JP2012114385A - Circuit board manufacturing device and circuit board manufacturing method using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a circuit board manufacturing device with high reliability and excellent productivity, and a circuit board manufacturing method using the same.SOLUTION: A circuit board is punched using a manufacturing device comprising a stress relief mechanism, in which a board holding surface of a lower die of a metallic mold is processed into a concave shape, and a uniform stress mechanism, in which a vicinity of a cutting part of an upper die stripper plate of the metallic mold is processed into a concave shape. In particular, a depth, to which the surface is processed into the concave shape, is a depth not more than a total thickness of a pattern and a solder resist formed on a circuit board surface layer on a lower die surface, and is between a depth equal to and three times larger than the total thickness of the pattern and the solder resist formed on the circuit board surface layer on the upper die stripper plate. Thereby, the stress generated during processing is relieved, so as to provide a circuit board manufacturing device for realizing a circuit board with high reliability and excellent productivity, and a circuit board manufacturing method using the same.

Description

  The present invention relates to a circuit board manufacturing method in which a circuit board manufacturing apparatus and a plurality of layers of circuit patterns are connected.

  In recent years, with the miniaturization and high density of electronic devices, there has been a strong demand for circuit boards not only for industrial use but also for consumer use. In particular, circuit boards have been improved in functionality, and more and more circuit patterns are connected using inner layer connection means, and the connection reliability is important.

  Hereinafter, a conventional circuit board manufacturing method will be described with reference to FIG.

  FIG. 7 illustrates a process of punching out a circuit board using a mold by a conventional circuit board manufacturing method.

  In FIG. 7A, 50 is a circuit board, 51 is a circuit pattern formed of a metal foil or the like on the circuit board, 52 is an upper mold part, 53 is an upper punch plate a, and 54 is a punching punch. , 55 is a stripper plate, 56 is an outer die plate b, 57 is a lower mold part, 58 is a lower die, 59 is a slit into which a punching punch is inserted, 60 is a punching hole for dropping the punched substrate residue, and 61 is a lower part A die holder plate 62 is a cushion, 63 is an outer stripper, and 64 is a guide pin for positioning the circuit board. The circuit board 50 is positioned on the lower mold part 57 by the guide pin 64 and left before being punched. Shows the state.

  In FIG. 7B, the stripper plate 55 is moved to the circuit board by applying pressure from above the upper punch plate a53 using a hydraulic device or the like (not shown) to press the upper mold part 52 against the lower mold part 57. At the same time as 50 is held, the punching punch 54 punches the discard board portion 65 of the circuit board into the slit 59 opened in the lower die 58.

  Similarly, when the upper outer shape die plate b56 pushes the circuit board, the cushion 62 provided below the outer shape stripper 63 sinks and pushes down the outer shape stripper 63, and the workpiece outer frame portion 66 is cut.

  Then, as shown in FIG. 7C, the upper mold part 52 is raised by releasing the hydraulic press, the stripper plate 55 is returned to the original position, and the circuit fitted in the upper outer die plate b56. The product outer portion 67 of the board is discharged, and the punching of the circuit board by the mold is completed.

  Next, a process in which the punching punches the circuit board will be described with reference to FIG.

  FIG. 8 is a cross-sectional view showing a conventional method of manufacturing a circuit board.

  From the state in which the circuit board is placed on the mold shown in FIG. 8A, a load is applied to the portion where the punch 54 is in contact with the circuit board 50 as shown in FIG. The circuit board 50 is bent and cut by using a portion closest to the cut portion as a fulcrum.

  At the moment of cutting, the bent circuit board 50 and the lower die 58 come into contact with each other. The amount of deflection at that time is the total thickness of the pattern or printed matter formed on the surface layer of the circuit board.

  The surface layer of the bent circuit board is stretched to cause delamination due to the misalignment of the layer, and a bending stress is applied to the cross section of the substrate serving as a fulcrum. The amount increases as the thickness of the substrate increases, and the damage also increases.

  Next, as shown in FIG. 8C, as the punching punch 54 enters, the circuit board 50 has a crack 68 that progresses to the outer shape of the punching punch 54.

