CN105065958B - Fluorescent tube - Google Patents
Fluorescent tube Download PDFInfo
- Publication number
- CN105065958B CN105065958B CN201510466388.9A CN201510466388A CN105065958B CN 105065958 B CN105065958 B CN 105065958B CN 201510466388 A CN201510466388 A CN 201510466388A CN 105065958 B CN105065958 B CN 105065958B
- Authority
- CN
- China
- Prior art keywords
- heat
- fluorescent tube
- light sources
- mounting plate
- cover body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000017525 heat dissipation Effects 0.000 claims abstract description 60
- 238000009423 ventilation Methods 0.000 claims abstract description 33
- 238000005452 bending Methods 0.000 claims abstract description 9
- 210000000515 Tooth Anatomy 0.000 claims description 9
- 239000007788 liquid Substances 0.000 claims description 8
- 239000011521 glass Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- 239000012530 fluid Substances 0.000 claims description 3
- 239000011159 matrix material Substances 0.000 claims description 2
- 238000002156 mixing Methods 0.000 claims description 2
- 230000005540 biological transmission Effects 0.000 claims 1
- 239000010949 copper Substances 0.000 description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 15
- 229910052802 copper Inorganic materials 0.000 description 15
- 239000000956 alloy Substances 0.000 description 10
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 10
- 229910045601 alloy Inorganic materials 0.000 description 9
- REDXJYDRNCIFBQ-UHFFFAOYSA-N aluminium(3+) Chemical class [Al+3] REDXJYDRNCIFBQ-UHFFFAOYSA-N 0.000 description 9
- 239000002131 composite material Substances 0.000 description 9
- FYYHWMGAXLPEAU-UHFFFAOYSA-N magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 9
- 229910052749 magnesium Inorganic materials 0.000 description 9
- 239000011777 magnesium Substances 0.000 description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 9
- 229910052710 silicon Inorganic materials 0.000 description 9
- 239000010703 silicon Substances 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 239000010936 titanium Substances 0.000 description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 7
- RTAQQCXQSZGOHL-UHFFFAOYSA-N titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 7
- 229910052719 titanium Inorganic materials 0.000 description 7
- 229910052720 vanadium Inorganic materials 0.000 description 7
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium(0) Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 7
- 239000004411 aluminium Substances 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminum Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 229910052804 chromium Inorganic materials 0.000 description 6
- 239000011651 chromium Substances 0.000 description 6
- VYZAMTAEIAYCRO-UHFFFAOYSA-N chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 6
- 229910021389 graphene Inorganic materials 0.000 description 6
- PWHULOQIROXLJO-UHFFFAOYSA-N manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 6
- 239000011572 manganese Substances 0.000 description 6
- 229910052748 manganese Inorganic materials 0.000 description 6
- 239000003921 oil Substances 0.000 description 6
- 238000010521 absorption reaction Methods 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 229910052742 iron Inorganic materials 0.000 description 5
- 238000001816 cooling Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 4
- 229910052732 germanium Inorganic materials 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000010955 niobium Substances 0.000 description 4
- 239000002019 doping agent Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 3
- 229910052758 niobium Inorganic materials 0.000 description 3
- 239000005439 thermosphere Substances 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- 241001465382 Physalis alkekengi Species 0.000 description 2
- 238000007792 addition Methods 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 235000013339 cereals Nutrition 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 241000406668 Loxodonta cyclotis Species 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- BBEAQIROQSPTKN-UHFFFAOYSA-N Pyrene Chemical compound C1=CC=C2C=CC3=CC=CC4=CC=C1C2=C43 BBEAQIROQSPTKN-UHFFFAOYSA-N 0.000 description 1
- YYMBJDOZVAITBP-UHFFFAOYSA-N Rubrene Chemical compound C1=CC=CC=C1C(C1=C(C=2C=CC=CC=2)C2=CC=CC=C2C(C=2C=CC=CC=2)=C11)=C(C=CC=C2)C2=C1C1=CC=CC=C1 YYMBJDOZVAITBP-UHFFFAOYSA-N 0.000 description 1
- GPPXJZIENCGNKB-UHFFFAOYSA-N [V]#[V] Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000003026 anti-oxygenic Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000295 complement Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000000875 corresponding Effects 0.000 description 1
- 230000003247 decreasing Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000002708 enhancing Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000002349 favourable Effects 0.000 description 1
- 238000005755 formation reaction Methods 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000002045 lasting Effects 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- YMWUJEATGCHHMB-UHFFFAOYSA-N methylene dichloride Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006011 modification reaction Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000001737 promoting Effects 0.000 description 1
- 230000027756 respiratory electron transport chain Effects 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- DIMMBYOINZRKMD-UHFFFAOYSA-N vanadium(5+) Chemical compound [V+5] DIMMBYOINZRKMD-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
Abstract
A kind of fluorescent tube, including：Diffuser, diffuser are arcuate structure, and the end of diffuser extends and is bent to form sliding part；Heat dissipating housing, heat dissipating housing include mounting plate and cover body, and cover body is arcuate structure, the both ends of cover body are connect with the two sides of mounting plate respectively, the side edge of mounting plate extends and is bent to form bending part, and the end of bending part and cover body surrounds sliding groove, and sliding part is slideably positioned in sliding groove；Lamp cap；Lamp plate, lamp plate fit in one side of the mounting plate far from cover body, and lamp plate is equipped with ventilation hole, and one end of ventilation hole is connected to the inner space of diffuser, and the other end of ventilation hole is connected to mounting plate；And multiple LED sub-light sources, multiple LED sub-light sources are arranged at intervals at one side of the lamp plate far from mounting plate successively.Above-mentioned fluorescent tube is installed on lamp plate, heat dissipating housing and lamp plate collaboration heat dissipation by the way that the heat dissipating housing and lamp plate that mutually support is arranged, and by LED sub-light sources, can greatly improve LED lamp tube heat dissipation performance.
