TWI271133B - Jig device for assembling package on circuit board and method thereof - Google Patents

Abstract

A jig device for assembling a package on a circuit board and a method thereof. The package includes an upper surface and a bottom surface with several contact legs. The circuit board includes a socket and several fix holes. The socket has several contact holes corresponding to the contact legs. The jig device includes a fix platform and a press device. The fix platform has several fix pins for correspondingly inserting into the fix holes. So that, the circuit board is fixed on the fix platform. The press device is for apply strength on the upper surface averagely to press the package. So that, the contact legs are inserted into the contact holes completely.

Description

1271133 IX. Description of the Invention: [Technical Field] The present invention relates to a jig, and more particularly to a jig and method for mounting a package on a circuit board by applying an average force to a package. [Prior Art] Two methods of conventionally using a basic input output system (BIOS) package into a motherboard are as follows. • In the first way of installing the BIOS package, the operator lays the motherboard flat on the electrostatic foam on the work surface, and then presses the BIOS package down into the electrical socket with the fixture. In the second way of installing the BIOS package, the operator places the motherboard on the palm of the hand, and then presses the BIOS package down into the electrical socket with a finger. The above two methods of installing the BIOS package can put the BIOS package into the electrical socket, and if the pins of the inserted BIOS package are completely and completely in contact with the electrical socket, the installation is completed. However, in the first method of installing the BIOS package, when the operator φ presses the BIOS package, it is artificially determined that the power and angle of the BIOS package are correct when pressed, which is easy to cause human judgment. The value of negligence or personal judgment is different, resulting in a bad situation. For example, if the BIOS package is misaligned when it is placed, it will cause the BIOS package to touch the pins, or the electrical socket may be damaged. If the amount of pressure under the BIOS package is too small, t will cause the BIOS package pins to not fully touch the electrical socket. If the amount of pressure under the BIOS package is too large, it will cause damage to the BIOS package or electrical outlet. In the second way of installing the BIOS package, when the operator presses the BIOS package, it is also artificially determined by the eye to judge whether the power TW2093PA 5 1271133 and the $ degree are correct when the BIOS package is pressed down and the motherboard is placed. On the palm of your hand. Therefore, in addition to the problems faced by the first way to install the BIOS package, there are also cases of poor health. For example, if the part of the finger or hand is not evenly applied, the part or line that is in the grip will be damaged, or the board will be bent. When the human body touches, the static electricity, temperature or hand sweat of the household ^ causes damage to the components of the 8 package or the motherboard. As for other applications in which the above two methods are used to mount other types of packages on the circuit board, the above problems are also faced. SUMMARY OF THE INVENTION In view of the above, it is an object of the present invention to provide a jig and method for mounting a package on a circuit board. The use of a mechanical electrical socket to fix the force of the wheel-type 'can prevent the package from being installed on the circuit board to produce a section or contact ^ good' completely eliminates the human error, further preventing the direction from being placed when the package is placed The curvature of the package is caused by the distortion of the package contact pin or the electrical socket of the package is damaged. When the package is placed under the pressure, the package pin is not completely connected, and the electrical socket and the package are placed under the pressure. ΜCauses damage to the electrical socket of the package or the closure, damage to the parts or lines caused by uneven finger or hand, or bending of the motherboard, static electricity caused by human contact or temperature or sweat This can result in damage to the package or parts on the motherboard. Therefore, it can be used in the installation process of various package devices, saving assembly time and avoiding the waste of money caused by damage to parts or finished products. According to the purpose of the present invention, a fixture is provided for smoothly mounting a circuit board. The package has a top surface and a bottom surface, and the bottom mask has a plurality of pins. The board has an electrical socket and a number of jacks that are responsive to these pins. The fixture includes a positioning flat garment. The positioning platform has a plurality of positioning pins, and the positioning pins are correspondingly inserted

