TW201303243A - Drying apparatus and drying method - Google Patents
Drying apparatus and drying method Download PDFInfo
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- TW201303243A TW201303243A TW100124254A TW100124254A TW201303243A TW 201303243 A TW201303243 A TW 201303243A TW 100124254 A TW100124254 A TW 100124254A TW 100124254 A TW100124254 A TW 100124254A TW 201303243 A TW201303243 A TW 201303243A
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本發明是有關於一種乾燥設備及乾燥方法，且特別是有關於一種運用於液晶面板中乾燥製程之乾燥設備及方法。The present invention relates to a drying apparatus and a drying method, and more particularly to a drying apparatus and method for use in a drying process in a liquid crystal panel.
乾燥設備廣泛運用於液晶面板的製程中，如在液晶面板前段陣列基板製程的去光阻製程中，先利用去光阻液除去基板上之光阻後再予以清洗，並在清洗後加以氣流吹乾基板並除去殘留於基板上之殘留物。Drying equipment is widely used in the manufacturing process of liquid crystal panels. For example, in the photoresist removal process of the array substrate process of the front panel of the liquid crystal panel, the photoresist on the substrate is removed by using the photoresist to be cleaned, and then air-purged after cleaning. The substrate is dried and the residue remaining on the substrate is removed.
隨著面板尺寸之增加，其清洗完後乾燥製程的難度亦為之增加。習知乾燥設備通常設有載台，用以承接待乾燥之基板，並利用風刀裝置吹乾基板。風刀裝置包含管路及噴嘴，氣體通過管路並藉由噴嘴對著載台上之基板噴出，用以吹乾基板並帶離於基板清洗後之殘留物。As the size of the panel increases, the difficulty of the drying process after cleaning is also increased. Conventional drying equipment is usually provided with a stage for receiving the dried substrate and drying the substrate by means of an air knife device. The air knife device includes a pipe and a nozzle, and the gas passes through the pipe and is sprayed toward the substrate on the stage by the nozzle to blow dry the substrate and carry away the residue after cleaning the substrate.
然，習知乾燥設備在乾燥時，會將基板上殘留之微粒吹離基板，微粒因重力吸引而沉積於乾燥設備之底板，且微粒將越積越多。在後續基板乾燥時，沉積於乾燥設備底板之微粒極易由風刀裝置之氣體揚起，再經重力吸引下降而附著於基板上，導致基板在乾燥後仍出現瑕疵。針對上述問題，實有改善之必要。However, when the drying device is dry, the residual particles on the substrate are blown off the substrate, and the particles are deposited by gravity on the bottom plate of the drying device, and the particles will accumulate more. When the subsequent substrate is dried, the particles deposited on the bottom plate of the drying device are easily lifted by the gas of the air knife device, and then attached to the substrate by gravity suction, thereby causing the substrate to be paralyzed after drying. In view of the above problems, there is a need for improvement.
因此，本發明之目的是在提供一種改良的乾燥設備及方法，藉以解決上述先前技術所提及的問題。Accordingly, it is an object of the present invention to provide an improved drying apparatus and method for solving the problems mentioned in the prior art.
根據上述目的，本發明提供一種乾燥設備包含腔室、傳輸裝置、風刀裝置及液體提供裝置。腔室具有底板。傳輸裝置設置於腔室內，用以承接待乾燥物。風刀裝置設置腔室內用以提供氣流以帶離於待乾燥物清洗後之殘留物。液體提供裝置提供液體至腔室之底板。In accordance with the above objects, the present invention provides a drying apparatus comprising a chamber, a transfer device, an air knife device, and a liquid supply device. The chamber has a bottom plate. The transmission device is disposed in the chamber for receiving the dry matter. The air knife device is arranged in the chamber to provide a gas flow to remove the residue after cleaning the object to be dried. The liquid supply device provides liquid to the bottom plate of the chamber.
依據本發明之實施例，液體提供裝置包含複數噴嘴。According to an embodiment of the invention, the liquid supply device comprises a plurality of nozzles.
依據本發明另一實施例，腔室包含一排氣口，設置於該腔室之頂端。According to another embodiment of the invention, the chamber includes an exhaust port disposed at a top end of the chamber.
依據本發明另一實施例，腔室包含一排液口位於該底板上。According to another embodiment of the invention, the chamber includes a drain opening on the bottom plate.
依據本發明另一實施例，傳輸裝置係一載台。According to another embodiment of the invention, the transmission device is a carrier.
