TW201211677A - Photo-sensitivity resin composition - Google Patents

Abstract

A photo-sensitivity resin composition is provided. The photo-sensitivity resin composition includes (A) polymer having three or more blocks, wherein the blocks include (A-1) ethylenically unsaturated monomer containing acid group and (A-2) ethylenically unsaturated monomer except (A-1); (B) monomer having at least one ethylenically unsaturated double bond; (C) polyurethane resin oligomer having at least one reactive acryl group; (D) nano-inorganic additive surface-modified with organosiloxane; (E) organic acid anhydride; (F) photopolymerization initiator; (G) functional silane coupling agent; and (E) organic solvent. The content of (C) is within a range of 1 wt% to 20 wt% based on the total weight of the photo-sensitivity resin composition.

Description

201211677

Iyyvivw〇02 35754twf.doc/I VI. Description of the Invention: [Technical Field] The present invention relates to a photo-sensitivity resin composition, and in particular to a good metal adhesion property A photosensitive resin composition with high hardness. [Prior Art] • In order to be more convenient, lighter, and more user-friendly, many information products have been converted from traditional keyboards or mice to devices that use touch devices as input. The touch-sensitive device can be assembled on a wide variety of flat-panel displays, so that the flat-panel display has the functions of displaying a picture and inputting operation information. For the current common touch devices, capacitive touch panels and resistive touch panels are the most popular. In a general touch panel process, a photosensitive resin composition (photoresist) is usually used as a dielectric layer between metal electrodes or a protective layer covering a metal electrode. Therefore, the above-mentioned photosensitive resin composition must have a good metal bond and high hardness, and (4) be free from the production of the towel (4). However, the photosensitive resin composition generally used as a dielectric layer or a protective layer does not have good metal adhesion, and is often scratched due to insufficient hardness in the process, thereby causing a problem of low yield. SUMMARY OF THE INVENTION The present invention provides a photosensitive resin composition with adhesion and high hardness. 201211677

XV/V 35754twf.doc/I The present invention proposes a photosensitive resin composition comprising (A) a polymer having three or more co-blocks, and these co-blocks include (A-1) An acid-based ethylenically unsaturated monomer and an ethylenically unsaturated monomer other than (Α·2); (B) a monomer having at least one ethylenically unsaturated double bond; (C) having at least one reactive group Acrylic resin functional urethane resin oligomer; (D) inorganic auxin surface modified inorganic additive; (E) organic acid anhydride; (F) photoinitiator; (G) functional decane coupling agent; )Organic solvents. The content of (c) is between 1 wt% and 20 wt% based on the total weight of the photosensitive resin composition. The photosensitive resin composition according to the embodiment of the invention, wherein the content of the above (A) is, for example, between 10% by weight and 15% by weight based on the total weight of the photosensitive resin composition. The photosensitive resin composition according to the embodiment of the present invention, wherein the content of the above (A·) is, for example, 10 parts by weight based on the total of (A1) and (A-2) being 1 part by weight. Parts to between 90 parts by weight. The photosensitive resin composition according to the embodiment of the present invention, wherein the content of the above (Α_2) is, for example, 10 parts by weight based on the total of (Α-1)舆(Α·2) of 1 part by weight. Between 9 parts by weight. The photosensitive resin composition according to the embodiment of the present invention, wherein the content of the above (Β) is, for example, between 5 wt% and 15% by weight based on the total weight of the photosensitive resin composition. According to the photosensitive resin composition of the embodiment of the present invention, the content of the ruthenium is, for example, between i wt% and 2 〇 wt%, based on the total weight of the photosensitive resin composition.

The photosensitive resin composition according to the embodiment of the present invention, wherein the content of the above (D) is, for example, N is wt%, based on the total weight of the photosensitive resin composition. The photosensitive resin composition according to the embodiment of the present invention, wherein π (A) is 100 parts by weight, and the content of the above (E) is, for example, between 〇1 β and 1 〇〇. Xiafen

