JP2015043350A - Device and device manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a miniaturized capacitor device having a large capacitance.SOLUTION: A capacitor element 5 includes: functional layers 31, 32 having a solid electrolyte layer 21 and an electrode layer 22 formed to cover each part of a surface 11 and a rear face 12 mutually facing on a tabular base body 10 to be a positive electrode; a first uncoated region 11a not covered with the functional layer 31 on the surface 11 of the base body 10; and a second uncoated region 12a not covered with the functional layer 32 on the rear face 12 of the base body 10. A device 1 includes: a capacitor unit 50 including at least one capacitor element 5; and at least one external connection electrode 91 which covers a first surface 71 formed by notching a part of a packaging member 99 covering the capacitor unit 50, together with the notches of each part of an insulating layer 41, the first uncoated region 11a, the second uncoated region 12a and an insulating layer 42, and is electrically connected to the base body 10 exposed on the first surface 71.

Description

  The present invention relates to a device incorporating a capacitor element employed in various electronic devices.

  In Patent Document 1, although the height differs when connecting the capacitor element and the convex part of the lead frame, a step is provided on the convex part of the lead frame to prevent the anode base from being bent, thereby relaxing the curvature of the anode base. Therefore, it is described that a chip-shaped solid electrolytic capacitor having a low cost and a good leakage current value can be provided without manufacturing an expensive metal mold. For this reason, Patent Document 1 discloses that an anode base made of a flat valve-acting metal having a dielectric oxide film layer on the surface, an end portion of the anode base, and a semiconductor on the dielectric oxide film layer of the remainder of the anode base. In a chip-shaped solid electrolytic capacitor in which a solid electrolytic capacitor element having a layer and a conductor layer provided thereon in order is connected to a lead frame and sealed by an exterior resin leaving a part of the lead frame, at least a valve A chip-shaped solid electrolytic capacitor is described in which the anode portion of the working metal substrate is connected to the anode side of the lead frame via a metal wire.

JP 2003-264125 A

  As electronic devices including portable information terminals such as smartphones become more functional and smaller and lighter, capacitor devices used around the CPU of electronic devices are also required to be smaller and larger in capacity. In the technique disclosed in Patent Document 1, the anode part of the capacitor element and the anode side of the lead frame are connected by a metal wire inside the exterior resin. For this reason, in addition to the capacitor element, the exterior resin covers the region (volume) including the connection portion between the metal wire and the metal wire and the lead frame, that is, the region other than the capacitor element that does not contribute to the capacity expansion of the capacitor device. Molded.

  One of the aspects of the present invention includes a functional layer including a solid electrolyte layer and an electrode layer formed so as to cover a part of one side and the other side of a plate-like substrate that serves as an anode. A capacitor element including a first uncovered region that is not covered by a functional layer on one side of the substrate and a second uncovered region that is not covered by a functional layer on the other side of the substrate. A capacitor unit including at least one capacitor element and a part of a packaging member covering the capacitor unit are formed together with a part of the first uncovered region and a part of the second uncovered region of the substrate. A device having at least one external connection electrode that covers the first surface and is electrically connected to the substrate exposed on the first surface.

  The device includes an external connection electrode that covers a first surface formed so as to penetrate a part of the capacitor unit after the capacitor unit is covered with a packaging member such as a mold resin. The external connection electrode is a first electrode. It is electrically connected to the substrate exposed on the surface. For this reason, the electrode for external connection is directly connected with respect to a base | substrate, and a metal wire can be abbreviate | omitted. Therefore, the space of the metal wire that does not contribute to the capacity expansion of the capacitor can be reduced, and the space efficiency can be increased.

  The capacitor unit may include a plurality of capacitor elements stacked and electrically connected via at least a part of the functional layer, and the at least one external connection electrode is at least one of the plurality of capacitor elements. An external connection electrode may be included to cover the first surface where the substrate is exposed. Even in a device including a capacitor unit in which a plurality of capacitor elements are stacked, the base and the external connection electrode can be directly connected without using a metal wire.

  It is desirable that the first uncovered region and the second uncovered region are arranged at positions where one surface and the other surface face each other.

  The first surface may include an end surface in which a part of the packaging member is cut out together with a part of the first uncovered region and a part of the second uncovered region of the base, and at least one The external connection electrode may include an external connection electrode that covers the end surface and covers a part of the capacitor unit. The wiring space inside the packaging member can be reduced or omitted. For this reason, the space for wiring which does not contribute to the capacity expansion of the capacitor inside the space covered with the packaging member can be reduced or omitted, and the space covered with the packaging member can be effectively used as a space functioning as a capacitor. Therefore, it is possible to provide a device with high space efficiency, a small size and a large capacity.

  Further, in this device, since the space for wiring occupying the space covered with the packaging member such as mold resin can be reduced or omitted, the current path can be shortened and a low ESL device can be provided.

  The capacitor element includes a first insulating layer that insulates the first uncovered region of the base body from the functional layer, and a second insulating layer that insulates the second non-covered region of the base body from the functional layer. In addition, it is preferable that the first surface penetrates including a part of the first insulating layer and a part of the second insulating layer. The first surface includes a part of the packaging member, a part of the first insulating layer, a part of the first non-covered region, a part of the second non-covered region, and a part of the second insulating layer. The end face cut out together with the part may be included, and the at least one external connection electrode may include an external connection electrode that covers the end face and part of the capacitor unit.

  The at least one external connection electrode may include an external connection electrode that covers one or a plurality of first surfaces in which at least any one of the four corners of the quadrangular base body is exposed. An external connection electrode may be included to cover one or a plurality of first surfaces exposed.

  The at least one external connection electrode desirably includes at least one of a sprayed metal layer, a deposited metal layer, and a metal layer made of a conductive paste. A typical external connection electrode is a metallicon electrode formed by spraying a conductive metal in a mist form on a first surface.

  The capacitor element includes a through electrode that penetrates the base and electrically connects the electrode layers of the functional layer formed on each of the one surface and the other surface, and the at least one external connection electrode is formed of a rectangular base. It is desirable to include a plurality of external connection electrodes that respectively cover the plurality of first surfaces formed at any of the four corners or the four sides. The device desirably has a substrate on which the capacitor unit is mounted.

  One of the different aspects of the present invention is a printed wiring board on which the above-described device is mounted and an electronic apparatus having the printed wiring board.