  As a result, when the punching punch 54 enters, the punching punch 54 is finally cut completely, resulting in a state as shown in FIG.

  Depending on the magnitude of the bending stress generated at this time, the inner via hole is formed near the cut portion in the circuit board having the inner via hole formed by filling the hole formed by laser machining or drilling with conductive paste. When the is installed, damage at the time of cutting affects the inner via hole, and there is a concern that the interlayer connection resistance value is deteriorated (resistance value is large).

  In addition, there is a concern that the cracks in the surface layer generated by the bending stress may be peeled or chipped.

  As prior art document information relating to the invention of this application, for example, Patent Document 1 is known.

JP-A 61-263294

  However, in the above conventional manufacturing method, there is no means for relieving the bending stress generated at the time of punching the die, and there is a high possibility that the circuit board is affected and the connection resistance value is deteriorated, the surface layer is peeled off, or chipping occurs. It had problems such as becoming.

  The present invention solves the above-mentioned conventional problems, reduces the bending stress generated at the time of punching, and suppresses peeling and chipping of the surface layer, and realizes a highly reliable and highly productive circuit board. A circuit board manufacturing apparatus and a circuit board manufacturing method using the same are provided.

  In order to achieve the above object, the present invention has the following configuration.

  The invention according to claim 1 of the present invention comprises an upper mold part having a punch and a lower mold part having a lower die for holding a circuit board, and is used for punching a circuit board. The lower die is provided with a stress relaxation mechanism, and the upper mold stripper plate is provided with a surface layer peeling relaxation mechanism. Thus, it is possible to take measures against bending stress generated during processing and peeling of the surface layer.

  The invention according to claim 2 of the present invention is the apparatus for manufacturing a circuit board according to claim 1, wherein the stress relaxation mechanism is obtained by processing a surface holding the circuit board into a concave shape. Therefore, by processing the surface of the lower die and the surface of the upper die into a concave shape, it has an effect that the impact at the time of punching on the surface layer portion or insulating layer portion of the circuit pattern of the circuit board can be reduced. .

  According to a third aspect of the present invention, the concave shape is processed into a shape in which a circuit pattern portion or an insulating layer portion formed on a circuit board held by the lower die and the upper die stripper plate is fitted. The apparatus for manufacturing a circuit board according to claim 2, wherein the circuit pattern portion and the insulating layer portion of the circuit board are formed by processing the surfaces of the lower die and the upper stripper plate into a concave shape. It has a fitting shape, and has the effect of reliably reducing the amount of bending of the circuit board at the time of die punching and suppressing the stress on the substrate surface in the vicinity of the cut portion.

  According to a fourth aspect of the present invention, the depth of the concave shape of the lower die is a depth less than the total thickness of the circuit pattern and insulating layer formed on the circuit board. 3 is an apparatus for producing a circuit board as described in No. 3, and has an effect that pressurizing force is not concentrated on a cut portion at the time of punching. 4. The circuit according to claim 3, wherein the depth of the concave shape of the upper stripper plate is about three times the total thickness of the circuit pattern formed on the circuit board and the insulating layer. The substrate manufacturing apparatus has an effect of concentrating the pressing force in the vicinity of the cutting vicinity at the time of punching.

  According to a fifth aspect of the present invention, the concave shape has a protruding edge portion, and the width of the edge portion is determined by the circuit pattern or insulating layer formed at the processed end of the circuit board and the end of the circuit board. 4. The apparatus for manufacturing a circuit board according to claim 3, wherein the width is shorter than the distance to the formation end, and has an effect of suppressing a load or pressure applied to the circuit pattern or the insulating layer at the time of punching. Have.

  The invention according to claim 6 of the present invention holds the circuit board on which the circuit pattern and the insulating layer are formed in the upper and lower mold parts of the circuit board manufacturing apparatus according to claim 1, and lowers the upper mold part. This circuit board manufacturing method is characterized by punching a circuit board with a punching die by pressing it against a mold part. The bending stress and surface stress generated during processing are alleviated and received by cutting the outer shape. A circuit board can be manufactured with less stress. Thereby, in particular, it is possible to suppress the influence of stress on the inner via hole disposed in the vicinity of the cut portion of the actual circuit portion, and there is an effect that a high quality circuit board can be provided.

