CN101997256B - Needling device of printed circuit board - Google Patents
Needling device of printed circuit board Download PDFInfo
- Publication number
- CN101997256B CN101997256B CN2009101946132A CN200910194613A CN101997256B CN 101997256 B CN101997256 B CN 101997256B CN 2009101946132 A CN2009101946132 A CN 2009101946132A CN 200910194613 A CN200910194613 A CN 200910194613A CN 101997256 B CN101997256 B CN 101997256B
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- China
- Prior art keywords
- pin
- printed substrate
- pedestal
- fixing
- fixed pedestal
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Abstract
The invention provides a needling device of a printed circuit board, comprising a fixed base, a fixed pedestal of the printed circuit board, a pin needle fixed absorbing pedestal, a movable rod connecting piece and a pressure lever, wherein the fixed pedestal of the printed circuit board is arranged on the fixed base; the pin needle fixed absorbing pedestal is positioned above the fixed pedestal of the printed circuit board and keeps a certain distance and is movably connected with the pressure lever by the movable connecting piece; and one end of the pressure lever is connected with the fixed base. The needling device of the printed circuit board realizes the needling treatment on the printed circuit board, saves time and force, is convenient and quick and can ensure favorable quality of the needling simultaneously.
Description
Technical field
The present invention relates to field of semiconductor manufacture, and be particularly related to a kind of printed substrate and plant needle device.
Background technology
Along with the raising of IC design level and technology, the integrated circuit scale is increasing, and chip design scale and design complexities also are increased sharply, and the pin number of IC chip is also more and more.These IC chips need carry out the test of multiple working procedure when encapsulation, so that the performance of detection chip for example is to carry out static discharge (Electro Static Discharge, ESD) test.The packaging and testing board that existing laboratory can provide at most only has 64 pins, yet the encapsulation bonding wire quantity of some IC chip reaches more than 100, therefore can not satisfy such demand at all.
In the prior art; The encapsulation of employing chip on board (Chip On Board, bonding technology COB) satisfies client's demand, the chip on board encapsulation; It is one of bare chip mounting technology; The IC chip handing-over is mounted on the printed substrate, and being electrically connected with the lead-in wire sewing method of chip and substrate realizes, and cover to guarantee reliability with resin.Yet carry out ESD test, also need use special printed substrate to plant pin equipment or instrument and chip is carried out printed substrate plant pin and handle.
In the laboratory, generally do not have this and type plant pin equipment or instrument, at present only can come to plant pin, therefore need to spend a large amount of manpowers, and the quality of planting pin also can not get good assurance, the easy flexural deformation of pin through free-hand mode to printed substrate.
Summary of the invention
The present invention proposes a kind of printed substrate and plants needle device, realizes the pin of planting of printed substrate is handled, and is time saving and energy saving convenient and swift, and the quality that can guarantee to plant pin simultaneously is good.
In order to achieve the above object; The present invention proposes a kind of printed substrate and plants needle device; Comprise: firm banking, printed substrate fixed pedestal, fixing pedestal, active connection and the depression bar drawn of pin pin; Wherein said printed substrate fixed pedestal is arranged on the firm banking; The fixing pedestal of drawing of said pin pin is positioned at printed substrate fixed pedestal top and keeps certain distance, and the fixing pedestal position of drawing of said pin pin flexibly connects through active connection and depression bar, and said depression bar one end is connected with said firm banking.
Optional, said printed substrate fixed pedestal zone line has groove, and a plurality of perforates evenly distribute around the groove.
Optional, the fixing a plurality of circular holes that evenly distribute all around of drawing the pedestal zone line of said pin pin, said a plurality of circular holes are corresponding with a plurality of perforates of said printed substrate fixed pedestal, and the circular hole bottom communicates.
Optional, first location hole is arranged around the said printed substrate fixed pedestal, have and corresponding second location hole of first location hole around the fixing absorption of the pin pin pedestal.
Optional, first location hole of said printed substrate fixed pedestal is provided with pilot pin, and the fixing pedestal of drawing of said pin pin is arranged in said pilot pin through second location hole.
Optional, being arranged with spring on the said pilot pin, the fixing pedestal of drawing of said pin pin is through moving up and down on the said pilot pin of acting on of depression bar and spring.
The printed substrate that the present invention proposes is planted needle device; Utilize depression bar that power is transmitted to the fixing pedestal of drawing of pin pin through active connection, again the pin pin is pressed in the printed substrate on the printed substrate fixed pedestal, realize the pin of planting of printed substrate is handled; Improved and planted pin efficient; And convenient and swift, effectively protected the lead-in wire in bonding zone, the quality that can guarantee to plant pin simultaneously is good.
