201245093 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種以附在基板上之對準標記為基準而利 用加工用工具進行基板加工之方法。本發明係一種尤其對 如低溫共燒陶瓷（LTCC，Low Temperature Co-fired Ceramic)基板之容易產生應變之基板有用之基板加工方 法。 【先前技術】 例如於專利文獻1中揭示有一種加工方法，其係為分斷 玻璃基板’而使刀輪（亦稱為劃線輪）一邊壓接於基板表面 一邊轉動，藉此形成劃線槽者。 圖5顯示先前之劃線裝置之一例之立體圖。劃線裝置3 i 具備載置基板W之工作台32。該工作台32可沿水平之執道 33於Y方向移動’並藉由利用馬達34而旋轉之滾珠螺桿35 予以驅動。又，工作台32可藉由内置馬達之驅動部36而於 水平面内轉動。 由夾持工作台32而豎立設置於兩側之支樓柱37支撑之架 橋39支撐於X方向上延伸之導向桿38。劃線頭41由馬達42 驅動，且以可沿形成於導向桿38上之導向槽4〇而於χ方向 移動之方式安裝。於劃線頭41上設置有固定器42a，利用 該固定器42a而保持加工用工具43(刀輪）。加工用工具43可 調整刀尖方向。而在使加工用工具43下降而將刀尖按壓於 基板W上之狀態下使工作台32於γ方向移動，或者使劃線 頭41沿導向槽40而於X方向移動，藉此如圖6所示，於基板 157554.doc 201245093 W上呈格子狀地形成X方向之劃線槽Si以及γ方向之劃線槽 S 2。 又，於架橋39之上部設置有相機44,藉由手動操作使其 上下移動而可調整焦點。由相機44所拍攝之圖像係顯示於 監視器45上。 ' 於載置於卫作台32上之基板|之角部，形成有用於確定 位置之對準標記（十字標記），藉由利用相機44拍攝對準標 記附近之基板而檢測對準標記之位置。具體而言，於劃線 裝置中預先記憶對準標記之形狀資料（十字形狀之資料）， 藉由比較由相機44拍攝之基板之圖像及已記憶之形狀資 料，利用圖案識別而判定對準標記像是否映照在上述圖像 内。當判定映照出對準標記像之情形時，判斷基板被載置 於正確之位置，將劃線頭41移動至預先規定之加工起始位 置而開始劃線作業。 若於圖像内無法檢測到對準標記像之情形時，則判斷基 板偏離正確之位置，發出提醒修正基板位置之錯誤資訊。 藉此，操作人員一邊藉由監視器45確認由相機44所拍攝之 圖像’一邊以手動調整基板位置來修正位置偏離。 又，於圖5之劃線裝置31中，用於引導基板之定位用基 準銷46係以突出於工作台面之方式而設置。藉由將基板w 之端面抵接於該基準銷46而載置，以避免基板玫之對準標 記自可在相機44中映照出之拍攝視野範圍大幅偏離之情 形。 [先前技術文獻] 157554.doc 201245093 [專利文獻] [專利文獻1]曰本專利第3078668號公報 【發明内容】 [發明所欲解決之問題] 然而，於加工對象之基板為LTCC基板之情形時，存在 如下問題^ LTCC基板係如下基板：在將氧化鋁之骨材及 玻璃化合物混合而成之片材上對導體進行佈線而成為多層 膜’並以通常100CTC以下、例如80〇t左右之溫度將該多 層膜共燒而成。對準標記係於共燒前形成，但共燒時如圖 4(a)及圖4(b)之虛線所示存在變形、收縮之傾向。若基板 產生變形，則會導致對準標記A於基板上之位置自當初設 汁之位置（β又叶值）偏離。因此，若於相機之拍攝視野範圍 内所應映照出對準標記A之工作台上之位置正確地載置基 板W，則由於基板變形之影響反而導致對準標記a自相機 之拍攝視野範圍偏離，變得無法檢測而成為錯誤顯示。 於此種情形時，需手動將基板移動至可檢測對準標記A 之圖像之位置，但必須暫時中斷自動操作來修正位置，使 得作業變得繁雜，並且時間上之損失較大。 另一方面，藉由於工作台面設置定位用之基準銷46來引 導基板W之載置位置，便可減少錯誤顯示之發生次數，但 該情形t仍存在如下缺點：由於基㈣46之存在而限制劃 線所使用之加工用工具43之移動範圍，使得可加工之區域 受到限制。 因此，本發明之目的在於提供一種在由於基板變形而無 157554.doc 201245093 法檢測到對準標記之情形時， 對準標記，檢測含有對準標記 之基板加工方法。 可不中斷裝置之操作而搜索 之圖像而繼續進行加工動作 用美進雜發月之目的在於提供—種於工作台上未設置定位 用土準銷之情料料縣Μ基㈣置位置之偏離，伸 即便基板之載置位置產生若干偏離情形時，亦可容易地進 订對準標記之檢測之基板加工方法。 [解決問題之技術手段] 為解決上述問題而完成之本發明之劃線方法係、-種基板 加工方法，其將附有對準標記之基板載置於工作台上，於 為拍攝對準標記而設定之拍攝基準位置自藉由相機而拍攝 之對準標記圖像（包含對準標記像之圖像）而取得基板之位 置資訊’並根據該位置資訊而規定利用加工用工具對基板 之加工位置之後，對基板進行加工；且，在拍攝基準 位置之拍攝中未檢測到對準標記圖像時，藉由移動相機或 者工作台’使拍攝位置於拍攝基準位置之周邊依序移動而 搜索對準標記圖像，並算出檢測到對準標記圖像時之拍攝 位置及拍攝基準位置之位置偏離量而修正利用加工用工 具之加工位置。 [發明之效果] 本發明方法中，在由於基板變形而無法於拍攝基準位置 處檢利到對準標記之情形時，藉由移動相機或者工作台而 使拍攝位置在拍攝纟準位置之周邊依序移動而搜索對準標 °己圖像。藉此，即便於最初之拍攝基準位置處之拍攝視野 157554.doc 201245093 範圍内未檢測到對準標記圖像之情形時，使相機或… 在其周邊之拍攝位置依序移動而於相同之拍攝視野範圍内 搜索’因此最終可檢測到對準標記圖像，心可檢測到對 準標記圖料之拍攝位置及拍攝基準位置之位置偏離量， 根據該位置偏離量而修正加4工具之加卫位置，從 繼續進行基板加卫之動作。藉此，可消除基板之位置修正 等手動作業之繁雜性’並且可減少作業時間之損失。 又，即便對準標記自拍攝基準位置或多或少位置偏離， 亦可檢測對準標記圖像，算出可檢測到對準標記圖像之拍 攝位置及基準設定位置之偏離量而規定加工位置，因此益 需設置如先前般之工作台上之定位用基準銷，基準銷及加 工用工具不會相互干擾，因此具有可使加卫用工具自由移 動至基板周緣為止之效果。 (其他解決問題之技術手段及效果） 上过:發明中，較佳為搜索對準標記圖像時，使拍攝位置 以拍攝基準位置為中心、而於其周邊呈螺旋狀地依序移動。 藉此，即便對準標記於工作台上向任意方向移動，均可 搜索對準標記。 上述發明中，亦可將相機之各拍攝位置處之拍攝視野範 圍設為圓形或方形，以鄰接之拍攝位置之拍攝視野範圍在 視野之周緣部分相互重疊的方式移動拍攝位置。 藉此，對準標記圖像可確實地進入鄰接之任意拍攝位置 處之拍攝視野範圍，故可消除檢測不良。 上述發明中，較佳為由相機之拍攝位置之移動範圍及拍 157554.doc 201245093 攝視野範圍規定之對準圖像之可檢測區域係以拍攝基準位 置為中心至少包含縱橫5 mm。 以5 mm左右之位置精度可容易地將基板載置於工作台 上，因此藉由以拍攝基準位置為中心至少將縱橫5 mm設為 可檢測區域’而可確實地檢測對準標記。因此，即便不存 在設置於通常裝置中之用於定位之基準銷亦可容易地進行 對準。又，由於不需要基準銷，而可防止基準銷所造成之 不良狀況（與劃線機構之干擾等）。 上述發明中，基板亦可為LTCC基板。 LTCC基板雖於共燒時產生對準標記之變形，但即便於 此種情形時亦可容易地檢測對準標記。 【實施方式】 以下，根據將LTCC基板劃線之實施例而對本發明之基 板加工方法進行詳細說明。 圖1係表示用於將LTCC基板劃線之劃線裝置之一例之立 體圖。該劃線裝置1包含可由吸附機構（未圖示）固定保持 LTCC基板W之工作台2。工作台2藉由以馬達Μ〗驅動滾珠 螺桿4而可沿軌道3、3向Y方向移動。又，工作台2藉由馬 達内置之驅動部5而可於水平面内轉動。 由夾持工作台2而於兩側豎立設置之支撐柱6、6所支撐 之架橋8對於X方向延伸之導向桿7進行支撐。劃線頭1〇係 由馬達M2驅動，其可沿形成於導向桿7之導向槽9向χ方向 移動。 於劃線頭10設置有固定器1丨。該固定器丨丨上保持有將基 157554.doc 201245093 板w劃線之專用刀輪（加工用工具）12。刀輪i2之刀尖之方 向（相對於基板之相對前進方向）可於Χ方向、γ方向調整角 度。而且，使刀輪12下降而使刀尖按壓於基板|上之狀態 下使基板w向γ方向移送，或使劃線頭1〇沿導向桿7向又方 询移動，藉此可形成X方向及γ方向之劃線槽。 又，於劃線頭1〇上設置有與刀輪12 一體地移動之相機 13。藉由使該相機13上下移動而可調整焦點。相機13及刀 輪12之距離為預先測量，由相機13映照之圖像中之位置及 刀輪12之位置係 對應地建立關聯。由相機13拍攝之圖 像資料被顯示於監視器14上，並且輸出至下述圖像處理部 21(參照圖3)。 在載置於工作台2上之基板霤之角部設置有用於確定基 板w之位置之對準標記A(參照圖4)，藉由利用相機13拍攝 基板W(附有對準標記a之附近）而檢測包含對準標記像之 圖像（稱為對準標記圖像），藉此檢測基板w之對準標記A 之位置。具體而言，進行藉由下述控制系統20之圖像處理 部21自所拍攝之圖像中抽選對準標記a之圖案之處理，並 且與預先儲存之對準標記之形狀資料（十字標記）進行對 照’藉此檢測對準標記A之位置。 再者，相機13(及劃線頭10)規定設為基準之原點位置， 田進行載置於工作台2上之基板w之對準標記a之位置檢測 時，藉由馬達Ml、M2之驅動恢復至原點位置，並於原點 位置進行拍攝。