JP5034887B2 - Chip type solid electrolytic capacitor - Google Patents

Description

  The present invention relates to a chip-type solid electrolytic capacitor in which a conductive polymer is used as a solid electrolyte among various capacitors used in various electronic devices and is adapted for surface mounting.

  Along with the higher frequency of electronic equipment, capacitors that are one of the electronic components have been required to have better impedance characteristics in the high frequency range than before, and electrical conductivity has been increased to meet these requirements. Various solid electrolytic capacitors using a highly conductive polymer as a solid electrolyte have been studied.

  In recent years, a solid electrolytic capacitor used around a CPU of a personal computer has been strongly demanded to have a small size and a large capacity. Further, not only a low ESR (equivalent series resistance) is reduced in response to a higher frequency but also a noise. There is a strong demand for low ESL (equivalent series inductance) excellent in removal and transient response, and various studies have been made to meet such demand.

  9A to 9D are a plan sectional view, a front sectional view, a bottom sectional view, and a bottom view showing a configuration of a conventional chip-type solid electrolytic capacitor proposed by the present inventors. In FIG. Reference numeral 21 denotes a capacitor element. The capacitor element 21 is provided with an insulating portion (not shown) provided at a predetermined position of an anode body made of a valve metal having a roughened surface and a dielectric oxide film layer formed thereon. 22 and a cathode forming part (not shown). On the dielectric oxide film layer of the cathode forming part, a solid electrolyte layer made of a conductive polymer, a cathode layer made of a carbon layer and a silver paste layer (all not shown) In this case, the cathode electrode portion 23 is formed by sequentially laminating the layers.

  Reference numeral 24 denotes a capacitor element laminate in which a plurality of the capacitor elements 21 are laminated. The capacitor element laminate 24 includes a plurality of sheets so that the anode electrode portions 22 of the capacitor elements 21 are alternately arranged in opposite directions. It is configured by stacking.

  25 is an anode comb frame integrally joined to the anode electrode portion 22 of the capacitor element laminate 24, 25a is an anode coupling portion integrally provided on the anode comb frame 25, and the anode coupling portion 25a is composed of the capacitor element 25a. After being bent so as to wrap the anode electrode part 22 along the outer periphery of the anode electrode part 22 of the capacitor element 21 constituting the multilayer body 24, the welded part 25b is integrally joined by means such as laser welding. is there. Similarly, 26 is a cathode comb frame in which the cathode electrode portion 23 of the capacitor element laminate 24 is integrally joined. The cathode comb frame 26 and the cathode electrode portion 23 are joined by a conductive adhesive (not shown). is there.

  Reference numeral 27 denotes an anode comb terminal in which the anode comb frame 25 is joined to the upper surface. The anode comb terminal 27 is provided with thin portions 27b at both ends in the width direction, and the central portion excluding the thin portion 27b is an anode when mounted. This is the terminal portion 27a.

  Reference numeral 28 denotes a cathode comb terminal in which the cathode comb frame 26 is joined to the upper surface. The cathode comb terminal 28 is provided with a thin portion 28b at the center in the width direction, and both end portions except for the thin portion 28b are cathodes when mounted. This is the terminal portion 28a.

  Reference numeral 29 denotes an insulating exterior resin integrally covering the capacitor element laminate 24, the anode comb frame 25, the cathode comb frame 26, the anode comb terminal 27, and the cathode comb terminal 28. The anode comb terminal 27, the cathode comb terminal The thin-walled portions 27b and 28b respectively provided on 28 are also integrally covered with the exterior resin 29, and the anode terminal portion 27a and the cathode terminal portion 28a are opposed to the lower surface, which is the mounting surface of the chip-type solid electrolytic capacitor, respectively. A four-terminal structure is exposed at the location.

  The conventional chip-type solid electrolytic capacitor configured as described above has a four-terminal structure in which the anode terminal portion 27a and the cathode terminal portion 28a are exposed on the lower surface serving as the mounting surface, so that the space between the terminals is reduced. By canceling out the magnetic fluxes generated by the current flowing through each other, the ESL can be greatly reduced, and by further reducing the current loop length by reducing the distance between the terminals as much as possible, ESL can be achieved, and ESL can be reduced to about 1/5 or less from the 522 pH of the conventional product to 98 pH.

