, the electrode layer 81 is laminated on the end surface 71 cut out from the mold body 60 to constitute a part of the exterior (package). Therefore, the electrode layer 81 is connected to the anode portion 51 of the plurality of capacitor elements 5, and also serves as the anode terminal 91 for external connection. Therefore, it is not necessary to provide a space for connecting the anode portion 51 and the terminal for external connection, that is, the wiring space for electrode extraction, in the internal space 62 of the device 1 packaged by the mold resin 99 and the electrode layer 81. Therefore, the wiring space can be omitted. Therefore, the portion (wiring space) which does not substantially contribute to the expansion of the capacitor capacity can be cut or reduced from the internal space 62 of the apparatus 1. Therefore, the internal space 62 of the apparatus 1 can be used (utilized) more efficiently as a space for securing the capacity of the capacitor (storage). Therefore, it is possible to provide the apparatus 1 which is space efficient, small, and large in capacity.

Further, in the apparatus 1, the electrode layer 81 is adhered (attached, directly attached) to the end portion 10e of the base 10 exposed at the end surface 71. Therefore, the dielectric oxide film 20 as a power storage unit and the anode for external connection which are laminated on the inner surface 15c of the base 10, the back surface 12, and the inner peripheral surface 15c of the through hole 15 can be shortened. The distance of the terminal 91. Therefore, the device 1 can be shortened in current path and can provide a low ESL (equivalent series inductance).

Further, with this device 1, the external connection electrode can be directly connected to a part or all of the electrode layer 81 covering the end surface 71. Therefore, the connection method with the printed substrate 100 is flexible. For example, the electrode layer 81 can be mounted on the external printed circuit board 100 as the mounting surface of the device 1, and the device 1 can be provided with a low ESL that shortens the current path.

In the apparatus 1 of the present example, the electrode layer 81 covers the end surface 71 and covers the right side surface (part) 63a of the mold body 60 instead of the stamper resin 99, and serves as a part of the exterior package (package). A lead frame (metal plate) may be attached (connected) to the outer side (outer wall) of the electrode layer 81, and an external connection electrode may be formed by a metal film, a terminal socket, or the like. The electrode layer 81 is formed by transmitting a metal layer to be evaporated, a metal layer to be vapor-deposited, or a metal layer of a conductive paste. Therefore, it is easy to make the terminals of the lead frame and the like closely connected, and it is easy to increase the contact area.

A method of manufacturing the apparatus 1 is shown in FIGS. 6 to 9. 6 is a cross-sectional view showing a state in which the capacitor unit 50 including the capacitor element 5 is mounted on the substrate 90, and FIG. 7 is a cross-sectional view showing a state in which the substrate 90 and the capacitor unit 50 are integrally molded by the molding resin 99, and FIG. A cross-sectional view showing a state in which the molded body 60 is cut is shown, and FIG. 9 is a cross-sectional view showing a state in which the laminated electrode layer 81 is covered on the end surface 71.

First, as shown in FIG. 6, the capacitor unit 50 is mounted on the mounting surface 90a of the substrate 90 through the conductive paste. The cathode terminal 92 of the substrate 90 and the cathode layer 22 of the capacitor element 5 are electrically connected. Moreover, the cathode layer 22 of the plurality of capacitor elements 5 stacked above and below the capacitor unit 50 is opposite to the cathode Terminals 92 are connected in parallel.

Next, as shown in FIG. 7, the capacitor unit 50 and the substrate 90 are integrally molded by a stamper resin 99 to produce a molded body 60. In the device 1, the capacitor unit 50 and the substrate 90 are all covered with the mold resin 99 except for the surface 90b on the mounting side of the substrate 90.

