201245872 六、發明說明： 【發明所屬之技術嘴域】 發明領域 本發明關於一種光硬化性樹脂組成物、使用光硬化性 樹脂組成物之硬化物做為絕緣層之觸控面板以及具有該觸 控面板之影像顯示裝置。 八 ^ C先前3 發明背景 内藏觸控面板之智慧型手機、個人電腦及遊戲機等， 操作者可藉由於畫面以手或筆_操作。該等裝置，由於 可藉由按壓及滑動畫面表示部份等’易直覺理解之方法操 作，非常容易使用，其市場正急速擴大中。 該觸控面板之感應器部份，通常可藉於透明美板^上， 將汀0電極2及4、絕緣層3、保護層5及輸出電極蜱以所欲 之形狀圖案成形積層而製得。 在此，絕緣層之成膜，係藉於IT〇電極等積層體上，塗 、 ••力 而進行。又，為 防止攜帶時破損，絕緣層需要具有一定之硬度。因此，用 於絕緣層成膜之光硬化性樹脂組成物，需要硬度、對IT〇 之密合性及而ί熱性。 在此，有於觸控面板中ΙΤ0電極等之上積層丨層絕緣 層’以及如第1⑷-1(b)圖所示積層複數絕緣層之情形。積層 1層絕緣層時’以及積層複數層時最上層之絕緣層，將要求 達到做為保制之功用、做絲聽朗可耐基板搬送時 201245872 接觸之高硬度以及從圖案化精度觀點來看之高顯影性。 又，觸控面板中，有感應器部份與濾色片個別製造而 將該等組合之類型與1片透明基板之一面上製造感應器部 份，其背面積層著色層等而製造濾色片之一體型。特別是 當與濾色片一體型之情況下，由於除感應器部份製造之加 熱步驟外，更有著色層（R、G及B)等積層亦須加熱，因此絕 緣層將用於多數之加熱步驟。因此，此時絕緣層需要非常 高之财熱性。 但是，習知觸控面板絕緣層用之樹脂組成物（專利文獻 1)，其硬度、顯影性、對於ITO之密合性以及耐熱性未能全 部滿足，而期望該種樹脂組成物之開發。 先行技術文獻 專利文獻 專利文獻1曰本特開2010-27033號公報 C發明内容3 發明概要 發明欲解決之課題 本發明課題為提供一種光硬化性樹脂組成物，係顯影 性高，且製得硬化物之硬度 '對於IT0之密合性及耐熱性高 者。 用以解決課題之手段 如前述狀況下’本發明者積極研究累積之結果，發現 於具有羧基之丙烯酸樹脂、多官能單體及聚合起始劑，再 摻混有機-無機混成材之光硬化性樹脂組成物，其顯影性 4 201245872 高，且使用該組成物時，可製得硬度、對IT〇之密合性及耐 熱性高之硬化物。本發明係奠基於前述新知。 因此，本發明提供以下項目： 項1. 裡尤硬化性樹脂組成物，含有具羧基之丙烯酸 樹脂、多官能單體、有機-無機混成材及聚合起始劑。 項2·項1記載之光硬化性樹脂組成物，其中有機無機 混成材係選自於由含甲基丙稀醯基等不飽和基之节石— 烷、丙烯酸/二氧化矽混合物、胺甲酸乙酯/二氣Λ夕氣 物、含丙烯酸酯基矽烷募聚物、含氫硫基矽烷寡聚 ° 倍半氧烧化合物所構成群組中之至少一種。 夕 項3. —種觸控面板之製造方法，係製造具有 板、ΙΤΟ電極及絕緣層之觸控面板者，該方法含有以下果月基 將如項1記載之光硬化性樹脂組成物以接觸ΙΤ〇 騍， 式塗佈之步驟； 於該光硬化性樹脂組成物上載置具有預定形狀開口 案之光罩，進行活性能量線照射，行顯影處理之步驟. 及 ， 將顯影處理後之光硬化性樹脂組成物加熱， 層之步驟。 製造絕 緣 項4· 一種觸控面板，其絕緣層之全部或一部分係由 項1 s己載之光硬化性樹脂組成物之硬化物構成。 項5. 種影像顯示裝置，係具備項4記載之觸控面板 項6.—種絕緣層之製造方法，含有以下步驟： 將如項1記載之光硬化性樹脂組成物以接觸Ιτ 电極方 201245872 式塗佈之步驟； 於該光硬化性樹脂組成物上載置具有預定形狀開口圖 案之光罩，進行活性能量線照射，行顯影處理之步驟；以 及， 將顯影處理後之光硬化性樹脂組成物加熱之步驟。 發明效果 本發明之光硬化性樹脂組成物，顯影性高’且使用該 組成物可製得硬度、對ITO之密合性及耐熱性高之硬化物。 因此，本發明之光硬化性樹脂組成物適於觸控面板之絕緣 層，特別是保護層之製造，其藉由圖案化成形，而需要耐 製造步驟中嚴酷之高溫條件，為密合於ITO之構件，且位於 裝置表面。又，從顯影性高、硬化物對ITO之密合性及耐熱 性高之觀點來看，亦適於電容式觸控面板之絕緣層材料。 圖式簡單說明 1第l(a)-l(b)圖係概略表示一般觸控面板。 【實施方式】 用以實施發明之形態 1.光硬化性樹脂組成物 本發明提供一種光硬化性樹脂組成物，含有具羧基之 丙烯酸樹脂、多官能單體、有機_無機混成材及聚合起始劑。 具羧基之丙烯酸樹脂 本發明之光硬化性樹脂組成物含有具羧基之丙烯酸樹 月曰。该具羧基之丙烯酸樹脂，除具有uv硬化性外，因其羧 基，可賦予鹼性顯影性等。 6 201245872 具羧基之丙稀酸樹脂’無特別限定，可舉例如於具有 對羧基反應性取代基之丙烯酸共聚合體，使含有2個羧基之 化合物或其無水物反應製得者；含羧基（曱基）丙烯酸酯單體 與其他（曱基）丙烯酸酿單體（不具有羧基之（甲基）丙烯酸酯 單體）共聚合而製得者等。又，具有對羧基反應性取代基之 丙烯酸共聚合體中，除具有對羧基反應性取代基之（甲基） 丙烯酸酯單體與其他（甲基）丙烯酸酯單體（不具有對羧基反 應性取代基之（曱基）丙烯酸酯單體)之共聚合體外，亦含有 具叛基（甲基）丙稀酸酷單體與不具有羧基之（甲基）丙烯酸 醋單體之共聚體之絲i，使環氧丙基（曱基）丙稀酸醋反應 之化合物(所製得共聚合體具有減心又，前述聚合反 應’亦可應需要添加可與（曱基）丙烯酸g|單體共聚合之單體 為原料。 本說明書中’「（曱基）丙烯酸酯」表示丙烯酸酯或曱基 兩稀酸醋。同樣地，「（甲基）丙稀酸」表示丙稀酸或甲基丙 婦酸。 (甲土）丙稀馱酯單體可舉例如曱基（甲基）丙烯酸酯、乙 基（甲基）丙稀酸酷、丙基（甲基）丙稀酸_及丁基（甲基）丙稀 酸單體等燒基(曱基)丙缚酸西旨；（曱基)丙婦g曼等含錄基（甲 基）丙烯酸能；2·經乙基（甲基）丙稀酸醋、2-經丁基（曱基) 丙棘义及2-經丁基(甲基)丙稀酸醋等含經基（曱基)丙稀酸 S曰—氟乙基甲基丙稀酸g旨、2_(全氟丁基）乙基甲基 丙烯欠曰2'(全氟己基）乙基甲基丙烯酸酯及2-(全氟丁基) 缔、能荨含氟（曱基）丙稀酸酯；M-經曱基（甲基) 201245872 丙烯醯胺及二甲基丙烯醯胺等（甲基）丙烯醯胺；二曱基胺乙 基（曱基）丙烯酸酯、環氧丙基（曱基）丙烯酸酯、3,4-環氧丁 基（曱基）丙烯酸酯及2-甲基-3,4-環氧基-環己基（曱基）丙烯 酸酯等單體。 具有對羧基反應性取代基之（甲基）丙烯酸酯單體，可舉 例如環氧丙基（甲基）丙烯酸酯、3,4-環氧丁基（甲基）丙烯酸 酯及2-甲基-3,4-環氧基-環己基（甲基）丙烯酸酯等。該等具 有對羧基反應性取代基之（甲基）丙烯酸酯，可1種單獨或2 種以上組合使用。 不具有對羧基反應性取代基之（曱基）丙烯酸酯單體，可 舉例如（甲基）丙烯酸、曱基（甲基）丙烯酸酯、乙基（曱基）丙 烯酸酯、丁基（甲基）丙烯酸酯、2-羥乙基（曱基）丙烯酸酯、 N-羥曱基（甲基）丙烯醯胺、2-羥丁基（曱基）丙烯酸|旨、2-羥 丁基（甲基）丙烯酸酯、二甲基丙烯酿胺、二甲基胺乙基（甲 基）丙烯酸酯及環氧丙基（曱基）丙烯酸酯等單體。該等具有 對羧基反應性取代基之（甲基）丙烯酸酯單體，可1種單獨或2 種以上組合使用。 含有羧基之（曱基）丙烯酸單體可舉（曱基）丙烯酸等。含 有羧基之（甲基）丙烯酸單體，可1種單獨或2種以上組合使 用。 不含有叛基之（曱基）丙烯酸酯單體，可舉例如曱基（甲 基）丙烯酸酯、乙基（曱基）丙烯酸酯、丁基（曱基）丙烯酸酯、 2-經乙基（甲基）丙烯義、N_m曱基（甲基）丙稀_、2-經 丁基（曱基）丙烯酸酯、2-羥丁基（曱基）丙烯酸酯、二甲基丙 8 201245872 稀酸醋、二曱基胺乙基（甲基)丙稀酸酿環氧丙基（甲基)丙 烯酉欠自曰環氧丁基（甲基）丙烯酸酯及2-甲基-3,4-環氧基_ 環^基（曱基)丙稀酸醋等。該等不含有絲之（曱基)丙稀酸 酯單體’可1種單獨或2種以上組合使用。 具有2個羧基之化合物或其無水物，可舉例如順丁烯二 酉文丁晞一酸、丁二酸、已二酸、癸二酸及該等之無水物 等。為調製樹脂組成物之光硬化性，宜為順讀二酸及丁 烯二酸等含聚合性不飽和基化合物。 可與（曱基)丙烯酸酿單體共聚合之單體，可舉例如乙稀 單體及丙烯單鮮。該村與（曱基)丙_g|相共聚合之 單體，可1種單獨或2種以上組合使用。 乙烯單體可舉例如笨乙烯等單體，但不限為該等物質。 m本發明中，具有對叛基反應性取代基之（甲基）丙烯酸酉旨 單體及7或含有誠之（曱基)丙雜單體之摻混比率，該等 合叶董宜為單體原料全體之2Q〜9〇重量％，較宜為5〇〜7〇重 量％ » 本發明中，為提高滑動性，具有羧基之丙烯酸樹脂， 原料單體宜含前述含氟（曱基）丙烯酸酯。 摻混含氟（曱基）丙烯酸酯時，其比率宜為單體原料全體 之0.1〜8重量％，較宜為2〜4重量0/〇。 具有缓基之丙烯酸樹脂之酸價，宜為3〇〜2〇〇 mgKOH/g，較宜為50〜150mgK〇H/g。具有絲之丙稀酸樹 月玲’藉使用具有前述範圍酸價者，可製得顯影性高，且對 基板达、合度兩之樹脂組成物，因此為適宜。 9 201245872 又，具有緩基之丙烯酸樹脂之酸價，可依照j〗S κ 測定。 又具有幾基之丙稀酸樹脂之重量平均分子量宜為 5000〜100000,較宜為1〇〇〇〇〜3〇〇〇〇β具有叛基之丙稀酸樹 脂，藉使用具有前述範圍之酸價者，圖案曝光時之圖案形 狀將易控制，抑制圖案製作後最終膜厚減少（膜厚損失)之問 題，且保護層化時黏度將不易過高，因此為適宜。又，本 發明之重量平均分子量，係藉由凝膠滲透層析（Gpc)測定 時，聚苯乙烯換算之重量平均分子量。 多官能單體 本發明之光硬化性樹脂組成物中，為提高交聯密度及 硬度，而摻混多官能單體。此等多官能單體，係具有複數 聚合性官能基，藉由光照射可使前述多官能單體及前述聚 合物聚合者即可。此等多官能單體，通常使用具有丙烯醯 基或曱基丙烯醯基之多官能（甲基）丙烯酸酯。前述多官能 (甲基）丙稀酸酯可舉二官能（甲基）丙烯酸酯及三官能以上 之（甲基）丙稀酸酷。 二官能（甲基）丙烯酸酯，可舉例如乙二醇二（甲基）丙烯 酸8旨、二乙二醇二（曱基）丙烯酸酯、己二醇（曱基）丙烯酸 酯、長鏈脂肪族二（曱基）丙烯酸酯、新戊二醇二（甲基）丙烯 酸0曰、經基三甲基乙酸新戊二醇二（甲基）丙烯酸酯、十八烷 酸變性新戊四醇二（甲基）丙烯酸酯、伸丙基二（甲基）丙烯酸 西旨、（曱基）丙烯酸甘油酯、三乙二醇二（甲基）丙烯酸酯、四 乙一醇二（甲基）丙烯酸酯、四曱二醇二（曱基）丙烯酸酯、丁 10 201245872 二醇二（曱基）丙烯酸酯、二環戊基二（甲基）丙烯酸酯、聚乙 二醇二（曱基）丙烯酸酯、聚伸丙基二（甲基）丙烯酸酯、二（甲 基）丙烯酸三甘油酯、新戊二醇變性三羥曱基丙烷二（甲基） 丙烯酸酯、丙烯化環己基二（甲基）丙烯酸酯、曱氧化環己基 二（甲基）丙烯酸酯、丙烯酸化三聚異氰酸酯、二（丙烯醯氧 基新戊二醇）己二酸酯、雙酚A二（曱基）丙烯酸酯、四溴雙酚 A二（甲基）丙烯酸酯、雙酚S二（甲基）丙烯酸酯、丁二醇二（曱 基)丙烯酸酯、鄰苯二甲酸二（甲基）丙烯酸酯、磷酸二（曱基） 丙烯酸酯及二（甲基）丙烯酸鋅等。 又，三官能以上之（甲基）丙烯酸酯，可舉例如三羥甲基 丙烷三（曱基）丙烯酸酯、三羥曱基乙烷三（曱基）丙烯酸酯、 三（曱基）丙烯酸甘油酯、新戊四醇二（曱基）丙烯酸酯、新戊 四醇三（甲基）丙烯酸酯、烷基變性二新戊四醇三（甲基）丙烯 酸酯、磷酸三（甲基）丙烯酸酯、三（丙烯醯氧基乙基)三聚異 氰酸酯、三（曱基丙稀酿氧基乙基)三聚異氰酸醋、新戍四醇 四（甲基）丙烯酸酯、二新戊四醇四（曱基）丙烯酸酯、二三羥 曱基丙院四丙稀酸酯、院基變性二新戍四醇四（曱基）丙稀酸 酯、二新戊四醇單羥基五（甲基）丙烯酸酯、二新戊四醇六（甲 基）丙稀酸酯、二新戊四醇五（曱基）丙烯酸g旨、烧基變性二 新戊四醇五（甲基）丙稀酸酯、叛酸變性二新戊四醇五（甲基) 丙浠酸酯、聚氨酯三（曱基）丙烯酸酯、酯類三（甲基）丙稀酸 S旨、聚歲S曰六（甲基）丙稀酸S旨及S旨類六（甲基）丙稀酸g旨等。 該等之多官能（甲基）丙烯酸酯，可僅1種單獨使用，亦 可2種以上組合使用。 201245872 用於本發明光硬化性樹脂組成物之多官能單體含量， 若引寻所需硬度即可，例如，光硬化性樹脂組成物之固體 成伤中，宜為10重量％〜60重量％之範圍内，其中又宜為2〇 重里/。5〇重量％之範圍β，特別宜為30重量％〜4〇重量％之 辄圍内。藉使多官能單體含量為前述範圍，將可藉由充分 進灯光硬化，抑制曝光部份之溶出，且未曝光部份之顯影 較確實而為適宜。 ~ 有機-無機混成材 本發月中，有機_無機混成材係表示聚石夕氧院(寡聚物或 聚合物)與有機聚合物或錢基所構成之有機·無機混成材。 有機-無機混成材，可舉例如含（曱基）丙烯酸基等不飽 和基之聚矽氧烷、丙烯酸/二氧化矽混合物、聚氨酯/二氧化 矽混合物、含丙烯酸酯基矽烷寡聚物、含氫硫基矽烷寡聚 物及矽倍半氧烷化合物等。 矽倍半氧烷化合物可舉例如具有一般式Rsi〇i $ (R:有 機基)所示基本構造之化合物，有機基例如具有甲基苯基 及硫醇基等者。例如，具有前述有機基甲基、苯基、甲基 與苯基以及硫醇基與曱基者。 δ亥專之有機-無機混成材係習知之化合物，或依據習知 方法可容易製造之化合物。具體而言，有機_無機混成材可 使用市販品例如商品名ΤΜ-100 (東亞合成）、[Technical Field] The present invention relates to a photocurable resin composition, a touch panel using a cured product of a photocurable resin composition as an insulating layer, and a touch panel having the same The image display device of the panel.八 ^ C Previous 3 Background of the Invention Built-in touch panel smart phones, personal computers and game consoles, etc., the operator can operate by hand or pen. These devices are very easy to use because they can be operated by pressing and sliding the screen display portion, etc., and the market is rapidly expanding. The sensor portion of the touch panel can usually be formed by forming a laminate of the T-O 2 electrodes 2 and 4, the insulating layer 3, the protective layer 5 and the output electrode 蜱 in a desired shape by means of a transparent plate. . Here, the film formation of the insulating layer is carried out by coating and/or force on a laminate such as an IT crucible electrode. Also, in order to prevent breakage during carrying, the insulating layer needs to have a certain hardness. Therefore, the photocurable resin composition for forming an insulating layer requires hardness, adhesion to IT, and heat. Here, there is a case where a tantalum insulating layer ’ is stacked on the ΙΤ0 electrode or the like in the touch panel, and a plurality of insulating layers are laminated as shown in the first (4)-1(b). When stacking one layer of insulating layer' and