TW201320837A - Print circuit board and manufacturing method thereof - Google Patents
Print circuit board and manufacturing method thereof Download PDFInfo
- Publication number
- TW201320837A TW201320837A TW101130691A TW101130691A TW201320837A TW 201320837 A TW201320837 A TW 201320837A TW 101130691 A TW101130691 A TW 101130691A TW 101130691 A TW101130691 A TW 101130691A TW 201320837 A TW201320837 A TW 201320837A
- Authority
- TW
- Taiwan
- Prior art keywords
- solder ball
- layer
- solder
- forming
- circuit board
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
Abstract
Description
本發明係有關於一種印刷電路板及其製造方法。 The present invention relates to a printed circuit board and a method of fabricating the same.
在半導體業界，疊合複數晶片之多晶片3D封裝(Multi-chip 3D package)構造之體現，與IC之高集積化皆是製作高性能產品之關鍵。 In the semiconductor industry, the multi-chip 3D package structure of stacked multi-chips and the high integration of ICs are the key to making high-performance products.
為在將複數半導體晶片安裝於印刷電路板時電性連接，可採用打線(Wire bonding)、植球(Bumping)等方法。最近則有高端(High-end)產品，於覆晶CSP(Chip scale package)單元之中央表面形成高度較低之凸塊，並於外側形成高度較高之球狀錫球，而可靈活地製成雙SOP(Solder on pad)製品，組裝兩個以上尺寸相異之晶片。 In order to electrically connect the plurality of semiconductor wafers to the printed circuit board, methods such as wire bonding and bumping may be employed. Recently, there is a high-end product, which forms a bump with a lower height on the center surface of the CSP (Chip Scale Package) unit, and forms a spherical ball of higher height on the outside, and can be flexibly manufactured. As a SOP (Solder on pad) product, assemble two or more wafers of different sizes.
另一方面，為於單元中央組裝晶片，而要求內外側之錫凸塊高度不同，但要降低內側之錫凸塊高度，卻有其限制。在此，安裝於外側之球狀錫球，適用較大體積(Volume)之球狀錫球，而可達成較高之高度，但卻會發生一個問題，那就是難以確保腳距密集(Fine pitch)化所導致之高I/O數。 On the other hand, in order to assemble the wafer at the center of the cell, the height of the tin bumps on the inner and outer sides is required to be different, but the height of the tin bump on the inner side is lowered, but there is a limit. Here, the spherical tin ball mounted on the outer side is suitable for a large spherical ball of a volume, and a higher height can be achieved, but a problem arises in that it is difficult to ensure a dense pitch (Fine pitch). The high I/O number caused by the conversion.
本發明之目的在於，提供一種印刷電路板及其製造方式，其中一側面之高度較高，而且適用可使腳距密集(Fine pitch)之錫球構造，以解決上述先前技術之問題。 It is an object of the present invention to provide a printed circuit board and a method of manufacturing the same, wherein the height of one side is high and the pitch is dense (Fine The pitch ball structure of the pitch is to solve the problems of the prior art described above.
本發明一實施例中之印刷電路板，包含具有接墊之基礎基板、於該接墊上具有第一開口部之阻焊層，以及形成於該第一開口部之錫球，其中該錫球可呈雪人狀。 A printed circuit board according to an embodiment of the present invention includes a base substrate having a pad, a solder resist layer having a first opening portion on the pad, and a solder ball formed in the first opening portion, wherein the solder ball is Snowman shaped.
另外，該錫球以該接墊面為基準，分為第一層和第二層，該第一層和第二層之直徑可為彼此相異，亦可為相同。 In addition, the solder ball is divided into a first layer and a second layer based on the pad surface, and the diameters of the first layer and the second layer may be different from each other or may be the same.
另外，該印刷電路板分為中央部和端部，該中央部和端部分別組裝半導體元件時，該錫球形成於該中央部或端部，且形成於該端部之錫球的材質，相較於形成於中央部之錫球的材質具有較高熔點。 In addition, the printed circuit board is divided into a central portion and an end portion. When the central portion and the end portion are respectively assembled with the semiconductor element, the solder ball is formed at the central portion or the end portion, and the material of the solder ball formed at the end portion is The material of the solder ball formed in the central portion has a higher melting point.