依據本發明另一實施例，傳輸裝置係一滾輪傳送裝置。According to another embodiment of the invention, the transport device is a roller transport device.
此外，本發明另提供一種去光阻設備，包含腔室、去光阻裝置、傳輸裝置、風刀裝置及液體提供裝置。腔室具有去光阻區及乾燥區，乾燥區具有底板。去光阻裝置設置於去光阻區內，用以去除一基板上之光阻。傳輸裝置設置於去光阻區，用以承接基板。風刀裝置設置於乾燥區，用以提供一氣流以帶離於基板表面之殘留物。液體提供裝置設置於乾燥區，用以提供一液體至乾燥區的底板。In addition, the present invention further provides a photoresist removal apparatus comprising a chamber, a photoresist removal device, a transmission device, an air knife device, and a liquid supply device. The chamber has a photoresist removal zone and a drying zone, and the drying zone has a bottom plate. The photoresist removal device is disposed in the photoresist region to remove the photoresist on a substrate. The transmission device is disposed in the photoresist region for receiving the substrate. The air knife device is disposed in the drying zone to provide a flow of air to carry residues away from the surface of the substrate. The liquid supply device is disposed in the drying zone to provide a liquid to the bottom plate of the drying zone.
依據本發明之實施例，液體提供裝置包含複數噴嘴。According to an embodiment of the invention, the liquid supply device comprises a plurality of nozzles.
依據本發明另一實施例，腔室包含一排氣口，設置於該腔室之頂端。According to another embodiment of the invention, the chamber includes an exhaust port disposed at a top end of the chamber.
依據本發明另一實施例，腔室包含一排液口位於該底板上。According to another embodiment of the invention, the chamber includes a drain opening on the bottom plate.
依據本發明另一實施例，傳輸裝置係一載台。According to another embodiment of the invention, the transmission device is a carrier.
依據本發明另一實施例，傳輸裝置係一滾輪傳送裝置。According to another embodiment of the invention, the transport device is a roller transport device.
此外，本發明另提供一種乾燥方法，其包含以下步驟。(a)傳輸待乾燥物至腔室；(b)提供一液體完整覆蓋該腔室之底部；以及(c)在步驟(b)後，施加氣流至待乾燥物，用以帶離該待乾燥物表面之殘留物。Further, the present invention further provides a drying method comprising the following steps. (a) transferring the object to be dried to the chamber; (b) providing a liquid to completely cover the bottom of the chamber; and (c) after step (b), applying a gas stream to the object to be dried for carrying away from the drying Residue on the surface of the object.
依據本發明之實施例，乾燥方法更包含在步驟(c)後，排出液體。According to an embodiment of the invention, the drying method further comprises, after step (c), discharging the liquid.
依據本發明另一實施例，乾燥方法更包含排出腔室內的氣流。According to another embodiment of the invention, the drying method further comprises discharging the gas flow within the chamber.
依據本發明另一實施例，其中液體係去離子水。According to another embodiment of the invention, the liquid system is deionized water.
因此，本發明之改良的乾燥設備及方法，利用液體完整覆蓋乾燥製程腔室之底部，藉以有效減低乾燥裝置內微粒的數量，同時減低微粒落至待乾燥物上的數量，進而提昇生產的良率。Therefore, the improved drying apparatus and method of the present invention utilizes a liquid to completely cover the bottom of the drying process chamber, thereby effectively reducing the amount of particles in the drying device and reducing the amount of particles falling on the object to be dried, thereby improving the production quality. rate.
為解決習知技術在乾燥設備內微粒落至待乾燥物上導致良率下降之問題，本發明提供一種降低微粒落至待乾燥物上的方式。解決微粒問題之前，需先找出乾燥設備內微粒來源的可能方式。In order to solve the problem that the prior art particles fall onto the object to be dried in the drying apparatus, resulting in a decrease in yield, the present invention provides a means for reducing the amount of particles falling on the object to be dried. Before solving the particle problem, you need to find out the possible ways of the source of the particles in the drying equipment.
請同時參閱第1圖及第2圖，第1圖係本發明之實施方式之乾燥設備上視示意圖，第2圖係沿第1圖AA’剖線之乾燥設備側視示意圖。Please refer to FIG. 1 and FIG. 2 together. FIG. 1 is a schematic top view of a drying apparatus according to an embodiment of the present invention, and FIG. 2 is a side view of the drying apparatus taken along line AA' of FIG.