TW2093PA 1271133 X These positioning holes allow the board to be positioned on the positioning platform. The surface of the positioning platform has a normal. The pressing device is movably disposed on the positioning platform for being operated by an operator when the pins are slightly inserted into the jacks, and pressing the package in a manner of applying the average force along the normal line to the top surface. The components are such that the pins are accurately and completely inserted into the jacks, and the package is electrically connected to the circuit board through the electrical socket. According to still another object of the present invention, a method of smoothly mounting a package on a circuit board is provided. The package has a top surface and a bottom surface, and the bottom mask has a plurality of pins. The circuit board has an electrical socket and a plurality of positioning holes, and the electrical socket i has a plurality of jacks. In this method, first, a jig is provided, and the jig includes a positioning platform and a pressing device. The positioning platform has a plurality of positioning pins corresponding to the positioning holes, and the surface of the positioning platform has a normal. The pressing device is movably disposed on the positioning platform. Then, the positioning pins are correspondingly inserted into the positioning holes to position the circuit board on the positioning platform, and the electrical socket corresponds to the pressing device. Then, the pins are correspondingly slightly inserted into the jacks, and the top surface corresponds to the pressing device. Φ Next, the pressing device is operated to press the package member along the normal line to apply the force to the top surface, so that the pins are accurately inserted into the jacks completely, and the package is electrically connected to the electrical socket and the circuit board. connection. In addition, the above pressing device comprises a pressing rod, a grip rod and a strut. The pressure-rod is disposed on the positioning platform so as to be movable back and forth along the normal line. One end of the pressing rod is used to keep the distance from the top surface when the pins are slightly inserted into the jacks. The gripping rod is slidably connected to the other end of the pressing rod for being rotated by the operator to move the pressing rod to the positioning platform, so that the end of the pressing rod contacts and applies an average force to the top surface. The brace is placed on an electrical socket to support the lever and the TW2093PA 7 1271133 • Grip. In addition, the pressing device further includes a force output component, and the constant force input component is connected to the pressure bar and the grip bar to define a maximum rotation angle of the grip bar, so that the pressure bar can be properly contacted and applied to the package on average. . Wherein, when the operator releases the grip, the force output member is used to return the strut and the grip to the original position. Wherein, the above-mentioned fixed-force output component comprises a hydraulic component or a torque adjusting component, and the package comprises a basic input and output system (BIOS) package and a flash memory (flash mem〇) And a plastic leadless carrier (pLcc) I package, the circuit board comprising a motherboard and a printed circuit board. The above described objects, features, and advantages of the present invention will become more apparent and understood. FIG. 1 to FIG. 2 ′′ are a cross-sectional view showing a state in which the fixture is prepared to be mounted on a circuit board according to the first embodiment of the present invention, and FIG. 2 is a diagram showing the treatment of the first diagram. Top view of the platform and board. In the first to second embodiments, the jig 1 of the present embodiment is used for smoothly mounting a package n on a circuit board U. In this embodiment, the package η has a top surface 11a and a bottom surface nb, and the bottom surface 11b has a plurality of pins 11c. The circuit board 12 has an electrical socket 12a and a plurality of positioning holes 12b. The electrical socket I2a has a plurality of pairs of sockets i2c that should be used for the pins 1 lc. The fixture 10 includes a positioning platform 13 and a pressing device 14. The positioning platform 1-3 has a plurality of positioning pins i 3 a, and the positioning pins [3 a are correspondingly inserted into the clamping holes 12 b ′ to make the circuit board 12 is positioned on the positioning platform 13. Among them,

TW2093PA 8 1271133 13 Λ surface has a method of 'such as + z direction. The face hole i2b is an angle screw hole, and the four screw holes are correspondingly disposed on the four corners of the circuit board 12. This is determined by the "I ^ &library; ^ 3a is four positioning posts, which are corresponding to the ground S and h the four corners of the surface of the platform 13 . ^ The board 12 itself has a preset screw hole, and the predetermined screw hole can be reduced by 2 bits, and the circuit board 12 can form the positioning hole position without the (4) hole, and the position of the hole can be relative to the circuit. The position of the screw hole of the plate 12 itself is designed. In addition, the positioning bolt is set in a pluggable manner.