本發明其他實施例之印刷電路板製造方法，包含以下步驟：準備具有接墊之基礎基板之步驟、形成該接墊上具有第一開口部之阻焊層步驟、於該阻焊層上對應於該第一開口部之區域形成具有第二開口部之錫球形成用阻焊層之步驟，以及於該第一開口部及第二開口部形成錫球之步驟，該錫球可呈雪人狀。 A method for manufacturing a printed circuit board according to another embodiment of the present invention includes the steps of: preparing a base substrate having a pad, forming a solder resist layer having a first opening portion on the pad, corresponding to the solder resist layer The step of forming the solder ball forming solder ball layer having the second opening portion in the region of the first opening portion, and the step of forming the solder ball in the first opening portion and the second opening portion, the solder ball may be in the shape of a snowman.
在此，於形成該錫球之步驟，可包含以下兩步驟：於該第一開口部和第二開口部形成圓形錫球之步驟，以及透過加熱工程，將該圓形錫球形成雪人狀錫球之步驟。 Herein, the step of forming the solder ball may include the following steps: forming a circular solder ball in the first opening portion and the second opening portion, and forming the circular solder ball into a snowman shape through a heating process The steps of the solder ball.
另外，該錫球以該接墊面為基準，分為第一層和第二層，該第一層和第二層之直徑可為彼此相異，亦可為相同。 In addition, the solder ball is divided into a first layer and a second layer based on the pad surface, and the diameters of the first layer and the second layer may be different from each other or may be the same.
另外，形成該錫球之步驟前，可更包含於該第一開口部形成助焊層之步驟。 In addition, before the step of forming the solder ball, the step of forming a solder layer in the first opening portion may be further included.
另外，在形成該錫球之步驟後，可更包含去除該錫球形成用阻焊層之步驟。 Further, after the step of forming the solder ball, the step of removing the solder ball forming solder resist layer may be further included.
另外，該錫球形成用阻焊層，可由乾膜所構成。 Further, the solder ball forming solder resist layer may be composed of a dry film.
另外，該印刷電路板分為中央部和端部，該中央部和端部分別組裝半導體元件時，該錫球形成於該中央部或端部，形成於該端部之錫球，其材質之熔點，可比形成於該中央部之錫球之材質高。 In addition, the printed circuit board is divided into a central portion and an end portion. When the central portion and the end portion are respectively assembled with the semiconductor element, the solder ball is formed at the central portion or the end portion, and the solder ball formed at the end portion is made of a material. The melting point is higher than the material of the solder ball formed in the central portion.
為了對本發明之上述及其他方面有更佳的瞭解，下文特舉實施例，並配合所附圖式，作詳細說明如下： In order to provide a better understanding of the above and other aspects of the present invention, the following detailed description of the embodiments and the accompanying drawings
透過以下所附圖式詳細說明及理想實施例，可更清楚明白本發明之目的、優點及新特徵。在本說明書中，對各圖式之構成要件編註參考編號時，只要是同一構成要素，即使於不同圖式中出現，亦盡可能編上同樣編號，尚請注意。另外，「一面」、「另一面」、「第一」、「第二」等用語，乃是用來區分一個構成要件與其他構成要件，並非以該用語限制構成要件。以下說明並省略眾所周知技術之詳細說明，以免混淆本發明之主旨。 The objects, advantages and novel features of the invention will become more apparent from In this manual, when the reference number is used for the constituent elements of each drawing, as long as it is the same component, even if it appears in different drawings, the same number is used as much as possible. In addition, terms such as "one side", "the other side", "first" and "second" are used to distinguish between a constituent element and other constituent elements, and the constituent elements are not restricted by the term. The detailed description of the well-known art is described below and is omitted to avoid obscuring the gist of the present invention.
