TW201329463A - Micro-stress test table - Google Patents

Abstract

The present invention relates to a micro-stress test table, including a base, a testing port, a guiding base, a long pressure clamp, a short pressure clamp, and two pressing members. The long pressure clamp and short pressure clamp are configured to two opposite sides of the base, where the two pressing members are placed over the long pressure clamp and short pressure clamp, respectively. A convex end on the long pressure clamp and an occlusal end on the short pressure clamp are both capable of selectively supporting against the guiding base. When the two pressing members are pressed down, a chip to be tested is placed in place; the pressing members are subsequently released; the long pressure clamp and short pressure clamp will press back to the guiding base. A square shaped pressing head is further pressed to the chip to be tested, such that the guiding base may absorb most impact force, preventing the chip to be tested from being damaged.

Description

Micro-stress test seat

The invention relates to a micro compressive stress test socket, in particular to a test seat suitable for testing electronic component components.

Various electronic component wafers, such as integrated circuits (ICs) and micro electro mechanical systems (MEMS), are packaged into packages after the wafer packaging process, and the packages are placed in the test machine. Conduct a test in the test socket to check if the package is functioning properly and if the characteristics meet the customer's requirements. Before entering the test machine test, the package must be placed in the test stand for subsequent testing.

Conventional test sockets mostly use a method of pressing the package from top to bottom, and the compression element is controlled by the elasticity of the second elastic element. When the package is to be placed, the second elastic element is pressed to make the compression element Opening, when the package is placed and positioned, the second elastic element is loosened to cause the compression element to rebound by elastic rebound to hold the seal, but this way often provides a large torque due to the elastic force of the second elastic element being too large. The pressing element causes a large impact force on the package. As the package becomes more and more precise, such impact force often causes damage to the package.

On the other hand, with the use and precision of the package, it is necessary to use different sizes of contact stress for testing. However, the conventional test sockets mostly provide fixed contact stress. If different contact stress is required, it needs to be made. Different test sockets cannot quickly adjust the required contact stress.

The reason for the inventor is that, in the spirit of active invention and creation, a micro-stress test seat that can solve the above problems is considered, and the present invention is completed after several research experiments.

The micro compressive stress test seat of the present invention comprises a base, a test cymbal, a guide seat, a long pressure tong, a short pressure tong, and two pressing members. The pedestal has a receiving slot, and the test cymbal is disposed in the receiving slot of the base; the guiding seat is disposed in the receiving slot of the base and is located above the test cymbal and has a test slot; A plurality of first elastic members are further interposed between the test cymbals, wherein the plurality of first elastic members may be springs.

The long pressure clamp is disposed on one side of the base, one end is a one-type pressure head, and the other end is provided with a cross bar, and a convex surface is convexly protruded between the square type pressure head and the horizontal bar, and the optional top is abutted on the guide seat; The short pressure clamp is disposed on the opposite side of the long pressure clamp, and one end is provided with a cross bar, and the other end is convexly provided with a stop surface, which can also be selectively abutted against the guide seat.

The two pressing members respectively pass through at least one through column on the base, are pivotally disposed on the base, and are respectively covered by the long pressure clamp and the short pressure clamp having one end of the cross bar, and the two pressing members correspond to the long pressure clamp and the short pressure clamp At the crossbar, a latching slot is respectively formed, and the crossbars of the long pressure clamp and the short pressure clamp are respectively engaged into the engaging groove. In addition, the base may further include a plurality of guiding grooves for accommodating the plurality of second elastic members, so that the plurality of second elastic members are sandwiched between the two pressing members and the base, and the plurality of second elastic members may be spring. .

Through the above structure, when the pressing members on the two sides are pressed down, the long pressure clamp and the short pressure clamp that are engaged with the pressing member are lifted upward to form an opening for conveniently placing a wafer to be tested, and when the wafer to be tested is placed When the pressing members on the two sides are loosened, the two pressing members that are rebounded by the elastic force will drive the long pressure clamp and the short pressure clamp that are engaged with each other, and press back to the guide seat, and the square pressure of the long pressure clamp The head will be pressed onto the wafer to be tested.

When the conventional compression element is elastically rebounded to press the sealing device, the elastic force of the second elastic element is often too large to provide a large torque, so that the pressing element generates a large impact force on the package, The package is becoming more and more sophisticated, and such impact can cause damage to the package. However, in the present invention, since the convex surface of the long pressure clamp and the stop surface of the short pressure clamp are pressed to the guide seat before the square pressure head of the long pressure clamp is pressed to the wafer to be tested, It absorbs most of the rebound's elasticity and greatly reduces the impact of the square indenter to the wafer to be tested.