As prior art document information related to the invention of this application, for example, Patent Document 1 is known.
JP 2007-5760 A

  However, the conventional chip-type solid electrolytic capacitor has a four-terminal structure in which the anode terminal portion 27a and the cathode terminal portion 28a are exposed on the lower surface, which is the mounting surface, so that the current flowing between the terminals The generated magnetic fluxes cancel each other, and the ESL can be greatly reduced. Further, the distance between the terminals is made as close as possible to reduce the current loop length, thereby further reducing the ESL. Although the cathode terminal portion 28a apparently has a two-terminal structure, since it is actually one cathode terminal, this is shown in an equivalent circuit in FIG. ), As shown in (b).

  Therefore, as shown in FIG. 10, in the current applied to the chip-type solid electrolytic capacitor, the direct current component flows on the anode side, and the high frequency noise component included in the applied current flows on the cathode side and falls to the ground. However, since the two cathodes are connected, the high frequency noise component does not fall to the ground, but flows to the other cathode terminal side as shown by the arrows in the figure. As a result, the removal of the high frequency noise component becomes insufficient, and there is a problem that the impedance characteristic in the high frequency region is deteriorated.

  An object of the present invention is to solve such a conventional problem and to provide a chip-type solid electrolytic capacitor excellent in impedance characteristics in a high frequency region.

In order to solve the above-described problems, the present invention provides a stack of a plurality of flat plate-like elements each having an anode electrode part and a cathode electrode part provided with an insulating layer on the surface, and the anode electrode part of some elements and other elements The cathode electrode part of some elements and the cathode electrode part of other elements are electrically separated by an insulating layer provided on the surface exceeding 50% of the cathode electrode part. And an independent element unit, an anode comb terminal, a first cathode comb terminal connected to the cathode electrode part of some elements, and a second cathode connected to the cathode electrode part of other elements, respectively. The cathode comb terminal is used. The present invention also includes a stack of a plurality of flat elements each having an anode electrode portion and a cathode electrode portion and provided with an insulating layer on the surface of the cathode electrode portion. An element unit in which the anode electrode part of the element is disposed on the opposite side, and the cathode electrode part of the part of the element and the cathode electrode part of the other element are electrically separated and separated by an insulating layer, and the element A pair of anode comb terminals respectively disposed on the lower surfaces of the anode electrode portions located at both ends of the unit and joined to the anode electrode portions, and electrically connected to the cathode electrode portions of some elements of the element unit. A first cathode comb terminal; a second cathode comb terminal electrically connected to a cathode electrode portion of another element of the element unit; and a pair of anode comb terminals and a pair of cathode comb terminals. The element in a state where a part of the lower surface that becomes the surface is exposed A U-shaped first cathode comb frame made of an insulating exterior resin coated with a knit and electrically connected to the cathode electrode portions of some elements, and the cathode electrode portions of other elements, respectively. And a first cathode comb terminal electrically connecting the first cathode comb frame to one end of the upper surface and a second cathode comb. The frame is connected to the other end in an insulated state, and the second cathode comb terminal electrically connects the first cathode comb frame to one end of the upper surface and electrically connects the second cathode comb frame to the other end. Connected.

Above Chip solid electrolytic capacitor according to the present invention as, it becomes possible to form two separate cathode in order to be able to be drawn cathode individual elements each independently, this As a result, the high-frequency noise component included in the applied current flows through two independent cathodes and is efficiently dropped into the ground, so that the high-frequency noise component can be sufficiently removed, and the impedance characteristic in the high-frequency region is improved. An effect that an excellent chip-type solid electrolytic capacitor can be realized is obtained.

(Embodiment 1)
1A and 1B are an exploded perspective view showing a basic configuration of a chip-type solid electrolytic capacitor according to Embodiment 1 of the present invention and a perspective view showing a laminated state. Indicates a flat element, and this element 1 is an anode body made of a valve-acting metal foil (in this embodiment, an aluminum foil is used) whose surface is roughened and a dielectric oxide film layer is formed. An insulating portion (not shown) is provided at a predetermined position to be separated into an anode electrode portion 2 and a cathode forming portion (not shown), and a solid electrolyte layer made of a conductive polymer on the dielectric oxide film layer of the cathode forming portion, A cathode electrode part 3 is formed by sequentially laminating a cathode layer (all not shown) made of a carbon layer and a silver paste layer, and a cathode electrode is formed from the side opposite to the anode electrode part 2 of the cathode electrode part 3. Insulating resin on the surface exceeding 50% of part 3 Those constructed by forming a that insulating layer 4.