  In the invention according to claim 7 of the present invention, the circuit board is electrically connected to the circuit patterns on both sides through the conduction holes formed by filling the processing holes of the insulating base material with the conductive paste. 7. A circuit board manufacturing method according to claim 6, wherein a stable quality circuit board is provided without increasing the resistance value of a conductive hole formed by filling a conductive paste. It has the effect of being able to do.

  According to an eighth aspect of the present invention, the circuit board has a multilayer structure in which a plurality of insulating base materials each having a conduction hole formed by filling a processing hole with a conductive paste, and the conduction hole is formed. A circuit board manufacturing method according to claim 6, wherein the circuit pattern between the layers including the surface layer is electrically connected through the conductive layer, and is formed by filling the conductive paste. Even in a multilayer circuit board that requires interlayer connection by holes, there is an effect that a multilayer circuit board of stable quality can be provided without increasing the resistance value of the conduction hole.

  The invention according to claim 9 of the present invention is characterized in that the insulating base material is made of a substrate material in which a glass cloth is impregnated with a thermosetting epoxy resin. In the circuit board using the glass cloth, which is relatively high in strength and difficult to punch, as an insulating base material, the resistance value of the conduction hole does not increase and is stable. It is possible to provide a circuit board having the quality as described above.

  The invention according to claim 10 of the present invention is the method for manufacturing a circuit board according to claim 6, wherein the insulating layer is formed in a region excluding the processed end. In addition to preventing cracks in the insulating layer at the processed end, the circuit board can be manufactured by reducing the bending stress generated during processing and reducing the stress received by cutting the outer shape.

  The present invention reduces the stress applied at the time of punching the substrate by processing the die surface of the lower die in accordance with the substrate shape when processing the circuit board using the inner via hole as a means of inner layer connection. Can be made. As a result, it is possible to suppress the influence of stress on the inner via hole disposed in the vicinity of the cut portion of the actual circuit portion.

  In addition, when processing the circuit board including the inner layer connection circuit board in the inner via hole, the surface of the upper mold stripper plate is recessed according to the substrate shape, so that the cutting portion is cut when punching the board. Stress applied to the vicinity can be reduced. As a result, it is possible to reduce the occurrence of surface layer peeling and chipping defects that occur in the vicinity of the cut portion, and it is possible to provide a circuit board manufacturing apparatus and manufacturing method with high quality and excellent productivity. is there.

Sectional drawing which shows the manufacturing method of the circuit board in embodiment of this invention Sectional drawing which shows the manufacturing method of the multilayer circuit board in the embodiment The top view which shows the circuit board in the embodiment Schematic cross-sectional view of the circuit board manufacturing apparatus in the same embodiment Sectional drawing which shows the manufacturing method of the circuit board in the embodiment, and the manufacturing method of the conventional circuit board The figure which shows the circuit board for evaluation in the embodiment Sectional drawing which shows the manufacturing method of the conventional circuit board Sectional drawing which shows the manufacturing method of the conventional circuit board

(Embodiment)
Hereinafter, a method for manufacturing a circuit board according to an embodiment of the present invention will be described.

  FIG. 1 is a cross-sectional view showing a method of manufacturing a circuit board according to the present invention.

  The prepreg 1 in FIG. 1A is a substrate material in which a glass cloth is impregnated with a thermosetting epoxy resin, and the size of the length, width, and thickness is 500 mm × 500 mm × 0.1 mm.

  In order to increase production efficiency, the prepreg is sized to form a plurality of products.

  Next, as shown in FIG. 1B, a through hole 2 having a diameter of 200 μm is formed at an arbitrary position in the prepreg 1 using a laser or a drill.

  Further, as shown in FIG. 1C, a conductive paste is filled into the through hole 2 by means such as a printing method to form the inner via hole 3.