The test 埠 of the micro-stress test socket may include a bottom plate, a plurality of contact terminals and a terminal fixing seat. The bottom plate may be provided with a plurality of grooves, and the terminal fixing seat has a plurality of through holes, and the plurality of contact terminals respectively correspond to The plurality of through holes are fixed to the terminal fixing seat and are disposed in the plurality of grooves on the bottom plate.

The bottom of the test slot of the guiding seat of the micro-stressing test seat may be provided with a plurality of perforations, and the plurality of contact terminals respectively corresponding to the plurality of perforations of the test slot. After the wafer to be tested is placed, the long pressure pliers and the short pressure pliers are pressed down onto the guide seat, and the guide seat is pressed down onto the test bead, so that the plurality of contact terminals protrude from the bottom of the test slot. Contact the wafer to be tested to facilitate testing of the crystal.

The terminal holder of the test crucible of the micro-stress test chamber may further include a plurality of grooves for receiving a plurality of first elastic members sandwiched between the guide seat and the test boring.

Conventional test sockets mostly provide fixed contact stress. However, due to the different uses and precision of the package, it is often necessary to use different sizes of contact stress for testing. Therefore, in the present invention, the square indenter of the long pressure clamp is used. Pressing on the wafer to be tested, so that the plurality of contact terminals contact the wafer to be tested, and the convex surface on the long pressure clamp is pressed against the guide seat, so that the wafer to be tested is not pressed to the test slot of the guide seat At the same time, a gap is formed between the wafer to be tested and the bottom of the test slot of the guide seat, so that the contact stress between the plurality of contact terminals and the wafer to be tested can be adjusted by the interval.

Please refer to FIG. 1. FIG. 1 is an exploded view of a preferred embodiment of the present invention. The micro compressive stress test socket of the embodiment comprises: a base 1, a test cartridge 2, a guide seat 3, a long pressure clamp 4, a short pressure clamp 5, and two pressing members 6. The susceptor 2 is disposed in the accommodating groove 11 of the pedestal 1 , and the guiding seat 3 is disposed in the accommodating groove 11 of the pedestal 1 and located above the test cymbal 2 . A plurality of first elastic members 212 are interposed between the guide seat 3 and the test cymbal 2, and in the embodiment, the plurality of first elastic members 212 are springs.

The test cartridge 2 includes a bottom plate 23, a terminal holder 21, and a plurality of contact terminals 22. The terminal fixing base 21 can include a plurality of grooves 213 for receiving the plurality of first elastic members 212 sandwiching the guiding seat 3 and the test cymbal 2; the bottom plate 23 is provided with a plurality of grooves 231 and a plurality of contact terminals 22 is correspondingly disposed in the plurality of recesses 231 of the bottom plate 23, and then is inserted and fixed in the plurality of through holes 211 in the terminal fixing base 21, thereby fixing the plurality of contact terminals 22 for subsequent testing. .

The end of the long pressure tongs 4 is a one-type ram 41, and the other end is provided with a cross bar 43. At the adjacent square ram 41, a convex surface 42 is provided, and the top surface of the guide yoke 3 is selectively attached. 32; at the adjacent crossbar 43, a hole 44 is provided; when the long pressure clamp 4 is disposed on one side of the base 1, a long crossbar 14 passes through the base 1 and the long pressure from the side of the base 1 The hole 44 in the pliers 4, whereby the long pliers 4 can be rotated about the axis of rotation at the hole 44.

In addition, the pressing member 6 to be covered above the long pressure clamp 4 is provided with two passages 62, and an engagement groove 61 is defined at the cross bar 43 corresponding to the long pressure clamp 4, and the pressing member 6 engages the crossbar 43 to After the engaging groove 61, the pressing member 6 is disposed on one side of the base 1 by the two through-pillars 12, and the second elastic member 13 is further interposed between the pressing member 6 and the base 1 above the long-pressure clamp 4. Two guiding grooves 15 are defined in the base 2 corresponding to the second elastic members 13 to accommodate the second elastic members 13 , whereby the pressing members 6 above the long pressing jaws 4 can pass through the two columns 12 . The reciprocating motion is performed up and down, and at the same time, the long-pressure pliers 4 that is engaged with the same can be driven, and the rotating shaft can be rotated by the hole 44. Further, in the present embodiment, the plurality of second elastic members 13 are springs.

