TW201323812A - Vacuum dry apparatus - Google Patents

Vacuum dry apparatus Download PDF

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Publication number
TW201323812A
TW201323812A TW101132338A TW101132338A TW201323812A TW 201323812 A TW201323812 A TW 201323812A TW 101132338 A TW101132338 A TW 101132338A TW 101132338 A TW101132338 A TW 101132338A TW 201323812 A TW201323812 A TW 201323812A
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TW
Taiwan
Prior art keywords
pin
dried
vacuum drying
casing
support pin
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TW101132338A
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Chinese (zh)
Inventor
Young-Jun Jeon
Min-Chul Lee
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Tera Semicon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Priority claimed from KR1020110090416A external-priority patent/KR101243313B1/en
Priority claimed from KR1020110090415A external-priority patent/KR20130026945A/en
Application filed by Tera Semicon Corp filed Critical Tera Semicon Corp
Publication of TW201323812A publication Critical patent/TW201323812A/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying

Abstract

Disclosed is a vacuum drying apparatus. Installed in the vacuum drying apparatus according to the present invention are: a supporting pin which supports a substrate to be dried, passes through a housing, and is capable of being raised and lowered; and a sealing means which seals a space between the supporting pin and the portion of the housing through which the supporting pin passes, and which is installed on the outside of the bottom surface of the housing so as not to interfere with the supporting pin. Therefore, the sealing means is not damaged by the supporting pin, thus preventing a leak from a vacuum of a chamber into which an object to be dried is loaded and dried. Accordingly, the reliability of a vacuum drying process is enhanced, and the maintenance and repair of the vacuum drying apparatus are convenient.; Further, since the supporting pin supporting the object to be dried has a fixing pin positioned and fixed at a lower side thereof and a moving pin which is movably installed at an upper side of the supporting pin and on which the object to be dried is loaded and supported, when the object to be dried moves in a state in which the object to be dried is loaded and supported on the moving pin, the moving pin is moved together with the object to be dried. Accordingly, the moving pin is prevented from being damaged by the object to be dried, and the object to be dried is prevented from being damaged by the moving pin, so that product reliability is improved.

Description

真空乾燥裝置 Vacuum drying device 發明領域 Field of invention

本發明係有關一種以真空使塗布於基板之塗佈液所含有之溶媒乾燥的真空乾燥裝置。 The present invention relates to a vacuum drying apparatus which dries a solvent contained in a coating liquid applied to a substrate by vacuum.

發明背景 Background of the invention

於用於LCD(Liquid Crystal Display:液晶顯示器)、OLED(Organic Light Emitting Diodes:有機發光二極體)顯示器或FED(Field Emission Display:場發射顯示器)等之平板顯示元件用基板塗佈光阻劑等塗佈液。又,為將塗佈液均一地塗佈於基板,使諸如溶劑等之溶媒摻合於塗佈液而塗佈。 Coating a photoresist for a substrate for a flat panel display element such as an LCD (Liquid Crystal Display), an OLED (Organic Light Emitting Diodes) display, or an FED (Field Emission Display) Such as coating liquid. Further, in order to apply the coating liquid uniformly to the substrate, a solvent such as a solvent is blended into the coating liquid to be applied.

塗佈液所含有之溶媒雖然可自然地蒸發,但由於至溶媒完全蒸發耗費許多時間,故使溶媒自然地蒸發後,若於塗佈液塗敷任意之物質,則生產性降低。又,若在未完全去除塗佈液含有之溶媒之狀態下,於塗佈液上塗敷任意之物質,於塗佈液硬化時,由於於因殘留於塗佈液而硬化之塗佈層形成氣孔,故基板之品質降低。 Although the solvent contained in the coating liquid can be naturally evaporated, it takes a lot of time until the solvent is completely evaporated. Therefore, when the solvent is naturally evaporated, if the coating liquid is applied with any substance, the productivity is lowered. Further, when the solvent contained in the coating liquid is not completely removed, an arbitrary substance is applied to the coating liquid, and when the coating liquid is cured, pores are formed in the coating layer which is hardened by the coating liquid. Therefore, the quality of the substrate is lowered.

根據前述理由,開發了一種真空乾燥裝置來使用,該真空乾燥裝置係於基板塗佈塗佈液後,利用壓力差,使塗佈液所含有之溶媒強制地蒸發而去除。 For the above reasons, a vacuum drying apparatus has been developed which removes the solvent contained in the coating liquid by forcibly evaporating the coating liquid after the coating liquid is applied to the substrate.

一般,真空乾燥裝置具有形成裝置基板而將之乾燥之密閉空間之腔室的下部殼體及上部殼體。前述下部殼體為 固定,前述上部殼體可升降地設置於前述下部殼體之上側。若前述上部殼體下降,密封於前述下部殼體而結合,可於前述下部殼體與前述上部殼體之間形成前述腔室。 Generally, a vacuum drying apparatus has a lower casing and an upper casing of a chamber in which a device substrate is formed and dried in a sealed space. The aforementioned lower housing is The upper housing is fixedly disposed on the upper side of the lower housing. The chamber may be formed between the lower casing and the upper casing if the upper casing is lowered and sealed to the lower casing.