  Thereafter, as shown in FIG. 1 (d), both sides of the prepreg 1 are sandwiched between metal foils 4 and heated and pressed by a hot press (not shown), so that the epoxy resin impregnated in the prepreg is cured and simultaneously penetrated. The conductive paste filled in the holes is also cured, whereby electrical connection between the metal foils on both sides can be achieved, and the double-sided plate 5 shown in FIG. 1 (e) can be formed.

  Next, as shown in FIG. 1 (f), the circuit pattern 6 is formed by selectively removing an arbitrary portion of the metal foil of the double-sided plate, and the two-layer circuit board 7 can be formed.

  Thereafter, a solder resist as an insulating layer and, if necessary, a component layout are formed.

  Next, the manufacturing method of the multilayer circuit board of this invention is demonstrated using FIG.

  FIG. 2 is a cross-sectional view showing a method for manufacturing a multilayer circuit board according to the present invention.

  2 (a), the two-layer circuit board 7 formed in FIG. 1 serving as the core of the laminated substrate and the process of FIGS. 1 (a) to 1 (c) are filled with the conductive paste. The prepreg 1 made and the metal foil 4 which becomes the outer layer circuit pattern of a laminated substrate are shown.

  FIG. 2B is a diagram in which a part of each material prepared in FIG. 2A is stacked with high accuracy after being optically recognized and positioned, for example.

  2C is a two-layer circuit that is a core substrate by curing the epoxy resin contained in the prepreg 1 by heating and pressurizing the layered structure in FIG. 2B with a hot press (not shown). By integrating the substrate 7, the prepreg 1, and the metal foil 4, it is a four-layer laminate 8 in which the metal foils 4 on both sides that are the outermost layers are electrically connected.

  FIG. 2D shows a four-layer circuit board 10 on which a circuit pattern 6 is formed by selectively removing the metal foil 4 on the surface of the four-layer laminate 8 by a method such as etching.

  Further, in the case of multilayering, it goes without saying that the above-described steps may be repeated using the four-layer circuit board 10 as a core board. Thereafter, a solder resist as an insulating layer and, if necessary, a component layout are formed.

  Note that the insulating layer is desirably formed in a region excluding the processed end.

  Thereby, the crack of the insulating layer of the process end at the time of a punching process can be prevented.

  Next, the process of dividing the circuit board formed in the above process will be described.

  FIG. 3 is a plan view showing a circuit board in the process of the circuit board manufacturing method of the present invention.

  The work size 11 is the size of the substrate material itself and needs to be divided into sizes to be mounted on a set substrate or the like.

  The product outer frame portion 12 is cut into a product size and shipped to the user, and a plurality of workpiece outer sizes 12 are included in the work size 11 to improve production efficiency.

  In the actual circuit portion 13, an electric circuit is formed by a metal foil, an inner via hole, or the like. This part is included in the product size to increase production efficiency.

  The discard plate portion 14 is cut by a punching punch in the outer shape processing, and is easily taken out from the product size when the user incorporates it into the final product.

  The inner via hole 15 is formed by filling a hole formed by laser processing or the like disposed in the actual circuit portion with a conductive paste.

  Further, the inner via hole 15 has a diameter of about φ200 μm and is disposed at an arbitrary position such as the center or the end of the substrate. Recently, as the density is increased, the inner via hole 15 is increasingly disposed at the end of the substrate.

  The connecting portion 16 connects the actual circuit portion 13 to the product outer shape portion after the discard plate portion 14 is cut after the outer shape processing, and can be easily separated after being mounted on a device or device after mounting the components. It has become.

  FIG. 4 is a schematic cross-sectional view of the circuit board manufacturing apparatus of the present invention.

  In FIG. 4A, 21 is an upper mold part, 22 is an upper punch plate a, 23 is a punching punch, 24 is a stripper plate in which the substrate holding surface is processed into a concave shape, and is formed on the circuit board surface layer. This is a state in which the edge portion 34b is dug with a depth from the line to be punched to the nearest metal foil at a depth about three times as large as the total thickness of the patterned resist and the solder resist.

