TW201316571A - High heat dissipation aluminum substrate - Google Patents

Abstract

The present invention relates to a high heat dissipating aluminum substrate, comprising a substrate, at least an LED and a plurality of heat dissipation holes, wherein the substrate is made of aluminum thin plate body, and the heat dissipation holes are disposed on the substrate; the LED is disposed on the aluminum substrate surface, and the LED is partially cover the heat dissipation holes; as such, heat can be conducted from the LED to the substrate, and the heat dissipation holes provide fast heat dissipation efficiency.

Description

High heat dissipation aluminum substrate

The invention relates to a high heat dissipation aluminum substrate, in particular to a design which can effectively assist the heat dissipation of the light emitting diode.

The light-emitting diode has energy saving, high energy conversion rate (converted from light energy into light energy), long life cycle and no mercury component. It has been widely used in daily life due to environmental benefits, such as street lighting and home lighting. , advertising billboards and backlight modules, etc., however, the conversion power of the LED is only about 15~20% of the electrical energy is converted into light, and nearly 80-85% of the electrical energy is converted into thermal energy. If too much thermal energy is accumulated around the light-emitting diode, The light-emitting diode under high temperature affects its luminous efficiency, life cycle and stability. With the continuous improvement of the material of the light-emitting diode wafer, the brightness and power of the light-emitting diode are improved. The thermal energy conversion rate increases, and the higher the temperature accumulated in the light-emitting diode, the selection of the substrate material affects the heat dissipation efficiency of the light-emitting diode, and the substrate that needs high heat dissipation is required to lower the temperature of the light-emitting diode interface. .

Each material has different thermal conductivity. It is arranged in silver, copper, aluminum and steel according to the thermal conductivity. Silver is extremely expensive and is not suitable for heat dissipation media. Currently, copper, aluminum alloy and ceramic substrates are used on the market, and each has its own use. Advantages and disadvantages, copper is expensive, processing is difficult, weight is too large, heat capacity is small and easy to oxidize, and ceramic substrate has low price, high thermal conductivity, high chemical stability, but its material hardness is strong and brittle, so it is processed and assembled. Difficulty, such as drilling, lock snails, and pure aluminum is too soft to be used directly, aluminum alloy can provide sufficient hardness, aluminum alloy is cheap and light weight but its thermal conductivity is worse than copper.

In addition, in addition to good thermal conductivity materials, heat dissipation must also take into account the surface area and aerodynamics of the heat dissipating material. The heat dissipation method can be divided into three methods: conduction, convection, and radiation. The conduction is conducted by the contact of the material material with the air to achieve the cooling effect. Convection uses the flow of gas to achieve the effect of cooling, while radiation radiates heat through electromagnetic waves.

In view of the above, the inventors of the present invention have invented a "high-heat-dissipating aluminum substrate" in order to improve the heat-dissipating effect of the light-emitting diode, and have finally developed a "high-heat-dissipating aluminum substrate", which provides an improved aluminum substrate and is good at applying various heat conduction modes, and is effective. The thermal energy converted by the light-emitting diode is eliminated, and the temperature of the light-emitting diode is lowered, so that the light-emitting diode can exert its optimum effect.

The main object of the present invention is to provide a high heat dissipation aluminum substrate which provides high heat dissipation effect, so that the light emitting diode can be quickly dissipated to maintain its utility.

In order to achieve the above object and effect, the high heat dissipation aluminum substrate of the present invention comprises a substrate, at least one light emitting diode and a plurality of heat dissipation holes, wherein the substrate is a thin plate made of aluminum, and the substrate is disposed on the substrate. The radiant hole; the illuminating diode system is disposed on the surface of the aluminum substrate, and the illuminating diode system partially covers the radiant hole; thus, the illuminating diode is thermally conductive to the substrate, and the radiant hole provides rapid heat dissipation.

The heat dissipation hole of the present invention is filled with a heat conductive material.

The heat conductive material of the present invention is nano carbon.

The heat conductive material of the present invention is a heat conductive adhesive.

The heat conductive material of the present invention is a heat conductive paste.

