TW201310905A - 台面型石英晶體振動件及石英晶體裝置 - Google Patents
台面型石英晶體振動件及石英晶體裝置 Download PDFInfo
- Publication number
- TW201310905A TW201310905A TW101129754A TW101129754A TW201310905A TW 201310905 A TW201310905 A TW 201310905A TW 101129754 A TW101129754 A TW 101129754A TW 101129754 A TW101129754 A TW 101129754A TW 201310905 A TW201310905 A TW 201310905A
- Authority
- TW
- Taiwan
- Prior art keywords
- quartz crystal
- mesa
- vibrating member
- crystal vibrating
- length
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/0595—Holders or supports the holder support and resonator being formed in one body
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/19—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/09—Elastic or damping supports
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1035—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by two sealing substrates sandwiching the piezoelectric layer of the BAW device
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011178554A JP5756712B2 (ja) | 2011-08-17 | 2011-08-17 | 水晶デバイス |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201310905A true TW201310905A (zh) | 2013-03-01 |
Family
ID=47712155
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101129754A TW201310905A (zh) | 2011-08-17 | 2012-08-16 | 台面型石英晶體振動件及石英晶體裝置 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US9018826B2 (OSRAM) |
| JP (1) | JP5756712B2 (OSRAM) |
| CN (1) | CN102957395A (OSRAM) |
| TW (1) | TW201310905A (OSRAM) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6318556B2 (ja) * | 2013-11-11 | 2018-05-09 | セイコーエプソン株式会社 | パッケージの製造方法および電子デバイスの製造方法 |
| US20150188025A1 (en) * | 2013-12-30 | 2015-07-02 | Nihon Dempa Kogyo Co., Ltd. | Container for electronic component and electronic component |
| KR20160032600A (ko) | 2014-09-16 | 2016-03-24 | 삼성전기주식회사 | 압전 진동편, 그 제조방법 및 압전 진동자 |
| CN106160694B (zh) * | 2014-09-16 | 2019-07-30 | 三星电机株式会社 | 压电振动构件、制造压电振动构件的方法和压电振动器 |
| US10601393B2 (en) * | 2015-01-29 | 2020-03-24 | Daishinku Corporation | Crystal resonator plate and crystal resonator device |
| JP2016152477A (ja) | 2015-02-17 | 2016-08-22 | セイコーエプソン株式会社 | 振動子、振動デバイス、発振器、電子機器、および移動体 |
| JP2016158147A (ja) * | 2015-02-25 | 2016-09-01 | 京セラクリスタルデバイス株式会社 | 水晶素子および水晶デバイス |
| JP2016174301A (ja) | 2015-03-17 | 2016-09-29 | セイコーエプソン株式会社 | 振動片、振動子、振動デバイス、発振器、電子機器、および移動体 |
| CN105007056A (zh) * | 2015-07-22 | 2015-10-28 | 成都泰美克晶体技术有限公司 | 一种具有单凸结构的压电石英晶片 |
| JP2017153010A (ja) * | 2016-02-26 | 2017-08-31 | 京セラ株式会社 | 水晶素子および水晶デバイス |
| CN108490067B (zh) * | 2018-04-20 | 2019-08-30 | 中国科学院长春应用化学研究所 | 一种插拔式安装的石英晶体检测池 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5198716A (en) * | 1991-12-09 | 1993-03-30 | The United States Of America As Represented By The United States Department Of Energy | Micro-machined resonator |
| JP2003017978A (ja) | 2001-06-29 | 2003-01-17 | Kinseki Ltd | 圧電振動子 |
| JP4506135B2 (ja) * | 2003-09-18 | 2010-07-21 | エプソントヨコム株式会社 | 圧電振動子 |
| JP2006238263A (ja) * | 2005-02-28 | 2006-09-07 | Seiko Epson Corp | 圧電振動片、及び圧電振動子 |
| JP2008263387A (ja) * | 2007-04-11 | 2008-10-30 | Epson Toyocom Corp | メサ型圧電振動片 |
| JP5471303B2 (ja) * | 2009-10-27 | 2014-04-16 | セイコーエプソン株式会社 | 振動片及び振動子 |
| JP4938124B2 (ja) * | 2009-12-15 | 2012-05-23 | 日本電波工業株式会社 | 水晶デバイス |
| JP5562757B2 (ja) * | 2010-08-07 | 2014-07-30 | 日本電波工業株式会社 | メサ型のatカット水晶振動片及び水晶デバイス |
| JP5657400B2 (ja) * | 2011-01-12 | 2015-01-21 | 日本電波工業株式会社 | 水晶デバイス |
| JP2013062579A (ja) * | 2011-09-12 | 2013-04-04 | Nippon Dempa Kogyo Co Ltd | 圧電デバイス及び圧電デバイスの製造方法 |
| JP5930526B2 (ja) * | 2012-02-20 | 2016-06-08 | 日本電波工業株式会社 | 圧電振動素子及び圧電デバイス |
| JP6017189B2 (ja) * | 2012-06-12 | 2016-10-26 | 日本電波工業株式会社 | 圧電振動片及び圧電デバイス |
-
2011
- 2011-08-17 JP JP2011178554A patent/JP5756712B2/ja not_active Expired - Fee Related
-
2012
- 2012-08-14 US US13/584,829 patent/US9018826B2/en not_active Expired - Fee Related
- 2012-08-16 TW TW101129754A patent/TW201310905A/zh unknown
- 2012-08-16 CN CN2012102932834A patent/CN102957395A/zh active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US20130043771A1 (en) | 2013-02-21 |
| US9018826B2 (en) | 2015-04-28 |
| JP2013042396A (ja) | 2013-02-28 |
| JP5756712B2 (ja) | 2015-07-29 |
| CN102957395A (zh) | 2013-03-06 |
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