  One further different aspect of the present invention is a method of manufacturing a device having a capacitor unit. The capacitor unit is a capacitor element including a functional layer including a solid electrolyte layer and an electrode layer formed so as to cover a part of one side and the other side of a plate-like substrate serving as an anode. And a capacitor element comprising at least a first uncovered region not covered by the functional layer on one surface of the substrate and a second uncovered region not covered by the functional layer on the other surface of the substrate. And the method includes covering the capacitor unit with a packaging member and penetrating a portion of the packaging member with a portion of the first uncovered region and a portion of the second uncovered region of the substrate. Covering the first surface formed by the penetration with a conductive member, and forming at least one external connection electrode electrically connected to the base exposed on the first surface.

  The capacitor unit may include a plurality of capacitor elements stacked and electrically connected via at least a part of the functional layer, and forming at least one external connection electrode may be a plurality of capacitor elements. Forming an external connection electrode that covers the first surface where at least one of the substrates is exposed.

  Puncturing may include cutting out a portion of the packaging member along with a portion of the first uncovered region and a portion of the second uncovered region of the substrate for at least one external connection Forming the electrode may include forming an external connection electrode that covers the end surface formed by the cutout and covers a part of the capacitor unit.

  The capacitor element includes a first insulating layer that insulates the first uncovered region of the base body from the functional layer, and a second insulating layer that insulates the second non-covered region of the base body from the functional layer. Including and penetrating preferably includes penetrating part of the first insulating layer and part of the second insulating layer. Penetrating means that part of the packaging member is part of the first insulating layer, part of the first uncovered region, part of the second uncovered region and part of the second insulating layer. The formation of at least one external connection electrode may include forming an external connection electrode that covers the end face formed by the cutout and covers a part of the capacitor unit. May be included.

  Preferably, forming the at least one external connection electrode includes any one of spraying a metal on the first surface, depositing the metal, and applying a conductive paste.

Sectional drawing which shows a part of printed wiring board carrying the device which concerns on this invention. The perspective view which shows the outline | summary of a device. The perspective view which shows a device in the state except the electrode layer. The top view which shows a device in the state which watermarked the mold resin. VV sectional view of a device (VV section of Drawing 4). Sectional drawing which shows a mode that a capacitor | condenser element is mounted in a board | substrate. Sectional drawing which shows a mode that a board | substrate and a capacitor | condenser unit are integrally shape | molded by mold resin. Sectional drawing which shows a mode that a mold body is cut | disconnected. Sectional drawing which shows a mode that an electrode layer is laminated | stacked on an end surface. The top view which shows a different device in the state which watermarked the mold resin. The perspective view which shows the device shown in FIG. 10 in the state which watermarked the electrode layer. Furthermore, the top view which shows a different device in the state which watermarked the mold resin. Furthermore, the top view which shows a different device in the state which watermarked the mold resin. XIV-XIV sectional drawing of the device shown in FIG. 13 (XIV-XIV section of FIG. 13). Furthermore, the perspective view which shows a different device in the state except the electrode layer. XVI-XVI sectional drawing of the device shown in FIG. 15 (XVI-XVI cross section of FIG. 15). Furthermore, sectional drawing which shows a different device. Furthermore, sectional drawing which shows a different device. Furthermore, sectional drawing which shows a different device.

  FIG. 1 is a sectional view showing a part of a printed wiring board on which a device according to the present invention is mounted. The printed wiring board 100 is a printed circuit board mounted on an electronic device including a portable information terminal such as a smartphone or a notebook personal computer. The front surface 100a has a CPU 200 mounted thereon, and the back surface 100b has a capacitor unit 50. A device (capacitor device) 1 including is mounted. The power terminal 201 of the CPU 200 and the connection electrodes (electrode terminals for external connection) 91 and 92 of the device 1 are electrically connected by the through electrode 101 that penetrates the printed circuit board 100, and the device 1 is decoupled. Functions as a condenser or bypass condenser.

  FIG. 2 is a perspective view showing an outline of the device 1. The device 1 includes the substrate 90 and the capacitor except for the substrate 90, the capacitor unit 50 mounted on the surface 90a on the mounting side of the substrate 90, and one surface (first surface, end surface) 71 of the substrate 90 and the capacitor unit 50. An exterior member (packaging member, mold resin) 99 that covers the unit 50 and an electrode layer 81 that covers the end surface 71 are included. The end surface 71 is formed by cutting one end (a part of the right side surface) 63a of the molded body 60 that is integrally formed so that the substrate 90 and the capacitor unit 50 are formed into a thin rectangular parallelepiped shape (plate shape) with the mold resin 99. Has been. The electrode layer 81 covering the end surface 71 is electrically connected to the first electrode portion (anode portion) 51 of the capacitor unit 50 that appears so as to be flush with the end surface 71, and is connected to the lead electrode layer for external connection and the outside It also serves as an electrode terminal (external connection electrode) 91 for connection. An example of the mold resin 99 is a sealing resin such as an epoxy resin.

  In this device 1, the anode part 51 of the capacitor unit 50 is electrically connected by an electrode layer 81 that also serves as an exterior. A typical electrode layer 81 is a metallicon electrode formed (attached) by spraying (spraying) a metal atomized by an atomizing method or the like onto the end surface 71. Examples of the metal sprayed on the end surface 71 include conductive metals such as gold, silver, copper, and aluminum. Copper is preferable in consideration of a balance between conductivity and cost. The electrode layer 81 may be formed by metal deposition or applying a conductive paste.

  FIG. 3 is a perspective view of the device 1 with the electrode layer 81 removed. The molded capacitor unit 50 includes two capacitor elements 5 stacked one above the other. The capacitor element 5 is a solid electrolytic capacitor element, and is formed on a thin film (plate-like) valve action base body (base body) 10 cut into a substantially square shape, and on both surfaces 11 and 12 facing the top and bottom of the base body 10. Dielectric oxide film 20, first capacitor functional layer (functional layer) 31 laminated on dielectric oxide film 20 on the surface (one surface) 11 side of substrate 10, and back surface (other surface) of substrate 10 The second capacitor functional layer (functional layer) 32 laminated on the dielectric oxide film 20 on the 12 side, and the entire peripheral edge 35 of the first functional layer 31 (entire circumference). The base body 10 is covered so as to cover the first insulating layer 41 directly laminated on the dielectric oxide film 20 on the surface 11 side of the base body 10 and the entire periphery (entire circumference) 36 of the second functional layer 32. Directly laminated on the dielectric oxide film 20 on the back surface 12 side And and a second insulating layer 42.

