TWI235625B - Pin packaging method for pin grid device - Google Patents

Abstract

The present invention relates to a pin packaging method for pin grid device, which includes the following steps: first fixing the pins on an auxiliary fixture; forming the welding pad group on a substrate; coating adhesive on each welding pad; employing the auxiliary fixture to align the pins with the welding pad on the substrate with adhesive coated, so each pin could be contacted with the corresponding welding pad; then, heating the substrate with the auxiliary fixture assembly by the welding oven, so the pins could be fixed on the welding pad by the physical and chemical reaction of the adhesive; and, removing the auxiliary fixture after completion of these above-mentioned steps. The design according to the present invention can complete the assembly for different pin grid array devices with improved pin packaging yield, for reducing the cost and meeting the mass production requirement.

Description

1235625 V. Description of the Invention (/) The present invention relates to a pin packaging method for a variety of pin gate components. Due to the reliable and rapid process of the knives, the pin package array pin packaging technology discussed has the advantages of two production capacities and low cost. Press, the pin gate array element (PGA, Pin Grid Array) is firstly planted with most pins (Pin) in the form of an array on the substrate, and then the chip is packaged = the pinned substrate. The integrated circuit formed by the foregoing method can be inserted into a socket on the motherboard through a pin in the form of a basin array to achieve the purpose of current or signal transmission. Due to the characteristics of easy combination and separation between the needle gate array element and the socket, it is very convenient to install, repair, replace, or class. The foregoing pin gate array element pin packaging method includes: (1) a substrate manufacturing step, which forms a circuit on the substrate and a single or multiple groups of pad groups or hole group units to be connected to the circuit. (1) The coating step is to apply an adhesive medium to each pad group or hole group on the aforementioned substrate that needs to be connected with telecommunications or current. (3) The step of planting the pins is to insert the pins one by one by using a mechanical hand into the preset holes on the substrate, wherein the holes have been coated with an adhesive medium. (4) The heating step is to heat the substrate with a soldering furnace to make the adhesive medium in each hole chemically change, so that the pins are fixed in each hole. In the foregoing steps, the cloth-stitching step is performed automatically by the robot. Although the robot's movement speed is very high, the operation method of pinching the needles and inserting them into the hole eight is very inefficient and cannot effectively improve the operation line. Production 1235625 A7 V. Description of the invention (>) Printed by the consumer agency of the Ministry of Intellectual Property, it can be seen that the implementation of the conventional method of planting the pins with the needle brake element has a low implementation efficiency, which needs to be further reviewed and the need for an effective solution. Therefore, the main object of the present invention is to provide a pin-implanting package that uses an auxiliary jig to transfer all pins to a substrate at the same time to improve work efficiency. A main technical method adopted to achieve the foregoing objective is to make the foregoing method include: a substrate The manufacturing step is to form a circuit for product demand and a pad group or a hole group connected to the circuit respectively on a substrate. A coating step is to apply an adhesive medium to each pad group or hole group on the substrate. In order to prepare for subsequent processes to connect with various pins; a cloth-planting pin step is to first fix the pins on the auxiliary jig, and the arrangement of each pin on the auxiliary jig is also the same form, and then use multi-sensitivity or a single auxiliary rule It is aligned to the substrate, and then the pins temporarily fixed on the auxiliary fixture are contacted with the corresponding solder pad groups or hole groups that have been coated with an adhesive medium. A heating step is to align the substrate and the pins on the substrate. After heating, the physical and chemical changes of the adhesive medium are generated, and each pin is then fixed in the pad group or hole group on the substrate, and then removed To help fixture; through the use of the simultaneous transfer of the majority of the auxiliary jig pins to the substrate, and in fixed manner through the stitches of the fabric implant after heating, can increase capacity and reduce costs. The pins, the pads of the pad group, and the holes of the hole group are arranged in a matrix form. G's Zhang scale is applicable _ home standard-specification ⑵Q χ see the public love page order 1235625 A7 V. Description of the invention ()) In the aforementioned substrate manufacturing steps, the visual disc 1 is recognized as bismuth. Set the number of morning or evening on the substrate:!: Dry pad or hole group. The aforementioned steps of planting cloth pins are beneficial to a certain board. "Use the Xi group or an early auxiliary fixture to align the aforementioned cloth-planting stitches. _, A sk μ π ν" There is a positioning means' to make the auxiliary > mouthpiece and the substrate piece accurately aligned. The aforementioned heating step It is used to heat the substrate and the pins on it by welding. The panel reviewer can further understand the specific process, characteristics and other purposes of the present invention. Part: The first picture: the schematic diagram of the fixed wire structure with poor thermal design. The second picture: the schematic diagram of the improved positioning structure of the size thermal design. The third picture: the pairing of the auxiliary fixture unit and the substrate module. Schematic diagram of the structure. Figure 4: Schematic diagram of the pairing of assisted pure unitization and substrate unitization. Figure 5: Schematic diagram of the pairing of auxiliary fixture unitization and substrate unitization. Figure 6: Positioning pin (column) ) Positioning sectional view on the auxiliary jig. It is a positioning sectional view of the positioning pin (column) on the base plate. It is a positioning cross-section view of the positioning clamp mechanism on the auxiliary jig. It is a cross-section of the cross-shaped pin embodiment. Illustration. A cross-sectional view of a substrate with a plug-in adhesive pin tightly mounted package. (Please read the precautions on the back before filling out this page.) -------- Order --------- Line · Intellectual Property of the Ministry of Economic Affairs 7th, 8th, 9th, 10th, 1235625 (II) Figure No .: (10) Substrate (1 1 0) Pad (13) Positioning pin (21) Hole slot (2 2) 0) Joining part (2 4) Positioning hole (2 0 5) Abutting part (8 0) Base plate (9 0) Needle script invention needle gate A7 B7 V. Description of the invention (f) Figure 11: System board insert Sectional view of human-type adhesive pin loose placement package (11) Pad group (1 2) Positioning hole (2 0) Auxiliary fixture (2 2) Pin (2 3) Positioning post (2 5) Positioning piece (2 6) The hole and groove group (8 1) and the hole (91) joint component pin packaging process include: a substrate manufacturing step, which is connected to a group of solder pads or holes on the substrate connected to the line; the design requirements for packaging are divided into a single Or most of the group A. On the cloth = Step: attached to the aforementioned substrate: each Tan pad group or hole group coating ", for subsequent processes to connect with various pins; One step of planting cloth pins, first fix the needle to Auxiliary fixture The arrangement of the needles on the auxiliary jig is also the same (such as a matrix). After that, more than two groups or single-auxiliary jigs are aligned on the substrate, and then the temporarily fixed pins on the auxiliary jig are connected with the already fixed pins. The corresponding solder pad groups or hole groups coated with the adhesive medium are in contact with each other;-the heating step is to use a soldering furnace to heat the substrate, needles, and auxiliary fixtures in paper form.