  Reference numeral 5 denotes an anode comb frame, 5a denotes a pair of anode coupling portions provided on the upper surface of the anode comb frame 5, and 5b denotes an anode comb terminal joined to the lower surface of the anode comb frame 5. The anodes positioned at both ends of the element unit in which a plurality of the element 1 are arranged on the opposite sides of the anode electrode portion 2 alternately (in the present embodiment, two sheets are used for easy understanding of the configuration). The anode electrode part 2 is disposed on the lower surface of the electrode part 2 and wrapped to bundle the anode electrode part 2 by bending the anode coupling part 5a, and then the anode electrode part 2 is joined electrically and mechanically by means such as resistance welding. It is a thing. The anode comb terminal 5b is not an independent member but may be integrated with the anode comb frame 5.

  Reference numeral 6 denotes a U-shaped first cathode comb frame, 6a denotes a pair of side wall portions provided at both ends of the first cathode comb frame 6, and the first cathode comb frame 6 includes the above-described element. The unit is disposed on the lower surface of the unit so as to be in contact with the cathode electrode part 3 of the lowermost element 1, and the conductive adhesive 10 (not shown) is also applied to the inside of the side wall part 6a. And the cathode electrode portion 3 of the element 1 which is an odd number in the stacking direction of the element units.

  7 is a U-shaped second cathode comb frame formed in the same manner as the first cathode comb frame 6, and 7 a is a side wall portion provided in a pair at both ends of the second cathode comb frame 7. The second cathode comb frame 7 is disposed on the lower surface of the element unit so as to be in contact with the insulating layer 4 of the lowermost element 1 and is provided with a conductive adhesive 10 (not shown, but inside the side wall portion 7a). In addition, the conductive adhesive 10 is applied to the cathode electrode portion 3 of the element 1 which is an even number in the stacking direction of the element units. .

  Reference numeral 8 denotes a first cathode comb terminal. The first cathode comb terminal 8 electrically connects the first cathode comb frame 6 to one end of the upper surface via a conductive adhesive 10, and A second cathode comb frame 7 is connected to the other end of the upper surface in an insulating state via an insulating adhesive 11.

  Reference numeral 9 denotes a second cathode comb terminal formed in the same manner as the first cathode comb terminal 8, and the second cathode comb terminal 9 has an insulating property on the first cathode comb frame 6 at one end of the upper surface. The second cathode comb frame 7 is electrically connected to the other end of the upper surface via the conductive adhesive 10 while being connected in an insulating state via the adhesive 11.

  As a result, the first cathode comb terminal 8 is electrically connected to the cathode electrode portion 3 of the element 1 which is an odd number in the stacking direction of the element units, and the second cathode comb terminal 9 is connected to the element. The cathode electrode portion 3 of the element 1 which is an even number in the unit stacking direction is electrically connected, and the first cathode comb terminal 8 and the second cathode together with a pair of independent anode comb terminals 5b. A chip-type solid electrolytic capacitor having a four-terminal structure in which the comb terminals 9 are independent from each other is formed.

  In the chip-type solid electrolytic capacitor according to the present embodiment configured as described above, the element 1 having the insulating layer 4 provided on the surface exceeding 50% of the cathode electrode portion 3 is arranged on the opposite side of the anode electrode portion 2 alternately. Thus, with the configuration in which the element unit is formed by laminating a plurality of elements, each cathode electrode portion 3 of this element unit is separated by the insulating layer 4 and becomes independent, which is equivalent to FIGS. 2 (a) and 2 (b). As shown in the circuit diagram, the cathode electrode portions 3 of the odd-numbered elements 1 and the cathode electrode portions 3 of the even-numbered elements 1 in the stacking direction of the element units are two independent and different cathodes.

  Accordingly, the high frequency noise component included in the current applied to the chip-type solid electrolytic capacitor flows through the two independent cathodes and is efficiently dropped to the ground, so that the high frequency noise component can be sufficiently removed. Therefore, a special effect is achieved that a chip-type solid electrolytic capacitor having excellent impedance characteristics in a high-frequency region can be realized.

  The results of measuring impedance characteristics in the high frequency region of the chip-type solid electrolytic capacitor according to the present embodiment configured as described above are shown in FIG. 3 and (Table 1) in comparison with a conventional product as a comparative example.