the uppermost layer of insulating layer when stacking multiple layers, it is required to achieve the function of the guarantee, and the high hardness of the contact when the substrate is conveyed, and from the viewpoint of patterning accuracy High developability. Further, in the touch panel, the sensor portion and the color filter are separately manufactured, and the type of the combination and the one surface of the one transparent substrate are used to manufacture the inductor portion, and the back surface layer is colored, and the like is manufactured to manufacture the color filter. One body type. In particular, in the case of a color filter integrated type, since a layer such as a colored layer (R, G, and B) is heated in addition to the heating step of the inductor portion, the insulating layer is used for most of the layers. Heating step. Therefore, the insulating layer needs a very high degree of heat at this time. However, the resin composition for a touch panel insulating layer (Patent Document 1) is not fully satisfactory in terms of hardness, developability, adhesion to ITO, and heat resistance, and development of such a resin composition is desired. SUMMARY OF THE INVENTION PROBLEMS TO BE SOLVED BY THE INVENTION An object of the present invention is to provide a photocurable resin composition which is highly developable and hardened. The hardness of the material is high for the adhesion and heat resistance of IT0. Means for Solving the Problem As described above, the inventors actively studied the cumulative results and found it in the photocuring property of an acrylic resin having a carboxyl group, a polyfunctional monomer, and a polymerization initiator, and then blending the organic-inorganic hybrid material. The resin composition has a high developability 4 201245872, and when the composition is used, a cured product having high hardness, adhesion to IT〇, and high heat resistance can be obtained. The present invention is based on the aforementioned novel knowledge. Accordingly, the present invention provides the following items: Item 1. A sturdy resin composition comprising a carboxyl group-containing acrylic resin, a polyfunctional monomer, an organic-inorganic hybrid material, and a polymerization initiator. The photocurable resin composition according to Item 2, wherein the organic-inorganic hybrid material is selected from the group consisting of a rock-alkali-based, an acrylic acid/ceria mixture, and a uric acid having an unsaturated group such as a methyl propyl sulfhydryl group. At least one of the group consisting of an ethyl ester/dioxane gas, an acrylate-containing decane polymer, and a thiosulfanyl oligo-halogenated compound. </ RTI> A method for manufacturing a touch panel, which is a touch panel having a plate, a ruthenium electrode and an insulating layer, the method comprising the following photocurable resin composition according to item 1 in contact with a step of coating the photocurable resin composition, placing a photomask having a predetermined shape opening, performing active energy ray irradiation, performing a development treatment step, and curing the photo-cured image The step of heating the resin composition. Manufacturing Insulation Item 4 A touch panel in which all or a part of the insulating layer is composed of a cured product of the photocurable resin composition of the item 1 s. Item 5. The image display device comprising the touch panel item according to Item 4, wherein the photo-curable resin composition is in contact with the Ιτ electrode. a step of coating a coating on a photocurable resin composition on which a photomask having a predetermined shape is placed, performing active energy ray irradiation, and performing a development treatment; and forming a photocurable resin after development processing The step of heating the object. EFFECTS OF THE INVENTION The photocurable resin composition of the present invention has high developability, and a cured product having high hardness, adhesion to ITO, and heat resistance can be obtained by using the composition. Therefore, the photocurable resin composition of the present invention is suitable for the production of an insulating layer of a touch panel, particularly a protective layer, which is formed by patterning, and is required to withstand the severe high temperature conditions in the manufacturing step, and is closely adhered to ITO. The component is located on the surface of the device. Further, it is also suitable for an insulating layer material of a capacitive touch panel from the viewpoint of high developability, high adhesion of a cured product to ITO, and high heat resistance. BRIEF DESCRIPTION OF THE DRAWINGS 1 The l(a)-l(b) diagram schematically shows a general touch panel. [Embodiment] The present invention provides a photocurable resin composition. The present invention provides a photocurable resin composition comprising a carboxyl group-containing acrylic resin, a polyfunctional monomer, an organic-inorganic hybrid material, and a polymerization initiation. Agent. Acrylic resin having a carboxyl group The photocurable resin composition of the present invention contains an acrylic resin having a carboxyl group. The carboxyl group-containing acrylic resin can impart alkali developability and the like in addition to uv hardenability due to its carboxyl group. 6 201245872 The carboxylic acid resin having a carboxyl group is not particularly limited, and examples thereof include those obtained by reacting a compound having two carboxyl groups or an anhydride thereof with an acrylic acid copolymer having a substituent reactive with a carboxyl group; and a carboxyl group (曱) A acrylate monomer is copolymerized with another (fluorenyl) acrylic styrene monomer (a (meth) acrylate monomer having no carboxyl group) to obtain a acrylate monomer. Further, in the acrylic acid copolymer having a substituent reactive with a carboxyl group, a (meth) acrylate monomer having a substituent reactive with a carboxyl group and another (meth) acrylate monomer (having no reactivity with a carboxyl group) The copolymerization of a thiol (meth) acrylate monomer and a copolymer of a (meth) acrylate monomer having no carboxyl group and a (meth) acrylate monomer having no carboxyl group a compound obtained by reacting epoxy propyl (mercapto) acrylic acid vinegar (the obtained copolymer has a core-reducing property, and the aforementioned polymerization reaction can also be added as needed to copolymerize with a (mercapto)acrylic acid g|monomer. The monomer is a raw material. In the present specification, '((fluorenyl) acrylate) means acrylate or sulfhydryl sulphuric acid vinegar. Similarly, "(meth) acrylic acid" means acrylic acid or methyl propyl acrylate. The (meth) acrylonitrile monomer may, for example, be mercapto (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate _ and butyl (A) Acetyl acid, such as a benzoic acid monomer; Etc. containing (meth)acrylic acid; 2. Ethyl (meth) acrylate vinegar, 2-butyl butyl (fluorenyl) propionate and 2-butyl (meth) acrylate Vinegar and the like containing a mercapto (mercapto) acrylic acid S 曰 fluoroethyl methyl acrylate acid, 2 _ (perfluorobutyl) ethyl methacryl oxime 2 ' (perfluorohexyl) ethyl Acrylate and 2-(perfluorobutyl) ruthenium, fluorenyl (fluorenyl) acrylate; M- fluorenyl (methyl) 201245872 acrylamide and dimethyl decylamine (A Acrylamide; dimethylaminoethyl (decyl) acrylate, epoxypropyl (decyl) acrylate, 3,4-epoxybutyl (decyl) acrylate and 2-methyl- Monomer such as 3,4-epoxy-cyclohexyl(fluorenyl) acrylate. The (meth) acrylate monomer having a carboxy-reactive substituent may, for example, be a propylene propyl (meth) acrylate. , 3,4-epoxybutyl (meth) acrylate, 2-methyl-3,4-epoxy-cyclohexyl (meth) acrylate, etc., which have a reactive substituent to a carboxy group ( The methyl acrylate may be used singly or in combination of two or more kinds. Examples of the (fluorenyl) acrylate monomer having no carboxyl group-reactive substituent include (meth)acrylic acid, mercapto (meth) acrylate, ethyl (decyl) acrylate, and butyl (methyl). Acrylate, 2-hydroxyethyl (decyl) acrylate, N-hydroxydecyl (meth) acrylamide, 2-hydroxybutyl (mercapto) acrylate, 2-hydroxybutyl (methyl) a monomer such as acrylate, dimethyl propylene amine, dimethyl amine ethyl (meth) acrylate, and epoxy propyl (decyl) acrylate. The acrylate monomer may be used alone or in combination of two or more. The carboxy group-containing acryl monomer may be a (meth)acrylic acid or the like. The carboxyl group-containing (meth)acrylic monomer may be used. These may be used alone or in combination of two or more. It does not contain a mercapto (meth) acrylate monomer, and examples thereof include mercapto (meth) acrylate, ethyl (decyl) acrylate, butyl (decyl) acrylate, 2-ethyl ( Methyl) propylene, N_m decyl (meth) propylene _, 2- butyl (decyl) acrylate, 2-hydroxybutyl (mercapto) acrylate, dimethyl propyl 8 201245872 dilute vinegar Di-decylamine ethyl (meth) acrylate acid epoxy propyl (meth) propylene oxime oxime epoxy butyl (meth) acrylate and 2-methyl-3, 4-epoxy Base _ ring ^ base (fluorenyl) acrylic acid vinegar and the like. These non-silk (fluorenyl) acrylate monomers may be used singly or in combination of two or more kinds. The compound having two carboxyl groups or an anhydride thereof may, for example, be maleic acid, succinic acid, adipic acid, azelaic acid or the like. In order to prepare the photocurability of the resin composition, it is preferable to use a polymerizable unsaturated group-containing compound such as a diacid or a butened acid. The monomer copolymerizable with the (fluorenyl) acrylic styling monomer may, for example, be a vinyl monomer or a propylene monomer. The monomer which is copolymerized with the (indenyl) propylene-g| phase may be used alone or in combination of two or more. The vinyl monomer may, for example, be a monomer such as stupid ethylene, but is not limited to these. m In the present invention, a blending ratio of a (meth)acrylic acid monomer and a 7 or a sulfonium-containing monomer having a reactive substituent is made of a monomer 2Q to 9〇% by weight of the entire raw material, preferably 5〇~7〇% by weight. In the present invention, in order to improve the slidability, an acrylic resin having a carboxyl group, the raw material monomer preferably contains the above-mentioned fluorine-containing (fluorenyl) acrylate. . When the fluorine-containing (fluorenyl) acrylate is blended, the ratio is preferably from 0.1 to 8% by weight, more preferably from 2 to 4 parts by weight, based on the total amount of the monomer raw materials. The acid value of the acrylic resin having a slow base is preferably from 3 Torr to 2 〇〇 mgKOH/g, more preferably from 50 to 150 mgK 〇H/g. It is suitable to use a resin composition having a range of acidity in the above range to obtain a resin composition having high developability and having a degree of adhesion to the substrate. 9 201245872 In addition, the acid value of the acrylic resin with a slow base can be measured according to j 〖S κ. Further, the weight average molecular weight of the acrylic resin having a few groups is preferably from 5,000 to 100,000, more preferably from 1 to 3 〇〇〇〇β, with a repellent acrylic resin, by using an acid having the aforementioned range In the price, the pattern shape at the time of pattern exposure is easy to control, and the problem that the final film thickness is reduced (loss of film thickness) after patterning is suppressed, and the viscosity at the time of protective stratification is not easily excessively high, and therefore it is suitable. Further, the weight average molecular weight of the present invention is a weight average molecular weight in terms of polystyrene when measured by gel permeation chromatography (Gpc). Polyfunctional monomer The photocurable resin composition of the present invention contains a polyfunctional monomer in order to increase the crosslinking density and hardness. These polyfunctional monomers may have a plurality of polymerizable functional groups, and the polyfunctional monomer and the above polymer may be polymerized by light irradiation. As such a polyfunctional monomer, a polyfunctional (meth) acrylate having an acrylonitrile group or a mercapto fluorenyl group is usually used. The above polyfunctional (meth) acrylate may be a difunctional (meth) acrylate or a trifunctional or higher (meth) acrylate. The difunctional (meth) acrylate may, for example, be ethylene glycol di(meth)acrylic acid, diethylene glycol bis(indenyl) acrylate, hexylene glycol (decyl) acrylate, long-chain aliphatic Di(indenyl) acrylate, neopentyl glycol di(meth)acrylic acid oxime, transmethyltrimethylacetate neopentyl glycol di(meth)acrylate, octadecanoic acid denatured pentaerythritol II Methyl) acrylate, propyl bis(meth) acrylate, glyceryl (meth) acrylate, triethylene glycol di (meth) acrylate, tetraethylene glycol di (meth) acrylate, four Decanediol bis(indenyl) acrylate, butyl 10 201245872 diol di(indenyl) acrylate, dicyclopentyl di(meth) acrylate, polyethylene glycol bis(indenyl) acrylate, poly stretching Propyl di(meth)acrylate, triglyceride di(meth)acrylate, neopentyl glycol denatured trihydroxymercaptopropane di(meth)acrylate, propylene cyclohexyl di(meth)acrylate, Oxidized cyclohexyl di(meth)acrylate, acrylated isocyanate Di(propylene methoxy neopentyl glycol) adipate, bisphenol A bis(indenyl) acrylate, tetrabromobisphenol A di(meth) acrylate, bisphenol S di(meth) acrylate And butanediol di(indenyl)acrylate, di(meth)acrylate phthalate, di(indenyl) acrylate and zinc di(meth)acrylate. Further, examples of the trifunctional or higher (meth) acrylate include trimethylolpropane tris(mercapto) acrylate, trishydroxy ethane tris(decyl) acrylate, and tris(decyl) acryl glycerin. Ester, pentaerythritol bis(indenyl) acrylate, neopentyl alcohol tri(meth) acrylate, alkyl-modified dipivalaerythritol tri(meth) acrylate, tris(meth) acrylate , tris(propyleneoxyethyl)trimeric isocyanate, tris(mercaptopropyloxyethyl)trimeric isocyanate, neodecyltetrakis(meth)acrylate, dipentaerythritol Tetrakis(meth)acrylate, ditrihydroxyindolyl tetrapropyl acrylate, institute-based denatured diterpene tetraol tetra(indenyl)propionate, dipentaerythritol monohydroxypenta-(methyl) Acrylate, dipentaerythritol hexa(methyl) acrylate, dipentaerythritol penta(indenyl) acrylate, calcined dipentaerythritol penta(methyl) acrylate , acid-reducing dipentaerythritol penta (methyl) propionate, polyurethane tris(decyl) acrylate, ester tris(meth)acrylic acid S , Said polyethylene years S hexa (meth) acrylic acid-based purpose S S aims and hexa (meth) acrylic acid and the like purpose g. These polyfunctional (meth) acrylates may be used alone or in combination of two or more. 201245872 The content of the polyfunctional monomer used in the photocurable resin composition of the present invention may be as long as the hardness required for the photocurable resin composition, for example, 10% by weight to 60% by weight. Within the scope, it should be 2 〇 /. The range of 5 〇% by weight is particularly preferably in the range of 30% by weight to 4% by weight. If the content of the polyfunctional monomer is in the above range, it is possible to suppress the elution of the exposed portion by sufficiently hardening the light, and the development of the unexposed portion is more preferable. ~ Organic-Inorganic Blends In this month's month, the organic-inorganic blended material is an organic/inorganic blend composed of a polysulfide compound (oligomer or polymer) and an organic polymer or a money base. The organic-inorganic hybrid material may, for example, be a polyoxyalkylene group containing an unsaturated group such as a (fluorenyl)acrylic group, an acrylic acid/ceria mixture, a polyurethane/ceria mixture, an acrylate-containing decane oligomer, or the like. A thiosulfanyl oligo oligomer, a sesquiterpene oxide compound, and the like. The sesquisquioxane compound may, for example, be a compound having a basic structure represented by the general formula Rsi〇i $ (R: organic group), and the organic group may have, for example, a methylphenyl group and a thiol group. For example, those having the aforementioned organic methyl group, phenyl group, methyl group and phenyl group, and thiol group and fluorenyl group. The organic-inorganic hybrid material of the formula is a conventional compound or a compound which can be easily produced according to a conventional method. Specifically, the organic-inorganic hybrid material can be used as a commercial product such as the trade name ΤΜ-100 (East Asia Synthetic).
COMPOCERAN AC6〇 1 (荒川化學）、COMPOCERAN AC611 (荒川化學）、UREARNO U201 (荒川化學）、UREARNO U301 (荒川化學）、UREARNO U3 03 (荒川化學）、COMPOCERAN 12 201245872 HBSQ105-7 (荒川化學）、 、SR13 (小西化學）、SR23 (小西化COMPOCERAN AC6〇1 (Arakawa Chemical), COMPOCERAN AC611 (Arakawa Chemical), UREARNO U201 (Arakawa Chemical), UREARNO U301 (Arakawa Chemical), UREARNO U3 03 (Arakawa Chemical), COMPOCERAN 12 201245872 HBSQ105-7 (Arakawa Chemical), SR13 (Xiaoxi Chemical), SR23 (Xiaoxihua
〜四化字）、入七-2226 (信 …^ |〇學）、X-41-1810 (信越化學）。~ 四化字), into the seven-2226 (letter ... ^ | dropout), X-41-1810 (Xin Yue Chemical).
可提高對ΠΌ之密合性。 10〜50重量份，較宜為2〇〜4〇重量份 此等有機-無機現成材之摻混比率，可設定範圍宜為 。又，從顯影性之觀點 來看，宜使用分子量1〇萬以下者。 聚合起始劑 本發明之光硬化性樹脂組成物中，t播混聚合起始 劑。此等聚合起始劑，可舉例如2·甲基小[4_(甲基硫）苯 基]-2-嗎基丙酮、2_笨甲基_2_二甲基胺小(4_嗎琳基苯基 丁綱、2,2’-二(0_氣苯基M，5,4，，5，-四苯基-1，2’-聯咪唑、2,4_ 二乙基塞噸酮及4,4-二二乙基胺二苯基酮等。 此等聚合起始劑之摻混比率，於固體成份中，可設定 範圍宜為3〜15重量份，較宜為5〜1〇重量份。 其他成份 本發明之光硬化性樹脂組成物，亦可適宜使用溶劑、 聚合抑止劑、氧化防止劑、分散劑、界面活性劑、光安定 劑、流平劑、為提高透明基板(玻璃基板等）密合性等之界面 活性劑、為提高滑動性之滑劑等及為提高硬度等之無機微 粒子（二氧化矽溶膠等）。 本發明中可使用之溶劑，若為對光硬化性樹脂組成物 13 201245872 各成份不反應，而可將該等溶解或分散之有機溶劑，則無 特別限定。具體來講，可舉甲醇及乙醇等醇類；四氫呋喃 等醚類；乙二醇一曱醚、乙二醇二曱醚、乙二醇甲乙醚及 乙二醇一乙醚等二醇醚類；甲基賽路蘇醋酸酯及乙基赛路 蘇醋酸s旨等乙二醇烧基鱗醋酸醋類；二乙二醇一甲醚、二 乙二醇二乙醚'二乙二醇二曱醚、二乙二醇甲乙醚、二乙 二醇一乙醚及二乙二醇一丁醚等二乙二醇類；丙二醇甲基 醚醋酸酯及丙二醇乙基醚醋酸酯等丙二醇烷基醚醋酸酯 類；曱苯及二曱苯等芳香烴類；甲乙酮、曱戊酮、環己酮 及4-羥基-4-曱基-2-戊酮等酮類；以及2_羥基丙酸乙酯、2_ 羥基-2-曱基丙酸曱酯' 2-羥基-2-甲基丙酸乙酯、乙氧基醋 酸乙酯、羥基醋酸乙酯、2-羥基-2-甲基丁酸甲酯、3_甲氧 基丙酸曱酯、3-甲氧基丙酸乙酯、3-乙氧基丙酸甲酯、3_ 乙氧基丙酸乙S旨、醋酸乙g旨、醋酸丁 g旨、乳酸甲g旨、乳酸 乙酯、3-曱氧基醋酸丁酯及3_曱基-3_甲氧基醋酸丁酯等酯 類；等。該等溶劑可單獨使用，亦可2種以上組合使用。 本發明中可使用之密合助劑，可舉例如信越化學社製 之矽烷偶合劑KBM-403、KBM-503及KBM-803等。 本發明中可使用之界面活性劑（滑劑），可舉例如DIC社 製之氟系『MEGAFAC』R08MH、RS-72-K 及 RS-75 等， BYK-CHEMIE JAPAN社製之聚矽氧系 BYK-333及BYK-301 等0 為提高ITO密合性，亦可更添加分子中具有雙鍵之磷酸 化合物。本發明所使用磷酸化合物，若為分子中具有雙鍵 14 201245872 之磷酸化合物則可使用而無特別限定。可舉例如，2-曱基 丙烯醯氧基乙基酸磷酸酯（商品名LIGHT ESTER P-1M及 LIGHT ESTER P-2M，共榮社化學（株）製）、環氧乙烧變性 磷酸二甲基丙烯酸酯（商品名PM-21，日本化藥（株)製）、含 磷酸環氧基甲基丙烯酸酯（商品名NEW FRONTIER S-23A，第一工業製藥(株)製）等磷酸（曱基）丙烯酸酯類及乙 烯基膦酸（商品名VPA-90及VPA-100，BASF社製）等磷酸乙 稀化合物。 該等磷酸單體使用量無特別限定，例如固體成份中， 可摻混宜為〇.〇1〜10重量份，較宜為1〜7重量份。 觸控面板 本發明提供一種觸控面板，其絕緣層之全部或一部分 由前述光硬化性樹脂組成物之硬化物構成。 在此，觸控面板於ITO電極及透明基板等之上有積層1 層絕緣層與積層複數層絕緣層之情形。本說明書中，保護 層係表示絕緣層1層時之該絕緣層，積層複數絕緣層時為最 上層之絕緣層。因此，僅保護層（最上層）由本發明光硬化性 樹脂組成物硬化物所構成之觸控面板，亦包含於本發明之 觸控面板。 本發明之觸控面板，除其絕緣層之全部或一部分使用 本發明之光硬化性樹脂組成物以外，可依據本身習知方法 製造。 因此，本發明提供一種觸控面板製造方法，係具有透 明基板、ITO電極及絕緣層之觸控面板製造方法，含有以下 15 201245872 步驟， 塗佈 將前述光硬化性樹脂組成物以接觸〗Τ 〇電極方 之步驟， 於該光硬化性樹脂組成物上載置具有預定形狀開 案之光罩，進行活性能量線照射，行顯影處理之牛^ .It can improve the adhesion of the confrontation. 10 to 50 parts by weight, preferably 2 to 4 parts by weight, of such organic-inorganic ready-made materials, the blending ratio is preferably set. Further, from the viewpoint of developability, it is preferred to use a molecular weight of not less than 10,000. Polymerization initiator In the photocurable resin composition of the present invention, t is a mixed polymerization initiator. Such a polymerization initiator may, for example, be 2, methyl small [4_(methylthio)phenyl]-2-morphylacetone, 2-stanomethyl-2-dimethylamine (4_? Phenyl phenyl, 2,2'-bis(0-phenylphenyl M,5,4,5,4-tetraphenyl-1,2'-biimidazole, 2,4-diethyl ketoxime and 4,4-diethylamine diphenyl ketone, etc. The blending ratio of the polymerization initiators may be in the range of 3 to 15 parts by weight, preferably 5 to 1 part by weight, based on the solid content. Other components The photocurable resin composition of the present invention may suitably be a solvent, a polymerization inhibitor, an oxidation inhibitor, a dispersant, a surfactant, a light stabilizer, a leveling agent, or a transparent substrate (glass substrate). For example, a surfactant such as adhesion, a lubricant for improving slidability, and the like, and inorganic fine particles (such as cerium oxide sol) for improving hardness, etc. The solvent which can be used in the present invention is a photocurable resin. The composition 13 201245872 is not particularly limited, and the organic solvent which can be dissolved or dispersed is not particularly limited, and specific examples thereof include alcohols such as methanol and ethanol; and tetrahydrofuran. Ethers; glycol ethers such as ethylene glycol monoterpene ether, ethylene glycol dioxime ether, ethylene glycol methyl ether and ethylene glycol monoethyl ether; methyl sarbuta acetate and ethyl celecoxib acetate Ethylene glycol sulphate acetate vinegar; diethylene glycol monomethyl ether, diethylene glycol diethyl ether 'diethylene glycol dioxime ether, diethylene glycol methyl ether, diethylene glycol monoethyl