Next, as shown in Fig. 8, a part of the mold body 60 is cut. In other words, the first insulating layer 41 including the stamper resin 99, the first non-covered region 11a, the second non-covered region 12a, and the second portion are placed in a state where the capacitor unit 50 and the substrate 90 are covered with the mold resin 99. The insulating layer 42 and the substrate 90 are notched (cut) so as to penetrate in a direction perpendicular to the substrate 90 in the range of the first insulating layer 41 and the second insulating layer 42. Thereby, the right side surface 63a of the molded body 60 perpendicular to the substrate 90 is cut out, and the end surface 71 on the same surface can be formed. In the end surface 71, the end portion 10e of the base 10 is in a state of being sandwiched by the first insulating layer 41 and the second insulating layer 42. Therefore, the anode portion 51 of the capacitor unit 50 can be formed on the end surface 71 in a state in which the cathode layer 22 (the first functional layer 31 and the second functional layer 32) is insulated.

Then, as shown in FIG. 9, the electrode layer 81 for external connection electrically connected to the anode portion 51 is laminated (formed) by exposing the end face 71 to the end surface 71 by spraying the copper or the like in the form of a powder. Thereby, in Fig. 8, the end surface 71 formed by cutting the molded body 60 is covered with the electrode layer 81, and the electrode layer 81 constitutes a part of the exterior of the apparatus 1. Further, the anode portions 51 of the plurality of capacitor elements 5 of the capacitor unit 50 are connected in parallel by the electrode layer 81. The electrode layer 81 covers the end surface 71, reaches the substrate 90, and is exposed on the surface 90b on the mounting side of the substrate 90, and serves as an electrode (anode terminal) 91 for external connection. Therefore, formed on the mounting side The surface 90b includes a surface mount type device 1 in which an anode terminal 91 and a cathode terminal 92 are provided. Further, the electrode layer 81 can also be formed by metal deposition or coating of a conductive paste.

In the method of manufacturing the surface mount type device, after the mold body 60 is formed by sealing (die) the capacitor unit 50 and the substrate 90, the mold is cut so that the anode portion 51 is exposed to the outer portion 61 of the mold body 60. The end face 71 is formed by the body 60, and the end face 71 is covered with the electrode layer 81 so as to be an exterior, and the anode terminal 91 for connecting the anode portions 51 to each other and connecting the anode portion 51 to the outside is formed. Therefore, the configuration (electrode) that electrically connects the anode portion 51 and the anode terminal 91 also serves as an exterior. Therefore, the inside of the exterior, that is, the wiring space for the electrode lead-out of the portion covered by the mold resin 99 (the inside 62 of the device 1) can be reduced or omitted. Therefore, the small and large-capacity device 1 can be manufactured.

Fig. 10 is a plan view showing a device 1a of a different surface mount type in a state of 99 penetrating the stamper resin. Fig. 11 is a perspective view showing the device 1a in a state of penetrating the electrode layer 81. This device 1a has an end surface 71 which is formed on the flat (the same surface) of one corner of the square-shaped molded body 60 without a step. In other words, the end surface 71 is caused to pass through the first insulating layer 41 including the stamper resin 99, the first non-covered region 11a of the substrate 10, the second non-covered region 12a, the second insulating layer 42, and the substrate 90. Formed into a fan-shaped (cylindrical (1/4 cylinder)) notch. Further, the device 1a includes an electrode (electrode layer) 81 which is formed to cover the end surface 71 and has a shape in which the entire shape of the device 1 is a rectangular parallelepiped.

The end face 71 is transmitted through the insulating layers 41 and 42 A portion (end portion) 10e having one corner 14a of the four corners of the base 10 is formed by a notch. Therefore, the anode portion 51 is in a state in which the portion (end portion) 10e including the one corner portion 14a of the base 10 is sandwiched by the end portion 41e of the first insulating layer 41 and the end portion 42e of the second insulating layer 42. The insulated state) is exposed at the end face 71. Therefore, by covering the end surface 71 with the electrode layer 81, the anode portions 51 of the plurality of capacitor elements 5 can be connected in parallel by the electrode layer 81. In addition, since the electrode layer 81 is exposed on the mounting surface 90b of the device 1a, it also serves as an electrode (anode terminal) 91 for the first external connection.

