TW201316558A - Method of packaging light emitting diode - Google Patents

Abstract

A method of packaging a light emitting diode includes: providing a substrate; etching the top surface of the substrate to form a plurality of reflective cup and defining several conductive frames in the reflectors, each conductive frame including a first electrode and a second electrode isolated from each other; forming a light emitting diode chip on each conductive frame, the light emitting being electrically connected to the first electrode and second electrode; setting a plurality of jointing blocks on the top surface of the substrate between each two neighboring reflectors; arranging a dual brightness enhancement film covering the plurality of jointing blocks; sintering the dual brightness enhancement film and the jointing blocks, by low temperature co-firing, to joint the dual brightness enhancement film with the substrate; cutting the substrate into dices each of which is a single light emitting diode structures.

Description

Light-emitting diode packaging method

The present invention relates to a method of packaging a semiconductor, and more particularly to a method of packaging a light emitting diode.

Light Emitting Diode (LED) is a kind of semiconductor component that can convert electricity into light. It has been widely used in various fields because of its high luminous efficiency, small size, light weight and environmental protection. .

In order to improve the light-emitting efficiency of the light-emitting element, a reflective brightness enhancing brightness enhancement film (DBEF) is usually disposed on the light-emitting surface of the package structure to generate polarized light having the same polarization direction. The reflective polarizer is a reflective brightness enhancement film using a multilayer optical film technology, which is disposed between the backlight and the lower polarizer, and uses the light absorbed by the conventional absorption polarizer to be looped, thereby lifting the optical device. The intensity of light output.

However, for the combination of the reflective polarizer and the light-emitting diode, if the direct adhesive method is adopted, the formed structural connection is not stable enough, and the aging of the long-term adhesive will affect the light-emitting effect of the light-emitting diode. If the reflective polarizing brightening film and the light emitting diode are directly combined under a high temperature environment, the structure of the entire light emitting diode may be damaged, especially the sealing layer formed by the colloidal material is damaged. Further, the light-emitting effect of the light-emitting diode is affected, so that further improvement is required.

In view of the above, it is necessary to provide a method of packaging a light-emitting diode that facilitates connection of a light-emitting diode and a reflective polarizing film.

A method for packaging a light emitting diode, comprising the steps of: providing a package substrate; etching an upper surface of the package substrate to form a plurality of reflective cups; and providing a plurality of conductive frames in the reflective cup, each of the conductive frames comprising first spaced apart from each other An electrode and a second electrode; a light emitting diode element is formed on the conductive frame, and the light emitting diode element is electrically connected to the first electrode and the second electrode; between the reflective cups of the package substrate a plurality of connecting blocks are disposed on the upper surface; a reflective polarizing brightening film is disposed on the plurality of connecting blocks; and the reflective polarizing brightening film and the connecting block are co-fired at a low temperature to increase the reflective polarization by the connecting block a bright film is bonded on the package substrate; and the package substrate is cut to form a plurality of light emitting diode package components.

Compared with the prior art, the light-emitting diode has a plurality of connecting blocks on the upper surface of the reflecting portion, and a reflective polarizing brightness-increasing film is disposed on the light-emitting surface of the LED, and the package is made by low-temperature co-firing. The region corresponding to the reflecting portion of the substrate and the reflective polarizing brightness enhancing film are tightly combined, and the region of the packaging substrate corresponding to the fluorescent layer and the reflective polarizing brightness enhancing film are spaced apart from each other, thereby ensuring the package substrate and The stable connection of the reflective polarizing brightening film also avoids the destruction of the light emitting diode in the co-firing process.

The invention will now be further described with reference to the specific embodiments thereof with reference to the accompanying drawings.

The invention will be further described in detail below with reference to the accompanying drawings.

The method for packaging a light-emitting diode according to the first embodiment of the present invention generally includes the following processes:

Providing a package substrate;

Etching the upper surface of the package substrate to form a plurality of reflective cups and disposing a plurality of conductive frames in the reflective cup, each of the conductive frames comprising first and second electrodes spaced apart from each other;

Forming a light emitting diode element on the upper electrode, the light emitting diode element being electrically connected to the first electrode and the second electrode;

Forming a phosphor layer on each of the light emitting diode elements to cover the light emitting diode element;

Providing a plurality of connection blocks on an upper surface between the reflective cups of the package substrate;

Providing a reflective polarizing brightening film on the plurality of connecting blocks;

Covalently firing the reflective polarizing brightness enhancing film and the connecting block at low temperature to bond the reflective polarizing brightness enhancing film to the package substrate through the connecting block;

The package substrate is diced to form a plurality of light emitting diode package components.

The flow will be described in detail below with reference to FIGS. 1 to 5.

Referring first to FIG. 1, a package substrate 10 is provided. The package substrate 10 includes a first surface 11 and a second surface 12. The package substrate 10 is a germanium substrate, a plastic substrate or a ceramic substrate. The package substrate 10 may also be made of one or more of the following materials: gallium arsenide (GaAs), zinc oxide (ZnO), and indium phosphide (InP).

The package substrate 10 is chiseled by photolithography and etching techniques to divide the package substrate 10 into a plurality of reflective cups 13. Each of the reflective cups 13 includes a carrying portion 131 and an upwardly extending body extending from the carrying portion 131. The reflecting portion 132. The carrying portion 131 has a regular flat shape. The reflective portion 132 defines a receiving space 133 for receiving the LED component 30. The lower surface of the reflecting portion 132 is in contact with a portion of the upper surface of the receiving portion 131. The diameter of one end of the receiving space 133 adjacent to the first surface 11 is larger than the diameter of one end of the receiving portion 131.

A conductive frame 20 is disposed in each of the reflective cups 13, and the conductive frame 20 includes first and second electrodes 21 and 22 spaced apart from each other. The first electrode 21 and the second electrode 22 are electrically connected and exposed in the receiving space 133. The first electrode 21 and the second electrode 22 are connected to the positive and negative electrodes of the light-emitting diode element 30 to be packaged later to obtain electric energy from the outside and supply the electric energy to the light-emitting diode element 30.

Referring to FIG. 2, a light emitting diode element 30 is disposed on the first electrode 21. In the embodiment, the light emitting diode element 30 is flip chip bonded to the first electrode 21 and the second electrode 22 Forming an electrical connection, it can be understood that the electrical connection can also be formed by wire bonding. Preferably, the light emitting diode element 30 used in the embodiment is a light emitting diode die.

Referring to FIG. 3, a phosphor layer 40 is provided. The phosphor layer 40 covers the LED component 30 and covers a portion of the first electrode 21 and the second electrode 22. Specifically, the phosphor layer 40 covers the light emitting diode element 30 while covering the ends of the first electrode 21 and the second electrode 22 close to each other. At the same time, the phosphor layer 40 is at a distance from the upper surface of the reflective portion 132 in the height direction. It can be understood that the phosphor layer 40 can also fill the entire reflective cup 13 to be flush with the upper surface of the reflective portion 132. The phosphor layer 40 may further include a phosphor powder according to the LED element 30 and the light emission, and the phosphor powder comprises a garnet-based phosphor powder, a niobate-based phosphor powder, and a protonate-based phosphor. One or more of powder, sulfide-based phosphor powder, thiogallate-based phosphor powder, oxynitride-based phosphor powder, and nitride-based phosphor powder.

Referring to FIG. 4 , a plurality of connecting blocks 50 are disposed on the first surface 11 of the package substrate 10 . Specifically, the plurality of connecting blocks 50 are disposed on the upper surface of the reflecting portion 132 .

A reflective brightness enhancing film 60 (Dual Brightness Enhancement Film, DBEF) is provided, and the reflective polarizing film 60 is disposed on the package substrate by low temperature co-firing by the connecting block 50. 10 on. The reflective polarizing brightening film 60 is formed by overlapping the multilayer film 61. In this embodiment, the number of the multilayer film is three. The film is made of two kinds of compounds having refractive indexes of 1.88 and 1.64, each of the films has different refractive indexes, and is made of a transparent material with good light-emitting property. Preferably, in this embodiment, The material of the reflective polarizing film 60 is SiO2. It is to be understood that the reflective polarizing film 60 can also be made of any other suitable material.

Specifically, in a temperature range of 850 ° C to 900 ° C, the connecting block 50 is melted, and the reflecting portion of the package substrate 10 and the reflective polarizing brightness enhancing film 60 are tightly combined, and corresponding to the firefly. There is a gap between the area of the light layer and the polarizing brightening film. That is, after the low temperature co-firing, the portion of the package substrate 10 provided with the connection block is closely adhered to the reflective polarizing brightness enhancement film 60, and the portion corresponding to the fluorescent layer 40 and the reflective polarization enhancing film 60 are There is still a gap, so that the stable connection of the package substrate 10 and the reflective polarizing brightness enhancing film 60 is ensured, and the entire LED body 100 is prevented from being damaged in the co-firing process.

Referring to FIG. 5 again, the light-emitting diode 100 after the co-firing is cut, thereby separating a plurality of light-emitting diode packages having higher light efficiency.

6 to 11 are second embodiments of the present invention, and the LED package process in this embodiment is similar to the package process in the first embodiment described above, except that the plurality of separate packages are provided in the second embodiment. The substrate 10 is disposed on a carrier 70. Thus, after the LEDs 100 are subsequently formed, each package substrate 10 is separated from the carrier 70.

Compared with the prior art, the light-emitting diode of the present invention is provided with a plurality of connecting blocks on the upper surface of the reflecting portion, and the reflective polarizing brightening film is disposed on the light-emitting surface of the LED, and is formed by low-temperature co-firing. The area of the package substrate corresponding to the upper surface of the reflective portion and the reflective polarizing brightness enhancing film are tightly combined, and the area of the package substrate corresponding to the fluorescent layer and the reflective polarizing brightness enhancing film are spaced apart from each other, thereby ensuring The stable connection of the package substrate and the reflective polarizing brightness enhancing film also avoids damage of the light emitting diode in the co-firing process.

In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.

100. . . Light-emitting diode

10. . . Package substrate

11. . . First surface

12. . . Second surface

13. . . Reflective cup

131. . . Carrying part

132. . . Reflection section

133. . . Containing space

20. . . Conductive frame

30. . . Light-emitting diode component

twenty one. . . First electrode

twenty two. . . Second electrode

40. . . Fluorescent layer

50. . . Connector

60. . . Reflective polarizing brightening diaphragm

61. . . Diaphragm

70. . . Carrier board

1 to FIG. 5 are schematic diagrams showing manufacturing steps of a light emitting diode package structure according to a first embodiment of the present invention.

6 to 11 are schematic diagrams showing manufacturing steps of a light emitting diode package structure according to a second embodiment of the present invention.

100. . . Light-emitting diode

10. . . Package substrate

11. . . First surface

12. . . Second surface

132. . . Reflection section

20. . . Conductive frame

30. . . Light-emitting diode component

40. . . Fluorescent layer

50. . . Connector

60. . . Reflective polarizing brightening diaphragm

Claims (10)

A method for packaging a light emitting diode, comprising the steps of:
Providing a package substrate;
Etching the upper surface of the package substrate to form a plurality of reflective cups, and providing a conductive frame in each of the reflective cups, each of the conductive frames including first and second electrodes spaced apart from each other;
A light emitting diode element is disposed on each of the conductive frames, and the light emitting diode element is electrically connected to the first electrode and the second electrode;
Providing a plurality of connection blocks on an upper surface between the reflective cups of the package substrate;
Providing a reflective polarizing brightening film on the plurality of connecting blocks;
The reflective polarizing brightening film and the connecting block are co-fired at a low temperature to bond the reflective polarizing brightening film to the package substrate through the connecting block; and the package substrate, the reflective polarizing brightness enhancing film and the cutting package are The blocks are connected to form a plurality of light emitting diode package components. The method of claim 2, wherein each of the reflective cups includes a carrying portion and a reflecting portion that is attached to the upper surface of the carrying portion, and the reflecting portion encloses a receiving space. The lower surface of the reflecting portion is in contact with a portion of the upper surface of the carrying portion, and the first electrode and the second electrode are disposed on the upper surface of the carrying portion and exposed to the receiving space. The method of claim 2, wherein a light-emitting layer is covered on the light-emitting element, and the phosphor layer is disposed in the reflective cup and on the upper surface of the reflective portion. There is a distance. The LED package method of claim 1, wherein the plurality of connection blocks are disposed on an upper surface of the reflection portion. The method of claim 2, wherein the reflective polarizing film is formed by overlapping a plurality of films, and each of the films is made of a transparent material having good light-emitting properties. The method of encapsulating a light-emitting diode according to claim 5, wherein the film is doped with two compounds having refractive indices of 1.88 and 1.64, each film having a different refractive index. The method of claim 2, wherein the low temperature co-firing temperature ranges from 850 ° C to 900 ° C. The method of claim 2, wherein after the low temperature co-firing step, the package substrate presents a gap between the phosphor layer region and the reflective polarizing film. The method of claim 2, wherein after the low temperature co-firing step, the upper surface area of the package substrate corresponding to the reflective portion and the reflective polarizing brightness enhancing film are tightly bonded together. A method for packaging a light emitting diode, comprising the steps of:
Providing a plurality of package substrates separated from each other, and the plurality of package substrates are disposed on a carrier board;
Etching the upper surface of each package substrate to form a plurality of reflective cups of the package substrate, and providing a conductive frame in each of the reflective cups, each of the conductive frames comprising first and second electrodes spaced apart from each other;
A light emitting diode element is disposed on each of the conductive frames, and the light emitting diode element is electrically connected to the first electrode and the second electrode;
Forming a phosphor layer on each of the light emitting diode elements to cover the light emitting diode element;
Providing a plurality of connection blocks on the first surface between the reflective cups of the package substrate;
Providing a reflective polarizing brightening film on the plurality of connecting blocks;
Covalently calcining the reflective polarizing brightening film and the connecting block to bond the reflective polarizing brightness enhancing film to the package substrate through the connecting block; and separating the plurality of package substrates from the carrier to form A plurality of light emitting diode package components.