In order to achieve the above object and effect, the high heat dissipation aluminum substrate of the present invention comprises a substrate, at least one light emitting diode, a plurality of grooves and a heat conductive material, wherein the substrate is a thin plate made of aluminum, and the substrate is on one side. The heat dissipating portion is provided with the heat dissipating portion, and the heat dissipating material covers the heat dissipating portion and fills the groove. The heat conducting material of the present invention is a thermal conductive adhesive.

The heat conductive material of the present invention is a heat conductive paste.

In this way, the light-emitting diode is thermally conductive to the substrate and provides rapid heat dissipation through the heat conductive material.

Therefore, the present invention can be said to be a practical and progressive invention, which is quite worthy of promotion by the industry and is publicized to the public.

The present invention relates to a high heat dissipation aluminum substrate, as shown in the first, second and third figures, which is a main embodiment of the present invention, comprising a substrate 1, a plurality of heat dissipation holes 10 and at least one light emitting diode 2, The substrate 1 is a thin plate made of aluminum, and the heat dissipation hole 10 is disposed on the substrate 1 , and the light emitting diode 2 is disposed on the surface of the substrate 1 , and the light emitting diode 2 is partially covered. In the heat dissipation hole 10, the substrate 1 is characterized in that the aluminum alloy has a large heat transfer coefficient, high mechanical strength, and excellent processing performance. In the embodiment, the energized light-emitting diode 2 converts electrical energy into heat energy and light energy. Most of the electrical energy is converted into thermal energy, so the light-emitting diode 2 gradually accumulates its temperature after being energized. When the interface temperature is raised from 25 ° C to 100 ° C, the luminous efficiency will decline by 20% to 75%. The diode 2 can be cooled by two ways to achieve the effect of cooling, one is convection state of air, and the high temperature flows to low temperature, so the temperature of the light-emitting diode 2 is high temperature, and the heat flow is lower than the temperature thereof. The air, another way is Conducting, the light-emitting diode 2 conducts thermal energy to the substrate 1 in contact therewith, and the light-emitting diode 2 conducts its high temperature to the substrate 1 having a lower temperature, and has achieved the effect of cooling, the substrate 1 is provided with a heat dissipation hole 10, The area of the substrate 1 in contact with the air is increased, so that the substrate 1 can be thermally convected via the heat dissipation hole 10, so that the substrate 1 is in a balanced heat dissipation state, and the heat dissipation effect of the substrate 1 is accelerated, so that the substrate 1 maintains the temperature relative to the light emitting diode. 2 low, the heat dissipation effect is better; please refer to the fourth and fifth figures, the embodiment includes a substrate 1, a plurality of heat dissipation holes 10, at least one light emitting diode 2 and a heat conductive material 3, wherein the heat dissipation holes 10 is filled with a heat conductive material 3, which may be a thermal conductive paste, a thermal conductive paste or a nano carbon (in this embodiment, a thermal conductive adhesive or a nano carbon), and the thermal conductive adhesive and the thermal conductive paste generally have a thermal conductivity of 0.5 W/mK. ~1.5W/mK, its interface materials are various, the heat transfer coefficient can be from 0.5W/mK~20W/mk, and it is a low thermal resistance conductive insulation material, while nano carbon has high thermal conductivity, which converts thermal energy into light energy. , radiating heat by infrared radiation , Due to the size of the surface area in contact with the heat source and the air interface affect the thermal resistance mused ..., and disposed above said fill material on the substrate cooling holes 110, effectively improve the heat dissipation effect of the substrate.