The photosensitive resin composition according to the embodiment of the present invention has a content of (F) as described above in an amount of, for example, from 〇 1 ^ ^ to 100 parts by weight. The photosensitive resin composition according to the embodiment of the present invention, wherein the content of the above (G) is between 0.01 wt% and 5 wt0/〇, based on the total weight of the γ photosensitive resin composition. The photosensitive resin composition according to the embodiment of the present invention, wherein the content of the above (H) is, for example, between 60% by weight and 80% by weight based on the total weight of the photosensitive resin composition. According to the photosensitive resin composition of the embodiment of the invention, the photosensitive resin composition may be applied to a dielectric layer between the metal electrodes of the touch panel or a protective layer covering the metal electrodes. Based on the above, the photosensitive resin composition of the present invention has good adhesion with metal and has high hardness, so that it is used as a dielectric layer between the metal electrodes in the touch panel to avoid the dielectric layer and The metal electrode is peeled off, or it can be used as a protective layer for the metal electrode of the city cover to avoid the problem that the protective layer is scratched and causes low yield. In order to make the above features and advantages of the present invention more comprehensible, the following embodiments are described in detail below with reference to the accompanying drawings. [Embodiment] The present invention proposes a photosensitive resin composition which has good adhesion to metal and has high hardness. Therefore, the photosensitive resin composition of the present invention can be applied to a touch panel process, and after exposure and development, is formed as a dielectric layer between the metal electrodes to improve adhesion between the dielectric layer and the metal electrode. The phenomenon that the dielectric layer and the metal electrode are peeled off is avoided, or the protective layer covering the metal electrode is formed to avoid the problem that the process is damaged and the low yield is caused. The photosensitive resin composition of the present invention comprises (A) a polymer having three or more co-blocks, (B) a monomer having at least one ethylenically unsaturated double bond, and (C) having at least one reactivity. Acrylic functional urethane resin oligomer (D) inorganically modified surface-modified inorganic additive, (e) organic acid needle, (F) photoinitiator, (G) functional decane coupling agent, (8) organic Solvent. In (A) a polymer having three or more co-blocks, these co-blocks include (A·1) acid-containing ethylenically unsaturated monomers and (A-2) except (A-1) External ethylenically unsaturated monomer. That is, (A) is at least aggregated by (Ad) and (A_2). Of course, (A) may also be formed by polymerizing (A-l), (A-2) and other monomers. The content of (A) is, for example, between 10% by weight and 15% by weight based on the total weight of the photosensitive resin composition. (A-1) The ethylenically unsaturated monomer having an acid group may be an unsaturated monobasic acid such as (mercapto)propionic acid, crotonic acid, or α-chloro(indenyl)acrylic acid, (ethyl)acrylic acid, cinnamic acid, etc.; not full 201211677

Wv 1 VVu02 35754tw£doc/I and dibasic acids/anhydrides such as maleic acid, maleic anhydride, ftoaric acid, itaconic acid , itaconic anhydride, toconic acid (10) from (3) also acid), citraconic anhydride (citraconic anhydride), mesaconic acid (de-stained (7) acid), mesaconic anhydride (mesaconic ^ hydride), etc.; or three Unsaturated polyvalent acids/anhydrides above the valence. The content of (Α·1) is, for example, between 10 parts by weight and 90 parts by weight based on 100 parts by weight of the total of (A-1) and (A_2). The above (A-1) can be used alone or in combination of several. When the photosensitive resin composition of the present invention is used as a dielectric layer between metal electrodes or a protective layer covering a metal electrode, (A-1) allows the photosensitive resin composition of the present invention to have good adhesion to the metal film layer. Sex. (A-2) The ethylenically unsaturated monomer other than (A-1) may be an allyl group-containing vinyl compound such as allyl (meth)acrylate or the like; A vinyl compound containing two acrylic groups, such as ethylene glycol di(meth)acrylate >dicyclopentenyl di(meth)acrylate , propylene glycol di(meth)acrylate, 2,2-dimercapto-1,3-propanediol dimercapto acrylate (2,2-dimethyl-l, 3-propylene glycol Di(meth)acrylate), triethylene glycol di(meth) aery late, tetraethylene glycol di(meth)acrylate, Tri(2-hydroxyethyl)isocyanate di(meth)acrylate, etc.; nitrile ethylene compound, such as (mercapto) propylene 7