ether and diethyl Diethylene glycol such as diol monobutyl ether; propylene glycol alkyl ether acetate such as propylene glycol methyl ether acetate and propylene glycol ethyl ether acetate; aromatic hydrocarbons such as toluene and diphenylbenzene; methyl ethyl ketone and pentanone , ketones such as cyclohexanone and 4-hydroxy-4-mercapto-2-pentanone; and ethyl 2-hydroxypropionate, 2-hydroxy-2-mercaptopropionate' 2-hydroxy-2-methyl Ethyl propyl propionate, ethyl ethoxyacetate, ethyl hydroxyacetate, methyl 2-hydroxy-2-methylbutanoate, decyl 3-methoxypropionate, ethyl 3-methoxypropionate , 3-ethoxypropionate methyl ester, 3_ethoxy propionic acid ethyl acetate, acetic acid, ethyl acetate, lactic acid, ethyl lactate, ethyl 3-methoxyacetate, and 3 An ester such as 曱-yl-3-methoxyacetate; etc. In the present invention, the auxane coupling agent KBM-403, KBM-503, and KBM-803 manufactured by Shin-Etsu Chemical Co., Ltd., etc., may be used. The surfactant (slip agent) which can be used is, for example, a fluorine-based "MEGAFAC" R08MH, RS-72-K, and RS-75 manufactured by DIC Corporation, and a polyoxygenated BYK-333 manufactured by BYK-CHEMIE JAPAN. And BYK-301, etc. 0, in order to improve ITO adhesion, a phosphoric acid compound having a double bond in the molecule may be further added. The phosphoric acid compound used in the present invention may be used as a phosphate compound having a double bond in the molecule 14 201245872 without Specially limited. For example, 2-mercapto acryloxyethyl acid phosphate (trade name: LIGHT ESTER P-1M and LIGHT ESTER P-2M, manufactured by Kyoeisha Chemical Co., Ltd.), epoxy epoxidized denatured dimethyl phosphate Phosphoric acid (such as PM-21, manufactured by Nippon Kayaku Co., Ltd.) and epoxidized epoxy methacrylate (trade name: NEW FRONTIER S-23A, manufactured by Daiichi Kogyo Co., Ltd.) Ethylene phosphate compounds such as acrylates and vinylphosphonic acids (trade names VPA-90 and VPA-100, manufactured by BASF Corporation). The amount of the phosphoric acid monomer to be used is not particularly limited. For example, the solid component may be blended in an amount of from 1 to 10 parts by weight, preferably from 1 to 7 parts by weight. Touch Panel The present invention provides a touch panel in which all or a part of the insulating layer is composed of a cured product of the photocurable resin composition. Here, the touch panel has a case where a single insulating layer and a plurality of insulating layers are laminated on the ITO electrode, the transparent substrate, or the like. In the present specification, the protective layer is the insulating layer when the insulating layer is one layer, and the uppermost insulating layer is formed when a plurality of insulating layers are laminated. Therefore, the touch panel composed only of the cured layer of the photocurable resin composition of the present invention (the uppermost layer) is also included in the touch panel of the present invention. The touch panel of the present invention can be produced according to a conventional method, except that all or a part of the insulating layer is used in the photocurable resin composition of the present invention. Therefore, the present invention provides a method for manufacturing a touch panel, which is a method for manufacturing a touch panel having a transparent substrate, an ITO electrode, and an insulating layer, comprising the following steps of 2012 20128, coating the photocurable resin composition to contact Τ 〇 In the step of the electrode, the photocurable resin composition is placed on a photomask having a predetermined shape, and the active energy ray is irradiated to perform development treatment.
及， /邵’ U 將顯影處理後之光硬化性樹月旨組成物加熱，製造 層之步驟。 k、”緣 例如於透明基板上，使依所需形狀圖案化之金屬輸出 電極、ITO電極及絕緣層附著積層，於其上積層保護層γ 此，藉由於絕緣層及/或保護層使用光硬化性樹脂組成物2 硬化物’將可製造本發明之觸控面板。 本發明所使用之透明基板，若為對可見光透明之基材 便無特別限定《具體而言，可舉石英玻璃、無鹼破璃:強 化玻璃及合成石英板等無彎曲性之透明剛性材料，或透明 樹脂薄膜(PET等）及光學用樹脂板等具有彎曲性之透明柔 性材料。 ' 一實施形態中，於前述透明基板使以所需形狀圖案化 之ITO電極附著。前述透明基板與汀〇電極間，亦可存在金 屬製之輸出電極。對於此透明基板及ITO電極，以接觸於令 等之方式，塗佈本發明之光硬化性樹脂組成物。 光硬化性樹脂組成物之塗佈方法無特別限定，可舉例 如喷霧塗佈法、浸潰塗佈法、塗佈棒塗佈法、滾輪塗佈法 及旋轉塗佈法等。 201245872 其後’依需要進行70〜lOOt，2〜5分鐘左右之預烤，再 於光硬化性樹脂組成物上載置具有預定形狀開口圖案之光 罩，照射活性能量線進行顯影處理。活性能量線可舉例如 紫外線及電子束等。照射量可於通常圖案化之使用範圍適 宜設定，例如可設定於30〜300mJxcm2，宜為50〜150mJxCm2 之範圍。活性能量線照射後之塗膜以通常方法顯影。將顯 影處理後之光硬化性樹脂組成物加熱（後烤）。加熱條件可設 定為與通常之絕緣層形成同樣範圍，例如可為22〇〜250。(：， 加熱20〜40分鐘。其結果’於該實施形態中，形成本發明光 硬化性樹脂組成物之硬化物所構成之絕緣層。絕緣層之膜 厚（乾燥時)無特別限定，通常可適宜設定為〇·5〜5μπι，宜為 0.75〜3μηι之範圍。於前述絕緣層上，塗佈光硬化性樹脂組 成物，因應需要進行預烤、活性能量線照射、顯影處理及 加熱而形成絕緣層。該絕緣層可兼為保護層，亦可再使用 本發明光硬化性樹脂組成物或習知之光硬化性樹脂組成 物，將其塗佈’因應需要進行預烤、活性能量線照射、顯 影處理及加熱而形成保護層。此時之塗佈、預烤、活性能 量線照射、顯影處理及加熱(後烤)條件，可設定為與前述同 樣範圍。保護層膜厚（乾燥時)無特別限定，通常可適宜設定 為0.5〜5μηι，宜為0.75〜3μηι之範圍。 又，本發明亦包含另一實施形態，係將絕緣層分為2層 (絕緣層及保護層）’使用本發明光硬化性樹脂組成物或習知 之光硬化性樹脂組成物’將其塗佈，因應需要進行預烤、 活性能量線照射、顯影處理及加熱而形成絕緣層，再因應 17 201245872 需要使ITO電極附著後，將本發明光硬化性樹脂組成物以接 觸ΙΤΟ電極方式塗佈，再因應需要進行預烤、活性能量線贼 射、顯影處理及加熱之方法。塗佈、預烤、活性能量線煦 射、顯影處理及加熱(後烤)條件，可設定為與前述同樣範園。 又，本發明之觸控面板，可為感應器部份與濾色片個 別製造而將該等組合之類型，亦可為1片透明基板之一面上 製造感應器部份，其背面積層著色層等而製造濾色片之 體型。一體型觸控面板’由於製造感應器部份後再製造濾 色片將需要多次加熱處理，因此耐熱性優之本發明光硬化 性樹脂組成物，適用於其製造。 影像顯示裝置 本發明亦提供具備前述觸控面板之影像顯示裝置。該 等影像顯示裝置可舉例如陰極射線管(CRT)、電漿顯示面板 (PDP)及液晶顯示裝置等。又，本發明之影像顯示裝置，亦 包含具備前述液晶顯示裝置之智慧型手機、個人電腦及遊 戲機等。 實施例 以下，利用合成例、製造例、實施例、比較例及試驗 例進一步說明本發明，唯本發明不限定為該等實施例。 合成例1製造具有羧基之丙烯酸樹脂 於備有攪拌裝置、氮氣導入管、溫度計及回流冷凝管 之燒瓶中’預備丙二醇一曱醚(PGME) 120重量份、甲基曱 基丙烯酸酯(MMA) 20重量份、2-(全氟己基）乙基甲基丙稀酸 酯10重量份及曱基丙稀酸(MAA) 70重量份，於燒瓶内導入 18 201245872 氮氣並攪拌30分鐘進行氮取代後，將燒瓶内容物昇溫至90 T：。接著’將燒瓶内容物維持901，添加/3氫硫基丙酸 (BMPA) 4重量份與二曱基2,2-偶氮二(2-甲基丙酸醋）0.1重 量份開始聚合。從聚合開始每小時添加2,2-偶氮二(2-甲基 丙酸酯）〇.4重量份共計3次。聚合開始6小時後，添加PGME 50重量份，冷卻至室溫。 將聚合物放置約10小時後，確認燒瓶内氧濃度回復至 20%左右後，於燒瓶内追加曱氧基對苯二酚(MEHQ) 0.1重量 份、環氧丙基曱基丙烯酸酯（GMA) 121重量份與PGME 100 重量份’昇溫至95°C。接著，將燒瓶内容物維持95。(：並添 加三乙胺(TEA) 1重量份後，7小時後冷卻至室溫。冷卻後， 追加無水順丁烯二酸22重量份、MEHQ 0.3重量份及PGME 10重量份，再度昇溫至95°C。接著，將燒瓶内容物維持95 。(：並添加二甲胺吡啶(DMAP) 1重量份7小時後，添加PGME 80重量份’冷卻至室溫，製得聚合物濃度38%之含羧基丙 烯酸樹脂。 所製得聚合物之重量平均分子量為丨萬5千，樹脂酸價 為 70mgKOH/g。 合成例2 於備有授拌裝置、氮氣導入管、溫度計及回流冷凝管 之燒瓶中’ ΪΙ備丙二醇一甲^(ρ(3ΜΕ) 12〇重量份、甲基甲 基丙’烯酸醋(MMA) 2〇重量份、曱基丙稀酸(MAA) 7〇重量份 及2_(王氟己基）乙基甲基丙烯酸醋10重量份 ，於燒瓶内導入 氮耽並猜3G分鐘進行氮取代後，將燒瓶内容物昇溫至9〇 19 201245872 。(：。接著，將燒瓶内容物維持9〇°C，添加万氫硫基丙酸 (BMPA) 4重量份與二甲基2,2-偶氮二(2_曱基丙酸酯）〇.1重 量份開始聚合。從聚合開始每小時添加2,2-偶氮二(2-甲基 丙酸酯）0.4重量份共計3次。聚合開始6小時後，添加PGME 50重量份，冷卻至室溫。 將聚合物放置約10小時後，確認燒瓶内氧濃度回復至 20%左右後，於燒瓶内追加甲氧基對苯二酚(MEHQ) 0.1重量 份、環氧丙基曱基丙烯酸酯（GMA)121重量份與PGME100 重量份，昇溫至95它。接著，將燒瓶内容物維持95°C並添 加三乙胺(TEA) 1重量份後，7小時後冷卻至室溫。冷卻後， 追加無水順丁烯二酸22重量份、MEHQ 0.3重量份及PGME 10重量份’再度昇溫至95°C。接著，將燒瓶内容物維持95 。(：並添加二曱胺吡啶(DMAP)l重量份7小時後，添加PGME 80重量份，冷卻至室溫’製得聚合物濃度38%之鹼可溶性 聚合物。 所製得聚合物之重量平均分子量為1.5萬，樹脂酸價為 70mgKOH/g。雙鍵含量為226 (g/mol)。 實施例 聚合物、多g此單體、聚合起始劑、添加劑及溶劑， 分別使用製造例1製造之具羧基丙烯酸樹脂、東亞合成株式 會社製M520 (多元酸變性丙烯酸寡聚物）、BASF社製 IRGACURE 907、DIC株式會社製R〇8MH、信越化學工業製 KBM 403及PGME(丙二醇一曱醚），再者使用表丨所示有機_ 無機混成材A〜R ’將該等摻混而調製光硬化性樹脂組成 20 201245872 物。又，各組成物調整固體成份濃度為20質量％。 在此，有機-無機混成材A〜D為含光硬化性基混成材（具 有曱基丙稀醯基、乙烯基、苯乙烯基及氫硫基等有機成份 之混成材）。有機-無機混成材A使用信越化學社製KR 513。 有機-無機混成材B - D係依據下列習知之合成方法（具有丙 稀醯基之有機-無機混成材合成方法），使用表1記載之具有 有機成份化合物所合成： 於裝置溫度計、攪拌裝置及回流冷凝管之300mL四口 燒瓶内，預備3-丙烯醯氧基丙基三甲氧石夕烧29_8g (0_13莫耳) 及苯基三甲氧矽烷95.2g (0.48莫耳），於冰水浴下，添加鹽酸 0.003莫耳與水32.4g(1.8莫耳），於常溫反應丨小時後，昇溫 至70°C保持1小時。反應結束後，添加曱苯i9〇g，使用分液 漏斗，以水洗淨至水相為中性。於裝置溫度計、授拌裝置 及回流冷凝管之500mL四口燒瓶内，預備甲苯層，添加氫 氧化鈉0.0029莫耳與水32.4g(1.8莫耳），於常溫攪拌1小時 半。反應結束後，使用分液漏斗，以水洗淨至水相為中性。 洗淨後將甲苯層過濾，於減壓下除去甲苯製得樹脂。 又，有機-無機混成材E-K為未含光硬化性基之混成材 (具有甲基、苯基、環氧基及PMMA(聚甲基甲基丙烯酸酯基） 等有機成份之混成材）。有機-無機混成材E使用小西化學社 製S R-13。有機-無機混成材F - K係依據下列習知之合成方法 (具有苯基之有機-無機混成材合成方法），使用表1記載之具 有有機成份化合物所合成： 於裝置溫度計、攪拌裝置、回流冷凝管及排出用旋塞 21 201245872 之1L加套燒瓶内，預備笨基三乙氧矽烷3〇〇 〇g (1 μ莫耳）， 調t系内溫度為25〇c。接著，將鹽酸G 23g(()嶋莫耳)與水 67_5g (3·74莫耳)所構成鹽酸水滴入，於25。〇保溫8小時。其 後加入曱苯300g溶解，以水分液洗淨至反應物為中性， 從製付之甲苯層將甲笨減壓回收，製得白色粉末之聚石夕氧 組成物。 具有羧基之丙烯酸樹脂、多官能單體、有機-無機混成 材、聚合起始劑及添加劑之摻混比率，分別為30重量％、 30重量％、30重量〇/〇、7重量％及3重量％，使用溶媒將固體 成份濃度調整為2〇量％。比較例添加HC材（多官能單體為東 亞合成株式會社製M520與聚合起始劑為BASF社製 IRGACURE 907以重量比7比丨摻混之光硬化性樹脂組成物) 及刖述合成例2製得鹼可溶性樹脂（比較例丨）或於其中加入 %氧樹脂者(比較例2)取代有機_無機混成材，此外與前述實 施例相同’調製光硬化性樹脂組成物1氧胞旨使用通 828(以上，三菱化學製）。 試驗例 使用實施例及比較例所製得絕緣層形成用組合物，對 於（1)顯影性、（2)硬度及密合性(τρ完、cF完及PCT完） 評估。 (1)顯影性 於玻璃基板上’將實施例及比較例製得絕緣層形成用 、，且合物以乾燥後厚度為1 · 5 μ m進行旋轉塗佈，於9 〇艽加熱板 上靜置3分鐘（預備乾燥），進行光罩曝光。接著使用〇.〇5% 22 201245872 氫氧化鉀水溶液做為顯影液進行顯影， 顯影性。 評估未曝光部份之 又’曝光條件如下。又 份是否完全溶解來進行。又 (曝光條件） 顯影性之評估， 顯影性結果示於 以未曝光部 下列表1。 曝光機：近接式曝光機 光罩：鉻板光罩 曝光間距：150μπι 光源：超高壓水銀燈 曝光量：60mJ/cm2 (判斷基準） 〇:完全溶解。 X:未完全溶解。 (2)硬度 '對與前述「⑴㈣性」同樣條件製得之曝光後 以錯筆硬度計進行硬度之評估。結果示於下列表1。 塗膜， 又，硬度測定藉由JISK5600-5·4進行。 (3)密合性(TP完） 對於ITO基板上以與前述「⑴顯影性」同樣條件製膜 之塗膜，以23(TC進行30分鐘後烤處理後，以玻璃紙膠帶進 行棋盤格剝離試驗。結果示於下列表1。 在此，棋盤格剝離試驗係使用美工刀，以深度建糾丨了〇 基板基材，間隔lmm切割垂直相交之縱橫各丨丨條平行直 線，製作lmmx 1mm之方格目100個，將玻璃紙膠帶（商。 23 201245872 名：玻璃紙帶，商品編號：CP4〇5AP·24，NICHIBAN(株) 製）以橡皮擦摩擦貼合，以直角瞬間剝離，藉目視評估方格 目之殘留數。又，方格目之剝離面積如下判定。 (判斷基準） 5 ·剝離面積=〇% 4 :剝離面積=大於〇%〜25%以内 3 :剝離面積=大於25%〜50%以内 2 :剝離面積=大於50%〜75%以内 1 :剝離面積=大於75%〜100% (4) 密合性(CF完） 為調查對於與濾色片一體型製造時同樣之加熱處理之 耐性，對以與前述「（3)密合性(τρ完）」同樣條件製得之加 熱後塗膜，再以23〇t進行30分鐘後烤處理7次後，以玻璃 紙膠帶進行棋盤格剝離試驗。結果示於下列表卜棋盤格剝 離試驗以與前述「⑽合性(TP完）」同樣條件實施及評估。 (5) 密合性(PCT完） 為更進步之加速s式驗，對以與前述「（4)密合性(cf 完）」同樣條件製得之加熱後塗膜，再以12(rc，剛％rh， 乳壓條件下放置3小時後，以玻璃_帶進行棋盤格剝 ^驗。結果示於下列表卜棋盤格剝離試驗以與前述「（3) @樣條件實施及評估。 [表1] 24 201245872 顯影 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 密合 PCT完 CO 寸 吋 <〇 *η *〇 寸 CF完 CT) m cn 寸 对 »ri «〇 cn TP完 »〇 寸 »〇 *n »〇 ι/Ί 硬度 »〇 en X W X 寸 W 对 cn κ cn w 对 K κ cn 混合材之有機成份 1 1 丙烯酿基 甲基丙烯醯基 氫硫基 氮硫基 甲基 甲基/笨基=2 : 1 苯基 環氧基 PMMA 聚笨乙烯 聚醚聚氨酯 系統 HC材+鹼可溶性樹脂 HC材+鹼可溶性樹脂+ 環氧樹脂 含光硬化性基混合材 未含光硬化性基混合材 比較例1 比較例2 實施例1 實施例2 實施例3 1 實施例4 實施例5 |實施例6 | 實施例7 實施例8 實施例9 實施例10 實施例11 <1： « U Q W pH ϋ W h-4 Η-» 25 201245872 【圖式簡單說明：： 第l(a)-(b)圖係概略表示一 【主要元件符號說明】 1.. .透明基板 2.. .第1 ITO電極 3.. .絕緣層 4.. .第2ITO電極 般觸控面板。 5.. .保護層 6.. .輸出電極 10.. .觸控面板 26And / Shao' U The step of heating the photocurable tree composition after the development treatment to produce a layer. k," the edge is, for example, on a transparent substrate, and the metal output electrode, the ITO electrode, and the insulating layer patterned according to the desired shape are laminated, and the protective layer γ is laminated thereon, whereby the insulating layer and/or the protective layer use light. The curable resin composition 2 is a cured material. The transparent substrate used in the present invention is not particularly limited as long as it is transparent to visible light. Specifically, quartz glass or Alkali-breaking: a transparent rigid material such as a tempered glass or a synthetic quartz plate, or a transparent transparent material such as a transparent resin film (PET or the like) or an optical resin plate. In one embodiment, the transparent The substrate is adhered to an ITO electrode patterned in a desired shape, and a metal output electrode may be present between the transparent substrate and the Ting electrode, and the transparent substrate and the ITO electrode are coated in such a manner as to be in contact with each other. The photocurable resin composition of the invention is not particularly limited, and examples thereof include a spray coating method, a dip coating method, and a coating bar coating method. , roller coating method, spin coating method, etc. 201245872 Thereafter, 70 to 100 t, 2 to 5 minutes pre-baked as needed, and a photomask having a predetermined shape opening pattern is placed on the photocurable resin composition. The active energy ray is irradiated with an active energy ray, and the active energy ray may be, for example, an ultraviolet ray or an electron beam. The irradiation amount may be appropriately set within a range of use for usual patterning, and may be, for example, 30 to 300 mJxcm 2 , preferably 50 to 150 mJ x cm 2 . The coating film after the irradiation of the active energy ray is developed by a usual method. The photocurable resin composition after the development treatment is heated (post-baked). The heating condition can be set to be in the same range as a usual insulating layer, for example, 22 〇 250. (:: heating for 20 to 40 minutes. As a result, in the embodiment, an insulating layer composed of a cured product of the photocurable resin composition of the present invention is formed. The film thickness of the insulating layer (during drying) is not particularly limited. Usually, it can be suitably set to 〇·5~5μπι, preferably in the range of 0.75~3μηι. On the insulating layer, a photocurable resin composition is applied, and it is required to enter The insulating layer is formed by pre-baking, active energy ray irradiation, development treatment, and heating. The insulating layer may also serve as a protective layer, and the photocurable resin composition of the present invention or a conventional photocurable resin composition may be used. The coating is formed by pre-baking, active energy ray irradiation, development treatment, and heating to form a protective layer. At this time, coating, pre-baking, active energy ray irradiation, development processing, and heating (post-baking) conditions can be set. The thickness of the protective layer (during drying) is not particularly limited, and is usually suitably set to 0.5 to 5 μm, preferably 0.75 to 3 μm. Further, the present invention also includes another embodiment, which is an insulating layer. It is divided into two layers (insulating layer and protective layer) 'coated with the photocurable resin composition of the present invention or a conventional photocurable resin composition', and pre-baked, active energy ray irradiation, development treatment, and After heating, an insulating layer is formed, and after the ITO electrode is required to be attached in accordance with 17 201245872, the photocurable resin composition of the present invention is coated by a contact ΙΤΟ electrode, and then required Pre-bake, active energy line thief shooting, development processing and heating methods. The conditions of coating, pre-baking, active energy ray ray irradiation, development treatment, and heating (post-baking) can be set to be the same as described above. Moreover, the touch panel of the present invention can be manufactured separately for the sensor portion and the color filter, or can be made of one surface of one transparent substrate, and the back surface layer is colored. And the body shape of the color filter is manufactured. Since the integrated touch panel is required to be heat-treated a plurality of times after the inductor portion is manufactured, the photocurable resin composition of the present invention having excellent heat resistance is suitable for its production. Image Display Device The present invention also provides an image display device including the above touch panel. Examples of such image display devices include a cathode ray tube (CRT), a plasma display panel (PDP), and a liquid crystal display device. Further, the video display device of the present invention includes a smart phone, a personal computer, a game machine, and the like including the liquid crystal display device. EXAMPLES Hereinafter, the present invention will be further described by way of Synthesis Examples, Production Examples, Examples, Comparative Examples and Test Examples, but the present invention is not limited to the Examples. Synthesis Example 1 An acrylic resin having a carboxyl group was produced in a flask equipped with a stirring device, a nitrogen gas introduction tube, a thermometer, and a reflux condenser. 