TW201325364A - Method for manufacturing soft-hard composite circuit board - Google Patents

Abstract

The present invention is to pre-arrange a thickened area on a surface of a hard-board exclusive portion. An adhesive material is arranged on the hardboard surface other than the thickened area. The thickened area and the surface of the adhesive material are on the same horizontal level. Subsequently, the hard-board exclusive portion and the thickened area are removed along the blind-hole vestiges formed by blind punching, so as to ensure flatness around the hard-board exclusive portion, and effectively prevent burrs generation at the periphery of the hard-board exclusive portion.

Description

Soft and hard composite circuit board manufacturing method

The present invention relates to a composite circuit board in which a flexible board and a hard board are combined, and a manufacturing method capable of preventing generation of burrs.

Because of the composite circuit board with both soft board and hard board, the soft board part has good flexibility and can flex the wiring, so the product can be easily reduced in size and weight, so the soft and hard composite board is often used in automotive circuits. Board, mobile phone, digital camera, flat panel display and other types of products.

Please refer to the soft and hard composite circuit board 10 shown in the first figure, which comprises at least one hard board 11 and a soft board 12 disposed on the surface of the hard board 11. The existing method of manufacturing the soft and hard composite circuit board 10 is provided. a soft board 12, which is provided with at least one exposed area 121, and covers the hard board 11 on the soft board 12, and then extends from the surface of the hard board 11 by a milling cutter to mill relative The hard plate 11 on the exposed area 121 exposes the exposed area 121 for electrical connection with other components, as shown in the second figure, or allows the entire soft and hard composite circuit board 10 to be used therein. Form a bend.

However, when a part of the hard plate 11 is milled by a milling cutter, since there is no support under the hard plate 11, the cut surface is liable to be uneven, and it is easy for the hard plate 11 to generate a burr 111 around the cut portion, which causes a serious influence. The accuracy of the circuit connection.

In addition, Taiwan Patent Publication No. 201112907, the patent name "blind-type soft and hard composite circuit board and its manufacturing method", and discloses a blind fishing type soft and hard composite circuit board manufacturing method for making the surface of the soft board have a flat groove The method comprises the steps of: providing a hard board substrate; fixing at least one body (which may be Teflon) on the hard board substrate, and providing an adhesive layer on a side of the block different from the hard board substrate Forming a polymer layer on both sides of the block, forming the polymer layer and the hard plate substrate to form a hard plate; and then stacking and fixing a soft plate on one side of the block having the adhesive layer, and making the adhesive layer Bonding to the soft board; using a machine tool to make a milling cutter to be deeply controlled to the junction of the block and the polymer layer, and milling from one side of the hard substrate to one side of the block to the adhesive layer of the block At the junction with the soft board, the second blind fishing trough is milled, the material between the two blind troughs and the block form a removal portion; and the adhesive layer of the block is separated from the soft board, so that the removal portion is Removed to form a slot with a certain width, so that the cutter can be prevented from contacting the soft board to obtain Good quality blind fishing formula hard composite board.

However, this manufacturing method has the following disadvantages:

1. In the manufacturing method, the adhesive layer is disposed on the block and is adhered to the exposed area of the soft board. When the removal part is removed, the adhesive layer is easy to be damaged on the soft board. Glue, which can not be sure to fix other electronic parts, and the residual glue will affect the connection conductivity of the circuit. This method does not achieve the function of recycling soft waste, which not only wastes cost but also saves energy.

2. This kind of manufacturing method mainly uses the blind fishing method to form a blind fishing trough, but the blind fishing method is prone to generate debris (dust is easy to cause the gold wire to be hit by the customer to hit the gold wire process and cause high defect rate.

3. The milling cutter is blindly aligned at the junction of the block and the polymer layer, and the polymer layer must have a flow gel phenomenon in the production process (high temperature and high pressure of the pressing process). The glue will cause the two sides of the block to adhere to the polymer layer. Therefore, when the milling is performed, the block and the polymer layer are adhered together. Therefore, when the hard plate is removed, the block and the polymer layer must be pulled to cause polymerization. The layer pulls the burrs so there is also a problem with the burrs.

4. The milling cutter is blindly aligned at the junction of the block and the polymer layer, but there is still a gap between the block and the polymer layer, so the milling depth is processed in one place and the other is generated. The deformation of the sheet, which is the phenomenon of support asymmetry, because the other side does not have the simultaneous milling depth processing, the depth of the product due to washing is uncontrollable.

5. There is still a gap between the block and the polymer layer, so there is still insufficient support force at the time of milling, and there is also a problem of burrs. It is fixed and there will be problems with burrs.