35754twf.doc/I 201211677 Nitrile (meth) acrylonitrile, α-aluminum (meth) acrylonitrile, etc.; aromatic vinyl compounds such as styrene, fluorenyl Styrene, nonyloxystyrene, etc.; other vinyl compounds 'for example, C6 to C12 cyclic alkyl (meth) acrylic acid, and the like. (A-2) is preferably dicyclopentanylmethacrylate, styrene, iso-octylacrylate, propylene (Xallylmethacrylate), methacrylonitrile (methacryl). 〇nitri(6), 2 2 dimethyl 1,3-propanediol diacrylate (2,2-dimethyl-l, 3-propylene glycoldiacrylate). When (A-2) is styrene, the invention can be further improved The heat resistance and the chemical property of the photosensitive resin composition. The content of (A_2) is, for example, from 1 part by weight to 90 parts by weight based on 100 parts by weight of the total of (A-1) and (A-2). The above (A_2) may be used singly or in combination of several kinds. The weight average molecular weight (Mw) obtained by (A) polystyrene conversion by gel permeation chromatography is preferably from 2 x 3 〇 3 to ΐχ 105. More preferably, it is between 5 χ 103 and 5 χ 104. When the weight average molecular weight of (Α) is less than 2χ103, the dielectric layer or the protective layer formed of the photosensitive resin composition of the present invention causes a problem of inaccurate pattern, and The dielectric layer or the protective layer is thinned after being subjected to a high temperature process The problem is that the pattern shape and heat resistance of the dielectric layer or the protective layer are deteriorated. When the weight average molecular weight of (A) is higher than lxlG5, the optical and optical tree assay of the present invention causes a problem of reduced sensitivity. It also reduces the accuracy of the dielectric or protective layer pattern.

201211677 j-^λ i uu〇02 35754twf.doc/I (B) The monomer having at least one ethylenically unsaturated double bond may be ethylene glycol di(meth)acrylate; 2 to 14 polyethylene oxide group of polyethylene glycol di(meth)acrylate; trimethylol propane di (meth)acrylate); trimethylol propane tri(meth)acrylate; pentaerythritol tri(meth)acrylate; isopenic Tetracohol tetradecyl acrylate (卩61^&61>^11*丨1;〇1{6让&(11161;11)&(^>^16); with 2 to 14 rings Propylene glycol group propyleneglycol di(meth)acrylate; dipentaerythritol penta(meth)acrylate; dipentaerythritol Dipentaerythritol hexa(meth)acrylate, DPHA; trimethylolpropane triglycidyl ether acrylic acid additive (trimethylolpropanetrigl Ycidylether acrylic acid); bisphenol A diglycidylether acrylic acid additive; (phthalate diesters) Of p-hydroxyethyl(meth)acrylate); toluene diisocyanate additive (eg (mercapto) acrylic acid · beta · ethyl ester printing - 1 ^ (11 * 〇 \ 76 also 71 (〇^11>«7 to 6); a monomer having an ethylenically unsaturated bond, wherein the ethylenically unsaturated bond is selected from ditrimethylol propanetetraacrylate, ethoxylated Trimeric isohydrogenic acid triacrylate (5 (24 (Q1 (^76111) 4 such as 00>^111»^6), containing

35754twf.doc/I 201211677 Ethoxylated pentaerylthritoltetraacrylate (EO 4 mol), pentaerythritol tetrapropyl acrylate (?61^6『>^111^0 he 1; with & (^ to 6) (£0 35 111〇1), ethoxylated trimethylolpropanetriacrylate (EO 9 mol), ethoxylated three Mercaptopropane triacrylate (EO 3 mol), propxylated pentaerythritoltetraacrylate (PO 4 mol), nonaethylene glycol Diacrylate), a group consisting of dipentaerythritol hexaacrylate-modified caprolactone and trimethylolpropane propoxylate triacrylate. Further, (B) can also be General commercial products, such as KAYARAD DPHA_4〇H (sold by Nippon Kayaku Co., Ltd.); U-4HA, U-6HA, U-6LPA, U-15HA, UA-32P, U-324A, U-4H, U-6H (manufactured by Shin-Nakamura Chemical Industry Co., Ltd.); UN-9000H, UN-3 320HA, UN-3320HB. ' UN-3320HC > UN-901' UN-1200TPK' UN-904 (manufactured by Kokusai Kogyo Co., Ltd.). The content of (Β) is based on the total weight of the photosensitive resin composition. It is between 5 wt% and 15 wt%, preferably between 1 〇wt〇/0 and 13 wt%. The above (B) may be used alone or in combination of several kinds. (C) having at least one reactive propylene An acid functional group polyurethane resin oligomer having an acid value (mgKOH/g) of between 0 and 1 Å. The polyurethane resin segment of the polyurethane resin oligomer is composed of an isocyanate and a warp compound Polymerized. The isocyanate can be an aromatic diisocyanate, for example 2,4- 201211677