以下參照所附圖式，詳細說明本發明之理想實施例。 DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
第1圖係表示本發明一實施例之印刷電路板構造之剖面圖。 Fig. 1 is a cross-sectional view showing the structure of a printed circuit board according to an embodiment of the present invention.
如第1圖所示，印刷電路板100包含：其有接墊120之基礎基板110、於接墊120上有第一開口部之阻焊層130，以及形成於第一開口部之錫球160。 As shown in FIG. 1, the printed circuit board 100 includes a base substrate 110 having a pad 120, a solder resist layer 130 having a first opening portion on the pad 120, and a solder ball 160 formed in the first opening portion. .
在此，錫球160可呈雪人狀。所謂雪人狀，其定義為以兩個圓上下接合之型態，且接合部分形成任意角度之形狀。 Here, the solder ball 160 may be in the shape of a snowman. The so-called snowman shape is defined as a shape in which two circles are joined up and down, and the joint portion is formed into an arbitrary angle shape.
另外，錫球160以接墊面為基準，分為第一層和第二層，第一層和第二層之直徑可為彼此相異，亦可不限於此，具有相同直徑。 In addition, the solder ball 160 is divided into a first layer and a second layer based on the pad surface, and the diameters of the first layer and the second layer may be different from each other, or may not be limited thereto, and have the same diameter.
例如，如第1圖所示，錫球160第一層之直徑A與第二層之直徑B可彼此相異，而第一層和第二層之間形成圓角。 For example, as shown in FIG. 1, the diameter A of the first layer of the solder ball 160 and the diameter B of the second layer may be different from each other, and a rounded corner is formed between the first layer and the second layer.
本發明實施例中之錫球160為呈雪人狀，與一般之圓形錫球相較，直徑(以基板寬度方向為基準)較小，高度(以基板厚度方向為基準)較高，因此可期待獲得腳距密集之效果。 The tin ball 160 in the embodiment of the present invention has a snowman shape, and the diameter (based on the substrate width direction) is smaller than the general circular tin ball, and the height (based on the substrate thickness direction) is high, so Looking forward to getting the effect of the pitch.
另外，在本圖式中，雖為方便說明，省略基礎基板110之具體內層電路構造，但若是該業者，應能充分了解，只要是於絕緣層形成複數層電路之一般電路板，皆適合用作基礎基板110。 In the present embodiment, the specific inner layer circuit structure of the base substrate 110 is omitted for convenience of explanation. However, if it is the manufacturer, it should be sufficiently understood that it is suitable for a general circuit board in which a plurality of layers of circuits are formed in an insulating layer. Used as the base substrate 110.
絕緣層可使用樹脂絕緣層。樹脂絕緣層，可使用類似環氧樹脂之熱硬化樹脂、類似聚亞醯胺之熱塑性樹脂、或於上述樹脂含浸玻璃纖維或無機填料類補強材料之樹脂，例如可使用預浸料胚，另外，可使用光硬化樹脂等，但在此並不限定使用。 A resin insulating layer can be used for the insulating layer. The resin insulating layer may be a thermosetting resin similar to an epoxy resin, a thermoplastic resin similar to polyamidamine, or a resin impregnated with the glass fiber or an inorganic filler-based reinforcing material, for example, a prepreg may be used, and, in addition, A photocurable resin or the like can be used, but it is not limited to use herein.
另外，在接墊120上，透過後續工程，錫球以外部連接端子之形式而形成。透過錫球，將半導體元件或外部部品和內層電路電性連接。 In addition, on the pad 120, through subsequent work, the solder balls are formed in the form of external connection terminals. The semiconductor element or the external component and the inner layer circuit are electrically connected through the solder ball.
另外，接墊120，若是在電路板領域中可作為電路用傳導性金屬使用者，則可無限制地適用，而在印刷電路板中一般使用銅。 Further, the pad 120 can be applied to a conductive metal user in the field of a circuit board without limitation, and copper is generally used in a printed circuit board.