恢復原點之狀態下之相機13之位置成為搜 索對準標記Α之動作時之最初的拍攝位置，因此將其設為 157554.doc 201245093 「拍攝基準位置」。 圖3係表示劃線裝置丨之控制系統2〇之方塊圖。自相機13 輸出之圖像資料信號經過圖像處理部21而作為料標記對 照用之圖像資料提供給控制部22。輸入部23係可輸入基板 W之劃線動作等各種處理程式之輸入裝—曼丄其中亦輸入有 用於對準標記之位置㈣之搜㈣程^。㈣㈣22上連 接有X方向馬達驅動部24、γ方向馬達驅動部乃、工作台 旋轉用馬達驅動部26及劃線頭驅動部27、以及資料保持區 域28(記憶體）。於該資料保持區域28中，係將與位置檢踯 關聯且與圖案識別之對準標記進行對照時所需之形狀資料 (十字資料）及各種處理程式一併儲存。 控制部22根據預先自輸入部23輸入之處理程式及劃線動 作所需之設定參數資料，而控制工作台2之旋轉軸方向之 位置，並且控制劃線頭1〇向X方向之移動、工作台2向丫方 向之移動。又，利用刀輪12劃線時，以刀輪12利用適當之 負重壓接基板W表面之方式進行控制。 進而，對基板W進行對準標記八之搜索時，進行將儲存 於資料保持區域2 8中之對準標記之形狀資料及由圖像處理 部2 1抽選之圖像進行對照的演算。 其次，對控制部22所進行之對準標記之搜索動作進行說 明。位置檢測之容許誤差作為裝置之控制程式之參數而可 任意變更，但本實施例中，將位置檢測之容許誤差設為丄 mm，相機13之拍攝視野範圍由於與相機之倍率（7〇倍）有 關，而設定為一邊2 mm之方形區域。即，於某個拍攝位置 157554.doc -10- 201245093 、基板時，、要於拍攝視野範圍内映照出對準標記之中 心位置（十字標記之中心），則判定於該拍攝位置處可檢測 到對準標記A。 首先，利用恢復至原點位置之相機13拍攝基板w。此 時相機13於拍攝基準位置處對拍攝視野範圍為直徑2麵 之方形區域進行拍攝。對由相機13拍攝之圖像及儲存於資 料保持區域28中之對準標記之形狀資料進行對照，只要於 圖像内對準標記A之像被圖案識別並JL標記之中心處於拍 攝視野範圍内’則㈣可檢測對準標記A，且狀基板1 之位置於拍攝基準位置係處於容許誤差内。然後，將刀輪 12(加工用工具)移動至預先設定之所需加工起始位置並 開始劃線作業。 若於拍攝基準位置處之拍攝視野範圍内未映照出對準標 記A之像’或者標記之中心處在拍攝視野範圍外之情: 時，判定自基準設定位置偏離。於此情形時，經由χ方向 馬達驅動部24以及γ方向馬達驅動部25，而使相機13或者 工作台2自拍攝基準位置向其周邊每次以旧距（作為驅動 部之控制程式之參數而可任意設定，但通常係考慮對準標 記之尺寸及相機之拍攝視野範圍的關係而任意設定，本實 施例中，例如為約i.8 mm)移動。使移動之間距短於拍攝 視野範圍之直徑（2 mm)，係為了一邊使拍攝視野範圍之周 邊部分與上-次之拍攝位置處之視野範圍重複__邊搜索對 準標記圖像。 ' 圖2係表示相機13對基板w進行拍攝之拍攝位置之移動 157554.doc •11- 201245093 順序（搜索順序）之圖，圖2(a)上附加之編號（1)〜(25)表示搜 索順序。相機13之拍攝視野範圍設為一邊2 mm之方形區 域，將處於中心之編號（1)規定為作為最初之拍攝位置之 「拍攝基準位置」。該拍攝基準位置如上述般係相機13之 原點位置。 於拍攝基準位置（編號（1))處拍攝基板W時，於準標記像 不處於拍攝視野範圍内而未檢測到對準標記圖像之情形 時，藉由相機13或工作台2而使拍攝位置向左方向移動Ub1 距（1.8 ππη)，移動至編號（2)β之後，直至檢測到對準標記 圖像為止，如圖2(b)之箭頭所示，以拍攝基準位置（編號 (1))為中心於其周邊呈螺旋狀地移動，以（1)—(2)—(3) (25)之順序移動拍攝位置。 然後，例如若於編號（2〇)之拍攝位置處檢測到對準標記 圖像，則藉由控制部22算出自拍攝基準位置（編號（1))起直 至編號（20)為止之位置偏離量之總和。將算出結果用於刀 輪12之加工起始位置之自動修正，使刀輪Η移動至修正後 之加工起始位置處而開始劃線動作。 如此，雖本來藉由拍攝基準位置處之拍攝應可檢測到對 準標記圖像，但即便於由於基板评變形等而無法檢測之情 形時亦可不使裝置之操作中斷而自動地搜索檢測對準標 記圖像以繼續進行劃線動作，藉此，可消除基板w之位置 修正等作業之繁雜性，並且消除作業時間之損失。 又即便於拍攝基準位置處無法檢測對準標記圖像之情 形時使拍攝位置以特定間距、且以特定之移動順序依序 157554.do. •12- 201245093 移動而進行搜索，亦可檢測對準標記圖像，因此無需如先 前般《又置工作台上之定位用&準銷卩準確地載置基板。因 此，不存在定位用基準銷及劃線頭丨〇碰撞之擔憂，可使劃 線頭ίο自由地移動至基板w之周緣為止。 本實施例中，將移動並搜索拍攝位置之範圍限制為縱橫 5 mm，於該範圍内若存在對準標記則可確實地發現，但於 ϋ索時間可延長之情形時’亦可擴大該搜索區域之範圍。 又’藉由控制程式之控制參數而將搜索時之一次移動間距 設為約1.8 mm，但亦可根據容許誤差調整間距。此時，較 佳為與上一次之拍攝視野範圍之一部分重疊，消除無法檢 測到對準標記之死角區域。χ，本實施例中，係將拍攝視 野範圍設為方形區域，但亦可設為圓形。於方形之情形時 容易消除死角區域。 再者，相機13之對準標記圖像之搜索包含縱橫5 mm之 區域，只要為該範圍，便可充分地覆蓋LTCC基板之變形 所導致之對準標記之偏離。 又，上述實施例中，將相機13—體地安裝於劃線頭1〇， 但亦可安裝於架橋8上。相機13及加工用工具12之位置關 係只要--對應建立關聯便可。 以上對本發明之代表性之實施例進行了說明，但本發明 並非僅由上述實施例特定者。例如作為加工對象基板，除 了各易應變之LTCC基板以外，亦可應用玻璃基板、半導 體基板、薄膜太陽電池基板等所有脆性材料基板。又，安 裝於劃線頭11上之加工用工具12除了刀輪以外，亦可為刀 157554.doc •13· 201245093 尖具有方向性之固定刀等，而於進行激光劃線之情形時 亦可為包含用於將激光光束聚光而成為聚束點並對 行照射之光學系統之光學工具》 [產業上之可利用性] 本發明可應用於如在LTCC基板等基板上形成劃線槽之 劃線裝置之基板加工裝置。 【圖式簡單說明】 圖1係表示用於實施本發明之基板加工方法之一實施例 之劃線裝置之一例之立體圖。 圖2(a)、（b)係表示搜索對準標記時之以拍攝基準位置為 中心之拍攝位置之移動順序之一例之圖。 圖3係表示上述劃線裝置之控制系統之方塊圖。 圖4(a)、（b)係表示LTCC基板之變形狀態之俯視圖。 圖5係表示先前之劃線裝置之一例之立體圖。 圆6係表示呈格子狀劃線之基板之俯視圖。 【主要元件符號說明】 2 3 4 5 6 7 8 劃線裝置 工作台 軌道 滾珠螺桿 驅動部 支撐柱 導向桿 架橋 157554.doc 導向槽 劃線頭 固定器 刀輪 相機 監視器 控制系統 圖像處理部 控制部 輸入部 X方向馬達驅動部 Y方向馬達驅動部 工作台旋轉用馬達驅動部 劃線頭驅動部 資料保持區域 劃線裝置 工作台 軌道 馬達 滚珠螺桿 驅動部 支撐柱 導向桿 架橋 -15· 201245093 40 導向槽 41 劃線頭 42 馬達 42a 固定器 43 加工用工具 44 相機 45 監視器 46 定位用基準銷 A 對準標記 M, 馬達 m2 馬達 S, 劃線槽 S2 劃線槽 w 基板 157554.doc -16-201245093 VI. Description of the Invention: [Technical Field] The present invention relates to a method of performing substrate processing using a processing tool based on an alignment mark attached to a substrate. The present invention is a substrate processing method which is particularly useful for a substrate which is susceptible to strain such as a low temperature co-fired ceramic (LTCC) substrate. [Prior Art] For example, Patent Document 1 discloses a processing method in which a cutter wheel (also referred to as a scribing wheel) is rotated while being pressed against a surface of a substrate, thereby forming a scribe line. Slot. Figure 5 shows a perspective view of an example of a prior scribing device. The scribing device 3 i includes a table 32 on which the substrate W is placed. The table 32 