乾燥設備100包含腔室105，有關乾燥的相關製程均於腔室105內完成。當乾燥的製程尚未開始時，腔室105內的微粒可能已因前次乾燥製程所留下的物質而附著於腔室105之側壁與底部108。當待乾燥物140(例如液晶顯示器基板)傳送至腔室105時，附著於待乾燥物140之微粒或殘留物亦有可能帶至腔室105內。當乾燥製程執行時，乾燥設備100利用風刀或強力氣流吹乾待乾燥物140，不過也因氣流之關係，會將上述微粒揚起懸浮於腔室105內。微粒經重力吸引，落下的位置有可能落至腔室105之底部108，也有可能落下至腔室105之側壁，也有可能落下至待乾燥物140表面。然而，當乾燥製程進行時，氣流不斷的揚起微粒後再經重力吸附落下，微粒在幾個揚起與落下的循環後，就可能增加微粒落至待乾燥物140表面的機會。就本案欲解決問題而言，希望避免揚起微粒落下至待乾燥物140表面上，以免汙染待乾燥物140。The drying apparatus 100 includes a chamber 105 in which the associated processes related to drying are completed. When the drying process has not begun, the particles within the chamber 105 may have adhered to the sidewalls and bottom 108 of the chamber 105 due to the material left by the previous drying process. When the object to be dried 140 (for example, a liquid crystal display substrate) is transferred to the chamber 105, particles or residues adhering to the object to be dried 140 may also be carried into the chamber 105. When the drying process is performed, the drying apparatus 100 blows the object to be dried 140 by a wind knife or a strong air flow, but also lifts the particles in the chamber 105 due to the air flow. The particles are attracted by gravity, and the dropped position may fall to the bottom portion 108 of the chamber 105, or may fall to the side wall of the chamber 105, or may fall to the surface of the object to be dried 140. However, when the drying process is carried out, the air current is continuously raised and then dropped by gravity, and after several cycles of lifting and falling, the particles may increase the chance of the particles falling on the surface of the object to be dried 140. In order to solve the problem in the present case, it is desirable to avoid lifting particles to fall onto the surface of the object to be dried 140 so as not to contaminate the object to be dried 140.
為了解決上述問題，本案提出的解決方案為在腔室105之底部108先佈滿液體123，藉以使落至腔室105之底部108的微粒不再因氣流而揚起，進而減少腔室105內的微粒，同時也減少微粒落下至待乾燥物140表面的機會。In order to solve the above problem, the solution proposed in the present invention is that the bottom portion 108 of the chamber 105 is first filled with the liquid 123, so that the particles falling to the bottom portion 108 of the chamber 105 are no longer lifted by the air flow, thereby reducing the inside of the chamber 105. The particles also reduce the chance that the particles will fall to the surface of the object to be dried 140.
倘若待乾燥物140經過清洗製程後，送至腔室105時，待乾燥物140上可能殘留有少量清洗之液體。當氣流吹乾待乾燥物140時，一樣將上述腔室105內之微粒揚起懸浮於腔室105，微粒在重力吸引下落至待乾燥物140表面，汙染待乾燥物140，或者少量殘留清洗液體被帶離待乾燥物140後落至腔室105之底部108。此時，落下至殘留清洗液體的微粒便無法再揚起，不過少量之液體無法佈滿腔室105之底部108，加上很快就蒸發，微粒依舊容易揚起進而落下汙染待乾燥物140。因此，當腔室105以氣流進行乾燥製程時，若腔室105的底部108無法佈滿液體，減少腔室105內微粒的效果就會大打折扣。If the object to be dried 140 is sent to the chamber 105 after the cleaning process, a small amount of cleaning liquid may remain on the object to be dried 140. When the airflow blows the object to be dried 140, the particles in the chamber 105 are lifted and suspended in the chamber 105, and the particles are attracted by gravity to the surface of the object to be dried 140, contaminating the object to be dried 140, or a small amount of residual cleaning liquid. After being carried away from the object to be dried 140, it falls to the bottom 108 of the chamber 105. At this time, the particles falling down to the residual cleaning liquid can no longer be lifted, but a small amount of liquid cannot fill the bottom portion 108 of the chamber 105, and the evaporation is quickly evaporated, and the particles are still easily lifted up to fall and contaminate the object to be dried 140. Therefore, when the chamber 105 is air-dried, if the bottom portion 108 of the chamber 105 cannot be filled with liquid, the effect of reducing the particles in the chamber 105 is greatly reduced.