Description
Technical field
The present invention relates to lighting technical fields, more particularly to a kind of fluorescent tube.
Background technology
LED (Light Emitting Diode, light emitting diode) can directly and efficiently convert electrical energy into visible light, and
And possess the service life up to tens thousand of hours~100,000 hour.LED is used to be known as LED lamp for the lamps and lanterns of light source, with matter
The advantages that excellent, durable, energy saving and be referred to as most common illuminator.As LED light Manifold technology develops rapidly in recent years, LED light
Pipe product replaces original fluorescent tube substantially.
Currently, LED lamp tube itself existing for a drawback be, LED lamp tube light efficiency by the junction temperature of LED lamp tube influenced compared with
Greatly, higher junction temperature of chip will cause light efficiency to be decreased obviously, and influence whether the service life of LED lamp tube.Due to LED light
When luminous, the temperature of its own can be increased constantly, in lasting illumination work, if LED light generate heat cannot and
When exhale, it will the damage for causing LED light influences the service life of LED light.Therefore, the heat dissipation problem pair of LED light is solved
It is most important in the performance for promoting LED light.
For example, the patent that Chinese Patent Application No. is 201220413753.1, discloses a kind of heat radiating LED lamp, it is specific
Open includes lamp cap, heat loss through convection lamp body and the lampshade to match with heat loss through convection lamp body, and LED is equipped in the heat loss through convection lamp body
Lamp plate, the LED lamp panel are equipped with LED light, and the heat loss through convection lamp body is equipped with convection cavity and is communicated with convection cavity
Convection mouth and convective tank.The configuration of the present invention is simple, cost are relatively low, and by the way that heat loss through convection lamp body structure is arranged, heat dissipation performance obtains
It greatly improves.
For example, the patent that Chinese Patent Application No. is 201410360995.2, discloses a kind of fluorescent tube heat dissipation of LED light
Device, specific disclosure includes a tube body and two fans；Support portion, mounting portion and several heat sink strips is arranged in tube body；Mounting portion is set
It is placed in the side of support portion, for external LED light to be fixedly mounted；Each heat sink strip is respectively arranged at the other side of support portion；Branch
Several columns heat emission hole is further opened on support part；The both sides of each row heat emission hole are respectively a heat sink strip；Cavity is set on mounting portion
Portion, heating column and several thermal holes；A fan is fixedly mounted in tube body both ends respectively, for blowing to tube body middle part.Above-mentioned LED
Fan in the lamp tube heat radiator of lamp is to air-supply in the middle part of tube body, and the air-flow of formation blows to LED light, and in cavity portion and heat sink strip
Between gap in flow, to be accumulated in lampshade by the form of convection current, the sky in cavity portion and between heat sink strip
Heat in gap is timely taken away, and avoids heat is a large amount of for a long time from building up, causes the electronic component in LED light to burn out, prolong
Its long service life.
For example, the patent that Chinese Patent Application No. is 201210332183.8, discloses a kind of Efficient LED lamp radiator,
It includes radiator body that it is specific open, and the radiator body is linked into an integrated entity from red copper heating column and Duo Gen and to outgoing
The groups of fins set is spread at red copper heating column is fixed on cooling fin center using hot pressing mode, wherein the surface of cooling fin is
Curved surface is provided with heat dissipation gap between cooling fin.The beneficial effects of the invention are as follows：Using copper post heat conduction, thermal energy export is strengthened
Ability, solve the problems, such as existing thermal chokes, while spreader surface complementary surface designs, increase and air contact surfaces, carry
The high heat dissipation performance of radiator, reduces the light decay of LED, extends the service life of LED, and have simple in structure, user
Just the characteristics of.
However, the fluorescent tube of above-mentioned patent disclosure still remains the poor problem of heat dissipation performance, in particular by relatively high power
LED light as light source when, heating problem is more apparent.
Invention content
Based on this, it is necessary to provide a kind of fluorescent tube of good heat dispersion performance.
A kind of fluorescent tube, including：
Diffuser, the diffuser are arcuate structure, and the end of the diffuser extends and is bent to form sliding part；
Heat dissipating housing, the heat dissipating housing include mounting plate and cover body, and the cover body is arcuate structure, the both ends point of the cover body
It is not connect with the two sides of the mounting plate, the side edge of the mounting plate extends and be bent to form bending part, the bending
Portion and the end of the cover body surround sliding groove, and the sliding part is slideably positioned in the sliding groove；
Lamp cap, the lamp cap are connect with the end of the mounting plate；
Lamp plate, the lamp plate fit in one side of the mounting plate far from the cover body, and the lamp plate is equipped with ventilation hole,
One end of the ventilation hole is connected to the inner space of the diffuser, and the other end of the ventilation hole connects with the mounting plate
It is logical；And
Multiple LED sub-light sources, multiple LED sub-light sources are arranged at intervals at the lamp plate far from the mounting plate successively
One side.
Multiple ventilation holes are set in one of the embodiments,.
Multiple ventilation hole rectangular arrays are distributed in the lamp plate in one of the embodiments,.
The ventilation hole is round cavernous structure in one of the embodiments,.
The aperture of the ventilation hole is 1mm~1.5mm in one of the embodiments,.
The aperture of the ventilation hole is 1.2mm~1.5mm in one of the embodiments,.
The aperture of the ventilation hole is 1.4mm in one of the embodiments,.
LED sub-light sources are installed on lamp plate, heat dissipating housing by above-mentioned fluorescent tube by the way that the heat dissipating housing and lamp plate that mutually support is arranged
It cooperates with and radiates with lamp plate, LED lamp tube heat dissipation performance can be greatlyd improve.
