TW201310406A - Substrate, structure and method for fabricating flexible display device - Google Patents

Abstract

A structure for fabricating a flexible display device includes a substrate, an etching layer, a resilient layer, and a display module. A trench structure is formed in a surface of the substrate. The etching layer is formed on the surface and covers the trench layer. The resilient layer is disposed on the etching layer. The resilient layer and the substrate are separated by the etching layer. The display module is disposed on the resilient layer. The substrate and the resilient layer can be separated without a mechanical stripping process and thus the yield is improved, and the process time and the manufacturing cost are reduced. In addition, the present invention also provides a substrate for fabricating a flexible display device and a method for fabricating a flexible display device.

Description

Substrate, structure and flexible display device for fabricating flexible display device

The present invention relates to a display device, and more particularly to a substrate and structure for fabricating a flexible display device, and a method of fabricating the same.

1 and 2 are schematic flow charts showing a method of fabricating a conventional flexible display device. Referring to FIG. 1 , a conventional flexible display device is formed by first forming a flexible substrate 120 on a glass substrate 110 , and then sequentially forming an isolation layer 130 and a display unit 140 on the flexible substrate 120 . Then, as shown in FIG. 2, a laser annealing process is performed, and the flexible substrate 120 is peeled off from the glass substrate 110.

However, the production machine and materials used in the above manufacturing method are expensive, and during the process of peeling the flexible substrate 120 from the glass substrate 110, stress applied to the flexible substrate 120 may cause components on the flexible substrate 120. Damaged, resulting in poor production yield.

To this end, the prior art proposes another method of fabricating a flexible display device. As shown in FIG. 3, another soft display device is prepared by first providing a low-viscosity release layer 230 on the glass substrate 210, and then covering the flexible substrate 220 on the release layer 230. . Thereafter, the isolation layer 240 and the display unit 250 are formed on the flexible substrate 220. Next, the flexible substrate 220 is cut along the dicing line L1.

Then, as shown in FIG. 4, the flexible substrate 220 is peeled off from the glass substrate 210 together with the insulating layer 240 and the display unit 250 thereon.

However, the above manufacturing method still needs to apply stress to separate the glass substrate 210 and the flexible substrate 220 during the peeling process, so that it is still possible to cause damage to components on the flexible substrate 220, resulting in deterioration of production yield. In addition, the lower surface 222 of the flexible substrate 220 may remain with the release layer of the glue 232 and requires additional time to remove, so as to increase production costs.

The invention provides a structure for fabricating a flexible display device, wherein a substrate and a resilience layer can be separated without mechanical stripping, thereby improving process yield, shortening manufacturing time and reducing production cost.

The invention further provides a method for manufacturing a flexible display device, which does not need to separate the substrate and the flexible material layer by mechanical stripping, thereby improving the process yield, shortening the manufacturing time and reducing the production cost.

The present invention also provides a substrate for fabricating a flexible display device, which can be separated from the flexible layer formed thereon without mechanical stripping, thereby improving process yield and shortening manufacturing. Time and reduce production costs.

To achieve the above advantages or other advantages, the present invention provides a structure for fabricating a flexible display device comprising a substrate, an etch layer, a flexible material layer, and a display module. The surface of the substrate is provided with a groove structure. An etch layer is formed on the surface and covers the trench structure. The layer of flexible material is disposed on the etch layer. The layer of flexible material is separated from the substrate by an etch layer. The display module is disposed on the layer of flexible material.

In an embodiment of the invention, the material of the etching layer comprises tantalum, molybdenum, titanium or tungsten.

In an embodiment of the invention, the structure for fabricating the flexible display device further includes an isolating layer disposed between the flexible material layer and the display module.

In an embodiment of the invention, the display module includes a driving circuit layer disposed on the isolation layer, a display medium layer disposed on the driving circuit layer, and a protective layer disposed on the display medium layer.

In an embodiment of the invention, the substrate is a rigid substrate.

In an embodiment of the invention, the trench structure includes a plurality of first strip-shaped trenches and a plurality of second strip-shaped trenches crossing the first strip-shaped trenches.

In an embodiment of the invention, the substrate comprises a bottom plate and a material layer formed on the bottom plate, and the surface of the substrate is a surface of the material layer.

In order to achieve the above advantages or other advantages, the present invention further provides a method for fabricating a flexible display device, comprising the steps of: first, forming a trench structure on a surface of a substrate. Next, an etch layer is formed on the surface of the substrate, and the etch layer covers the trench structure. Thereafter, a layer of flexible material is formed on the etch layer, and the layer of flexible material is separated from the substrate by the etch layer. A display module is then formed on the layer of flexible material. Next, the etch layer is removed to separate the flexible material layer from the substrate.

