TW201305361A - 薄膜及其製備方法 - Google Patents

薄膜及其製備方法 Download PDF

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TW201305361A
TW201305361A TW100125543A TW100125543A TW201305361A TW 201305361 A TW201305361 A TW 201305361A TW 100125543 A TW100125543 A TW 100125543A TW 100125543 A TW100125543 A TW 100125543A TW 201305361 A TW201305361 A TW 201305361A
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titanium
chromium
layer
target
substrate
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TW100125543A
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Chung-Pei Wang
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Hon Hai Prec Ind Co Ltd
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Priority to TW100125543A priority Critical patent/TW201305361A/zh
Priority to US13/245,875 priority patent/US20130022837A1/en
Publication of TW201305361A publication Critical patent/TW201305361A/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B32B15/013—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of an iron alloy or steel, another layer being formed of a metal other than iron or aluminium
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0015—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterized by the colour of the layer
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/024—Deposition of sublayers, e.g. to promote adhesion of the coating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08—Oxides
    • C23C14/083—Oxides of refractory metals or yttrium
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568—Transferring the substrates through a series of coating stations
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12806—Refractory [Group IVB, VB, or VIB] metal-base component
    • Y10T428/12812—Diverse refractory group metal-base components: alternative to or next to each other

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

本發明提供一種薄膜，其附著在一由不銹鋼製成的基板的表面，且包括依次堆疊在所述基板表面的一附著層、一應力緩衝層及一顏色層。所述附著層由鉻製成。所述應力緩衝層由鈦與鉻的混合物製成；所述顏色層由鈦與鉻的混合物製成。本發明還涉及一種薄膜的製備方法。

