TW201327618A - Vacuum coating apparatus - Google Patents
Vacuum coating apparatus Download PDFInfo
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- TW201327618A TW201327618A TW101130430A TW101130430A TW201327618A TW 201327618 A TW201327618 A TW 201327618A TW 101130430 A TW101130430 A TW 101130430A TW 101130430 A TW101130430 A TW 101130430A TW 201327618 A TW201327618 A TW 201327618A
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- coating
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- coating apparatus
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- vacuum coating
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- 238000001771 vacuum deposition Methods 0.000 title claims abstract description 46
- 238000000576 coating method Methods 0.000 claims abstract description 86
- 239000011248 coating agent Substances 0.000 claims abstract description 75
- 239000000758 substrate Substances 0.000 claims abstract description 69
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 13
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 13
- 239000010439 graphite Substances 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims description 29
- 238000012423 maintenance Methods 0.000 claims description 24
- 238000010438 heat treatment Methods 0.000 claims description 14
- 238000012545 processing Methods 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 238000000605 extraction Methods 0.000 claims 1
- 239000007789 gas Substances 0.000 description 22
- 238000009826 distribution Methods 0.000 description 5
- 230000005684 electric field Effects 0.000 description 3
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000000717 retained effect Effects 0.000 description 2
- 239000002470 thermal conductor Substances 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 239000012495 reaction gas Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/505—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
- C23C16/509—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges using internal electrodes
- C23C16/5096—Flat-bed apparatus
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45563—Gas nozzles
- C23C16/45565—Shower nozzles
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45587—Mechanical means for changing the gas flow
- C23C16/45591—Fixed means, e.g. wings, baffles
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4581—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber characterised by material of construction or surface finish of the means for supporting the substrate
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
- C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
- C23C16/4586—Elements in the interior of the support, e.g. electrodes, heating or cooling devices
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/54—Apparatus specially adapted for continuous coating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32091—Radio frequency generated discharge the radio frequency energy being capacitively coupled to the plasma
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
- H01J37/3255—Material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/186—Particular post-treatment for the devices, e.g. annealing, impurity gettering, short-circuit elimination, recrystallisation
- H01L31/1868—Passivation
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Chemical Vapour Deposition (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Description
本發明係有關於一種真空塗佈設備被揭露,其具有一可抽真空的塗佈室,在該塗佈室內設有一用來固持一待塗佈的基材的基材載具、具有一在該待塗佈的基材上方的電極及具有一相反電極。 The present invention relates to a vacuum coating apparatus having an evacuatable coating chamber in which a substrate carrier for holding a substrate to be coated is provided, having The electrode above the substrate to be coated has an opposite electrode.
此種真空塗佈設備原則上是已知的(例如,美國專利第US 6,626,186 B1號)。它們被使用在許多塗佈工作中。這可以是例如一CVD(化學氣相沉積)方法或一PECVD(電漿強化的化學氣相沉積)方法。在後者的例子中,該RF電壓被施加在該電極和該相反電極之間,其結果為,一電漿被產生。此等方法例如被使用在太陽能電池的製造,例如用以施加一氮化物塗層來將太陽能電池的表面鈍態化。 Such a vacuum coating apparatus is known in principle (for example, U.S. Patent No. 6,626,186 B1). They are used in many coating jobs. This can be, for example, a CVD (Chemical Vapor Deposition) method or a PECVD (plasma enhanced chemical vapor deposition) method. In the latter example, the RF voltage is applied between the electrode and the opposite electrode, with the result that a plasma is produced. Such methods are used, for example, in the fabrication of solar cells, for example to apply a nitride coating to passivate the surface of a solar cell.
此處理的一個問題是該處理的清潔操作,用以施加一定厚度的無污染塗層於該基材表面上,該塗層要儘可能均勻。該塗佈結果在此受到數種處理參數的影響,譬如該反應氣體的氣體組成、該待塗佈的基材的溫度、該塗佈室內的溫度、介於該電極和該相反電極之間的距離、所施加的電壓或頻率、該處理氣體的流動輪廓、及其它參數。 One problem with this process is the cleaning operation of the process to apply a non-contaminating coating of a certain thickness to the surface of the substrate which is as uniform as possible. The coating result is hereby influenced by several processing parameters, such as the gas composition of the reaction gas, the temperature of the substrate to be coated, the temperature within the coating chamber, between the electrode and the opposite electrode. Distance, applied voltage or frequency, flow profile of the process gas, and other parameters.
與發明背景相對比地,本發明係基於改善本文一開始提到的真空塗佈設備類型的目的而開發的,其中塗佈處理可儘可能均勻地且具有高穩定性被實施。再者,一種在有給送一處理氣體之下施用一電壓於一電極和一相反電極之間之改良的真空塗佈方法被提出,該方法允許儘可能均勻且穩定地來實施塗佈處理。 In contrast to the background of the invention, the invention has been developed for the purpose of improving the type of vacuum coating apparatus mentioned at the outset, wherein the coating treatment can be carried out as uniformly as possible and with high stability. Furthermore, an improved vacuum coating method for applying a voltage between an electrode and an opposite electrode under the application of a process gas is proposed which allows the coating process to be carried out as uniformly and stably as possible.