On the surface, the operator can arrange the required positioning pin 13a on the surface of the positioning platform according to the screw hole of the circuit board η itself, so that the positioning platform 13 can position different sizes and different screw hole positions. Designed circuit board 12. The pressing device 14 is movably disposed on the positioning platform 13 and is operated by the operator. When the operator pre-sets these pins ^ ^ slightly

When the jacks 12c are inserted and slightly positioned, the pressing device presses the sealing material u in such a manner as to apply an average force to the top surface 11a along the normal line N, so that the pins are accurately inserted into the plugs. The hole 12c, the package u is electrically connected to the circuit board. In the present embodiment, the pressing device 14 includes a pressing rod 14a, a grip i4b, and a strut 14C. The pressing rod 14a is disposed on the clamping platform 13 so as to be movable back and forth along the normal line N. The end of the pressing rod 14a is used for inserting the jacks 12c into the jacks 12c and the top surface Ua. Keep a distance. The gripping rod is connected to the other end of the pressing rod in a movable manner for being rotated by the operator to drive the pressing rod 14a to move toward the positioning platform 13, so that the end of the pressing rod 14a contacts and applies an average force to the top surface 11a. . The stay 14c is disposed on the positioning platform 13 for supporting the presser 14a and the grip 14c.

TW2093PA 9 1271133 In addition, the pressing device 14 further includes a force output member 14d, which is connected to the pressing rod 14a and the grip rod 14c for defining a maximum rotation angle Θ of the grip i4b, so that the pressing rod 14a can The ground contact and the average force is applied to the package 11. Wherein, after the operator releases the grip 14b, the constant force output member 14d is used to return the strut i4a and the grip 14b to the original position. As for how the operator uses the jig 10 to smoothly mount the package u on the circuit board 12, the following is briefly explained. First, as shown in Fig. 1, the operator inserts the positioning check 13a of the positioning platform 13 into the positioning hole 12b of the circuit board 12 to position the circuit board u on the positioning platform 13. Next, the operator places the package u on the electrical socket 12a with the bottom surface 11b facing the circuit board 12, so that the pin mountain of the package U is correspondingly inserted into the socket 12e of the electrical socket 12a. At this time, the package u is positioned slightly on the electrical socket 12a' but the package Η is not yet completely mounted on the circuit board 12. Then, the operator aligns the pressing rod 14a with the top surface Ua of the package u so that the pressing rod Ha is moved in the direction and normal. At this time, the dust bar 2' and the top surface 11a are separated by a distance. ^ Next, the operator holds the grip 14b and applies a force to move the grip (4) so that the grip 14b is along the first! The direction of the arrow 15 of the figure is rotated. At this time, the direction of the arrow 16 of the figure c! moves toward the positioning stage 13 to contact the top surface 11a of the seal 1. During the process of the operator continuing to move the grip 14b, the 214a will press the seal u in a manner of applying an average force to the top surface 11a, and the pin 11c$ of the garment 11 is fully inserted into the jack of the electrical socket 12a. In the middle, the device ^ is electrically connected to the circuit board 12 through the recording socket m. As shown in Fig. 3, the maximum rotation angle of the grip 14b must be driven according to the falling distance of the pressing rod and the moving distance of the pressing member 14a. Set by factors