-------- 1 ---------. Μφ— (Please read the precautions on the back before filling this page) 1235625 A7 B7

Order --------- Line 1 (Please read the precautions on the back before filling out this page): Combine the '俟 adhesive medium to produce physical and chemical changes, and each pin will complete the bonding pad set on the substrate Group or hole group, and then remove the auxiliary jig. In the specific embodiment, as shown in the first figure, it is mainly on the surface of a substrate (10) that there are a large number of pad groups or slot groups arranged in a matrix, = Positioning holes (12) are formed at appropriate positions. In this embodiment, a plurality of pad groups (11) are provided on the system and the second inversion (1Q), and positioning holes (12) are formed at four corners of the substrate (0). ; Each of the aforementioned pad groups (1 1) is composed of a plurality of pads (1 1 0), and each welding pad (work i 0) is coated with an adhesive medium, respectively. = Auxiliary jigs for transferring pins (20) are provided with multiple groups of slotted holes :: 6), each slotted hole group (26) is composed of a majority corresponding to the front = (ii〇) w slotted hole (21) Furthermore, the auxiliary jigs (20) are provided with positioning posts (23) at the four corners, and each positioning post (23) is received in the positioning hole (12 posts) on the substrate (10) (23). When using the seven-mentioned structure to perform the cloth implantation operation, the pins (2 2) are first inserted and fixed in the hole 2 (21) of the auxiliary fixture (20), and the method of fixing the pins 2 is transmitted. The tool (20) is placed on the vibrating machine on the reverse side. 'Each pin (2 2) is inserted into the hole (2 1) towel by vibration', and then it is turned over to the base plate (丄 〇) to perform the pin (2f). Transfer. When the auxiliary fixture (20) is connected to the base plate (10), the upper positioning post (2 3) will be correspondingly inserted into the positioning hole (1 2) so that the auxiliary fixture (2Q) and the base plate (iq) Accurate positioning. 俟 After the connection is completed, heating is performed, and 7 paper rulers are welded on the substrate (1 0). 1235625 A7 B7