Ju^iw〇02 35754twf.doc/I

2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, diphenyl-1,4-diisocyanate (xylene- 1,4-diisocyanate), xylene 1,3-diisocyanate, 4,4'-dipyridyl diisocyanate (4,4' -diphenylmethane diisocyanate, MDI), 2,4'-diphenylmethane diisocyanate, 4,4'-diphenylethylidene diisocyanate (4, 4'-diphenyl ether diisocyanate), 2-nitrodiphenyl-4,4'-diisocyanate, 2,2'-phenylpropane-4, 4'-Diisocyanate, 2,3'-dimercaptodipropylmethyl-4,4'-diisocyanate (3 , 3'-dimethyldiphenylmethane-4,4'-diisocyanate), 4,4'-diphenylpropane diisocyanate, m-phenylene diisocyanate (m- Phenylene diisocyanate), p-phenylene diisocyanate, naphthalene-1,4·diisocyanate (naphthy lene-1,4-diisocyanat) e) 'naphthylene-l, 5-diisocyanate, 3,3'-dimorphoxy quinone-4,4'-diisocyanate (3, 3'-dimethoxydiphenyl-4,4'-diisocyanate); aliphatic diisocyanates, such as tetramethylene diisocyanate, cycloheximide diisocyanate (hexamethylene) Diisocyanate, HDI), lysine diisocyanate; alicyclic diisocyanates, such as isophorone diisocyanate, hydrogenated terpene dioxime Cyanate (hydrogenated 11

35754twf.doc/I 201211677 i^yvi wuv^. tolylene diisocyanate), hydrogenated xylene diisocyanate, hydrogenated diphenylmethane diisocyanate, tetraterpene Tetramethylxylene diisocyanate. The above isocyanate is for illustrative purposes only, but is not limited thereto, and the isocyanate used to polymerize the urethane resin segment may be used in combination of one or more kinds. The hydroxy compound used to polymerize the polyurethane resin segment may be a diol such as ethylene glycol, propylene glycol, tetramethylene glycol, 1,5-pentanediol. (l,5-pentanediol), 1,6-butanediol, 1,10-decanediol, 1,4-dicyclohexanol (1,4) -dihydroxycyclohexane) '1,4-dihydroxymethylcyclohexane, diethylene glycol, triethylene glycol; amino alcohol; Base compound. The above-mentioned warp-based compound is for illustrative purposes only, but is not limited thereto, and the hydroxy compound used to polymerize the polyurethane resin segment may also be used in combination of one kind or plural kinds. The content of cerium is between 1 wt% and 20 wt%, preferably between 3 wt% and 15 wt%, more preferably between 5 wt% and 10 wt%, based on the total weight of the photosensitive resin composition. The above (C) may be used singly or in combination of several kinds. When the photosensitive resin composition of the present invention is used as a dielectric layer between metal electrodes or a protective layer covering a metal electrode, (c) The photosensitive resin composition of the invention has high hardness and good adhesion to the metal film layer. (D) The inorganic additive modified by the surface of the organic decane may be organic 12 201211677

J-^yv*uw〇02 35754twf.doc/I An organic-inorganic sol prepared by sol-gel reaction of decane with an inorganic oxide. The sol-gel reaction can be carried out by adding an acid catalyst, and the acid catalyst used may be selected from the group consisting of acetic acid, phosphoric acid, suitoic acid, and c-citric acid. ), nitric acid, chlorosulfonic acid, p-toluene sulfonic acid, trichloroacetic acid, polyphosphoric acid, iodic acid ), a group of iodoic acid (i〇dic aQ^ydride) and perchloric acid. The above acid catalysts may be used singly or in combination of several kinds. The organic-inorganic sol prepared by the sol-gel reaction is characterized by the type of organic rare substance, the type and concentration of the acid catalyst, the acidity (pH value), the temperature, the water content, and the alcohol used as the hydrolysis solvent. The type and concentration of the salt and the type and concentration of the salt are affected. Specifically, the prepared organic-inorganic sol has an effect of improving hardness and wear resistance because it contains an inorganic oxide. The inorganic oxide used in the sol-gel reaction may be selected from the group consisting of titanium dioxide, sulphur dioxide, oxidized oxidization, tin dioxide, bismuth oxide, barium titanate, oxidized sulphur, and oxonium. The organodecane used in the sol-gel reaction may be selected from methyl trimethoxy silane, methyl triethoxy silane, and ethylene trimethoxy sulfonate. Vinyl trimethoxy silane), vinyl triethoxy silane, dimethyl dimethoxy silane, dimethyl diethoxy silane, Vinyl methyl methoxy silane, butyl trimethoxy silane, diphenyl ethoxy b 13 35754twf.doc/l 201211677 alkenyl ^diphenyl ethoxy vinyl silane), methyl triisopropoxy silane, methyl triacetoxy silane, tetraphenoxy silane, tetrapropoxy A group of tetrapropoxy silane and vinyl triisopropoxy silane. In addition to the organic-inorganic sol synthesized by the above method, the inorganic additive modified by the surface of the organic decane may also be a general commercial product, such as 601Α-35, 601Β-35, 601C-35, 601Η-35 of Changxing Chemical. , 601Q-35; ΒΥΚ series BYK-UV3500, BYK-UV3510, BYK_UV333, BYK-UV3650; Nissan Chemical's MEK-ST, MEK-AC-2101. The content of ¢)) is, for example, less than 5 wt〇/〇 based on the total weight of the photosensitive resin composition. (E) The organic acid anhydride may be maleic anhydride, itaconic anhydride, tetrahydrophthalic anhydride, citraconic anhydride, mesaconic acid gf ( Mesaconic anhydride) and so on. The content of (E) is, for example, between (i) i parts by weight and loo parts by weight of (A). The above (E) may be used singly or in combination of several kinds. (F) The photoinitiator may be a phosphine oxide compound, a carbonyl compound, an aminocarbonyl compound, a triazine compound, a brick (〇xime) compound, Amine (amjne) anthraquinone compound, alkoxyantharcene compound, thioxanthone compound. The content of (F) is, for example, between 0.1 part by weight and 1 part by weight based on 100 parts by weight of (A). The above (F) can be used singly or in combination of several kinds.