  Reference numeral 25 denotes an upper outer die plate b, 26 denotes a lower mold portion, and 27 denotes a lower die in which the substrate holding surface is processed into a concave shape, which is less than the total thickness of the pattern formed on the circuit board surface layer and the solder resist. In this state, the edge portion 34a having a depth equal to or less than the distance from the line to be punched to the nearest metal foil is left and dug.

  28 is a slit into which a punching punch is inserted, 29 is a punching hole for dropping the punched substrate residue 35, 30 is a lower die holder plate, 31 is a cushion, 32 is an outer stripper plate, and 33 is a guide pin for positioning the circuit board.

  A method of manufacturing a circuit board using a mold which is the manufacturing apparatus of the present invention having the above-described specially processed lower die and upper die stripper plate will be described below.

  As shown in FIG. 4B, the punch 23 is punched by applying pressure from above the upper punch plate a22 and pressing the upper mold part 21 against the lower mold part 26 using a hydraulic device or the like (not shown). Processing is performed by punching a discarded plate portion of the circuit board 10 into a slit 28 formed in the lower die 27.

  At this time, the stripper plate 24 processed into the concave shape is held in a state where the circuit pattern portion of the actual circuit portion 13 is pressed against the portion of the lower die 27 processed into the concave shape.

  The concave shape of the lower die 27 is processed into a shape into which a circuit pattern portion or a solder resist portion as an insulating layer is fitted. The depth of the concave shape is processed to be equal to or less than the total thickness of the circuit pattern thickness and the solder resist thickness.

  For this reason, the edge part 34a does not contact the circuit board 10, and the load when the stripper plate 24 holds the circuit board 10 can be received over the entire area of the board including the part where the circuit board 10 is punched out. Therefore, the substrate cutting part is not intensively pressed.

  The concave shape of the stripper plate 24 is also processed into a shape into which a circuit pattern portion or a solder resist portion as an insulating layer is fitted.

  The depth of the concave shape is processed to be equal to or about three times the total thickness of the circuit pattern thickness and the solder resist thickness. Therefore, the edge portion 34b is in contact with the circuit board 10, and the load when the stripper plate 24 holds the circuit board 10 can be received in the entire area of the edge portion 34b. Pressurized.

  Further, if the depth of the concave die of the lower die 27 is too deep, the load may be received by the edge portion 34a and the substrate may be crushed.

  Further, if the edge of the lower die is made like a sharp blade, the die is likely to be chipped, which is not suitable for mass production.

  In the present invention, the circuit pattern portion of the product outer frame portion 12 of the circuit board is punched in a state where the circuit pattern portion is fitted in the upper and lower concave molds, and the amount of substrate deflection corresponding to the thickness of the circuit pattern or the like is reduced. And the substrate can be cut.

  Next, as shown in FIG. 4B, when the upper outer die plate b25 pushes the circuit board, the cushion 31 provided under the outer die 32 is sunk, and the outer stripper plate 32 is pushed down. The circuit board 10 is cut and separated into a product outer frame portion 12, a workpiece outer frame portion 17, and a substrate residue 35.

  Then, as shown in FIG. 4 (c), the upper mold part 21 is raised by releasing the hydraulic device, the stripper plate 24 returns to the original position, and the circuit fitted in the upper outer die plate b25. The product outer frame portion 12 of the board is discharged, and the circuit board punching by the mold is completed.

  4 will be described in comparison with the conventional method with reference to FIG.

  FIG. 5 is a schematic cross-sectional view showing the circuit board manufacturing method of the present invention and the conventional circuit board manufacturing method at the same time. The circuit board manufacturing method of the present invention is shown on the left side, and a conventional example is shown on the right side for simultaneous comparison.

  From the state where the circuit board 10 is placed on the lower mold shown in FIG. 5A, the punching shown in FIG. 5B is performed.

  When the punching punch 23 enters, the portion to be punched is bent with the circuit pattern closest to the cutting portion as a fulcrum as shown in the figure, and the insulating base material portion of the surface layer is pulled and processed while sliding. In the conventional method shown in (1), the substrate surface is slippery and cannot be cut unless it is bent by the thickness of the formed pattern or solder resist.