The adhesive medium on the surface of the pad (1 1 Ο) undergoes a chemical change after heating, and then the auxiliary mold (20) is used to correspond to the physical effect of pressing, so that the pins (2 2) can be fixed to the pad (χ 工 〇). , And then remove the auxiliary jig (20). In order to consider the different thermal expansion coefficients of the substrate and the auxiliary fixture, the degree of thermal expansion generated during the heating step is also different. Therefore, when pairing the aforementioned substrate with different auxiliary fixtures, it is necessary to consider their positioning methods one by one: As shown in the second figure, the schematic diagram of the base plate (丄 〇) and the auxiliary jig (2 〇) before and during heating in a coupled state, wherein the positioning post (2 3) has been extended into the outer substrate (i 〇). In the positioning hole (i 2), there is still a certain gap between each other. Although the same pins (2 2) are inserted and fixed = the hole grooves (2 1) of the auxiliary jig (20), they still retain a certain amount of each other. As shown in the second figure a, when the substrate (丄 〇) and the auxiliary fixture (20) pass through the reflow furnace at the same time, although the thermal expansion will cause the size variation, then the positioning column (2 3) and positioning There is still a gap between the hole (1 2) and the pin (2 2) and the hole groove (2 1), which can ensure that the substrate (丄 〇) and the auxiliary jig (20) can be smoothly separated at the end, and the substrate (丄 〇) and Auxiliary jigs (20) can avoid any warping caused by size expansion and contraction restrictions At the same time, pins (22) have switched fixed on the substrate (work 0), and reaches the required size. In terms of the pairing relationship between the substrate and the auxiliary fixture, the following methods can be adopted: '(1) Fully unitized and modularized substrate: If the pole is two circles, the auxiliary fixture (2 0) is divided For a small area (only one set of this paper size is applicable to Chinese National Standard (CNS) A4 specifications (21G X 297 public love (please read the precautions on the back before filling this page)) Order ------- --Line i [235625 V. Description of the invention (7) The board (and 1 base. The boarder 10) still remains a large area (multiple groups of groups), (Please read the precautions on the back before filling this page) m "and each unit on the auxiliary jig (20) (with the group as the early position) to divide and locate the material, which is used to place the auxiliary substrate (10) on the oblique foot center: U ◦隹 保 / 、 The upper pin can be accurately connected to the solder pad or the hole ^ Description = set a number of auxiliary fixtures with single-hole slot group (26) 20), after the needle has been placed and fixed to each single_ = Up '? Under the shape, the positioning post (23) is used to face the countersunk holes (1 2), corresponding to the same number of pad groups (worker base T: I: · group), so that each pin (2 2) can be combined with all Corresponding welding 11) The surface of the Zhongya pad (11◦) has been coated with an adhesive medium (not shown) to keep in contact with the gap between the bit hole and the positioning post under the influence of the dimensional thermal expansion, and the solder group (U) in the substrate module Under the unit distance, a heating step is performed to allow the adhesive medium f to pass through the chemical and physical reaction to 'fix the needle to the designed pad group (ii) and evacuate the auxiliary fixture to complete the packaging process. (2) Qian is shown in the fourth figure [2, (1 ◦) is divided into smaller areas (group of pads), while the auxiliary rule (20) still maintains a large area (groups of holes and grooves) , 〇) There are positioning measures on the auxiliary fixture. Use: = fixture (2 0) to fix on the substrate (i 〇), and ensure that the pins on it can contact the pads or holes accurately. The aforementioned design will The auxiliary jig (20) module with multiple groups of holes and grooves (2 6) is fixed to each single hole and groove (2α) α when the needle has been put through; and the paper size applies to the Chinese National Standard (CNS) A4 Specification ⑵Q χ 297 public love) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 123562 5 A7 ----- * ------------ 5. Description of the invention (&) In the shape of "丄", use all the positioning pins (2 3) on the module to align and insert it into the base plate ( The positioning holes (12) on 10) are equipped with multiple sets of matrix unit auxiliary modules to correspond to the same number of single welding pad groups (1 1) substrates (1 0), so that each pin (2 2) can be combined with The surface of the pads (11) in the corresponding pad group (11) has been coated with an adhesive medium (not shown in the figure) to maintain the contact state, and the gap between the positioning hole and the positioning post is reserved under the influence of the dimensional thermal expansion. Under the cell and slot group (2 6) unit distance in the auxiliary fixture module, a heating step is performed to allow the adhesive medium to pass through the chemical and physical reaction, and the needle is fixed to the designed pad group (i 1) position, and the auxiliary fixture is finally evacuated smoothly. Complete the packaging process. (Two) all through help! 1 star and substrate Qin Yuanpu: Jiagan Gang, the substrate (10) and the auxiliary fixture (20) are divided into smaller areas (a group of welding pads), and the substrate (tool 0) and the auxiliary fixture are used. Positioning measures are provided on the tool (20), and the auxiliary jig (20) is fixed on the substrate (丄 〇), and the pins on it can be accurately contacted with the pads or holes. In the aforementioned design, the auxiliary jigs (20) of the single-hole slot group (2 6) are fixed on the single-hole slots (21) after the pins (22) have been put through and fixed in the shape of i. All positioning posts (2 3) are aligned and inserted = positioning holes (丄 2) on the base plate (10), corresponding to the base plate (10) having only a single known group (11), so that each pin (22) It can keep contact with the dry (1 1 Q) of the corresponding welding pad group (1 1) which has been coated with an adhesive medium (not shown) on the surface, and the required gap is reserved under the influence of dimensional thermal expansion. Locate the hole (12), heat the step to make the adhesive medium pass through the chemical and physical reaction, and then fix the needle to the design (please read the note on the back? Matters before filling this page)