因此，依據本發明之實施例，提供一種乾燥設備100，其包含腔室105、傳輸裝置130及風刀裝置110。Thus, in accordance with an embodiment of the present invention, a drying apparatus 100 is provided that includes a chamber 105, a transfer device 130, and an air knife device 110.
腔室105具有底板108，而傳輸裝置130設置於腔室105內部，係用以承接經過半導體製程清洗後之待乾燥物140，例如液晶顯示器製程，在除去基板上之光阻後，需要清洗基板。風刀裝置110亦設置腔室105內，用以提供氣流113以帶離於待乾燥物140清洗後之殘留物。值得一提的是，在腔室105之底板108需具有液體123完整覆蓋於底板108。藉此，一旦腔室105中之微粒180降落在覆蓋於底板108之液體123時，因微粒180無法再被氣流113揚起，故可以有效的降低微粒180持續在腔室105內飄浮移動而落至待乾燥物140上導致良率降低的問題。又，經過實驗的驗證，液體只覆蓋於底板108的小部份時，例如少量殘留清洗液體覆蓋於底板108時，腔室內量測之微粒180可高達在每0.6立方米內具有1000顆左右，但當液體123完整覆蓋於底板108時，腔室內量測之微粒180降至在每0.6立方米內具有約20顆，故當液體123完整覆蓋於底板108時，降低微粒數量的效果最好。The chamber 105 has a bottom plate 108, and the transfer device 130 is disposed inside the chamber 105 for receiving the workpiece 140 to be dried after being cleaned by a semiconductor process, such as a liquid crystal display process. After removing the photoresist on the substrate, the substrate needs to be cleaned. . The air knife device 110 is also disposed within the chamber 105 for providing a gas stream 113 to carry away residue from the object to be dried 140 after cleaning. It is worth mentioning that the bottom plate 108 of the chamber 105 needs to have a liquid 123 completely covering the bottom plate 108. Thereby, once the particles 180 in the chamber 105 land on the liquid 123 covering the bottom plate 108, since the particles 180 can no longer be lifted by the air stream 113, the particles 180 can be effectively reduced to continuously float in the chamber 105. The problem of a decrease in yield is caused to the object to be dried 140. Moreover, it has been experimentally verified that when the liquid covers only a small portion of the bottom plate 108, for example, when a small amount of residual cleaning liquid covers the bottom plate 108, the particles 180 measured in the chamber can be as high as about 1000 particles per 0.6 cubic meters. However, when the liquid 123 completely covers the bottom plate 108, the particles 180 measured in the chamber are reduced to about 20 per 0.6 cubic meters, so that when the liquid 123 completely covers the bottom plate 108, the effect of reducing the number of particles is best.
本發明腔室105之底板108所覆蓋之液體123可由液體提供裝置120所提供或其他任何適用的方式提供。液體提供裝置120被設置鄰近於腔室105之底板108，具有管路121與複數個噴嘴122，管路121係由腔室105外傳送液體再經複數個噴嘴122噴灑至腔室105之底板108。複數個噴嘴122彼此依適當之距離(例如等間距)設置於管路121上，使得複數個噴嘴122均勻的噴灑液體而完整覆蓋底板108。The liquid 123 covered by the bottom plate 108 of the chamber 105 of the present invention may be provided by the liquid providing device 120 or in any other suitable manner. The liquid supply device 120 is disposed adjacent to the bottom plate 108 of the chamber 105, having a conduit 121 and a plurality of nozzles 122. The conduit 121 is delivered from the outside of the chamber 105 and then sprayed through a plurality of nozzles 122 to the bottom plate 108 of the chamber 105. . A plurality of nozzles 122 are disposed on the conduit 121 at an appropriate distance (e.g., equidistant) such that the plurality of nozzles 122 uniformly spray liquid to completely cover the bottom plate 108.
依據本發明之實施例，傳輸裝置為載台130，載台130由可控制之機械手臂所持扶。載台130上可設置若干吸盤進一步牢牢吸附待乾燥物140。當待乾燥物140經過清洗後，載台130承接待乾燥物140後，風刀裝置110則接近待乾燥物140，對準待乾燥物140噴出氣流以進行乾燥，並且帶離殘留於待乾燥物140表面之殘留物。風刀裝置110具有管路111及噴嘴112，而氣流113可藉由管路111由外部運送至腔室105內並由噴嘴112噴出。In accordance with an embodiment of the present invention, the transport device is a stage 130 that is held by a controllable robotic arm. A plurality of suction cups may be disposed on the stage 130 to further firmly adsorb the object to be dried 140. After the object to be dried 140 has been cleaned, after the stage 130 receives the dried object 140, the air knife device 110 approaches the object to be dried 140, and the airflow is discharged to the object to be dried 140 for drying, and the residue remains on the object to be dried. Residue on the surface of 140. The air knife device 110 has a line 111 and a nozzle 112, and the air stream 113 can be externally transported into the chamber 105 by the line 111 and ejected by the nozzle 112.
