CN102956668A - Substrate and structure for manufacturing flexible display device and manufacturing method thereof - Google Patents
Substrate and structure for manufacturing flexible display device and manufacturing method thereof Download PDFInfo
- Publication number
- CN102956668A CN102956668A CN2012101872075A CN201210187207A CN102956668A CN 102956668 A CN102956668 A CN 102956668A CN 2012101872075 A CN2012101872075 A CN 2012101872075A CN 201210187207 A CN201210187207 A CN 201210187207A CN 102956668 A CN102956668 A CN 102956668A
- Authority
- CN
- China
- Prior art keywords
- layer
- substrate
- display device
- etch
- material layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 98
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 45
- 239000000463 material Substances 0.000 claims abstract description 89
- 238000000034 method Methods 0.000 claims abstract description 63
- 238000005530 etching Methods 0.000 claims abstract description 8
- 239000010410 layer Substances 0.000 claims description 169
- 238000002955 isolation Methods 0.000 claims description 22
- 230000015572 biosynthetic process Effects 0.000 claims description 11
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 6
- 239000011241 protective layer Substances 0.000 claims description 6
- 229910052710 silicon Inorganic materials 0.000 claims description 6
- 239000010703 silicon Substances 0.000 claims description 6
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 5
- 238000005520 cutting process Methods 0.000 claims description 5
- 229910052750 molybdenum Inorganic materials 0.000 claims description 5
- 239000011733 molybdenum Substances 0.000 claims description 5
- 238000000059 patterning Methods 0.000 claims description 5
- 239000010936 titanium Substances 0.000 claims description 5
- 229910052719 titanium Inorganic materials 0.000 claims description 5
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 5
- 229910052721 tungsten Inorganic materials 0.000 claims description 5
- 239000010937 tungsten Substances 0.000 claims description 5
- BLIQUJLAJXRXSG-UHFFFAOYSA-N 1-benzyl-3-(trifluoromethyl)pyrrolidin-1-ium-3-carboxylate Chemical compound C1C(C(=O)O)(C(F)(F)F)CCN1CC1=CC=CC=C1 BLIQUJLAJXRXSG-UHFFFAOYSA-N 0.000 claims description 3
- 239000012528 membrane Substances 0.000 abstract 1
- 239000011521 glass Substances 0.000 description 12
- 239000003292 glue Substances 0.000 description 6
- 239000004642 Polyimide Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 238000005224 laser annealing Methods 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000004904 shortening Methods 0.000 description 2
- 206010059866 Drug resistance Diseases 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Images
Abstract
The invention provides a structure for manufacturing flexible display equipment, which comprises a substrate, an etching layer, a flexible material layer and a display module. The surface of the substrate is provided with a groove structure. The etching layer is formed on the surface and covers the groove structure. The flexible material layer is configured on the etching layer. The flexible material layer is separated from the substrate by the etching layer. The display module is disposed on the flexible material layer. The substrate and the flexible material layer can be separated without adopting a mechanical membrane stripping mode, so that the process yield is improved, the manufacturing time is shortened, and the production cost is reduced. In addition, the invention also provides a substrate for manufacturing the flexible display device and a manufacturing method of the structure.
Description
Technical field
The present invention relates to a kind of display device, relate in particular to a kind of substrate and structure for making flexible display device, and the manufacture method of flexible display device.
Background technology
The schematic flow sheet of Fig. 1 and the manufacture method that Figure 2 shows that a kind of existing flexible display device.Please first with reference to Fig. 1, the manufacture method of existing flexible display device is to form flexible base plate 120 at glass substrate 110 first, then forms successively isolation layer 130 and display unit 140 on flexible base plate 120.Then, as shown in Figure 2, carry out laser annealing (laser annealing) technique, and flexible base plate 120 is peeled off from glass substrate 110.
Yet, the cost of employed production board and material is higher in the above-mentioned manufacture method, and with flexible base plate 120 from the process that glass substrate 110 is peeled off, the stress that puts on flexible base plate 120 may cause the assembly on the flexible base plate 120 impaired, causes producing the yield variation.