--------- Line I 10! 235625 V. Description of the invention (Position of pad group (1 1), and finally evacuated the auxiliary fixture successfully to complete the sealing process. As for the positioning between the aforementioned substrate and the auxiliary fixture Measures can be taken in several ways:-Order the following (a) two ways of positioning with positioning pins: • As described in Section •, tied to the auxiliary fixture (20) outside the setting post ( 2 3) The figure is provided with positioning holes (12) at corresponding positions on the base plate (10). When the auxiliary fixture (20) is moved onto the base plate (丄 〇) and lowered, the auxiliary: fixture (2 0) The positioning post (2 3) will penetrate into the base plate (the positioning hole (1 2) on the mouth of the mouth) for positioning. The aforementioned positioning post (2 3) is set on the periphery of the auxiliary fixture (20), = on the base plate ( The corresponding position on 1 0) is provided with a positioning hole (12) that has taken into account the size of the thermal expansion _ J to reserve the required clearance. When the auxiliary rule:) moves to the substrate (1 Q) to load and lower, the auxiliary jig ( The field positioning post (2 3) will complete the positioning corresponding to the positioning hole (1 2) penetrating into the substrate (10), and at the same time, it is fixed in the auxiliary jig (20) and the groove (2 1) presents a "丄" shape of Pin (2 2), which is printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs == (2 2 0) will maintain contact with the pads (ii 〇) on the substrate (1 〇) that have been coated with adhesive (not shown) status. Yan) Zhao, as shown in the seventh picture, is attached to the auxiliary fixture (20), and has a positioning hole (24), and a prostitute post (2 3) is formed on the relative position of the base plate (1 Q). The aforementioned design The positioning post (2 3) is set on the substrate (10), and the corresponding position on the auxiliary fixture (20) is provided with a corresponding size on the paper of the size of the thermal expansion paper. Han family standard (CNSM4 specification (21G X 297 male shame " 7 1235625 A7

-I- I-(Please read the precautions on the back before filling this page) Order --------- Line ·! Reserve the required gap under the influence of swelling ⑴ Move to the substrate (1 2 =? 4) , When the auxiliary jig (: the positioning column (")) will correspond to wear = ::: = and at the same time fixed to the pad (u〇) of the auxiliary jig (2.::⑴.) To maintain contact. State. Figure 8 (= This positioning measure is not attached to the sides of the auxiliary fixture (20) as shown in the figure and figure ^ The position piece is used to reliably reach the base U0). ^ The aforementioned design is based on the auxiliary fixture. (2Q) Set the positioning pieces on each side to reliably abut the edge of the substrate (10), and the clearance between the base edge and the abutment portion (25) must be reserved under the influence of dimensional thermal expansion. When the tool (20) is moved to the substrate (1 0) and aligned and lowered, the = part (2 50) on the auxiliary rule 4 (2 0) will correspondingly limit the edge of the substrate (work 0) to complete the positioning. At the same time, it is fixed to the slot (2 U) of the auxiliary jig (2 U: the pin (2 2) in the shape of "丄", and the joint (2 2) at the lower end will be coated and adhered to the substrate (10). The pad (1 1 0) of the medium (not shown) is maintained Contact status. —Further, 'the present invention can also use different shapes of needles for packaging, and its possible embodiments can be as follows: (1) Advancement method: Pins (2 2) 12 3 张 Zhang scale suitable financial_ Home standard (CNSM4 specification ⑽X 297 Male 1235625 A7 B7 V. Description of the invention) As shown in the third figure, it is an inverted T-shaped joint (2 2 0). The end of the joint is formed with a disc-shaped inner part. The position corresponds to the welding pad (110) on the substrate (i 2 〇) fixed to the auxiliary jig and the pad () 7 on the substrate (10), for (2): should be touched, the pin As shown in the ninth figure (the joint portion of the Chuan aperture (= is matched with the substrate (80), the cross section of the hole can have any shape, the joint; the horizontal position of the joint (9 1) corresponds to the substrate (8 0) The hole (81) on the inner plate (80) of the hole auxiliary fixture on the upper side is provided to correspond to the basic toilet-rq 1, and the joint (9 1) and the ceremony hole (8 1) are closely fitted a U 1) Loose fit (such as the eleventh shogun · Jinbu), or。 均可 can be packaged in this way and using different shapes of pins The package is not as good as the package; gauge: to be possible: pins for thin "shape = ω can be applied to ί'ΐηΊ feet (90) with shoulders" gauge board (80) hole shape and size can be set according to (q 1 ^ ^ 求, for the true joint part = 1) weight any shape, the position where the joint part (91) is fixed on the auxiliary rule is corresponding to the hole (δι) on the substrate (80), and : The way to enter these holes is either the tightly inserted state (such as the eleventh) or the loose state of the substrate (such as the tenth-not shown in the figure). As long as the substrate and the The effect of the thermal expansion of the dimensions between the auxiliary fixtures {__ 13 This, and '' Zhang scales are applicable to China's national standards (CNs) ^ specifications ⑵ X Xiao Gongfu 1235625

2. The pairing relationship or positioning of different substrates and auxiliary fixtures. 1 Transfer knows that through the use of auxiliary fixtures, a large number of thermal expansion shadows can be obtained, and the amount of Αθ between the substrate and the auxiliary fixture is overcome. Different pairing and positioning methods, pin-to-plate surface, male and female pins, or loosely inserted pin packages, can become a guilty and rapid process, so that the discussed pin gate array element ten-pin packaging technology has: With the advantages of low production capacity, & these methods have indeed possessed industrial applicability and progressability, and are in line with the invention patent application. C Please read the Zhuyin on the back? Please fill in this page again for the matter} Dry -------- Order i ------- Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs ^ Paper size applies Chinese National Standard (CNS) A4 (210 X 297 Common f) '-