  As apparent from FIG. 3 and (Table 1), the chip-type solid electrolytic capacitor according to the present embodiment can reduce the impedance at 1 GHz to about 60% of the conventional product, and its variation is small. It is possible to sufficiently meet the recent high demands for high frequency response.

(Embodiment 2)
The present embodiment is different from the first embodiment in that the number of stacked elements constituting the element unit of the chip-type solid electrolytic capacitor described with reference to FIG. 1 is increased. Since they are the same as those of the first embodiment, the same portions are denoted by the same reference numerals and detailed description thereof is omitted, and only different portions will be described below with reference to the drawings.

  4A and 4B are a perspective view from the top side and a perspective view from the bottom side showing the configuration of the chip-type solid electrolytic capacitor according to Embodiment 2 of the present invention, and FIGS. ) Is a perspective view from the top side and a perspective view from the bottom side showing the internal structure of the chip-type solid electrolytic capacitor. FIGS. 6A and 6B are exploded views of the chip-type solid electrolytic capacitor before resin molding. It is the same perspective view as a perspective view.

  4 to 6, reference numeral 1 denotes an element having an anode electrode part 2 and a cathode electrode part 3, and an insulating layer 4 made of an insulating resin is formed on the surface of the cathode electrode part 3 exceeding 50%. The element unit is configured by stacking six elements 1 configured as described above so that the anode electrode portions 2 are alternately arranged on opposite sides.

  5 is a pair of anode comb frames in which the anode electrode portions 2 of the element unit are electrically and mechanically joined, 12 is an anode comb terminal joined to the lower surface of the anode comb frame 5, and 12a is this anode comb terminal. 12 is a bent portion provided by bending and raising one end, and the bent portion 12a is formed from the exterior resin 15 after molding the element unit with the exterior resin 15 described later. The solder fillet is easily formed in the soldering operation at the time of mounting on the solder.

  Reference numeral 6 denotes a first cathode comb frame, and reference numeral 7 denotes a second cathode comb frame. The cathode electrode portions 3 of the odd-numbered elements 1 in the stacking direction of the element units are respectively connected via the conductive adhesive 10. 1 is connected to the cathode comb frame 6 (including the side wall portion 6a), and the cathode electrode portion 3 of the element 1 which is an even number in the stacking direction of the element units is connected to the second cathode comb via the conductive adhesive 10, respectively. This is connected to the frame 7 (including the side wall portion 7a).

  Reference numeral 13 denotes a first cathode comb terminal, and 13a denotes a bent portion provided by bending and raising one end of the first cathode comb terminal 13. The first cathode comb terminal 13 includes the first cathode comb frame 6 described above. Is electrically connected to one end of the upper surface via a conductive adhesive 10, and the second cathode comb frame 7 is connected to the other end of the upper surface in an insulating state via an insulating adhesive 11. The configuration and effect of the bent portion 13a are the same as those of the bent portion 12a provided on the anode comb terminal 12.

  Reference numeral 14 denotes a second cathode comb terminal, 14a denotes a bent portion provided by bending and raising one end of the second cathode comb terminal 14, and the second cathode comb terminal 14 is connected to the first cathode comb frame 6 described above. Is connected to one end of the upper surface in an insulating state via an insulating adhesive 11, and the second cathode comb frame 7 is electrically connected to the other end of the upper surface via a conductive adhesive 10. The configuration and effect of the bent portion 14a are the same as those of the bent portion 12a provided on the anode comb terminal 12.

  As a result, the first cathode comb terminal 13 is electrically connected to the cathode electrode portion 3 of the element 1 which is an odd number (first, third and fifth) in the stacking direction of the element units. Further, the cathode electrode portion 3 of the element 1 which is the even number (second sheet, fourth sheet and sixth sheet) in the stacking direction of the element units is electrically connected to the second cathode comb terminal 14 respectively. A chip-type solid electrolytic capacitor having a four-terminal structure in which the first cathode comb terminal 13 and the second cathode comb terminal 14 are independent of each other, together with a pair of independent anode comb terminals 12 is configured. Is exactly the same as in the first embodiment.