Description of drawings
Shown in Figure 1ly plant needle device structure side intention for the printed substrate of preferred embodiment of the present invention.
Shown in Figure 2ly plant the needle device structural front view for the printed substrate of preferred embodiment of the present invention.
Shown in Figure 3 for the printed substrate fixed pedestal sketch map of preferred embodiment of the present invention.
The fixing pedestal sketch map of drawing of pin pin for preferred embodiment of the present invention shown in Figure 4.
Embodiment
In order more to understand technology contents of the present invention, special act specific embodiment also cooperates institute's accompanying drawing explanation as follows.
Please refer to Fig. 1 and Fig. 2, shown in Figure 1ly plant needle device structure side intention for the printed substrate of preferred embodiment of the present invention, shown in Figure 2ly plant the needle device structural front view for the printed substrate of preferred embodiment of the present invention.The present invention proposes a kind of printed substrate and plants needle device; Comprise: firm banking 500, printed substrate fixed pedestal 100, fixing pedestal 200, active connection 300 and the depression bar 400 drawn of pin pin; Wherein said printed substrate fixed pedestal 100 is arranged on the firm banking 500; The fixing pedestal 200 of drawing of said pin pin is positioned at printed substrate fixed pedestal 100 tops and keeps certain distance; The fixing pedestal 200 of drawing of said pin pin flexibly connects through active connection 300 and depression bar 400, and said depression bar 400 1 ends are connected with said firm banking 500.
Please first location hole 130 be arranged around the said printed substrate fixed pedestal 100 simultaneously with reference to figure 1-Fig. 4, have and first location hole, 130 corresponding second location holes 230 around the fixing absorption of the pin pin pedestal 200.First location hole 130 of said printed substrate fixed pedestal 100 is provided with pilot pin 700, and the fixing pedestal 200 of drawing of said pin pin is arranged in said pilot pin 700 through second location hole 230.Be arranged with spring 710 on the said pilot pin 700, the fixing pedestal 200 of drawing of said pin pin moves up and down through depression bar 400 and acting on the said pilot pin 700 of spring 710.
Please refer to Fig. 3 and Fig. 4 again, shown in Figure 3ly be the printed substrate fixed pedestal sketch map of preferred embodiment of the present invention, the fixing pedestal sketch map of drawing of the pin pin for preferred embodiment of the present invention shown in Figure 4.Said printed substrate fixed pedestal 100 zone lines have groove 110, are used to place printed substrate, and a plurality of perforates 120 evenly distribute around the groove 110.Said pin pin is fixing draw pedestal 200 zone lines 210 around a plurality of circular holes 220 that evenly distribute, said a plurality of circular holes 220 are corresponding with a plurality of perforates 120 of said printed substrate fixed pedestal 100, and circular hole 220 bottoms communicate, and are used to place the pin pin.
In use; At first that bonding is good printed substrate is placed upside down on the groove 110 of printed substrate fixed pedestal 100 zone lines; Promptly need plant one of pin processing and face up, equally distributed a plurality of perforates 120 match with printed substrate around the groove 110.Through vacuum plant 600 the pin pin is drawn to fixing a plurality of circular holes 220 inside of drawing pedestal 200 of pin pin; Circular hole 220 bottoms communicate and are convenient to vacuum plant 600 absorption pin pins; Through pilot pin 700 the fixing pedestal 200 of drawing of printed substrate fixed pedestal 100 and pin pin is aimed at then, so that fixing pin pin and the printed substrate pin hole of drawing on the pedestal 200 on the printed substrate fixed pedestal 100 of pin pin is that a plurality of perforate 120 is corresponding.Then planting pin handles; By moulded rod 400 power is transmitted to the fixing pedestal 200 of drawing of pin pin through active connection 300; Thereby the pin pin is pressed in the printed substrate on the printed substrate fixed pedestal 100, plants the pin fixing pedestal 200 of drawing of back pin pin that disposes and under the effect of pilot pin 700 upper springs 710, recover initial position.
In sum, the printed substrate that the present invention proposes is planted needle device, utilizes depression bar that power is transmitted to the fixing pedestal of drawing of pin pin through active connection; Again the pin pin is pressed in the printed substrate on the printed substrate fixed pedestal; Realization is handled the pin of planting of printed substrate, and improved and planted pin efficient, and convenient and swift; Effectively protected the lead-in wire in bonding zone, the quality that can guarantee to plant pin simultaneously is good.