is movable in the Y direction along the horizontal path 33 and is driven by a ball screw 35 that is rotated by the motor 34. Further, the table 32 can be rotated in the horizontal plane by the drive unit 36 of the built-in motor. The bridge 39 supported by the branch columns 37 erected on the both sides by the clamping table 32 supports the guide bars 38 extending in the X direction. The scribing head 41 is driven by the motor 42 and is mounted in such a manner as to be movable in the x direction along the guide groove 4 formed on the guide bar 38. A holder 42a is provided on the scribing head 41, and the machining tool 43 (cutter wheel) is held by the holder 42a. The machining tool 43 adjusts the direction of the tool tip. On the other hand, when the processing tool 43 is lowered and the blade edge is pressed against the substrate W, the table 32 is moved in the γ direction, or the scribing head 41 is moved in the X direction along the guide groove 40. As shown in the drawing, the scribe groove Si in the X direction and the scribe groove S 2 in the γ direction are formed in a lattice shape on the substrate 157554.doc 201245093 W. Further, a camera 44 is provided on the upper portion of the bridge 39, and the focus can be adjusted by manually moving it up and down. The image taken by the camera 44 is displayed on the monitor 45. The corner portion of the substrate placed on the guard table 32 is formed with an alignment mark (cross mark) for determining the position, and the position of the alignment mark is detected by photographing the substrate near the alignment mark by the camera 44. . Specifically, the shape data of the alignment mark (the data of the cross shape) is previously stored in the scribing device, and the image is determined by pattern recognition by comparing the image of the substrate photographed by the camera 44 with the shape data that has been memorized. Whether the mark image is reflected in the above image. When it is judged that the alignment mark image is reflected, it is judged that the substrate is placed at the correct position, and the scribing head 41 is moved to a predetermined processing start position to start the scribing operation. If the alignment mark image cannot be detected in the image, it is judged that the substrate is deviated from the correct position, and an error message for correcting the position of the substrate is issued. Thereby, the operator corrects the positional deviation by manually adjusting the substrate position while confirming the image taken by the camera 44 by the monitor 45. Further, in the scribing device 31 of Fig. 5, the positioning reference pin 46 for guiding the substrate is provided so as to protrude from the table top. The end surface of the substrate w is placed in contact with the reference pin 46 to prevent the alignment of the substrate from being largely deviated from the range of the field of view that can be reflected in the camera 44. [Prior Art Document] 157554.doc 201245093 [Patent Document 1] [Patent Document 1] Japanese Patent No. 3078668 [Disclosure] [Problems to be Solved by the Invention] However, when the substrate to be processed is an LTCC substrate The LTCC substrate is a substrate in which a conductor is wired on a sheet obtained by mixing an alumina aggregate and a glass compound to form a multilayer film ′ at a temperature of usually 100 CTC or less, for example, about 80 〇t. The multilayer film was co-fired. The alignment marks were formed before co-firing, but there was a tendency to deform and shrink as shown by the broken lines in Fig. 4(a) and Fig. 4(b) during co-firing. If the substrate is deformed, the position of the alignment mark A on the substrate is deviated from the position (β and leaf value) at which the juice was originally set. Therefore, if the substrate W is properly placed on the stage on which the alignment mark A is to be reflected in the shooting field of view of the camera, the alignment mark a deviates from the camera's