又,支撐裝載於前述腔室之基板之複數支撐銷可升降地設置於前述下部殼體之下側,前述支撐銷在貫穿前述下部殼體之下面之狀態下升降。於以機器手臂支撐基板,將基板裝載於前述腔室時,前述支撐銷之上端部側可突出至前述下部殼體之下面上側而支撐基板。 Further, a plurality of support pins supporting the substrate mounted on the chamber are vertically disposed on the lower side of the lower casing, and the support pins are raised and lowered in a state of penetrating the lower surface of the lower casing. When the substrate is supported by the robot arm and the substrate is loaded into the chamber, the upper end side of the support pin may protrude to the lower surface side of the lower case to support the substrate.

由於前述支撐銷設置成可升降,故可使用前述機器手臂,將基板便利地裝載於前述腔室或卸載。又,若將前述支撐銷設置成可升降,而可使前述支撐銷依需要突出至前述下部殼體之下面上側,相較於前述支撐銷一直突出至前述下部殼體之下面上側之構造,可減低腔室之空間。 Since the aforementioned support pin is provided to be movable up and down, the aforementioned robot arm can be used to conveniently load the substrate into the aforementioned chamber or unload. Further, if the support pin is provided to be movable up and down, the support pin may be protruded to the lower surface side of the lower casing as needed, and the support pin may protrude to the lower surface side of the lower casing. Reduce the space in the chamber.

如前述之習知真空乾燥裝置由於前述支撐銷貫穿前述下部殼體之下面,故透過前述支撐銷貫穿之前述下部殼體之部位,漏前述腔室之真空。 In the above-described conventional vacuum drying apparatus, since the support pin penetrates the lower surface of the lower casing, the vacuum of the chamber is leaked through the portion of the lower casing through which the support pin penetrates.

為防止此,於前述支撐銷之外周面設置O型環等,以防止漏前述腔室之真空。而由於前述支撐銷進行升降運動,故前述O型環因前述支撐銷之運動而磨損。藉此,由於可能漏前述腔室之真空,故有真空乾燥步驟之可靠度降低之缺點。 To prevent this, an O-ring or the like is provided on the outer peripheral surface of the support pin to prevent leakage of the vacuum of the chamber. Since the support pin is moved up and down, the O-ring is worn by the movement of the support pin. Thereby, since the vacuum of the chamber may be leaked, there is a disadvantage that the reliability of the vacuum drying step is lowered.

又,由於必須頻繁地更換前述O型環,故有花費許多保養費用之缺點。 Moreover, since the O-ring must be frequently replaced, there are disadvantages in that a lot of maintenance costs are incurred.

又,若在基板搭載支撐於前述支撐銷之狀態下,基板 遊動時,有支撐銷因基板之遊動而損傷之虞,因支撐銷刮基板,基板可能損傷,故有製品之可靠度降低之缺點。 Further, when the substrate is mounted and supported by the support pin, the substrate When swimming, there is a flaw in the support pin due to the movement of the substrate. Since the support pin scrapes the substrate, the substrate may be damaged, so that the reliability of the product is reduced.

發明概要 Summary of invention

本發明係為解決如前述之習知技術之問題而導出者,其目的在於提供一種設置密封機構,俾不與設置成可升降而支撐為被乾燥體之基板之支撐銷干擾,而可使真空乾燥步驟之可靠度提高之真空乾燥裝置。 The present invention has been made in order to solve the problems of the prior art as described above, and an object thereof is to provide a sealing mechanism which does not interfere with a support pin which is arranged to be lifted and supported as a substrate of a dried body, and can be vacuumed. A vacuum drying device with improved reliability in the drying step.

本發明之另一目的在於提供一種可減低保養費用之真空乾燥裝置。 Another object of the present invention is to provide a vacuum drying apparatus which can reduce maintenance costs.

本發明之再另一目的在於提供防止支撐銷因被乾燥體而損傷,同時,防止被乾燥體因支撐銷而損傷,而可使製品之可靠度提高之真空乾燥裝置。 Still another object of the present invention is to provide a vacuum drying apparatus which prevents the support pin from being damaged by the dried body and prevents the dried body from being damaged by the support pin, thereby improving the reliability of the product.

用以達成前述目的之本發明之真空乾燥裝置包含有本體、殼體、複數支撐銷、泵送機構及密封機構,該殼體係設置於前述本體之內部,並形成裝載被乾燥體而將之乾燥之腔室者;該複數支撐銷係可升降地設置於前述殼體之下側,上端部側貫穿前述殼體,出入前述腔室,並且支撐裝載於前述腔室之前述被乾燥體;該泵送機構係設置於前述本體之一側,將前述腔室減壓至真空狀態者;該密封機構係設置於前述支撐銷貫穿之前述殼體之外面,與前述支撐銷不接觸,並密封前述支撐銷貫穿之前述殼體之部位者。 The vacuum drying device of the present invention for achieving the above object comprises a body, a casing, a plurality of support pins, a pumping mechanism and a sealing mechanism, the casing being disposed inside the body and forming a dried body to be dried a plurality of support pins; the plurality of support pins are vertically disposed on a lower side of the housing, the upper end side penetrates the housing, enters and exits the chamber, and supports the dried body loaded in the chamber; the pump The feeding mechanism is disposed on one side of the main body, and decompresses the chamber to a vacuum state; the sealing mechanism is disposed on an outer surface of the housing through which the support pin penetrates, does not contact the support pin, and seals the support The pin penetrates the part of the aforementioned casing.