  On the other hand, in the circuit board manufacturing method of the present invention, as shown on the left side of the figure, the periphery of the cut portion is pressed by the upper mold edge portion, the slip of the substrate surface is pressed down, and the distance between the lower mold edge portion and the substrate is short, Since the amount of bending at the time of cutting can be reduced as compared with the conventional method, the effect of relaxing the bending stress at the time of shearing can be obtained.

  It is considered that if the upper stripper plate 24 is recessed and pressed, the bending and tensile stress when the punching punch 23 enters the surface layer when the substrate is cut is surely relieved, and the influence on the surface layer peeling and chipping is reduced. .

  In addition, if the lower die 27 is recessed, the bending stress at the time of cutting the substrate is surely relaxed, and the influence on the inner via hole is considered to be reduced.

  However, since there is a concern that the shape of the concave processing may adversely affect the appearance of the substrate and the life of the mold, in this embodiment, a die processed to have an edge width of 0.3 mm and a depth of 50 μm is used. . The depth of the upper mold recess was 100 μm.

  As a concave machining method, the inside was machined with a ball end mill, and in particular, when the circuit pattern was close to the edge of the substrate, machining was performed so that the corner portion did not have R by electric discharge machining.

  Moreover, it processed with the discharge master which made it about 0.3 mm smaller than the external shape of a circuit board.

  As a result, the manufacturing method using the circuit board manufacturing apparatus of the present invention has a small amount of bending at the time of punching out the substrate, so that the influence of bending stress on the inner via hole arranged in the vicinity of the cut portion can be suppressed.

  In addition, since the upper stripper plate was pressed and pulled and bent less, cracks on the substrate surface could be reduced.

  The appearance quality can be further improved by using a highly flexible solder resist.

  Next, a circuit board formed by the circuit board manufacturing method of the present invention, in which an evaluation circuit including an inner via hole is disposed in the vicinity of the cut portion, and a conventional circuit board manufacturing method The change of the connection resistance of the prepared circuit board was compared.

  FIG. 6 is a schematic diagram showing an evaluation circuit formed and arranged on a circuit board. The inner via hole 3 is relay-connected by a circuit pattern 6 (metal foil 4), and several inner via holes are connected in a chain shape.

  In this embodiment, an example of a six-layer substrate is shown.

  Let L be the distance from the outer cutting line of the circuit board to the center of the inner via hole, and L = 10.55 mm as a reference, which is smaller, that is, “close”, and larger, that is, “far”. A circuit board for an evaluation circuit having a distance (hereinafter referred to as an evaluation board) was manufactured.

  The resistance value of the circuit can be measured using a resistance meter between the two circuit patterns 6 on the surface layer.

  The results are shown in (Table 1).

  (Table 1) shows the resistance value change of the evaluation circuit when the die punching process is performed for each arrangement position in the workpiece size on the manufacturing substrate of the evaluation substrate, and processing 1 to 3 is performed as a screening test. It is. Moreover, the comparison of the evaluation board | substrate formed with the conventional manufacturing method and the evaluation board | substrate formed with the manufacturing method of this invention was also shown (evaluation board | substrate: each 9 sheets).

  “Initial” shown in the table is before the die punching, “After punching” is after punching the circuit board with the die, “Process 1” is a high temperature process, “Process 2” is a process assuming soldering, “Process 3” is also a process assuming soldering, and the resistance value after each process was measured.

  In the conventional manufacturing method, when the screening test is performed when the position of the inner via hole is close to the cut portion of the circuit board, an evaluation board whose resistance value increases after “Process 3” is generated (encircled in Table 1). Each part corresponds to two evaluation boards.)

  It can be estimated that the influence of stress at the time of cutting is not constant, considering that not all of them are deteriorated but there are some circuits that have no problem and appear in part.

  It can also be seen that the resistance value increases as the distance L between the cut portion and the inner via hole decreases, and the resistance value gradually increases as the distance increases, and is dependent on the distance.

  On the other hand, in the evaluation board formed by the method for manufacturing a circuit board according to the present invention, even if it is “close” to the cut portion, the resistance value does not tend to increase in the screening test, and a stable result was obtained.

  When this experiment was repeated several times for each production lot, similar results could be obtained.