field of view due to the influence of the substrate deformation. It becomes undetectable and becomes an error display. In this case, the substrate needs to be manually moved to the position where the image of the alignment mark A can be detected, but the automatic operation must be temporarily interrupted to correct the position, which makes the work complicated and the time loss is large. On the other hand, by guiding the placement position of the substrate W by the reference pin 46 for positioning the work surface, the number of occurrences of the erroneous display can be reduced. However, this case t still has the following disadvantages: the limitation is limited due to the presence of the base (four) 46. The range of movement of the processing tool 43 used by the wire limits the area that can be processed. SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a substrate processing method for detecting an alignment mark when an alignment mark is detected by the 157554.doc 201245093 method due to deformation of the substrate. The image can be searched without interrupting the operation of the device, and the purpose of the process is to provide a deviation from the location of the county-based (four) position where the positioning is not set on the workbench. When the substrate is placed at a position where a certain deviation occurs, the substrate processing method for detecting the alignment mark can be easily performed. [Technical means for solving the problem] The scribing method of the present invention which is completed to solve the above problems, and a substrate processing method in which a substrate with an alignment mark is placed on a table for photographing alignment marks And the set photographing reference position acquires the position information of the substrate from the alignment mark image (including the image of the alignment mark image) taken by the camera, and specifies the processing of the substrate by the processing tool according to the position information. After the position, the substrate is processed; and when the alignment mark image is not detected in the shooting of the shooting reference position, the search is performed by moving the camera or the table to sequentially move the shooting position around the shooting reference position. The image is accurately marked, and the positional deviation of the imaging position and the imaging reference position when the alignment mark image is detected is calculated, and the processing position by the processing tool is corrected. [Effects of the Invention] In the method of the present invention, when the alignment mark is not detected at the photographing reference position due to the deformation of the substrate, the shooting position is adjusted around the shooting position by moving the camera or the table. The sequence moves to search for the alignment image. Therefore, even if the alignment mark image is not detected within the range of the shooting field 157554.doc 201245093 at the initial shooting reference position, the camera or the shooting position at the periphery thereof is sequentially moved to the same shooting. Search within the field of view 'Therefore, the alignment mark image can be finally detected, and the heart can detect the positional deviation of the shooting position of the alignment mark and the shooting reference position, and correct the addition of the tool according to the position deviation amount. Position, continue the substrate to enhance the action. Thereby, the cumbersomeness of manual work such as position correction of the substrate can be eliminated, and the loss of work time can be reduced. Further, even if the alignment mark is deviated from the shooting reference position more or less, the alignment mark image can be detected, and the amount of deviation between the imaging position of the alignment mark image and the reference setting position can be calculated to determine the processing position. Therefore, it is