TW201320848A - Method and system for producing printed circuit boards - Google Patents

Abstract

The invention relates to a method and a system (1) for producing circuit boards (2) having pressed-in form pieces, at least one form piece (3), before it is impressed into a breakout (4) of a circuit board (2) by means of a pressing tool (6), being aligned by a template (7) in relation to the breakout (4) of the circuit board (2).

Description

Method and system for manufacturing printed circuit boards

The present invention relates to a method for manufacturing a circuit board according to the preamble of claim 1, and to a system for manufacturing a circuit board according to the preamble of claims 31 and 40.

Printed electronic circuits are conventional techniques in which rigid printed circuit boards are equipped with: electronic components. The printed circuit boards may be composed of one or more single layers: cured glass sheets of reinforced glass fibers laminated to copper on one side or on both sides. To form a conductor path (Leiterbahn).

Due to the relatively high power loss of electronic components disposed on a printed circuit board, the printed circuit board is subject to high thermal generation. In the prior art, in the well-known printed circuit boards, heat-conducting elements in the form of metal bodies are provided, which are provided in the gaps (Aussparungen). The metal bodies are respectively composed of at least copper bolts or bolts of the same material, and the material has good thermal conductivity. The thermally conductive element provided in the printed circuit board ensures that the loss of heat of the electronic component is sufficiently taken away and that the thermally conductive element provided in the printed circuit board thus prevents a critical temperature range of the component from the printed circuit board.

In the conventional method for manufacturing the above-mentioned circuit board, before the formed block is actually pressed into the printed circuit board, it must be pressed before the heat conductive element is pressed The thermally conductive element is accurately aligned with the gap in the printed circuit board. In the prior art, a printed circuit board, for example in EP 1 276 357 A2, is known, in which a thermally conductive element as described above is pressed. In particular, in this case, the heat-conducting element is pressed into the channel space, which is situated in the printed circuit board. In order to press the heat conducting element into the printed circuit board without being caught, the heat conducting element must be accurately aligned with the passage gap beforehand, which may be disadvantageous because the cost is too high.

Another technique for the detachment of electronic components of printed circuit boards is known, for example, from DE 102 100 41 B4. Accordingly, a thermal conduction device is provided to conduct the heat of the electronic component, and in the thermal conduction device, the printed circuit board equipped with the electronic component is adhered to the planar cooling member by the adhesive film. The area of the viscous film below the component has a notch that is filled with a good thermally conductive filler. In addition, on the side of the printed circuit board, drilled holes are disposed beside the components, the drilled holes vertically extending through the printed circuit board and penetrating the printed circuit board vertically. Below the component, the drilled holes are in contact with the recess. The construction of the thermal separation device described above requires a costly manufacturing process and is therefore expensive.

The present invention is therefore based on the object of a method and system for manufacturing a printed circuit board in which a forming block can be reliably pressed into a printed circuit board at low cost and in a simple manner. In order to ensure the loss of heat conduction.

This subject is achieved by a method having the features of claim 1 , a system having the features of request item 31, and having request item 40 Characteristic system. Advantageous developments of the invention are defined in the subsidiary.

The proposed solution is based on the basic consideration of aligning the forming block with the indentation of the printed circuit board via a stencil prior to pressing the forming block into the notch of the printed circuit board. After the alignment, the formed block is pressed into the gap of the printed circuit board by pressing the tool. Thus, it is not necessary to treat the individual forming blocks at a high cost, such as by gripping elements, vacuum tools or the like, to accurately position the gaps of the printed circuit board.

In particular, the following is proposed: the stencil has an opening which is shaped in a cross section to fit the notch, and the opening has a size slightly larger than the notch. In order to align the forming blocks with the notches, the forming block dimensions are deliberately slightly adapted to the dimensions of the notches so that the forming blocks can be introduced into the openings of the stencil in a relatively short period of time.

According to the invention, the method is carried out using a positioning device with which the stencil is aligned with the printed circuit board before the forming block is pressed. For example, in a mechanically simple solution, the positioning device can have so-called guides that pass through the bore or through holes and engage the bores or the through holes, such Drill holes or such through holes are formed in the printed circuit board and the stencil. Thus, the stencil can be accurately aligned to the printed circuit board even during the press-in process or when the printed circuit board is moved relative to the press-in tool.

In an advantageous further development of the method according to the invention, the positioning device can also be used to align the printed circuit board with the stencil in the press-in tool before pressing the forming block into place or when pressing into the forming block. For the purpose, the formed block is pressed into the printed circuit board when the printed circuit board and the stencil are aligned with the press-in tool.

As mentioned above: the formation of the blocks is precisely aligned with the notches, which has the further advantage that in one stroke, the formed blocks can be pressed into the gaps of the printed circuit board. For the process, this results in a short action of the press-in tool with a corresponding short period.

The action of the press-in tool can affect the position at which the forming block is pressed into the notch of the printed circuit board. The press-in tool has a stamper (Stempel) whose end face (which is in contact with the forming block) is configured to be smaller than the planar side surface forming the block or the same as the planar side surface forming the block. Similarly, the outer dimension of the front end face of the press is smaller than the opening of the stencil. Therefore, when the printing circuit board and the pressing tool are relatively moved relative to each other, the pressing tool of the pressing tool can press the forming block completely through the stencil by the front end surface of the pressing tool (ie, toward the orientation). Located in the direction of the printed circuit board below). As such, the forming blocks are pressed into the indentations of the printed circuit board. Depending on the movement of the press-in tool in the direction of the printed circuit board, the forming block can be pressed into the notch of the printed circuit board in such a manner that the planar side of the lower portion of the block protrudes from the printed circuit board (in contrast to the pressing direction of the forming block) The outer layer of the phase. Alternatively, after pressing into the forming block, the forming block is flush with the outer layer to which the printed circuit board belongs, with at least one planar side or two planar sides.

In a further preferred embodiment according to claims 8 to 12, the reference plate is provided on the side of the printed circuit board opposite to the press-in direction of the forming block, when the forming block is pressed into the notch of the printed circuit board, The forming block is in contact with the reference plate. The distance of the reference plate relative to the printed circuit board can be adjusted prior to the press-in process so that the position of the formed block in the printed circuit board can be adjusted after the press-in. The accuracy of forming the block into the printed circuit board is further enhanced in that the reference plate has a horizontal parallel surface in which the printed circuit board is in contact with the horizontal parallel surface during the press-in process. Preferably, the reference plate is at least partially made of resilient plastic such that after the forming block is in contact with the reference plate, the press-in tool and the bottom plate (or reference plate) are relatively slightly moved relative to each other. Therefore, damage to the press-in tool and the drive mechanism (optionally coupled to the press-in tool) can be avoided.

Due to the elastic resilience of the plastic (or the elastic characteristics of the plastic), the use of plastic as the material of the reference plate has the following effect: the forming block is pressed into the plastic and thus forms a block beyond the lower outer layer of the printed circuit board, The printed circuit board is placed on the reference board during the press-in process, and when the forming block is pressed into the notch of the printed circuit board, the forming block is in contact with the reference board. This corresponds to the "excess stroke (Überhub)". In general, after the forming block is pressed into the printed circuit board, a well-known resetting effect is produced, whereby the forming block is oriented in the opposite direction to the pressing direction when the press-in forming block is completed. And returned. Therefore, due to the elastic restoring force of the above-mentioned plastic, the formation of the block protrudes from the lower outer layer of the printed circuit board to compensate for the reset effect.

In a further preferred embodiment of the method according to claims 15 and 16, the indentations in the printed circuit board are produced in two steps prior to pressing into the block. In the first step, rough path processing is performed, which is also referred to as opening. Spiral-toothed drilling cutters (spiralverzahntes Fräser) can be used here. The holes are opened in such a way that the opening size is slightly smaller than the outer dimensions of the forming blocks that will be pressed later. In the second step, the notch is machined to the desired final size, for example by using a finishing tool (Schlichtfräser). Here, the final dimension of the notch conforms to the outer dimensions of the forming block. The processing can optionally be repeated by finishing the milling tool to obtain the desired value of the final dimension of the gap.

Further preferred embodiments of the method according to claims 17 to 25 respectively relate to forming different surface treatments of the blocks and/or printed circuit boards before and/or after pressing the forming blocks into the printed circuit board. In detail, this includes: surface treatment of the printed circuit board after press-forming to form a block to effectively remove a rough edge (Grate) or the like. The printed circuit board can be metallized at least in the region of the gap before or after the forming block is pressed. In particular, when the printed circuit board is still in a "Rohzustand" state, a wet chemical process can be performed to apply, for example, a copper layer to the printed circuit board containing the notches. Further, the printed circuit board can be electroplated before or after the forming block is pressed to deposit a metal layer (preferably a copper layer) on the printed circuit board (and optionally on the forming block). In order to prepare this plating deposit, the printed circuit board may also be processed by photolithography. In addition, a tin-lead (SnPb) layer can be plated to achieve a printed circuit board Etching protection. Finally, surface processing can be performed on the printed circuit board and the forming blocks that are selectively adapted for bonding wire bonding applications. Depending on the material from which the block is formed, the surface processing for forming the block may be selectively different from the surface processing for the printed circuit board. For this purpose, after the forming block is pressed into the printed circuit board, a suitable mask or the like can be used for this surface treatment.

A further advantageous refinement of the method according to claims 26 and 27 relates to the embodiment of the profile, that is to say on the inner peripheral surface of the notch and/or on the outer peripheral surface of the block. Obviously, the contours are produced separately before the forming blocks are pressed into the gaps of the printed circuit board. The profile can preferably be shaped as a toothed projection. The contour causes a gap to be formed between the outer peripheral surface of the forming block and the inner peripheral surface of one of the notches after the forming block is pressed into the notch. The width of the gap between the forming block and the printed circuit board depends on the height of the toothed protrusion and/or the material of the printed circuit board, which material results in a stronger or weaker penetration of the toothed protrusion. In any event, a sufficiently large gap between the forming block and the printed circuit board is selected such that during subsequent surface processing (e.g., wet chemical programming or metallization in electroplating), it is ensured that liquid can pass through the gap. Therefore, it is ensured that the inner peripheral surface of the notch and the outer peripheral surface forming the block are completely wetted. After pressing, the gap created between the forming block and the printed circuit board can be conveniently filled (for example, lacquer or resin). Thereby, when the printed circuit board is reworked, the solder is effectively prevented from penetrating from the outer layer of the printed circuit board to the outer layer on the opposite side of the outer layer.

According to the preferred embodiment of the method of claims 29 and 30, respectively In: the choice of materials to form a block or printed circuit board. According to the claim 29, the forming block may be made of at least copper or a copper alloy, alternatively may be made of a synthetic material such as tungsten-copper or molybdenum copper. According to yet another alternative, the forming blocks can also be made based on ceramic or carbon. In any case, it is important to select a suitable forming block material that has good thermal conductivity and sufficient mechanical strength to allow for the indentation of the printed circuit board.

According to claim 30, the printed circuit board can be made of a material suitable for high frequency signals and/or microwave signals, and a material based on polytetrafluoroethylene (PTFE) is particularly suitable for use herein. The printed circuit board can also optionally contain: a filler such as ceramic. According to a further advantageous refinement of the invention, the printed circuit board can also comprise a material of a rigid substrate or an elastic substrate such that it can result in a multi-layered hard or elastic layer structure of the printed circuit board.

According to a further teaching of the claim 31 having an independent meaning, a system for manufacturing a printed circuit board having a press-forming block is requested. This system typically has a backplane on which a printed circuit board can be placed. Furthermore, the press-in tool is arranged above the base plate, wherein the base plate and the press-in tool can be moved relative to each other or to each other. By moving from each other, the printed circuit board placed on the substrate can be subjected to a press-in process.

According to the claim 31, it is important for the system to align the stencil with the printed circuit board by means of the positioning device. In particular, the stencil has an opening into which the forming block can be introduced, the opening being adapted in cross-section to the shape of the notch, the notch being arranged in the printed circuit board. Before the forming block is pressed into the printed circuit board, the stencil can be made in the following manner by the positioning device Align the printed circuit board: the opening of the stencil is flush with the notch of the printed circuit board. As such, the forming blocks introduced into the stencil opening can be pressed into the notch of the printed circuit board accurately and without tilting.

According to claims 32 and 33, in an advantageous refinement of the system, the printed circuit board can be aligned with the stencil via the positioning device. According to a simple mechanical solution, this can be carried out in that the bottom plate is provided with so-called guides which pass through the corresponding holes in the printed circuit board and the stencil, so that the printed circuit board and the stencil are positively Located on the bottom plate. In the system, the position of the base plate relative to the press-in tool is known such that the final position determines the relative position between the printed circuit board and the stencil and, on the other hand, the relative position between the printed circuit board and the press-in tool. The press-in tool is conveniently used when the printed circuit board has been aligned with the stencil into the tool by the positioning device (as previously described).

According to claim 35, in an advantageous refinement of the system, the base plate can have a reference plate aligned with the printed circuit board. During the pressing process of pressing the forming block into the notch of the printed circuit board, the planar side below the forming block contacts the reference plate. Once the block contacts the reference plate, the relative movement between the press-in tool and the bottom plate is prevented. The relative movement between the press-in tool and the base plate can expediently be force-regulated so that when the predetermined forming block (against the reference plate) is reached, the press-in between the tool and the base plate Relative movement automatically stops. Furthermore, the reference plate can be at least partially made of plastic, in any case the lower area of the reference plate is made of plastic: during the press-in process, the printed circuit board is placed The area placed on the reference board. As described above in relation to claim 11, the characteristics of the reference plate made of plastic advantageously compensate for the reset effect when the formed block is pressed into the printed circuit board. Therefore, if necessary, the forming block can form the planar side of the lower portion of the block and be flush with the lower outer layer.

According to an advantageous refinement according to claim 36, the forming block can be pressed into the printed circuit board particularly accurately in such a way that the reference plate has a horizontal parallel surface on which the printed circuit board is placed during the press-in process .

Further advantages of the system improvement according to claims 34 and 37 to 39 correspond to the features of the method claims 7 and 11 to 13, respectively, and therefore, reference is made to the method claims 7 and 11 to 13 to avoid duplication.

The nature of the substrate or the material associated with the substrate is: according to a further teaching of the independent claim 40, during the press-in process, the printed circuit board is placed on the material in the direction of the indentation forming the block. Made of materials with elastic characteristics. In this regard, it is important that the material has an elastic restoring force in the direction in which the block is pressed, during which the printed circuit board is placed on the material and the block is formed to form the lower side of the block. That is, the material) is in contact. As a result, after the forming block is in contact with this partial region of the bottom plate (i.e., the material), a portion of the bottom plate (i.e., the material) is elastically deformed, allowing a slight further step between the pressing tool and the bottom plate. Relative movement. A portion of the bottom plate (i.e., the material) is conveniently made of plastic, such as, for example, and preferably made of Plexiglas, as described above. Said to have elastic characteristics.

Figure 1 is a graphical representation in the form of a press or CNC control tool press: a schematic diagram of a perspective view of system 1. With this system 1, a printed circuit board having a press-formed block according to the present invention can be manufactured. Next, the individual components of this system 1 and the materials used for this purpose are explained in detail.

The flat printed circuit board 2 can be processed by the system 1 to press the forming block 3 into the printed circuit board 2. The forming block 3 is preferably also in the form of a plate and comprises: an upper planar side and a lower planar side, preferably the upper planar side and the lower planar side are substantially parallel to each other. In this regard, the concept of "planar side" is broadly understood: as long as the associated plane is approximately planar at first. Thus, the planar sides may also comprise different topologies, such as trough shapes or the like. The forming block 3 can be formed, for example, as a square, and in Fig. 1, the side length is indicated by the letter k.

The notch 4 is formed in the printed circuit board 2, and the notch 4 is also formed in a square shape to be suitable for forming the block 3. However, the length of the side of the notch 4 is selected such that the side length of the notch 4 is slightly smaller than the side length of the forming block 3, which is indicated by the symbol "k-1" in Fig. 1. Therefore, the length of the side forming the block 3 exceeds the notch as compared with the notch, which allows the forming block 3 to be pressed into the notch 4 snugly.

The system 1 comprises a bottom plate 5 which is movable along planes x and y in a plane. In Figure 1, this is indicated by the corresponding arrow. In the bottom plate Above 5, the system 1 comprises a press-in tool 6 that moves in a vertical direction, which is indicated by the arrow z in Figure 1. In order to carry out the press-in process, the press-in tool 6 is moved downwards towards the bottom plate 5 in the direction of the arrow z.

In order to align the forming block 3 with the printed circuit board 2, a stencil 7 is provided, in which the opening 8 is formed. In order to fit the shape suitable for forming the block 3, the opening 8 is also formed into a square shape, but the opening 8 has a side length slightly larger than the side length of the forming block 3, which is indicated by the relationship "k+1". The side of the opening 8 is longer than the side forming the block 3 such that the forming block 3 can be introduced into the opening 8, and the forming block 3 is not inclined or jammed in the opening 8. Therefore, when the forming block 3 is introduced into the opening 8, the forming block 3 is guided in the x-y plane, but the forming block 3 can be moved in and out of the opening 8 vertically (i.e., in the z direction). By means of an operating device (not shown), the forming block 3 can be intentionally introduced (or embedded) into the opening 8 before the forming block 3 is pressed into the printed circuit board 2.

In the region of the base plate 5, a positioning device 9 is provided, by means of which the printed circuit board 2 can be aligned with the stencil 7. In detail, the positioning device 9 comprises: a so-called guide 9a which extends vertically upward from the bottom plate 5. For example, a total of four guide members 9a may be provided, the mutual distance of the four guide members 9a being adapted to the bottom surface of the printed circuit board 2. Together with the positioning device 9, drill holes 9b are also provided, each of which is formed in the printed circuit board 2 or in the stencil 7. The illustration of Fig. 1 illustrates that the bores 9b are integrally matched to each other for the respective distances of the guides 9a. In particular, the printed circuit board 2 can be placed on the base plate 5 together with the stencil 7, wherein the guide 9a then penetrates the drill in the printed circuit board 2 (and the stencil 7). Hole 9b. Thus, on the one hand, the stencil 7 can be aligned with the printed circuit board 2 in a defined and defined manner, and on the other hand the printed circuit board 2 can be aligned with the stencil 7 in the bottom plate 5.

In order to control the system 1, the spatial position of the bottom plate 5 in the x-y plane relative to the position of the press-in tool 6 is generally known. By fixing the x-y coordinates in advance, the object can be accurately aligned with the press-in tool 6, and the guide 9a is placed on the bottom plate 5 on the x-y coordinates, which is positioned on the bottom plate 5 by the guide 9a. Thus, the printed circuit board 2 and the bottom plate 7 are aligned with the bottom plate 5, and at the same time, the press-in tool 6 is aligned.

The press-in tool 6 has a stamper 10 which is in contact with the forming block 3 (i.e., forming the upper planar side of the block 3) at the end face of the presser 10. In order to carry out the pressing method, it is important to select the end face of the presser 10 such that the end face of the presser 10 is equal in size to the planar side of the upper portion of the forming block 3, or the end face of the presser 10 is larger than the forming block 3. The upper plane side is slightly smaller. This allows the press 10 to move the end face of the press 10 through the opening 8 of the stencil 7 to press the forming block 3 into the printed circuit board 2. This will be explained in more detail below.

