TW201321708A - Heat sink module and assembling method thereof - Google Patents

Abstract

A heat sink module and assembling method thereof are provided. Firstly, a first heat conduction medium is disposed in plural of slots of plural of fins, wherein a heat pipe passes through the fins, and the heat pipe is disposed in the slots. Then, the fins and the heat pipe are heated, so as to combine the heat pipe and the fin by the first heat conduction medium. Next, the heat pipe attaches to a heating element by a flattened portion, and a second conduction medium further disposes between the heating element and the flattened portion of the heat pipe, so as to constitute the heat sink module.

Description

Heat dissipation module and assembly method thereof

The invention relates to a heat dissipation module and an assembly method thereof, in particular to a heat dissipation module in which a heat pipe is directly attached to a heat generating component and an assembly method thereof.

Please refer to FIG. 1 , which is a schematic structural view of a heat dissipating mold assembled to a heating element in the prior art.

As shown in the figure, the heat dissipation module 100 is mounted on a heat generating component 200. The heat dissipation module 100 of the prior art includes a plurality of heat dissipation fins 110, a plurality of heat pipes 130 and a module base 150, and heat dissipation fins. A plurality of accommodating slots 112 are disposed. The heat pipe 130 is disposed in the accommodating groove 112. A first heat transfer medium 120 is disposed between the accommodating groove 112 and the heat pipe 130. The module base 150 is disposed on the heat pipe 130. A second heat transfer medium 140 is disposed between the heat pipe 130 and the module base 150. The module base 150 is disposed on the heat generating component 200, and a third heat transfer medium 160 is disposed between the module base 150 and the heat generating component 200.

When the heating element 200 generates heat, the thermal energy of the heating element 200 will be transferred by the third heat transfer medium 160 to the module base 150, and then the thermal energy is guided to the heat pipe 130 via the second heat transfer medium 140, and the heat energy is absorbed through the heat pipe 130. The heat transfer is transferred to the plurality of heat dissipation fins 110 by the first heat transfer medium 120.

The thermal energy transfer of the heating element 200 is first transmitted via the first heat transfer path 101, and the thermal energy is dissipated by the heating element 200, and is absorbed by the third heat transfer medium 160 and transferred to the module base 150; then, via the second heat transfer path 102, the mold The base 150 absorbs thermal energy, and the thermal energy is transferred from the module base 150 to the second heat transfer medium 140. Then, through the third heat transfer path 103, the second heat transfer medium 140 conducts heat absorption, and the heat energy is further transmitted by the second heat transfer medium 140. To the heat pipe 130, at the same time, part of the heat energy will be transferred from the second heat transfer medium 140 to the first heat transfer medium 120; then, through the fourth heat transfer path 104, heat energy is transferred from the heat pipe 130 to the first heat transfer medium 120; The fifth heat transfer path 105 is further transferred from the first heat transfer medium 120 to the heat dissipation fins 110; then, through the sixth heat transfer path 106, the heat energy is dissipated by the heat dissipation fins 110.

It can be seen that the heat transfer module of the prior art has many heat transfer paths, and the contact surface between the components may be completely incomplete due to the unevenness of the contact surfaces between the components. The combination of the two components will increase the thermal resistance between the two components, which seriously affects the heat transfer efficiency. In addition, there are many known transmission paths, which will reduce the heat dissipation efficiency of the heat dissipation module.

In view of the above problems, the present invention provides a heat dissipation module and an assembly method thereof, thereby reducing the heat energy transmission path to solve the problem of heat dissipation efficiency derived from the conventional technology.

The heat dissipation module of the present invention is suitable for a heating element. The heat dissipation module comprises a plurality of heat dissipation fins, a first heat conduction medium, a heat pipe and a second heat conduction medium. Each of the plurality of heat dissipating fins is respectively provided with a receiving groove, the first heat conducting medium is disposed in the receiving groove, the heat pipe is provided with a plurality of heat dissipating fins, and the heat pipe is disposed in the receiving groove, the heat pipe and the first heat conducting medium In contact with each other, the heat pipe has a flat portion attached to the heat generating component. The second heat transfer medium is located between the flat portion and the heat generating component, and the second heat conductive medium is in contact with the heat pipe and the heat generating component.