此目的可根據本發明在本文開頭時提到的真空塗佈設備類型的例子中被達成,因為該基材載具被固持在一板子上,該板子被連接作為該相反電極且較佳地由石墨構成。 This object can be achieved in accordance with the invention in the example of the type of vacuum coating apparatus mentioned at the outset, since the substrate carrier is held on a board which is joined as the counter electrode and preferably by Made up of graphite.
本發明的目的可用此方式來完全地達成。 The object of the invention can be achieved in this way.
有鑑於在傳統的真空塗佈設備中,一待塗佈的基材(例如一晶圓)係直接平置在一用碳纖維(CFC)製成之被連接作為相反電極的基材載具上,依據本發明,該基材載具係被固持在一板子上,該板子被連接作為該相反電極。因此,該基材係被固持在一更為均質的電場中,因為該電場延伸得和該板子一樣遠。以此方式,可獲得一更為均質的塗佈結果。 In view of the conventional vacuum coating apparatus, a substrate to be coated (for example, a wafer) is directly placed on a substrate carrier made of carbon fiber (CFC) and connected as an opposite electrode. According to the invention, the substrate carrier is held on a board which is joined as the opposite electrode. Thus, the substrate is held in a more homogeneous electric field because the electric field extends as far as the board. In this way, a more homogeneous coating result can be obtained.
在本發明的一較佳的開發中,該板子是用石墨構成的。與金屬基材載具相較,石墨是更佳的導熱體,因此可對均質的溫度分布有貢獻並對更好的塗佈有貢獻。 In a preferred development of the invention, the panel is constructed of graphite. Compared to metal substrate carriers, graphite is a better thermal conductor and therefore contributes to a homogeneous temperature distribution and contributes to better coating.
由於板子的重量及其大的表面積的關係,該板子較佳地是由多個個別的板子所組成。 Due to the weight of the board and its large surface area, the board is preferably comprised of a plurality of individual panels.
在本發明的一較佳的組態中,該板子被加熱。詳言之,當該板子是用石墨構成時,由於其良好的導熱性的關 係,所以可達成一特別均質的溫度分布,以及可達成一更為均質的塗佈結果。 In a preferred configuration of the invention, the board is heated. In detail, when the board is made of graphite, due to its good thermal conductivity Therefore, a particularly homogeneous temperature distribution can be achieved and a more homogeneous coating result can be achieved.
有鑑於在傳統的設備中,該基材載具被間接地加熱,其上固持有該基材載具的該板子可被處處加熱。因此,可確保一更為均勻的溫度。 In view of the conventional apparatus, the substrate carrier is indirectly heated, and the board on which the substrate carrier is held can be heated locally. Therefore, a more uniform temperature can be ensured.
為了加熱,多個加熱元件(例如,電阻式加熱元件形式的加熱元件)較佳地被設置在該板子的底下。該等加熱元件較佳地儘可能均勻地散布在該板子的整個表面上,用以達到一特別均質的溫度分布。每一加熱元件可被獨立地致動或調整。 For heating, a plurality of heating elements (e.g., heating elements in the form of resistive heating elements) are preferably disposed beneath the board. The heating elements are preferably spread as evenly as possible over the entire surface of the panel to achieve a particularly homogeneous temperature profile. Each heating element can be independently actuated or adjusted.
多個氣體出口孔(其較佳地儘可能均勻地散布在該電極的整個表面上)較佳地穿過該電極。 A plurality of gas outlet apertures, which are preferably spread as uniformly as possible over the entire surface of the electrode, preferably pass through the electrode.
在本發明的一更佳的組態中,一流動導引件(其較佳地是一框架的形式)被設置在該電極上,該流動引導件延伸在該基材載具的方向上。 In a preferred configuration of the invention, a flow guide (which is preferably in the form of a frame) is disposed on the electrode, the flow guide extending in the direction of the substrate carrier.
由於這些結構,一在該基材方向上之均勻的處理氣體流可被確保,其結果為塗佈可被改善。 Due to these structures, a uniform process gas flow in the direction of the substrate can be ensured, with the result that coating can be improved.
依據本發明的一進一步的組態,該電極和該基材載具之間的距離是可改變的。 According to a further configuration of the invention, the distance between the electrode and the substrate carrier is changeable.
有鑑於在傳統真空塗佈方法中此距離係被固定不變地界定,在依據本發明的真空塗佈方法中,介於該基材載具(其上固持著該基材)和該電極之間的距離是可改變的。藉由改變介於該基材載具(或相反電極)和該電極之間的距離,該塗佈處理可被更均勻地建構且偏離的塗佈處理可 藉由調整介於該電極和該相反電極之間的距離來加以穩定。 In view of the fact that the distance is fixedly defined in the conventional vacuum coating method, in the vacuum coating method according to the present invention, the substrate carrier (on which the substrate is held) and the electrode are The distance between them can be changed. By varying the distance between the substrate carrier (or opposite electrode) and the electrode, the coating process can be more uniformly constructed and the offset coating process can be It is stabilized by adjusting the distance between the electrode and the opposite electrode.