Description

薄膜及其製備方法
本發明涉及一種薄膜及其製備方法。
先前的電子設備的金屬外殼表面一般會鍍薄膜，不但可以保護金屬外殼，而且使金屬外殼的表面具有高金屬質感及絢麗的色彩。電子設備在使用過程中，金屬外殼表面的薄膜與外界物體經常發生摩擦，因此如何提高薄膜的耐磨性就成為亟待解決的問題。
有鑒於此，有必要提供一種耐磨性較佳的薄膜及其製備方法。
一種薄膜，其附著在一由不銹鋼製成的基板的表面，且包括依次堆疊在所述基板表面的一附著層、一應力緩衝層及一顏色層。所述附著層由鉻製成。所述應力緩衝層由鈦與鉻的混合物製成。所述顏色層由鈦與鉻的混合物製成。
一種變色薄膜的製備方法，其包括如下步驟：提供一基板，所述基板由不銹鋼製成；將所述基板放入一第一真空鍍膜腔內，在所述基板的表面鍍上一附著層，所述附著層由鉻製成；將鍍上所述附著層後的基板放入一第二真空鍍膜腔內，並在所述附著層的表面鍍上一應力緩衝層，所述應力緩衝層由鈦與鉻的混合物製成；將鍍上應力緩衝層後的基板放入一第三真空鍍膜腔內，並在所述應力緩衝層的表面鍍上一顏色層，所述顏色層由鈦與鉻的混合物製成。
相較於先前技術，本發明的薄膜及其製備方法，通過將所述附著層由鉻製成，將所述應力緩衝層由鉻與鈦製成，使得所述薄膜在由不銹鋼製成的基板的表面的附著力較好，具有較好的耐磨性。
下面將結合附圖，對本發明作進一步的詳細說明。
請參閱圖1，本發明實施方式提供的一種薄膜100，其附著在一基板200的表面，且包括依次堆疊在所述基板200表面的一附著層10、一應力緩衝層30及一顏色層50。在本實施方式中，所述基板200為一電子裝置的外殼。
所述基板200由不銹鋼製成。
所述附著層10由鉻製成。所述附著層10的厚度為0.2~0.25um。
所述應力緩衝層30由鈦與鉻的混合物製成，且鈦與鉻的質量比為1：1。所述應力緩衝層30的厚度為0.3~0.35um。
所述顏色層50由鈦與鉻的混合物製成，且鈦與鉻的質量比為3：1。所述顏色層50的厚度為0.4~0.5um。
如圖2所示，本發明的薄膜的製備方法包括如下步驟：
S1：提供一由不銹鋼製成的基板。具體的，所述基板為一金屬外殼。
S2：將所述基板放入第一真空鍍膜腔內採用直流磁控濺射方法進行濺鍍，使所述基板的表面鍍上一附著層。具體的，所述第一真空鍍膜腔內的真空壓力為0.5~0.8Pa，以鉻(Cr)作為靶材，離子轟擊源的功率是10~12KW，偏壓電源的電壓是200~220V，真空濺鍍的時間是600s(秒)。所述附著層的厚度為0.2~0.25um。以氬氣(Ar)作為工作氣體，所述氬氣(Ar)的流量為500sccm (毫升/分鐘)。
S3：將鍍上所述附著層的基板放入第二真空鍍膜腔內採用直流磁控濺射方法進行濺鍍，使所述基板的表面鍍上一應力緩衝層。具體的，所述第二真空鍍膜腔內的真空壓力為0.5~0.8Pa，在所述第二真空腔內同時放置一鈦(Ti)靶材及一鉻(Cr)靶材。所述鈦(Ti)靶材與所述鉻(Cr)靶材進行離子轟擊源的功率均是10~12KW，偏壓電源的電壓均為120~130V，真空濺鍍的時間均為600s，從而使得所述應力緩衝層中鈦與鉻含量的質量比為1：1。所述應力緩衝層的厚度為0.3~0.35um。以氬氣(Ar)作為工作氣體，所述氬氣(Ar)的流量為500sccm。
S4：將鍍上所述應力緩衝層的基板放入第三真空鍍膜腔內採用直流磁控濺射方法進行濺鍍，使所述基板的表面鍍上一顏色層。具體的，所述第三真空鍍膜腔內的真空壓力為0.5~0.8Pa，在所述第三真空腔內同時放置一鈦(Ti)靶材及一鉻(Cr)靶材。所述鈦(Ti)靶材與所述鉻(Cr)靶材進行離子轟擊的偏壓電源的電壓均為80~85V，真空濺鍍的時間均為2700s，所述鈦(Ti)靶材進行離子轟擊的功率是30~36KW，所述鉻(Cr)靶材進行離子轟擊的功率是10~12KW，從而使得所述應力緩衝層中鈦與鉻的質量比為3：1。所述顏色層的厚度為0.4~0.5um。以氬氣(Ar)及氧氣(O2)作為工作氣體，所述氬氣(Ar)與氧氣(O2)的流量比為1：3。所述氬氣(Ar)的流量為200sccm，所述氧氣(O2)的流量為600sccm。
可以理解，在其他實施方式中，所述第一、第二、第三真空鍍膜腔也可為同一鍍膜腔，只需要在鍍完一膜之後，將該鍍膜腔抽真空，然後接著鍍下一膜。
相較於先前技術，本發明的薄膜及其製備方法，通過將所述附著層由鉻製成，將所述應力緩衝層由鉻鈦製成，使得所述薄膜在由不銹鋼製成的基板表面的附著力較好，具有較好的耐磨性。同時鉻鈦膜設置在由鉻製成的附著層及由鉻鈦製成的顏色層之間還能起到顏色過渡的作用，增加色彩的柔和度。
綜上所述，本發明確已符合發明專利之要件，遂依法提出專利申請。惟，以上所述者僅為本發明之較佳實施方式，自不能以此限制本案之申請專利範圍。舉凡熟悉本案技藝之人士援依本發明之精神所作之等效修飾或變化，皆應涵蓋於以下申請專利範圍內。
100．．．薄膜
200．．．基板
10．．．附著層
30．．．應力緩衝層
50．．．顏色層
圖1係本發明較佳實施方式的薄膜的結構示意圖。
圖2係圖1的薄膜的製備方法的流程圖。
100．．．薄膜
200．．．基板
10．．．附著層
30．．．應力緩衝層
50．．．顏色層

Claims (10)

  1. 一種薄膜，其附著在一由不銹鋼製成的基板的表面，且包括依次堆疊在所述基板表面的一附著層、一應力緩衝層及一顏色層，所述附著層由鉻製成；所述應力緩衝層由鈦與鉻的混合物製成；所述顏色層由鈦與鉻的混合物製成。
  2. 如申請專利範圍第1項所述的薄膜，其中，所述應力緩衝層中鈦與鉻的質量比為1：1。
  3. 如申請專利範圍第1項所述的薄膜，其中，所述顏色層中鈦與鉻的質量比為3：1。
  4. 如申請專利範圍第1項所述的薄膜，其中，所述附著層的厚度為0.2~0.25um。
  5. 如申請專利範圍第1項所述的薄膜，其中，所述應力緩衝層的厚度為0.3~0.35um。
  6. 如申請專利範圍第1項所述的薄膜，其中，所述顏色層的厚度為0.4~0.5um。
  7. 一種薄膜的製備方法，其包括如下步驟：提供一由不銹鋼製成的基板；將所述基板放入一第一真空鍍膜腔內，在所述基板的表面鍍上一附著層，所述附著層由鉻製成；將鍍上所述附著層的基板放入一第二真空鍍膜腔內，並在所述附著層的表面鍍上一應力緩衝層，所述應力緩衝層由鈦與鉻的混合物製成；將鍍上應力緩衝層的基板放入一第三真空鍍膜腔內，並在所述應力緩衝層的表面鍍上一顏色層，所述顏色層由鈦與鉻的混合物製成。
  8. 如申請專利範圍第7項所述的薄膜的製備方法，其中，所述第一真空鍍膜腔內的真空壓力為0.5~0.8Pa，以鉻作為靶材，離子轟擊源的功率是10~12KW，偏壓電源的電壓是200~220V，真空濺鍍的時間是600s，所述附著層的厚度為0.2~0.25um，以氬氣作為工作氣體，所述氬氣的流量為500sccm。
  9. 如申請專利範圍第7項所述的薄膜的製備方法，其中，所述第二真空鍍膜腔內的真空壓力為0.5~0.8Pa，在所述第二真空腔內同時放置一鈦靶材及一鉻靶材，所述鈦靶材與所述鉻靶材進行離子轟擊源的功率均是10~12KW，偏壓電源的電壓均為120~130V，真空濺鍍的時間均為600s，所述應力緩衝層的厚度為0.3~0.35um，以氬氣作為工作氣體，所述氬氣的流量為500sccm。
  10. 如申請專利範圍第7項所述的薄膜的製備方法，其中，所述第三真空鍍膜腔內的真空壓力為0.5~0.8Pa，在所述第三真空腔內同時放置一鈦靶材及一鉻靶材，所述鈦靶材與所述鉻靶材進行離子轟擊的偏壓電源的電壓均為80~85V，真空濺鍍的時間均為2700s，所述鈦靶材進行離子轟擊的功率均是30~36KW，所述鉻靶材進行離子轟擊的功率均是10~12KW，所述顏色層的厚度為0.4~0.5um，以氬氣及氧氣作為工作氣體，所述氬氣與氧氣的流量比為1：3，所述氬氣的流量為200sccm，所述氧氣的流量為600sccm。
TW100125543A 2011-07-20 2011-07-20 薄膜及其製備方法 TW201305361A (zh)

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US5403458A (en) * 1993-08-05 1995-04-04 Guardian Industries Corp. Sputter-coating target and method of use
CA2327031C (en) * 1999-11-29 2007-07-03 Vladimir Gorokhovsky Composite vapour deposited coatings and process therefor
DE60124061T2 (de) * 2000-12-28 2007-04-12 Kabushiki Kaisha Kobe Seiko Sho, Kobe Hartstoffschicht für Schneidwerkzeuge
US6679976B2 (en) * 2001-03-16 2004-01-20 4Wave, Inc. System and method for performing sputter deposition with multiple targets using independent ion and electron sources and independent target biasing with DC pulse signals
US6906295B2 (en) * 2003-02-20 2005-06-14 National Material L.P. Foodware with multilayer stick resistant ceramic coating and method of making

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