A short pressure clamp 5 is disposed on the opposite side of the long pressure clamp 4, and a stop surface 51 is protruded from one end thereof, and the top surface of the guide seat 3 is selectively attached to the surface 32 of the guide seat 3, and the other end is also provided with a cross rod 52; A cross hole 53 is provided at the crossbar 52. Similarly, when the short press pliers 5 is disposed on one side of the base 1, a long crossbar 14 passes through the base 1 and the short press pliers 5 from the side of the base 1. The upper hole 53 is thereby, and the short press pliers 5 can be rotated at the hole 53 as a rotating shaft.

The lower pressure clamp 5 is also covered with a pressing member 6 , which is also provided with two passages 62 , and an engaging groove 61 is defined at the cross bar 52 corresponding to the short pressure clamp 5 , and the pressing member 6 engages the cross bar 52 to the card. After the groove 61 is inserted, the pressing member 6 is disposed on one side of the base 1 by using the two through posts 12, and the second elastic member 13 is further interposed between the pressing member 6 and the base 1 above the short pressing pliers 5, Two guiding grooves 15 are defined in the second elastic member 13 of the base 1 to accommodate the second elastic members 13 so that the pressing member 6 can reciprocate up and down along the two through columns 12, and can also be driven. The short-pressure pliers 5 that is engaged with the hole can be rotated by the hole 53 as a rotating shaft.

The test socket 3 defines a test slot 31. The bottom of the test slot 31 defines a plurality of through holes 34. The plurality of contact terminals 22 respectively pass through the plurality of through holes 34 of the test slot 31.

Next, please refer to FIG. 2. FIG. 2 is a cross-sectional view of the pressing and pressing member of the embodiment. When the two pressing members 6 on the two sides of the base 1 are simultaneously pressed, as described above, the long pressure clamp 4 and the short pressure clamp 5 respectively engaged with the two pressing members 6 are driven, so that the long pressure clamp 4 is The hole 44 is a rotating shaft, and the short pressure pliers 5 is rotated by the hole 53 while rotating, and an opening is formed. Then, a wafer suction device 9 can place a wafer 7 to be tested on the guiding seat. 3 in the test slot 31. On the other hand, when the long pressure clamp 4 and the short pressure clamp 5 leave the surface 32 of the guide seat 3, the elastic member 212 between the guide seat 3 and the test jaw 2 lifts the guide seat 3 upward to allow the test piece 3 to be tested. When the wafer 7 is placed in the test slot 31 of the guide holder 3, the plurality of contact terminals 22 do not protrude from the test slot 31 to contact the wafer 7 to be tested.

Referring to FIG. 3, and referring to FIG. 1 and FIG. 2 together, FIG. 3 is a cross-sectional view of the release pressing member of the embodiment. When the wafer 7 to be tested is placed and the wafer suction device 9 is removed, the pressing of the two side pressing members 6 is released, and the second elastic member 13 between the pressing member 6 and the base 1 pushes the pressing member 6 upward. The long pressure clamp 4 and the short pressure clamp 5 are pushed back to the guide seat 3, and the square pressure head 41 of the long pressure clamp 4 is pressed onto the wafer 7 to be tested to fix the position of the wafer 7 to be tested. The invention is to prevent the conventional compression element from rebounding due to elasticity, because the elastic force of the second elastic element is too large, providing a large torque, so that the compression element generates a large impact force on the package, thereby causing damage to the package. Before the square pressing head 41 of the long pressure clamp 4 is pressed to the wafer 7 to be tested, the convex surface 42 of the long pressure clamp 4 and the stop surface 51 of the short pressure clamp 5 are first pressed onto the surface 32 of the guiding seat 3, that is, Absorbing most of the impact force caused by the resilience force, the square indenter 41 does not bring an excessive impact force to the wafer 7 to be tested, thereby avoiding damage of the wafer 7 to be tested.

Please refer to FIG. 3 and FIG. 4 at the same time. FIG. 4 is an enlarged view of a portion A in FIG. 3 of the embodiment. When the long pressure clamp 4 and the short pressure clamp 5 are pressed to the surface 32 of the guide seat 3, the guide seat 3 is pressed down to the test jaw 2, at which time the plurality of contact terminals 22 will protrude from the test slot 31. The wafer 7 to be tested is used for subsequent testing.

In addition, in order to solve the conventional test socket, only the fixed contact stress is provided. However, due to the use and precision of the package, it is often required to use different sizes of contact stress for testing. In the present invention, the long pressure clamp 4 The convex surface 42 is pressed against the surface 32 of the guiding seat 3, so that the square pressing head 41 of the long pressure clamp 4 does not press the wafer 7 to be tested to the bottom of the test slot 31, so that there is a gap between the wafer 7 to be tested and the bottom of the test slot 31. The interval D, whereby the plurality of contact terminals 22 protrude from the pressing of the guiding seat 3 until the test slot 31 contacts the wafer 7 to be tested, and the contact between the plurality of contact terminals 22 and the wafer 7 to be tested can be adjusted through the interval D. Force to provide the required contact stress for different packages.