In an embodiment of the invention, the forming process of the trench structure includes performing an etching process on a surface of the substrate.

In an embodiment of the invention, the substrate includes a bottom plate and a material layer formed on the bottom plate, and the forming process of the trench structure includes patterning the material layer to form a patterned material layer having a trench structure.

In an embodiment of the invention, the process of removing the etch layer includes performing an etch back process on the etch layer.

In an embodiment of the invention, the etch back process comprises a dry etch process or a wet etch process.

In an embodiment of the invention, the etch back process is a dry etch process and ruthenium difluoride is used as the etch gas.

In an embodiment of the invention, the material of the etching layer comprises tantalum, molybdenum, titanium or tungsten.

In an embodiment of the invention, the method for fabricating the flexible display device further includes cutting the substrate to expose the trench structure on at least one side of the substrate before removing the etch layer.

In order to achieve the above advantages or other advantages, the present invention further provides a substrate for fabricating a flexible display device in which a groove structure is formed on a surface of the substrate.

In an embodiment of the invention, the trench structure includes a plurality of first strip-shaped trenches and a plurality of second strip-shaped trenches crossing the first strip-shaped trenches.

In an embodiment of the invention, the substrate comprises a bottom plate and a patterned material layer formed on the bottom plate, and the surface of the substrate provided with the groove structure is a surface of the patterned material layer.

In the substrate for producing a flexible display device, the structure for fabricating a flexible display device, and the method for fabricating the flexible display device of the present invention, the etching layer can be removed by etching to separate the flexible material layer from the substrate. In this way, no stress is applied to peel the flexible material layer from the substrate, so the process yield is improved. In addition, the separated flexible material layer does not have residual glue, so it is possible to shorten the manufacturing time and reduce the production cost without taking extra time and labor to remove the residual glue.

The above and other objects, features and advantages of the present invention will become more <RTIgt;

FIG. 5 is a schematic flow chart of a method for fabricating a flexible display device according to an embodiment of the present invention, and FIG. 6 is a schematic perspective view of the substrate of FIG. 5B. Referring to FIG. 5A, the manufacturing method of the flexible display device of the embodiment includes the following steps. First, a substrate 310 is provided. The substrate 310 is, for example, a rigid substrate such as a glass substrate. However, the present invention is not limited thereto, and any material that satisfies the requirements for strength, temperature stability, and resistance to a specific etchant in the process can be used for the substrate 310. In this embodiment, the substrate 310 is a multi-layer substrate including a bottom plate 315 and a material layer 316 formed on the bottom plate 315. The bottom plate 315 is, for example, a glass plate, and the material layer 316 is formed of, for example, a photoresist material.

Next, as shown in FIG. 5B and FIG. 6, a trench structure 312 is formed on the surface 311 of the substrate 310. Specifically, the surface 311 of the substrate 310 is, for example, the surface of the material layer 316, and the formation process of the trench structure 312 is, for example, patterning the material layer 316 of FIG. 5A to form the patterned material layer 316' having the trench structure 312, The substrate having the trench structure 312 will be denoted by reference numeral 310' hereinafter. The process of patterning the material layer 316 depends on the type of the material layer 316. In this embodiment, since the material layer 316 is formed of a photoresist material, the material layer 316 can be patterned by a lithography process. It should be noted that, in another embodiment, as shown in FIG. 7, the substrate 310a may be a single-layer substrate (such as a glass plate or other rigid substrate), and the trench structure 312 may be directly formed on the surface 311a of the substrate 310a. The process of forming the trench structure 312 on the surface 311a may be an etching process on the surface 311a.

Referring to FIG. 6 again, the trench structure 312 includes a plurality of first strip trenches 313 and a plurality of second strip trenches 314 , for example. For example, the first strip-shaped grooves 313 may be parallel to each other, and the second strip-shaped grooves 314 may be parallel to each other, for example. The first strip-shaped trench 313 and the second strip-shaped trench 314 cross each other to form a mesh-like trench structure 312. In this embodiment, the first strip-shaped trench 313 is, for example, perpendicular to the second strip-shaped trench 314. The trench structure 312 is, for example, not exposed at the side surface 317 of the substrate 310. The specific shape of the above-described trench structure 312 is merely illustrative and is not intended to limit the present invention.

Referring to FIG. 5C, after the fabrication of the trench structure 312 is completed, an etch layer 320 is formed on the substrate 310'. The etch layer 320 covers and fills the trench structure 312. The material of the etching layer 320 includes, for example, tantalum, molybdenum, titanium or tungsten, but the present invention is not limited thereto. The method of forming the etch layer 320 may include, for example, physical vapor deposition, such as evaporation or sputtering.

Referring to FIG. 5D, after the etch layer 320 is formed, a flexible material layer 330 is formed on the etch layer 320. The material of the flexible material layer 330 may include polyimide, but the invention is not limited thereto. The flexible material layer 330 may be bonded to the upper surface of the etch layer 320, for example, by press bonding.

Next, referring to FIG. 5E, an insulating layer 340 is formed on the flexible material layer 330. The barrier layer 340 can be a dielectric inorganic material or a polymer. The above inorganic material may include, for example, tantalum nitride, cerium oxide, or cerium oxynitride. The above polymers may include, for example, polyimine, polycarbonate or other plastics. It should be noted that the isolation layer 340 is not necessary, that is, this step can be omitted and the subsequent steps can be directly performed.

Referring to FIG. 5F , after the isolation layer 340 is formed, the display module 350 is formed on the isolation layer 340 , so the isolation layer 340 is disposed between the flexible material layer 330 and the display module 350 . Moreover, in embodiments in which the isolation layer 340 is not formed, the display module 350 is formed directly on the layer of flexible material 330. The display module 350 can include, for example, a driving circuit layer 351, a display medium layer 352, and a protective layer 353. The driving circuit layer 351 is disposed on the insulating layer 340, the display dielectric layer 352 is disposed on the driving circuit layer 351, and the protective layer 353 is disposed on the display medium layer 352. The driver circuit layer 351 can include, for example, a thin film transistor array and its associated signal lines as well as peripheral circuitry. Display medium layer 352 can be, for example, a liquid crystal display layer, an electrophoretic display layer, or other type of display medium layer. The protective layer 353 can be formed, for example, of a transparent material such as glass or transparent plastic. It should be noted that the structure of the display module 350 described above is only one embodiment of the present invention, and the present invention does not limit the structure and type of the display module.

After forming the display module 350, a structure 300 for fabricating a flexible display device is obtained, which includes a substrate 310', an etch layer 320, a flexible material layer 330, an isolation layer 340, and a display module 350. The surface 311 of the substrate 310' is provided with a trench structure 312. The etch layer 320 is formed on the surface 311 of the substrate 310' and covers the trench structure 312. The flexible material layer 330 is disposed on the etch layer 320. The layer of flexible material 330 is separated from the substrate 310' by an etch layer 320. The display module 350 is disposed on the isolation layer 340. Of course, in the embodiment in which the isolation layer 340 is not formed, the display module 350 is disposed on the flexible material layer 330.

The method of manufacturing the flexible display device of the present embodiment further includes the step of separating the flexible material layer 330 from the substrate 310'. As shown in FIG. 5G, after the fabrication of the display module 350 is completed, the substrate 310' and the etch layer 320, the flexible material layer 330, and the isolation layer 340 formed on the substrate 310' are at least one of the substrates 310'. Side 318 exposes trench structure 312. The side surface 318 is a side surface formed by the substrate 310' being cut. In the embodiment, the side surface 318 of the substrate 310' exposing the trench structure 312 is, for example, a plurality, but in other embodiments, the trench structure 312 is exposed. The side 318 can also be only one. In another embodiment, when the trench structure is formed, the trench structure can be exposed by at least one side of the substrate, so that the substrate cutting process is not required.

Referring to FIG. 5H, after the above cutting process is completed, the etching layer 320 is removed to separate the flexible material layer 330 from the substrate 310'. Specifically, the process of removing the etch layer 320 may include an etch back process. The above etchback process may include a dry etching process or a wet etching process. The gas used in the dry etching process may be determined by the material of the etching layer 320. In one embodiment, germanium difluoride may be used as the etching gas. Since the side surface 318 of the substrate 310' exposes the trench structure 312, the etching gas can directly contact the etch layer 320 within the trench structure 312 and gradually etch back the etch layer 320. After the etch back process of the etch layer 320 is completed, the flexible material layer 330 can be separated from the substrate 310', thereby obtaining a flexible display device 300' including the flexible material layer 330, the isolation layer 340, and the display module 350.

In the above method of fabricating a flexible display device, the etching layer 320 can be removed by etching to separate the flexible material layer 330 from the substrate 310'. Therefore, in the process of separating the flexible material layer 330 from the substrate 310', stress is not required to peel the flexible material layer 330 from the substrate 310', so that the display mode on the flexible material layer 330 can be prevented from being damaged. Group 350 or other components to increase process yield. In addition, the separated flexible material layer 330 does not have residual glue, so that it is possible to reduce the manufacturing time and reduce the production cost without taking extra time and labor to remove the residual glue.

While the present invention has been described in its preferred embodiments, the present invention is not intended to limit the invention, and the present invention may be modified and modified without departing from the spirit and scope of the invention. The scope of protection is subject to the definition of the scope of the patent application.

110. . . glass substrate

120. . . Flexible substrate

130. . . Insulation

140. . . Display unit

210. . . glass substrate

220. . . Flexible substrate

222. . . lower surface

230. . . Release layer

232. . . Plastic material

240. . . Insulation

250. . . Display unit

300. . . Structure for making a flexible display device

300’. . . Flexible display device

310, 310', 310a. . . Substrate

311. . . surface

312. . . Groove structure

313. . . First groove

314. . . Second strip groove

315. . . Bottom plate

316. . . Material layer

316’. . . Patterned material layer

317. . . Side surface

318. . . side

320. . . Etched layer

330. . . Flexible material layer

340. . . Insulation

350. . . Display module

351. . . Drive circuit layer

352. . . Display media layer

353. . . The protective layer

L1. . . Cutting line

1 and 2 are schematic flow charts showing a method of manufacturing a conventional flexible display device.

3 and 4 are schematic flow charts showing another conventional method of manufacturing a flexible display device.

5A-5H are schematic flow charts of a method for fabricating a flexible display device according to an embodiment of the invention.

6 is a perspective view of the substrate of FIG. 5B for fabricating a flexible display device.

FIG. 7 is a schematic diagram of a substrate having a flexible display device according to another embodiment of the present invention.

300. . . Structure for making a flexible display device

310’. . . Substrate

311. . . surface

312. . . Groove structure

320. . . Etched layer

330. . . Flexible material layer

340. . . Insulation

350. . . Display module

351. . . Drive circuit layer

352. . . Display media layer

353. . . The protective layer

Claims (18)

A structure for fabricating a flexible display device, comprising: a substrate having a trench structure on one surface thereof; an etch layer formed on the surface and covering the trench structure; a layer of flexible material disposed on the substrate On the etch layer, the flexible material layer is separated from the substrate by the etch layer; and a display module is disposed on the flexible material layer. The structure for fabricating a flexible display device according to claim 1, wherein the material of the etching layer comprises tantalum, molybdenum, titanium or tungsten. The structure for fabricating a flexible display device according to claim 1, further comprising an insulating layer disposed between the flexible material layer and the display module. The structure for manufacturing a flexible display device according to claim 3, wherein the display module comprises: a driving circuit layer disposed on the dielectric layer; and a display dielectric layer disposed on the driving circuit layer And a protective layer disposed on the display medium layer. A structure for fabricating a flexible display device according to claim 1, wherein the substrate is a rigid substrate. The structure for fabricating a flexible display device according to claim 1, wherein the trench structure comprises a plurality of first strip-shaped trenches and a plurality of second strips crossing the first strip-shaped trenches Groove. The structure for manufacturing a flexible display device according to claim 1, wherein the substrate comprises a bottom plate and a patterned material layer formed on the bottom plate, wherein the substrate is provided with the groove structure The surface is one of the surfaces of the patterned material layer. A method for fabricating a flexible display device includes: forming a trench structure on a surface of a substrate; forming an etch layer on the surface of the substrate, the etch layer covering the trench structure; forming a etched layer on the etch layer a layer of flexible material separated from the substrate by the etch layer; a display module formed on the layer of flexible material; and the etch layer removed to separate the layer of flexible material from The substrate. The method for fabricating a flexible display device according to claim 8, wherein the forming process of the trench structure comprises performing an etching process on the surface of the substrate. The method of fabricating a flexible display device according to claim 8, wherein the substrate comprises a bottom plate and a material layer formed on the bottom plate, and the forming process of the trench structure comprises patterning the material layer to form A layer of patterned material having the trench structure. The method of fabricating a flexible display device according to claim 8, wherein the process of removing the etch layer comprises performing an etch back process on the etch layer. The method for fabricating a flexible display device according to claim 11, wherein the etchback process comprises a dry etching process or a wet etching process. The method for fabricating a flexible display device according to claim 11, wherein the etchback process is a dry etching process and ruthenium difluoride is used as an etching gas. The method for fabricating a flexible display device according to claim 13, wherein the material of the etch layer comprises bismuth, molybdenum, titanium or tungsten. The method of fabricating a flexible display device according to claim 8, wherein the removing the substrate further comprises cutting the substrate to expose the trench structure on at least one side of the substrate. A substrate for fabricating a flexible display device, wherein a groove structure is formed on a surface of one of the substrates. The substrate for fabricating a flexible display device according to claim 16, wherein the trench structure comprises a plurality of first strip-shaped trenches and a plurality of second strips crossing the first strip-shaped trenches Groove. The substrate for fabricating a flexible display device according to claim 16, wherein the substrate comprises a bottom plate and a patterned material layer formed on the substrate, the substrate having the surface of the trench structure Is the surface of one of the patterned material layers.