The end surface 71 can be formed in such a manner that any of the four corners 14a to 14d of the base 10 is exposed. The end faces 71 may be plural or formed by exposing the two corners of the four corners 14a to 14d. Further, the electrode layer 81 (anode terminal 91) covering the plurality of end faces 71 may be plural (multiple terminals), or may be one continuous electrode layer 81 (anode terminal 91).

The device 1a is also connected to the anode portion 51 of the capacitor element 5 through an electrode layer 81 constituting a part of the exterior. Therefore, the electrode layer 81 also serves as an anode terminal (first external connection electrode) 91. Therefore, the plurality of capacitor elements 5 can be electrically connected by the electrode layer 81 which also serves as the anode terminal 91. Therefore, it is possible to provide the device 1a which is simple and compact. In addition, since the corners of the mold body 60 are notched, the electrode layer 81 (anode terminal 91) for connection and external connection is formed, and the space vacated by the wiring or the electrode can be reduced. Therefore, the inner volume of the device 1a can be utilized more effectively as a capacitor. Therefore, a compact and large-capacity surface mount type device 1a can be provided. Further, the portion (volume) of the cutting mold body 60 is limited to the corners, and the amount of metal used for the spraying of the electrode layer 81 can be reduced. Therefore, it is possible to provide space efficient and large capacity at a lower cost. Device 1a.

Fig. 12 is a plan view showing still another different device 1b in a state of penetrating the molding resin 99. The capacitor unit 50 of the device 1b also includes two capacitor elements 5b stacked one above another, and the capacitor element 5b includes a film-shaped substrate (base) 10 cut into a substantially rectangular film shape (plate shape).

This apparatus 1b has an end surface 71 which is formed in a flat (same surface) portion having no step in the center of the right side surface 63a of the molded body 60 formed into a rectangular parallelepiped shape, and an electrode layer 81 formed to cover the end surface 71 thereof. The end surface 71 transmits (cuts out) the first insulating layer 41 including the stamper resin 99, the first non-covered region 11a of the substrate 10, the second non-covered region 12a, the second insulating layer 42, and the substrate 90. Formed by a semi-circular notch. The electrode layer 81 covers the end surface 71 in a semi-cylindrical shape. Therefore, the device 1b which is integrally packaged in a rectangular parallelepiped shape is formed by the molding resin 99 and the electrode layer 81.

In the device 1b, the central portion (end portion) 10e of one side 13a of the base 10 is cut into a semicircle in the range of the first and second insulating layers 41 and 42 (below the twist) depending on the end surface 71. shape. Therefore, in the end surface 71, the central portion (end portion) 10e is in a state of being sandwiched by the first insulating layer 41 and the second insulating layer 42. Therefore, the anode portion 51 is exposed in an insulated state. Therefore, by forming the electrode layer 81 so as to cover the end surface 71, the anode portions 51 of the plurality of capacitor elements 5 can be connected in parallel, and the electrode layer 81 serving as the anode terminal (first external connection electrode) 91 can be formed.

Similarly, the end surface 71 can be formed to include a center of either side of the four sides 13a to 13d of the base 10 or a position deviated from the center. Moreover, a plurality of end faces 71 may be formed to form a complex covering each end face 71. A plurality of electrode layers 81 and a plurality of anode terminals 91 are provided.

This device 1b also passes through the electrode layer 81 laminated on the end surface 71, and connects the anode portion 51 of the capacitor element 5 to the outside 61 of the stamper resin 99. Therefore, the inner portion 62 of the molded body 60 may not be provided with a wiring space. Therefore, a compact and large-capacity device 1b can be provided. Further, the entire surface of the rectangular package may not be replaced with the electrode layer. Therefore, the amount of metal used for the electrode layer 81 to be melted can be reduced, and a device including a plurality of anode terminals 91 can be provided. Therefore, a device with low ESL and low ESR and small size and large capacity can be provided at low cost.