  Reference numeral 15 denotes an insulating exterior resin made of epoxy resin or the like. The exterior resin 15 includes a bottom surface and a bent portion 12a of the pair of anode comb terminals 12, a bottom surface and a bent portion 13a of the first cathode comb terminal 13, The element unit, the anode comb frame 5, the first cathode comb frame 6, and the second cathode comb frame 7 are integrally covered with the bottom surface of the cathode comb terminal 14 and the bent portion 14a exposed on the outer surface. Thus, the chip-type solid electrolytic capacitor according to the present embodiment is configured, and the pair of anode comb terminals 12, the first cathode comb terminals 13, and the second cathode comb terminals 14 exposed on the bottom surface of the exterior resin 15. It is comprised so that it may mount in the board | substrate which is not shown in figure via.

  The chip-type solid electrolytic capacitor according to the present embodiment configured as described above has the configuration in which two independent and different cathodes are provided in the same manner as the chip-type solid electrolytic capacitor according to the first embodiment. The high-frequency noise component contained in the current applied to the capacitor flows through two independent cathodes and is efficiently dropped to the ground, so that the high-frequency noise component can be sufficiently removed. This provides a special effect that a chip-type solid electrolytic capacitor having excellent characteristics can be realized.

(Embodiment 3)
In this embodiment, the configuration of the element unit of the chip-type solid electrolytic capacitor described in the second embodiment with reference to FIGS. 4 to 6 is partially different. Since they are the same as in the second embodiment, the same parts are denoted by the same reference numerals and detailed description thereof is omitted, and only different parts will be described below with reference to the drawings.

  FIGS. 7A and 7B are a perspective view from the top side and a perspective view from the bottom side showing the configuration of the chip-type solid electrolytic capacitor according to Embodiment 3 of the present invention, and FIGS. ) Is an exploded perspective view of the same chip-type solid electrolytic capacitor before resin molding, and in FIGS. 7 and 8, 1 is an element having an anode electrode portion 2 and a cathode electrode portion 3, and the cathode electrode An insulating layer 4 made of an insulating resin is formed on the surface of the portion 3 that exceeds 50%, and a single element stack is formed by stacking three elements 1 configured in this way in the same direction. The point that the element unit is configured by stacking two sets (six pieces) of the element laminate so that the anode electrode portions 2 are alternately arranged on opposite sides is a difference from the second embodiment. .

  Accordingly, the cathode electrode portions 3 of the element stacks that are odd-numbered in the stacking direction of the element units are connected to the first cathode comb frames 6 via the conductive adhesives 10, respectively, and are even-numbered in the stacking direction of the element units. The cathode electrode part 3 of the element laminate to be connected to the second cathode comb frame 7 through the conductive adhesive 10 respectively.

  The chip-type solid electrolytic capacitor according to the present embodiment configured as described above has a plurality of elements 1 stacked in the same direction in addition to the effects obtained by the chip-type solid electrolytic capacitor according to the first and second embodiments. A plurality of (three) cathode electrode parts are obtained by forming an element unit by laminating the element laminated body so that the anode electrode parts 2 are alternately arranged on opposite sides. 3 overlap each other and are connected to the first cathode comb frame 6 (including the side wall portion 6a) and the second cathode comb frame 7 (including the side wall portion 7a). The contact property between the cathode comb frame 6 and the second cathode comb frame 7 is improved, and the ESR can be lowered.

  In addition, since the amount of bending of the anode electrode portion 2 of the element laminate constituting the element unit can be halved, it is possible to reduce damage applied to the element 1 and suppress deterioration of leakage current characteristics. It also has a special effect of becoming.

  The chip-type solid electrolytic capacitor according to the present invention has an effect of being excellent in impedance characteristics in a high frequency region, and is particularly useful as a capacitor in a field where high frequency characteristics are regarded as important.

(A) An exploded perspective view showing a basic configuration of a chip-type solid electrolytic capacitor according to Embodiment 1 of the present invention, (b) a perspective view showing the same laminated state (A), (b) Equivalent circuit diagram showing the configuration of the chip-type solid electrolytic capacitor Characteristic diagram showing impedance characteristics of the same chip-type solid electrolytic capacitor (A) The perspective view from the upper surface side which showed the structure of the chip-type solid electrolytic capacitor by Embodiment 2 of this invention, (b) The perspective view from the same bottom face side (A) The perspective view from the upper surface side which showed the internal structure of the chip-type solid electrolytic capacitor, (b) The perspective view from the same bottom surface side (A) Exploded perspective view of the chip-type solid electrolytic capacitor before resin molding, (b) Perspective view (A) The perspective view from the upper surface side which showed the structure of the chip-type solid electrolytic capacitor by Embodiment 3 of this invention, (b) The perspective view from the same bottom face side (A) Exploded perspective view of the chip-type solid electrolytic capacitor before resin molding, (b) Perspective view (A) Plan sectional view showing the configuration of a conventional chip-type solid electrolytic capacitor, (b) Front sectional view, (c) Bottom sectional view, (d) Bottom view (A), (b) Equivalent circuit diagram showing the configuration of a conventional chip-type solid electrolytic capacitor

DESCRIPTION OF SYMBOLS 1 Element 2 Anode electrode part 3 Cathode electrode part 4 Insulating layer 5 Anode comb frame 5a Anode coupling part 5b Anode comb terminal 6 1st cathode comb frame 6a, 7a Side wall part 7 2nd cathode comb frame 8, 13 1st Cathode comb terminal 9, 14 Second cathode comb terminal 10 Conductive adhesive 11 Insulating adhesive 12 Anode comb terminal 12a, 13a, 14a Bending portion 15 Exterior resin

Claims (5)

A plurality of plate-like elements having an anode electrode part and a cathode electrode part and having an insulating layer provided on the surface of the cathode electrode part are laminated, and the anode electrode part of some elements and the anode of other elements An element unit in which the electrode part is disposed on the opposite side, and the cathode electrode part of the part of the element and the cathode electrode part of the other element are electrically separated and made independent by the insulating layer, and the element unit A pair of anode comb terminals respectively disposed on the lower surfaces of the anode electrode portions located at both ends of the element and joined to the anode electrode portions, and electrically connected to the cathode electrode portions of the partial elements of the element unit, respectively. The first cathode comb terminal, the second cathode comb terminal electrically connected to the cathode electrode portion of the other element of the element unit, the pair of anode comb terminals and the pair of cathode combs, respectively. At least a part of the bottom surface that is the mounting surface In a state of people exposed made of insulating sheathing resin coated with the element unit, wherein the insulating layer is provided on the surface of greater than 50% of the cathode electrode portion,
Chip type solid electrolytic capacitor. A plurality of plate-like elements having an anode electrode part and a cathode electrode part and having an insulating layer provided on the surface of the cathode electrode part are laminated, and the anode electrode part of some elements and the anode of other elements An element unit in which the electrode part is disposed on the opposite side, and the cathode electrode part of the part of the element and the cathode electrode part of the other element are electrically separated and made independent by the insulating layer, and the element unit A pair of anode comb terminals respectively disposed on the lower surfaces of the anode electrode portions located at both ends of the element and joined to the anode electrode portions, and electrically connected to the cathode electrode portions of the partial elements of the element unit, respectively. The first cathode comb terminal, the second cathode comb terminal electrically connected to the cathode electrode portion of the other element of the element unit, the pair of anode comb terminals and the pair of cathode combs, respectively. At least a part of the bottom surface that is the mounting surface of the terminal Made of insulating sheathing resin coated with the element unit in a state that people exposed,
Furthermore, a U-shaped first cathode comb frame that is electrically connected to the cathode electrode portion of each of the elements, and a U-shape that is electrically connected to the cathode electrode portions of the other elements. A first cathode comb terminal electrically connecting the first cathode comb frame to one end of the upper surface and insulating the second cathode comb frame at the other end. Connect with
The second cathode comb terminal is a chip-type solid electrolytic capacitor in which the first cathode comb frame is connected to one end of the upper surface in an insulated state and the second cathode comb frame is electrically connected to the other end. 3. The chip-type solid electrolytic capacitor according to claim 1, wherein the anode comb terminal is provided with an anode coupling portion that integrally couples the anode electrode portion along the outer periphery of the anode electrode portion of the element constituting the element unit. The chip according to claim 1 or 2 , wherein at least a part of the lower surface of the anode comb terminal and the cathode comb terminal is extended so as to protrude from the upper surface exterior resin, and the extended portion is bent upward along the side surface of the exterior resin. Type solid electrolytic capacitor. As an element, an insulating part is provided at a predetermined position of an anode body made of a valve metal having a roughened surface and a dielectric oxide film layer formed thereon, and separated into the anode electrode part and the cathode forming part. 2. An element in which the cathode electrode part is formed by sequentially laminating a solid electrolyte layer made of a conductive polymer and a cathode layer made of a carbon layer and a silver paste layer on the dielectric oxide film layer of the part. Or a chip-type solid electrolytic capacitor according to 2;

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