以此方式,塗佈處理的一被改善的實施(藉由自動控制該電極和該相反電極之間的距離)可被達成。 In this way, an improved implementation of the coating process (by automatically controlling the distance between the electrode and the opposite electrode) can be achieved.
介於該電極和該基材載具之間的距離較佳地可被設定,使得一約2至20mm,較佳地約2至5mm的間隙被保留在一流動導引件和該基材載具之間。 The distance between the electrode and the substrate carrier can preferably be set such that a gap of about 2 to 20 mm, preferably about 2 to 5 mm, is retained in a flow guide and the substrate. Between.
依據本發明的真空塗佈設備較佳地係以批次模式操作。 The vacuum coating apparatus according to the present invention preferably operates in a batch mode.
為了高產出率的目的,一真空塗佈設施(installation)可被耦合至多個具有一共同的裝載單元的塗佈設備,其中該等塗佈設備中的至少一者可為了維修的目的而從其它的塗佈設備的操作中脫離以成為一維修單元,其中其餘的塗佈設備的產能被設計成使得該真空塗佈設施的標稱產能可在沒有該維修單元下被達成。 For high throughput purposes, a vacuum coating installation can be coupled to a plurality of coating devices having a common loading unit, wherein at least one of the coating devices can be used for maintenance purposes The operation of the other coating apparatus is detached to become a maintenance unit, wherein the capacity of the remaining coating apparatus is designed such that the nominal capacity of the vacuum coating facility can be achieved without the maintenance unit.
以此方式,維修工作可在一持續進行的塗佈處理期間在該維修單元內被實施,該塗佈設施無需被停機。以此方式,平均約97%的正常運作時間(uptime)可被達成。 In this way, maintenance work can be carried out in the service unit during a continuous coating process that does not need to be shut down. In this way, an average of about 97% of the uptime can be achieved.
在正常的操作期間以降低的產能同時操作屬於該真空塗佈設施的所有塗佈設備來達成標稱產量產能是可能的。 It is possible to simultaneously operate all of the coating equipment belonging to the vacuum coating facility at a reduced capacity to achieve a nominal throughput capacity during normal operation.
或者,所有該等塗佈設備中的一被選定的單元可被故意地設為故障將其停機,而其餘的塗佈設備則以更高的產量產能來操作,用以維持總標稱產量產能。 Alternatively, a selected one of all of the coating equipment can be deliberately set to fail to shut down, while the remaining coating equipment is operated at a higher throughput capacity to maintain the total nominal production capacity. .
以此方式,維修工作可在一持續進行的塗佈處理期間 在該維修單元內被實施,該塗佈設施無需被停機。以此方式,平均約97%的正常運作時間(uptime)可被達成。 In this way, maintenance work can be performed during a continuous coating process. Implemented within the service unit, the coating facility need not be shut down. In this way, an average of about 97% of the uptime can be achieved.
本發明的目的亦可用一種有一電壓被施加在一電極和一相反電極之間、有處理氣體被給送之用於真空塗佈基材的方法來達成,其中該基材被設置在一介於該電極和一板子之間的基材載具上,該板子較佳地是用石墨構成且其被連接作為該相反電極。 The object of the present invention can also be achieved by a method for vacuum coating a substrate with a voltage applied between an electrode and an opposite electrode, wherein the substrate is disposed between On the substrate carrier between the electrode and a plate, the plate is preferably constructed of graphite and joined as the opposite electrode.
如上文中已經提到的,此方法允許該處理更均勻的實施以具有特別高的品質。 As already mentioned above, this method allows a more uniform implementation of the treatment to have a particularly high quality.
在該方法的一有利的開發中,該處理氣體在此處係透過在該電極上的多個氣體出口開口被給送且被至少一流動導引件引導於該基材的方向上,抽吸式抽出較佳地係發生在塗佈室的底部區域。 In an advantageous development of the method, the process gas is here fed through a plurality of gas outlet openings on the electrode and guided by the at least one flow guide in the direction of the substrate, suctioned The draw preferably occurs in the bottom region of the coating chamber.
因此,可允許一在該基材方向上來自於上方之特別均勻的處理氣體給送,可達成特別均勻的塗佈結果。 Therefore, a particularly uniform processing gas supply from above in the direction of the substrate can be allowed to achieve a particularly uniform coating result.
不待贅言的是,上述的特徵及將於下文中描述的特徵不只可用每一例子中所提出的組合來加以使用,還可以用其它組合或它們自己本身來加以使用,而不偏離發明的範圍。 It goes without saying that the above features and the features which will be described hereinafter can be used not only in the combination proposed in each example, but also in other combinations or by themselves without departing from the scope of the invention.