Fig. 13 is a plan view showing still another different device 1c in a state of penetrating the molding resin 99. Further, in Fig. 14, the apparatus 1c is displayed by the XIV-XIV sectional view (XIV-XIV cross section of Fig. 13).

This device 1c includes a through hole 70 formed in one corner 64a of a molded body 60 formed into a rectangular parallelepiped shape. The through hole 70 has an inner peripheral surface (first surface) 71 having no flatness (same surface) of step difference. The inner peripheral surface 71 is permeable to the first non-covered region 11a, the second non-covered region 12a, the second insulating layer 42, and the substrate 90 in which the first insulating layer 41 including the stamper resin 99 and the substrate 10 are not allowed to pass. The lower part is formed by being inserted (extracted) in a circular shape. The through hole 70 penetrates within the range of the first and second insulating layers 41 and 42 (in the range). Therefore, on the inner peripheral surface 71, the anode portion 51 of each capacitor element 5 is exposed in an insulated state. Therefore, the conductive paste is applied to the through hole 70, and the conductive paste is applied (attached) to the inner peripheral surface 71 of the through hole 70, whereby the electrode layer 81 can be formed to cover the inner peripheral surface 71. Therefore, the anode portion 51 of the plurality of capacitor elements 5 can be connected. Therefore, the electrode layer 81 as the anode terminal (first external connection electrode) 91 can be formed on the outer portion 61 of the mold body 60. In addition, inside The circumferential surface (first surface) 71 is coated with a conductive paste, and includes a concept of filling (injecting) a conductive paste into the through hole 70, and further including applying a conductive paste filled in the through hole 70 to the inner peripheral surface 71 (so that The concept of attachment and closeness.

Thus, after the mold body 60 is formed, not only the electrode layer 81 but also the portion including the four sides 13a to 13d of the substrate 10 or the portions including the four corners 14a to 14d including the mold body 60 is covered. The end surface 71 formed by the notch can also cover the end surface 71 formed by the base 10 in the range of the first insulating layer 41 and the second insulating layer 42 by the electrode layer 81. In the device 1c, the anode portion 51 of the plurality of capacitor elements 5 can be connected in parallel by forming a portion (through hole 70) that is pulled out in a penetrating manner by the electrode layer 81, and an electrode serving as the terminal electrode 91 can be formed. Layer 81.

A wiring member for connecting the capacitor element 5 such as a bonding wire (metal wire) to the substrate 90 or the lead frame is not required in the device 1c. Therefore, the wiring space for arranging the wiring members can be omitted. Moreover, most of the package of device 1c is occupied by molded body 60. Therefore, the device 1c having a balanced shape and high space efficiency and large capacity can be provided at a lower cost.

Fig. 15 is a perspective view showing a state of still another different device 1d after the electrode layer 81 is removed. In Fig. 16, the schematic structure of the device 1d is shown by the XVI-XVI sectional view (XVI-XVI cross section of Fig. 15).

This device 1d has an end surface 71 which is formed on the right side surface 63a of the molded body 60 formed into a rectangular parallelepiped shape, and has an uneven surface (the same surface) 71 and an electrode layer 81 formed to cover the end surface 71 thereof. The end surface 71 transmits the first insulating layer 41 including the stamper resin 99, the first non-covered region 11a of the substrate 10, the second non-covered region 12a, and the second insulating layer 42 The anode lead terminal 191 of the lead frame 190 of the first anode terminal (first external connection electrode) 91 is formed by a notch (cutting or cutting).