35754twf.doc/I 201211677

V. V phosphine oxide compound is, for example, arylphosphine oxide, acylphosphine oxide, bisacylphosphine oxide, 2,4,6-trimercaptobenzoyl-diphenyl 2,6-trimethylbenzoyldiphenylphosphine oxide j ΤΡΟ 2,6-diethylbenzoyldiphenylphosphine oxide, 2,6-dimercaptophenyl quinone 2,6-dimethoxybenzoyldiphenylphosphine oxide, 2,6-dichlorobenzoyldiphenylphosphine oxide, 2,3,5,6·tetradecylbenzamide 2,3,5,6-tetramethylbenzoyldiphenylphosphine oxide, benzoyldi(2,6-dimethylphenyl)phosphonate, 2, 4,6-ST* 2,4,6-trimethylbenzoylethoxyphenylphosphine oxide 'bis(2,4,6-trimercaptobenzoyl)phenylphosphine oxide) (bis (2,4,6-trimethylbenzoyl)phenylphosphine, 1-819), bis(2,6,nonylbenzoyl)-2,4,4-tridecylphenylphosphine oxide (bis(2}6- Dimethoxybenzoyl)-2,4 , 4-trimethylpentylphosphine oxide)) and so on. The carbonyl compound, the amine carbonyl compound, the triazine compound, and the oxime compound are, for example, acetophenone, benzophenone, biphenylketone, 1-amino-1-ring. Already 15

201211677 35754twf.doc/I 1-hydroxy-1-benzoylcyclohexane ' 1-184), benzylpropane 2,2·dimethoxyl_1,2-diphenylethene-1· Brewing I (benzyldimethylketal 2,2-dimethoxy-l,2-diphenylethane-l-one, 1-651), 1-benzyl-l-didecyl tertiary amine-1-(4-intimidation-benzoquinone) (1-benzyl-1 -dimethy lamino-1 -(4-morpholino-benzoyl)propan e ' 1-369), 2-morphin-2-(4-methylthio)benzoquinone-propanil (2-morpholyl -2-(4-methylmercapto)benzoylpropane, 1-907), ethylantraquinone, 4-benzoyl-4_methyldiphenylsulfide, benzoquinone Benzoinbutylether, 2-hydroxy-2-benzoylpropane, 2-amino-2-(4-isopropyl)benzophenone 2-11丫(11*〇\>^2-(4七〇卩1>〇卩丫1 for 6112〇>^1*〇卩&1^), 4-butyl benzene甲烧(4-1)1^比6117〇>^11;1*化111〇1*〇11161:11&1^), 4-phenoxybenzoyldichloromethane Benzoylmethylformate 1,7-double (9-σ丫 基) Gengyuan (l,7-bis(9-acridinyl)heptane), 9-η-butyl·3,6-bis(2-?--isobutyl) ) 9-n-butyl-3,6-bis(2-morpholino-isobutyloyl)carbazole) 10-butyl-2-carboxyacridone, 2-[ 2-(4-methoxy-phenyl)-vinyl]-4,6-bis-trichloromethyl-[1,3,5]triazine (2-[2-(4-methoxy-phenyl)) -viny 1] -4,6-bis-trichloromethy 1- [1,3 ,5]triazine), 2-(4-decyloxy-naphthalen-1-yl)-4,6-bis-trichloroindolyl- [1,3,5] Triazine (2-(4-methoxy-naphthalen-1 -yl)-4,6-bis-trichloromethy 1-[ 1,3,

