TW201319503A - 熱管組合 - Google Patents

熱管組合 Download PDF

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Publication number
TW201319503A
TW201319503A TW100141333A TW100141333A TW201319503A TW 201319503 A TW201319503 A TW 201319503A TW 100141333 A TW100141333 A TW 100141333A TW 100141333 A TW100141333 A TW 100141333A TW 201319503 A TW201319503 A TW 201319503A
Authority
TW
Taiwan
Prior art keywords
heat
heat pipe
conducting block
pipe
pipe assembly
Prior art date
Application number
TW100141333A
Other languages
English (en)
Inventor
Yao-Ting Chang
Original Assignee
Hon Hai Prec Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hon Hai Prec Ind Co Ltd filed Critical Hon Hai Prec Ind Co Ltd
Priority to TW100141333A priority Critical patent/TW201319503A/zh
Priority to US13/314,196 priority patent/US20130118718A1/en
Publication of TW201319503A publication Critical patent/TW201319503A/zh

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一種熱管組合,用於將一發熱元件的熱量傳導至一散熱器,該熱管組合包括一第一熱管、一第二熱管及一導熱塊,該第一熱管的第一端連接於該發熱元件,該第一熱管的第二端連接於該導熱塊,該第二熱管的第一端連接於該散熱器,該第二熱管的第二端連接於於該導熱塊。

Description

熱管組合
本發明涉及一種熱管組合。
熱管是一種導熱性能高的被動傳熱元件,被廣泛用於電子產品的散熱。在實際的使用中,經常會遇到冷熱源相隔距離較大的情況,此時,若仍然採用單個熱管的傳熱方法,則必須將熱管的長度加長。熱管過長不僅製造和運輸不便,傳熱效果也會降低。
鑒於以上內容,有必要提供一種製造和運輸方便且傳熱效果好的熱管組合。
一種熱管組合,用於將一發熱元件的熱量傳導至一散熱器,該熱管組合包括一第一熱管、一第二熱管及一導熱塊,該第一熱管的第一端連接於該發熱元件,該第一熱管的第二端連接於該導熱塊,該第二熱管的第一端連接於該散熱器,該第二熱管的第二端連接於於該導熱塊。
相較習知技術,本發明熱管組合利用該導熱塊使第一、第二熱管串聯,從而克服單一熱管長度過長的弊端,從而能降低熱管的製造和運輸成本並保證了傳熱效果。
請參閱圖1,本發明熱管組合用於將一發熱元件100的熱量傳導至一散熱器200。該發熱元件100的頂部設有另一散熱器101。該熱管組合包括一第一熱管10、一第二熱管20及一導熱塊30。
該導熱塊30為銅或銅合金製成,其一側設有卡槽31及32。
該第一熱管10的第一端連接於該發熱元件100。本實施方式中,該第一熱管10的第一端夾置於發熱元件100與該散熱器101之間。該第一熱管10的第二端卡入其中該導熱塊30的卡槽31並焊接固定於該導熱塊30。
該第二熱管20的第一端連接於該散熱器200,該第二熱管20的第二端卡入其中該導熱塊30的卡槽32並焊接固定於該導熱塊30。
使用時,該發熱元件100產生的熱量透過該第一熱管10傳導至該導熱塊30,並透過該導熱塊30傳導至第二熱管20,進而由第二熱管20傳導至該散熱器200。
本發明熱管組合利用該導熱塊30使第一、第二熱管10、20串聯,從而避免在冷、熱源相隔距離較遠的場合使用過長的熱管,從而能降低熱管的製造和運輸成本並保證了傳熱效果。採用焊接連接方式,既可保證連接的可靠性,又能減少導熱塊30與第一、第二熱管10、20的熱阻。
綜上所述,本發明確已符合發明專利之要件,遂依法提出專利申請。惟,以上所述者僅為本發明之較佳實施方式,自不能以此限制本案之申請專利範圍。凡熟悉本案技藝之人士爰依本發明之精神所作之等效修飾或變化,皆應涵蓋於以下申請專利範圍內。
100...發熱元件
101、200...散熱器
10...第一熱管
20...第二熱管
30...導熱塊
31、32...卡槽
圖1為本發明熱管組合的較佳實施方式、一發熱元件及一散熱器的立體組合圖。
100...發熱元件
101、200...散熱器
10...第一熱管
20...第二熱管
30...導熱塊
31、32...卡槽

Claims (5)

  1. 一種熱管組合,用於將一發熱元件的熱量傳導至一散熱器,該熱管組合包括一第一熱管、一第二熱管及一導熱塊,該第一熱管的第一端連接於該發熱元件,該第一熱管的第二端連接於該導熱塊,該第二熱管的第一端連接於該散熱器,該第二熱管的第二端連接於該導熱塊。
  2. 如申請專利範圍第1項所述的熱管組合,其中該導熱塊由銅或銅合金製成。
  3. 如申請專利範圍第1項所述的熱管組合,其中該導熱塊的一側設有兩卡槽,分別卡合第一、第二熱管的第二端。
  4. 如申請專利範圍第1項所述的熱管組合,其中該第一、第二熱管的第二端焊接固定於該導熱塊。
  5. 如申請專利範圍第1項所述的熱管組合,其中該發熱元件的頂部設有另一散熱器,該第一熱管的第一端夾置於該發熱元件與該另一散熱器之間。
TW100141333A 2011-11-11 2011-11-11 熱管組合 TW201319503A (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW100141333A TW201319503A (zh) 2011-11-11 2011-11-11 熱管組合
US13/314,196 US20130118718A1 (en) 2011-11-11 2011-12-08 Heat pipe assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW100141333A TW201319503A (zh) 2011-11-11 2011-11-11 熱管組合

Publications (1)

Publication Number Publication Date
TW201319503A true TW201319503A (zh) 2013-05-16

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TW100141333A TW201319503A (zh) 2011-11-11 2011-11-11 熱管組合

Country Status (2)

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US (1) US20130118718A1 (zh)
TW (1) TW201319503A (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014106051A1 (en) * 2012-12-30 2014-07-03 General Electric Company Heat sink apparatus and method for power semiconductor device module
US11925003B2 (en) * 2022-01-14 2024-03-05 Dell Products L.P. Heating or cooling apparatus-integrated heat sink for a computing device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5822187A (en) * 1996-10-25 1998-10-13 Thermal Corp. Heat pipes inserted into first and second parallel holes in a block for transferring heat between hinged devices

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