阻焊層130具有保護最外層電路之保護層功能，形成電氣絕緣。在阻焊層130中形成開口部，以露出最外層之接墊120。阻焊層130，如該業界之眾所周知，可以由例如防焊油墨、防焊膜或膠囊化劑等構成，但並不限於此。 The solder resist layer 130 has a protective layer function for protecting the outermost circuit to form electrical insulation. An opening is formed in the solder resist layer 130 to expose the outermost pad 120. The solder resist layer 130, as is well known in the art, may be composed of, for example, a solder resist ink, a solder resist film, or an encapsulant, but is not limited thereto.
另外，雖未加以圖示，印刷電路板100，可適用於安裝多數半導體元件或封裝之構造。 Further, although not shown, the printed circuit board 100 can be applied to a structure in which a large number of semiconductor elements or packages are mounted.
此時，印刷電路板100分為中央部和端部，中央部和端部分別組裝半導體元件時，錫球可形成於中央部或端部。 At this time, the printed circuit board 100 is divided into a central portion and an end portion, and when the central portion and the end portion are respectively assembled with the semiconductor element, the solder ball can be formed at the central portion or the end portion.
此時，形成於端部之錫球，其材質之熔點，可比形成於中央部之錫球之材質高。 At this time, the solder ball formed at the end portion may have a higher melting point than the material of the solder ball formed at the center portion.
此乃是為了在對中央部組裝半導體元件完畢前，使形成於端部之錫球維持雪人狀。 This is to maintain the snow ball formed at the end portion in a snowman shape before assembling the semiconductor element to the center portion.
第2圖至第5圖係說明第1圖印刷電路板製造方法之工程剖面圖。 Fig. 2 to Fig. 5 are sectional views showing the construction of the printed circuit board manufacturing method of Fig. 1.
首先，如第2圖所示，準備具有接墊120之基礎基板110。 First, as shown in FIG. 2, the base substrate 110 having the pads 120 is prepared.
在本圖式中，雖為方便說明，圖示時省略基礎基板110之具體內層電路構造，但若是該業者，應能充分了解，只要是於絕緣層形成複數層電路之一般電路板，皆適合用作基礎基板110。 In the present embodiment, for the sake of convenience of explanation, the specific inner layer circuit structure of the base substrate 110 is omitted in the illustration. However, if it is the manufacturer, it should be fully understood that as long as it is a general circuit board in which a plurality of layers of circuits are formed in an insulating layer, It is suitable for use as the base substrate 110.
絕緣層可使用樹脂絕緣層。樹脂絕緣層，可使用類似 環氧樹脂之熱硬化樹脂、類似聚亞醯胺之熱塑性樹脂、或於上述樹脂含浸玻璃纖維或無機填料類補強材料之樹脂，例如可使用預浸料胚，另外，可使用光硬化性樹脂等，但在此並不限定使用。 A resin insulating layer can be used for the insulating layer. Resin insulation, can be used similarly A thermosetting resin of an epoxy resin, a thermoplastic resin similar to polyamidamine, or a resin impregnated with the glass fiber or an inorganic filler-based reinforcing material, for example, a prepreg may be used, and a photocurable resin or the like may be used. However, it is not limited to use here.
其次，如第2圖所示，接墊120上可形成具有第一開口部之阻焊層130。 Next, as shown in FIG. 2, a solder resist layer 130 having a first opening portion may be formed on the pad 120.
阻焊層130具有保護最外層電路之保護層功能，形成電氣絕緣。在阻焊層中形成開口部，以露出最外層之接墊120。阻焊層130，如該業界之眾所周知，可以由例如防焊油墨、防焊膜或膠囊化劑等構成，但並不限於此。 The solder resist layer 130 has a protective layer function for protecting the outermost circuit to form electrical insulation. An opening is formed in the solder resist layer to expose the outermost pad 120. The solder resist layer 130, as is well known in the art, may be composed of, for example, a solder resist ink, a solder resist film, or an encapsulant, but is not limited thereto.
其次，如第2圖所示，阻焊層130上可形成錫球形成用阻焊層140，錫球形成用阻焊層140於對應於第一開口部之區域具有第二開口部。 Next, as shown in FIG. 2, a solder ball forming solder resist layer 140 is formed on the solder resist layer 130, and the solder ball forming solder resist layer 140 has a second opening portion in a region corresponding to the first opening portion.