Please refer to the sixth to the ninth drawings, which includes a substrate 1, at least one light emitting diode 2, a plurality of recesses 110 and a heat conductive material 3. The substrate 1 is a thin plate made of aluminum, and the substrate 1 is A heat dissipating portion 11 is disposed on one side, and the light emitting diode 2 is disposed on the other side, and the heat dissipating portion 11 is formed in the recess 110, and the heat conductive material 3 covers the heat dissipating portion 11 and fills the recess 110. The heat conductive material 3 The heat dissipating paste or the heat dissipating glue (in the embodiment, the heat dissipating material 3 is a heat dissipating glue), and the heat energy accumulated by the light emitting diode 2 is transmitted to the substrate 1 , and the groove 110 is provided to promote the rapid thermal energy and the heat conducting material 3 The contact, the heat conductive material 3 covering the heat dissipating portion 11 increases the area of the heat conductive material 3 in contact with the air, so that the heat energy can be accelerated by the groove 110 and the thermal conductive glue, and the light emitting diode 2 can be maintained at a moderate temperature. Its maximum performance.

In this way, the recess 110 and the heat conductive material 3 disposed on the substrate 1 enable the thermal energy to quickly convect, heat and radiate, and integrate three heat conduction modes to achieve an optimal heat dissipation effect to maintain the stability of the LED 2 . Sex.

The above description is only intended to explain the preferred embodiments of the present invention, and is not intended to limit the invention in any way. The changer should still be included in the scope of the intention of the present invention.

In summary, the "high heat dissipation aluminum substrate" of the present invention is completely in line with the needs of industrial development in terms of structural design, practical use and cost effectiveness, and the disclosed structural creation is also an unprecedented innovative structure, so Its "novelty" should be undoubtedly considered, and the invention is more effective than the conventional structure, and therefore has "progressiveness", which fully complies with the requirements of the application requirements of the invention patents of the Chinese Patent Law, and is patented according to law. Apply and ask the bureau for an early review and give it affirmation.

1. . . Substrate

10. . . Vents

11. . . Heat sink

110. . . Groove

2. . . Light-emitting diode

3. . . Thermal material

The first figure is a perspective view of a substrate of a first embodiment of the present invention.

The second drawing is a perspective view of a first embodiment of the present invention.

The third drawing is a cross-sectional view of the first embodiment A-A of the present invention.

The fourth figure is a perspective view of a second embodiment of the present invention.

Figure 5 is a cross-sectional view showing a second embodiment A-A of the present invention.

Figure 6 is a perspective view of a substrate of a third embodiment of the present invention.

Figure 7 is a cross-sectional view of a substrate A-A of a third embodiment of the present invention.

The eighth figure is a perspective view of a third embodiment of the present invention.

The ninth drawing is a cross-sectional view of a third embodiment A-A of the present invention.

1. . . Substrate

10. . . Vents

2. . . Light-emitting diode

Claims (8)

A high heat dissipation aluminum substrate includes a substrate, at least one light emitting diode, and a plurality of heat dissipation holes, wherein: the substrate is a thin plate body made of aluminum, and the heat dissipation hole is disposed on the substrate; the light emitting diode The system is disposed on the surface of the substrate of the aluminum material, and the light emitting diode system partially covers the heat dissipation hole; thus, the light emitting diode is thermally conductive to the substrate, and the heat dissipation hole provides the function of rapid heat dissipation. According to the high heat dissipation aluminum substrate of claim 1, the heat dissipation hole is filled with a heat conductive material. According to the high heat dissipation aluminum substrate described in claim 2, the heat conductive material is nano carbon. According to the high heat dissipation aluminum substrate described in claim 2, the heat conductive material is a heat conductive adhesive. According to the high heat dissipation aluminum substrate described in claim 2, the heat conductive material is a heat conductive paste. A high heat dissipation aluminum substrate comprises a substrate, at least one light emitting diode, a plurality of grooves and a heat conductive material, wherein the substrate is a thin plate body made of aluminum, and the substrate is provided with a heat dissipating portion on one side and the other side The light-emitting diode is disposed; the heat-dissipating portion defines the groove, and the heat-conducting material covers the heat-dissipating portion and fills the groove; thus, the light-emitting diode is thermally conductive to the substrate, and provides rapid heat dissipation through the heat-conducting material. efficacy. According to the high heat dissipation aluminum substrate described in claim 6 of the patent application, the heat conductive material is a heat conductive adhesive. According to the high heat dissipation aluminum substrate described in claim 6 of the patent application, the heat conductive material is a thermal conductive paste.