在圖1中,一依據本發明的真空塗佈設備整體被標以標號10。 In Fig. 1, a vacuum coating apparatus in accordance with the present invention is generally designated by the numeral 10.
該真空塗佈設備10具有一塗佈室12,其以氣密的方 式被一底部16、壁18及頂部14所圍繞。該塗佈室12具有一上空間38及一在該上空間底下的下空間40。一基材載具28可被固持在該上空間38及該下空間40中。該基材載具28可藉由一搬運裝置52通過該壁18上的一相關連的門48被導入到該上空間38中且從上空間38中被撤出。為了要固持在該上空間中,在此處使用的是相關連的滾輪36,其可藉由真空軸套而從該塗佈室12外面予以致動且其可藉由軸向運動而在壁18中被降低。 The vacuum coating apparatus 10 has a coating chamber 12 which is airtight The pattern is surrounded by a bottom 16, a wall 18 and a top 14. The coating chamber 12 has an upper space 38 and a lower space 40 below the upper space. A substrate carrier 28 can be retained in the upper space 38 and the lower space 40. The substrate carrier 28 can be introduced into the upper space 38 and withdrawn from the upper space 38 by a handling device 52 through an associated door 48 on the wall 18. In order to be held in the upper space, the associated roller 36 is used here, which can be actuated from outside the coating chamber 12 by means of a vacuum bushing and which can be moved in the wall by axial movement. 18 was lowered.
在該下空間中,亦設有輸送滾輪46,其用來固持一基材載具28,該基材載具28在門50打開的狀態下可藉由一被致動的搬運裝置54而被送入該塗佈室12的下空間40中或從該下空間40被撤出。 In the lower space, there is also provided a transport roller 46 for holding a substrate carrier 28 which can be acted upon by the actuated handling device 54 with the door 50 open. It is fed into or withdrawn from the lower space 40 of the coating chamber 12.
一位在該塗佈室12內的基材載具28在該等輸送滾輪36被縮回到該壁18內的時候係平置在一板子32上,該板子較佳地係由石墨構成且可在一昇降裝置42的幫助下可移動於垂直的方向上。該昇降裝置42包含一昇降驅動器64,其例如可以是一電動氣缸,在該昇降驅動器的幫助下,一活塞可以一受控制的方式移位於該垂直的方向上。 A substrate carrier 28 in the coating chamber 12 is placed flat on a plate 32 when the transfer rollers 36 are retracted into the wall 18, preferably constructed of graphite and It can be moved in a vertical direction with the aid of a lifting device 42. The lifting device 42 includes a lifting drive 64 which may, for example, be an electric cylinder with which a piston can be moved in a controlled manner in a vertical direction with the aid of the lifting drive.
該由石墨構成的板子32是可加熱的,為了此目的,多個加熱元件34(例如,電阻式加熱元件)被設置在該板子的底側上,該等加熱元件34係以均勻分布的方式被配置在該板子32的整個底側。依據圖1,一平的基材30被固持在該基材載具28上,該平的基材30可在該塗佈設備10中被塗佈。該板子32被連接作為一相反電極。 The plate 32 of graphite is heatable, and for this purpose a plurality of heating elements 34 (e.g., resistive heating elements) are disposed on the bottom side of the plate, the heating elements 34 being evenly distributed. It is disposed on the entire bottom side of the board 32. According to FIG. 1, a flat substrate 30 is held on the substrate carrier 28, which can be coated in the coating apparatus 10. The board 32 is connected as an opposite electrode.
在該基材30上方,一相關連的平的電極24被設置成離該基材載具28一距離d。多個氣體出口開口26穿過該電極24,該等氣體出口開口26係以散布成網格(grid)形式的方式延伸在該電極24的整個表面上。該等氣體出口開口26係用來給送用於真空塗佈處理的處理氣體,該處理氣體可透過一被連接的氣體給送件22從該塗佈室12的外面被給送。 Above the substrate 30, an associated flat electrode 24 is disposed at a distance d from the substrate carrier 28. A plurality of gas outlet openings 26 are passed through the electrodes 24, and the gas outlet openings 26 extend over the entire surface of the electrode 24 in a manner that is dispersed in a grid. The gas outlet openings 26 are used to feed a process gas for vacuum coating processing that is fed from the outside of the coating chamber 12 through a connected gas feed member 22.
一電壓被施加於該板子32和該電極24之間(未示出),如果是PECVD處理將於真空下於該塗佈室內被實施的話,該電壓可以是RF電壓。 A voltage is applied between the plate 32 and the electrode 24 (not shown), which may be an RF voltage if the PECVD process is to be performed in the coating chamber under vacuum.
在一塗佈處理期間,該處理氣體(如箭頭74所示)在該基材30的方向上均勻地向下流出。為了要避免處理氣體的側向逸逃及確保處理氣體均勻地接近該基材表面,一流動導引件70被設置。該流動導引件是一被圓周地封閉的框架,其被緊固至該電極24的底側並向下延伸至該基材載具28的上方。 During a coating process, the process gas (as indicated by arrow 74) flows uniformly downwardly in the direction of the substrate 30. A flow guide 70 is provided in order to avoid lateral escape of the process gas and to ensure uniform access of the process gas to the surface of the substrate. The flow guide is a circumferentially closed frame that is secured to the bottom side of the electrode 24 and extends downwardly above the substrate carrier 28.