Description of the drawings
Fig. 1 is the structural schematic diagram of the fluorescent tube of an embodiment of the present invention；
Fig. 2 is the structural schematic diagram of another angle of fluorescent tube shown in FIG. 1；
Fig. 3 is the structural schematic diagram of another angle of fluorescent tube shown in FIG. 1；
Fig. 4 is the structural schematic diagram of the fluorescent tube of another embodiment of the present invention；
Fig. 5 is the structural schematic diagram of the fluorescent tube of another embodiment of the present invention；
Fig. 6 is the structural schematic diagram of the fluorescent tube of another embodiment of the present invention；
Fig. 7 is the structural schematic diagram of the fluorescent tube of another embodiment of the present invention；
Fig. 8 is the partial structural diagram of the fluorescent tube of another embodiment of the present invention.
Specific implementation mode
To facilitate the understanding of the present invention, below with reference to relevant drawings to invention is more fully described.In attached drawing
Give the better embodiment of the present invention.But the present invention can realize in many different forms, however it is not limited to herein
Described embodiment.On the contrary, the purpose of providing these embodiments is that making to understand more the disclosure
Add thorough and comprehensive.
It should be noted that when element is referred to as " being fixed on " another element, it can be directly on another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it can be directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
" right side " and similar statement for illustrative purposes only, are not offered as being unique embodiment.
Unless otherwise defined, all of technologies and scientific terms used here by the article and belong to the technical field of the present invention
The normally understood meaning of technical staff is identical.Used term is intended merely to description tool in the description of the invention herein
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term " and or " used herein includes one or more
Any and all combinations of relevant Listed Items.
For example, a kind of fluorescent tube, including：Diffuser, the diffuser are arcuate structure, and the end of the diffuser extends simultaneously
It is bent to form sliding part；Heat dissipating housing, the heat dissipating housing include mounting plate and cover body, and the cover body is arcuate structure, the cover body
Both ends connect respectively with the two sides of the mounting plate, the side edge of the mounting plate extends and is bent to form bending part,
The end of the bending part and the cover body surrounds sliding groove, and the sliding part is slideably positioned in the sliding groove；Lamp cap, institute
Lamp cap is stated to connect with the end of the mounting plate；Lamp plate, the lamp plate fit in side of the mounting plate far from the cover body
Face, the lamp plate are equipped with ventilation hole, and one end of the ventilation hole is connected to the inner space of the diffuser, the ventilation hole
The other end is connected to the mounting plate；And multiple LED sub-light sources, multiple LED sub-light sources are arranged at intervals at the lamp successively
One side of the plate far from the mounting plate.
For a further understanding of above-mentioned fluorescent tube, another example is a kind of fluorescent tube comprising above addresses following any implementation
Fluorescent tube described in example.
Also referring to Fig. 1 and Fig. 3, fluorescent tube 10 includes：Diffuser 100, heat dissipating housing 200, lamp cap 300, lamp plate 400 and more
A LED sub-light sources 500.Diffuser 100 is set to heat dissipating housing 200, and lamp cap 300 is set to the end of heat dissipating housing 200, lamp plate 400
It is set to heat dissipating housing 200, multiple LED sub-light sources 500 are set to lamp plate 400.
Referring to Fig. 3, diffuser 100 is arcuate structure, the end of diffuser 100 extends and is bent to form sliding part 110.
Diffuser 100 is used to play scattering or atomizing to light, so as to so that the light sent out from fluorescent tube 10 is softer, to protect
Human eye health is protected, and then keeps illuminating effect more uniform.
Referring to Fig. 3, heat dissipating housing 200 includes mounting plate 210 and cover body 220, cover body 210 is arcuate structure, cover body 210
Both ends are connect with the two sides of mounting plate 210 respectively, and the side edge of mounting plate 210 extends and be bent to form bending part 211, curved
Folding part 211 and the end of cover body 220 surround sliding groove 212, and sliding part 110 is slideably positioned in sliding groove 212.In this way, only needing
The sliding part 110 of diffuser 100 is slid into sliding groove 212, you can fit together diffuser 100 and heat dissipating housing 200, together
Reason, when needing to dismantle diffuser 100 from heat dissipating housing 200, the sliding part 110 of diffuser 100 is skidded off outside sliding groove 212
, assembly and disassembly operate more simple and convenient.
Also referring to Fig. 2 and Fig. 3, lamp cap 300 is connect with the end of mounting plate 210.For example, the lamp cap is for installing
On external lamp holder；For another example, the lamp cap is provided with contact pin, and the contact pin is used to be electrically connected with external lamp holder, to give
The normal work for stating LED sub-light sources provides power supply.For example, lamp cap 300 and the end lock of mounting plate 210 connect.
Referring to Fig. 3, lamp plate 400 fits in one side of the mounting plate 210 far from cover body 220.For example, the thickness of the lamp plate
Degree is 1.5cm~2cm；For another example, the thickness of the lamp plate is 1.6cm~1.8cm；For another example, the thickness of the lamp plate is 1.7cm.
In this way, the intensity of lamp plate and the weight of lamps and lanterns can be taken into account, LED sub-light sources firmly install.For another example, lamp plate also sets up several ventilative
Hole, for accelerating internal heat dissipating.
Referring to Fig. 3, multiple LED sub-light sources 500 are arranged at intervals at one side of the lamp plate 400 far from mounting plate 210 successively.
For example, the LED sub-light sources are LED chip；For another example, the LED sub-light sources are LED light；For another example, the LED sub-light sources are LED
Shot-light.For example, the fluorescent tube further includes circuit unit, the circuit unit is electrically connected with the LED sub-light sources.For example, each
The LED sub-light sources are in a row or two rows are arranged.For another example, equal with the adjacent LED sub-light source spacing of a line.