On the bottom plate 5, an additional reference plate 11 is provided on the upper side, which is made of plastic, such as polymethyl methacrylate (PMMA, also known as "Plexiglas"). The reference plate 11 has a horizontal parallel surface 12. In the embodiment illustrated in Fig. 1, the reference plate 11 is fixed to the bottom plate 5, and, for example, the reference plate 11 is embedded in the recess of the bottom plate 5. Alternatively, the base plate 5 can be manufactured integrally with the reference plate 11, that is, entirely made of Plexiglas.

The invention operates in the following manner: First, the system 1 is transferred to a starting position in which the press-in tool 6 together with the press 10 is sufficiently far from the base plate 5. Next, the printed circuit board 2 is applied to the base plate 5, that is, in such a manner that the printed circuit board 2 is placed on the reference plate 11, and at the same time, the guide 9a passes through the drilled hole 9b of the printed circuit board 2. In this way, the printed circuit board 2 is bound to the bottom plate 5 in a defined manner in the x-y direction, and thus the printed circuit board 2 is aligned with the press-in tool 6 in a defined manner in the x-y direction.

Next, the stencil 7 is placed over the printed circuit board 2 from above, with the drilled holes 9b of the stencil 7 aligned with the guide 9a. As a result, the guide 9a also passes through the drilled hole 9b of the stencil 7, so that the stencil is automatically aligned with the printed circuit board 2 and the alignment substrate 5 (or the reference plate 11). Next, the forming block 3 is introduced into the opening 8 of the stencil 7 by means of an operating device (not shown). The height of the stencil 7 is sufficiently large in cross section of the stencil 7, such that when the forming block 3 is introduced into the opening 8, the forming block is constrained to be guided in the x-y plane. For the arrangement of the openings 8 in the stencil 7, this is expediently adapted to the position of the notches 4 in the stencil 2. This means that when the stencil 7 (as described) is commonly aligned with the printed circuit board 2 via the guide 9a, the opening 8 is precisely aligned with the notch 4.

It should be noted that the position of the notch 4 and the opening 8 in the x-y plane (respectively) relative to the outer dimensions of the printed circuit board and the outer dimensions of the stencil 7 have been known in advance. On the basis of this, the base plate 5 can be moved in the x-y plane such that the opening 8 and the notch 4 are precisely positioned below the presser 10 of the press-in tool 6. Can be determined by bar code 13: opening 8 and notch 4 are respectively opposite to The position of the stencil 7 and the printed circuit board 2 in the x-y plane is exactly the same, which can be read by the scanner 9c, which is attached to the mechanical housing of the system 1. Alternatively, the respective position coordinates may be input to the controller of the system 1 by the operation panel 14.

As described above, by inserting the forming block 3 into the opening 8 of the stencil 7, the forming block 3 is accurately aligned with the notch 4 of the printed circuit board 2 located below the forming block 3. Due to the excess "k+1" of the opening 8 (compared to the length k of the side forming the block 3), the forming block 3 is free to move in the vertical direction z within the opening 8. If the forming block 3 is located in the opening 8, the press-in tool 6 is then moved in the direction of the reference plate 11 with the press 10 down. In this case, the presser 10 is in contact with the end surface of the upper portion of the forming block 3 with the end face of the presser 10, and the presser 10 presses the forming block 3 out of the opening 8, so that the forming block 3 is pressed into the printed circuit. The gap of the board is 4. Next, the block 3 is formed so that the planar side of the lower portion of the forming block 3 comes into contact with the reference plate 11, and the forming block 3 is slightly pressed out of the edge of the lower outer layer of the printed circuit board 2 due to the restoring force of the Plexiglas material. However, in view of the typical reset effect, the forming block 3 can then be aligned within the indentation 4 in such a way that the lower planar side of the forming block 3 eventually fits flush with the lower outer layer of the printed circuit board 2.

After the forming block 3 is completely pressed into the notch 4, the press-in process itself is completed, and then the press-in tool 6 and the press 10 are raised vertically by the stencil 7. Thereafter, the stencil 7 can be removed by the printed circuit board 2 to, if necessary, further process the printed circuit board 2.

In addition to the compensation for the reset effect described above, made of Plexiglas The embodiment of the reference plate 11 has the further advantage that the surface of the reference plate 11 is typically softer than the material of the printed circuit board. In this regard, the printed circuit board 2 is protected when placed on the reference board 11, and in particular the printed circuit board 2 is not damaged by the reference board 11, for example by scratches or the like.

In the variation of the pattern of Fig. 1, it is also possible to press a plurality of forming blocks into a printed circuit board. In this regard, the printed circuit board may have a plurality of indentations, and in this case, a plurality of openings are formed in a stencil: the openings are sized and positioned in the stencil to conform to the printed circuit board. The plurality of forming blocks can be pressed into the printed circuit board by, for example, the system 1 illustrated in FIG. 1 in such a manner that a plurality of forming blocks are continuously (ie, sequentially) pressed into the printed circuit board. 2 respective gaps 4. If the press-in tool 6 has a plurality of presses 10 (which should fit in the position of the notch 4 in the printed circuit board), a plurality of forming blocks can also be pressed into the printed circuit board simultaneously (i.e., in one stroke).