desirable to set the positioning reference pin on the table as in the prior art, and the reference pin and the processing tool do not interfere with each other, so that the effect of allowing the reinforcing tool to move freely to the periphery of the substrate is obtained. (Other technical means and effects for solving the problem) In the invention, it is preferable that when the alignment mark image is searched, the imaging position is moved in the spiral shape in the vicinity of the imaging reference position. Thereby, the alignment mark can be searched even if the alignment mark is moved in any direction on the table. In the above invention, the shooting field of view at each shooting position of the camera may be circular or square, and the shooting position may be moved so that the peripheral portion of the field of view overlaps with the shooting field of the adjacent shooting position. Thereby, the alignment mark image can surely enter the photographing field of view at any of the adjacent shooting positions, so that the detection failure can be eliminated. In the above invention, it is preferable that the detectable area of the alignment image defined by the moving range of the shooting position of the camera and the shooting field of the 157554.doc 201245093 is at least 5 mm in the vertical and horizontal directions centering on the shooting reference position. The substrate can be easily placed on the table with a positional accuracy of about 5 mm. Therefore, the alignment mark can be reliably detected by setting at least 5 mm in the vertical and horizontal directions as the detectable region ′ centering on the imaging reference position. Therefore, even if there is no reference pin for positioning which is provided in a normal device, alignment can be easily performed. Further, since the reference pin is not required, it is possible to prevent the problem caused by the reference pin (interference with the scribing mechanism, etc.). In the above invention, the substrate may be an LTCC substrate. Although the LTCC substrate is deformed by the alignment mark when co-fired, the alignment mark can be easily detected even in such a case. [Embodiment] Hereinafter, a substrate processing method of the present invention will be described in detail based on an embodiment in which a LTCC substrate is scribed. Fig. 1 is a perspective view showing an example of a scribing apparatus for scribing an LTCC substrate. The scribing device 1 includes a table 2 that can hold and hold the LTCC substrate W by an adsorption mechanism (not shown). The table 2 is movable in the Y direction along the rails 3, 3 by driving the ball screw 4 with a motor. Further, the table 2 is rotatable in the horizontal plane by the drive unit 5 built in the motor. The bridge 8 supported by the support columns 6, 6 erected on both sides by the clamping table 2 supports the guide rods 7 extending in the X direction. The scribing head 1 is driven by a motor M2 which is movable in the x direction along the guide groove 9 formed in the guide rod 7. A holder 1 is provided on the scribing head 10. A special cutter wheel (machining tool) 12 for scribing the base 157554.doc 201245093 plate is held on the holder. The direction of the cutting edge of the cutter wheel i2 (relative to the relative advancement direction of the substrate) can be adjusted in the Χ direction and the γ direction. Further, the cutter wheel 12 is lowered to press the blade tip against the substrate|the substrate to transfer the substrate w in the γ direction, or the scribing head 1〇 is moved along the guide bar 7 to thereby move the X direction. And scribe grooves in the γ direction. Further, a camera 13 that moves integrally with the cutter wheel 12 is provided on the scribing head 1〇. The focus can be adjusted by moving the camera 13 up and down. The distance between the camera 13 and the cutter wheel 12 is measured in advance, and the position in the image reflected by the camera 13 and the position of the