It should be noted that the heat generated that shines when LED sub-light sources 500 work can be transferred to lamp plate 400, later,
Mounting plate 210 is transferred to by lamp plate 400 again, finally, then cover body 220 is transferred to by mounting plate 210, in the process of heat transfer
In, lamp plate 400, mounting plate 210 and cover body 220 can into air dielectric dissipated heat.In this way, heat dissipation path can be optimized,
And cooling surface area can be increased.
In order to keep the light that the fluorescent tube is sent out softer, for example, the fluorescent tube further includes multiple OLED sub-light sources, it is more
A OLED sub-light sources are arranged at intervals at one side of the lamp plate far from mounting plate successively, and LED sub-light sources replace with OLED sub-light sources to be set
It sets, in this way, using the compounding effect of OLED sub-light sources and LED sub-light sources, the light that the fluorescent tube is sent out can be made softer,
OLED sub-light sources and LED sub-light sources can also be controlled respectively.
For example, OLED sub-light sources include the anode transparent glass substrate, ITO conductive anodes, the holes NPB for being sequentially overlapped setting
Transport layer, NPB luminescent layers, the Alq for mixing MQA3Electron transfer layer, Al conductive cathodes and cathode transparent glass substrate, wherein OLED
The fluorescence matrix of the luminescent layer of sub-light source is NPB.
The voltage difference for applying 2V~10V between conductive anode and conductive cathode, can make the hole of anode and the electricity of cathode
Son is transferred to EL by hole and electron transfer layer respectively, and hole and electronics generate energy exciton when meeting in luminescent layer, from
And the light emitting molecule in EL is excited to send out green light.Certainly, the luminescent color of each OLED sub-light sources is not limited to green light, that is,
It says, fluorescent dopants are not limited to MQA, can also be adjusted according to actual needs to fluorescent dopants, need to only change luminous
The substance of layer doping.For example, fluorescent dopants further include or mixtures thereof pyrene, rubrene DCM, in this way, OLED sub-light sources
Corresponding luminescent color is blue light, yellow light or orange light.In this way, can make multiple OLED sub-light sources be respectively provided with it is a variety of not
Same luminescent color.For example, the OLED sub-light sources include the OLED sub-light sources of different luminescent color.
In order to improve the uniformity of the OLED light source module light, for example, the OLED sub-light sources are flat with rectangle
The flaky texture in face；For another example, the OLED sub-light sources have the section that rectangle is combined with arch, and the OLED sub-lights
Source has the flaky texture of cambered surface；For another example, multiple OLED sub-light sources are arranged in parallel in the reflectance coating, in this way, can be with
Improve the uniformity of the OLED light source module light.
In order to further increase the heat dissipation performance of the fluorescent tube, for example, referring to Fig. 4, the fluorescent tube further includes heat-dissipating cylinder
Body 600, radiating cylinder body 600 are set to outside cover body 220, the setting of the inner vacuum of radiating cylinder body 600, radiating cylinder body 600 it is interior
Portion is filled with heat dissipating fluid 610, and the radiating cylinder body 600 being arranged by inner vacuum can reinforce the evaporation of heat dissipating fluid 610
And degree of condensation, so as to take away more heats from cover body 220, in this way, the heat dissipation of the fluorescent tube can be further increased
Performance.
In order to further increase the heat dissipation performance of the fluorescent tube, for example, the heat-dissipating cylinder has arcuate cross-section；For another example,
Multiple radiating areas are set inside the heat-dissipating cylinder；For another example, the adjacent radiating area is interconnected, in this way, can further carry
The heat dissipation performance of the high fluorescent tube.
Effective heat dissipation area of the fluorescent tube in order to further increase, so as to improve the heat dissipation performance of the fluorescent tube,
For example, referring to Fig. 5, the fluorescent tube further includes radiating piece 700, radiating piece 700 includes heat-removal bar 710, heat sink 720 and heat dissipation
Tooth 730, the first end of heat-removal bar 710 are set to the outside of the cover body 220, and second end and the heat sink 720 of heat-removal bar 710 connect
It connects, radiation tooth 730 is set to one side of the heat sink 720 far from heat-removal bar 710, in this way, the fluorescent tube can be further increased
Effective heat dissipation area, so as to improve the heat dissipation performance of the fluorescent tube.
Effective heat dissipation area of the fluorescent tube in order to further increase, for example, the multiple radiation tooths of setting；For another example, if
Set three radiation tooths；For another example, three radiation tooths are arranged at intervals at the heat sink far from the heat-removal bar successively
One side；For another example, the heat-removal bar is circular rod-shaped configuration；For another example, the heat-removal bar is hollow-core construction；For another example, it is arranged multiple
The radiating piece；For another example, the distance between two adjacent described radiating pieces are equal, in this way, the lamp can be further increased
Effective heat dissipation area of pipe.
In order to further increase the heat dissipation performance of the fluorescent tube, for example, referring to Fig. 6, mounting plate 210 is far from cover body 220
One side be provided with heat dissipation oil reservoir 211, lamp plate 400 be bonded with heat dissipation oil reservoir 211, can be by by setting heat dissipation oil reservoir 211
Lamp plate 400 is rapidly transferred on mounting plate 210, and then is transmitted to again on cover body 220, in this way, can further increase described
The heat dissipation performance of fluorescent tube.For example, the thickness of the heat dissipation oil reservoir is 0.2cm~0.5cm；For another example, the thickness of the heat dissipation oil reservoir
For 0.3cm~0.4cm；For another example, the thickness of the heat dissipation oil reservoir is 0.35cm.
In order to reinforce air circulation degree, so as to improve the heat dissipation performance of the fluorescent tube, for example, referring to Fig. 7, lamp
Plate 400 is equipped with ventilation hole 410, and one end of ventilation hole 410 is connected to the inner space of diffuser 100, the other end of ventilation hole 410
It is connected to mounting plate 210, in this way, air circulation degree can be reinforced, so as to improve the heat dissipation performance of the fluorescent tube.Example
Such as, the aperture of the ventilation hole is 1mm~1.5mm；For another example, the aperture of the ventilation hole is 1.2mm~1.5mm；For another example, described
The aperture of ventilation hole is 1.4mm.
In order to further strengthen air circulation degree, so as to improve the heat dissipation performance of the fluorescent tube, for example, setting is more
A ventilation hole；For another example, multiple ventilation hole rectangular arrays are distributed in the lamp plate；For another example, the ventilation hole is circle
Shape cavernous structure.
In order to further increase the heat dissipation performance of the fluorescent tube, for example, referring to Fig. 8, the fluorescent tube further includes folds pipe
800, folds pipe 800 is set in lamp plate 400, and folds pipe 800 is hollow mechanism, and heat exchange is filled with inside folds pipe 800
There is inlet 810 and liquid outlet 820, heat exchange liquid to be flowed by inlet 810 for liquid, folds pipe 800, and by liquid outlet
820 outflows, in this way, the heat that lamp plate 400 is absorbed from LED sub-light sources and OLED sub-light sources can be rapidly taken away, so as to
Further increase the heat dissipation performance of the fluorescent tube.For example, the folds pipe is round tubular structure.The folds pipe is fold-line-shaped
Structure；For another example, the folds pipe is helicoidal structure.
LED sub-light sources 500 are installed on lamp by above-mentioned fluorescent tube by the way that the heat dissipating housing 200 mutually supported and lamp plate 400 is arranged
Plate 400, heat dissipating housing 200 and the collaboration heat dissipation of lamp plate 400, can greatly improve the heat dissipation performance of above-mentioned fluorescent tube.
In order to further increase the heat dissipation performance of the fluorescent tube, for example, the heat dissipating housing, the lamp plate, the heat-dissipating cylinder
And the radiating piece is all made of NEW TYPE OF COMPOSITE heat dissipation alloy and is prepared, the NEW TYPE OF COMPOSITE heat dissipation alloy includes being sequentially overlapped to set
Heat-sink shell, heat-conducting layer and the heat dissipating layer set；For another example, the heat-sink shell, the heat-conducting layer it is identical with the material of the heat dissipating layer or
The different setting of person；For another example, the LED sub-light sources and OLED sub-light sources are set to the heat-sink shell；For another example, the heat-sink shell, institute
The heat-conductive characteristic for stating heat-conducting layer and the heat dissipating layer successively decreases successively, forms heat-conductive characteristic gradient, to advanced optimize
The heat dissipation path of the NEW TYPE OF COMPOSITE heat dissipation alloy, greatly improve the heat dissipating housing, the lamp plate, the heat-dissipating cylinder and
The heat dissipation performance of the radiating piece, and then improve the heat dissipation performance of the fluorescent tube so, it is possible to meet big described of calorific value
The radiating requirements of fluorescent tube.
For example, the fluorescent tube of an embodiment of the present invention, wherein the heat-sink shell of the NEW TYPE OF COMPOSITE heat dissipation alloy,
Include each component of following mass parts：
90 parts~92 parts of copper, 2 parts~4.5 parts of aluminium, 1 part~2.5 parts of magnesium, 0.5 part~0.8 part of nickel, 0.1 part~0.3 part of iron,
1.5 parts~4.5 parts of vanadium, 0.1 part~0.4 part of manganese, 0.5 part~0.8 part of titanium, 0.5 part~0.8 part of chromium, 0.5 part~0.8 part of vanadium, silicon
0.8 part~15 parts and 0.5 part~2 parts graphenes.
First, what the copper (Cu) that above-mentioned heat-sink shell contains 90 parts~92 parts can make heat-sink shell has preferable heat absorption energy.
When the mass parts of copper be 90 parts~92 parts when, the coefficient of heat conduction of heat-sink shell can reach 365W/mK or more, can rapidly by
The heat that LED sub-light sources and OLED sub-light sources generate siphons away, and then is dispersed in the structure of heat-sink shell entirety with making even heat,
To prevent heat from being accumulated on the contact position between LED sub-light sources and OLED sub-light sources and heat-sink shell, cause hot-spot existing
The generation of elephant.Moreover, the density of heat-sink shell is less than the density of fine copper, it can effectively mitigate the weight of heat-sink shell in this way, it is more sharp
It is manufactured in installation, while also greatly reducing cost.Wherein, the definition of the coefficient of heat conduction is：Per unit length, per K, can be with
The energy of how many W, unit W/mK are transmitted, wherein " W " refers to thermal power unit, " m " represents length unit rice, and " K " is absolute
Temperature unit, the numerical value is bigger to illustrate that heat absorption capacity is better.In addition, by adding 0.5 part~2 parts of graphene, it can be effective
Ground improves its coefficient of heat conduction, and then improves the heat absorption capacity of the heat-sink shell.
Secondly, heat-sink shell contain mass parts be 2 parts~4.5 parts aluminium, 1 part~2.5 parts of magnesium, 0.5 part~0.8 part of nickel,
0.1 part~0.3 part of iron, 1.5 parts~4.5 parts of vanadium, 0.1 part~0.4 part of manganese, 0.5 part~0.8 part of titanium, 0.5 part~
0.8 part of chromium and 0.5 part~0.8 part of vanadium vanadium.Relative to fine copper material, the ductility of heat-sink shell, toughness, intensity with
And high temperature resistance is improved significantly, and not easy-sintering；In this way, LED sub-light sources and OLED sub-light sources are installed to suction
When on thermosphere, so that it may be damaged, also, had to heat-sink shell with the high temperature for preventing LED sub-light sources and OLED sub-light sources from generating
Preferable ductility, toughness and intensity are also possible to prevent heat-sink shell when installing the LED sub-light sources and OLED sub-light sources
Caused to deform by excessive stresses.Wherein, heat-sink shell contains the nickel (Ni) that mass parts are 0.5 part~0.8 part, can improve suction
The high temperature resistance of thermosphere.For another example, heat-sink shell, which contains the vanadium (V) that mass parts are 1.5 parts~4.5 parts, can inhibit heat-sink shell crystal grain
It grows up, obtains more uniform tiny grain structure, to reduce the brittleness of heat-sink shell, improve the mechanical property of heat-sink shell entirety, with
Improve toughness and intensity.For another example, heat-sink shell contains the titanium (Ti) that mass parts are 0.5 part~0.8 part, can make the crystalline substance of heat-sink shell
Grain miniaturization, to improve the ductility of heat-sink shell.
Finally, heat-sink shell further includes the silicon (Si) that mass parts are 0.8 part~15 parts, when heat-sink shell contains suitable silicon,
The hardness and abrasion resistance of heat-sink shell can be effectively promoted under the premise of not influencing heat-sink shell heat absorption capacity.But through repeatedly managing
It finds by analysis and experiment evidence, when the quality of silicon in heat-sink shell is too many, such as mass percent is more than 15 parts or more, can make
The appearance of heat-sink shell is distributed black particles, and ductility reduces, and is unfavorable for the production molding of heat-sink shell.
For example, the fluorescent tube of an embodiment of the present invention, wherein the heat-conducting layer of the NEW TYPE OF COMPOSITE heat dissipation alloy,
Include each component of following mass parts：
60 parts~65 parts of copper, 55 parts~60 parts of aluminium, 0.8 part~1.2 parts of magnesium, 0.2 part~0.5 part of manganese, titanium 0.05 part~0.3
Part, 0.05 part~0.1 part of chromium, 0.05 part~0.3 part of vanadium, 0.3 part~0.5 part of silicon and 0.1 part~0.3 part of graphene.
First, it is 60 parts~65 parts of copper and 55 parts~60 parts of aluminium that above-mentioned heat-conducting layer, which contains mass parts, can be made
The coefficient of heat conduction of heat-conducting layer is maintained at 320W/mK~345W/mK, described in ensureing that heat-conducting layer can will absorb by heat-sink shell
The heat that LED sub-light sources and OLED sub-light sources generate is quickly transmitted to heat dissipating layer, and then prevents heat from being accumulated on heat-conducting layer,
Hot-spot phenomenon is caused to generate.Compared with the existing technology, merely use price costly and the larger copper of quality, it is above-mentioned to lead
Thermosphere can not only ensure that quickly the heat transfer by heat-sink shell was to heat dissipating layer, but also have lighter weight, be easily installed casting, price
Less expensive advantage.Meanwhile compared with the existing technology, the aluminium alloy for merely using heat dissipation effect poor, above-mentioned heat-conducting layer tool
There is more preferably heat transfer property.
Next can greatly improve the heat conductivility of the heat-conducting layer by 0.1 part~0.3 part of graphene of addition,
Preferably by the heat transfer passed over from heat-sink shell to heat dissipating layer.
Finally, it is 0.8 part~1.2 parts of magnesium, 0.2 part~0.5 part of manganese, 0.05 part~0.3 that heat-conducting layer, which contains mass parts,
The titanium, 0.05 part~0.1 part of chromium, 0.05 part~0.3 part of vanadium and 0.3 part~0.5 part of silicon of part, so as to improve heat-conducting layer
Mechanical performance and high temperature resistance, e.g., mechanical performance includes but is not limited to yield strength, tensile strength.For example, heat-conducting layer
The magnesium for being 0.8 part~1.2 parts containing mass parts, can assign heat-conducting layer yield strength and tensile strength to a certain extent, by
In the fabrication process in NEW TYPE OF COMPOSITE heat dissipation alloy, it needs heat-sink shell, heat-conducting layer and heat dissipating layer entirety punching press being integrally formed,
This just needs heat dissipating layer to have stronger yield strength, to prevent heat dissipating layer from being generated in process by favourable opposition compression
Non-reversible deformation, and then ensure the proper heat reduction performance of NEW TYPE OF COMPOSITE heat dissipation alloy.When the relative mass of magnesium is too low, e.g., matter
When measuring part less than 0.8 part, it cannot substantially ensure that the yield strength of heat-conducting layer is met the requirements, however, the relative mass when magnesium is excessively high
When, such as when mass parts are more than 1.2 parts, and can make the ductility and heat conductivility dramatic decrease of heat-conducting layer.For example, heat conduction
The iron that layer is 0.2 part~0.8 part containing mass parts, can assign the higher high temperature resistance of heat-conducting layer and high temperature resistant mechanicalness
Can, the processing for being conducive to heat-conducting layer is cast.
For example, the fluorescent tube of an embodiment of the present invention, wherein the heat dissipating layer of the NEW TYPE OF COMPOSITE heat dissipation alloy,
Include each component of following mass parts：
88 parts~93 parts of aluminium, 5.5 parts~10.5 parts of silicon, 0.3 part~0.7 part of magnesium, 0.05 part~0.3 part of copper, 0.2 part of iron~
0.8 part, 0.2 part~0.5 part of manganese, 0.05 part~0.3 part of titanium, 0.05 part~0.1 part of chromium, 0.05 part~0.3 part of vanadium and 5 parts~15
Part graphene.
First, above-mentioned heat dissipating layer contains the aluminium that mass parts are 88 parts~93 parts, can make the coefficient of heat conduction of heat dissipating layer
It is maintained at 200W/mK~220W/mK, when the heat that LED sub-light sources and OLED sub-light sources generate passes through heat-sink shell and heat-conducting layer
After part is radiated, when remaining heat passes to heat dissipating layer by heat-conducting layer again, heat dissipating layer may insure these remaining heat
Amount by consistent scatters away, and then prevents heat from being accumulated on heat dissipating layer, causes hot-spot phenomenon.
Next can effectively improve the heat dissipation performance of the heat dissipating layer by 5 parts~15 parts of graphene of addition, into
And it will can be rapidly lost in extraneous air dielectric from the heat that the heat-conducting layer is transmitted to.
Finally, it is 5.5 parts~10.5 parts of silicon, 0.3 part~0.7 part of magnesium, 0.05 part~0.3 that heat dissipating layer, which contains mass parts,
The copper, 0.2 part~0.8 part of iron, 0.2 part~0.5 part of manganese, 0.05 part~0.3 part of titanium, 0.05 part~0.1 part of chromium of part
And 0.05 part~0.3 part of vanadium, the heat dissipation performance of heat dissipating layer can be significantly improved.For example, heat dissipating layer contains mass parts is
5.5 parts~10.5 parts of silicon and 0.05 part~0.3 part of copper, it can be ensured that heat dissipating layer has good mechanical properties and lighter weight
The advantages of, at the same time it can also further improve the heat-conductive characteristic of heat dissipating layer, further ensure that heat dissipating layer can will be via heat absorption
Layer and heat-conducting layer transmit after after-heat consistent scatter away, and then prevent heat from being accumulated on heat dissipating layer, cause office
Portion's superheating phenomenon.
In order to further increase the tensile strength of the heat dissipating layer, for example, it is 0.8 part that the heat dissipating layer, which further includes mass parts,
~1.2 parts of lead (Pb), when the lead that heat dissipating layer contains 0.8 part~1.2 parts can improve the tensile strength of heat dissipating layer, in this way, can
When striking out radiating fin, i.e. laminated structure to prevent that heat dissipating layer ought be cast, due to being pullled stress by excessive punching press
And it is broken.
In order to further increase the high temperature oxidation resistance of the heat dissipating layer, for example, the heat dissipating layer further includes mass parts
It for 0.05 part~0.08 part of niobium (Nb), is found through many experiments evidence and theory analysis, when the mass parts of niobium are more than 0.05 part
When, the antioxygenic property of heat dissipating layer can be greatlyd improve, it will be understood that heat dissipating layer as in LED street lamp radiator with the external world
The maximum component of air contact area, it is more demanding to high temperature oxidation resistance.However, the mass parts when niobium are more than 0.08 part
When, the magnetism of heat dissipating layer can be caused to sharply increase, the other component in fluorescent tube can be had an impact.
In order to further increase the heat dissipation performance of the heat dissipating layer, for example, heat dissipating layer further include mass parts be 0.05 part~
0.2 part of germanium (Ge) can play the raising of the heat dissipation performance of heat dissipating layer unexpected when the mass parts of germanium are more than 0.05 part
Effect and the brittleness of heat dissipating layer can be made to increase however, the quality accounting when germanium is excessive, such as when the mass parts of germanium are more than 0.2 part
Add.
Above-mentioned NEW TYPE OF COMPOSITE heat dissipation alloy is by being sequentially overlapped the setting heat-sink shell, the heat-conducting layer and the heat dissipation
Layer, and the heat-conductive characteristic of the heat-sink shell, the heat-conducting layer and the heat dissipating layer successively decreases successively, forms heat-conductive characteristic ladder
Degree, for fine copper material radiator, under the premise of ensuring heat dissipation performance, weight is greatly lowered；Compared in the market
For a large amount of existing aluminum alloy material radiators, heat dissipation performance greatly enhances.
It should be noted that the other embodiment of the present invention further includes, the technical characteristic in the various embodiments described above is mutually tied
Conjunction is formed by, the fluorescent tube that can implement.
Each technical characteristic of embodiment described above can be combined arbitrarily, to keep description succinct, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, it is all considered to be the range of this specification record.
Only several embodiments of the present invention are expressed for embodiment described above, the description thereof is more specific and detailed, but
It cannot be construed as a limitation to the scope of the present invention.It should be pointed out that for the ordinary skill people of this field
For member, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the present invention's
Protection domain.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (7)
1. a kind of fluorescent tube, which is characterized in that including：
Diffuser, the diffuser are arcuate structure, and the end of the diffuser extends and is bent to form sliding part；
Heat dissipating housing, the heat dissipating housing include mounting plate and cover body, and the cover body is arcuate structure, the both ends of the cover body respectively with
The two sides of the mounting plate connect, and the side edge of the mounting plate extends and be bent to form bending part, the bending part and
The end of the cover body surrounds sliding groove, and the sliding part is slideably positioned in the sliding groove；
Lamp cap, the lamp cap are connect with the end of the mounting plate；
Lamp plate, the lamp plate fit in one side of the mounting plate far from the cover body, and the lamp plate is equipped with ventilation hole, described
One end of ventilation hole is connected to the inner space of the diffuser, and the other end of the ventilation hole is connected to the mounting plate；And
Multiple LED sub-light sources, multiple LED sub-light sources are arranged at intervals at side of the lamp plate far from the mounting plate successively
Face；
Wherein, the fluorescent tube further includes multiple OLED sub-light sources, and multiple OLED sub-light sources are arranged at intervals at lamp plate far from peace successively
The one side of loading board, LED sub-light sources are arranged alternately with OLED sub-light sources, and the OLED sub-light sources include the sun for being sequentially overlapped setting
Pole transparent glass substrate, ITO conductive anodes, NPB hole transmission layers, NPB luminescent layers, the Alq for mixing MQA3Electron transfer layer, Al are led
Electric cathode and cathode transparent glass substrate, wherein the fluorescence matrix of the luminescent layer of OLED sub-light sources is NPB, the OLED sub-lights
Source has the section that rectangle is combined with arch, and the OLED sub-light sources have the flaky texture of cambered surface；
Wherein, the fluorescent tube further includes radiating piece, and radiating piece includes heat-removal bar, heat sink and radiation tooth, and the of the heat-removal bar
One end is set to the outside of the cover body, and the second end of the heat-removal bar is connect with the heat sink, and the radiation tooth is set to
One side of the heat sink far from the heat-removal bar；Three radiation tooths are set；Three radiation tooths are spaced successively to be set
It is placed in one side of the heat sink far from the heat-removal bar；The heat-removal bar is circular rod-shaped configuration；The heat-removal bar is sky
Core structure；Multiple radiating pieces are set；The distance between two adjacent radiating pieces are equal；
The fluorescent tube further includes radiating cylinder body, and radiating cylinder body is set to outside cover body, the inner vacuum setting of radiating cylinder body, heat dissipation
The inside of cylinder is filled with heat dissipating fluid；
The fluorescent tube further includes folds pipe, and folds pipe is set in lamp plate, and folds pipe is hollow mechanism, fills and sets inside folds pipe
Heat exchange liquid is set, folds pipe has inlet and liquid outlet, and heat exchange liquid is flowed by inlet, and is flowed out by liquid outlet；
One side of the mounting plate far from cover body is provided with heat dissipation oil reservoir, and the lamp plate is bonded with the heat dissipation oil reservoir.
2. fluorescent tube according to claim 1, which is characterized in that the multiple ventilation holes of setting.
3. fluorescent tube according to claim 2, which is characterized in that multiple ventilation hole rectangular arrays are distributed in the lamp
Plate.
4. fluorescent tube according to claim 1, which is characterized in that the ventilation hole is round cavernous structure.
5. fluorescent tube according to claim 1, which is characterized in that the aperture of the ventilation hole is 1mm~1.5mm.
6. fluorescent tube according to claim 5, which is characterized in that the aperture of the ventilation hole is 1.2mm~1.5mm.
7. fluorescent tube according to claim 6, which is characterized in that the aperture of the ventilation hole is 1.4mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510466388.9A CN105065958B (en) | 2015-07-30 | 2015-07-30 | Fluorescent tube |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510466388.9A CN105065958B (en) | 2015-07-30 | 2015-07-30 | Fluorescent tube |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105065958A CN105065958A (en) | 2015-11-18 |
| CN105065958B true CN105065958B (en) | 2018-11-06 |
Family
ID=54495400
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510466388.9A Active CN105065958B (en) | 2015-07-30 | 2015-07-30 | Fluorescent tube |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105065958B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107062044A (en) * | 2016-11-28 | 2017-08-18 | 深圳市圣诺光电科技有限公司 | A kind of combination lamp of anti-dazzle |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102734654A (en) * | 2011-04-12 | 2012-10-17 | 上海矽卓电子科技有限公司 | High power LED (light-emitting diode) daylight lamp and heat rejection method |
| CN104806894A (en) * | 2015-05-12 | 2015-07-29 | 东莞市闻誉实业有限公司 | Illuminating device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201425253Y (en) * | 2009-05-20 | 2010-03-17 | 深圳市斯派克光电科技有限公司 | LED fluorescent lamp shade |
| CN103185327A (en) * | 2011-12-27 | 2013-07-03 | 上海陆离光电科技有限公司 | Radiating device of LED (Light Emitting Diode) lamp |
-
2015
- 2015-07-30 CN CN201510466388.9A patent/CN105065958B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102734654A (en) * | 2011-04-12 | 2012-10-17 | 上海矽卓电子科技有限公司 | High power LED (light-emitting diode) daylight lamp and heat rejection method |
| CN104806894A (en) * | 2015-05-12 | 2015-07-29 | 东莞市闻誉实业有限公司 | Illuminating device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105065958A (en) | 2015-11-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8740416B2 (en) | Cooling device and LED lighting apparatus using the same | |
| CN104896351B (en) | Tubular radiating lamp | |
| CN2872073Y (en) | High-brightness and large-power LED light | |
| CN105065958B (en) | Fluorescent tube | |
| CN101839412A (en) | High-power LED illuminator cooled by finned tubular radiator | |
| CN201242125Y (en) | LED lamp with improved heat radiating structure | |
| CN105090786B (en) | Lighting device | |
| CN105042376B (en) | LED tubular light fixtures | |
| CN104235794B (en) | Convection current LED radiator and LED module light fixture above and below a kind of buckle-type | |
| CN203165947U (en) | Novel LED heat radiation structure | |
| CN105065983A (en) | Illuminating device | |
| CN105065984A (en) | Led lamp | |
| CN105020615A (en) | Lighting lamp | |
| CN206338744U (en) | A kind of LED lamp for car of high heat dispersion | |
| CN105042374A (en) | LED straight pipe lamp | |
| CN105135236A (en) | Tubular lamp | |
| CN105020614A (en) | Novel lamp | |
| CN104896350B (en) | Illuminating device | |
| CN105065985A (en) | Lamp | |
| CN201983047U (en) | High-power LED (light-emitting diode) illuminator radiating heat through tubular fin heat radiator | |
| CN201706448U (en) | Heat radiating structure of lamps and lanterns | |
| CN204573965U (en) | LED lamp heat sink | |
| CN104976536B (en) | Tubular type illuminator | |
| CN104456247B (en) | A kind of strip light | |
| CN104879673B (en) | Tubular type light fixture |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |