WO2013036016A3 - Vacuum drying apparatus - Google Patents

Vacuum drying apparatus Download PDF

Info

Publication number
WO2013036016A3
WO2013036016A3 PCT/KR2012/007077 KR2012007077W WO2013036016A3 WO 2013036016 A3 WO2013036016 A3 WO 2013036016A3 KR 2012007077 W KR2012007077 W KR 2012007077W WO 2013036016 A3 WO2013036016 A3 WO 2013036016A3
Authority
WO
WIPO (PCT)
Prior art keywords
dried
pin
vacuum drying
supporting
drying apparatus
Prior art date
Application number
PCT/KR2012/007077
Other languages
French (fr)
Korean (ko)
Other versions
WO2013036016A2 (en
Inventor
전영준
이민철
Original Assignee
주식회사 테라세미콘
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020110090416A external-priority patent/KR101243313B1/en
Priority claimed from KR1020110090415A external-priority patent/KR20130026945A/en
Application filed by 주식회사 테라세미콘 filed Critical 주식회사 테라세미콘
Publication of WO2013036016A2 publication Critical patent/WO2013036016A2/en
Publication of WO2013036016A3 publication Critical patent/WO2013036016A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Solid Materials (AREA)

Abstract

Disclosed is a vacuum drying apparatus. Installed in the vacuum drying apparatus according to the present invention are: a supporting pin which supports a substrate to be dried, passes through a housing, and is capable of being raised and lowered; and a sealing means which seals a space between the supporting pin and the portion of the housing through which the supporting pin passes, and which is installed on the outside of the bottom surface of the housing so as not to interfere with the supporting pin. Therefore, the sealing means is not damaged by the supporting pin, thus preventing a leak from a vacuum of a chamber into which an object to be dried is loaded and dried. Accordingly, the reliability of a vacuum drying process is enhanced, and the maintenance and repair of the vacuum drying apparatus are convenient. Further, since the supporting pin supporting the object to be dried has a fixing pin positioned and fixed at a lower side thereof and a moving pin which is movably installed at an upper side of the supporting pin and on which the object to be dried is loaded and supported, when the object to be dried moves in a state in which the object to be dried is loaded and supported on the moving pin, the moving pin is moved together with the object to be dried. Accordingly, the moving pin is prevented from being damaged by the object to be dried, and the object to be dried is prevented from being damaged by the moving pin, so that product reliability is improved.
PCT/KR2012/007077 2011-09-06 2012-09-04 Vacuum drying apparatus WO2013036016A2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2011-0090415 2011-09-06
KR1020110090416A KR101243313B1 (en) 2011-09-06 2011-09-06 Vacuum dry apparatus
KR1020110090415A KR20130026945A (en) 2011-09-06 2011-09-06 Vacuum dry apparatus
KR10-2011-0090416 2011-09-06

Publications (2)

Publication Number Publication Date
WO2013036016A2 WO2013036016A2 (en) 2013-03-14
WO2013036016A3 true WO2013036016A3 (en) 2013-05-02

Family

ID=47832695

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2012/007077 WO2013036016A2 (en) 2011-09-06 2012-09-04 Vacuum drying apparatus

Country Status (2)

Country Link
TW (1) TW201323812A (en)
WO (1) WO2013036016A2 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003332193A (en) * 2003-03-20 2003-11-21 Tokyo Electron Ltd Substrate treatment device
KR20060082091A (en) * 2005-01-11 2006-07-14 삼성전자주식회사 Equipment for treating substrate
KR20080114497A (en) * 2007-06-27 2008-12-31 다이니폰 스크린 세이조우 가부시키가이샤 Vacuum drying apparatus
JP2009099719A (en) * 2007-10-16 2009-05-07 Dainippon Screen Mfg Co Ltd Reduced pressure dryer

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003332193A (en) * 2003-03-20 2003-11-21 Tokyo Electron Ltd Substrate treatment device
KR20060082091A (en) * 2005-01-11 2006-07-14 삼성전자주식회사 Equipment for treating substrate
KR20080114497A (en) * 2007-06-27 2008-12-31 다이니폰 스크린 세이조우 가부시키가이샤 Vacuum drying apparatus
JP2009099719A (en) * 2007-10-16 2009-05-07 Dainippon Screen Mfg Co Ltd Reduced pressure dryer

Also Published As

Publication number Publication date
TW201323812A (en) 2013-06-16
WO2013036016A2 (en) 2013-03-14

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