  The first functional layer 31 and the second functional layer 32, and the first insulating layer 41 and the second insulating layer 42 are arranged at positions (ranges) facing each other up and down across the base body 10, respectively. Yes. The end surface 71 of the device 1 is a step formed by cutting (cutting or cutting) the first insulating layer 41, the base 10, the second insulating layer 42, and the substrate 90 including the mold resin 99. There is no flat surface. For this reason, the end surface 71 includes two capacitor elements in which the end portion 99e in which the mold resin 99 appears in a gate shape, the rectangular end portion 90e of the substrate 90, and the capacitor 90 are sequentially stacked from above so as to be sandwiched between them. 5 of the first insulating layer 41, the rectangular end portion 41e of the base 10, the square end portion 42e of the second insulating layer 42, and the first insulating layer 41 A square end 41 e, a square end 10 e of the base 10, and a square end 42 e of the second insulating layer 42 are included. Therefore, a portion (end portion) 10e including one side 13a of the base 10 of each capacitor element 5 appears on the end face 71 in a state of being sandwiched between the first insulating layer 41 and the second insulating layer 42 ( As a result, the anode part 51 of the capacitor unit 50 is formed.

  The first and second functional layers 31 and 32 and the electrode layer are formed by the dielectric oxide film 20 that covers the both surfaces 11 and 12 of the substrate 10 without providing the first insulating layer 41 and the second insulating layer 42. It is also possible to take insulation from 81. By laminating the first and second insulating layers 41 and 42 on the dielectric oxide film 20, it is possible to further improve the insulation between the first and second functional layers 31 and 32 and the electrode layer 81. In addition, the plurality of capacitor elements 5 can be easily and stably stacked one above the other.

  FIG. 4 is a plan view showing the device 1 in a state where the mold resin 99 is seen through. The anode portion 51 of the capacitor unit 50 is formed by a portion (end portion) 10 e including one side 13 a among the four sides 13 a to 13 d of the base body 10 appearing on the end surface 71. The anode portion 51 may be formed by cutting the portion including the other three sides 13b to 13d of the base 10 together with the mold resin 99 in the same manner as described above, and exposing it as an end face, out of the four sides 13a to 13d. You may form the end surface which two or more sides of appear.

  FIG. 5 shows a more detailed configuration of the device 1 by a VV cross-sectional view (VV cross-section of FIG. 4). The first functional layer 31 of each capacitor element 5 includes a solid electrolyte layer 21 sequentially laminated on the dielectric oxide film 20 formed on the surface 11 of the base body 10 made porous by etching or the like, Electrode layer (cathode layer) 22a (22). The second functional layer 32 of the capacitor element 5 includes a solid electrolyte layer 21 sequentially laminated on the dielectric oxide film 20 formed on the back surface 12 of the substrate 10 made porous by etching or the like, and an electrode layer. (Cathode layer) 22b (22).

  The capacitor element 5 includes a first uncovered region 11 a that is not covered by the first functional layer 31 on the surface 11 of the base 10 and a second non-covered region that is not covered by the second functional layer 32 on the back surface 12 of the base 10. And an uncovered region 12a. Further, the capacitor element 5 includes a first insulating layer 41 that insulates the first uncovered region 11a of the base 10 from the first functional layer 31, and a second non-covered region 12a of the base 10 as the second. And a second insulating layer 42 that insulates the functional layer 32. The first insulating layer 41 is laminated on the dielectric oxide film 20 on the surface 11 side of the base 10 so as to cover the entire periphery of the peripheral edge 35 of the first functional layer 31, and the second insulating layer 42. Is laminated on the dielectric oxide film 20 on the back surface 12 side of the substrate 10 so as to cover the entire periphery of the peripheral edge 36 of the second functional layer 32. Therefore, by forming the end face 71 so as to penetrate a part of the first uncovered region 11a and a part of the second uncovered region 12a of the base 10 together with the first and second insulating layers 41 and 42, The base 10 appearing on the end face 71 and the first and second functional layers 31 and 32 can be insulated by the first and second insulating layers 41 and 42.

  Each capacitor element 5 further includes a through hole (through hole) 15 penetrating the center of the base 10 and a third capacitor functional layer (functional layer) 33 formed on the inner peripheral surface 15 c of the through hole 15. . The third functional layer 33 is formed by filling the solid electrolyte layer 21 sequentially from the side in contact with the dielectric oxide film 20 covering the substrate 10 and filling the through hole 15 with a conductive paste such as silver paste. Through electrode 19. For this reason, the cathode layer 22 a of the first functional layer 31 and the cathode layer 22 b of the second functional layer 32 are electrically connected by the through electrode 19 of the third functional layer 33.

  Further, in the capacitor unit 50, the cathode layer 22a of the lower capacitor element 5 and the cathode layer 22b of the upper capacitor element 5 are electrically connected by an element fixing conductive paste or the like. Since the anode part 51 is covered with being vertically sandwiched between the first insulating layer 41 and the second insulating layer 42, the anode part 51 and the cathode are stacked when the capacitor elements 5 are stacked one above the other. There is almost no possibility that the layer 22 is short-circuited. For this reason, it is easy to stack a plurality of capacitor elements 5, and by increasing the number of stacked layers, it is easy to increase the capacitance of the capacitor unit 50, and it is easy to reduce ESR (equivalent series resistance).

  Examples of the substrate 10 include an etched aluminum foil, a tantalum sintered body, a niobium sintered body, and a titanium sintered body. In consideration of forming the thin device 1, an etched aluminum foil is preferable. is there. When etched aluminum foil is used for the substrate 10, the dielectric oxide film 20 is aluminum oxide formed on the front surface 11 and the back surface 12 of the substrate 10. The solid electrolyte layer 21 can be formed by laminating a conductive polymer such as polypyrrole, polythiophene, or polyaniline on the dielectric oxide film 20 by electrolytic polymerization or the like. An example of the electrode layer 22 (22a, 22b) is a cathode layer formed by laminating a conductive paste such as a silver paste on the solid electrolyte layer 21. The first functional layer 31 and the second functional layer 32 may include a highly conductive graphite layer laminated between the solid electrolyte layer 21 and the electrode layer (cathode layer) 22. It is easy to reduce. An example of the first insulating layer 41 and the second insulating layer 42 is an insulating resin such as a polyimide resin or an epoxy resin.