Claims (1)

1235625 1 · A pin packaging method for a pin gate component, comprising: a substrate manufacturing step, forming a circuit for product demand on the substrate, and a group of pads or holes connected to the circuit; a coating step, Each pad group or hole group attached to the aforementioned substrate is coated with an adhesive medium for subsequent processes to be connected with various pins. In the step of planting cloth pins, the pins are first fixed on an auxiliary jig. The auxiliary jig A single group of holes and grooves is arranged on the auxiliary fixture. The auxiliary fixture is provided with positioning measures at the four corners. The arrangement of the pins on the auxiliary fixture is also the same. Later, multiple groups or a single auxiliary fixture are used to position the substrate. Then, it is connected to make the temporarily fixed pins on the auxiliary fixture contact the corresponding solder pad groups or hole groups that have been coated with the adhesive medium. A heating step is to heat the substrate and the pins on the substrate. The medium produces physical and chemical changes, and each pin is then fixed in the pad group or hole group on the substrate, and then the auxiliary jig can be removed. 2-A pin packaging method for a pin gate component, including: a substrate manufacturing step, which forms a circuit for product demand on the substrate, and a group of pads or holes connected to the circuit; a coating step, which Apply adhesive medium to each pad group or hole group on the aforementioned substrate to prepare for subsequent processes to connect with various pins. In the step of planting cloth pins, the pins are first fixed on the auxiliary fixture, which is on the auxiliary fixture. A plurality of hole and groove groups are provided. The auxiliary jig system is provided with positioning measures at appropriate positions around each hole and groove group. The arrangement of the pins on the auxiliary jig is also the same. Later, multiple groups or a single auxiliary jig are used. Align to the substrate, and then connect the temporarily fixed pins on the auxiliary fixture to the corresponding pad group or hole group that has been coated with 15 1235625 adhesive medium. A heating step is to the aforementioned substrate and its The pins are heated, and the adhesive medium produces physical and chemical changes. Each pin is then fixed in the pad group or hole group on the substrate, and then the auxiliary jig can be removed. 3. According to the pin packing method of the pin gate component described in item 1 or 2 of the scope of patent application, the substrate is provided with a single pad group or hole group. 4. According to the pin packing method of the pin gate component described in item 1 or 2 of the scope of patent application, the substrate is provided with a plurality of pad groups or hole groups. 5. According to the pin package method of the pin brake component described in item 3 of the patent application scope, the substrate is provided with positioning measures at the four corners. 6 • Pin pin package method as described in item 4 of the scope of patent application 'The substrate is provided with positioning measures at appropriate positions around each pad group or hole group. 7. According to the pin package method of the pin brake element described in item 5 of the scope of the patent application, the positioning measure on the substrate is a positioning post, and the positioning measure on the auxiliary fixture is a positioning hole. 8. According to the pin package method of the pin brake element described in item 6 of the scope of the patent application, the positioning measure on the substrate is a positioning post, and the positioning measure on the auxiliary fixture is a positioning hole. 9. According to the pin package method of the pin brake element described in item 5 of the scope of the patent application, the positioning measure on the substrate is a positioning hole, and the positioning measure on the auxiliary fixture is a positioning post. 1◦ • As for the pin packing method of the pin brake element described in item 6 of the scope of the patent application, the positioning measures on the base plate are positioning holes, and the fixing measures on the auxiliary fixture are 1235625 bits. 11. According to the needle method of the needle brake element described in item 1 or 2 of the scope of patent application, the positioning measure on the auxiliary fixture is a positioning member corresponding to the periphery of the substrate. 12. The pin seal of the needle brake element as described in item 7 of the scope of the patent application. The positioning hole and the positioning post have a proper gap. ^ 13. The pin seal of the needle lock element as described in item 8 of the scope of the patent application. The positioning hole and the positioning post have a proper gap. ^ 14. The pin seal of the needle lock element as described in item 9 of the scope of the patent application ′ The positioning hole and the positioning post have an appropriate gap. ±, 1 5 · According to the pin of the needle brake element as described in Item 10 of the scope of the patent application, there is a proper gap between the positioning hole and the positioning post. 17