cutter wheel 12 are correspondingly associated. The image data captured by the camera 13 is displayed on the monitor 14 and output to the image processing unit 21 (see Fig. 3) described below. An alignment mark A (refer to FIG. 4) for determining the position of the substrate w is provided on the corner portion of the substrate slide placed on the table 2, and the substrate W is photographed by the camera 13 (with the vicinity of the alignment mark a) And detecting an image including an alignment mark image (referred to as an alignment mark image), thereby detecting the position of the alignment mark A of the substrate w. Specifically, the process of drawing the pattern of the alignment mark a from the captured image by the image processing unit 21 of the control system 20 described below, and the shape data (cross mark) of the alignment mark stored in advance is performed. A comparison is made 'by this to detect the position of the alignment mark A. Further, the camera 13 (and the scribing head 10) defines the origin position of the reference, and when the position of the alignment mark a of the substrate w placed on the table 2 is detected, the motor M1, M2 is used. The drive returns to the home position and shoots at the home position. The position of the camera 13 in the state of returning to the origin is the first shooting position at the time of searching for the alignment mark ,, so it is set to 157554.doc 201245093 "shooting reference position". Figure 3 is a block diagram showing the control system 2 of the scribing device. The image data signal output from the camera 13 is supplied to the control unit 22 as image data for use as a material mark by the image processing unit 21. The input unit 23 is configured to input an input device of various processing programs such as a scribing operation of the substrate W, and a search (four) for the position (4) of the alignment mark is also input. (4) The fourth direction 22 is connected to the X-direction motor drive unit 24, the γ-direction motor drive unit, the table rotation motor drive unit 26, the scribing head drive unit 27, and the data holding area 28 (memory). In the data holding area 28, the shape data (cross data) and various processing programs required for the comparison with the position detection mark and the alignment mark of the pattern recognition are stored together. The control unit 22 controls the position of the table 2 in the direction of the rotation axis based on the processing program input from the input unit 23 and the setting parameter data required for the scribing operation, and controls the movement and operation of the scribing head 1 in the X direction. The movement of the table 2 in the direction of the cymbal. Further, when scribing the cutter wheel 12, the cutter wheel 12 is controlled so as to press-contact the surface of the substrate W with an appropriate load. Further, when the substrate W is searched for the alignment mark eight, the calculation of the shape data of the alignment mark stored in the data holding area 28 and the image selected by the image processing unit 21 is performed. Next, the search operation of the alignment mark by the control unit 22 will be described. The allowable error of the position detection can be arbitrarily changed as a parameter of the control program of the device. However, in the present embodiment, the allowable error of the position detection is set to 丄mm, and the range of the field of view of the camera 13 is proportional to the magnification of the camera (7 times). For this, set it to a square area of 2 mm on one side. That is, at a certain shooting position 157554.doc -10- 201245093, the substrate, the center position of the alignment mark (the center of the cross mark) is to be reflected in the shooting field of view, and it is determined that the shooting position is detectable. Align mark A. First, the substrate w is photographed by the camera 13 restored to the original position. At this time, the camera 13 photographs a square area having a diameter of two sides in the shooting field at the shooting reference position. The image captured by the camera 13 and the shape data of the alignment mark stored in the data holding area 28 are compared, as long as the image of the alignment mark A in the image is recognized by the pattern and the center of the JL mark is within the field of view. 