  In this specification, the electrode layer 22 described to function as the cathode layer 22 is an apparent cathode, and the solid electrolyte layer 21 functions to function as a true cathode. The same applies to the following embodiments.

  The substrate 90 on which the capacitor unit 50 is mounted is a glass epoxy substrate cut into a substantially square shape, and the mounting side surface 90b opposite to the mounting side surface 90a on which the capacitor unit 50 is mounted is molded resin. 99 and is shown as a mounting surface 2 for mounting the device 1 on an external printed circuit board 100 or the like. In the substrate 90, the copper foil on the mounting side surface 90a and the mounting side surface 90b is patterned by etching or the like, and a cathode connection electrode layer 92a connected to the cathode layer 22 of the capacitor unit 50 is formed on the mounting side surface 90a. A cathode terminal electrode layer 92b connected to the outside is formed on the surface 90b on the mounting side. These electrode layers 92 a and 92 b are electrically connected by an electrode (through hole) 95 that penetrates the core layer 92 c of the substrate 90.

  Therefore, the cathode layer 22 of the capacitor unit 50 appears as a cathode terminal (cathode connection electrode) 92 on the mounting surface 2 of the device 1 via the electrode layers 92a and 92b formed on the substrate 90, and the anode of the capacitor unit 50 The part 51 appears as an anode terminal (anode connection electrode) 91 on the mounting surface 2 by an electrode layer 81 that forms part of the exterior. The anode terminal 91 and the cathode terminal 92 appearing on the mounting surface 2 are electrically connected to connection terminals provided on the printed circuit board 100 or the like, and the device 1 functions as a surface-mount type device.

  Note that the substrate 90 is not limited to this example, and may be a thin and light coreless substrate without the core layer 92c, and it is easy to improve the electrical characteristics by reducing the inductor component due to the through-hole 95, and the wiring It is easy to improve the design freedom. Furthermore, by forming a rewiring layer in the capacitor unit 50, it is possible to eliminate the substrate 90 and eliminate the substrate.

  In this device 1, an electrode layer 81 that is laminated on an end surface 71 cut out from a mold body 60 and constitutes a part of an exterior (package) connects the anode portions 51 of a plurality of capacitor elements 5, and further, an electrode layer 81 also serves as an anode terminal 91 for external connection. Therefore, a space for connecting the anode 51 and the terminal for external connection, that is, a wiring space for drawing out the electrode, is provided in the internal space 62 of the device 1 packaged by the mold resin 99 and the electrode layer 81. There is no need and wiring space can be omitted. Therefore, a portion (wiring space) that does not substantially contribute to the capacity expansion of the capacitor can be cut or reduced from the internal space 62 of the device 1, and the space for securing the capacity using the internal space 62 of the device 1 as a capacitor (capacitor). Can be used (utilized) more efficiently. Therefore, it is possible to provide a device 1 having high space efficiency, small size and large capacity.

  Furthermore, in this device 1, the electrode layer 81 is adhered (attached or directly attached) to the end portion 10 e of the base body 10 that appears on the end surface 71. For this reason, the distance between the dielectric oxide film 20 serving as a power storage unit laminated on the front surface 11 and the back surface 12 of the substrate 10 and the inner peripheral surface 15c of the through hole 15 and the anode terminal 91 for external connection can be shortened. Therefore, the current path can be shortened, and the device 1 with low ESL (equivalent series inductance) can be provided.

  Furthermore, in this device 1, an external connection electrode can be directly connected to a part or all of the electrode layer 81 covering the end surface 71. For this reason, the connection method with the printed circuit board 100 is flexible. For example, the electrode layer 81 can be mounted on the external printed circuit board 100 or the like as the mounting surface of the device 1, and the low ESL device 1 with a further shortened current path can be provided.

  In the device 1 of this example, the electrode layer 81 covers the end surface 71 and also covers the right side surface (part) 63a of the mold body 60 instead of the mold resin 99, thereby also serving as a part of the exterior (package). However, an external connection electrode may be formed by adding (connecting) a lead frame (metal plate), a metal film, a terminal socket, and the like to the outside (outer wall) of the electrode layer 81. Since the electrode layer 81 is formed of a sprayed metal layer, a deposited metal layer, a metal layer made of a conductive paste, or the like, it is easy to closely contact terminals such as a lead frame and to improve the contact area.

  6 to 9 show a method for manufacturing the device 1. 6 is a cross-sectional view showing a state in which the capacitor unit 50 including the capacitor element 5 is mounted on the substrate 90, and FIG. 7 is a cross-sectional view showing a state in which the substrate 90 and the capacitor unit 50 are integrally molded with the mold resin 99. FIG. 8 is a cross-sectional view showing a state in which the mold body 60 is cut, and FIG. 9 is a cross-sectional view showing a state in which the electrode layer 81 is laminated and covered on the end face 71.

  First, as shown in FIG. 6, the capacitor unit 50 is mounted on the surface 90a on the mounting side of the substrate 90 via a conductive paste. As a result, the cathode terminal 92 of the substrate 90 and the cathode layer 22 of the capacitor element 5 are electrically connected, and the cathode layers 22 of the plurality of capacitor elements 5 stacked above and below the capacitor unit 50 are connected to the cathode terminal 92. Connected in parallel.

  Next, as shown in FIG. 7, the capacitor unit 50 and the substrate 90 are integrally molded with a mold resin 99 to manufacture a mold body 60. In this device 1, the surface 90 b on the mounting side of the substrate 90 is removed and is covered with the mold resin 99.

  Next, as shown in FIG. 8, a part of the mold body 60 is cut. That is, in a state where the capacitor unit 50 and the substrate 90 are covered with the mold resin 99, the first insulating layer 41 including the mold resin 99, the first uncovered region 11a of the base body 10, and the second uncovered region 12a. The second insulating layer 42 and the substrate 90 are cut out (cut) so as to penetrate in a direction perpendicular to the substrate 90 within the range (in the width) of the first insulating layer 41 and the second insulating layer 42. ). As a result, the right side surface 63a perpendicular to the substrate 90 of the mold body 60 is cut away, and the flush end surface 71 can be formed. On the end surface 71, the end portion 10 e of the substrate 10 appears in a state where it is sandwiched between the first insulating layer 41 and the second insulating layer 42. Therefore, the anode part 51 of the capacitor unit 50 can be formed on the end face 71 in a state of being insulated from the cathode layer 22 (the first functional layer 31 and the second functional layer 32).