'Prepared propylene glycol monoterpene ether (PGME) 120 parts by weight, methyl methacrylate (MMA) 20 10 parts by weight of 2-(perfluorohexyl)ethyl methacrylate and 70 parts by weight of mercapto acrylic acid (MAA) were introduced into the flask by introducing 18 201245872 nitrogen and stirring for 30 minutes for nitrogen substitution. The contents of the flask were warmed to 90 T:. Next, the contents of the flask were maintained at 901, and 4 parts by weight of /3 thiolacylpropionic acid (BMPA) was added to 0.1 part by weight of dimercapto 2,2-azobis(2-methylpropionic acid vinegar) to start polymerization. 2,2-azobis(2-methylpropionate)〇.4 parts by weight was added every 3 times from the start of the polymerization. Six hours after the start of the polymerization, 50 parts by weight of PGME was added, and the mixture was cooled to room temperature. After the polymer was allowed to stand for about 10 hours, it was confirmed that the oxygen concentration in the flask was returned to about 20%, and then 0.1 part by weight of decyl hydroquinone (MEHQ) and epoxypropyl methacrylate (GMA) were added to the flask. 121 parts by weight and 100 parts by weight of PGME were heated to 95 °C. Next, the contents of the flask were maintained at 95. (: After adding 1 part by weight of triethylamine (TEA), it was cooled to room temperature after 7 hours. After cooling, 22 parts by weight of anhydrous maleic acid, 0.3 parts by weight of MEHQ, and 10 parts by weight of PGME were added, and the temperature was raised again. 95 ° C. Next, the contents of the flask were maintained at 95. (: and after adding 1 part by weight of dimethylamine pyridine (DMAP) for 7 hours, 80 parts by weight of PGME was added and cooled to room temperature to obtain a polymer concentration of 38%. The carboxyl group-containing acrylic resin has a weight average molecular weight of 10,000 and a resin acid value of 70 mgKOH/g. Synthesis Example 2 In a flask equipped with a mixing device, a nitrogen gas introduction tube, a thermometer, and a reflux condenser ' Prepare propylene glycol monomethyl ( (ρ (3 ΜΕ) 12 〇 parts by weight, methyl methacrylate acrylate (MMA) 2 parts by weight, mercapto acrylic acid (MAA) 7 parts by weight and 2 _ (king 10 parts by weight of fluorohexyl)ethyl methacrylate was introduced into the flask, and after nitrogen substitution was judged for 3 G minutes, the contents of the flask were heated to 9 〇 19 201245872. (:. Next, the contents of the flask were maintained at 9) 〇 ° C, adding 1,4-hydroxythiopropionic acid (BMPA) 4 parts by weight with dimethyl 2,2-azodi(2_fluorenyl) Propionate) 1 part by weight of the polymerization was started. 0.4 parts by weight of 2,2-azobis(2-methylpropionate) was added every 3 times from the start of polymerization. After 6 hours from the start of the polymerization, PGME 50 was added. The parts by weight were cooled to room temperature. After the polymer was allowed to stand for about 10 hours, it was confirmed that the oxygen concentration in the flask was returned to about 20%, and then 0.1 part by weight of methoxy hydroquinone (MEHQ) and propylene oxide were added to the flask. 121 parts by weight of thiol acrylate (GMA) and 100 parts by weight of PGME, and the temperature was raised to 95. Then, the contents of the flask were maintained at 95 ° C and 1 part by weight of triethylamine (TEA) was added, and then cooled to room after 7 hours. After cooling, 22 parts by weight of anhydrous maleic acid, 0.3 parts by weight of MEHQ, and 10 parts by weight of PGME were added to raise the temperature again to 95 ° C. Then, the contents of the flask were maintained at 95. (: and diammonium pyridine was added. (DMAP) After 7 hours by weight, 80 parts by weight of PGME was added, and cooled to room temperature to obtain an alkali-soluble polymer having a polymer concentration of 38%. The weight average molecular weight of the obtained polymer was 15,000, and the acid value of the resin was obtained. It is 70 mgKOH/g. The double bond content is 226 (g/mol). Example polymer, more than g of this monomer In the polymerization initiator, the additive, and the solvent, each of the carboxy acrylate resin manufactured by the production example 1 and M520 (polyacid-modified acryl oligomer) manufactured by Toagosei Co., Ltd., IRGACURE 907 manufactured by BASF Corporation, and R〇8MH manufactured by DIC Corporation were used. , KBM 403 and PGME (propylene glycol monoterpene ether) manufactured by Shin-Etsu Chemical Co., Ltd., and further blended with the organic-inorganic hybrid materials A to R' shown in Table 而 to prepare a photocurable resin composition 20 201245872. Further, each of the compositions was adjusted to have a solid content concentration of 20% by mass. Here, the organic-inorganic hybrid materials A to D are photocurable base-containing materials (mixtures having an organic component such as a mercapto acrylonitrile group, a vinyl group, a styryl group, and a thiol group). The organic-inorganic hybrid material A was KR 513 manufactured by Shin-Etsu Chemical Co., Ltd. The organic-inorganic hybrid material B-D is synthesized according to the following conventional synthesis method (an organic-inorganic hybrid material synthesis method having an acrylonitrile group), and is synthesized using the organic component compound described in Table 1: a device thermometer, a stirring device, and In a 300 mL four-necked flask of a reflux condenser, prepare 3-propenyloxypropyltrimethoxide 29-8 g (0_13 mol) and phenyltrimethoxynonane 95.2 g (0.48 mol), and add in an ice water bath. A solution of 0.003 mol of hydrochloric acid and 32.4 g of water (1.8 mol) was reacted at room temperature for a few hours, and then heated to 70 ° C for 1 hour. After completion of the reaction, toluene i9 〇g was added, and the mixture was washed with water to a neutral phase using water. The toluene layer was prepared in a 500 mL four-necked flask equipped with a device thermometer, a mixing device and a reflux condenser, and sodium hydroxide (0.0029 mol) and water (32.4 g (1.8 mol) were added, and the mixture was stirred at room temperature for one and a half hours. After completion of the reaction, a separatory funnel was used, and the mixture was washed with water until the aqueous phase was neutral. After washing, the toluene layer was filtered, and toluene was removed under reduced pressure to obtain a resin. Further, the organic-inorganic hybrid material E-K is a mixed material containing no photocurable group (a mixed material having an organic component such as a methyl group, a phenyl group, an epoxy group, and a PMMA (polymethyl methacrylate group)). The organic-inorganic hybrid material E was made into S R-13 manufactured by Kosei Chemical Co., Ltd. The organic-inorganic hybrid material F-K is synthesized according to the following conventional synthesis method (synthesis method of organic-inorganic hybrid material having a phenyl group) using the organic component compound described in Table 1: in a device thermometer, stirring device, reflux condensation Tube and discharge cock 21 In a 1L-added flask of 201245872, a stupid triethoxy oxane 3 〇〇〇g (1 μm) was prepared, and the temperature inside the t-system was 25 〇c. Next, hydrochloric acid G 23g (() oxime) and hydrochloric acid 67_5g (3·74 mol) were added dropwise to the hydrochloric acid at 25. 〇 Keep warm for 8 hours. Thereafter, 300 g of toluene was added and dissolved, and the mixture was washed with a water solution until the reactant was neutral, and the toluene layer was recovered under reduced pressure to obtain a white powder polyoxo composition. The blending ratio of the carboxyl group-containing acrylic resin, the polyfunctional monomer, the organic-inorganic hybrid material, the polymerization initiator, and the additive is 30% by weight, 30% by weight, 30% by weight, 7/〇, 7% by weight, and 3 parts by weight, respectively. %, the concentration of the solid component was adjusted to 2% by volume using a solvent. In the comparative example, the HC material (the polyfunctional monomer is M520 made by Toagosei Co., Ltd. and the polymerization initiator is IRGACURE 907 manufactured by BASF Corporation, and the photocurable resin composition is blended at a weight ratio of 7 丨), and the synthesis example 2 is described. An alkali-soluble resin (Comparative Example) or a compound in which a % oxygen resin was added (Comparative Example 2) was used in place of the organic-inorganic hybrid material, and the photocurable resin composition 1 was prepared in the same manner as in the above Example. 828 (above, manufactured by Mitsubishi Chemical Corporation). Test Example The composition for forming an insulating layer obtained in the examples and the comparative examples was evaluated for (1) developability, (2) hardness and adhesion (τρ completion, cF completion, and PCT completion). (1) Developability on a glass substrate 'The insulating layer was formed in the examples and the comparative examples, and the composition was spin-coated with a thickness of 1 · 5 μ m after drying, and was dried on a 9 〇艽 heating plate. Set for 3 minutes (pre-drying) and expose the mask. Then, using 〇.〇5% 22 201245872 potassium hydroxide aqueous solution as a developing solution for development, developability. The evaluation of the unexposed portion is as follows. Whether or not the mixture is completely dissolved. Further (exposure conditions) Evaluation of developability, and developability results are shown in Table 1 under the unexposed portion. Exposure machine: Proximity exposure machine Photomask: Chrome plate mask Exposure distance: 150μπι Light source: Ultra high pressure mercury lamp Exposure: 60mJ/cm2 (Judgment) 〇: Completely dissolved. X: Not completely dissolved. (2) Hardness 'After the exposure obtained under the same conditions as the above (1) (four), the hardness was evaluated by a pen hardness tester. The results are shown in Table 1 below. The coating film and hardness were measured by JIS K5600-5·4. (3) Adhesiveness (TP finish) The coating film formed on the ITO substrate under the same conditions as the above-mentioned "(1) developability" was subjected to a checkerboard test after baking for 30 minutes at TC for 30 minutes. The results are shown in the following table 1. Here, the checkerboard peeling test system uses a utility knife to deepen the entanglement of the base material of the base plate, and cuts the parallel straight lines of the vertical and horizontal lines perpendicularly intersecting each other to make a lmmx 1 mm square. In the case of 100, the cellophane tape (commercial. 23 201245872: cellophane tape, product number: CP4〇5AP·24, NICHIBAN Co., Ltd.) was rubbed and rubbed with an eraser, and it was peeled off at a right angle, and the square was evaluated by visual observation. In addition, the peeling area of the square is determined as follows. (Judgment basis) 5 · Peeling area = 〇% 4: Peeling area = more than 〇% to 25% or less 3: Peeling area = more than 25% to 50% Within 2: peeling area = more than 50% to 75% or less 1: peeling area = more than 75% to 100% (4) Adhesion (CF finish) For the investigation, the same heat treatment as in the case of the color filter integrated type manufacturing Patience, the same as the above "(3) Adhesion (τρ完)" After heating, the film was coated, and after baking for 30 minutes at 23 °t for 7 times, the checkerboard peeling test was performed with a cellophane tape. The results are shown in the following table. The checkerboard peeling test is in agreement with the above (10). (End of TP) Implementation and evaluation of the same conditions. (5) Adhesion (PCT completion) is a more advanced acceleration s test, which is obtained under the same conditions as the above ((4) Adhesion (cf) After heating, the film was coated, and then placed under 12 (rc, just %rh, milk pressure for 3 hours, and then the glass plate was used for the checkerboard peeling test. The results are shown in the following table. The checkerboard peeling test is the same as the above. (3) Implementation and evaluation of @sample conditions [Table 1] 24 201245872 Development 〇〇〇〇〇〇〇〇〇〇〇〇〇 Close PCT Finish CO 吋 〇 〇 η η * 〇 CF CF finished CT) m Cn inch pairs»ri «〇cn TP完»〇寸»〇*n »〇ι/Ί hardness»〇en XWX inch W to cn κ cn w to K κ cn mixed organic components 1 1 acryloyl methyl Propylene fluorenyl thiol nitromethylmethyl methyl / stupid = 2 : 1 phenyl epoxy PMMA polystyrene Polyurethane system HC material + alkali soluble resin HC material + alkali soluble resin + epoxy resin light-curing base material without photocurable base material Comparative Example 1 Comparative Example 2 Example 1 Example 2 Example 3 1 Example 4 Example 5 | Example 6 | Example 7 Example 8 Example 9 Example 10 Example 11 <1: « UQW pH ϋ W h-4 Η-» 25 201245872 [Simple description:: l(a)-(b) diagram outlines a [main component symbol description] 1.. Transparent substrate 2.. 1st ITO electrode 3.. Insulation layer 4.. . 2nd ITO electrode type touch panel . 5.. .Protective layer 6.. . Output electrode 10.. Touch panel 26