Therefore, how to obtain the ideal soft and hard composite circuit board, that is, the current related and therefore how to obtain the ideal soft and hard composite circuit board, is the active research goal of the current related fields.

In view of the above, the main object of the present invention is to provide a composite circuit board in which a flexible board and a hard board are combined, and a manufacturing method capable of preventing generation of burrs and ensuring accurate connection of circuits.

In order to achieve the above, the present invention mainly provides a picking portion in the exposed area of the hard board relative to the soft board, and the surface of the picking part is preliminarily provided with a thickening area, and the surface of the hard board is different from the The thickened area is provided with a rubber material, and the thickened area is located at the same horizontal plane as the surface of the rubber material, and after pressing, the hardened plate is removed along the blind trace formed by the blind punching and thickened. The area is simultaneously removed to ensure the flatness around the hard board picking-out part, and it is possible to effectively prevent the occurrence of burrs around the hard board picking-out portion.

The features of the present invention can be clearly understood by referring to the drawings and the detailed description of the embodiments.

The present invention relates to a method for manufacturing a composite circuit board by combining a soft board and a hard board; as shown in the third drawings (A) to (H), the method for manufacturing a composite circuit board of the present invention comprises the following steps: providing at least a soft board 20 having at least one exposed area 21 as shown in FIG. 3A; at least one hard board 30 is provided, and the hard board 30 is provided with respect to the dew area 21 In addition to the portion 31, as shown in the third figure (B), in the embodiment shown in the figure, at least one positioning hole 33 is formed before the periphery of the hard plate 30, and is also used for subsequent processing positioning, and then the hard board. The surface of the 30 is patterned (a yellow light process such as exposure, development, etching, etc.), and at least one bump 34 is formed on the surface of the hard plate 30, as shown in the third figure (C), the bump 34 is relative to Picking up the position of the portion 31, and applying a heat resistant material to the surface of the bump 34 to form a thickened region 32, as shown in the third figure (D); wherein the heat resistant material is applied prior to the surface of the bump a heat resistant glue, and further comprising a heat resistant material on the heat resistant glue, the heat resistant material may be polyimide (PI); sizing, on the hard plate 30 A glue 40 (which may be a hot melt adhesive) is disposed at the thickened area 32. As shown in the third figure (E), the thickened area 32 and the surface of the adhesive 40 are at the same level, as shown in the figure. In the illustrated embodiment, the protrusion 34 protrudes from the sum of the thickness of the surface of the hard plate 30 and the thickness of the thickened portion 32, and is less than or equal to the thickness of the glue 40; press-fit, the hard plate 30 and the softened The plate 20 is pressed to form a main body of the composite circuit board, as shown in the third figure (F); the hard board picking portion is blindly punched, and the blind hole 35 is pre-punched at the hard board picking portion 31 by the cutter 50, As shown in the third figure (G), the depth of the blind hole 35 is preferably closer to the junction of the soft and hard plates 20, 30; the hard plate picking portion and the thickened portion are removed, as shown in the third figure (H). ), the pick-up portion 31 and the thickened portion 32 of the hard board are simultaneously removed along the traces of the blind holes 35 formed after the blind punching, so that the exposed area 21 is exposed, thereby completing a soft board 20 The composite circuit board 60 combined with the hard board 30 is as shown in the fourth figure, and the integrated composite circuit board 60 may be bonded to the hard board 30 only on one side of the soft board 20, or in the soft board. Hard boards are combined on both sides.

Furthermore, in at least one of the hard plates, a copper foil layer 36 may be disposed on the surface of the hard plate 30, and as shown in FIG. 5(A), the copper foil layer 36 of the hard plate surface is patterned. (The yellow light process such as exposure, development, etching, etc. can be used), the copper foil layer 36 is formed with at least one copper block 361 and a connecting wire 362 connecting the copper blocks 361, as shown in the fifth figure (B), (C) The copper block 361 is positioned relative to the pick-up portion 32. The connecting wire 362 can be processed to remove the position to be removed, and then plated to form a thickened portion 32 (also made of copper) on the surface of each copper block 361. And the connecting wire portion can be removed, as shown in FIG. 5(D), after the sizing, the copper block 361 protrudes from the sum of the thickness of the surface of the hard plate 30 and the thickness of the thickened portion 32, which is less than or equal to After the thickness of the rubber material 40 is subjected to the above-described subsequent pressing and the like, the soft and hard composite circuit board structure of the present invention can also be formed.