Though the present invention discloses as above with preferred embodiment, so it is not in order to limit the present invention.Have common knowledge the knowledgeable in the technical field under the present invention, do not breaking away from the spirit and scope of the present invention, when doing various changes and retouching.Therefore, protection scope of the present invention is as the criterion when looking claims person of defining.
Claims (4)
1. a printed substrate is planted needle device; It is characterized in that; Comprise: firm banking, printed substrate fixed pedestal, fixing pedestal, active connection and the depression bar drawn of pin pin; Wherein said printed substrate fixed pedestal is arranged on the firm banking; The fixing pedestal of drawing of said pin pin is positioned at printed substrate fixed pedestal top and keeps certain distance, and the fixing pedestal position of drawing of said pin pin flexibly connects through active connection and depression bar, and said depression bar one end is connected with said firm banking; First location hole is arranged around the said printed substrate fixed pedestal; Have and corresponding second location hole of first location hole around the fixing absorption of the pin pin pedestal, first location hole of said printed substrate fixed pedestal is provided with pilot pin, and the fixing pedestal of drawing of said pin pin is arranged in said pilot pin through second location hole.
2. printed substrate according to claim 1 is planted needle device, it is characterized in that, said printed substrate fixed pedestal zone line has groove, and a plurality of perforates evenly distribute around the groove.
3. printed substrate according to claim 2 is planted needle device; It is characterized in that; The fixing a plurality of circular holes that evenly distribute all around of drawing the pedestal zone line of said pin pin, said a plurality of circular holes are corresponding with a plurality of perforates of said printed substrate fixed pedestal, and the circular hole bottom communicates.
4. printed substrate according to claim 1 is planted needle device, it is characterized in that, is arranged with spring on the said pilot pin, and the fixing pedestal of drawing of said pin pin is through moving up and down on the said pilot pin of acting on of depression bar and spring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101946132A CN101997256B (en) | 2009-08-26 | 2009-08-26 | Needling device of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101946132A CN101997256B (en) | 2009-08-26 | 2009-08-26 | Needling device of printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101997256A CN101997256A (en) | 2011-03-30 |
| CN101997256B true CN101997256B (en) | 2012-11-14 |
Family
ID=43787039
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009101946132A Active CN101997256B (en) | 2009-08-26 | 2009-08-26 | Needling device of printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101997256B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108666843A (en) * | 2018-05-09 | 2018-10-16 | 苏州东钜精密机械有限公司 | A kind of jockey of disc type wiring board pin type connecting seat |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106159581B (en) * | 2015-04-23 | 2018-11-27 | 中芯国际集成电路制造(上海)有限公司 | A kind of connecting device for line |
| CN108919093B (en) * | 2018-07-10 | 2021-06-29 | 郑州云海信息技术有限公司 | Method, device, equipment and storage medium for ICT (information communication technology) pin implantation in PCB (printed circuit board) |
| CN111432573B (en) * | 2020-05-06 | 2021-07-30 | 上海世禹精密机械有限公司 | Circuit board needle implanting device and method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1236296A (en) * | 1998-05-15 | 1999-11-24 | 法玛通国际连接器公司 | Method and device for locating printed circuit board on a punching machine |
| JP3298302B2 (en) * | 1994-04-29 | 2002-07-02 | イビデン株式会社 | Positioning method and apparatus |
| TW200644751A (en) * | 2005-06-03 | 2006-12-16 | Via Tech Inc | Jig device for assembling package on circuit board and method thereof |
-
2009
- 2009-08-26 CN CN2009101946132A patent/CN101997256B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3298302B2 (en) * | 1994-04-29 | 2002-07-02 | イビデン株式会社 | Positioning method and apparatus |
| CN1236296A (en) * | 1998-05-15 | 1999-11-24 | 法玛通国际连接器公司 | Method and device for locating printed circuit board on a punching machine |
| TW200644751A (en) * | 2005-06-03 | 2006-12-16 | Via Tech Inc | Jig device for assembling package on circuit board and method thereof |
Non-Patent Citations (1)
| Title |
|---|
| JP特开2002-189048A 2002.07.05 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108666843A (en) * | 2018-05-09 | 2018-10-16 | 苏州东钜精密机械有限公司 | A kind of jockey of disc type wiring board pin type connecting seat |
| CN108666843B (en) * | 2018-05-09 | 2019-05-31 | 苏州东钜精密机械有限公司 | A kind of jockey of disc type wiring board pin type attachment base |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101997256A (en) | 2011-03-30 |
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