TW2093PA 1271133 meter. In addition, the constant force output element 14d can define the maximum rotation angle 0 of the grip 14b. When the operator is unable to swing the grip 14b, it indicates that the presser has pressed the assembly 11 into the electrical socket 12a to remind the operation. The person does not need to re-stick the grip 14b' and the operator can release the grip 14b. Then, when the operator can release the grip 14b, the grip lever and the press lever ΐ4& will return to the original position due to the constant force output member 14d. That is to say, the grip (10) and the strut 14a will return to the original position along the arrow 17 and the direction of Fig. 3, respectively, as shown in Fig. 4. Next, the operator can remove the positioning platform 13 The package 11 and the circuit board 12 have been installed. Then, the operator can perform the assembly operation of the other package and the other circuit board by using the jig 1 . The person having ordinary knowledge in the technical field of the embodiment can also It is to be understood that the technology of the embodiment is not limited thereto. For example, the constant force output element ud includes a hydraulic element and a torque adjusting element. In addition, the sealing component includes a basic input output system (BI0S). a package, a flash memory, and a plastic leadless chip carrying a leadless chip carrier (PLCC) package. In addition, the circuit board 12 includes a motherboard and a printed circuit board. The fixture 10 is designed by using the positioning pin 13a and the positioning hole l2b, and the circuit board 12 can be fixed on the positioning platform 13 to achieve the purpose of positioning the circuit board 12. In addition, the implementation The fixture 10 is mechanically judged to apply force. Fix the grip 14c down to the scribe line. If the grip 丨牝 is rotated down a maximum angle of rotation Θ, or the hydraulic device is fixed to apply force, the package will be packaged. The device is pressed into the electrical socket 12a. In this way, it can be avoided when the package is mounted on the circuit board.

TW2093PA 11 1271133 If the product is too small and too large, the problem of excessive or too small force is applied. This prevents the package and the board from being in poor contact due to the application of force, and prevents the damage of (4) and the electrical socket due to the application of force. Therefore, through the treatment of the embodiment 4, the circuit board 12 can be positioned on the positioning platform 13 so that when the package n is mounted on the circuit board 12, the direction of the force can be applied and the force is moderate. So - the package of the packaged circuit board (1) moxibustion will be very correct, avoiding the angle of the money offset, excessive force or too small, to prevent damage to the package or circuit board parts. Embodiment 2 More... FIG. 5 is a flow chart showing a method of smooth mounting = mounting on a circuit board according to Embodiment 2 of the present invention. Referring also to Figures 1-4, the package 11 has a top surface 11a and a bottom surface ub, and the bottom surface iib has a plurality of pins 11c. The circuit board 12 has an electrical socket 12b and a plurality of positioning holes 12c. The private socket 12a has a plurality of pins corresponding to the pins. The jack is 12 inches. First, in step 51, a jig 1 is provided, and the jig 10 includes a positioning platform 13 and a pressing device 14. The positioning platform 13 has a plurality of clamping pins 13a corresponding to the positioning holes 12b, and the surface of the positioning platform 13 has a normal N. The pressing device 14 is movably disposed on the positioning platform 13. Then, in step 52, the positioning pins na are correspondingly inserted into the positioning holes 12b to position the circuit board ι2 on the positioning platform 13, and the electrical socket 12a corresponds to the pressing device 14. Then, in step 53, the pins Uc are correspondingly slightly inserted into the insertion holes 12b, and the top surface 11a corresponds to the pressing means 14. Then, in step 54, the pressing device 14 is operated to press the package 11 in such a manner that the normal N is applied to the surface along the normal line N, so that the pins are aligned.

The TW2093PA 12 1271133 is fully inserted into the jacks 12c, and the package 11 is electrically connected to the circuit board 12 through the electrical socket 12a. The pressing device 14 includes a pressing rod i4a, a holding rod 14b and a strut 14c. The pressing rod 14a is disposed on the positioning platform 13 so as to be movable back and forth along the normal line. One end of the pressing rod 14a is used for inserting the plurality of pins 12c into the jack 12c and the top surface lia. Keep a distance. The grip 14b is slidably connected to the other end of the pressing rod 14a for being rotated by the operator to drive the pressing rod 14a to move toward the positioning platform 13, so that the end of the pressing rod 接触 contacts and the average force is applied to the top. Face 11a. The stay i4c is disposed on the positioning platform 13 for supporting the presser 14a and the grip 14c. In addition, the pressing device 14 further includes a force output member 14, and the cardiac output member 14d is connected to the pressing rod 14a and the grip Uc for defining a maximum rotation angle 0 of the grip 14b so that the pressing rod 14a can be properly contacted. The force is applied to the package 11 on average. When the operator releases the grip 14b, the force taking-out member 14d is used to return the strut H a and the grip 丨 4 b to the original position. Therefore, in the above-described step 54, the step of operating the pressing means 14 is further included as shown in Fig. 6. First, in step 61, the grip is rotated to bring the presser 14a to move the distance to contact the top surface 1U of the package. Then, proceeding to step 62, the rotation of the grip 14b is continued, so that the pressing rod, 14a is pressed with the::: force: the top surface 1U is pressed against the package 11' and the package 11 is inserted two: the second is moved:, straight: These pins UC will accurately _ u ^ , ..., MANN, enter step 63, release the grip 14b, so that the pressure action. The method of assembling the other package and the other circuit board and the method of the method for mounting the package on the circuit board 4 /, using mechanical electrical socket fixing and constant force output,