介於該流動導引件或該框架70的下端和該基材載具28之間有一間隙s,其較佳地是在約2至20mm,特別是在2至5mm,的範圍之內且較佳地在該昇降裝置42的幫助之下該間距是可依據至少一處理參數改變的。為此,該昇降裝置42係透過一中央控制器60予以控制,如控制線66所標示。一感測器62純示意地被例示在該塗佈室12中,該感測器62透過線路68被耦接至該中央控制器60。該感測器例如可以是溫度感測器、壓力感測器、用來偵測 一特定的氣體的部分壓力的感測器、等等。不待贅言的是,該感測器28只是以純示意的方式被標示且可被建構成任何所想要的感測器,及可提供數種被連接至該中央控制器60之不同的感測器。無論如何,介於該基材載具28和該電極24之間的距離d或介於該流動導引件或框架70的下端和該基材載具28之間的間隙s可在該控制器60的幫助下依據處理參數中的一者來設定,用以確保該處理的最佳化實施。 There is a gap s between the lower end of the flow guide or the frame 70 and the substrate carrier 28, which is preferably in the range of about 2 to 20 mm, especially 2 to 5 mm. Preferably, the spacing is varied with the aid of the lifting device 42 in accordance with at least one processing parameter. To this end, the lifting device 42 is controlled by a central controller 60, as indicated by control line 66. A sensor 62 is purely schematically illustrated in the coating chamber 12, and the sensor 62 is coupled to the central controller 60 via a line 68. The sensor can be, for example, a temperature sensor, a pressure sensor, and is used for detecting A partial pressure sensor for a particular gas, and the like. It goes without saying that the sensor 28 is only indicated in a purely schematic manner and can be constructed to form any desired sensor, and several different sensors connected to the central controller 60 can be provided. . In any event, the distance d between the substrate carrier 28 and the electrode 24 or the gap s between the lower end of the flow guide or frame 70 and the substrate carrier 28 may be at the controller With the help of 60, it is set according to one of the processing parameters to ensure optimal implementation of the process.
該塗佈室12可在一真空幫浦20的幫助下被抽真空。該真空幫浦20具有多個抽吸開口21,這些開口較佳地以一均勻散布的方式被配置在該塗佈室12的底部區域。 The coating chamber 12 can be evacuated with the aid of a vacuum pump 20. The vacuum pump 20 has a plurality of suction openings 21 which are preferably arranged in a uniformly distributed manner in the bottom region of the coating chamber 12.
藉由該流動導引件或框架70,透過該電極24被給送至該基材30的表面之處理氣體的極為均勻的接近可被確保。 By the flow guide or frame 70, an extremely uniform access of the process gas that is fed through the electrode 24 to the surface of the substrate 30 can be ensured.
該石墨板32(其被連接作為該相反電極)係用來將該電場均質化。再者,石墨是很好的導熱體,這可確保在整個表面上有均勻的溫度分布。一極為均勻的溫度分布因而可在整個石墨板32上產生,因而亦在整個基材載具28上及最終地在該基材30上產生,且這會導致一相當均質的塗佈結果。 The graphite plate 32, which is connected as the opposite electrode, is used to homogenize the electric field. Furthermore, graphite is a good thermal conductor which ensures a uniform temperature distribution across the entire surface. An extremely uniform temperature profile can thus be produced across the graphite sheet 32 and thus also on the entire substrate carrier 28 and ultimately on the substrate 30, and this results in a fairly homogeneous coating result.
由於將該塗佈室12分成上空間38及下空間40,配合上相關的搬運裝置及相關的裝卸及分配裝置,一特別快速的產出率可被確保。 Since the coating chamber 12 is divided into an upper space 38 and a lower space 40, a particularly rapid yield can be ensured in conjunction with the associated handling device and associated handling and dispensing device.
當在該塗佈室12的上區38的塗佈處理結束時,其上 放置了基材30的該基材載具28可藉由該昇降裝置42而被移入到該下空間40。在門48或50打開的時候,一其上放置了待塗佈的基材的新的基材載具可被該搬運裝置52導入,如箭頭56所標示。與此同時,其上放置了已被完全塗佈的基材30的該基材載具28在該門50打開的時候可被該搬運裝置54從該下空間40中撤出,如箭頭58所標示。 When the coating process at the upper region 38 of the coating chamber 12 is completed, on the upper portion The substrate carrier 28 on which the substrate 30 is placed can be moved into the lower space 40 by the lifting device 42. When the door 48 or 50 is opened, a new substrate carrier on which the substrate to be coated is placed can be introduced by the handling device 52 as indicated by arrow 56. At the same time, the substrate carrier 28 on which the substrate 30 that has been completely coated is placed can be withdrawn from the lower space 40 by the handling device 54 when the door 50 is opened, as indicated by arrow 58. Marked.