The above-mentioned embodiments are merely examples for convenience of description, and the scope of the claims is intended to be limited to the above embodiments.

1. . . Pedestal

11. . . Locating slot

12. . . Through the column

13. . . Second elastic element

14. . . Long crossbar

15. . . Guide groove

2. . . Test埠

twenty one. . . Terminal holder

211. . . Through hole

212. . . First elastic element

213. . . Trench

twenty two. . . Contact terminal

twenty three. . . Bottom plate

231. . . Groove

3. . . Guide seat

31. . . Test slot

32. . . surface

34. . . perforation

4. . . Long pressure pliers

41. . . Square indenter

42. . . Convex

43. . . Crossbar

44. . . Hole

5. . . Short press pliers

51. . . Stop face

52. . . Crossbar

53. . . Hole

6. . . Pressing member

61. . . Engagement slot

62. . . aisle

7. . . Chip to be tested

9. . . Wafer suction device

D. . . interval

1 is an exploded view of a preferred embodiment of the present invention.

Figure 2 is a cross-sectional view of a push-down pressing member in accordance with a preferred embodiment of the present invention.

Figure 3 is a cross-sectional view showing the release of the pressing member in accordance with a preferred embodiment of the present invention.

Figure 4 is an enlarged view of a portion A of Figure 3 in accordance with a preferred embodiment of the present invention.

1. . . Pedestal

11. . . Locating slot

12. . . Through the column

13. . . Second elastic element

14. . . Long crossbar

15. . . Guide groove

2. . . Test埠

twenty one. . . Terminal holder

211. . . Through hole

212. . . First elastic element

213. . . Trench

twenty two. . . Contact terminal

twenty three. . . Bottom plate

231. . . Groove

3. . . Guide seat

31. . . Test slot

32. . . surface

34. . . perforation

4. . . Long pressure pliers

41. . . Square indenter

42. . . Convex

43. . . Crossbar

44. . . Hole

5. . . Short press pliers

51. . . Stop face

52. . . Crossbar

53. . . Hole

6. . . Pressing member

61. . . Engagement slot

62. . . aisle

Claims (9)

A micro-stressing test socket includes: a pedestal having a receiving groove; a test cymbal disposed in the accommodating groove of the pedestal; and a guiding seat having a test slot disposed on the pedestal The accommodating groove is located above the test cymbal, and a plurality of first elastic elements are interposed between the guiding seat and the test cymbal; a long pressure tong is disposed on one side of the base, and a convex surface is convexly disposed a selectable top is abutted against the guide seat; a short presser is disposed on the opposite side of the long press pliers on the base, and a stop surface is convexly disposed, and the selectable top is abutted against the guide seat; And the two pressing members are respectively disposed on the base through the at least one through post on the base, and respectively cover the end of the long pressure clamp and the short pressure clamp, and the two pressing members and the base A plurality of second elastic members are interposed. The micro-pressure stress test seat according to claim 1, wherein the long-pressure pliers has a one-side indenter at one end and a cross bar at the other end; the pressing member covering the long-pressure pliers corresponds to A snap groove is formed at the crossbar. The micro-pressure stress test seat according to the first aspect of the invention, wherein the short pressure pliers is provided with a cross bar at one end; and the pressing member covering the short press pliers has a snap on the corresponding cross bar. groove. The micro-pressure stress test socket according to the first aspect of the invention, wherein the test device includes a bottom plate and a plurality of contact terminals; the bottom plate is provided with a plurality of recesses, and the plurality of contact terminals are respectively disposed on the bottom plate. In the plural groove. The micro-pressure stress test socket according to the fourth aspect of the invention, wherein the test socket has a plurality of perforations at the bottom of the test slot, and the plurality of contact terminals respectively pass through the plurality of perforations of the test slot. The micro-pressure stress test socket according to claim 5, wherein the test device further comprises a terminal fixing base, the terminal fixing base includes a plurality of through holes, and the plurality of contact terminals respectively pass through and are fixed to the Multiple through holes. The micro-pressure stress test socket of claim 1, wherein the base further comprises a plurality of guiding grooves for receiving the plurality of second elastic members. The micro-pressure stress test socket of claim 6, wherein the terminal fixing base further comprises a plurality of grooves for receiving the plurality of first elastic members. The micro compressive stress test socket of claim 1, wherein the first elastic element is a spring.