因腔室105底板108已被液體完整的覆蓋住，故當風刀裝置110提供氣流113乾燥清潔待乾燥物140時，腔室105內原有之微粒180揚起飄浮於腔室105中，經重力吸引落下至液體123後，再也無法被氣流113揚起於腔室105中，故腔室的微粒180數量有效地降低，也同時提高了製程的良率。Since the bottom plate 108 of the chamber 105 has been completely covered by the liquid, when the air knife device 110 provides the airflow 113 to dry and clean the object to be dried 140, the original particles 180 in the chamber 105 rise and float in the chamber 105. After the gravity suction drops to the liquid 123, it can no longer be lifted by the airflow 113 in the chamber 105, so the number of particles 180 in the chamber is effectively reduced, and the yield of the process is also improved.
在本發明的實施例中，腔室105亦可包含了排氣口150，位於腔室105之頂端。當風刀裝置110作動時腔室105可藉排氣口150將多餘之氣流排除於腔室105外，並同時帶走飄浮於腔室的微粒。此外，本發明腔室105之底部108包含了排液口160，藉以排出液體123。而排液口160排液體的時機，可視液體提供裝置120所提供的水量或者製程的便利性來決定，可以隨著每片待乾燥物140乾燥完後即排出液體123，抑或等待乾燥完數片待乾燥物140後再一次排出適當量的液體123。當液體123排出腔室105時，液體123內所含的微粒180亦隨之被排出腔室105外。關於液體123的選擇，只要不造成腔室105污染的液體均適用，例如去離子水。In an embodiment of the invention, the chamber 105 may also include an exhaust port 150 located at the top end of the chamber 105. When the air knife device 110 is actuated, the chamber 105 can exclude excess airflow from the chamber 105 through the exhaust port 150, and simultaneously take away particles floating in the chamber. Further, the bottom portion 108 of the chamber 105 of the present invention includes a drain port 160 through which the liquid 123 is discharged. The timing of discharging the liquid from the liquid discharge port 160 may be determined by the amount of water provided by the liquid supply device 120 or the convenience of the process. The liquid 123 may be discharged after each piece of the object to be dried 140 is dried, or may be dried. An appropriate amount of liquid 123 is again discharged after the object 140 to be dried. When the liquid 123 exits the chamber 105, the particles 180 contained in the liquid 123 are also discharged outside the chamber 105. Regarding the selection of the liquid 123, any liquid that does not cause contamination of the chamber 105 is suitable, such as deionized water.
請同時參閱第3圖及第4圖，第3圖係本發明另一實施例之乾燥設備上視示意圖，第4圖係沿第3圖BB’剖線之乾燥設備側視示意圖。Please refer to FIG. 3 and FIG. 4 at the same time. FIG. 3 is a schematic top view of a drying apparatus according to another embodiment of the present invention, and FIG. 4 is a side view of the drying apparatus taken along line BB' of FIG.