不待贅言地,除了圖1所示的兩個分開的門48,50之外,亦可提供一共用的、連續的門或埠口。 Needless to say, in addition to the two separate doors 48, 50 shown in Figure 1, a common, continuous door or cornice can be provided.
該設備較佳地係以循環的方式用批次的模式來操作。 The apparatus preferably operates in a batch mode in a cyclic manner.
圖2例示一真空塗佈設施(vacuum coating installation)的基礎結構,該設施整體被標示為標號80。依據圖2a),該真空塗佈設施80包含三個塗佈單元P1,P2,P3及一構造相同的維修單元M、及一裝載單元82,該等單元被配置在一分配單元84外側周圍,該分配單元是一正五角形的形式。該等塗佈單元P1,P2,P3及該維修單元M每一者都透過一相關連的埠口或門耦合至該分配單元84。 2 illustrates the basic structure of a vacuum coating installation, which is generally designated by the numeral 80. According to FIG. 2a), the vacuum coating facility 80 comprises three coating units P1, P2, P3 and a maintenance unit M of identical construction, and a loading unit 82, which are arranged around the outside of a dispensing unit 84. The dispensing unit is in the form of a regular pentagon. The coating units P1, P2, P3 and the service unit M are each coupled to the dispensing unit 84 via an associated port or door.
每一塗佈單元P1,P2,P3及該維修單元M是由上述的真空塗佈設備10所形成。 Each of the coating units P1, P2, P3 and the maintenance unit M are formed by the above-described vacuum coating apparatus 10.
在此例子中,相同的塗佈處理被實施於所有該等塗佈單元P1,P2,P3中。由於該等塗佈單元P1,P2,P3平行操作的關係,因而可確保一高的產出率。該等塗佈單元P1,P2,P3的產能被設計成使得三個塗佈單元足以確保標稱(nominal)產出率。該維修單元M具有與該等塗佈 單元P1,P2,P3相同的構造,因而作為保留產能。這表示該塗佈處理是在標稱產出率下實施,而在此同時,維修工作(例如,清潔工作及類此者)可在一個單元內(維修單元M內)實施,而不會減損該標稱產出率。 In this example, the same coating process is carried out in all of the coating units P1, P2, P3. Due to the parallel operation of the coating units P1, P2, P3, a high yield can be ensured. The throughput of the coating units P1, P2, P3 is designed such that three coating units are sufficient to ensure a nominal production rate. The repair unit M has the same coating The units P1, P2, P3 have the same construction and thus serve as a reserve capacity. This means that the coating process is carried out at a nominal yield, while at the same time maintenance work (for example, cleaning work and the like) can be carried out in one unit (within the maintenance unit M) without derogation This nominal output rate.
圖2b)顯示該真空塗佈設施80’的一不同的狀態,在此裝態中,之前在圖2a)的處理中被用作為塗佈單元P3的單元現在被用作為維修單元M,且之前的維修單元M現在在此處理中則如塗佈單元P3般地被操作。 Fig. 2b) shows a different state of the vacuum coating facility 80', in which the unit previously used as the coating unit P3 in the process of Fig. 2a) is now used as the maintenance unit M, and before The maintenance unit M is now operated in this process as the coating unit P3.
因此,可使用的塗佈單元的數量係與之前的數目相同,而在此同時,該等單元中的一個不同的單元現在被用於維修,其被標示為M。 Thus, the number of coating units that can be used is the same as the previous number, while at the same time a different unit of the units is now used for maintenance, which is labeled M.
圖2c)顯示該真空塗佈設施80”的另一狀態,在此狀態中,之前在圖2b)中被用作為塗佈單元P2的單元現在被用作為維修單元M,而之前的維修單元現在被用作為塗佈單元P2。 Fig. 2c) shows another state of the vacuum coating facility 80", in which the unit previously used as the coating unit P2 in Fig. 2b) is now used as the maintenance unit M, while the previous maintenance unit is now It is used as the coating unit P2.
因此,整個真空塗佈設施的標稱產出率可一直被達成,同時該等單元中的一個單元為了維修的目的一直都是離線的。整體而言,此設計可確保約97%的正常運作時間(uptime)。 Thus, the nominal yield of the entire vacuum coating facility can be achieved at all times, while one of the units is always offline for maintenance purposes. Overall, this design ensures approximately 97% uptime.
在一不同的組態中,所有單元P1至P4及M可以減小的產能來生產以同時被使用。為了維修,該等單元中的一個單元M與其餘的單元P1至P4脫離,該等單元其餘的單元P1至P4可以接近其最大產能之較高的產能來操作,藉以在一個單元M接受維修的同時還能達到標稱的總 輸出產能。 In a different configuration, all of the units P1 to P4 and M can be produced with reduced capacity to be used at the same time. For maintenance, one of the units M is disengaged from the remaining units P1 to P4, and the remaining units P1 to P4 of the units can be operated close to their maximum capacity, thereby being serviced in one unit M. At the same time, it can reach the nominal total Output capacity.