The method for assembling the heat dissipation module of the present invention is characterized in that a first heat conduction medium is disposed in a plurality of accommodating grooves of the plurality of heat dissipation fins, and a plurality of heat dissipation fins are disposed through a heat pipe to set the heat pipe on the heat pipe A plurality of accommodating slots. Then, the heat dissipation fins and the heat pipe are heated, and the heat pipe is coupled to the receiving groove of the heat dissipation fin by the first heat conduction medium. Then, the flat portion of the heat pipe is attached to the heat generating component, and a second heat conducting medium is disposed between the heat generating component and the flat portion to contact the heat pipe, the heat generating component and the second heat conducting medium.

The utility model has the advantages that the flat portion of the heat pipe is attached to the heat generating component, and the heat pipe is directly in contact with the heat generating component, thereby reducing the number of components of the heat dissipation module, thereby greatly reducing the heat energy transmission path, and Significantly increase the heat dissipation efficiency of the heat dissipation module.

In addition, the present invention further reduces the thermal resistance between the heat dissipating fin and the heat pipe by the first heat conducting medium, and reduces the thermal resistance between the heat generating component and the heat pipe by the arrangement of the second heat conducting medium, so that Increase the heat dissipation efficiency of the heat dissipation module.

The features, implementations, and utilities of the present invention are described in detail below with reference to the drawings.

Please refer to FIG. 2A, FIG. 2B and FIG. 3 , which are schematic perspective and plan views of a heat dissipation module according to a first preferred embodiment of the present invention.

As shown in the figure, the heat dissipation module 300 of the first preferred embodiment of the present invention is applicable to a heat generating component 400. The heat dissipation module 300 of the first preferred embodiment includes a plurality of heat dissipation fins 310 and a first heat conduction medium. 320, a heat pipe 330 and a second heat transfer medium 340. The plurality of heat dissipating fins 310 are respectively disposed in the accommodating slots 312. The first heat conducting mediums 320 are disposed in the accommodating slots 312. The heat pipes 330 are disposed through the plurality of heat dissipating fins 310, and the heat pipes 330 are disposed on the heat dissipating fins 310. In each of the accommodating grooves 312, the heat pipe 330 is in contact with the first heat transfer medium 320. The heat pipe 330 has a flat portion 332, the flat portion 332 is attached to the heat generating component 400, the second heat transfer medium 340 is located between the flat portion 332 and the heat generating component 400, and the second heat conductive medium 340 is in contact with the heat pipe 330 and the heat generating component 400. .

In addition, the heat pipe 330 of the present invention includes a flat portion 332, and further includes a joint portion 334. The flat portion 332 is coupled to the joint portion 334. The joint portion 334 is disposed in the receiving groove 312, and the flat portion 332 is exposed in the receiving groove. The first heat transfer medium 320 is located between the joint portion 334 and the accommodating groove 312, and the shape of the joint portion 334 is matched with the shape of the accommodating groove 312, so that the heat pipe 330 and the heat dissipation fin 310 are disposed between The thermal resistance is reduced. In this embodiment, the joint portion 334 and the accommodating groove 312 are both curved. For example, when the first heat transfer medium 320 is disposed in the accommodating groove 312, the heat energy can be diffused in an arc manner. Uniformly guided by the heat pipe 330 to the heat dissipation fins 310, the heat dissipation efficiency of the heat dissipation module 300 can be increased.

When the heat dissipation module 300 of the present invention is to be combined, the first heat transfer medium 320 is disposed on the plurality of accommodating grooves 312 of the plurality of heat dissipation fins 310 in the step S510 of the third embodiment. In this embodiment, four heat pipes are used. For example, the arranging groove 312 is disposed in each of the heat dissipating fins 310, and the first heat conducting medium 320 is disposed in the accommodating groove 312 by coating or spraying. Then, in step S520, the heat dissipation fins 310 are disposed through the heat pipes 330, and the heat pipes 330 are disposed in the accommodating grooves 312.