在此乾燥設備100’中，傳輸裝置為滾輪傳送裝置135，滾輪傳送裝置135包括複數個軸承136及複數個滾輪137。複數個軸承136彼此依適當之距離間隔排開並設置於腔室105內，而每一軸承136設置複數個滾輪137，滾輪137依適當之距離彼此間隔開(例如等間距)，如此，待乾燥物140則可由腔室105之一端進入置放於滾輪137上，隨著滾輪137滾動將待乾燥物140傳送至腔室105之另一端，如圖示箭頭方向所示。兩組風刀裝置110分別設置於接近於待乾燥物140之上表面以及下表面處，以不干涉滾輪傳送裝置135之運作為原則。風刀裝置110之結構與上述第1、2圖之實施例相同。相同地，在腔室105之底部108先佈滿液體123，藉以使落至液體123表面的微粒180不再因氣流而揚起，進而減少腔室105內的微粒，同時也減少微粒落下至待乾燥物140的機會。In this drying apparatus 100', the transporting device is a roller transporting device 135, and the roller transporting device 135 includes a plurality of bearings 136 and a plurality of rollers 137. A plurality of bearings 136 are spaced apart from each other at an appropriate distance and disposed within the chamber 105, and each of the bearings 136 is provided with a plurality of rollers 137 spaced apart from each other by an appropriate distance (e.g., equidistant), thus, to be dried The object 140 can be placed on one of the chambers 105 and placed on the roller 137. As the roller 137 rolls, the object to be dried 140 is transferred to the other end of the chamber 105, as indicated by the direction of the arrow. The two sets of air knife devices 110 are respectively disposed near the upper surface and the lower surface of the object to be dried 140, so as not to interfere with the operation of the roller conveyor 135. The structure of the air knife device 110 is the same as that of the first and second embodiments described above. Similarly, the bottom portion 108 of the chamber 105 is first filled with the liquid 123, so that the particles 180 falling on the surface of the liquid 123 are no longer lifted by the air flow, thereby reducing the particles in the chamber 105, and also reducing the particles falling to the surface. The chance of drying 140.
在本實施例中，腔室105同樣包含了排氣口150與排液口160，藉排氣口150將氣流排出於腔室105外，以及藉排液口160排出液體123至腔室105外。當液體123排出腔室105時，液體123內所含的微粒180亦隨之被排出腔室105外。In the present embodiment, the chamber 105 also includes an exhaust port 150 and a drain port 160. The exhaust port 150 discharges the airflow outside the chamber 105, and the drain port 160 discharges the liquid 123 to the outside of the chamber 105. . When the liquid 123 exits the chamber 105, the particles 180 contained in the liquid 123 are also discharged outside the chamber 105.
此外，本發明亦提供一種乾燥方法，請參第5圖，其繪示本發明之實施方式之乾燥方法流程圖。In addition, the present invention also provides a drying method, please refer to FIG. 5, which illustrates a flow chart of a drying method according to an embodiment of the present invention.
在步驟210，傳輸清洗後之待乾燥物至腔室，係藉由傳輸裝置傳輸待乾燥物至腔室內，在腔室內進行乾燥之步驟。其中，傳輸裝置可為前述第1圖之載台130或前述第3圖之滾輪傳送裝置135等等。In step 210, the cleaned object to be dried is transferred to the chamber, and the drying device is transported into the chamber by a transport device to perform drying in the chamber. The transport device may be the stage 130 of the first figure or the wheel transfer unit 135 of the third figure described above.
在步驟220中，提供液體完整覆蓋腔室之底部，利用如前述第1圖之液體提供裝置來提供液體完整覆蓋腔室之底部。步驟220需在步驟230前執行，藉以使落至液體表面的微粒不再因氣流而揚起，進而減少腔室105內的微粒，同時也減少微粒落下至待乾燥物140的機會。In step 220, a liquid is provided to completely cover the bottom of the chamber, and the liquid supply means as in the first aspect of Fig. 1 is used to provide a liquid to completely cover the bottom of the chamber. Step 220 is performed prior to step 230 whereby particles falling on the surface of the liquid are no longer lifted by the gas stream, thereby reducing particulates within the chamber 105 while also reducing the chance of particles falling to the object 140 to be dried.
在步驟230中，使用風刀裝置施加氣流至待乾燥物，用以帶離待乾燥物清洗後之殘留物。此步驟執行時可同時排出氣流，使腔室內之壓力保持穩定平衡之狀態。在步驟230後，可排出液體，其頻率可為每次乾燥製程後隨即排出液體或等數次乾燥製程完成後再行排出液體。In step 230, an air flow is applied to the object to be dried using an air knife device to carry away the residue after washing the object to be dried. When this step is performed, the airflow can be simultaneously exhausted, so that the pressure in the chamber is kept in a stable and balanced state. After step 230, the liquid can be discharged at a frequency such that the liquid is discharged immediately after each drying process or after several drying processes are completed, and then the liquid is discharged.
根據上述之實施例可知，本發明之改良的乾燥設備及方法，利用液體完整覆蓋乾燥製程腔室之底部，藉以有效減低乾燥設備內微粒的數量，同時減低微粒落至待乾燥物上的數量，進而提昇生產的良率。According to the above embodiments, the improved drying apparatus and method of the present invention completely covers the bottom of the drying process chamber by using the liquid, thereby effectively reducing the amount of particles in the drying device and reducing the amount of particles falling on the object to be dried. In turn, the yield of production is improved.