  From this, it can be seen that the circuit board of the present invention can reduce the bending stress by suppressing the amount of bending at the time of punching the board, and has the effect of eliminating the influence on the actual circuit portion.

  In the present embodiment, the circuit board using a glass cloth having a relatively high strength and difficult to punch as an insulating base material (prepreg) has a stable quality without increasing the resistance value of the conduction hole. It was shown to provide a circuit board.

  From this, it is needless to say that more stable quality can be secured when another insulating base material that is easier to punch than glass cloth is used.

  As described above, when all the circuit boards including the circuit board using the inner via hole as a means for connecting the inner layer are to be die-molded, the mold using the mold obtained by processing the lower die and the upper stripper plate into a concave die is used. By performing the die machining, it is possible to suppress the amount of bending of the substrate at the time of punching, and to reliably reduce the bending stress generated during the machining.

  As a result, the present invention improves the quality by suppressing the influence of the stress placed on the actual circuit portion of the circuit board, can realize the stabilization of the process, and further provides a circuit board manufacturing apparatus and manufacturing method with excellent productivity. The industrial applicability is great.

DESCRIPTION OF SYMBOLS 1 Prepreg 2 Through-hole 3 Inner via hole 4 Metal foil 5 Double-sided board 6 Circuit pattern 7 2 layer circuit board 8 4 layer laminated board 10 4 layer circuit board 11 Work size 12 Product outer frame part 13 Actual circuit part 14 Discarding board part 16 Connection Part 21 Upper mold part 22 Upper punch plate a
23 punching punch 24 stripper plate 25 upper die plate b
26 Lower mold part 27 Lower mold die 28 Slit 29 Punching hole 30 Lower external die holder plate 31 Cushion 32 External stripper plate 33 Guide pin 34a Edge part (lower mold)
34b Edge part (upper mold)
35 Substrate residue

Claims (10)

An upper mold part having a punching punch and a lower mold part having a lower die for holding a circuit board and used for punching a circuit board, the lower die and the upper mold stripper plate Is provided with a stress relaxation mechanism. The circuit board manufacturing apparatus according to claim 1, wherein the stress relaxation mechanism is formed by processing a surface holding the circuit board into a concave shape. 3. The circuit according to claim 2, wherein the concave shape is processed into a shape in which a circuit pattern portion or an insulating layer portion formed on a circuit board held by a lower die and an upper die stripper plate is fitted. Board manufacturing equipment. The depth of the concave shape of the lower die is a depth less than the total thickness of the circuit pattern and the insulating layer formed on the circuit board. 4. The circuit according to claim 3, wherein the depth of the concave shape of the upper stripper plate is a depth equivalent to the total thickness of the circuit pattern formed on the circuit board and the insulating layer or about 3 times. Board manufacturing equipment. The concave shape has a protruding edge portion, and the width of the edge portion is shorter than the distance from the processing end of the circuit board to the formation end of the circuit pattern or insulating layer formed at the end of the circuit board. The circuit board manufacturing apparatus according to claim 3. A circuit board with a punching punch is formed by holding a circuit board on which a circuit pattern and an insulating layer are formed in upper and lower mold parts of the apparatus for manufacturing a circuit board according to claim 1, and pressing the upper mold part against the lower mold part. A method of manufacturing a circuit board, comprising stamping a board. The circuit board according to claim 6, wherein the circuit board is electrically connected to both sides of the circuit pattern through a conduction hole formed by filling the processing hole of the insulating base material with a conductive paste. A method for manufacturing a substrate. The circuit board has a multilayer structure in which a plurality of insulating base materials having conductive holes formed by filling a conductive hole in a processing hole are laminated, and an interlayer circuit pattern including a surface layer is electrically connected through the conductive hole. The circuit board manufacturing method according to claim 6, wherein the circuit boards are connected to each other. 9. The method of manufacturing a circuit board according to claim 7, wherein the insulating base is made of a substrate material obtained by impregnating a glass cloth with a thermosetting epoxy resin. The method for manufacturing a circuit board according to claim 6, wherein the insulating layer is formed in a region excluding the processed end.

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