The first heat transfer medium 320 is a solder paste or a high thermal conductivity solder material. Therefore, when the heat pipe 330 is disposed in the accommodating groove 312, the heat dissipation fins 310 can be used to tightly bond the heat dissipation fins 310 to the heat. The conduit 330, in this way, eliminates the need for additional fixing elements to combine all of the heat sink fins 310. In addition, the thermal conductivity of the first heat transfer medium 320 can be greater than or equal to the heat dissipation fins 310 and the heat pipe 330, so that heat energy can be more effectively transmitted between the heat dissipation fins 310 and the heat pipes 330 to enhance the heat dissipation module 300. Cooling efficiency.

In order to allow the heat dissipating fins 310 to be more stably disposed on the heat pipe 330, a plurality of locking portions 314 may be disposed on each of the heat dissipating fins 310. The positions of each of the locking portions 314 are opposite, and the adjacent locking portions 314 are opposite. Can be interlocked. Therefore, the structural strength of the heat dissipation module 100 can be increased when the heat pipe 330 and the heat dissipation fins 310 are assembled with each other.

Before the heat pipe 330 is disposed in the accommodating groove 312, the flat portion 332 must be formed before the heat pipe 330. Therefore, before step S520, the step S515 is further included, and the heat pipe 330 is rolled by the rolling machine. The heat pipe 330 is press-fitted to form a flat portion 332 for subsequent processing. After step S520, step S525 is performed to adjust the angle of the flat portion 332 such that the contact faces of the flat portion 332 and the heat generating component 400 are parallel to each other.

Since the flat portion 332 is not necessarily in the same plane when the heat pipe 330 is disposed in the accommodating groove 312, the flat portion 332 of the heat pipe 330 must be angled so that the flat portions 332 of the four heat pipes 330 are located on the same plane. Therefore, the heat pipe 330 can be relatively flatly attached to the heat generating component 400 by the flat portion 332. This can reduce the unevenness of the contact surface between the heat pipe 330 and the heat generating component 400 and increase the thermal resistance, and the heat pipe 330 does not It is necessary to connect any component having a flat structure to connect the heat generating component 400. Therefore, the present invention can reduce the number of components, and the heat dissipation efficiency of the present invention is improved and the production cost is lowered.

In order to further reduce the thermal resistance between the heat pipe 330 and the heat generating component 400, after step S525, step S530 is performed to heat the plurality of heat radiating fins 310 and the heat pipe 330, so that the heat pipe 330 is coupled to the first heat conducting medium 320. In the accommodating groove 312 of the heat dissipation fin 310, the final step S540 is performed, the flat portion 332 of the heat pipe 330 is attached to the heat generating component 400, and the second heat conductive medium 340 is disposed between the heat generating component 400 and the flat portion 332 and mutual Contact, so as to assemble the heat dissipation module 100. The second heat transfer medium 340 can be disposed on the heat generating component 400 or the flat portion 332. The second heat conductive medium 340 is a heat dissipation paste. The second heat conductive medium 340 has a thermal conductivity greater than or equal to the heat pipe 330 and the heat generating component 400. When the flat portion 332 of the 330 is disposed on the heat generating component 400, the heat energy can be more effectively transmitted between the heat radiating fin 310 and the heat pipe 330 to improve the heat dissipation efficiency of the heat dissipation module 300. In addition, the second heat transfer medium 340 may be first disposed on the flat portion 332, and then the flat portion 332 is attached to the heat generating element 400.

Please refer to FIG. 4 , which is a schematic diagram of thermal energy transfer of a heat dissipation module according to a first preferred embodiment of the present invention. As shown in the figure, when the heat generating component 400 of the present invention dissipates heat energy, first, thermal energy is transmitted to the heat pipe 330 through the first heat transfer path 301 via the first heat transfer medium 340, and the heat energy of the heat generating component 400 is absorbed by the second heat transfer medium 340. When the thermal energy is transferred to the heat pipe 330, a portion of the heat transfer energy of the second heat transfer medium 340 is transferred to the first heat transfer medium 320, and then the heat energy is transferred to the first heat transfer via the second heat transfer path 302. The medium 320, then the thermal energy is transferred to the heat dissipation fins 310 via the first heat transfer medium 320 via the third heat transfer path 303, and finally the fourth heat transfer path 304, and the heat energy is radiated through the heat dissipation fins 310, so that the heat dissipation mold Group 300 dissipates heat generating component 400.

The heat dissipation module 300 of the present invention disperses the heat energy of the heat generating component 400 via four heat transfer paths. Compared with the prior art, the present invention reduces the number of components of the heat dissipation module, thereby reducing the production of the heat dissipation module 300. cost. In addition, when the number of component components is reduced, the thermal resistance between the components is also reduced, so that the heat dissipation efficiency of the heat dissipation module 300 can be effectively improved.

Please refer to FIG. 5 , which is a structural diagram of a heat dissipation module according to a second preferred embodiment of the present invention. As shown in the figure, the coupling portion 334 of the heat pipe 330 and the receiving groove 312 of the heat dissipation fin 310 in this embodiment are different from the first embodiment. The joint portion 334 and the accommodating groove 312 of the embodiment are tightly fitted, and the first heat transfer medium 320 is filled in the gap between the joint portion 334 and the accommodating groove 312. As a result, the contact area of the bonding portion 334 and the accommodating groove 312 can be increased, the heat dissipation efficiency of the heat dissipation module 300 can be increased, and the rectangular bonding portion 334 can be matched with the accommodating groove 312 to further increase the heat dissipation fins 310. The robustness of the heat pipe 330 is set.

In addition, as can be seen from FIG. 2B and FIG. 5, the first heat transfer medium 320 of the second preferred embodiment shown in FIG. 5 is compared with the first preferred embodiment of FIG. 2B. The amount of heat transfer medium 320 used is much smaller than that of FIG. 2B, which can reduce the amount of use of the first heat transfer medium 320, thereby reducing the production cost of the heat dissipation module 100.

Please refer to FIG. 6 , which is a schematic structural diagram of a heat dissipation module 300 according to a third preferred embodiment of the present invention. As shown in the figure, in this embodiment, only one accommodating groove 312 is disposed in each of the heat dissipation fins 310, and the joint portion 334 of each heat pipe 330 is also rectangular. Therefore, the adjacent heat pipes 330 can be more closely fitted by the sides of the rectangle, thus reducing the generation of thermal resistance. The first heat transfer medium 320 may also be coated on the adjacent heat pipe 330 to further reduce the influence of the heat resistance.

If the adjacent heat pipes 330 are combined with each other, they are disposed in the accommodating grooves 312 coated with the first heat transfer medium 320. In order to accommodate the heat pipes 330 combined with each other, the sized accommodating grooves 312 must be used. Therefore, the weight of the heat dissipation fins 310 can be greatly reduced. Therefore, the embodiment can reduce the production cost of the heat dissipation fins 310, thereby reducing the manufacturing cost of the heat dissipation module 300.

In summary, the heat dissipation module of the present invention comprises a plurality of heat dissipation fins, a first heat conduction medium, a heat pipe and a second heat conduction medium, wherein the heat dissipation fins are provided with a receiving groove, and the first heat conduction medium is disposed in the receiving groove. The heat pipe is disposed in the accommodating groove, the first heat conduction medium is located between the heat pipe and the accommodating groove, the heat pipe is provided with a flat portion, the flat portion is disposed on the heat generating component, and the second heat conductive medium is disposed on the flat portion and the heat generating component In the meantime, the flat portion of the heat pipe is disposed on the heat generating component to reduce the number of components of the heat dissipation module, thereby reducing the heat energy transmission path, thereby increasing the heat dissipation efficiency of the heat dissipation module, and reducing the heat dissipation fin by the first heat conduction medium. The thermal resistance between the sheet and the heat pipe is reduced by the second heat transfer medium to reduce the heat resistance between the heat generating component and the heat pipe, so that the heat dissipation efficiency of the heat dissipation module can be increased.

Although the embodiments of the present invention are disclosed above, it is not intended to limit the present invention, and those skilled in the art, regardless of the spirit and scope of the present invention, the shapes, structures, and features described in the scope of the present application. And the number of modifications may be made, and the scope of patent protection of the present invention shall be determined by the scope of the patent application attached to the specification.

100. . . Thermal module

101. . . First heat transfer route

102. . . Second heat transfer pathway

103. . . Third heat transfer route

104. . . Fourth heat transfer route

105. . . Fifth heat transfer route

106. . . Sixth heat transfer route

110. . . Heat sink fin

112. . . Locating slot

120. . . First heat transfer medium

130. . . Heat pipe

140. . . Second heat transfer medium

150. . . Module base

160. . . Third heat transfer medium

200. . . Heating element

300. . . Thermal module

301. . . First heat transfer pathway

302. . . Second heat transfer pathway

303. . . Third heat transfer route

304. . . Fourth heat transfer route

310. . . Heat sink fin

312. . . Locating slot

314. . . Locking part

320. . . First heat transfer medium

330. . . Heat pipe

332. . . Flat section

334. . . combination

340. . . Second heat transfer medium

400. . . Heating element

FIG. 1 is a schematic view showing the planar structure of a heat dissipating mold assembled from a conventional heating element.

2A is a perspective view of a heat dissipation module according to a first preferred embodiment of the present invention.

FIG. 2B is a schematic plan view of the heat dissipation module according to the first preferred embodiment of the present invention.

FIG. 3 is a flow chart of a method for assembling a heat dissipation module according to a first preferred embodiment of the present invention.

4 is a schematic diagram of thermal energy transfer of a heat dissipation module according to a first preferred embodiment of the present invention.

FIG. 5 is a schematic plan view of a heat dissipation module according to a second preferred embodiment of the present invention.

FIG. 6 is a schematic plan view of a heat dissipation module according to a third preferred embodiment of the present invention.

300. . . Thermal module

310. . . Heat sink fin

312. . . Locating slot

314. . . Locking part

320. . . First heat transfer medium

330. . . Heat pipe

332. . . Flat section

334. . . combination

340. . . Second heat transfer medium

400. . . Heating element

Claims (12)

A heat dissipating module is applicable to a heating element, the heat dissipating module comprises: a plurality of heat dissipating fins respectively provided with a receiving groove; a first heat conducting medium disposed in the receiving groove; a heat pipe, wearing The heat dissipating fins are disposed, and the heat pipe is disposed in the accommodating groove, the heat pipe is in contact with the first heat conducting medium, and the heat pipe has a flat portion attached to the heating element; And a second heat conducting medium between the flat portion and the heat generating component, and the second heat conducting medium is in contact with the heat pipe and the heat generating component. The heat dissipation module of claim 1, wherein the heat pipe comprises a joint portion, the flat portion is coupled to the joint portion, the joint portion is disposed in the receiving groove, and the flat portion is exposed to the receiving portion. The receiving portion of the first heat conducting medium and the heat pipe and the receiving groove of the heat dissipating fin are in contact with each other. The heat dissipation module of claim 2, wherein the shape of the joint matches the shape of the receiving groove. The heat dissipation module of claim 3, wherein the shape of the joint portion and the receiving groove are curved. The heat dissipation module of claim 3, wherein the joint portion and the receiving groove are rectangular in shape. The heat dissipation module of claim 1, wherein the first heat conduction medium has a thermal conductivity greater than or equal to a thermal conductivity of the heat dissipation fin and the heat pipe. The heat dissipation module of claim 1, wherein the second heat transfer medium has a thermal conductivity greater than or equal to a thermal conductivity of the heat pipe and the heat generating component. The heat dissipation module of claim 1, wherein the first heat transfer medium is a solder paste. The heat dissipation module of claim 1, wherein the second heat transfer medium is a heat dissipation paste. A method for assembling a heat dissipation module, comprising the steps of: disposing a first heat conduction medium in a plurality of receiving grooves of a plurality of heat dissipation fins; piercing the heat dissipation fins with a heat pipe, and setting the heat pipe to the heat pipe The heat dissipating fins and the heat pipe are coupled to the heat dissipating grooves of the heat dissipating fins; and one of the heat pipes The flat portion is attached to a heat generating component, and a second heat conductive medium is disposed between the heat generating component and the flat portion and is in contact with each other. The method for assembling a heat dissipation module according to claim 10, wherein before the step of inserting the heat dissipation fins by the heat pipe, the method further comprises the step of rolling the heat pipe to form the flat portion. The method for assembling a heat dissipation module according to claim 10, wherein after the step of inserting the heat dissipation fins by the heat pipe, the method further comprises the steps of: adjusting an angle of the flat portion to make the flat portion and the One of the heating elements has a contact surface that is parallel to each other.