請參閱第6圖，其繪示本發明另一實施例之去光阻設備上視示意圖。Please refer to FIG. 6 , which is a schematic top view of a photoresist device according to another embodiment of the present invention.
去光阻設備300具有腔室305，腔室305內包含去光阻區310、乾燥區320以及一傳輸裝置335。The photoresist removal device 300 has a chamber 305 containing a photoresist removal region 310, a drying region 320, and a transport device 335.
腔室305內之去光阻區310，用於執行去光阻製程以除去基板340上所形成之光阻。在除去光阻後，傳輸裝置335會將基板340從去光阻區310傳送至乾燥區320，以進行基板340後續的乾燥步驟。其中，傳輸裝置335可為前述實施例中提及之載台，亦可為滾輪傳送裝置，在此不另贅述。The photoresist region 310 in the chamber 305 is used to perform a photoresist removal process to remove the photoresist formed on the substrate 340. After the photoresist is removed, the transfer device 335 transfers the substrate 340 from the photoresist region 310 to the drying region 320 for subsequent drying of the substrate 340. The transmission device 335 may be the carrier mentioned in the foregoing embodiment, or may be a roller transmission device, and details are not described herein.
腔室305內之乾燥區320與前述乾燥設備之設置相似，乾燥區320具有乾燥腔室、風刀裝置、及液體提供裝置，其中風刀裝置提供氣流以帶離於基板340表面之殘留物。液體提供裝置用以提供液體至乾燥腔室之底板。底板設有排液口，以排出多餘之液體。乾燥腔室設有排氣口，用以排出多餘之氣體。其中，風刀裝置、液體提供裝置、排氣口及排液口之結構可為前述實施例中提及各實施態樣，故不再贅述。The drying zone 320 in the chamber 305 is similar to the arrangement of the drying apparatus described above. The drying zone 320 has a drying chamber, an air knife device, and a liquid supply device, wherein the air knife device provides airflow to carry residues away from the surface of the substrate 340. A liquid supply device is provided to supply liquid to the bottom plate of the drying chamber. The bottom plate is provided with a drain to drain excess liquid. The drying chamber is provided with an exhaust port for discharging excess gas. The structure of the air knife device, the liquid supply device, the exhaust port and the liquid discharge port can be the embodiments mentioned in the foregoing embodiments, and therefore will not be described again.
根據上述之實施例可知，本發明之去光阻設備，利用液體完整覆蓋乾燥區之底板，藉以有效減低乾燥設備內微粒的數量，同時減低微粒落至待乾燥物上的數量，進而提昇生產的良率。According to the above embodiments, the photoresist removal device of the present invention completely covers the bottom plate of the drying zone by using the liquid, thereby effectively reducing the amount of particles in the drying device, and reducing the amount of particles falling on the object to be dried, thereby improving production. Yield.
雖然本發明已以實施方式揭露如上，然其並非用以限定本發明，任何熟習此技藝者，在不脫離本發明之精神和範圍內，當可作各種之更動與潤飾，因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and the present invention can be modified and modified without departing from the spirit and scope of the present invention. The scope is subject to the definition of the scope of the patent application attached.
100．．．乾燥設備100. . . Drying equipment
100’．．．乾燥設備100’. . . Drying equipment
105．．．腔室105. . . Chamber
108．．．底板108. . . Bottom plate
110．．．風刀裝置110. . . Air knife device
111．．．管路111. . . Pipeline
112．．．噴嘴112. . . nozzle
113．．．氣流113. . . airflow
120．．．液體提供裝置120. . . Liquid supply device
121．．．管路121. . . Pipeline
122．．．噴嘴122. . . nozzle
123．．．液體123. . . liquid
130．．．載台130. . . Loading platform
135．．．滾輪傳送裝置135. . . Roller conveyor
136．．．軸承136. . . Bearing
137．．．滾輪137. . . Wheel
140．．．待乾燥物140. . . Dry matter
150．．．排氣口150. . . exhaust vent
160．．．排液口160. . . Drain port
180．．．微粒180. . . particle
210．．．步驟210. . . step
220．．．步驟220. . . step
230．．．步驟230. . . step
300．．．去光阻設備300. . . De-resisting device
305．．．腔室305. . . Chamber
310．．．去光阻區310. . . Deblocking area
320．．．乾燥區320. . . Drying area
335．．．傳輸裝置335. . . Transmission device
340．．．基板340. . . Substrate
為讓本發明之上述和其他目的、特徵、優點與實施例能更明顯易懂，所附圖式之說明如下：The above and other objects, features, advantages and embodiments of the present invention will become more apparent and understood.