For this reason, prior art proposes the manufacture method of another kind of flexible display device.As shown in Figure 3, the manufacture method of existing another kind of flexible display device is the release layer 230 (release layer) that low stickiness is set at glass substrate 210 first, and then flexible base plate 220 is covered on the release layer 230.Afterwards, on flexible base plate 220, make isolation layer 240 and display unit 250.Then, along line of cut L1 cutting flexible base plate 220.
Then, as shown in Figure 4, flexible base plate 220 is peeled off from glass substrate 210 together with the isolation layer 240 on it and display unit 250.
Yet above-mentioned manufacture method still needs stress application that glass substrate 210 is separated with flexible base plate 220 in stripping process, therefore still has the assembly that may cause on the flexible base plate 220 impaired, causes producing the yield variation.In addition, the lower surface 222 of flexible base plate 220 may residually have the glue material 232 of release layer and need the ancillary cost time to remove, to such an extent as to increase production cost.
Summary of the invention
The invention provides a kind of structure for making flexible display device, its substrate can not adopt the mode of mechanical stripping to be separated with flexible material layer (resilient layer), thereby the lifting process yield, the shortening manufacturing time also reduces production costs.
The present invention provides a kind of manufacture method of flexible display device in addition, and it need not adopt mode separating base plate and the flexible material layer of mechanical stripping, thus the lifting process yield, and the shortening manufacturing time also reduces production costs.
The present invention also provides a kind of substrate for making flexible display device, it can not adopt the mode of mechanical stripping to be separated with the flexible material layer (resilient layer) of making thereon, so energy lifting process yield shortens manufacturing time and also reduces production costs.
For reaching above-mentioned advantage or other advantages, the present invention proposes a kind of structure for making flexible display device, and it comprises substrate, etch layer, flexible material layer and display module.The surface of substrate is provided with groove structure.Etch layer is formed at above-mentioned surface and covering groove structure.The flexible material layer is disposed on the etch layer.The etched layer of flexible material layer and substrate separates.Display module configuration is on the flexible material layer.
In an embodiment of the present invention, the material of above-mentioned etch layer comprises silicon, molybdenum, titanium or tungsten.
In an embodiment of the present invention, above-mentioned structure for making flexible display device also comprises isolation layer (isolating layer), is disposed between flexible material layer and the display module.
In an embodiment of the present invention, above-mentioned display module comprises the drive circuit layer that is disposed on the isolation layer, is disposed at the display dielectric layer on the drive circuit layer and is disposed at protective layer on the display dielectric layer.
In an embodiment of the present invention, aforesaid substrate is rigid substrates.
In an embodiment of the present invention, above-mentioned groove structure comprises a plurality of the first strip-shaped grooves and a plurality of second strip-shaped grooves of intersecting with these first strip-shaped grooves.
In an embodiment of the present invention, aforesaid substrate comprises base plate and is formed at material layer on the base plate that the surface of aforesaid substrate is the surface of material layer.
For reaching above-mentioned advantage or other advantages, the present invention proposes a kind of manufacture method of flexible display device in addition, and it comprises the following steps: at first, forms groove structure in the surface of substrate.Then, form etch layer, this etch layer covering groove structure in the surface of substrate.Afterwards, on etch layer, form the flexible material layer, and the flexible material layer separates with etched layer of substrate.Then, on the flexible material layer, form display module.Then, remove etch layer to separate flexible material layer and substrate.
In an embodiment of the present invention, the formation technique of above-mentioned groove structure comprises etch process is carried out on the surface of aforesaid substrate.
In an embodiment of the present invention, aforesaid substrate comprises base plate and is formed at material layer on the base plate, and the formation technique of groove structure comprises this material layer of patterning, has the patterned material layer of groove structure with formation.
In an embodiment of the present invention, the technique of above-mentioned removal etch layer comprises etch layer is carried out etch-back technics.