本發明之真空乾燥裝置係用以支撐為被乾燥體之基板之支撐銷貫穿殼體並且設置成可升降,用以密封支撐銷與支撐銷貫穿之殼體部位之間之密封機構不與支撐銷干擾並且設置於殼體之下面外側。如此一來,由於密封機構不因支撐銷而損傷,故不致漏用以裝載被乾燥體而將之乾燥之腔室的真空。因而,可發揮真空乾燥步驟之可靠度提高,真空乾燥裝置之保養作業簡單之效果。 The vacuum drying device of the present invention is configured to support the support pin of the substrate of the object to be dried through the casing and is arranged to be lifted and lowered, and the sealing mechanism between the support pin and the casing portion through which the support pin penetrates is not supported by the support pin. Interference and disposed on the outside of the lower side of the housing. As a result, since the sealing mechanism is not damaged by the support pin, the vacuum for filling the chamber to be dried by the dried body is not leaked. Therefore, the reliability of the vacuum drying step can be improved, and the maintenance work of the vacuum drying device can be simplified.

又,由於用以支撐被乾燥體之支撐銷具有位於下部側而固定之固定銷及位於上部側並設置成可遊動以搭載支撐被乾燥體之遊動銷,故若在被乾燥體搭載支撐於遊動銷之狀態下,被乾燥體遊動時,遊動銷與被乾燥體一同遊動。因而,由於可防止遊動銷因被乾燥體而損傷,且可防止被乾燥體因遊動銷而損傷,故有製品之可靠度提高之效果。 Further, since the support pin for supporting the object to be dried has a fixing pin that is fixed on the lower side and a floating pin that is located on the upper side and is provided to be movable to support the body to be dried, the support is supported by the dried body. In the state of the pin, when the object is moved by the dry body, the swimming pin and the object to be dried swim together. Therefore, since the floating pin can be prevented from being damaged by the dried body, and the dried body can be prevented from being damaged by the floating pin, the reliability of the product can be improved.

圖式簡單說明 Simple illustration

圖1係本發明一實施形態之真空乾燥裝置之立體圖。 Fig. 1 is a perspective view of a vacuum drying apparatus according to an embodiment of the present invention.

圖2係圖1所示之殼體部位之立體圖。 Figure 2 is a perspective view of the housing portion shown in Figure 1.

圖3係圖2所示之下部殼體與上部殼體之放大立體圖。 Figure 3 is an enlarged perspective view of the lower housing and the upper housing shown in Figure 2 .

圖4係圖3之平面立體圖。 Figure 4 is a plan perspective view of Figure 3.

圖5係圖3所示之伸縮管之放大立體圖。 Figure 5 is an enlarged perspective view of the telescopic tube shown in Figure 3.

圖6係圖5之截面圖。 Figure 6 is a cross-sectional view of Figure 5.

用以實施發明之形態 Form for implementing the invention

後述之關於本發明之詳細說明參照將可實施本發明之 特定實施形態作為例子而顯示之附加圖式。充分詳細地說明該等實施形態,以使該業者可實施本發明。務必理解本發明之多種實施形態雖相互不同,但不需相互排斥。舉例言之,於此記載之特定形狀、特定之構造及特性與一實施形態相關,在不脫離本發明之精神及範圍下可以其他實施形態實現。又,務必理解各個揭示之實施形態中之個別構成要件之位置或配置在不脫離本發明之精神及範圍下可變更。因而,後述之詳細說明非限定之涵義,當適當地說明本發明之範圍時,僅以與該等申請項主張者均等之所有範圍一同附加之申請項限定。圖式所示之實施形態之長度、面積、厚度及形態為方便,亦可能有誇張呈現之情形。 The detailed description of the present invention, which will be described hereinafter, with reference to the present invention The specific embodiment shown as an example of a specific embodiment. These embodiments are described in sufficient detail to enable the practitioner to practice the invention. It is to be understood that the various embodiments of the invention are different from each other, but need not be mutually exclusive. For example, the specific shapes, specific structures, and characteristics described herein may be made in various embodiments without departing from the spirit and scope of the invention. Further, it is to be understood that the position or arrangement of the individual components of the embodiments disclosed herein may be modified without departing from the spirit and scope of the invention. Therefore, the scope of the present invention is defined by the scope of the claims, and the scope of the present invention is defined by the appended claims. The length, area, thickness and shape of the embodiment shown in the drawings are convenient and may be exaggerated.

以下,參照附加之圖式,詳細地說明本發明一實施形態之真空乾燥裝置。 Hereinafter, a vacuum drying apparatus according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

圖1係本發明一實施形態之真空乾燥裝置之立體圖,圖2係圖1所示之殼體部位之立體圖。 1 is a perspective view of a vacuum drying apparatus according to an embodiment of the present invention, and FIG. 2 is a perspective view of a housing portion shown in FIG. 1.

如圖所示,本實施形態之真空乾燥裝置包含有形成外觀之本體110,並於本體110之內部設置殼體120。於殼體120之內部形成腔室120a,該腔室係為裝載諸如平板顯示元件用基板等之被乾燥體50而將之乾燥之密閉的空間。 As shown in the figure, the vacuum drying apparatus of the present embodiment includes a main body 110 that forms an outer appearance, and a housing 120 is provided inside the main body 110. A chamber 120a is formed inside the casing 120, and this chamber is a sealed space in which the dried body 50 such as a substrate for a flat panel display element is dried and dried.

於被乾燥體50塗佈諸如光阻劑等之塗佈液,塗佈液含有諸如溶劑等之溶媒。當將被乾燥體50裝載於腔室120a時,便將腔室120a減壓而形成為真空狀態,藉此,塗佈於被乾燥體50之塗佈液含有之溶媒因壓力差而強制地蒸發。 A coating liquid such as a photoresist or the like is applied to the dried body 50, and the coating liquid contains a solvent such as a solvent. When the dried body 50 is placed in the chamber 120a, the chamber 120a is depressurized to be in a vacuum state, whereby the solvent contained in the coating liquid applied to the object to be dried 50 is forcibly evaporated due to a pressure difference. .

殼體120具有固定於本體110之下部殼體121、支撐於下 部殼體121上側之本體110之部位並設置成可升降的上部殼體125。當上部殼體125下降時,便將上部殼體125與下部殼體121密封結合,而形成密閉之腔室120a。又,當上部殼體125上升時,上部殼體125與下部殼體121拉開距離,藉此,可開放腔室120a。當開放腔室120a時,將被乾燥體50裝載於腔室120a,或從腔室120a卸載。 The housing 120 has a housing 121 fixed to the lower portion of the body 110 and supported under The portion of the body 110 on the upper side of the housing 121 is provided as an upper housing 125 that can be raised and lowered. When the upper casing 125 is lowered, the upper casing 125 and the lower casing 121 are sealingly joined to form a sealed chamber 120a. Further, when the upper casing 125 is raised, the upper casing 125 and the lower casing 121 are separated by a distance, whereby the chamber 120a can be opened. When the chamber 120a is opened, the object to be dried 50 is loaded into or unloaded from the chamber 120a.

上部殼體125以固定於本體110之諸如馬達或氣缸等之第1驅動機構131升降。又,於本體110之一側設置泵送機構135,該泵送機構係密閉腔室120a時,用以將腔室120a減壓至真空狀態之真空泵等。泵送機構135為了被乾燥體50之均一之乾燥,宜分別與下部殼體121之下面及上部殼體125之上面連通,將腔室120a減壓。 The upper casing 125 is lifted and lowered by a first drive mechanism 131 such as a motor or a cylinder fixed to the main body 110. Further, a pumping mechanism 135 is provided on one side of the main body 110, and the pumping mechanism is a vacuum pump or the like for decompressing the chamber 120a to a vacuum state when the chamber 120a is sealed. In order to uniformly dry the dried body 50, the pumping mechanism 135 preferably communicates with the lower surface of the lower casing 121 and the upper surface of the upper casing 125 to decompress the chamber 120a.

於被乾燥體50裝載於腔室120a時,當被乾燥體50與下部殼體121之內部下面接觸時,以機器手臂(圖中未示)支撐被乾燥體50,將被乾燥體50裝載於腔室120a,或將被乾燥體50從腔室120a卸載時,由於被乾燥體50與下部殼體121之內部下面之間無間隔,故不便。 When the dried body 50 is placed in the chamber 120a, when the object to be dried 50 comes into contact with the lower surface of the lower portion of the lower casing 121, the object to be dried 50 is supported by a robot arm (not shown), and the object to be dried 50 is placed on the body 50a. When the chamber 120a or the dried body 50 is unloaded from the chamber 120a, there is no space between the dried body 50 and the lower surface of the lower casing 121, which is inconvenient.

又,將被乾燥體50裝載於腔室120a時,當被乾燥體50與下部殼體121之內部下面接觸時,可能妨礙泵送機構135所作之往下部殼體121之下面外側之泵送。 Further, when the dried body 50 is placed in the chamber 120a, when the dried body 50 comes into contact with the inner lower surface of the lower casing 121, the pumping mechanism 135 may be prevented from pumping to the lower outer side of the lower casing 121.

藉此,於將被乾燥體50裝載於腔室120a時,用以使被乾燥體50與下部殼體121之內部下面拉開距離而支撐之複數支撐銷140(參照圖4)設置成可升降。 Thereby, when the object to be dried 50 is placed in the chamber 120a, a plurality of support pins 140 (refer to FIG. 4) for supporting the object to be dried 50 and the lower surface of the lower casing 121 are provided so as to be movable up and down. .

支撐銷140係下端部設置於可升降地設置於下部殼體 121之下側之升降板150。因而,藉升降板150升降,支撐銷40亦升降。支撐銷140之上端部側貫穿形成於下部殼體121之下面的貫穿孔122(參照圖4),可出入腔室120a,並且支撐裝載於腔室120a之被乾燥體50。 The lower end of the support pin 140 is disposed on the lower housing The lifting plate 150 on the lower side of 121. Therefore, the lifting plate 150 is raised and lowered, and the support pin 40 is also raised and lowered. The upper end side of the support pin 140 penetrates through the through hole 122 (refer to FIG. 4) formed under the lower casing 121, and can enter and exit the chamber 120a and support the dried body 50 loaded in the chamber 120a.

於升降板150下側之本體110之部位固定支承板160,並於支承板160設置用以使升降板150升降之諸如馬達或氣缸等之第2驅動機構(圖中未示)。 The support plate 160 is fixed to a portion of the body 110 on the lower side of the lift plate 150, and a second drive mechanism (not shown) such as a motor or a cylinder for lifting the lift plate 150 is provided on the support plate 160.

由於支撐銷140設置成可升降,故可使支撐銷140依需要突出至下部殼體121之下面上側。如此一來,相較於支撐銷140一直突出至下部殼體121之下面上側之構造,可減低腔室120a之空間。 Since the support pin 140 is disposed to be movable up and down, the support pin 140 can be protruded to the lower surface side of the lower casing 121 as needed. As a result, the space of the chamber 120a can be reduced as compared with the configuration in which the support pin 140 protrudes to the lower surface side of the lower casing 121.

由於支撐銷140貫穿貫穿孔122,故腔室120a之真空可能漏洩至支撐銷140之外周面與貫穿孔122之內周面之間。為防止此,於形成有貫穿孔122之下部殼體121之下面外側部位設密封機構。 Since the support pin 140 penetrates the through hole 122, the vacuum of the chamber 120a may leak between the outer circumferential surface of the support pin 140 and the inner circumferential surface of the through hole 122. To prevent this, a sealing mechanism is provided on the lower outer side portion of the lower casing 121 in which the through hole 122 is formed.

就前述密封機構,參照圖3~圖5來說明。圖3係圖2所示之下部殼體與上部殼體之放大立體圖,圖4係圖3之平面立體圖,圖5係圖3所示之伸縮管之放大立體圖。 The sealing mechanism will be described with reference to Figs. 3 to 5 . 3 is an enlarged perspective view of the lower casing and the upper casing shown in FIG. 2, FIG. 4 is a plan perspective view of FIG. 3, and FIG. 5 is an enlarged perspective view of the telescopic pipe shown in FIG.

如圖所示,前述密封機構係以伸縮管170而設,該伸縮管係中央部側覆蓋支撐銷140,上部側密封於下部殼體121之下面而結合,下部側密封於升降板150而結合,而可藉升降板150升降而伸縮。此時,支撐銷140與伸縮管170非接觸,對支撐銷140之運動,伸縮管170不干擾。 As shown in the figure, the sealing mechanism is provided by a telescopic tube 170 that covers the support pin 140 at the central portion side, the upper side is sealed to the lower surface of the lower housing 121, and the lower side is sealed to the lifting plate 150 for bonding. And can be extended and lowered by the lifting plate 150. At this time, the support pin 140 is not in contact with the telescopic tube 170, and the telescopic tube 170 does not interfere with the movement of the support pin 140.

如此一來,由於支撐銷140位於伸縮管170之內部,伸 縮管170之內部密閉而與腔室120a同樣地維持真空狀態,故結果,可密封支撐銷140與貫穿孔122之間之部位。 In this way, since the support pin 140 is located inside the extension tube 170, the extension The inside of the shrinkable tube 170 is sealed and maintained in a vacuum state similarly to the chamber 120a. As a result, the portion between the support pin 140 and the through hole 122 can be sealed.

為更穩定地密封伸縮管170與下部殼體121之間及伸縮管170與升降板150之間,O型環181可介在伸縮管170與下部殼體121間,O型環185(參照圖6)可介在伸縮管170與升降板150之間。 In order to more stably seal between the extension tube 170 and the lower housing 121 and between the extension tube 170 and the lifting plate 150, the O-ring 181 can be interposed between the extension tube 170 and the lower housing 121, and the O-ring 185 (refer to FIG. 6). ) can be interposed between the telescopic tube 170 and the lifting plate 150.

又,可於伸縮管170之上端面形成供O型環181插入而置放之置放路171,亦可於伸縮管170之下端面形成供O型環185插入而置放之置放路175(參照圖6)。 Further, a placement path 171 into which the O-ring 181 is inserted and placed may be formed on the upper end surface of the extension tube 170, or a placement path 175 in which the O-ring 185 is inserted and placed on the lower end surface of the extension tube 170 may be formed. (Refer to Figure 6).

本實施形態之真空乾燥裝置以於支撐銷140貫穿之下部殼體121之下面外側覆蓋支撐銷140之形態密封伸縮管170而設置,伸縮管170可藉支撐銷140升降而升縮。即,由於即使支撐銷140進行升降運動,支撐銷140與伸縮管170亦不相互干擾,故無支撐銷140引起之伸縮管170之損傷。因而,可完全密封支撐銷140與貫穿孔122之間之部位。 The vacuum drying device of the present embodiment is provided such that the support pin 140 is sealed to the outer side of the lower casing 121 so as to cover the support pin 140, and the telescopic tube 170 can be lifted and lowered by the support pin 140. That is, since the support pin 140 and the extension tube 170 do not interfere with each other even if the support pin 140 is moved up and down, the support tube 140 does not cause damage to the extension tube 170. Thus, the portion between the support pin 140 and the through hole 122 can be completely sealed.

被乾燥體50搭載支撐於支撐銷140。而若支撐銷140固定時,支撐銷140可能因被乾燥體50之遊動損傷,或被乾燥體50因支撐銷140而損傷。 The dried body 50 is mounted and supported by the support pin 140. On the other hand, when the support pin 140 is fixed, the support pin 140 may be damaged by the movement of the dried body 50, or the dried body 50 may be damaged by the support pin 140.

為防止此,本實施形態之真空乾燥裝置之支撐銷140形成為於被乾燥體50遊動時,可與被乾燥體50一同遊動。就支撐銷140,參照圖5及圖6來說明。圖6係圖5之截面圖。 In order to prevent this, the support pin 140 of the vacuum drying apparatus of the present embodiment is formed to be able to swim with the object to be dried 50 when the object to be dried 50 swims. The support pin 140 will be described with reference to FIGS. 5 and 6. Figure 6 is a cross-sectional view of Figure 5.

如圖所示,支撐銷140具有位於下部側之固定銷141及位於上部側之遊動銷145。 As shown, the support pin 140 has a fixing pin 141 on the lower side and a floating pin 145 on the upper side.

固定銷141之下端部側固定於伸縮管170之下面,上端 部側則形成為平坦之平面。遊動銷145之下端部側形成為平坦之平面,在固定銷141之上端面上,設置成可滑動,上部側則貫穿貫穿孔122(參照圖4),於上端部搭載支撐被乾燥體50。 The lower end side of the fixing pin 141 is fixed to the lower side of the telescopic tube 170, and the upper end The side of the part is formed as a flat plane. The lower end side of the floating pin 145 is formed into a flat plane, and is provided to be slidable on the upper end surface of the fixing pin 141, and the upper side penetrates the through hole 122 (see FIG. 4), and the support dried body 50 is mounted on the upper end.

此時,固定銷141之上端部側與遊動銷145之下端部側為套筒191覆蓋而受到支撐,球體193介在形成平面而相互對向之固定銷141之上端面與遊動銷145之下端面之間。又,於遊動銷145之下端面之外周面與套筒191之外周面之間形成間隙。因而,遊動銷145可在固定銷141上滑動。 At this time, the upper end side of the fixing pin 141 and the lower end side of the floating pin 145 are covered by the sleeve 191 and supported, and the spherical body 193 is formed on the upper end surface of the fixing pin 141 and the lower end surface of the floating pin 145 which are formed to face each other. between. Further, a gap is formed between the outer peripheral surface of the lower end surface of the floating pin 145 and the outer peripheral surface of the sleeve 191. Thus, the floating pin 145 can slide on the fixing pin 141.

於伸縮管170之上面設置引導構件195,遊動銷145貫穿引導構件195。引導構件195引導遊動銷之升降運動。此時,於引導構件195之內周面與遊動銷145之外周面之間形成間隙。引導構件195之內周面與遊動銷145之外周面之間之間隙容許遊動銷145之滑動。又,為容許遊動銷145之滑動,亦於貫穿孔122之內周面與遊動銷145之外周面之間形成間隙。 A guiding member 195 is disposed on the upper surface of the telescopic tube 170, and the floating pin 145 penetrates the guiding member 195. The guiding member 195 guides the lifting movement of the flying pin. At this time, a gap is formed between the inner circumferential surface of the guiding member 195 and the outer circumferential surface of the floating pin 145. The gap between the inner circumferential surface of the guiding member 195 and the outer circumferential surface of the floating pin 145 allows the sliding of the floating pin 145. Further, in order to allow the sliding of the floating pin 145, a gap is formed between the inner circumferential surface of the through hole 122 and the outer circumferential surface of the floating pin 145.

本實施形態之真空乾燥裝置藉介在遊動銷145與固定銷141之間之球體193、遊動銷145之下端面之外周面與套筒191之內周面之間之間隙、引導構件195之內周面與遊動銷145之外周面之間的間隙及貫穿孔122之內周面與遊動銷145之外周面之間的間隙,遊動銷145可在固定銷141上滑動。 The vacuum drying apparatus of the present embodiment borrows a space between the ball 193 between the floating pin 145 and the fixing pin 141, the outer circumferential surface of the lower end surface of the floating pin 145, and the inner circumferential surface of the sleeve 191, and the inner circumference of the guiding member 195. The gap between the surface and the outer peripheral surface of the floating pin 145 and the gap between the inner peripheral surface of the through hole 122 and the outer peripheral surface of the floating pin 145 allow the floating pin 145 to slide on the fixed pin 141.

如此一來,當在被乾燥體50搭載支撐於遊動銷145之上端部之狀態下被乾燥體50遊動時,藉被乾燥體50遊動銷145可滑動。藉此,可防止遊動銷145因被乾燥體50而損傷,亦 可防止被乾燥體50因遊動銷145而損傷。 In this manner, when the dried body 50 is supported by the upper end portion of the floating pin 145 and is moved by the dried body 50, the floating pin 145 can be slid by the dried body 50. Thereby, the swimming pin 145 can be prevented from being damaged by the dried body 50, The dried body 50 can be prevented from being damaged by the floating pin 145.

本發明如前述,舉較佳之實施形態為例顯示而說明,但不限於前述實施形態,在不脫離本發明之精神之範圍內,在該發明所屬之技術領域具有一般知識者可進行多樣之變形及變更。該種變形例及變更例應視為屬於本發明及附加之申請專利範圍之範圍內者。 The present invention has been described with reference to the preferred embodiments of the present invention. However, the present invention is not limited to the embodiments described above, and various modifications may be made by those skilled in the art to which the invention pertains without departing from the spirit of the invention. And changes. Such modifications and variations are considered to be within the scope of the invention and the scope of the appended claims.

50‧‧‧被乾燥體 50‧‧‧Dry body

110‧‧‧本體 110‧‧‧ body

120‧‧‧殼體 120‧‧‧shell

120a‧‧‧腔室 120a‧‧‧室

121‧‧‧下部殼體 121‧‧‧ Lower housing

122‧‧‧貫穿孔 122‧‧‧through holes

125‧‧‧上部殼體 125‧‧‧Upper casing

131‧‧‧第1驅動機構 131‧‧‧1st drive mechanism

135‧‧‧泵送機構 135‧‧‧ pumping mechanism

140‧‧‧支撐銷 140‧‧‧Support pin

141‧‧‧固定銷 141‧‧‧fixed pin

145‧‧‧遊動銷 145‧‧‧Travel pin

150‧‧‧升降板 150‧‧‧ lifting plate

160‧‧‧支承板 160‧‧‧support plate

170‧‧‧伸縮管 170‧‧‧ telescopic tube

181,185‧‧‧O型環 181,185‧‧‧O-ring

191‧‧‧套筒 191‧‧‧Sleeve

193‧‧‧球體 193‧‧‧ sphere

195‧‧‧引導構件 195‧‧‧Guiding components

圖1係本發明一實施形態之真空乾燥裝置之立體圖。 Fig. 1 is a perspective view of a vacuum drying apparatus according to an embodiment of the present invention.

圖2係圖1所示之殼體部位之立體圖。 Figure 2 is a perspective view of the housing portion shown in Figure 1.

圖3係圖2所示之下部殼體與上部殼體之放大立體圖。 Figure 3 is an enlarged perspective view of the lower housing and the upper housing shown in Figure 2 .

圖4係圖3之平面立體圖。 Figure 4 is a plan perspective view of Figure 3.

圖5係圖3所示之伸縮管之放大立體圖。 Figure 5 is an enlarged perspective view of the telescopic tube shown in Figure 3.

圖6係圖5之截面圖。 Figure 6 is a cross-sectional view of Figure 5.

50‧‧‧被乾燥體 50‧‧‧Dry body

110‧‧‧本體 110‧‧‧ body

120‧‧‧殼體 120‧‧‧shell

120a‧‧‧腔室 120a‧‧‧室

121‧‧‧下部殼體 121‧‧‧ Lower housing

125‧‧‧上部殼體 125‧‧‧Upper casing

135‧‧‧泵送機構 135‧‧‧ pumping mechanism

Claims (10)