The capacitor unit 50 of the device 1d includes two capacitor elements 5d stacked one above another. The capacitor element 5d does not penetrate the through hole 15 of the base 10, and instead includes the third functional layer 33 formed on the side surface of one side 35c of the base 10 and is connected to the first functional layer 31 and the second functional layer 32. The third functional layer 33. Therefore, the first insulating layer 41 is formed along the three sides 35a, 35b, and 35d of the peripheral edge 35 of the first functional layer 31. The second insulating layer 42 is formed along the three sides 36a, 36b, and 36d of the peripheral edge 36 of the second functional layer 32. The first functional layer 31 and the second functional layer 32 are electrically connected via a third functional layer 33 formed on one side 35c.

Therefore, the cathode layer 22 of each capacitor element 5d is connected in parallel by the third functional layer 33 for the through hole 15 penetrating through the base 10. Further, the anode portion 51 is connected in parallel by the electrode layer 81 formed on the end surface 71. Therefore, a compact and large-capacity device 1d can be provided.

Further, the anode portion 51 and the anode lead terminal 191 can be electrically connected by the electrode layer 81 covering the end surface 71. Further, the cathode layer 22 and the cathode lead terminal 192 can be electrically connected by a conductive paste or the like.

Fig. 17 is a cross-sectional view showing a schematic configuration of still another different device 1e. The capacitor unit 50 of the device 1e includes two capacitor elements 5e which are vertically stacked in a left-right position (a thousand birds). For example, in each of the capacitor elements 5e, the through hole 15 penetrating the base 10 is provided at a position (eccentric position) slightly shifted from the center of the base 10 to any of the four sides 13a to 13d. Therefore, the capacitor elements 5e are oriented to change the orientation to the through holes 15. When the lower opposing manner is superimposed, the end portion 10e of the base 10 can be staggered in a staggered manner. The capacitor element 5 having the through hole 15 at the center and the capacitor element 5d having no through hole 15 may be stacked in the same manner as the end portion 10e of the base 10 in the same manner.

The device 1e has a first end face 71 and a second end face 72 which are formed on both sides of the molded body 60 which is formed into a rectangular parallelepiped shape, that is, the right side face 63a and the left side face 63c, and cover the respective end faces 71 and 72. The first electrode layer 81 and the second electrode layer 82. The first end surface 71 transmits the first insulating layer 41 of the lower capacitor element 5e including the stamper resin 99, the first non-covered region 11a of the base 10, the second non-covered region 12a, and the second insulating layer 42. The first anode lead terminal 191a of the lead frame 190 as the first anode terminal (first external connection electrode) 91a is formed by a notch (cutting or cutting). The second end surface 72 transmits the first insulating layer 41 of the upper capacitor element 5e including the stamper resin 99, the first non-covered region 11a of the substrate 10, the second non-covered region 12a, and the second insulating layer 42. The second anode lead terminal 191b of the lead frame 190 as the second anode terminal 91b is formed to have a notch.

Therefore, the anode portion 51 of the lower capacitor element 5e and the first anode lead terminal 191a are electrically connected by the first electrode layer 81 covering the first end surface 71. Further, the anode portion 51 and the second anode lead terminal 191b of the upper capacitor element 5e are electrically connected by the second electrode layer 82 covering the second end surface 72. Further, the electrode layers 81 and 82 reach the mounting surface 190b and function as connection electrodes. Further, a cathode lead terminal 192 as a cathode terminal 92 is provided at the center of the mounting surface 90b to be connected to the cathode layer 22 and/or the through electrode 19 of the capacitor element 5e.

In the device 1e, a plurality of laminated capacitor elements 5e are laminated such that the positions at the ends in the horizontal direction are shifted. Therefore, when the first and second end faces 71 and 72 are formed, the end portions 10e of the base 10 of the different capacitor elements 5e are exposed at the respective end faces 71 and 72. Therefore, the respective capacitor elements 5e can be independently connected through the electrode layers 81 and 82 formed on the different end faces 71 and 72, respectively. Therefore, a multi-terminal capacitor device 1e having a plurality of electrostatic capacitances can be provided. Further, by changing the withstand voltage of the base 10 through the upper capacitor element 5e and the lower capacitor element 5e, the multi-terminal multi-voltage specification device 1e can be provided.