'Four (4) Alignment mark A can be detected, and the position of the substrate 1 is within the tolerance of the shooting reference position. Then, the cutter wheel 12 (machining tool) is moved to a predetermined machining start position set in advance and the scribing operation is started. If the image of the alignment mark A is not reflected in the shooting field of view at the shooting reference position or the center of the mark is outside the shooting field of view: the determination is deviated from the reference setting position. In this case, the camera 13 or the table 2 is moved from the photographing reference position to the periphery thereof by the χ direction motor drive unit 24 and the γ direction motor drive unit 25, respectively, as a parameter of the control program of the drive unit. Although it can be set arbitrarily, it is arbitrarily set in consideration of the relationship between the size of the alignment mark and the imaging field of view of the camera, and in this embodiment, for example, about i.8 mm) is moved. The diameter (2 mm) which is shorter than the shooting field of view is used to search for the alignment mark image while repeating the __ of the peripheral portion of the shooting field range and the upper-second shooting position. FIG. 2 is a diagram showing the movement of the photographing position at which the camera 13 photographs the substrate w, 157554.doc •11-201245093 (search order), and the numbers (1) to (25) attached to FIG. 2(a) indicate search. order. The shooting field of the camera 13 is set to a square area of 2 mm on one side, and the number (1) at the center is defined as the "shooting reference position" of the first shooting position. The shooting reference position is the origin position of the camera 13 as described above. When the substrate W is photographed at the photographing reference position (number (1)), when the quasi-mark image is not within the photographing field of view and the alignment mark image is not detected, the photograph is taken by the camera 13 or the table 2 Move the Ub1 distance (1.8 ππη) to the left and move to the number (2) β until the alignment mark image is detected, as shown by the arrow in Fig. 2(b), to take the reference position (number (1) )) The center moves around the periphery in a spiral shape, and moves the shooting position in the order of (1) - (2) - (3) (25). Then, for example, when the alignment mark image is detected at the imaging position of the number (2〇), the control unit 22 calculates the positional deviation amount from the imaging reference position (number (1)) to the number (20). The sum of them. The calculation result is used for automatic correction of the machining start position of the cutter wheel 12, and the cutter rim is moved to the corrected machining start position to start the scribing operation. In this way, although the alignment mark image should be detectable by the shooting at the photographing reference position, the detection alignment can be automatically searched without interrupting the operation of the device even when the substrate cannot be detected due to the deformation of the substrate or the like. By marking the image to continue the scribing operation, the complexity of the work such as the position correction of the substrate w can be eliminated, and the loss of the working time can be eliminated. Even if the alignment mark image cannot be detected at the shooting reference position, the shooting position can be detected at a specific pitch and in a specific moving order by 157554.do. •12- 201245093, and the alignment