10‧‧‧真空塗佈設備 10‧‧‧Vacuum coating equipment
12‧‧‧塗佈室 12‧‧‧ Coating Room
14‧‧‧頂部 14‧‧‧ top
16‧‧‧底部 16‧‧‧ bottom
18‧‧‧壁 18‧‧‧ wall
38‧‧‧上空間 38‧‧‧Upper space
40‧‧‧下空間 40‧‧‧Lower space
28‧‧‧基材載具 28‧‧‧Substrate carrier
30‧‧‧基材 30‧‧‧Substrate
48‧‧‧門 48‧‧‧
50‧‧‧門 50‧‧‧
52‧‧‧搬運裝置 52‧‧‧Transportation device
36‧‧‧輸送滾輪 36‧‧‧Transport roller
32‧‧‧板子 32‧‧‧ boards
42‧‧‧昇降裝置 42‧‧‧ lifting device
64‧‧‧昇降驅動器 64‧‧‧ Lifting drive
34‧‧‧加熱元件 34‧‧‧ heating elements
24‧‧‧電極 24‧‧‧ electrodes
26‧‧‧氣體出口開口 26‧‧‧ gas outlet opening
22‧‧‧氣體給送件 22‧‧‧ gas delivery parts
70‧‧‧導引件或框架 70‧‧‧Guide or frame
74‧‧‧箭頭 74‧‧‧ arrow
60‧‧‧中央控制器 60‧‧‧Central controller
62‧‧‧感測器 62‧‧‧ sensor
66‧‧‧控制線 66‧‧‧Control line
68‧‧‧線路 68‧‧‧ lines
21‧‧‧抽吸開口 21‧‧‧ suction opening
20‧‧‧真空幫浦 20‧‧‧vacuum pump
56‧‧‧箭頭 56‧‧‧ arrow
80‧‧‧真空塗佈設施 80‧‧‧vacuum coating facilities
80’‧‧‧真空塗佈設施 80’‧‧‧vacuum coating facility
80”‧‧‧真空塗佈設施 80”‧‧‧vacuum coating facilities
P1‧‧‧塗佈單元 P1‧‧‧ Coating unit
P2‧‧‧塗佈單元 P2‧‧‧ Coating unit
P3‧‧‧塗佈單元 P3‧‧‧ Coating unit
M‧‧‧維修單元 M‧‧‧Maintenance unit
82‧‧‧裝卸單元 82‧‧‧Handling unit
84‧‧‧分配單元 84‧‧‧Distribution unit
本發明的其它特徵及好處可從參考圖式之較佳的例示性實施例的下面描述中獲得,其中:圖1係以高度簡化及示意性例示方式顯示依據本發明的一真空塗佈設備的剖面圖;及圖2a)至2c)顯示一真空塗佈設施的示意性例示,其具有三個塗佈單元、一個維修單元及一個裝卸單元,這些單元以五角形的方式被安排在一中央分配單元周圍,其中不同類型的使用被示於圖a)至c)中。 Other features and advantages of the present invention can be obtained from the following description of the preferred exemplary embodiments of the drawings, wherein: FIG. 1 shows a vacuum coating apparatus in accordance with the present invention in a highly simplified and schematic illustration. A cross-sectional view; and Figures 2a) to 2c) show a schematic illustration of a vacuum coating facility having three coating units, a service unit and a handling unit arranged in a pentagonal manner in a central distribution unit Around, where different types of use are shown in Figures a) to c).