The capacitor element 5e is not limited to the left and right directions, and may be stacked in three or four directions. The electrode layer covering the end faces is not limited to the side faces of the opposite sides of the rectangular package, and may be formed on the faces of 3 or 4 squares, respectively. Further, by using a polygonal package and a plurality of capacitor elements 5e arranged left and right, more terminals can be provided.

Fig. 18 is a cross-sectional view showing a schematic configuration of still another different device 1f. The capacitor unit 50 of the device 1f includes two capacitor elements 5f and 5 stacked vertically. The capacitor element 5f on the upper side is made smaller than the size of the capacitor element 5 on the lower side. In the capacitor unit 50, the through holes 15 of the capacitor elements 5 on the lower side of the two capacitor elements 5f and 5 of different sizes and the through holes 15 of the upper capacitor element 5f are superposed on each other.

This device 1f also has a first end surface 71 that is exposed on both sides of the molded body 60 that is formed into a rectangular parallelepiped shape, that is, the first end surface 71 that is exposed on the right side surface 63a, and a second end surface 72 that is exposed on the left side surface 63c. The first end surface 71 transmits the first insulating layer 41 of the lower capacitor element 5 including the stamper resin 99, and the first substrate 10 The non-covered region 11a, the second non-covered region 12a, the second insulating layer 42, and the first anode lead terminal 191a of the lead frame 190 as the first anode terminal (first external connection electrode) 91a are formed to have a notch. Further, the first end surface 71 is covered by the first electrode layer 81. In addition, the second end surface 72 transmits the first insulating layer 41 including the upper capacitor element 5f and the lower capacitor element 5, the first non-covered region 11a of the substrate 10, and the second non-covered layer. The region 12a, the second insulating layer 42, and the second anode lead terminal 191b of the lead frame 190 as the second anode terminal 91b are formed to have a notch. Further, the second end surface 72 is covered by the second electrode layer 82.

Therefore, the anode portion 51 of the lower capacitor element 5 and the first anode lead terminal 191a are electrically connected by the first electrode layer 81 of the first end surface 71. The anode portion 51 of the upper capacitor element 5f and the anode portion 51 and the second anode lead terminal 191b of the lower capacitor element 5 are electrically connected by the second electrode layer 82 of the second end surface 72.

Therefore, when only the anode portion 51 of the lower capacitor element 5 is externally connected, the first electrode layer 81 of the first end surface 71 and the first anode terminal 91a (first anode lead terminal 191a) can be used. On the other hand, when the anode portions 51 of the two capacitor elements 5f and 5 stacked one above another are externally connected, the electrode layer 82 of the second end surface 72 and the second anode terminal 91b (second anode lead terminal 191b) can be used. . Therefore, by changing the number of anode portions 51 drawn on both sides, it is possible to provide a device 1f having a plurality of electrostatic capacitances. Further, by changing the withstand voltage of the base 10 by the upper capacitor element 5f and the lower capacitor element 5, a plurality of voltage-sized devices 1f can be provided.

Figure 19 shows a schematic configuration of a further different device 1g. Sectional view. In the device 1g, the first insulating layer 41 and the second insulating layer 42 are omitted from the device 1 shown in FIG.

The device 1g includes a capacitor element 5g including a first functional layer 31 and a second functional layer 32 which cover portions other than the periphery (all circumferences) of the surface 11 and the back surface 12 of the substrate 10. The capacitor element 5g includes a first non-covered region 11a that is not covered by the first functional layer 31 of the surface 11 of the substrate 10, and a second non-covered region 12a that is not covered by the second functional layer 32 of the back surface 12 of the substrate 10.

The first non-covered region 11a and the second non-covered region 12a of the device 1g are covered by the dielectric oxide film 20, but are not covered by the first insulating layer 41 and the second insulating layer 42. Therefore, the end surface 71 of the device 1g transmits the notch (cutting and cutting) of the first non-covered region 11a, the second non-covered region 12a, and the substrate 90 of the substrate 10 of the capacitor element 5g including the stamper resin 99. form. Moreover, the end face 71 is covered by the electrode layer 81. As a result, the dielectric oxide film 20 can also function to insulate the first and second functional layers 31 and 32 from the electrode layer 81.

Further, the present invention is not limited to the embodiments, but includes those specified in the scope of the patent application. Further, the capacitor unit 50 of the device according to the present invention may include one capacitor element, or may include two or more capacitor elements stacked. Further, the capacitor element may be another type of capacitor element such as a non-solid electrolytic capacitor, a ceramic capacitor, or a thin film capacitor. Further, the device according to the present invention may be combined with a CPU or a combination of other circuit elements, and may be applied to, for example, a smoothing circuit of a DC-DC converter.

1‧‧‧ device

2‧‧‧Installation surface

5‧‧‧ capacitor components

10‧‧‧ base

10e‧‧‧ end

11‧‧‧ surface

11a‧‧‧1st non-covered area

12‧‧‧ Back

12a‧‧‧2nd non-covered area

15‧‧‧through holes (through holes)

15c‧‧‧ inner circumference

19‧‧‧through electrodes

20‧‧‧Dielectric oxide film

21‧‧‧Solid electrolyte layer

22a (22) ‧ ‧ electrode layer (cathode layer)

22b (22) ‧ ‧ electrode layer (cathode layer)

31‧‧‧1st functional layer

32‧‧‧2nd functional layer

33‧‧‧3rd Capacitor Functional Layer (Functional Layer)

35‧‧‧ Periphery

36‧‧‧ Periphery

41‧‧‧1st insulation layer

42‧‧‧2nd insulation layer

42e‧‧‧ end

50‧‧‧ capacitor unit

51‧‧‧Anode

60‧‧‧ mould body

62‧‧‧Internal space

63a‧‧‧right side (part of)

71‧‧‧ end face

81‧‧‧Electrode layer

90‧‧‧Substrate

90a‧‧‧Side side

90b‧‧‧Face on the side of the installation

90e‧‧‧ end

91‧‧‧Anode terminal (anode connection electrode, first external connection electrode)

92‧‧‧ cathode terminal (electrode for cathode connection, electrode for second external connection)

92a, 92b‧‧‧ electrode layer

92c‧‧‧ core layer

95‧‧‧electrodes (through holes)

99‧‧‧Molded resin

Claims (17)