TW2093PA 13 1271133 .°, avoiding the installation of the package and the components after the board is skewed or poorly contacted, completely eliminating the man-made error, preventing the direction of the package from being distorted when the package is placed and the contact of the package is distorted or The electrical socket of the package is damaged, and the package pin does not completely contact the electrical socket of the package because the package is placed under the pressure of the I. When the package is placed, the amount of downward pressure is too large, resulting in damage to the package or the electrical socket of the package, the uneven force applied by the finger or the hand, resulting in damage to the part or the line or the bending of the motherboard. Damage to the package or board components due to static electricity or temperature or sweating caused by human contact. Therefore, the present embodiment can be used in the installation process of various packages 1 to save assembly time and avoid waste of money caused by damage to parts or finished products. In view of the above, the present invention has been described above in terms of a preferred embodiment, and is not intended to limit the invention, and those skilled in the art can make various changes without departing from the spirit and scope of the invention. And the scope of the present invention is defined by the scope of the appended claims.

TW2093PA 14 1271133 _ [Simple description of the drawings] Fig. 1 is a cross-sectional view showing a state in which the jig is prepared to mount the package on a circuit board according to the first embodiment of the present invention. Fig. 2 is a plan view showing the positioning platform and the circuit board of the jig of Fig. 1. Fig. 3 is a cross-sectional view showing the state in which the grip of Fig. 2 is pulled downward and the plunger is pressed down. Fig. 4 is a cross-sectional view showing the state in which the grip and the pressing lever of Fig. 3 are returned to the original position. Figure 5 is a flow chart showing a method of smoothly mounting a package on a circuit board in accordance with a second embodiment of the present invention. Fig. 6 is a flow chart showing the details of the operation of the pressing device in the lesser step 54 of Fig. 5. [Main component symbol description] 10: Fixture 11: Package φ 11a: Top surface 1 lb: Back surface lie: Pin 12: Circuit board 12a: Electrical socket 12b: Positioning hole 12c: Jack 13: Positioning platform 13 a Positioning inspection TW2093PA 15 1271133 14 : Pressing device 14a: Pressing bar 14b: Grip 14c: Strut 14d: Constant-force output elements 15, 16, 17, 18: Arrow N: Normal to the surface of the positioning platform 0: Grip Maximum angle of rotation

TW2093PA 16

Claims (1)