can be detected. By marking the image, it is not necessary to accurately mount the substrate as in the previous position. Therefore, there is no fear that the positioning reference pin and the scribing head 丨〇 collide, and the scribe head ίο can be freely moved to the periphery of the substrate w. In this embodiment, the range of moving and searching for the shooting position is limited to 5 mm in the vertical and horizontal directions, and if there is an alignment mark in the range, the position can be surely found, but the search can be expanded when the search time can be extended. The scope of the area. Further, the movement pitch of the search is set to about 1.8 mm by controlling the control parameters of the program, but the pitch can also be adjusted according to the tolerance. At this time, it is preferable to partially overlap with one of the previous shooting field ranges, and the dead zone where the alignment mark cannot be detected is eliminated. In the present embodiment, the shooting field range is set to a square area, but it may be a circle. In the case of a square, it is easy to eliminate the dead zone. Further, the search for the alignment mark image of the camera 13 includes an area of 5 mm in the vertical and horizontal directions, and as long as it is within this range, the deviation of the alignment marks caused by the deformation of the LTCC substrate can be sufficiently covered. Further, in the above embodiment, the camera 13 is integrally attached to the scribing head 1〇, but may be attached to the bridge 8. The positional relationship between the camera 13 and the processing tool 12 can be as long as it is associated with it. The representative embodiments of the present invention have been described above, but the present invention is not limited to the specific embodiments described above. For example, as the substrate to be processed, all the brittle material substrates such as a glass substrate, a semiconductor substrate, and a thin film solar cell substrate can be applied in addition to the easily strainable LTCC substrate. Further, the processing tool 12 attached to the scribing head 11 may be a knife 157554.doc • 13· 201245093, which has a directional fixed blade, etc., in addition to the cutter wheel, and may be used for laser scribing. An optical tool including an optical system for concentrating a laser beam to be a focusing point and illuminating the line. [Industrial Applicability] The present invention can be applied to forming a scribe groove on a substrate such as an LTCC substrate. A substrate processing apparatus for a scribing device. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing an example of a scribing apparatus for carrying out an embodiment of a substrate processing method of the present invention. Figs. 2(a) and 2(b) are diagrams showing an example of the order of movement of the imaging position centered on the imaging reference position when the alignment mark is searched. Fig. 3 is a block diagram showing a control system of the above scribing device. 4(a) and 4(b) are plan views showing a deformed state of the LTCC substrate. Fig. 5 is a perspective view showing an example of a conventional scribing device. Circle 6 is a plan view showing a substrate having a lattice-shaped scribe line. [Main component symbol description] 2 3 4 5 6 7 8 Scribe device table rail ball screw drive unit support column guide rod bridge 157554.doc Guide groove dash head holder cutter wheel camera monitor control system image processing unit control Part input part X direction motor drive part Y direction motor drive part table rotation motor drive part scribing head drive part data holding area scribing device table rail motor ball screw drive part support column guide rod bridge -15· 201245093 40 Slot 41 Scriber head 42 Motor 42a Retainer 43 Machining tool 44 Camera 45 Monitor 46 Positioning reference pin A Alignment mark M, Motor m2 Motor S, scribe groove S2 scribe groove w Substrate 157554.doc -16-