10‧‧‧真空塗佈設備 10‧‧‧Vacuum coating equipment
12‧‧‧塗佈室 12‧‧‧ Coating Room
14‧‧‧頂部 14‧‧‧ top
16‧‧‧底部 16‧‧‧ bottom
18‧‧‧壁 18‧‧‧ wall
20‧‧‧真空幫浦 20‧‧‧vacuum pump
21‧‧‧抽吸開口 21‧‧‧ suction opening
22‧‧‧氣體給送件 22‧‧‧ gas delivery parts
24‧‧‧電極 24‧‧‧ electrodes
26‧‧‧氣體出口開口 26‧‧‧ gas outlet opening
28‧‧‧基材載具 28‧‧‧Substrate carrier
30‧‧‧基材 30‧‧‧Substrate
32‧‧‧板子 32‧‧‧ boards
34‧‧‧加熱元件 34‧‧‧ heating elements
36‧‧‧輸送滾輪 36‧‧‧Transport roller
38‧‧‧上空間 38‧‧‧Upper space
40‧‧‧下空間 40‧‧‧Lower space
42‧‧‧昇降裝置 42‧‧‧ lifting device
46‧‧‧輸送滾輪 46‧‧‧Transport roller
48‧‧‧門 48‧‧‧
50‧‧‧門 50‧‧‧
52‧‧‧搬運裝置 52‧‧‧Transportation device
54‧‧‧搬運裝置 54‧‧‧Transportation device
56‧‧‧箭頭 56‧‧‧ arrow
58‧‧‧箭頭 58‧‧‧ arrow
60‧‧‧中央控制器 60‧‧‧Central controller
62‧‧‧感測器 62‧‧‧ sensor
64‧‧‧昇降驅動器 64‧‧‧ Lifting drive
66‧‧‧控制線 66‧‧‧Control line
68‧‧‧線路 68‧‧‧ lines
70‧‧‧導引件或框架 70‧‧‧Guide or frame
74‧‧‧箭頭 74‧‧‧ arrow
Claims (14)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102011113293A DE102011113293A1 (en) | 2011-09-05 | 2011-09-05 | Vacuum coater |
Publications (1)
Publication Number | Publication Date |
---|---|
TW201327618A true TW201327618A (en) | 2013-07-01 |
Family
ID=46650561
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW101130430A TW201327618A (en) | 2011-09-05 | 2012-08-22 | Vacuum coating apparatus |
Country Status (3)
Country | Link |
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DE (1) | DE102011113293A1 (en) |
TW (1) | TW201327618A (en) |
WO (1) | WO2013034411A2 (en) |
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CN103215562A (en) * | 2013-04-25 | 2013-07-24 | 光垒光电科技(上海)有限公司 | Reaction cavity |
EP3449033A1 (en) | 2015-11-05 | 2019-03-06 | Bühler Alzenau GmbH | Device and method for vacuum coating |
DE102020124022A1 (en) | 2020-09-15 | 2022-03-17 | centrotherm international AG | Workpiece carrier, system and operating procedure for PECVD |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
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US5000113A (en) * | 1986-12-19 | 1991-03-19 | Applied Materials, Inc. | Thermal CVD/PECVD reactor and use for thermal chemical vapor deposition of silicon dioxide and in-situ multi-step planarized process |
US5534072A (en) * | 1992-06-24 | 1996-07-09 | Anelva Corporation | Integrated module multi-chamber CVD processing system and its method for processing subtrates |
US6001183A (en) * | 1996-06-10 | 1999-12-14 | Emcore Corporation | Wafer carriers for epitaxial growth processes |
KR100269097B1 (en) * | 1996-08-05 | 2000-12-01 | 엔도 마코토 | Wafer process apparatus |
US6189482B1 (en) * | 1997-02-12 | 2001-02-20 | Applied Materials, Inc. | High temperature, high flow rate chemical vapor deposition apparatus and related methods |
US6626186B1 (en) | 1998-04-20 | 2003-09-30 | Tokyo Electron Limited | Method for stabilizing the internal surface of a PECVD process chamber |
TW511158B (en) * | 2000-08-11 | 2002-11-21 | Alps Electric Co Ltd | Plasma processing apparatus and system, performance validation system thereof |
US7270713B2 (en) * | 2003-01-07 | 2007-09-18 | Applied Materials, Inc. | Tunable gas distribution plate assembly |
US7279049B2 (en) * | 2004-02-05 | 2007-10-09 | Applied Materials, Inc. | Apparatus for reducing entrapment of foreign matter along a moveable shaft of a substrate support |
US20060156979A1 (en) * | 2004-11-22 | 2006-07-20 | Applied Materials, Inc. | Substrate processing apparatus using a batch processing chamber |
US20070271751A1 (en) * | 2005-01-27 | 2007-11-29 | Weidman Timothy W | Method of forming a reliable electrochemical capacitor |
US20070116888A1 (en) * | 2005-11-18 | 2007-05-24 | Tokyo Electron Limited | Method and system for performing different deposition processes within a single chamber |
WO2007101207A2 (en) * | 2006-02-27 | 2007-09-07 | Anaconda Semi Lp | Process chambers for substrate vacuum processing tool |
US7740705B2 (en) * | 2006-03-08 | 2010-06-22 | Tokyo Electron Limited | Exhaust apparatus configured to reduce particle contamination in a deposition system |
US20070264443A1 (en) * | 2006-05-09 | 2007-11-15 | Applied Materials, Inc. | Apparatus and method for avoidance of parasitic plasma in plasma source gas supply conduits |
JP2009228032A (en) * | 2008-03-19 | 2009-10-08 | Sanyo Electric Co Ltd | Plasma processing method and plasma processing apparatus |
US20120097330A1 (en) * | 2010-10-20 | 2012-04-26 | Applied Materials, Inc. | Dual delivery chamber design |
-
2011
- 2011-09-05 DE DE102011113293A patent/DE102011113293A1/en not_active Withdrawn
-
2012
- 2012-08-14 WO PCT/EP2012/065908 patent/WO2013034411A2/en active Application Filing
- 2012-08-22 TW TW101130430A patent/TW201327618A/en unknown
Also Published As
Publication number | Publication date |
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DE102011113293A1 (en) | 2013-03-07 |
WO2013034411A3 (en) | 2013-09-12 |
WO2013034411A2 (en) | 2013-03-14 |
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