其次，如第3圖至第5圖所示，第一開口部及第二開口部141中可形成錫球160。 Next, as shown in FIGS. 3 to 5, the tin balls 160 can be formed in the first opening portion and the second opening portion 141.
錫球160可呈雪人狀。 The solder ball 160 can be snowman shaped.
更進一步詳細說明，在形成錫球160之步驟，如第3圖所示，可包含於第一開口部形成助焊層150之步驟。 More specifically, in the step of forming the solder ball 160, as shown in FIG. 3, the step of forming the solder layer 150 in the first opening portion may be included.
其次，如第3圖所示，可於第一開口部及第二開口部141安裝圓形之錫球160。 Next, as shown in FIG. 3, a circular tin ball 160 can be attached to the first opening and the second opening 141.
其次，如第4圖所示，可透過加熱工程，將圓形之錫球160形成雪人狀之錫球160。 Next, as shown in Fig. 4, the circular tin ball 160 can be formed into a snowball-shaped solder ball 160 by a heating process.
此時，錫球160以接墊面為基準，分為第一層和第二層，第一層和第二層之直徑A、B可彼此相異，但並不限於此。 At this time, the solder ball 160 is divided into a first layer and a second layer based on the pad surface, and the diameters A and B of the first layer and the second layer may be different from each other, but are not limited thereto.
例如，錫球160之第一層和第二層之直徑，亦可相同。 For example, the diameters of the first layer and the second layer of the solder balls 160 may be the same.
其次，如第5圖所示，可去除錫球形成用阻焊層140。 Next, as shown in Fig. 5, the solder ball formation solder resist layer 140 can be removed.
此時，錫球形成用阻焊層140可由乾膜構成。 At this time, the solder ball formation soldering layer 140 may be composed of a dry film.
另外，錫球形成用阻焊層140亦可使用氫氧化鈉(NaOH)或氫氧化鉀(KOH)等剝離液去除。 Further, the solder ball forming solder resist layer 140 may be removed using a stripping solution such as sodium hydroxide (NaOH) or potassium hydroxide (KOH).
另一方面，印刷電路板分為中央部和端部，中央部和端部分別組裝半導體元件時，錫球可形成於中央部或端部。 On the other hand, the printed circuit board is divided into a central portion and an end portion, and when the central portion and the end portion are respectively assembled with the semiconductor element, the solder ball can be formed at the central portion or the end portion.
此時，形成於端部之錫球，其材質之熔點，可比形成於中央部之錫球之材質高。 At this time, the solder ball formed at the end portion may have a higher melting point than the material of the solder ball formed at the center portion.
如上所述之分為中央部和端部之印刷電路板可為半導體封裝多層所構成之構造，例如中央部組裝半導體元件，端部組裝半導體元件封裝。 The printed circuit board divided into the central portion and the end portion as described above may be a structure in which a plurality of semiconductor packages are formed, for example, a central portion is assembled with a semiconductor element, and an end portion is assembled with a semiconductor element package.
本發明實施例之錫球160，可透過調整錫球形成用阻焊層140開口之尺寸及高度，而實現各種型態。藉此，可期待獲得提高印刷電路板之設計自由度之效果。 The solder ball 160 of the embodiment of the present invention can realize various types by adjusting the size and height of the opening of the solder ball forming solder resist layer 140. Thereby, it is expected to obtain an effect of improving the degree of freedom in designing a printed circuit board.
因此，本發明實施例之優點，乃是與以往依設備之工程能力來決定錫球型態相較之下，可藉由工程能力、錫裂信賴度限制等評價，設定錫球形成用阻焊層之尺寸、助焊層塗布厚度等最適化之詳細條件，而形成錫球。 Therefore, the advantage of the embodiment of the present invention is that the solder ball formation resistance soldering can be set by evaluating the solder ball type according to the engineering capability of the device. Tin balls are formed by optimizing the conditions of the size of the layer, the thickness of the coating layer, and the like.
以上為根據本發明具體實施例之詳細說明，但僅用來具體說明本發明，本發明並不限於上述內容，若為具有本領域之一般知識者，可於本發明之技術思想範疇內加以變更或改良，此自不待言。 The above is a detailed description of the specific embodiments of the present invention, but is only intended to specifically illustrate the present invention, and the present invention is not limited to the above, and may be modified within the scope of the technical idea of the present invention if it has a general knowledge in the art. Or improvement, this is self-evident.
本發明之單純變形乃至於變更，皆屬於本發明之領域，透過所附之申請專利範圍，可更加明確闡釋本發明之 具體保護範圍。 </ RTI> </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; Specific protection scope.
本發明實施例之印刷電路板及其製造方法，乃是可望透過改善錫球之構造，而達成高腳距密集、以及使所形成錫球之高度較以往高之效果。 The printed circuit board and the method of manufacturing the same according to the embodiment of the present invention are expected to have an effect of improving the structure of the solder ball to achieve high pitch and high height of the formed solder ball.
另外，本發明之實施例，乃是可透過錫球形成用阻焊層之尺寸，形成各種高度及腳距之錫球，因此具有可提高印刷電路板之設計自由度之優點。 Further, the embodiment of the present invention has the advantages of being able to increase the degree of freedom in design of the printed circuit board by forming the size of the solder resist layer for solder ball formation and forming solder balls of various heights and pitches.
以上為根據本發明之具體實施例之詳細說明，但僅用來具體說明本發明，本發明並不限於上述內容，若為具有本領域之一般知識者，可於本發明之技術思想範疇內加以變更或改良，此自不待言。 The above is a detailed description of the specific embodiments of the present invention, but is only intended to specifically illustrate the present invention, and the present invention is not limited to the above, and if it has a general knowledge in the art, it can be included in the technical idea of the present invention. Change or improvement, this is self-evident.
本發明之單純變形乃至於變更，皆屬於本發明之領域，透過所附之申請專利範圍，可更加明確闡釋本發明之具體保護範圍。 The specific scope of the present invention can be more clearly understood from the scope of the appended claims.
100‧‧‧印刷電路板 100‧‧‧Printed circuit board
110‧‧‧基礎基板 110‧‧‧Basic substrate
120‧‧‧接墊 120‧‧‧ pads
130‧‧‧阻焊層 130‧‧‧solder layer
140‧‧‧錫球形成用阻焊層 140‧‧‧ Solder ball formation solder mask
150‧‧‧助焊層 150‧‧‧welding layer
160‧‧‧錫球 160‧‧‧ solder balls
A、B‧‧‧直徑 A, B‧‧‧ diameter
第1圖係表示本發明一實施例之印刷電路板構造之剖面圖。 Fig. 1 is a cross-sectional view showing the structure of a printed circuit board according to an embodiment of the present invention.
第2圖係說明第1圖印刷電路板製造方法之工程剖面圖。 Fig. 2 is a cross-sectional view showing the construction of the printed circuit board of Fig. 1.
第3圖係說明第1圖印刷電路板製造方法之工程剖面圖。 Fig. 3 is a sectional view showing the construction of the printed circuit board of Fig. 1;
第4圖係說明第1圖印刷電路板製造方法之工程剖面圖。 Fig. 4 is a cross-sectional view showing the construction of the printed circuit board of Fig. 1.
第5圖係說明第1圖印刷電路板製造方法之工程剖面 圖。 Figure 5 is a cross-sectional view showing the engineering profile of the printed circuit board manufacturing method of Figure 1. Figure.