In the present invention, the thickened area is filled in the gap between the pick-up portion and the exposed area, so that when the cutter is cut, the hard board can be supported by the thickened area, so that the cut surface is relatively flat, and The hard board is not burred around the cut portion, and the invention is formed by the blind punching method, which is less prone to dust than the blind or blind cut; and the hard board thickening is avoided in advance during the sizing process. The area is not glued, so as to remove the hard board picking parts and thickening areas in the future, without generating residual glue in the exposed area, and ensuring the accuracy of the circuit connection; and also utilizing the current expired or scrapped The protective film (which is made of polyamidamine, which is the main material of the current soft board) is used as a heat-resistant substance to be attached to the surface of the bump to achieve the energy-saving effect of recycling waste.

In summary, the present invention provides a preferred method for manufacturing a soft and hard composite circuit board, and an application for an invention patent according to the law; the technical content and technical features of the present invention are disclosed above, but those skilled in the art may still The various alternatives and modifications may be made without departing from the spirit and scope of the invention. Therefore, the scope of the present invention should be construed as being limited by the scope of the appended claims

10. . . Soft and hard composite circuit board

11. . . hard Board

111. . . Burr

12. . . Soft board

121. . . Dew area

20. . . Soft board

twenty one. . . Dew area

30. . . hard Board

31. . . Picking out part

32. . . Thickened area

33. . . Positioning hole

34. . . Bump

35. . . Blind hole

36. . . Copper foil layer

361. . . Copper block

362. . . Connecting wire

40. . . Plastic material

50. . . Tool

60. . . Composite circuit board

The first figure is a schematic diagram of the structure of a conventional soft and hard composite circuit board.

The second figure is a schematic structural view of a conventional hard and soft composite circuit board to cut a part of the hard board.

The third diagrams (A) to (H) are schematic diagrams showing the manufacturing process of the soft and hard composite circuit board in the present invention.

The fourth figure is a schematic structural view of the soft and hard composite circuit board in the present invention.

The fifth figure (A)~(D) is a schematic flow chart of another thickened area.

20. . . Soft board

twenty one. . . Dew area

30. . . hard Board

31. . . Picking out part

32. . . Thickened area

33. . . Positioning hole

34. . . Bump

35. . . Blind hole

40. . . Plastic material

50. . . Tool

Claims (10)

A method for manufacturing a soft and hard composite circuit board, comprising the steps of: providing at least one soft board, wherein the soft board is provided with at least one exposed area; at least one hard board is provided, the hard board is provided with respect to the exposed area Picking up a portion, and the surface of the picking portion is provided with a thickening zone; and sizing, a glue material is disposed on the surface of the hardened board different from the thickened area, and the thickened area is at the same horizontal plane as the surface of the rubber material; Pressing, the hard board and the soft board are pressed together to form the main body of the composite circuit board; the hard board picking up part is blindly punched, and the hard board picking up part is pre-punched with blind holes; removing the hard board picking The part and the thickened area, along the blind hole marks formed after the blind punching, remove the hardened part and the thickened area at the same time, thereby completing a composite circuit board which combines the soft board and the hard board. The method for manufacturing a soft and hard composite circuit board according to claim 1, wherein at least one of the hard plates is provided, and the surface of the hard board is patterned to form at least one bump on the surface of the hard board. The heat-resistant substance is applied to the surface of the bump relative to the position of the pick-up portion. The method for manufacturing a soft and hard composite circuit board according to claim 2, wherein when the heat resistant material is applied, a heat resistant adhesive is disposed on the surface of the bump, and a heat resistant material is disposed on the heat resistant adhesive. The method for manufacturing a soft and hard composite circuit board according to claim 2 or 3, wherein the heat resistant material is polyimide (PI). The method for manufacturing a soft and hard composite circuit board according to claim 2 or 3, wherein the sum of the thickness of the surface of the protruding protruding hard plate and the thickness of the thickened portion is less than or equal to the thickness of the rubber material. The method for manufacturing a soft and hard composite circuit board according to claim 1, wherein at least one hard plate is provided, the surface of the hard plate is provided with a copper foil layer, and the copper foil layer on the surface of the hard plate is patterned to make The copper foil layer is formed with at least one copper block and a connecting wire connecting the copper blocks, and the copper block is plated with respect to the position of the pick-up portion to form a thickened region on the surface of each copper block. The method for manufacturing a soft and hard composite circuit board according to claim 6, wherein the thickness of the surface of the copper block protruding hard plate and the thickness of the thickened portion is less than or equal to the thickness of the rubber material. The method for manufacturing a soft and hard composite circuit board according to claim 2, 3 or 6, wherein the patterning can be performed by a yellow light process. The method for manufacturing a soft and hard composite circuit board according to claim 1, 2, 3 or 6, wherein the depth of the blind hole is preferably closer to the junction of the soft and hard plates. The manufacturing method of the soft and hard composite circuit board of claim 1, 2, 3 or 6, wherein at least one of the hard plates is provided to form at least one positioning hole around the hard board.