一種真空乾燥裝置,其特徵在於包含有:本體;殼體,係設置於前述本體之內部,並形成裝載被乾燥體而將之乾燥之腔室者;複數支撐銷,係可升降地設置於前述殼體之下側,上端部側貫穿前述殼體,出入前述腔室,並且支撐裝載於前述腔室之前述被乾燥體;泵送機構,係設置於前述本體之一側,將前述腔室減壓至真空狀態者;及密封機構,係設置於前述支撐銷貫穿之前述殼體之外面,與前述支撐銷不接觸,並密封前述支撐銷貫穿之前述殼體之部位者。 A vacuum drying device, comprising: a body; a housing disposed inside the body and forming a chamber for drying the dried body; the plurality of support pins are vertically movable in the foregoing a lower side of the casing, the upper end side penetrates the casing, enters and exits the chamber, and supports the dried body loaded in the chamber; a pumping mechanism is disposed on one side of the body to reduce the chamber And the sealing mechanism is disposed on the outer surface of the casing through which the support pin penetrates, and is not in contact with the support pin, and seals a portion of the casing through which the support pin penetrates. 如申請專利範圍第1項之真空乾燥裝置,其中前述殼體包含有下部殼體及上部殼體,該下部殼體係固定於前述本體,且形成前述支撐銷貫穿之貫穿孔,並可支撐前述密封機構,該上部殼體係支撐於前述下部殼體之上側部位之前述本體而設置成可升降,並藉升降,與前述下部殼體分離,或結合於前述下部殼體。 The vacuum drying device of claim 1, wherein the housing comprises a lower housing and an upper housing, the lower housing being fixed to the body and forming a through hole through which the support pin penetrates and supporting the seal The mechanism is configured to be supported by the body of the upper portion of the lower casing to be lifted and lowered, and separated from the lower casing by the lifting or lowering, or coupled to the lower casing. 如申請專利範圍第2項之真空乾燥裝置,其中在前述下部殼體之下側,可升降地設置有支撐前述支撐銷之下端部的升降板,前述密封機構係以伸縮管而設,該伸縮管係以覆蓋前述支撐銷之形態設置,上部側係密封結合於前述下部 殼體之下面,下部側則密封結合於前述升降板,藉由前述升降板升降而伸縮。 The vacuum drying device of claim 2, wherein a lower surface of the lower casing is provided with a lifting plate supporting the lower end portion of the support pin, and the sealing mechanism is provided by a telescopic tube. The pipe system is arranged to cover the aforementioned support pin, and the upper side is sealed and coupled to the lower part The lower side of the casing is sealingly coupled to the lifting plate, and the lifting plate is extended and lowered to expand and contract. 如申請專利範圍第3項之真空乾燥裝置,其中O型環介在前述伸縮管與前述下部殼體之間及前述伸縮管與前述升降板之間。 The vacuum drying device of claim 3, wherein the O-ring is interposed between the telescopic tube and the lower housing and between the telescopic tube and the lifting plate. 如申請專利範圍第2項之真空乾燥裝置,其中可搭載支撐前述被乾燥體之前述支撐銷與前述被乾燥體一同遊動。 A vacuum drying apparatus according to claim 2, wherein the support pin supporting the object to be dried is allowed to swim together with the object to be dried. 如申請專利範圍第5項之真空乾燥裝置,其中前述支撐銷具有固定銷及遊動銷,該固定銷係下端部側固定於前述伸縮管,該遊動銷係下端部在前述固定銷之上端部上並設置成可滑動,上部側貫穿前述貫穿孔,且於上端部搭載支撐前述被乾燥體。 The vacuum drying device of claim 5, wherein the support pin has a fixing pin and a floating pin, and the lower end side of the fixing pin is fixed to the telescopic tube, and the lower end of the floating pin is on the upper end of the fixing pin. The upper side is inserted through the through hole, and the upper end portion is mounted to support the dried body. 如申請專利範圍第6項之真空乾燥裝置,其中相互對向之前述固定銷之上端部側與前述遊動銷之下端部側為套筒覆蓋而受到支撐。 The vacuum drying apparatus according to claim 6, wherein the upper end side of the fixing pin and the lower end side of the floating pin which are opposed to each other are sleeve-covered and supported. 如申請專利範圍第7項之真空乾燥裝置,其中相互對向之前述固定銷之上端部與前述遊動銷之下端部形成為平坦之平面,而在前述固定銷之上端面與前述遊動銷之下端面之間,有球體介在其之間。 The vacuum drying device of claim 7, wherein the upper end portion of the fixing pin and the lower end portion of the floating pin are formed in a flat plane opposite to each other, and the upper end surface of the fixing pin and the floating pin Between the end faces, a sphere is interposed between them. 如申請專利範圍第8項之真空乾燥裝置,其中於前述伸縮管之上面,形成引導前述遊動銷之升降運動的引導構件,前述支撐銷貫穿前述引導構件而升降。 A vacuum drying apparatus according to claim 8, wherein a guide member for guiding the lifting movement of the floating pin is formed on the upper surface of the telescopic tube, and the support pin is lifted and lowered through the guiding member. 如申請專利範圍第9項之真空乾燥裝置,其中於前述貫穿孔之內周面與前述遊動銷之外周面之間、前述引導構 件之內周面與前述遊動銷之外周面之間及前述遊動銷之下端面之外周面與前述套筒之內周面之間分別形成間隙。 The vacuum drying device of claim 9, wherein the inner circumferential surface of the through hole and the outer peripheral surface of the floating pin, the guiding structure A gap is formed between the inner circumferential surface of the member and the outer circumferential surface of the floating pin, and between the outer circumferential surface of the lower end surface of the floating pin and the inner circumferential surface of the sleeve.
TW101132338A 2011-09-06 2012-09-05 Vacuum dry apparatus TW201323812A (en)

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JP2003332193A (en) * 2003-03-20 2003-11-21 Tokyo Electron Ltd Substrate treatment device
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