In an embodiment of the present invention, above-mentioned etch-back technics comprises dry etch process or wet etch process.
In an embodiment of the present invention, above-mentioned etch-back technics is dry etch process and adopts xenon difluoride as etching gas.
In an embodiment of the present invention, the material of above-mentioned etch layer comprises silicon, molybdenum, titanium or tungsten.
In an embodiment of the present invention, the manufacture method of above-mentioned flexible display device comprised also that cutting substrate exposed groove structure with at least one side at substrate before removing etch layer.
For reaching above-mentioned advantage or other advantages, the present invention proposes a kind of substrate for making flexible display device in addition, wherein is formed with groove structure on the surface of substrate.
In an embodiment of the present invention, above-mentioned groove structure comprises a plurality of the first strip-shaped grooves and a plurality of second strip-shaped grooves of intersecting with the first strip-shaped grooves.
In an embodiment of the present invention, aforesaid substrate comprises base plate and is formed at patterned material layer on the base plate that the surface that substrate is provided with groove structure is the surface of patterned material layer.
In substrate, the structure that is used for the making flexible display device and the manufacture method of flexible display device for making flexible display device of the present invention, owing to can adopt etched mode to remove etch layer, to separate flexible material layer and substrate.So, need not stress application the flexible material layer is peeled off from substrate, so the technique yield is promoted.In addition, the flexible material layer after the separation does not have the removing residual glue material, so need not additionally take time and manpower is removed the removing residual glue material, can shorten manufacturing time and reduces production costs.
For above and other purpose of the present invention, feature and advantage can be become apparent, preferred embodiment cited below particularly, and cooperate appended graphicly, be described in detail below.
Description of drawings
Fig. 1 and the schematic flow sheet that Figure 2 shows that a kind of manufacture method of existing pliability display device.
Fig. 3 and the schematic flow sheet that Figure 4 shows that the manufacture method of another kind of existing pliability display device.
The schematic flow sheet of the manufacture method of the flexible display device that Fig. 5 A to Fig. 5 H provides for one embodiment of the invention.
Fig. 6 is the schematic perspective view of the substrate that is used for the making flexible display device of Fig. 5 B.
Fig. 7 is a kind of schematic diagram that has for the substrate of making flexible display device of another embodiment of the present invention.
The main element symbol description
110: glass substrate
120: flexible base plate
130: isolation layer
140: display unit
210: glass substrate
220: flexible base plate
222: lower surface
230: release layer
232: the glue material
240: isolation layer
250: display unit
300: the structure that is used for making flexible display device
300 ': flexible display device
310,310 ', 310a: substrate
311: the surface
312: groove structure
313: the first strip-shaped grooves
314: the second strip-shaped grooves
315: base plate
316: material layer
316 ': patterned material layer
317: side surface
318: the side
320: etch layer
330: the flexible material layer
340: isolation layer
350: display module
351: drive circuit layer
352: display dielectric layer
353: protective layer
L1: line of cut.
Embodiment
Be technological means and the effect that the predetermined goal of the invention of realization is taked for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, the embodiment, structure, feature and the effect thereof that are used for making flexible display device substrate, structure and preparation method thereof to foundation the present invention proposes are described in detail as follows.
The schematic flow sheet of the manufacture method of the flexible display device that Fig. 5 A to Fig. 5 H provides for one embodiment of the invention, and Fig. 6 is the schematic perspective view of the substrate of Fig. 5 B.Please consult first Fig. 5 A, the manufacture method of the flexible display device of present embodiment comprises the following steps.At first, provide substrate 310.Substrate 310 is such as being the rigid substrates such as glass substrate, but the present invention is not limited to this, any can satisfy in the technique for intensity, temperature stability and material that special etch agent drug resistance is required all can be used for making substrate 310.In the present embodiment, substrate 310 is multilager base plate, and it comprises base plate 315 and is formed at material layer 316 on the base plate 315.Above-mentioned base plate 315 is glass plate for example, and material layer 316 is for example formed by photoresist.