  Next, as shown in FIG. 9, an electrode layer for external connection that is electrically connected to the anode portion 51 by covering the end surface 71 with a copper layer by spraying the powdered copper or the like onto the end surface 71. 81 are stacked (formed). As a result, the cut end surface 71 of the molded body 60 in FIG. 8 is covered with the electrode layer 81, and the electrode layer 81 constitutes a part of the exterior of the device 1 and the anodes of the plurality of capacitor elements 5 of the capacitor unit 50. The parts 51 are connected in parallel at the electrode layer 81. The electrode layer 81 covers the end surface 71, reaches the substrate 90, appears on the surface 90b on the mounting side of the substrate 90, and becomes an electrode (anode terminal) 91 for external connection. Therefore, the surface mount type device 1 including the anode terminal 91 and the cathode terminal 92 on the mounting side surface 90b is formed. The electrode layer 81 may be formed by metal deposition or applying a conductive paste.

  In this method for manufacturing a surface mount type device, the capacitor unit 50 and the substrate 90 are sealed (molded) to form the mold body 60, and then the mold body so that the anode portion 51 appears on the outside 61 of the mold body 60. 60 is cut to form an end surface 71, and the end surface 71 is covered with an electrode layer 81 so as to serve as an exterior, thereby connecting anode portions 51 to each other and forming an anode terminal 91 for connecting the anode portion 51 to the outside. The For this reason, the structure (electrode) which electrically connects the anode part 51 and the anode terminal 91 also serves as an exterior, and the electrode inside the exterior, that is, the part covered by the mold resin 99 (the interior 62 of the device 1) Wiring space for drawing out can be omitted or reduced. For this reason, a small and large-capacity device 1 can be manufactured.

  FIG. 10 is a plan view showing different surface-mount type devices 1a with the mold resin 99 being seen through. FIG. 11 is a perspective view of the device 1a with the electrode layer 81 being seen through. In this device 1a, one corner 64a of the rectangular parallelepiped mold body 60 is cut out including the capacitor unit 50 and the substrate 90 to form a cylindrical (1/4 cylinder) end face 71. That is, the end surface 71 includes the first insulating layer 41 including the mold resin 99, the first uncovered region 11a, the second uncovered region 12a, the second insulating layer 42, and the substrate 90 of the base 10 in a fan shape. It is a flat (flat) surface with no step formed by cutting out (cutting). Furthermore, the device 1a includes an electrode (electrode layer) 81 that covers the end surface 71 and is formed so that the entire shape of the device 1 is a rectangular parallelepiped.

  The end surface 71 is formed by cutting out a portion (end portion) 10 e including one corner 14 a of the four corners of the base 10 of the capacitor unit 50 within the range of the insulating layers 41 and 42. 10 appears in an insulated state, and the anode 51 is formed. That is, the end surface 71 includes a portion (end portion) 10 e including one corner 14 a of the base 10 between the end portion 41 e of the first insulating layer 41 and the end portion 42 e of the second insulating layer 42. By appearing, the anode part 51 appears in an insulated state. Therefore, by covering the end surface 71 with the electrode layer 81, the anode portions 51 of the plurality of capacitor elements 5 can be connected in parallel with the electrode layer 81. At the same time, since the electrode layer 81 appears on the mounting surface 90b of the device 1a, the electrode layer 81 also serves as an electrode (anode terminal) 91 for external connection.

  The end surface 71 can be formed so that any of the portions including the four corners 14a to 14d of the base body 10 appears. The end surface 71 may be plural, and may be formed by appearing at least two corners of the four corners 14a to 14d. Further, the electrode layer 81 (anode terminal 91) covering the plurality of end faces 71 may be a plurality (multi-terminal), or may be one continuous electrode layer 81 (anode terminal 91).

  Also in this device 1 a, the anode part 51 of the capacitor element 5 is connected by the electrode layer 81 constituting a part of the exterior, and the electrode layer 81 also serves as the anode terminal 91. Therefore, a plurality of capacitor elements 5 can be electrically connected by the electrode layer 81 also serving as the anode terminal 91, and the device 1a having a simple and compact configuration can be provided. Furthermore, since the electrode layer 81 (anode terminal 91) for connection and external connection is formed by cutting out the corners of the molded body 60, the space that is broken for wiring or electrodes can be reduced. Therefore, the internal volume of the device 1a can be further effectively used as a capacitor, and a compact and large-capacity surface-mounted device 1a can be provided. Moreover, the part (volume) which cuts the mold body 60 is limited to a corner, and the amount of metal used for thermal spraying of the electrode layer 81 can also be reduced. For this reason, the space efficiency is high and the large capacity device 1a can be provided at a lower cost.

  FIG. 12 is a plan view showing still another device 1b through the mold resin 99. The capacitor unit 50 of the device 1b also includes two capacitor elements 5b stacked one above the other. The capacitor element 5b includes a thin film (plate-like) valve action base (base) 10 cut into a substantially rectangular shape.

  The device 1b includes a first insulating layer 41 including the mold resin 99, the first uncovered region 11a of the base body 10, the second non-covering portion at the center of the right side surface 63a of the molded body 60 formed in a rectangular parallelepiped shape. A flat end face 71 having no step formed by cutting (cutting) the covering region 12a, the second insulating layer 42, and the substrate 90 into a semi-moon shape (semicircular shape), and the end face 71 And an electrode layer 81 formed to cover the electrode layer 81. The end surface 71 has a semi-cylindrical shape, and a semi-cylindrical electrode layer 81 is formed so as to cover the end surface 71, and the device 1 b that is packaged in a rectangular parallelepiped shape is formed by the mold resin 99 and the electrode layer 81. Yes.

  In this device 1b, the central portion (end portion) 10e of one side 13a of the base body 10 of the capacitor unit 50 is half of the end face 71 within the range of the first and second insulating layers 41 and 42 (width or less). It is cut into a circle. For this reason, the central portion (end portion) 10e of one side 13a of the base 10 appears on the end surface 71 in a state sandwiched between the first insulating layer 41 and the second insulating layer 42, and the anode portion 51 is insulated. It appears in the state. Therefore, by forming the electrode layer 81 so as to cover the end surface 71, the anode portions 51 of the plurality of capacitor elements 5 can be connected in parallel and the electrode layer 81 that becomes the anode terminal 91 can be formed.

  Similarly, the end surface 71 can be formed so as to include the center of any of the four sides 13a to 13d of the base body 10 or a position off the center. It is also possible to provide a device including a plurality of anode terminals 91 by forming a plurality of end surfaces 71 and forming a plurality of electrode layers 81 so as to cover the respective end surfaces 71.

  Also in this device 1b, the electrode layer 81 laminated on the end surface 71 cut out at the center of the right side surface 63a of the mold body 60 is used to form the capacitor element 5 on the outside 61 of the mold resin 99 by the electrode layer 81 also serving as an exterior. The anode part 51 is connected. Therefore, it is not necessary to provide a wiring space in the interior 62 of the mold body 60, and a compact and large-capacity device 1b can be provided. In addition, since it is not necessary to replace the entire surface of the rectangular parallelepiped package with the electrode layer, the amount of metal used for thermal spraying of the electrode layer 81 can be reduced, and a device including a plurality of anode terminals 91 can be provided. Therefore, a small and large capacity device with low ESL and low ESR can be provided at low cost.

  FIG. 13 is a plan view showing still another device 1c with the mold resin 99 being seen through. In addition, FIG. 14 shows the device 1c with a XIV-XIV cross-sectional view (a XIV-XIV cross-section of FIG. 13).

  The device 1c includes a through hole 70 formed in one corner 64a of a mold body 60 formed in a rectangular parallelepiped shape. The through hole 70 does not cut out the first insulating layer 41 including the mold resin 99, the first uncovered region 11 a, the second uncovered region 12 a, the second insulating layer 42, and the substrate 90 of the base 10. And a flat inner surface (first surface) 71 having no level difference formed by penetrating (extracting) into a circular shape. The through hole 70 penetrates the width (within the range) of the first and second insulating layers 41 and 42, and the anode portion 51 of each capacitor element 5 of the capacitor unit 50 is formed on the inner peripheral surface 71. Appears in an insulated state. For this reason, the electrode layer 81 is covered so as to cover the inner peripheral surface 71 by filling the through hole 70 with a conductive paste or the like and applying (attaching) a conductive pace to the inner peripheral surface 71 of the through hole 70. Can be formed. Therefore, the anode portions 51 of the plurality of capacitor elements 5 can be connected, and the electrode layer 81 that appears on the outside 61 of the molded body 60 and becomes the anode terminal 91 can be formed. The application of the conductive paste to the inner peripheral surface (first surface) 71 is a concept that includes filling (injecting) the conductive paste into the through hole 70, and further filling the through hole 70. This is a concept including applying (adhering or adhering) a conductive paste to the inner peripheral surface 71.

  Thus, once the mold body 60 is formed, the electrode layer 81 is formed with the end surface 71 in which the mold body 60 and the portion including the four sides 13a to 13d and the portion including the four corners 14a to 14d of the base 10 are cut out. In addition to covering the substrate 10 with the electrode layer 81, the end surface 71 penetrating the base body 10 within the range of the first insulating layer 41 and the second insulating layer 42 is covered, that is, a portion (through-hole extracted). By replacing 70) with the electrode layer 81, the anode portions 51 of the plurality of capacitor elements 5 can be connected in parallel and the electrode layer 81 to be the terminal electrode 91 can be formed.

  Also in this device 1c, a wiring member for connecting the capacitor element 5 such as a bonding wire (metal wire) and the substrate 90 or the lead frame is unnecessary, and a wiring space for arranging them can be omitted. Further, most of the packaging of the device 1c is occupied by the mold body 60, which has a balanced shape, is highly space efficient, and can provide a large capacity device 1c at a lower cost.

  FIG. 15 shows a further different device 1d in a perspective view with the electrode layer 81 removed. FIG. 16 shows a schematic structure of the device 1d by an XVI-XVI cross-sectional view (XVI-XVI cross-section of FIG. 15).

  In this device 1d, the right side surface 63a of the molded body 60 formed in a rectangular parallelepiped shape includes the first insulating layer 41 including the mold resin 99, the first uncovered region 11a of the base 10, and the second uncovered region. 12a, the second insulating layer 42, and the flat end face without a step formed by cutting (cutting, cutting) the anode lead terminal 191 of the lead frame 190 to be the first anode terminal 91. 71 is formed, and has an electrode layer 81 formed so as to cover the end surface 71 thereof.

  The capacitor unit 50 of the device 1d includes two capacitor elements 5d stacked one above the other. The capacitor element 5d does not have the through hole 15 penetrating the base body 10, but instead is a third functional layer 33 formed on the side surface of one side 35c of the base body 10, and includes the first functional layer 31 and the first functional layer 31d. A third functional layer 33 that connects the two functional layers 32 is included. Accordingly, the first insulating layer 41 is formed along the three sides 35 a, 35 b, and 35 d of the peripheral edge 35 of the first functional layer 31, and the second insulating layer 42 is the peripheral edge of the second functional layer 32. The first functional layer 31 and the second functional layer 32 are electrically connected to each other via the third functional layer 33 formed on one side 35c. Connected to.

  Therefore, the cathode layer 22 of each capacitor element 5 d of the capacitor unit 50 is connected in parallel via the third functional layer 33 instead of the through hole 15 penetrating the base 10, and the anode portion 51 is formed on the end surface 71. The electrode layers 81 are connected in parallel. Therefore, a compact and large-capacity device 1d can be provided.

  Furthermore, the anode part 51 of the capacitor unit 50 and the anode lead terminal 191 of the lead frame 190 can be electrically connected by an electrode layer 81 that covers the end face 71. Further, the cathode layer 22 of the capacitor unit 50 and the cathode lead terminal 192 of the lead frame 190 can be electrically connected via a conductive paste or the like.

  FIG. 17 is a cross-sectional view showing a schematic configuration of a further different device 1e. The capacitor unit 50 of the device 1e includes two capacitor elements 5e that are vertically stacked with the left and right positions shifted (in a zigzag manner). For example, each capacitor element 5e is provided at a position where the through hole 15 penetrating the base body 10 is slightly shifted from the center of the base body 10 in any direction of the four sides 13a to 13d (a position that is eccentric (shifted)). . Therefore, when these capacitor elements 5e are superposed so that the through-holes 15 are vertically opposed to each other by changing the direction, the end portions 10e of the base body 10 do not coincide with each other and can be stacked in a shifted manner. Similarly, the capacitor element 5 having the through-hole 15 in the center or the capacitor element 5d without the through-hole 15 may be overlapped so that the end portions 10e of the base body 10 do not coincide with each other.

  In this device 1e, the first end surface 71 and the second end surface 72 are formed by cutting out both sides of the molded body 60 formed into a rectangular parallelepiped shape, that is, the right side surface 63a and the left side surface 63c. The first electrode layer 81 and the second electrode layer 82 are formed so as to cover the end faces 71 and 72, respectively. The first end surface 71 includes the mold resin 99, the first insulating layer 41 of the lower capacitor element 5e, the first uncovered region 11a, the second uncovered region 12a of the base 10, the second The insulating layer 42 and the first anode lead terminal 191a of the lead frame 190 to be the first anode terminal 91a are cut out (cut or cut). The second end surface 72 includes the mold resin 99, the first insulating layer 41 of the upper capacitor element 5e, the first uncovered region 11a, the second uncovered region 12a, and the second insulating layer of the base body 10. The layer 42 and the second anode lead terminal 191b of the lead frame 190 to be the second anode terminal 91b are cut out.

  Therefore, the anode portion 51 of the lower capacitor element 5 e and the first anode lead terminal 191 a of the lead frame 190 are electrically connected by the first electrode layer 81 that covers the first end surface 71. Further, the anode portion 51 of the upper capacitor element 5 e and the second anode lead terminal 191 b of the lead frame 190 are electrically connected by the second electrode layer 82 covering the second end surface 72. Further, these electrode layers 81 and 82 reach the mounting surface 190b, and also function as respective connection electrodes. Further, a cathode lead terminal 192 of a lead frame 190 serving as a cathode terminal 92 is provided at the center of the mounting surface 90b, and is connected to the cathode layer 22 and / or the through electrode 19 of the capacitor element 5e.

  In this device 1e, a plurality of stacked capacitor elements 5e are stacked so that the positions of the end portions in the horizontal direction are shifted, and different capacitors are formed when the first and second end faces 71 and 72 are formed. The end portion 10e of the base body 10 of the element 5e is exposed to the respective end surfaces 71 and 72. Therefore, each capacitor element 5e can be independently connected via the electrode layers 81 and 82 formed on the different end faces 71 and 72, respectively. For this reason, the multi-terminal capacitor | condenser device 1e provided with several electrostatic capacitance can be provided. Furthermore, by changing the withstand voltage of the substrate 10 between the upper capacitor element 5e and the lower capacitor element 5e, a multi-terminal multi-voltage device 1e can be provided.

  The capacitor element 5e can be stacked by shifting in three directions or four directions, not limited to the left and right two directions, and the electrode layer covering the end face is not limited to the opposite side surface of the rectangular parallelepiped package. Can be formed on each side. Further, it is possible to provide more terminals by adopting a polygonal package or arranging a plurality of capacitor elements 5e on the left and right.

  FIG. 18 is a cross-sectional view showing a schematic configuration of still another device 1f. The capacitor unit 50 of the device 1f includes two capacitor elements 5f and 5 stacked one above the other. The upper capacitor element 5 f is obtained by reducing the size of the lower capacitor element 5. In this capacitor unit 50, two capacitor elements 5f and 5 of different sizes are stacked such that the through hole 15 of the lower capacitor element 5 and the through hole 15 of the upper capacitor element 5f are connected vertically.

  This device 1 f also has a first end surface 71 appearing on both sides of the mold body 60 formed into a rectangular parallelepiped shape, that is, the right side surface 63 a, and a second end surface 72 appearing on the left side surface 63 c. The first end surface 71 includes the mold resin 99, the first insulating layer 41 of the lower capacitor element 5, the first uncovered region 11 a, the second uncovered region 12 a, and the second of the base 10. The first anode lead terminal 191 a of the lead frame 190 to be the insulating layer 42 and the first anode terminal 91 a is formed by cutting out, and the first end face 71 is covered with the first electrode layer 81. In addition, the second end surface 72 includes the mold resin 99, the first insulating layer 41 of the upper capacitor element 5f and the lower capacitor element 5, the first uncovered region 11a of the base 10, the second The second anode lead terminal 191b of the lead frame 190 to be the uncovered region 12a, the second insulating layer 42, and the second anode terminal 91b is formed by cutting out, and the second end face 72 is the second electrode layer. 82.

  Therefore, the anode portion 51 of the lower capacitor element 5 and the first anode lead terminal 191a of the lead frame 190 are electrically connected by the first electrode layer 81 of the first end face 71, and the upper side The anode portion 51 of the capacitor element 5 f and the anode portion 51 of the lower capacitor element 5 and the second anode lead terminal 191 b of the lead frame 190 are electrically connected by the second electrode layer 82 of the second end face 72. It is connected.

  Therefore, when only the anode part 51 of the lower capacitor element 5 is externally connected, the first electrode layer 81 and the first anode terminal 91a (first anode lead terminal 191a) on the first end face 71 are connected. Can be used. On the other hand, in the case where the anode parts 51 of the two capacitor elements 5f and 5 stacked one above the other are externally connected, the electrode layer 82 on the second end face 72 and the second anode terminal 91b (second anode lead terminal 191b). ) Can be used. For this reason, the device 1f provided with several electrostatic capacitance can be provided by changing the number of the anode parts 51 pulled out by both sides. Furthermore, by changing the withstand voltage of the base body 10 between the upper capacitor element 5f and the lower capacitor element 5, a multi-voltage specification device 1f can be provided.

  FIG. 19 is a cross-sectional view showing a schematic configuration of a further different device 1g. The device 1g is obtained by omitting the first insulating layer 41 and the second insulating layer 42 from the device 1 shown in FIG.

  The device 1g includes a capacitor element 5g including a first functional layer 31 and a second functional layer 32 that cover portions excluding the peripheral edges (entire circumference) of the front surface 11 and the back surface 12 of the substrate 10. The capacitor element 5g has a first uncovered region 11a that is not covered by the first functional layer 31 on the surface 11 of the base body 10 and a second functional layer 32 that is not covered by the second functional layer 32 on the back surface 12 of the base body 10. And an uncovered region 12a.

  The first uncovered region 11a and the second uncovered region 12a of the device 1g are covered with the dielectric oxide film 20, but are covered with the first insulating layer 41 and the second insulating layer. Absent. Therefore, in the device 1g, including the mold resin 99, the first uncovered region 11a, the second uncovered region 12a, and the substrate 90 of the base 10 of the capacitor element 5g are cut out (cut). Thus, the end surface 71 is formed, and the end surface 71 is covered with the electrode layer 81. As described above, the dielectric oxide film 20 may also have a function of insulating the first and second functional layers 31 and 32 and the electrode layer 81.

  In addition, this invention is not limited to these embodiment, What was prescribed | regulated by the claim is included. Further, the capacitor unit 50 of the device according to the present invention may include one capacitor element or may be a laminate of two or more capacitor elements. The capacitor element may also be other types of capacitor elements such as non-solid electrolytic capacitors, ceramic type capacitors, and film type capacitors. The device according to the present invention can be used not only in combination with a CPU but also in combination with other circuit elements, and can be applied to a smoothing circuit of a DC-DC converter, for example.

1, 1a, 1b, 1c, 1d, 1e, 1f, 1g Device 71 First surface 81 Electrode layer

Claims (19)

A capacitor element including a functional layer having a solid electrolyte layer and an electrode layer formed so as to cover a part of each of one surface and the other surface of a plate-shaped substrate that serves as an anode, A capacitor element comprising: a first uncovered area not covered by the functional layer on the one surface of the substrate; and a second uncovered area not covered by the functional layer on the other surface of the base. A capacitor unit including at least one of
Covering a first surface formed by penetrating a part of the packaging member covering the capacitor unit together with a part of the first uncovered region and a part of the second uncovered region of the base. A device having at least one external connection electrode electrically connected to the substrate exposed on the first surface. In claim 1,
The capacitor unit includes a plurality of capacitor elements stacked and electrically connected via at least a part of the functional layer,
The device, wherein the at least one external connection electrode includes an external connection electrode that covers the first surface where the base of at least one of the plurality of capacitor elements is exposed. In claim 1 or 2,
The device, wherein the first uncovered region and the second uncovered region are arranged at positions where the one surface and the other surface face each other. In any of claims 1 to 3,
The first surface includes an end surface in which a part of the packaging member is cut out together with a part of the first uncovered region and a part of the second uncovered region of the base body,
The device, wherein the at least one external connection electrode includes an external connection electrode that covers the end face and covers a part of the capacitor unit. In any of claims 1 to 3,
The capacitor element insulates the first uncovered region of the base from the functional layer and the second non-covered region of the base from the functional layer. A second insulating layer,
The device, wherein the first surface penetrates including a part of the first insulating layer and a part of the second insulating layer. In claim 5,
The first surface includes a part of the packaging member, a part of the first insulating layer, a part of the first uncovered area, a part of the second uncovered area, and the first Including a notched end face together with a part of the insulating layer of 2,
The device, wherein the at least one external connection electrode includes an external connection electrode that covers the end face and covers a part of the capacitor unit. In any one of Claims 1 thru | or 6.
The at least one external connection electrode includes an external connection electrode that covers the first surface in which at least one of four corners of the quadrangular base body is exposed. In any one of Claims 1 thru | or 7,
The at least one external connection electrode includes an external connection electrode that covers the first surface where at least one of four sides of the quadrangular base body is exposed. In any of claims 1 to 8,
The at least one external connection electrode includes at least one of a sprayed metal layer, a deposited metal layer, and a metal layer made of a conductive paste. In any one of Claim 1 thru | or 9,
The capacitor element includes a through electrode that penetrates the base body and electrically connects the electrode layers of the functional layer formed on each of the one surface and the other surface,
The at least one external connection electrode includes a plurality of external connection electrodes that respectively cover the plurality of first surfaces formed at any one of four corners or four sides of the quadrangular base. In any one of Claims 1 thru | or 10,
A device having a substrate on which the capacitor unit is mounted.   A printed wiring board on which the device according to claim 1 is mounted.   An electronic device comprising the printed wiring board according to claim 12. A method of manufacturing a device having a capacitor unit, comprising:
The capacitor unit is a capacitor element including a functional layer including a solid electrolyte layer and an electrode layer formed so as to cover a part of one side and the other side of a plate-like substrate serving as an anode. A first uncovered region not covered by the functional layer on the one surface of the base, and a second uncovered region not covered by the functional layer on the other surface of the base. Including at least one capacitor element with
The method includes covering the capacitor unit with a packaging member, and penetrating a part of the packaging member together with a part of the first uncovered region and a part of the second uncovered region of the base body. When,
Covering the first surface formed by penetrating with a conductive member and forming at least one external connection electrode electrically connected to the base exposed on the first surface; Method. In claim 14,
The capacitor unit includes a plurality of the capacitor elements stacked and electrically connected via at least a part of the functional layer,
Forming the at least one external connection electrode includes forming an external connection electrode that covers the first surface where the base of at least one of the plurality of capacitor elements is exposed. In claim 14 or 15,
The penetrating includes cutting out a part of the packaging member together with a part of the first uncovered area and a part of the second uncovered area of the base body,
Forming the at least one external connection electrode includes forming an external connection electrode that covers an end surface formed by the notch and covers a part of the capacitor unit. In claim 14 or 15,
The capacitor element insulates the first uncovered region of the base from the functional layer and the second non-covered region of the base from the functional layer. A second insulating layer,
The penetrating includes penetrating including part of the first insulating layer and part of the second insulating layer. In claim 17,
The penetrating includes part of the packaging member, part of the first insulating layer, part of the first uncovered area, part of the second uncovered area, and the second part. Including notching together with part of the insulating layer,
Forming the at least one external connection electrode includes forming an external connection electrode that covers an end surface formed by the notch and covers a part of the capacitor unit. In any of claims 14 to 18,
Forming the at least one external connection electrode includes any one of spraying metal on the first surface, depositing metal, and applying a conductive paste.

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