第1圖繪示本發明之實施方式之乾燥設備上視示意圖。FIG. 1 is a schematic top view of a drying apparatus according to an embodiment of the present invention.
第2圖繪示本發明之實施方式沿第1圖A-A’剖面線之乾燥設備剖面示意圖。Fig. 2 is a cross-sectional view showing the drying apparatus of the embodiment of the present invention taken along line A-A' of Fig. 1.
第3圖繪示本發明另一實施方式之乾燥設備上視示意圖。FIG. 3 is a schematic top view of a drying apparatus according to another embodiment of the present invention.
第4圖繪示本發明另一實施方式沿第3圖B-B’剖面線之乾燥設備剖面示意圖。Fig. 4 is a schematic cross-sectional view showing a drying apparatus taken along line B-B' of Fig. 3 according to another embodiment of the present invention.
第5圖繪示本發明之實施方式之乾燥方法流程圖。Figure 5 is a flow chart showing the drying method of the embodiment of the present invention.
第6圖繪示本發明之另一實施方式之去光阻設備上視示意圖。FIG. 6 is a schematic top view of a photoresist device according to another embodiment of the present invention.
100．．．乾燥設備100. . . Drying equipment
105．．．腔室105. . . Chamber
110．．．風刀裝置110. . . Air knife device
111．．．管路111. . . Pipeline
112．．．噴嘴112. . . nozzle
113．．．氣流113. . . airflow
120．．．液體提供裝置120. . . Liquid supply device
121．．．管路121. . . Pipeline
122．．．噴嘴122. . . nozzle
130．．．載台130. . . Loading platform
140．．．待乾燥物140. . . Dry matter
150．．．排氣口150. . . exhaust vent
160．．．排液口160. . . Drain port
180．．．微粒180. . . particle
Claims (16)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
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| TW100124254A TWI522589B (en) | 2011-07-08 | 2011-07-08 | Drying apparatus and drying method |
| CN201110271373.9A CN102435058B (en) | 2011-07-08 | 2011-09-06 | Drying equipment, photoresist removing equipment and drying method |
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| TW100124254A TWI522589B (en) | 2011-07-08 | 2011-07-08 | Drying apparatus and drying method |
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| TWI522589B TWI522589B (en) | 2016-02-21 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI565923B (en) * | 2013-05-21 | 2017-01-11 | Air knife structure |
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|---|---|---|---|---|
| CN104538332B (en) * | 2014-12-12 | 2017-06-27 | 深圳市华星光电技术有限公司 | A kind of chamber structure of wet process board |
| CN106842836A (en) * | 2017-04-05 | 2017-06-13 | 武汉华星光电技术有限公司 | Drying device and the exposure imaging equipment with the drying device |
| CN112985043A (en) * | 2019-12-17 | 2021-06-18 | 亚智科技股份有限公司 | Air knife structure and mechanism thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP3230051B2 (en) * | 1997-05-16 | 2001-11-19 | 東京エレクトロン株式会社 | Drying method and apparatus |
| JP3918401B2 (en) * | 1999-05-31 | 2007-05-23 | 株式会社日立ハイテクノロジーズ | Substrate drying apparatus, drying method, and substrate manufacturing method |
| CN2541872Y (en) * | 2001-04-06 | 2003-03-26 | 铼宝科技股份有限公司 | Photoresist stripper |
| JP3868804B2 (en) * | 2001-11-27 | 2007-01-17 | アルプス電気株式会社 | Substrate drying apparatus and substrate drying method using the same |
| JP4128040B2 (en) * | 2002-07-16 | 2008-07-30 | アルプス電気株式会社 | Drying equipment |
| JP4647378B2 (en) * | 2005-04-20 | 2011-03-09 | 協和化工株式会社 | Drying equipment |
| KR20080090070A (en) * | 2007-04-04 | 2008-10-08 | 삼성전자주식회사 | Air knife and apparatus drying substrates having the same |
| CN201271209Y (en) * | 2008-09-16 | 2009-07-15 | 王�琦 | Novel broom |
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2011
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI565923B (en) * | 2013-05-21 | 2017-01-11 | Air knife structure |
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| TWI522589B (en) | 2016-02-21 |
| CN102435058B (en) | 2014-06-11 |
| CN102435058A (en) | 2012-05-02 |
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