Then, such as Fig. 5 B and shown in Figure 6, form groove structure 312 in the surface 311 of substrate 310.Particularly, the surface 311 of substrate 310 for example is the surface of material layer 316, and the formation technique of groove structure 312 for example is the material layer 316 of patterning Fig. 5 A, have the patterned material layer 316 ' of groove structure 312 with formation, and hereinafter will represent to have with label 310 ' substrate of groove structure 312.Material layer 316 being carried out the technique of patterning need decide on the kind of material layer 316, in the present embodiment because material layer 316 is formed by photoresist, so can select lithography process to come material layer 316 is carried out patterning.It should be noted that in another embodiment, as shown in Figure 7, substrate 310a can be single layer substrate (such as glass plate or other rigid substrates), and groove structure 312 is formed directly in the surperficial 311a of substrate 310a.The technique that forms groove structure 312 in surperficial 311a can be that effects on surface 311a carries out etch process.
Referring again to Fig. 6, above-mentioned groove structure 312 for example comprises a plurality of the first strip-shaped grooves 313 and a plurality of the second strip-shaped grooves 314.For example can be parallel to each other between the first strip-shaped grooves 313, for example be parallel to each other between the second strip-shaped grooves 314.The first strip-shaped grooves 313 is intersected mutually with the second strip-shaped grooves 314, with the webbed groove structure 312 of shape.In the present embodiment, the first strip-shaped grooves 313 for example is perpendicular to the second strip-shaped grooves 314.Groove structure 312 does not for example expose in side surface 317 places of substrate 310.The concrete shape of above-mentioned groove structure 312 is not to limit the present invention only for illustrating.
See also Fig. 5 C, after the making of finishing groove structure 312, in substrate 310 ' the upper etch layer 320 that forms.Etch layer 320 covers and filling groove structure 312.The material of etch layer 320 for example comprises silicon, molybdenum, titanium or tungsten, but the present invention is not limited to this.The formation method of etch layer 320 for example can comprise that physical vapor Shen is long-pending, for example evaporation or sputter.
See also Fig. 5 D, after forming etch layer 320, on etch layer 320, form flexible material layer 330.The material of flexible material layer 330 can comprise polyimides (polyimide), but the present invention is not limited to this.Flexible material layer 330 for example can adopt the mode of pressing to be incorporated into the upper surface of etch layer 320.
Then, see also Fig. 5 E, on flexible material layer 330, form isolation layer 340.Isolation layer 340 can be inorganic material or the polymer of dielectric.Above-mentioned inorganic material for example can comprise silicon nitride, silica, silicon oxynitride.Above-mentioned polymer for example can comprise polyimides, Merlon (polycarbonate) or other plastics.It should be noted that isolation layer 340 is not necessary, that is this step can be omitted and directly carry out follow-up step.
See also Fig. 5 F, after forming isolation layer 340, at the upper formation display module 350 of isolation layer 340, so isolation layer 340 is to be disposed between flexible material layer 330 and the display module 350.In addition, in the embodiment that does not form isolation layer 340,350 of display modules directly are formed on the flexible material layer 330.This display module 350 for example can comprise drive circuit layer 351, display dielectric layer 352 and protective layer 353.Drive circuit layer 351 is disposed on the isolation layer 340, and display dielectric layer 352 is disposed on the drive circuit layer 351, and protective layer 353 is disposed on the display dielectric layer 352.Drive circuit layer 351 for example can comprise thin-film transistor array and relevant holding wire and peripheral circuit thereof.Display dielectric layer 352 for example can be the display dielectric layer of liquid crystal display layer, electrophoretic display layer or other kinds.Protective layer 353 for example can for example glass or transparent plastic form by transparent material.It should be noted that the structure of above-mentioned display module 350 only is one embodiment of the present of invention, the present invention does not limit structure and the kind of display module.
Can obtain for the structure 300 of making flexible display device after forming display module 350, it comprises substrate 310 ', etch layer 320, flexible material layer 330, isolation layer 340 and display module 350.The surface 311 of substrate 310 ' is provided with groove structure 312.Etch layer 320 is formed at surface 311 and the covering groove structure 312 of substrate 310 '.Flexible material layer 330 is disposed on the etch layer 320.Flexible material layer 330 separates with substrate the 310 ' etched layer 320.Display module 350 is disposed on the isolation layer 340.Certainly, in the embodiment that does not form isolation layer 340,350 of display modules are disposed on the flexible material layer 330.
The manufacture method of the flexible display device of present embodiment also comprises the step that flexible material layer 330 is separated with substrate 310 '.Shown in Fig. 5 G, after the making of finishing display module 350, cutting substrate 310 ' and the etch layer 320, flexible material layer 330 and the isolation layer 340 that are formed on the substrate 310 ' expose groove structure 312 with at least one side 318 at substrate 310 '.Side 318 is sides that substrate 310 ' is cut rear formation, and in the present embodiment, substrate 310 ' exposes the side 318 of groove structure 312 for example for a plurality of, but in other embodiments, the side 318 that exposes groove structure 312 can only be one also.In another embodiment, when making groove structure, groove structure is exposed by at least one side of substrate, so can not need carry out substrate cut technique.
See also Fig. 5 H, after finishing above-mentioned cutting technique, remove etch layer 320 to separate flexible material layer 330 and substrate 310 '.Particularly, the technique of removal etch layer 320 can comprise etch-back technics.Above-mentioned etch-back technics can be selected dry etch process or wet etch process.The employed gas of above-mentioned dry etch process is decided by the material of etch layer 320, in one embodiment, can adopt xenon difluoride as etching gas.Because groove structure 312 is exposed in the side 318 of substrate 310 ', etching gas can be directly contacts with the interior etch layer 320 of groove structure 312 and also progressively eat-backs etch layer 320.Behind the etch-back technics of finishing etch layer 320, flexible material layer 330 can separate with substrate 310 ', and then obtains comprising the flexible display device 300 ' of flexible material layer 330, isolation layer 340 and display module 350.
In the manufacture method of above-mentioned flexible display device, owing to can adopt etched mode to remove etch layer 320, to separate flexible material layer 330 and substrate 310 '.Therefore, in the process of separating flexible material layer 330 and substrate 310 ', need not stress application flexible material layer 330 is peeled off from substrate 310 ', thus can avoid damaging display module 350 or other assemblies on the flexible material layer 330, and then the lifting process yield.In addition, the flexible material layer 330 after the separation does not have the removing residual glue material, so need not additionally take time and manpower is removed the removing residual glue material, can shorten manufacturing time and reduces production costs.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, although the present invention discloses as above with preferred embodiment, yet be not to limit the present invention, any those skilled in the art, within not breaking away from the technical solution of the present invention scope, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be not break away from the technical solution of the present invention content, according to technical spirit of the present invention any brief introduction that above embodiment does is revised, equivalent variations and modification all still belong in the scope of technical solution of the present invention.
Claims (18)
1. structure of be used for making flexible display device, it comprises:
Substrate, its surface is provided with groove structure;
Etch layer is formed at this surface and covers this groove structure;
The flexible material layer is disposed on this etch layer, and this flexible material layer and this substrate are separated by this etch layer; And
Display module is disposed on this flexible material layer.
2. the structure for making flexible display device as claimed in claim 1, wherein the material of this etch layer comprises silicon, molybdenum, titanium or tungsten.
3. the structure for making flexible display device as claimed in claim 1 also comprises an isolation layer, is disposed between this flexible material layer and this display module.
4. the structure for making flexible display device as claimed in claim 3, wherein this display module comprises:
Drive circuit layer is disposed on this dielectric layer;
Display dielectric layer is disposed on this drive circuit layer; And
Protective layer is disposed on this display dielectric layer.
5. the structure for making flexible display device as claimed in claim 1, wherein this substrate is rigid substrates.
6. the structure for making flexible display device as claimed in claim 1, wherein this groove structure comprises a plurality of the first strip-shaped grooves and a plurality of second strip-shaped grooves of intersecting with those first strip-shaped grooves.
7. the structure for making flexible display device as claimed in claim 1, wherein, this substrate comprises base plate and is formed at patterned material layer on this base plate that this substrate is provided with this surface of this groove structure and is the surface of this patterned material layer.
8. the manufacture method of a flexible display device, it comprises:
Surface in substrate forms a groove structure;
This surface in this substrate forms etch layer, and this etch layer covers this groove structure;
Form the flexible material layer on this etch layer, this flexible material layer and this substrate are separated by this etch layer;
On this flexible material layer, form display module; And
Remove this etch layer to separate this flexible material layer and this substrate.
9. the manufacture method of flexible display device as claimed in claim 8, wherein the formation technique of this groove structure comprises etch process is carried out on this surface of this substrate.
10. the manufacture method of flexible display device as claimed in claim 8, wherein this substrate comprises base plate and is formed at material layer on this base plate, the formation technique of this groove structure comprises this material layer of patterning, has the patterned material layer of this groove structure with formation.
11. the manufacture method of flexible display device as claimed in claim 8, the technique of wherein removing this etch layer comprises carries out an etch-back technics to this etch layer.
12. the manufacture method of flexible display device as claimed in claim 11, wherein this etch-back technics comprises dry etch process or wet etch process.
13. the manufacture method of flexible display device as claimed in claim 11, this etch-back technics are dry etch process and adopt xenon difluoride as etching gas.
14. the manufacture method of flexible display device as claimed in claim 13, wherein the material of this etch layer comprises silicon, molybdenum, titanium or tungsten.
15. the manufacture method of flexible display device as claimed in claim 8 comprised also before removing this etch layer that wherein this substrate of cutting exposes this groove structure with at least one side at this substrate.
16. a substrate that is used for making flexible display device wherein is formed with groove structure on the surface of this substrate.
17. the substrate for making flexible display device as claimed in claim 16, wherein this groove structure comprises a plurality of the first strip-shaped grooves and a plurality of second strip-shaped grooves of intersecting with those first strip-shaped grooves.
18. the substrate for making flexible display device as claimed in claim 16, wherein this substrate comprises base plate and is formed at patterned material layer on this base plate, and this substrate is provided with this surface of this groove structure and is the surface of this patterned material layer.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW100130109 | 2011-08-23 | ||
TW100130109A TWI444945B (en) | 2011-08-23 | 2011-08-23 | Substrate, structure and method for fabricating flexible display device |
Publications (1)
Publication Number | Publication Date |
---|---|
CN102956668A true CN102956668A (en) | 2013-03-06 |
Family
ID=47765234
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2012101872075A Pending CN102956668A (en) | 2011-08-23 | 2012-06-08 | Substrate and structure for manufacturing flexible display device and manufacturing method thereof |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN102956668A (en) |
TW (1) | TWI444945B (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103682176A (en) * | 2013-12-06 | 2014-03-26 | 京东方科技集团股份有限公司 | Manufacturing method for rigid substrate and flexible display device and rigid substrate |
CN104319263A (en) * | 2014-11-14 | 2015-01-28 | 昆山工研院新型平板显示技术中心有限公司 | Preparing method of flexible display device and substrate for preparing flexible display device |
CN104880846A (en) * | 2015-06-15 | 2015-09-02 | 京东方科技集团股份有限公司 | Flexible substrate, production method thereof and display device |
CN104952781A (en) * | 2014-03-31 | 2015-09-30 | 新日铁住金化学株式会社 | Method of manufacturing a flexible device, a flexible device manufacturing apparatus, a flexible device and a liquid composition |
CN104979284A (en) * | 2015-06-01 | 2015-10-14 | 京东方科技集团股份有限公司 | Method for stripping ultra-thin glass from bearing substrate |
CN105633003A (en) * | 2016-01-26 | 2016-06-01 | 京东方科技集团股份有限公司 | Display substrate, forming method, carrier substrate and display device |
CN106229421A (en) * | 2016-08-24 | 2016-12-14 | 昆山工研院新型平板显示技术中心有限公司 | Flexible base board manufacture method and flexible base board |
WO2018112919A1 (en) * | 2016-12-22 | 2018-06-28 | 武汉华星光电技术有限公司 | Porous substrate and manufacturing method therefor, and method for manufacturing thin film transistor |
CN110600524A (en) * | 2019-09-29 | 2019-12-20 | 昆山工研院新型平板显示技术中心有限公司 | Array substrate, display panel and preparation method thereof |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI561325B (en) * | 2014-08-01 | 2016-12-11 | Au Optronics Corp | Display module manufacturing method and display module |
CN110741427B (en) * | 2017-11-10 | 2021-10-22 | 深圳市柔宇科技股份有限公司 | Manufacturing method of flexible panel, flexible panel and display device |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1280617A2 (en) * | 2000-04-17 | 2003-02-05 | The Penn State Research Foundation | Deposited thin films and their use in separation and sarcrificial layer applications |
US20040048447A1 (en) * | 2002-07-11 | 2004-03-11 | Seiko Epson Corporation | Method for making semiconductor device, semiconductor element composite, electro-optical apparatus, and electronic system |
US20070091062A1 (en) * | 2003-11-21 | 2007-04-26 | Koninklijke Philips Electronics N.V. | Active matrix displays and other electronic devices having plastic substrates |
JP2007266472A (en) * | 2006-03-29 | 2007-10-11 | Stanley Electric Co Ltd | Nitride semiconductor wafer or nitride semiconductor device, and manufacturing method thereof |
-
2011
- 2011-08-23 TW TW100130109A patent/TWI444945B/en active
-
2012
- 2012-06-08 CN CN2012101872075A patent/CN102956668A/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1280617A2 (en) * | 2000-04-17 | 2003-02-05 | The Penn State Research Foundation | Deposited thin films and their use in separation and sarcrificial layer applications |
US20040048447A1 (en) * | 2002-07-11 | 2004-03-11 | Seiko Epson Corporation | Method for making semiconductor device, semiconductor element composite, electro-optical apparatus, and electronic system |
US20070091062A1 (en) * | 2003-11-21 | 2007-04-26 | Koninklijke Philips Electronics N.V. | Active matrix displays and other electronic devices having plastic substrates |
JP2007266472A (en) * | 2006-03-29 | 2007-10-11 | Stanley Electric Co Ltd | Nitride semiconductor wafer or nitride semiconductor device, and manufacturing method thereof |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103682176B (en) * | 2013-12-06 | 2016-03-30 | 京东方科技集团股份有限公司 | The manufacture method of rigid substrate substrate and flexible display device, rigid substrate substrate |
CN103682176A (en) * | 2013-12-06 | 2014-03-26 | 京东方科技集团股份有限公司 | Manufacturing method for rigid substrate and flexible display device and rigid substrate |
CN104952781A (en) * | 2014-03-31 | 2015-09-30 | 新日铁住金化学株式会社 | Method of manufacturing a flexible device, a flexible device manufacturing apparatus, a flexible device and a liquid composition |
CN104319263A (en) * | 2014-11-14 | 2015-01-28 | 昆山工研院新型平板显示技术中心有限公司 | Preparing method of flexible display device and substrate for preparing flexible display device |
CN104319263B (en) * | 2014-11-14 | 2017-08-25 | 昆山工研院新型平板显示技术中心有限公司 | The preparation method of flexible display apparatus and the substrate for making flexible display apparatus |
CN104979284A (en) * | 2015-06-01 | 2015-10-14 | 京东方科技集团股份有限公司 | Method for stripping ultra-thin glass from bearing substrate |
CN104979284B (en) * | 2015-06-01 | 2018-01-16 | 京东方科技集团股份有限公司 | A kind of method for peeling off ultra-thin glass from bearing substrate |
US9997547B2 (en) | 2015-06-01 | 2018-06-12 | Boe Technology Group Co., Ltd. | Carrier substrate having a plurality of fluid passages and method of fabricating display apparatus utilizing the same |
CN104880846A (en) * | 2015-06-15 | 2015-09-02 | 京东方科技集团股份有限公司 | Flexible substrate, production method thereof and display device |
CN104880846B (en) * | 2015-06-15 | 2018-07-24 | 京东方科技集团股份有限公司 | Flexible base board and preparation method thereof, display device |
US10209544B2 (en) | 2015-06-15 | 2019-02-19 | Boe Technology Group Co., Ltd. | Flexible substrate and manufacturing method thereof and display device |
CN105633003A (en) * | 2016-01-26 | 2016-06-01 | 京东方科技集团股份有限公司 | Display substrate, forming method, carrier substrate and display device |
CN106229421A (en) * | 2016-08-24 | 2016-12-14 | 昆山工研院新型平板显示技术中心有限公司 | Flexible base board manufacture method and flexible base board |
CN106229421B (en) * | 2016-08-24 | 2018-08-14 | 昆山工研院新型平板显示技术中心有限公司 | Flexible base board production method and flexible base board |
US10361402B2 (en) | 2016-12-12 | 2019-07-23 | Wuhan China Star Optoelectronics Technology Co., Ltd | Porous substrate and fabricating method thereof, and a fabricating method for thin film transistor |
WO2018112919A1 (en) * | 2016-12-22 | 2018-06-28 | 武汉华星光电技术有限公司 | Porous substrate and manufacturing method therefor, and method for manufacturing thin film transistor |
CN110600524A (en) * | 2019-09-29 | 2019-12-20 | 昆山工研院新型平板显示技术中心有限公司 | Array substrate, display panel and preparation method thereof |
Also Published As
Publication number | Publication date |
---|---|
TWI444945B (en) | 2014-07-11 |
TW201310406A (en) | 2013-03-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102956668A (en) | Substrate and structure for manufacturing flexible display device and manufacturing method thereof | |
US8604485B2 (en) | Intermediate structure, method and substrate for fabricating flexible display device | |
JP5033880B2 (en) | Electronic device having plastic substrate | |
US8961255B2 (en) | Manufacturing method for flexible display apparatus | |
CN109817767B (en) | Micro device and manufacturing method thereof | |
TW201944629A (en) | Bezel-less display device, bezel-less display panel and manufacturing method thereof | |
US10158100B2 (en) | Method for manufacturing flexible display panel and flexible display panel | |
US20140104509A1 (en) | Touch panel and manufacturing method thereof | |
CN110570754B (en) | Manufacturing method of flexible display panel and flexible display panel | |
JP2009047736A (en) | Display device and method for manufacturing the same | |
CN104934374A (en) | Electronic Die Singulation Method | |
JP7023832B2 (en) | Flexible panel manufacturing method, flexible panel and display device | |
US8339563B2 (en) | Liquid crystal imager and method of making same | |
CN104934441A (en) | GOA unit, preparation method thereof, gate drive circuit and display device | |
CN103000491A (en) | Method for manufacturing flexible display device | |
CN112310252A (en) | Micro LED crystal grain, Micro LED substrate and preparation method thereof | |
CN108987338B (en) | Method for forming flexible electronic device | |
CN108333819B (en) | Display panel and method for manufacturing the same | |
CN101853819B (en) | Chip fabrication technique | |
CN106206623B (en) | A kind of display base plate, its production method, display panel and display device | |
KR20150058610A (en) | Method for manuacturing liquid crystal display pannel and manufacturing device thereor | |
KR100852735B1 (en) | Method for fabricating flexible array substrate and substrate module | |
US8653631B2 (en) | Transferred thin film transistor and method for manufacturing the same | |
JP2009231533A (en) | Peeling method, peeling apparatus and method of manufacturing semiconductor device | |
TW531897B (en) | Method of forming thin film transistor on plastic substrate |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130306 |