The embodiment of the reference plate 11 according to Fig. 2 is particularly feasible after extensive attempts at the following optimizations. Here, the reference plate 11 is formed to have a groove-like form 11a which is larger than the opening 8 (aligned to form the block 3) in the stencil 7, and which is in the printed circuit board 2 The corresponding gap 4 is large. The fact that is noticeable here is that in this variation, the press-in of the forming block 3 is accompanied by a slight bending of the printed circuit board 2 into the groove-like form 11a. It is known that such bending (also referred to as "elastic" of the printed circuit board 2 makes the press-in of the forming block 3 particularly protected. It can be confirmed that in this way, the possibility of pre-damage of the printed circuit board 2 (derived from press-in) is reduced.

For a device having a reference plate 12 in the form of a trough, it is important to properly control the movement when pressing into the forming block 3. Therefore, at least during the final movement phase of the press-in process, a particularly slight advancement is made (Vorschub) in order to prevent the printed circuit board 2 from bounce back uncontrollably. It must also be noted that the forming block 3 is pressed into the gap 4 of the printed circuit board 2 with a certain excess stroke (Überhub).

For the reference plate 11 illustrated in Fig. 2, it is also noted that the above-described guide 9a is no longer provided. The printed circuit board 2 is configured to move to some extent upstream on the surface 12 of the reference plate 11. In this regard, in the above-mentioned attempt, the press-in of the forming block 3 is again particularly protected.

In a preferred embodiment, the reference plate 11 is made of a highly shaped, highly wear resistant material (especially just). An embodiment of such a shape-fixed and particularly rigid reference plate 11 can be used for the reference plate 11 with and without the guide 9a, and for the reference plate 11 without the groove-like form 11a.

In a further preferred embodiment, the press-in process is set to be reversed to some extent, that is to say in such a way that, when pressed, the block 3 is not moved, but the printed circuit board 2 is moved. . For this purpose, it is advantageously provided that the frame-shaped press is placed above the printed circuit board, which is aligned with the cutout 11 in the printed circuit board 2. The forming block 3 is aligned with the reference plate 11 before the press-in process. These variations are particularly feasible when a plurality of forming blocks 3 are to be introduced into the printed circuit board 2 during a press-in process.

1‧‧‧ system

2‧‧‧Printed circuit board

3‧‧‧ forming a block

4‧‧‧ gap

5‧‧‧floor

6‧‧‧Indentation tool

7‧‧‧Template

8‧‧‧ openings

9‧‧‧ Positioning device

9a‧‧‧Guide

9b‧‧‧Drilling

9c‧‧‧Scanner

10‧‧‧Brazil

11‧‧‧ Reference Board

11a‧‧‧ trough form

12‧‧‧ surface

13‧‧‧ barcode

14‧‧‧Operator panel

The invention is further illustrated above based on the drawings, which are merely illustrative of the embodiments. In the drawings: Figure 1 illustrates a simplified schematic of a perspective view of the proposed system for producing a printed circuit board.

Figure 2 illustrates an alternative embodiment of a reference plate for: the system according to Figure 1.

1‧‧‧ system

2‧‧‧Printed circuit board

3‧‧‧ forming a block

4‧‧‧ gap

5‧‧‧floor

6‧‧‧Indentation tool

7‧‧‧Template

8‧‧‧ openings

9‧‧‧ Positioning device

9a‧‧‧Guide

9b‧‧‧Drilling

9c‧‧‧Scanner

10‧‧‧Brazil

11‧‧‧ Reference Board

12‧‧‧ surface

13‧‧‧ barcode

14‧‧‧Operator panel

Claims (40)

A method for producing a printed circuit board (2) pressed into a forming block (3), characterized in that at least one forming block (3) is pressed in by means of a press-in tool (6) Before a notch (4) of a planar printed circuit board (2), the at least one forming block (3) is aligned with the notch of the printed circuit board (2) by a stencil (7) (4) ). The method of claim 1, characterized in that the forming block (3) is integrated with the inner dimension of the notch (4) by the outer dimension of the forming block (3). The method according to any of the preceding claims, characterized in that the stencil (7) has an opening (8) which is adapted in a cross section to fit one of the notches (4) And the opening (8) has a size slightly larger than the notch (4), wherein the forming block is formed before the forming block (3) is pressed into the notch (4) of the printed circuit board (2) (3) Introduced into the opening (8). The method according to any of the preceding claims, characterized in that the stencil (7) is aligned with the printing device by means of a positioning device (9) before pressing the forming block (3) The circuit board (2), preferably, the positioning device (9) has: a guide (9a), the guides (9a) can be adapted to the template (7) Drilling (9b). The method of claim 4, characterized in that the printed circuit board (2) is aligned with the stencil (7) by the positioning device (9) before being pressed into the forming block (3). Pressing the tool (6), preferably, when the printed circuit board (2) and the stencil (7) are aligned with the press-in tool (6), the forming block (3) is pressed into the printed circuit Board (2). The method according to any of the preceding claims, wherein the forming block (3) is pressed into the printed circuit board by the pressing tool (6) in a stroke (2) ) the gap (4). The method according to any of the preceding claims, characterized in that the press-in tool (6) has: a press (Stempel) (10), the end face (Stirnseite) of the press (10) is configured : being smaller than the planar side of one of the forming blocks (3) or the same as the planar side of one of the forming blocks (3), the end face being brought into contact with the forming block (3). A method according to any of the preceding claims, characterized in that a reference plate (11) is provided in the manner parallel to the printed circuit board (2) to the printed circuit board (2) relative to the formation a side surface of the block (3) in the press-in direction, wherein when the forming block (3) is pressed into the notch (4) of the printed circuit board (2), the forming block (3) and the reference plate ( 11) contact, and in the case of elastic deformation of the reference plate (11), allowing the formation of the block (3) and the printed circuit board (2) A slight further relative movement between them. The method of claim 8, characterized in that the printed circuit board (2) is placed on the reference board (11) during the pressing process. The method of claim 8 or 9, wherein the reference plate (11) has: a horizontal parallel surface (12), the printed circuit board (2) and the horizontal parallel surface during the pressing process ( 12) Contact. The method of any one of claims 8 to 10, wherein the reference plate (11) is at least partially made of plastic, preferably the reference plate (11) is aligned with the press-in tool There are: a plastic coating. The method of any one of claims 8 to 11, characterized in that the distance of the reference plate (11) relative to the printed circuit board (2) is adjustable, wherein the distance determines the press-in forming block ( 3) Position in the gap (4). The method according to any of the preceding claims, characterized in that at least two notches (4) are arranged in the printed circuit board (2), and the stencil (7) has: Two openings of the notch (4), wherein the two forming blocks (3) are simultaneously pressed into the respective notches (4) of the printed circuit board (2) by the pressing tool (6). The method of any of the preceding claims, characterized in that After forming the forming block (3), the forming block (3) is flush with each of the outer layers of the printed circuit board (2) with at least one planar side, and/or by at least one planar side from the printed circuit board (2) One of the outer layers protrudes and/or is recessed by an outer layer of one of the printed circuit boards (2) with at least one planar side. The method according to any of the preceding claims, characterized in that the gap (4) in the printed circuit board (2) is produced in two steps before the forming block (3) is pressed in, In a first step, the notch (4) is produced by a rough path processing, wherein in a subsequent second step, the notch (4) is accurately machined to a predetermined final size. The method of claim 15, wherein in the first step, a spiral-toothed drill tool (spiralverzahntes Fräswerkzeug) is used, and/or in the second step, a finishing tool is used. (Schlichtfräser). The method according to any of the preceding claims, characterized in that after the forming block (3) is pressed in, the printed circuit board (2) is subjected to a surface treatment by which the rough edges are removed ( Grate) or the like. The method of any of the preceding claims, wherein the printed circuit board (2) is electroplated prior to pressing the forming block (3), preferably, a copper is applied during the plating A layer is applied to the printed circuit board (2), and more preferably, the plating also includes: plating the inner peripheral surface of the notch (4). The method according to any of the preceding claims, characterized in that after the forming block (3) is pressed in, the printed circuit board (2) is electroplated such that a printed circuit board (2) is produced Desirable wire layout, preferably, the printed circuit board (2) is photolithographically processed prior to the electroplating. The method of claim 18 or 19, wherein a tin-lead layer is applied to the printed circuit board (2), and an etch protection is ensured via the tin-lead layer. The method according to any of the preceding claims, characterized in that before and/or after the forming block (3) is pressed, the printed circuit board (2) is at least in the region of the notch (4) Metallisiert. The method according to any of the preceding claims, characterized in that after the forming block (3) is pressed in, the printed circuit board (2) is subjected to a common surface processing together with the forming block (3) ( Oberflächenfinish). The method of any one of claims 1 to 21, characterized in that, after the forming block (3) is pressed, the forming block (3) is compared to other areas of the printed circuit board (2) In terms of a other surface processing. The method of claim 22 or 23, characterized in that: The surface processing of the brush circuit board (2) and/or the forming block (3) is suitable for bonding wire bonding applications. The method according to any of the preceding claims, characterized in that the forming block (3) is printed with a solder mask or a positioning print on at least one of the planar sides. The method according to any of the preceding claims, characterized in that, before pressing the forming block (3), the inner peripheral surface of the notch (4) having a contour and/or the forming block ( 3) an outer peripheral surface is provided in the notch (4) of the printed circuit board (2), preferably, the profile is shaped as a toothed protrusion, and more preferably, the forming block (3) is pressed into After the notch (4) of the printed circuit board (2), a predetermined gap is formed between the outer peripheral surface of one of the forming blocks (3) and the inner peripheral surface of one of the notches (4). The method of claim 26, characterized in that after the forming block (3) is pressed, the gap between the forming block (3) and the inner peripheral surface of one of the printed circuit boards (2) It is filled, preferably, the gap is filled with paint or resin. The method according to any of the preceding claims, characterized in that after the forming block (3) is pressed into the notch (4) of the printed circuit board (2), the forming block (3) and the The conductive layer of the printed circuit board (2) is electrically connected, and/or the gap (4) of the forming block (3) is pressed into the printed circuit board (2) Thereafter, the forming block (3) is thermally coupled to the defined layer of the printed circuit board (2). The method of any of the preceding claims, wherein the forming block (3) is at least partially made of copper or a copper alloy, a composite material, or at least partially based on ceramic or carbon. The synthetic material is made, in particular, such as tungsten-copper (W-Cu) or molybdenum-copper (Mo-Cu). The method of any of the preceding claims, wherein the printed circuit board (2) is made of a material suitable for high frequency signals and/or microwave signals, preferably the printing The circuit board has: polytetrafluoroethylene (PTFE), and more preferably, the printed circuit board contains: a filler such as ceramic. A system (1) for manufacturing a printed circuit board (2) having a press-in forming block (3), the system (1) having: a bottom plate (5), a planar printed circuit board (2) can be defined The ground is placed on the bottom plate (5), the planar printed circuit board (2) has at least one notch (4), and a pressing tool (6), wherein the bottom plate (5) and the pressing tool (6) Movable to each other, characterized in that it has a stencil (7) of an opening (8) into which a forming block (3) can be introduced, wherein the pressing tool (6) Before the forming block (3) is pressed into the planar printed circuit board (2), the stencil (7) can be aligned with the notch (4) of the printed circuit board (2) via a positioning device (9). The system (1) according to claim 31, characterized in that the printed circuit board (2) and the stencil (7) are co-aligned with the pressing tool (6) by the positioning device (9) . The system (1) according to claim 31 or 32, characterized in that, when the positioning device (9) is used, the printed circuit board (2) and the stencil (7) are aligned with the pressing tool (6). The pressing tool (6) can press the forming block (3) into the printed circuit board (2). The system (1) according to any one of claims 31 to 33, wherein the press-in tool (6) has: a presser (10), one end face of the presser (10) is configured to : being smaller than the planar side of one of the forming blocks (3) or the same as the planar side of one of the forming blocks (3), the end face being brought into contact with the forming block (3). The system (1) of any one of claims 31 to 34, characterized in that on the bottom plate (5), a reference plate (11) aligned with the printed circuit board (2) is provided, A printed circuit board (2) can be placed on the reference board (11), wherein when the forming block (3) is pressed into the notch (4) of the printed circuit board (2), the forming block (3) can be Contact with the reference plate (11), wherein the reference plate (11) is elastically deformed after the forming block (3) is in contact with the reference plate (11) a slight further relative movement between the pressing tool (6) and the bottom plate (5) is prevented. Preferably, the movement of the pressing tool (6) is a function of a predetermined contact pressure (Anpresskraft), and thus The pushing tool (6) is controlled by the movement force (kraftgesteuert). The system (1) of claim 35, wherein the reference plate (11) has: a horizontal parallel surface (12), the printed circuit board (2) and the horizontal parallel surface during the pressing process (12) Contact. A system (1) according to claim 35 or 36, characterized in that the reference plate (11) is at least partially made of plastic, more advantageously the bottom plate (5) and the reference plate ( 11) integrally formed, more advantageously, the bottom plate (5) and the reference plate (11) are jointly made of plastic. The system (1) of any one of claims 35 to 37, wherein the distance of the reference plate (11) relative to the bottom plate (5) is adjustable, wherein the distance determines the pressed into a block (3) A position within the notch (4) of the printed circuit board (2). The system (1) according to any one of claims 31 to 38, characterized in that the stencil (7) has two openings (8), each of which is adapted to the printing The two notches (4) of the circuit board (2), wherein the two forming blocks (3) are simultaneously pressed into the respective notches of the printed circuit board (2) by the pressing tool (6) (4). A system (1) for manufacturing a printed circuit board (2) having a press-in forming block (3), the system (1) having: a bottom plate (5), a planar printed circuit board (2) can be defined The ground is placed on the bottom plate (5), the planar printed circuit board (2) has at least one notch (4), and a pressing tool (6), the pressing tool (6) is relative to the bottom plate (5) Moving, wherein a forming block (3) can be pressed into the notch (4) of the planar printed circuit board (2) by the pressing tool (6), characterized in that at least the bottom plate (5) a portion of the material or a material (11) in contact with the bottom plate (5) is elastically deformable in the pressing direction of the forming block (3), and the printed circuit board (2) is placed in the press-in process The material (11) is such that after the forming block (3) is in contact with the partial region of the bottom plate (5), that is, the material (11), the portion of the bottom plate (5) is elastically deformed or In the case of elastic deformation of the material (11), a slight further relative movement between the pressing tool (6) and the bottom plate (5) is allowed.