201211677 w〇02 35754twf.doc/I 5]triazine), 2-nonylbenzene [1,3]dioxol-5-yl-4,6-bis-trismethylmethyl_[1,3, 5] Triazine (2-benzo[l,3]dioxol-5-yl-4,6-bis-trichloromethyl-[l,3,5]triaz ine), 2-mercapto-4,6-bis (three 2-methyM,6-bis(trichloromethyl)-s-triazine, 2-phenyl, 4,6-bis(trichloroindenyl)-s-triazine (2-phenyl) -4,6-bis(trichloromethyl)-s-triazine), 2-naphthylacetate-4,6·bis(trichloroindenyl)-s-triazine (2-naphthyl_4,6-bis(trichloromethyl)-s- Triazine), 1-[9-ethyl-6-(2-mercaptophenyl)-9.H-carbazol-3-yl]-bicycloheptyl decane-1-one oxime-0- Acetate, 1-[9-ethyl·6·(2-mercaptophenyl)-9.H-carbazol-3-yl]-bicycloheptyl-1-one oxime-〇-B Acid ester, 1-[9-ethyl-6-(2-mercaptophenyl hydrazino) _3_ yl]-Adamantyl ketone -1 -0-benzoic acid vinegar, 1- [9-Ethyl-6·(2-methylphenylhydrazino)-9.Η·oxazol-3-yl]-adamantyl 曱院-1-洞肥-〇-acetic acid from the purpose, 1· [9-Ethyl-6-(2-mercaptobenzoquinone)-9.Η-flavor.Sit _3·基]-Four atmosphere bite base 曱 嗣 嗣 嗣 〇 〇 〇 曱 曱 曱 曱Decree 1-[9-ethyl-6-(2-mercaptophenyl)-9.H-carbazole-3-yl]•tetrahydrofuranyldecane-1-oneindole-0-acetate, 1- [9-Ethyl-6-(2-mercaptobenzoyl)·9.Η-oxazol-3-yl]-sepylene-methyl--1嗣--0-benzoic acid vinegar, 1 -[9-ethyl-6-(2-mercaptobenzylidene)-9.H-indazol-3-yl]-cefenyldecane-1-oneindole·0·acetate, 1 ·[9-Ethyl-6-(2-mercaptophenylindazol-3-yl]-propenylnonane-1-oneindole-0-benzoate, 1-[9-B Base-6-(2-mercaptophenylhydrazino)-9.H-吟β sits on _3_yl]•code phenyl oxime-ig with acetic acid §, i-[9-ethyl-6 -(2-mercaptobenzoyl)-9.H_oxazol-3-yl]•ethane-1·ketooxime-0-bicyclobutanoic acid 17

201211677 35754twf.doc/I ester, l-[9-ethyl-6.(2.methyl adenyl)_9.H-carbazole-3.yl]-ethane·ΐ·ketone oxime-Ο- Tricyclodecanoate, 1·[9·ethyl-6·(2-methylbenzoinyl)-9.Η-oxazol-3-yl]-ethane-1-one oxime_〇_ Amantacarbonate, hydrazine, 2-octanedione-1-[4-(phenylthio)phenyl]-2-(0-benzylidene hydrazide), hydrazine, 2·butanedione•1-[ 4-(phenylthio)phenyl]-2-(0-benzhydrylhydrazine), hydrazine, 2·butylenedione-1-[4_(phenylthio)phenyl]_2·(〇-乙酿1,2-octanedione·1_[4_(methylthio)phenyl]-2-(0-benzylidene fluorenyl), i,2-octanedione small [4_(phenylthio) ) phenyl]-2-(0-fluorenylbenzylidene). The amine compound is, for example, triethanolamine, methyldiethanolamine, triisopropylamine, 4-dimethylaminomethylbenzoate, 4- 4-dimethylaminoethyl benzoate, 4-methylaminoisoamyl benzoate, 2-mercaptoaminoethylbenzoic acid 2-methylaminoethyl benzoate, 4-dimethylamino-2-ethylhexyl benzoate, N,N-mercapto-p-methylamine >1,]^-1116111)^& Melon 111丨(^1^), 4,4'-bis(didecylamino)benzophenone_(4,4'-bis(dimethylamino)benzophenone , 4,4'-bis(diethylamino)benzophenone, 4,4'-bis(ethyldecylamino)benzophenone (4,4'-bis(ethylmethylamino)benzophenone). The alkoxy ruthenium compound is, for example, 9,10-dimethoxyanthracene, 9,10-diethoxyanthracene.