An apparatus comprising: a capacitor unit including a capacitor element; a package member covering the capacitor unit; and a plurality of external connection electrodes electrically connected to the capacitor element, the capacitor element including: a plate-shaped substrate as an anode; The functional layer formed by the opposite sides of the substrate and the respective portions of the other surface is a functional layer containing a solid electrolyte layer and an electrode layer; a portion of the aforementioned side of the substrate is not covered by the functional layer a first non-covered region; and a second non-covered region of the other surface of the substrate that is not covered by the functional layer, wherein the plurality of external connection electrodes include a first external connection electrode: A portion of the package member and a portion of the base body pass through the first surface of the first non-covered region and a portion of the second non-covered region. The device of claim 1, wherein the capacitor unit includes a plurality of laminated capacitor elements, and the plurality of stacked capacitor elements are electrically connected to at least a portion of the functional layer, and the first external connection is used. The electrode includes the first surface exposed by the substrate covering at least one of the plurality of capacitor elements Electrode. The apparatus according to claim 1, wherein the first non-covered region and the second non-covered region are disposed at positions facing each other of the one surface and the other surface. The device of any one of claims 1 to 3, wherein the first surface comprises a portion of the package member and a portion of the substrate to pass through the first non-covered region And forming an end surface of a portion of the second non-covered region, wherein the first external connection electrode includes a portion covering the end surface and replacing the package member with a portion of the capacitor unit Part of the covered electrode. The device of claim 1, wherein the capacitor element includes: a first insulating layer that insulates the first non-covered region of the substrate from the functional layer; and the second non-covered region of the substrate a second insulating layer in which the functional layer is insulated, wherein the first external connection electrode includes a cover formed by penetrating a portion including the first insulating layer and a portion of the second insulating layer. The electrode of the first surface. The device of claim 1, wherein the foregoing capacitor element is as described above The base is a quadrangular shape, and the first external connection electrode includes an electrode that covers the first surface formed by exposing at least one of four corners of the base. The apparatus according to claim 1, wherein the substrate of the capacitor element has a square shape, and the first external connection electrode includes: a cover formed by exposing at least a portion of at least one of the sides of the substrate One side of the electrode. The apparatus according to claim 1, wherein the capacitor element has a square shape, and the capacitor element includes a through electrode penetrating the base body to electrically connect the one surface and the other surface of the electrode layer, the first The external connection electrode includes a plurality of electrodes each covering a plurality of the first surfaces formed at any of four corners or four sides of the base. The apparatus according to the first aspect of the invention, wherein the first external connection electrode includes: a metal layer that is melted on the first surface; a metal layer that is vapor-deposited on the first surface; and a conductive layer that is applied to the first surface At least one of the metal layers of the paste. A device as claimed in claim 1, wherein the capacitor is mounted The substrate of the unit, wherein the package member covers the capacitor unit mounted on the substrate. A printed wiring board comprising: a device as claimed in claim 1; and a printed wiring on which the device is mounted. An electronic device having a printed wiring board as in claim 11 of the patent application. A method of manufacturing a device for manufacturing a capacitor unit including a capacitor element, a package member covering the capacitor unit, and a plurality of external connection electrodes electrically connected to the capacitor element, wherein the capacitor element includes: as an anode a plate-like substrate; a functional layer formed to cover a portion of the opposite side of the substrate and a portion of the other surface; and a functional layer including a solid electrolyte layer and an electrode layer; a part of the aforementioned side of the substrate a first non-covered region not covered by the functional layer; and a second non-covered region of the other surface of the substrate and not covered by the functional layer, the method comprising: a part of the package component Together with a portion of the aforementioned substrate to pass a portion of the first non-covered region and the foregoing A part of the non-covered region penetrates to form the first surface, and the first surface is covered with the conductive member to form the first external connection electrode included in the plurality of external connection electrodes. The method of manufacturing a device according to claim 13, wherein the capacitor unit includes a plurality of laminated capacitor elements, and the plurality of laminated capacitor elements are electrically connected via at least a portion of the functional layer to form the foregoing The first surface includes the first surface in such a manner that the base body of at least one of the plurality of capacitor elements is exposed. The method of manufacturing the apparatus of claim 13 or 14, wherein the forming the first surface comprises: encapsulating a portion of the package member together with a portion of the substrate to pass the first non-covered layer of the substrate The first external connection electrode is formed by cutting a portion of the region and a portion of the second non-covered region to form the first external connection electrode, and includes a portion covering the end surface and replacing the package member An electrode is formed in such a manner as to cover a part of the capacitor unit. The method of manufacturing the device of claim 13, wherein the capacitor element includes: a first insulating layer that insulates the functional layer from the first non-covered region of the substrate; Forming the first surface of the second insulating layer in which the second non-covered region of the substrate is insulated from the functional layer includes a portion including the first insulating layer and the second insulating layer The first surface is formed by a partial penetration method. The method for producing a device according to claim 13, wherein the forming the first external connection electrode includes: spraying a metal on the first surface, depositing a metal on the first surface, and electrically conductive paste Any one of the first ones mentioned above.