1271133 X. Patent Application Range··1. A fixture for smoothly mounting a package on a circuit board, the package having a top surface and a bottom surface, the bottom surface having a plurality of pins, the circuit The board has an electrical socket and a plurality of positioning holes. The electrical socket has a plurality of sockets corresponding to the pins. The fixture includes: a positioning platform having a plurality of positioning pins Correspondingly inserting the positioning holes, so that the circuit board is positioned on the positioning platform, the surface of the positioning platform has a normal line; and a pressing device is disposed on the positioning platform in a movable manner for When the pins are slightly inserted into the jacks, they are operated by an operator, and the pressing device presses the package in such a manner as to apply an average force along the normal line to the top surface, so that the pins are accurately and completely The jacks are inserted, and the package is electrically connected to the circuit board through the electrical socket. The jig of claim 1, wherein the pressing device comprises: a pressing cup disposed at the positioning opening in a manner of being movable back and forth along the normal line, wherein one end of the pressing rod is used for the The pin is slightly inserted into the jacks to maintain a distance from the top surface; the grip bar is swingably connected to the other end of the pressing rod for being rotated by the operator to drive the mast to the The positioning platform moves, so that the pressing force of the pressing rod is applied to the surface and the support, and is disposed on the positioning platform for supporting the pressing rod and the talent 0, and further includes the claim 2 of the patent scope. a fixture, wherein the pressing device is a force output member, and the pressing rod and the grip are connected to define a rotation angle of the grip TW2093PA 17 1271133 so that the pressing rod can be properly contacted and the average force is applied to you~ After the operator releases the grip, the force output member is used to return the pressure rod and the grip to the original position. A jig as claimed in claim 3, wherein the fixed-force wheel-out device comprises a hydraulic component. 5. The jig of claim 3, wherein the fixed force comprises a torque adjusting component. 6. Please ask for the scope of patents! The fixture of the item, wherein the plurality of positioning holes are formed on the four boards of the circuit board. 7. The jig of claim 6, wherein the positioning is detected as four positioning posts, and the four positioning posts are correspondingly disposed on four corners of the (four) face. The jig of the invention is the jig of the invention, wherein the basic input output system (BIOS) is a jig as claimed in claim i, wherein The package includes a flash memory (fiashmem〇ry). The jig according to the first item of the patent, wherein the package package s is a lead-free wafer carrier (plastic (10) package. P human u. as claimed in claim 1 of the patent scope The circuit board includes a motherboard and a printed circuit board. 2-2--Smooth mounting-package on the circuit board, the package has a top φ and a bottom surface a plurality of pins, the electric TW2093PA 18 1271133 circuit board has an electrical socket and a plurality of sockets, the electrical socket has a plurality of jacks corresponding to the pins, wherein the method comprises: providing a fixture, the The fixture includes a positioning platform having a plurality of positioning pins corresponding to the positioning holes, the surface of the positioning platform has a normal line, and a pressing device disposed on the positioning platform in an movable manner Inserting the positioning pins correspondingly into the positioning holes to position the circuit board on the clamping platform, the electrical socket corresponding to the pressing device; inserting the pins correspondingly into the insertion slots a hole corresponding to the pressing device; and an operation of the "heling device to press the package in a manner to apply an average force to the top surface along the normal line" such that the pins are accurately inserted completely The jacks are electrically connected to the circuit board through the electrical socket. The method of claim 12, wherein the pressing device is provided with a pressing rod disposed on the positioning, the mouth, and movable along the normal line, the pressing rod One end is used for inserting the pins slightly to maintain a distance from the top surface; (4) being swingably connected to the other end of the pressing rod for rotating the pressing rod to The positioning platform moves such that the material of the rod contacts and applies an average force to the top surface; and the mast is abutted; a strut is disposed on the positioning platform, and the pressing rod and the grip are operated The step of the device further includes: rotating the grip bar to drive the pressure bar to move the distance to contact the top TW2093PA 19 1271133 face; and -p/k performance to rotate the grip bar so that the press bar applies an average force The top surface mode compresses the 4 pieces of the package' and moves to the positioning platform in synchronization with the package until the pins are accurately inserted into the sockets. The method of claim 13, wherein the pressing device further comprises: a first force output member that connects the pressing rod and the grip to define a maximum rotation angle of the grip cup, such that The pressing rod can be properly contacted and applied to the package on average; wherein the force output member is used to return the pressing rod and the holding rod to the original position when the holding rod is released. The method of claim 14, wherein the constant force output element comprises a hydraulic component. The method of claim 14, wherein the force output 70 comprises a torque adjustment component. The method of claim 12, wherein the positioning holes are four screw holes, and the four screw holes are correspondingly disposed on four corners of the circuit board. The method of claim 17, wherein the positioning members are four positioning posts, and the four positioning posts are correspondingly disposed on four corners of the surface of the positioning platform. 19. The method of claim 12, wherein the package comprises a basic input output system (BI〇S) package, a flash memory (flash memory) And a plastic leadless chip carrier (Plastic leadless chip carrier (PLCC) package. 20. The method of claim 12, wherein the circuit board TW2093PA 20 1271133 comprises a motherboard and a printed circuit board. TW2093PA 21