.〇02 35754twf.doc/I 201211677 (9,10-diethoxyanthracene), 2-ethyl-9,1-ethyl-9,10-dimethoxyanthracene, 2-ethyl-9 ,2-diethoxyanthracene (2-ethyl-9,10-diethoxyanthracene) A lauding compound such as 2-isopropylthioxanthone, 4-isopropyl ketamine (4 -isopropylthioxanthone, IPTX), 2,4·2-ethyl spurs _ (2,4-diethylthioxanthone, DETX), 2,4_ tri-gas 嗟 collar _ (2,4-trichlorothioxanthone), 1-chloro-4-propene 1-chloro-4-propoxythioxanthone. The (G) functional decane coupling agent may be a fluorenyl functional group-containing oxirane monomer having a fluorenyl acrylate monomer, and is, for example, a glycidoxytrimethoxydecane or the like. (G) The photosensitive resin composition of the present invention can have good adhesion to a metal, a metal oxide or a glass substrate. Further, since (G) has a hydrophobic property, the photosensitive resin composition of the present invention can have high oxidation resistance when subjected to the reliability test. "For the total weight of the photosensitive resin composition, the content of (G) is, for example, Between wt.〇1 wt% to 5 wt%. The above (G) may be used singly or in combination of several kinds. (H) The organic solvent may be benzene, toluene, xylene, methanol, ethanol, ethylene glycol monopropyl ether, diethylene glycol. Diethylene glycol dimethyl ether, diethylene glycol methyl ether, methyl methoxypropionate, ethyl ethoxypropionate, ethyl lactate (ethyllactate), tetrahydroanthracene

201211677 35754twf.doc/I

201211677 35754twf.doc/I

(tetrahydrofUran), ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, methyl cellosolve acetate, ethyl cellosolve acetate, Diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, propylene glycol methyl ether acetate (PGMEA), Propylene glycol propyl ether acetate, propylene glycol propyl ether acetate, methyl isobutyl ketone, methyl ether ketone, propyl I Ketone), cyclohexanone, dimethyl formamide 'DMF, N,N-dimethylacetamide (DMAc), nitrogen-mercaptotetrahydron-bi N-Methyl pyrrolidone (NMP), γ-butyrolactone. The content of (Η) is, for example, between 60% by weight and 80% by weight based on the total weight of the photosensitive resin composition. The above (Η) may be used singly or in combination of several kinds. The photosensitive resin composition of the present invention has high sensitivity and can have excellent metal adhesion, high hardness, good insulating properties, and good chemical resistance even at an exposure amount of 4 〇〇J/m or less, and can be used as a dielectric layer between the metal electrodes in the touch panel or a protective layer covering the metal electrodes. As described above, since the photosensitive resin composition of the present invention has good adhesion to metal and has high hardness, it can be applied to touch 20

201211677 on the process of vi/J02 35754twf.doc/I panel. When the photosensitive resin composition of the present invention is exposed and developed, it can be formed as a dielectric layer between the metal electrodes to improve the adhesion between the dielectric layer and the metal electrode to avoid the dielectric layer and the metal electrode. The peeling phenomenon may occur or may be formed to cover the protective layer of the metal electrode to avoid the problem that the protective layer is scratched in the process to cause a low yield. The photosensitive resin composition of the present invention will be described below by way of experimental examples. (A) Synthesis of a polymer having three or more co-blocks: First, 95.673 kg of ethyl 3-ethoxypropionate was added to the reaction vessel as a solvent. Then, nitrogen gas was introduced and stirred and heated to 130 °C. Next, 24.451 kg of methacrylic acid, 42.614 kg of benzyl methacrylate, 42.443 kg of isobornyl isocyanide (isob〇rnyl methacrylate), and 2.547 kg of peroxybenzene The t-butyl perbenzoate was stirred well and dropped into a reaction vessel at 130 ° C (dropping time of about 6 hours). Thereafter, 72.195 kg of ethyl ethoxypropionate was added, and the temperature of the reaction vessel was lowered back to 50 °C. Then, the nitrogen gas was stopped, and 6.636 kg of glycidyl methacrylate and 0.716 kg of dimethyl amino ethanol (catalyst) were added, and the reaction was stirred in air to 4 6 hours. The obtained resin solution product had a solid content of 41.4 wt.%, a viscosity of 2650 cps/25 ° C, an acidity of 88.3 mgKOH/g, and a weight average molecular weight (Mw) of 12,000. In the photosensitive resin compositions of Experimental Example 1 and Comparative Example 1-4, except 21