100‧‧‧印刷電路板 100‧‧‧Printed circuit board
110‧‧‧基礎基板 110‧‧‧Basic substrate
120‧‧‧接墊 120‧‧‧ pads
130‧‧‧阻焊層 130‧‧‧solder layer
160‧‧‧錫球 160‧‧‧ solder balls
A、B‧‧‧直徑 A, B‧‧‧ diameter
Claims (10)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020110103761A KR101516045B1 (en) | 2011-10-11 | 2011-10-11 | Printed circuit board and method of manufacturing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201320837A true TW201320837A (en) | 2013-05-16 |
| TWI522018B TWI522018B (en) | 2016-02-11 |
Family
ID=48439482
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101130691A TWI522018B (en) | 2011-10-11 | 2012-08-23 | Print circuit board and manufacturing method thereof |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5934057B2 (en) |
| KR (1) | KR101516045B1 (en) |
| TW (1) | TWI522018B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9543263B2 (en) | 2013-11-12 | 2017-01-10 | Taiwan Semiconductor Manufacturing Company Ltd. | Semiconductor packaging and manufacturing method thereof |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002076055A (en) * | 2000-08-22 | 2002-03-15 | Hitachi Ltd | Packaging method and packaging structure of semiconductor device |
| JP4454454B2 (en) * | 2004-06-29 | 2010-04-21 | 京セラ株式会社 | Semiconductor element and semiconductor element mounting board on which the semiconductor element is mounted |
| JP2007214332A (en) * | 2006-02-09 | 2007-08-23 | Matsushita Electric Ind Co Ltd | Semiconductor packaging module and manufacturing method thereof |
| KR101022878B1 (en) * | 2008-08-13 | 2011-03-16 | 삼성전기주식회사 | Substrate comprising a solder bump and method of manufacturing the same |
-
2011
- 2011-10-11 KR KR1020110103761A patent/KR101516045B1/en active IP Right Grant
-
2012
- 2012-08-22 JP JP2012183257A patent/JP5934057B2/en active Active
- 2012-08-23 TW TW101130691A patent/TWI522018B/en active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9543263B2 (en) | 2013-11-12 | 2017-01-10 | Taiwan Semiconductor Manufacturing Company Ltd. | Semiconductor packaging and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20130039235A (en) | 2013-04-19 |
| TWI522018B (en) | 2016-02-11 |
| KR101516045B1 (en) | 2015-04-30 |
| JP5934057B2 (en) | 2016-06-15 |
| JP2013084917A (en) | 2013-05-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10008477B2 (en) | Microelectronic element with bond elements to encapsulation surface | |
| TWI417972B (en) | Manufacturing method of stackable semiconductor device packages | |
| TWI355034B (en) | Wafer level package structure and fabrication meth | |
| KR101605600B1 (en) | Manufacturing method of semiconductor device and semiconductor device thereof | |
| US20140367850A1 (en) | Stacked package and method of fabricating the same | |
| US20070222072A1 (en) | Chip package and fabricating method thereof | |
| US10950464B2 (en) | Electronic device module and manufacturing method thereof | |
| JP5290215B2 (en) | Semiconductor device, semiconductor package, interposer, and manufacturing method of interposer | |
| TWI459517B (en) | Package substrate, semiconductor package and method of forming same | |
| TWI646639B (en) | Semiconductor package | |
| TW201316462A (en) | Package structure and fabrication method thereof | |
| KR102050011B1 (en) | Interconnect structure for semiconductor package and method of fabricating the interconnect structure | |
| TWI522018B (en) | Print circuit board and manufacturing method thereof | |
| KR20130116643A (en) | Substrate, semiconductor chip, and semiconductor package having bump, and methods of fabricating the same | |
| KR101099583B1 (en) | Wafer level package having chip stack structure and method for manufacturing the same | |
| TW201507097A (en) | Semiconductor chip and semiconductor device including semiconductor chip | |
| TWI595616B (en) | Chip package and method for forming the same | |
| TWI503941B (en) | Chip package substrate and method for manufacturing same | |
| TWI628756B (en) | Package structure and its fabrication method | |
| JP2010153491A5 (en) | Electronic device, manufacturing method thereof, and semiconductor device | |
| TW201526188A (en) | Semiconductor package | |
| US9368442B1 (en) | Method for manufacturing an interposer, interposer and chip package structure | |
| TWI815356B (en) | Three-dimensional pad structure, interconnection structure and semiconductor package | |
| KR102382076B1 (en) | Semiconductor package | |
| US9401345B2 (en) | Semiconductor device package with organic interposer |