35754twf.doc/I 201211677 Other components than (A) above are shown in Table 1. In addition, the results of the pencil hardness test and the metal adhesion test are also shown in Table 1. Table I

Ingredient Experimental Example 1 Comparative Example 1 Comparative Example 2 Comparative Example 3 Comparative Example 4 (A) 10 10 4 10 10 (B) DPHA 5 5 , 5.. 5 5 (C) UN-3320 .5 5 5 (D) BYK -UV3600 1 (E) Maleic anhydride 0.5 0.5 0.5 0.5 0.5 (F) 1-907 0.5 0.5 0.5 0.5 0.5 (G)r-glycidoxypropyltrimethoxydecane 1 1 1 (H) PGMEA 40 40 40 40 40 Exposure energy (mJ/cm2) 200 200 200 200 200 Baking temperature (°c) 230 230 230 230 230 Baking time (min) 30 30 30 30 30 Pencil hardness 4H 2H 3H 2H 2H Adhesion 5B 3B 4B 1B 0B As is clear from Table 1, the photosensitive resin composition of the present invention (Experimental Example 1) has good metal adhesion and high hardness as compared with the general photosensitive resin composition (Comparative Example 1_4). The present invention has been disclosed in the above embodiments, and is not intended to limit the present invention. Any one of ordinary skill in the art can make a few changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims. [Simple diagram] 22 201211677 vvu〇2

35754twf.doc/I None [Key component symbol description] None

Claims (1)

3 5 754tw£d〇〇/i 201211677 VII. Patent application: 1. A photosensitive wax composition, including: (A) a polymer having two or more co-blocks, : (Α·1) an ethylenically unsaturated monomer having an acid group; and (Α-2) an ethylenically unsaturated monomer other than (Α-1); (Β) having at least one ethylenically unsaturated double a monomer of a bond; (C) a polyurethane resin conjugate having at least one reactive acrylic functional group; (D) an inorganic additive modified by an organic decane surface; (Ε) an organic acid anhydride; (F) a light start (G) a functional decane coupling agent; and (Η) an organic solvent, wherein the content of (C) is between 1 wt% and 20 wt% based on the total weight of the photosensitive resin composition. 2. The photosensitive resin composition according to claim 1, wherein the content of (A) is between 10% by weight and 15% by weight based on the total weight of the photosensitive resin composition. 3. The photosensitive resin composition according to claim 1, wherein the total amount of (A-1) and (A-2) is 1 part by weight, and the content of '(A-1) is between Between 10 parts by weight and 90 parts by weight. 4. The photosensitive resin composition according to claim 1, wherein the sum of (A-1) and (Α·2) is 24 parts of (A·2) 24 201211677, 35754 twf, 0C The content of the photosensitive resin composition is 6 to 10' (the total weight of the photosensitive resin composition is as described in claim 1). The amount of B) is between 5 wt% and 15 wt% β 6. The photosensitive tree = composition as described in claim 1 of the patent application, wherein the diffractive tree remains as a secret image The content of (C) is between 1 wt% and 20 wt%. 7. The photosensitive tree composition according to the first aspect of the patent application, wherein the content of (D) is less than 5 wt% based on the total weight of the photosensitive resin composition. The photosensitive resin composition according to item 1, wherein the content of (E) is from 0.1 part by weight to 100 parts by weight based on 100 parts by weight of (A). 9. The photosensitive resin composition according to claim 1, wherein the content of (F) is from 0.1 part by weight to 100 parts by weight based on 100 parts by weight of (A). 10. The photosensitive resin composition according to Item 1, wherein the content of (G) is between 0.01 wt% and 5 wt% based on the total weight of the photosensitive resin composition. 11. The photosensitive resin composition according to claim 1, wherein the content of (H) is between 60% by weight and 80% by weight based on the total weight of the photosensitive resin composition. 12. The photosensitive resin composition according to claim 1, wherein the photosensitive resin composition is applied to a dielectric layer between metal electrodes in a touch panel or a protective layer covering the metal electrode. 25 35754twf.doc/I 201211677 x^y\. 1 v/v/uw^ monomer having at least one ethylenic unsaturated double bond; (C) polyurethane resin oligomer having at least one reactive acryl group; (D) nano-inorganic additive (E) photopolymerization initiator; (G) functional silane coupling agent; and (E) organic solvent. The content of (C) is within a range of 1 wt% to 20 Wp% based on the total weight of the photo-sensitivity resin composition. Fourth, the designated representative map: (a) the designated representative of the case: no (two) the representative symbol of the symbol of the figure is simple: M. five 'this case if In the chemical formula, please reveal the chemical formula that best shows the characteristics of the invention: