201240742 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種用於將在分離玻璃基板之一分離裝置 中產生之黏附至一玻璃基板表面之雜質（主要是玻璃碎片） 自該玻璃基板表面清洗之玻璃基板表面清洗裝置及方法， 且因此更明確而言係關於一種玻璃基板表面清洗裝置及方 法’其針對液晶面板之製程中在施加一偏振板之前用於液 晶面板中之玻璃基板。 【先前技術】 當前’使用在一玻璃基板上之真空吸入構件或使用研磨 及此類物之裝置及方法係已知之用於移除黏附至玻璃基板 之雜質（主要是玻璃碎片）之清洗裝置及方法且係與分離玻 璃基板之基板分離裝置關聯（例如，日本未經審查專利申 請公開案第2008-94690號及第2005-81297號）。 【發明内容】 本發明待解決之問題在於提供一種具有可恰當應用於存 在於玻璃基板上之各種大小（例如，自1〇 4111至1〇〇〇 ^爪之 範圍中）之雜質（主要是玻璃碎片）之一清洗功能之玻璃基板 表面清洗裝置及方法。 根據本發明之該玻璃基板表面清洗裝置之一態樣係由一 玻璃基板表面清洗裝置100組成，其具有一玻璃基板支撐 及運輸機構20，其支撐一玻璃基板5〇且在一第一方向（圖3 中之M)中運輸該玻璃基板；及一玻璃基板表面清洗機構 1〇 ’其包含一清洗帶丨丨’該清洗帶丨丨將黏附至該玻璃基板 162637.doc 201240742 ，該表面之雜質_移除且在該玻璃基板之該表面上在與 s亥第一方向交又之一楚、 第一方向（圖3中之N)中滑動。該清洗 帶广於其-表面上之複數個三維結構研磨突起7〇及位 於塗層膜之間之凹槽6〇。該等凹槽6〇之寬度Μ係寬於黏附 至該玻璃基板之該表面之該雜質3⑽之該外部寬度尺寸。 此處，「清洗」意指將雜質(主要是玻璃碎片）自該玻璃 基板移除。「該雜質之外部寬度尺寸」意指該清洗帶在該 玻璃基板上滑動之該第二方向（圖3中之N)中之雜質之最大 外部周邊寬度。「凹槽」意指形成於一個三維結構研磨突 I /、另相鄰之二維結構研磨突起之間之間隙。「凹槽寬 度」意指一個三維結構研磨突起7〇之頂部72與另一相鄰之 三維結構研磨突起7〇之頂部72之間之間隔。玻璃碎片意指 當粉碎或分段玻璃產品時製作之玻璃廢棄物，或此類物。 本發明之另一態樣係用於上述玻璃基板表面清洗裝置 100中之該清洗帶11。 此外’本發明之另一態樣係由一玻璃基板表面清洗方法 組成，該方法包括：使用一玻璃基板支撐及運輸機構2〇在 一第一方向中運輸一玻璃基板50且使該玻璃基板表面清洗 機構10之一清洗帶11在該玻璃基板50之該表面上在與該第 一方向交又之一第二方向中滑動’以移除黏附至該玻璃基 板50之該表面上之雜質300。該清洗帶包含在其一表面上 之複數個三維結構研磨突起70及位於該該等塗層膜之間之 若干凹槽60。該等凹槽60之寬度係寬於黏附至該玻璃基板 5〇之該表面之該雜質300之該外部寬度尺寸。 162637.doc 201240742 根據本發明之玻璃基板表面清洗裝置及方法，可能恰當 且可靠地將具有一範圍之大小之雜質（主要是玻璃碎片）自 一玻璃基板移除。 【實施方式】 下文參考圖式詳盡地解釋本發明之實施例，但應理解， 本發明並不限於下文之實施例，且可基於一般熟悉本發明 所屬之此項技術者之認知在不背離本發明之範圍下，酌情 對設計做出修改、改良及此類物。 圖1及圖2圖解根據本發明之一清洗裝置，例如，該清洗 裝置可用於清洗在（例如，在曰本未經審查專利申請案第 2005-81297號中所揭示之液晶面板製程中）施加偏振板之過 程之前用於液晶面板中之玻璃基板之表面。在圖1中，一 玻璃基板表面清洗裝置100包含一玻璃基板支撐及運輸機 構20及一玻璃基板表面清洗機構1〇。該玻璃基板支樓及運 輸機構20包含一入口輥軸21、一出口輥軸22及一導件23， 其自下側支樓一玻璃基板50且在一第一方向（圖3中之μ)中 運輸該玻璃基板50。該玻璃基板表面清洗機構1〇包含一清 洗帶11，該清洗帶11具有大體上提供於該玻璃基板支撐及 運輸機構20之上方之中心之一無端軌道；一驅動導向滑輪 12及從動導向滑輪13' 14、15，當其施加一預定張力至該 清洗帶11時使該清洗帶11旋轉。該驅動導向滑輪12係連接 至施加驅動功率至該驅動導向滑輪12之一驅動馬達1 8。同 樣地’該清洗帶11係設置於與該玻璃基板50之該運輸方向 (第一方向’圖3中之M)交叉之一方向（第二方向，圖3中之 162637.doc -6 · 201240742 leg ^ π呀况帶11係設置與一诂 璃基板50之一頂表面接觸， 罝與玻 冰跦”今Τ , 士、 負載裝置30係設置於該清 洗帶11之正上方以施加一鱼脊 ,,,,cn 載，以將該清洗帶按壓貼靠該 玻璃基板50。視需要可佶用 罟J使用任何類型（諸如，-鼓風類 型、一水壓力類型等等）之备弟i 寻)之負載裝置作為該負载裝置30。 負載可經調整而在自約〇 〇1 v kg/Cm2至約 3 kg/cm2之範圍 内0 圖3圖解該玻璃基板表面清洗裝置1〇〇中之玻璃運輸方向 (該第-方向，圖3中之M)與滑動方向（該第二方向，圖化 該N)之間之關係。如圖3中所圖解，該清洗帶叫該玻璃 基板50上之滑動方向（該第二方向，圓3中之n)係提供於與 該玻璃基板50之該運輸方向（該第一方向，圖3中之交又 之-方向中。以此方式交叉而設置該清洗帶u之原因在於 增寬該玻璃基板50上之滑動表面，且緩和當該玻璃基板別 撞擊於該清洗帶上時之衝撞。明確而言，所提供之交又角 Θ(圖3)係在約70。至約85。或約95。至約no。之範圍中。 清洗帶滑動速度係基於考量該玻璃基板運輸速度、該玻 璃基板生產率及雜質之移除程度來確定。明確而言，該玻 璃基板50之該第二方向（圖3中之⑴中之該清洗帶滑動速度 可大體上調整至自約每分鐘1〇米（m)至約每分鐘5〇〇 m之範 圍中’且在該玻璃基板5〇之該第一方向（圖3中之M)中之運 輸速度可大體上調整至自約每分鐘〇.1 m至約每分鐘1〇 m 之範圍中。滑動速度/運輸速度之比率值係大體上在自約2 I62637.doc 201240742 至約100之範圍中。因此，在該玻璃基板表面清洗裝置l〇〇 中，由於滑動該清洗帶i i而移除雜質係主要在該第二方向 (圖3中之N)中。 圖4及圖5圖解用於根據本發明之一實施例之該玻璃基板 表面清洗機構10中之該清洗帶丨丨。如圖4及圖5中所圖解， 用於本發明中之該清洗帶丨丨係由一個三維結構研磨材料層 80及一背襯層90組成，該三維結構研磨材料層8〇包含在一 前表面上之複數個二維結構研磨突起及提供於該複數個 三維結構研磨突起70之間之凹槽6〇，該背襯層9〇自該等三 維結構研磨材料層80之該前表面之一背側支撐該三維結構 研磨材料層80。 該三維結構研磨材料層80係由該背襯層9〇之該表面上之 該等三維結構研磨突起7〇及凹槽6〇組成。 該等三維結構研磨突起7()之幾何形狀可選自包含但不限 於-立方體形狀 '一稜柱形狀、一圓柱形狀、一圓錐形 狀、一方錐形狀、一截頭方錐形狀（一方錐之截頭體）、一 截頭圓錐形狀（―圓錐形之截頭體）等等之-群組。在此等 中’具有具-平坦頂表面之該截頭方錐形式或該截頭圓雜 形式之形式係較佳。若該形式係該截頭方錐形式或該截頭 圆錐形式’則該等三維結構研磨突起7〇之該頂表面係於與 該玻璃基板接觸之平面，且促進移除黏附至該玻璃基板50 之該表面之雜質。 該等截頭方錐錢頭®錐三維結構研磨突起70大體上係 經形成而精確地成形。此處，「精確地成形」之含義與 I62637.doc 201240742 PCT國際專利公開案第W098/39142號中所揭示之含義相 同，其中，包含研磨顆粒之一黏合劑前驅物係使用一製造 工具形成於該背襯層90上’接著該黏合劑前驅物經硬化， 以形成該三維結構。 以此方式精確地成形之該等截頭方錐之各者之頂部72之 面積係）I於約0.2 mm至約20 mm2，明確而言約1 mm〗至約 1 0 mm2 »該等截頭方錐之底部74具有最大比該頂部多出約 60%明確而言最大比該頂部多出約4〇%且更明確而言最大 比該頂部多出約20〇/。之一面積。同樣地，該等截頭方錐或 圓錐形之高度（圖5中之H)係自約〇.2 mm至約5 mm，且更明 確而言約0.3 mm至約3 mm。該等三維結構研磨突起7〇之 形式最終係基於以下而確定：待移除之雜質之形式之考 量，換言之’該雜質之大小及至該基板之黏附強度等等。 該複數個三維結構研磨突起70係在大體上該第二方向 (圊3中之N)中以相等之間隔以格架或交錯形式或此類物規 則地且按序地設置於該背襯層9〇之該頂表面上。此配置係 稱為「結構化」，且其含義與國際專利公開案第 W098/39142中所使用之含義相同，因此在此說明書中， 該研磨材料層及該研磨突起係分別稱為三維結構研磨材料 層及該三維結構研磨突起。 该清洗帶11之組成材料係該背襯層9〇及該三維結構研磨 材料層80。该二維結構研磨材料層8〇係由研磨顆粒及黏合 劑製成。 必要的是，該背襯層90具有延長該清洗帶之壽命且在該 162637.doc 201240742 清洗帶11之整個寬度上均句地獲得雜質（主要是玻璃碎 片）3 00之強度及耐用性。必要的是，該清洗帶丨丨具有使得 該清洗帶11可均勻地符合於該玻璃基板5 〇或與該玻璃基板 50緊密地接觸之強度、可變形性及可撓性。該背襯層之示 例性材料係聚合物膜、紙張、織物、金屬膜、硫化纖維或 層壓片或其經處理產品。聚合物膜之實例包含但不限於： 聚酯膜、共聚酯膜、聚醯亞胺膜、聚醯胺膜等等。紙張之 實例包含但不限於：浸潰有樹脂之紙張，以增加強度或此 類物。織物之實例包含但不限於：使用選自樹脂纖維、棉 纖維、玻璃纖維及此等纖維之組合或此類物之纖維之編織 物或針織物。聚合物膜可具有一材料（諸如，乙烯丙烯酸 酯共聚物）之一底塗以促進與該等三維結構研磨突起之基 底材料之黏附。 該三維結構研磨材料層8〇包含一黏合劑基質及一研磨材 料組分，其包含分散於該黏合劑基質中作為其組成組分之 研磨顆粒。 較佳的是，該等研磨顆粒之尺寸係精細，使得不會對該 玻璃表面賦予深度刮痕。例如，㉟等研磨顆粒之尺寸係在 約0.01 μηι與約10 μηι之間更明確而言在約〇 〇1 與約5 之間且更明確而言介於約〇〇1 μηι與約3 _之間之—平 均顆粒直#。可應用至本發明之研磨顆粒之實例包含但不 於金剛石、立方氮化棚、氧化飾、溶化之氧化紹、經熱 處理之氧化⑼、溶勝凝膠m碳切、三氧化二絡、氧化 矽、氧化鍅、錯剛玉、氧化鐵、石榴石、碳酸鈣及其混合 162637.doc 201240742 物。特別適合的係金剛石、立方氮化硼、氧化鋁、碳化 矽、氧化鈽及氧化矽，其具有6或更高之一莫氏（Mohs)硬 度。 該研磨材料層係藉由使該黏合劑硬化或凝膠化而形成。 根據本發明之合適黏合劑之實例包含但不限於：盼酸樹 脂、可溶性酚醛樹脂、胺基塑膠樹脂、聚氨酯樹脂、環氧 樹脂、丙烯酸酯樹脂、聚酯樹脂、乙烯基樹脂、三聚氰胺 樹脂、丙烯酸酯化異氰脲酸酯樹脂、脲醛樹脂、異氰脲酸 醋樹脂、丙烯酸酯化聚氨酯樹脂、丙烯酸酯化環氧樹脂及 其混合物。該黏合劑可為一熱塑性樹脂。 齡越樹脂、可溶性酚醛樹脂、環氧樹脂、丙烯酸樹脂及 '氣‘自旨樹脂明確而言係適合。 該黏合劑係可輻射硬化。一可輻射硬化黏合劑係藉由輻 射能量而至少部分硬化或至少部分聚合之一黏合劑。取決 於所使用之黏合劑，可使用熱、紅外光、電子束、紫外光 或可見光作為該能量源。 通常’此等黏合劑係藉由一自由基機制聚合。較佳的 是，其選自包含丙烯酸酯化聚氨酯、丙烯酸酯化環氧、具 有α、β不飽和羰基之胺基塑膠衍生物、乙烯系不飽和化合 物、具有至少一個丙烯酸酯基之異氰脲酸酯衍生物、具有 至少一個丙烯酸酯基之異氰脲酸酯之一群組及其混合物。 若該黏合劑係用紫外輻射來硬化，則必需一光起始劑來 開始該自由基聚合。用於此目的之合適光起始劑之實例包 含但不限於：有機過氧化物、偶氮化合物、苯醌、二笨甲 I62637.doc 201240742 酮、亞硝基化合物、丙烯基齒化物、月宗、疏基化合物、吡 喃化合物、三芳基咪唑，雙咪唑，氣烷基三嗪，安息香乙 驗节縮酮，°塞°頓酮及苯乙酮衍生物。’較佳之光起始劑包 括2,2·二曱氧基]，2_二苯基_卜乙酮及2·曱基」*曱基笨 硫基）-2-嗎啉基丙酮。 右0亥黏0劑係用可見光輕射硬化，貝1必需一光起始劑來 開始自由基聚合°用於此目的之合適光起始劑之實例包 3 4一不限於美國專利第4,735,632號自第3行第25列至第4行 第1〇列；第5行第1至第7列及第6行第1至第35列中所揭 示0 該研磨材料組分係由包含複數種研磨顆粒之一漿液形 成，該等研磨顆粒係以未硬化或未凝膠化狀態分散於黏合 劑中。在硬化或凝膠化中，固定該研磨材料組分，換言 之，以一預定形狀及一預定結構固定。 關於在該研磨材料組分中研磨顆粒相對於黏合劑之混合 比例’大體上按照質量計算約5〇份至約1〇〇〇份之研磨顆粒 對按照質量計算約100份之黏合劑，且明確而言，按照質 量計算約100份至約700份之範圍中之研磨顆粒對按照質量 計算約100份之黏合劑。該比例取決於所使用之研磨顆粒 之類型及大小及黏合劑之類型而變動。 該研磨組分中可包含除了研磨顆粒及黏合劑之外之材 料。例如’常見之添加劑包含但不限於：耦合劑、濕潤 劑、染料、顏料、增塑劑、填料、脫模劑、研磨輔助劑及 其混合物。 162637.doc •12· 201240742 一輕合劑，可減 用於本發明之此 有機矽烷、鋁錯 該研磨組分可包含一耦合劑。藉由添加 小用於形成該研磨組分之該漿液之黏度。 種類之耦合劑之合適實例包含但不限於： 及鈦酸鹽。該耦合劑之數量大體上係小於約5 Μ。〆。且明確 而言小於約2 wt%。 該等三維結構研磨突起7〇之間形成該清洗帶丨丨之該三維 結構研磨材料層80之複數個凹槽6〇。該等凹槽⑽之形狀與 該背襯層9G之頂表面上之該等三維結構研磨突起7〇之該外 周邊相同。因A ’該等凹槽60之深度係與該等截頭方錐之 向度實質上相同，其係自約〇.2 _至約5職，且明確而 言自約0.3 mm至約3 _。同樣地，該等凹槽之寬度不小 於約0.3 mm，明確而言，不小於約〇5 mm，且更明確而言 不小於約1 mm。 根據本發明之該玻璃基板表面清洗裝置1〇〇之該清洗帶 11之凹槽尺寸係基於考量待移除之雜質3〇〇(主要是玻璃碎 片）之尺寸而確定。圖6及圖7示意性地圖解在該玻璃基板 表面清洗裝置100之操作期間該雜質3〇〇與該清洗帶丨丨之該 等凹槽60之間之關係。如圖6所示，當該凹槽寬度係寬於 黏附至該玻璃基板50之該表面之該雜質3 〇〇之該外部寬度 尺寸時，首先，戎玻璃基板5〇上之該雜質3 〇〇之頂部僅接 觸該三維結構研磨材料層80上建造之該複數個三維結構研 磨突起70之頂部72(見圖6A)，但藉由使該清洗帶u在該玻 璃基板50上滑動，由於該清洗帶丨丨之可撓性，該雜質3〇〇 係包含於該凹槽60中，且變得陷入於該凹槽6〇中（見圖 162637.doc 201240742 6B)。此處，「雜質變得陷入於該四槽中」意指該雜質300 之頂部之至少一部分係包含於形成於該等三維結構研磨突 起70之間之一凹槽60内，且由於該清洗帶11之滑動而在該 第二方向（圖3中之N)中遭受藉由該等三維結構研磨突起70 之一剪切力。 接著’該凹槽60内之該雜質300衝撞該凹槽60之一側 壁，換言之，維持良好形狀之該三維研磨材料層80之一側 壁（見圖6C)，且最後藉由在該凹槽60内移動，該雜質3 〇〇 係自該玻璃基板50擦拭掉且移除（見圖6D)。 另一方面，如圖7中所圖解，當該凹槽寬度62係窄於黏 附至該玻璃基板表面之該雜質300之該外部寬度尺寸時， 首先自該玻璃基板50上之該雜質300之頂部接觸該三維結 構研磨材料層80上之該複數個三維結構研磨突起7〇之頂部 72之狀態’接著即使當該雜質3〇〇由於該清洗帶丨丨之滑動 而到達一凹槽60，該雜質300並不包含於該凹槽6〇内，而 是僅僅滑動跨過該研磨層壓片（三維結構研磨突起7〇)之頂 部’且該雜質300保持於該玻璃基板5〇上，而不會自該玻 璃基板50擦拭掉。 下文係清洗该玻璃基板5 0表面之一方法之一特定實例 根據本發明之該玻璃基板表面清洗裝置藉由下列程序操 作。 、 (1)首先，實施對來自與該玻璃基板5〇相同之製造批量之一 玻璃基板之一雜質產生狀態調查之採樣，且自該採樣，調 查雜質之顆粒之數目及該雜質之外部尺寸，以獲得關於該 I62637.doc . 14 201240742 雜質之資訊。 此處，使用一光學顯微鏡之一調查或使用—影像處理元 件之一調查或此類物可實施作為該雜質產生狀態調查。 (2) 針對該製造批量，預測在該清洗帶之該滑動方向（第二 方向）中之該雜質300之該外部寬度尺寸之最大值且選擇具 有不小於此值之一凹槽寬度之一清洗帶u且將該清洗帶U 配合至該清洗裝置。 (3) 在將該第一玻璃基板5〇放置於該玻璃基板支撐及運輸機 構20上之後，基於考量該玻璃基板表面清洗之操作效率等 等來確定該清洗帶之該滑動方向（第二方向，圖3中之^相 對於該運輸方向（第一方向，圖3中之μ)之交又條件。 (4) 在使該清洗帶π在該縱向上與該玻璃基板5〇之一端緊密 接觸之後’使該玻璃基板50在該運輸方向（第一方向，圖3 中之M)中運輸，且使該清洗帶丨丨在該滑動方向（第二方 向’圖3中之N)中滑動。 (5) 在完成清洗該第一玻璃基板50之該玻璃基板表面之後， 將該第二玻璃基板及後續之玻璃基板放置於該玻璃基板支 撐及運輸機構20上，且重複上述（3)及（4)中之過程。 接著’結合一比較實例來解釋本發明之一實例。 實例 測試樣本製備 實例1及2 藉由下列方法製作適用於根據本發明之該玻璃基板表面 清洗方法中使用之具有該三維結構研磨材料層之一清洗 162637.doc 201240742 帶。 用一刀式塗布器將具有表1中所示之組合物 之研磨材料 施加液體施加至一個聚丙烯形成膜（2MM-3〇 • υ〇)上，以形 成截頭正方形方錐（一正方形方錐之載頭體 一圖案，其 具有約0.5 mm之一高度且在頂部上具有_ π + , 、 止方形之側之一 長度約2mm之一表面形式’且在該頂部 正方形之側 之一長度係約2 mm ’且該等截頭正方形方 ’（ 正方形方 錐之截頭體）之間之距離為約1 ·6 mm，装笙〜 寻之頂部上層壓 一個125 μπι之聚酯膜，其經處理以便於黏社α “ 滑塗層，該 且其具有一 防滑塗層在其後表面上包含碳酸鈣顆粒 酯樹脂，該研磨係用紫外輻射硬化，且該研磨膜 rrL俞及由妙々k挺β … 膜係分離《在not下熱處理該研磨膜達24小日寺 該研磨膜冷卻至室溫’此完成製造該研磨 與該形成 之後，將 膜。用於輕易黏 結之過程係用己烯丙烯酸酯共聚物進行底漆塗布 表1 組分 一- r——~~~~ 質量 ----- 100.0 ----- 30.0 200 氧化鋁研磨顆粒JIS WA#4000(Nanko研磨工 單丙烯酸酯單體M-101A(東亞合成株式會~- 一丙烯酸酯單體R-551(曰本化藥株式會社) ~ 光聚合起始劑Irgacure 907(BASF) 0.5 SI基2稀酿氧丙基三甲氧基石夕烧迎^1-503(曰本信越 社） 她上| ~ 一·----- 1.0 ST ~~—------- 151.5 實例3，比較實例1 由住友商事3M有限公司製造之砂石捲繞膜，5 mm 3微 162637.doc 201240742 米，氧化鋁類型2。 此研磨材料在與實例丨相同之膜基底材料上具有一研磨 材料層’其具有約0.35 mm之一高度及具有一正方形頂表 面之一截頭正方形方錐（一正方形方錐之截頭體）形之一表 面形狀’且A頂表面具有約13 _之__側，且該等截頭正 方形方錐（正方形方錐之截頭體）之間之長度為約0.5 mm, 且包含具有3 μιη之一平均顆粒直徑之氧化鋁研磨顆粒。 評估測試方法及評估測試結果 1) 製備玻璃基板，使兩個玻璃基板之邊緣一起在該等玻 璃基板上摩擦，以產生玻璃碎片，該玻璃碎片落下至該等 玻璃基板上，其等接著留下一時間段使該玻璃碎片黏附。 將該等玻璃基板分成黏附至該玻璃基板之該玻璃碎片之尺 寸（外部寬度尺寸）不超過15 mm且不小於05爪⑺之一群組 及玻璃碎片之尺寸小於0·5 mm之一群組。 2) 將實例1、2及3及比較實例1之該研磨膜處理成約3〇 mm之寬度及2080 mm之長度之無端帶，以形成該等清洗 帶。將該等清洗帶配合至一清洗裝置，將交又角θ(圖3)設 定為80° ’將該帶滑動速度設定為1〇〇 m/分鐘，且使得該 玻璃基板以6 m/分鐘之一運輸速度在該清洗帶之下方穿 過，使得黏附該碎片之表面接觸該研磨材料表面。此時， 在約0.1 MPa之一壓力下將水供應至該該帶之該後表面， 使得供應一負載至該帶且使該研磨材料表面按壓貼靠該玻 璃基板至該表面，且亦將水供應至該玻璃基板之該表面， 使得將所黏附之碎片自該表面清洗。表2顯示在清洗之後 162637.doc 201240742 剩餘在該玻璃表面上之碎片之量。 表2 實例1 實例2 實例3 比較實例1 形狀 正方形方錐 之截頭體 正方形方錐 之截頭體 正方形方錐 之截頭體 正方形方錐 之截頭體 正方形方錐之 截頭體之頂部 之表面形狀 正方形，側 為2 mm 正方形，側 為2 mm 正方形，側 為 1.3 mm 正方形，側 為 1.3 mm 正方形方錐之 截頭體之高度 0.5 mm 0.5 mm 0.35 mm 0.35 mm 凹槽之寬度 1.6 mm 1.6 mm 0.5 mm 0.5 mm 玻璃碎片大小 (外部寬度尺寸） 小於0.5 mm 不超過1.5 mm且不小 於0.5 mm 小於0.5 mm 不超過1.5 mm且不小 於0.5 mm 碎片移除效能 5 5 5 3 玻璃碎片移除效能評價 1幾乎未移除玻璃碎片。 2減少殘留玻璃碎片量，但並不充分減少。 3極大地減小殘留玻璃碎片量，但有時，達到有問題之 位準。 4殘留玻璃碎片量小。 5未偵測到殘留之玻璃碎片。 儘管已參考較佳實施例描述本發明，熟悉此項技術者將 認識到，在不脫離本發明之精神及範疇下，可做出形式及 細節上之變化。 【圖式簡單說明】 圖1係圖解根據本發明之一玻璃基板表面清洗裝置之總 162637.doc •18· 201240742 體組態之一透視圖； 圖2係圖解根據本發明之該玻璃基板表面清洗裝置之總 體組態之一前立面圖； 圖3係圖解一玻璃基板之運輸方向（第一方向，M)與根據 本發明之該玻璃基板表面清洗裝置中之該清洗帶之滑動方 向（第二方向’ N)之間之關係之一平面圖； 圖4係圖解該三維結構研磨材料層之一部分之一平面 圖’該二維結構研磨材料層具有提供於根據本發明之該玻 璃基板表面清洗裝置中之該清洗帶之該表面上之複數個三 維結構研磨突起； 圖5係沿圖4中之截面線又_又之一橫截面圖； 圖6a至圖6d係圖解黏附至一玻璃基板之該表面之雜質 (玻璃碎片）與提供於該清洗帶之該三維結構研磨材料層中 之該等凹槽之間在該等凹槽之一寬度係寬於該雜質之一外 部寬度尺寸時之行為關係之示意性橫截面圖；及 圖7a至圖7d係圖解黏附至一玻璃基板之該表面之雜質 (玻璃碎片）與提供於該清洗帶之該三維結構研磨材料層中 之該等凹槽之間在該等凹槽之一寬度係窄於該雜質之一外 邛寬度尺寸時之行為關係之示意性橫截面圖。 【主要元件符號說明】 10 玻璃基板表面清洗機構 11 清洗帶 12 驅動導向滑輪 13 從動導向滑輪 162637.doc 201240742 14 從動導向滑輪 15 從動導向滑輪 18 驅動馬達 20 玻璃基板支撐及運輸機構 21 入口輥軸 22 出口輥軸 23 導件 30 負載元件 50 玻璃基板 60 凹槽 62 凹槽60之寬度 70 三維結構研磨突起 72 三維結構研磨之頂部 74 三維結構研磨之底部 80 三維結構研磨材料層 90 背襯層 100 玻璃基板表面清洗裝置 300 雜質 162637.doc -20-201240742 VI. Description of the Invention: [Technical Field] The present invention relates to an impurity (mainly glass shard) for adhering to a surface of a glass substrate which is produced in a separating device of a separate glass substrate, from the glass substrate A glass substrate surface cleaning apparatus and method for surface cleaning, and thus more specifically relates to a glass substrate surface cleaning apparatus and method for a glass substrate used in a liquid crystal panel prior to application of a polarizing plate in a process for a liquid crystal panel. [Prior Art] Current vacuum suction members using a glass substrate or devices and methods using polishing and the like are known as cleaning devices for removing impurities (mainly glass fragments) adhered to a glass substrate and The method is also associated with a substrate separation device that separates a glass substrate (for example, Japanese Unexamined Patent Application Publication No. Publication No. 2008-94690 and No. 2005-81297). SUMMARY OF THE INVENTION The problem to be solved by the present invention is to provide an impurity (mainly glass) which can be suitably applied to various sizes (for example, in the range of from 1 to 4111 to 1 〇〇〇 claw) existing on a glass substrate. Glass substrate surface cleaning device and method for cleaning function. An aspect of the glass substrate surface cleaning apparatus according to the present invention is composed of a glass substrate surface cleaning apparatus 100 having a glass substrate supporting and transporting mechanism 20 supporting a glass substrate 5 in a first direction ( The glass substrate is transported in M) in FIG. 3; and a glass substrate surface cleaning mechanism 1' includes a cleaning tape 丨丨 which adheres to the glass substrate 162637.doc 201240742, the surface impurity Removed and slid on the surface of the glass substrate in the first direction (N in FIG. 3) in the first direction. The cleaning tape is broadly distributed over a plurality of three-dimensional structure polishing projections 7 on its surface and a recess 6〇 between the coating films. The width of the grooves 6 is wider than the outer width dimension of the impurity 3 (10) adhered to the surface of the glass substrate. Here, "cleaning" means removing impurities (mainly glass fragments) from the glass substrate. The "outer width dimension of the impurity" means the maximum outer peripheral width of the impurity in the second direction (N in Fig. 3) in which the cleaning tape slides on the glass substrate. "Groove" means a gap formed between a three-dimensional structure polishing protrusion I / and another adjacent two-dimensional structure polishing protrusion. By "groove width" is meant the spacing between the top 72 of a three-dimensionally structured abrasive projection 7〇 and the top 72 of another adjacent three-dimensionally structured abrasive projection 7〇. Glass shards mean glass waste made when comminuting or segmenting glass products, or such materials. Another aspect of the present invention is applied to the cleaning belt 11 in the above-described glass substrate surface cleaning apparatus 100. In addition, another aspect of the present invention is composed of a glass substrate surface cleaning method, which comprises: transporting a glass substrate 50 in a first direction using a glass substrate supporting and transporting mechanism 2 and making the glass substrate surface A cleaning tape 11 of the cleaning mechanism 10 slides on the surface of the glass substrate 50 in a second direction intersecting the first direction to remove the impurities 300 adhering to the surface of the glass substrate 50. The cleaning tape comprises a plurality of three-dimensional structural polishing projections 70 on one surface thereof and a plurality of grooves 60 between the coating films. The width of the grooves 60 is wider than the outer width dimension of the impurity 300 adhered to the surface of the glass substrate 5?. 162637.doc 201240742 According to the glass substrate surface cleaning apparatus and method of the present invention, it is possible to appropriately and reliably remove impurities (mainly glass fragments) having a range of sizes from a glass substrate. [Embodiment] The embodiments of the present invention are explained in detail below with reference to the drawings, but it should be understood that the present invention is not limited to the embodiments below, and may be based on the knowledge of those skilled in the art to which the present invention belongs. Modifications, improvements, and such items are made as appropriate to the scope of the invention. 1 and 2 illustrate a cleaning apparatus according to the present invention, for example, which can be used for cleaning, for example, in a liquid crystal panel process disclosed in Japanese Unexamined Patent Publication No. 2005-81297. The process of polarizing the plate is previously applied to the surface of the glass substrate in the liquid crystal panel. In Fig. 1, a glass substrate surface cleaning apparatus 100 includes a glass substrate supporting and transporting mechanism 20 and a glass substrate surface cleaning mechanism 1A. The glass substrate branch and transport mechanism 20 includes an inlet roller shaft 21, an exit roller shaft 22 and a guide member 23 from a lower side of a glass substrate 50 in a first direction (μ in FIG. 3). The glass substrate 50 is transported. The glass substrate surface cleaning mechanism 1 includes a cleaning tape 11 having one endless track substantially provided at a center above the glass substrate supporting and transporting mechanism 20; a driving guide pulley 12 and a driven guiding pulley 13' 14, 15 rotates the cleaning belt 11 when it applies a predetermined tension to the cleaning belt 11. The drive guide pulley 12 is coupled to a drive motor 18 that applies drive power to one of the drive guide pulleys 12. Similarly, the cleaning tape 11 is disposed in a direction intersecting the transport direction of the glass substrate 50 (the first direction 'M in FIG. 3') (the second direction, 162637.doc -6 · 201240742 in FIG. 3) The leg ^ π belt 11 series is placed in contact with one of the top surfaces of one of the glass substrates 50, and the 玻 and the glass 跦 Τ Τ, the load device 30 are disposed directly above the cleaning belt 11 to apply a fish ridge. ,,,,cn, to press the cleaning tape against the glass substrate 50. Any type (such as - blast type, water pressure type, etc.) can be used as needed. The load device is used as the load device 30. The load can be adjusted within a range from about v1 v kg/cm 2 to about 3 kg/cm 2 . FIG. 3 illustrates the glass in the glass substrate surface cleaning device 1 . The relationship between the transport direction (the first direction, M in Fig. 3) and the sliding direction (the second direction, which maps the N). As illustrated in Fig. 3, the cleaning tape is called the glass substrate 50. a sliding direction (the second direction, n of the circle 3) is provided in the transport direction with the glass substrate 50 (the first direction) In the cross-direction of FIG. 3, the reason why the cleaning tape u is disposed in this manner is to widen the sliding surface on the glass substrate 50 and to alleviate when the glass substrate does not hit the cleaning tape. In contrast, the provided corners (Fig. 3) are in the range of about 70 to about 85. or about 95 to about no. The cleaning belt sliding speed is based on consideration of the glass substrate transport. The speed, the productivity of the glass substrate, and the degree of removal of impurities are determined. Specifically, the second direction of the glass substrate 50 (the cleaning speed of the cleaning tape in (1) of FIG. 3 can be substantially adjusted to about every minute. 1 〇m (m) to about 5 〇〇m per minute' and the transport speed in the first direction (M in Figure 3) of the glass substrate 5〇 can be substantially adjusted to about every minute 11m to about 1〇m per minute. The ratio of sliding speed/transport speed is generally in the range from about 2 I62637.doc 201240742 to about 100. Therefore, the glass substrate surface cleaning device L〇〇, the removal of impurities due to sliding the cleaning tape ii In the second direction (N in Fig. 3), Fig. 4 and Fig. 5 illustrate the cleaning tape in the glass substrate surface cleaning mechanism 10 according to an embodiment of the present invention, as shown in Figs. 4 and 5. As illustrated in the present invention, the cleaning tape used in the present invention is composed of a three-dimensional structured abrasive material layer 80 and a backing layer 90, the three-dimensional structured abrasive material layer 8〇 comprising a plurality of two on a front surface. a dimensioning abrasive protrusion and a groove 6〇 provided between the plurality of three-dimensional structure polishing protrusions 70, the backing layer 9〇 supporting the three-dimensional structure from a back side of one of the front surfaces of the three-dimensional structure abrasive material layer 80 A layer 80 of abrasive material. The three-dimensional structure abrasive material layer 80 is composed of the three-dimensional structure polishing protrusions 7〇 and the grooves 6〇 on the surface of the backing layer 9〇. The geometry of the three-dimensional structure polishing protrusions 7() may be selected from the group consisting of, but not limited to, a cubic shape, a prism shape, a cylindrical shape, a conical shape, a tapered shape, and a truncated square pyramid shape. Head body, a truncated cone shape ("conical frustum", etc. - group. It is preferred in the form of the truncated conical shape or the truncated circular form having a flat top surface. If the form is the truncated cone or the frustoconical form, the top surface of the three-dimensional structure polishing protrusions 7 is attached to a plane in contact with the glass substrate, and facilitates removal and adhesion to the glass substrate. 50 impurities on the surface. The truncated square cone-cone three-dimensionally structured abrasive projections 70 are generally formed to be accurately formed. Here, the meaning of "precisely formed" is the same as that disclosed in I62637.doc 201240742 PCT International Publication No. W098/39142, wherein a binder precursor comprising abrasive particles is formed using a manufacturing tool. The backing layer 90 is then 'hardened' with the binder precursor to form the three dimensional structure. The area of the top 72 of each of the truncated square cones precisely formed in this manner is from about 0.2 mm to about 20 mm2, specifically about 1 mm to about 10 mm2 » the truncates The bottom 74 of the square cone has a maximum of about 60% more than the top, specifically a maximum of about 4% more than the top and more specifically a maximum of about 20% more than the top. One area. Similarly, the height of the truncated square or conical shape (H in Fig. 5) is from about 22 mm to about 5 mm, and more specifically about 0.3 mm to about 3 mm. The form of the three-dimensionally structured abrasive projections 7 is ultimately determined based on the form of the form of the impurity to be removed, in other words, the size of the impurity and the adhesion strength to the substrate, and the like. The plurality of three-dimensional structure abrasive protrusions 70 are regularly and sequentially disposed on the backing layer in substantially the second direction (N in 圊3) at equal intervals in a lattice or staggered form or the like. 9〇 on the top surface. This configuration is referred to as "structuring" and has the same meaning as used in International Patent Publication No. W098/39142. Therefore, in this specification, the abrasive material layer and the polishing protrusion are respectively referred to as three-dimensional structure grinding. The material layer and the three-dimensional structure are polished. The constituent material of the cleaning tape 11 is the backing layer 9 and the three-dimensional structured abrasive material layer 80. The two-dimensional structured abrasive material layer 8 is made of abrasive particles and an adhesive. It is essential that the backing layer 90 has an extension of the life of the cleaning tape and that the strength and durability of the impurities (mainly glass flakes) of 300 are uniformly obtained over the entire width of the cleaning tape 11 of the 162637.doc 201240742. It is essential that the cleaning tape has strength, deformability, and flexibility such that the cleaning tape 11 can uniformly conform to or in close contact with the glass substrate 5 . Exemplary materials for the backing layer are polymeric films, paper, fabrics, metal films, vulcanized fibers or laminates or treated products thereof. Examples of the polymer film include, but are not limited to, a polyester film, a copolyester film, a polyimide film, a polyamide film, and the like. Examples of paper include, but are not limited to, paper impregnated with resin to increase strength or such. Examples of the fabric include, but are not limited to, a woven or knitted fabric selected from the group consisting of resin fibers, cotton fibers, glass fibers, and combinations of such fibers or fibers of such materials. The polymeric film can have one of a material, such as an ethylene acrylate copolymer, primed to promote adhesion to the substrate material of the three dimensionally structured abrasive projections. The three-dimensional structured abrasive material layer 8A comprises a binder matrix and an abrasive material component comprising abrasive particles dispersed as a constituent component of the binder matrix. Preferably, the abrasive particles are of a fine size such that no deep scratches are imparted to the surface of the glass. For example, the size of the abrasive particles such as 35 is between about 0.01 μηι and about 10 μηι, more specifically between about 〇〇1 and about 5 and more specifically between about μ1 μηι and about 3 _ Between - the average particle straight #. Examples of abrasive particles that can be applied to the present invention include, but are not limited to, diamond, cubic nitride, oxidized, melted, heat treated oxidation (9), melted gel m carbon cut, triple oxide, tantalum oxide , cerium oxide, fused alumina, iron oxide, garnet, calcium carbonate and mixtures thereof 162637.doc 201240742. Particularly suitable are diamond, cubic boron nitride, aluminum oxide, tantalum carbide, niobium oxide and tantalum oxide having a Mohs hardness of 6 or higher. The layer of abrasive material is formed by hardening or gelating the binder. Examples of suitable binders in accordance with the present invention include, but are not limited to, acid-promoting resins, soluble phenolic resins, amine-based plastic resins, polyurethane resins, epoxy resins, acrylate resins, polyester resins, vinyl resins, melamine resins, acrylics. Esterified isocyanurate resin, urea-formaldehyde resin, isocyanuric acid vinegar resin, acrylated polyurethane resin, acrylated epoxy resin, and mixtures thereof. The binder may be a thermoplastic resin. The older resin, the resole phenolic resin, the epoxy resin, the acrylic resin, and the 'gas' resin are clearly suitable. The binder is radiation hardenable. A radiation curable adhesive is at least partially hardened or at least partially polymerized by radiation energy. Depending on the adhesive used, heat, infrared light, electron beam, ultraviolet light or visible light can be used as the energy source. Usually, these binders are polymerized by a free radical mechanism. Preferably, it is selected from the group consisting of an acrylated polyurethane, an acrylated epoxy, an amine based plastic derivative having an alpha, beta unsaturated carbonyl group, an ethylenically unsaturated compound, an isocyanurate having at least one acrylate group An acid ester derivative, a group of isocyanurates having at least one acrylate group, and mixtures thereof. If the binder is cured by ultraviolet radiation, a photoinitiator is necessary to initiate the radical polymerization. Examples of suitable photoinitiators for this purpose include, but are not limited to, organic peroxides, azo compounds, benzoquinones, dimero I62637.doc 201240742 ketones, nitroso compounds, propylene-based dentates, moons , a sulfhydryl compound, a pyran compound, a triaryl imidazole, a diimidazole, a gas alkyl triazine, a benzoin ketal, a thiophene ketone and an acetophenone derivative. The preferred photoinitiator comprises 2,2·dimethoxyl], 2_diphenyl-ethylidene and 2·indolyl*(indolylthio)-2-morpholinylacetone. The right 0 ray 0 agent is light-hardened by visible light, and the shell 1 requires a photoinitiator to initiate radical polymerization. An example of a suitable photoinitiator for this purpose is not limited to U.S. Patent No. 4,735,632. From line 3, column 25 to line 4, column 1; row 5, columns 1 to 7, and row 6, columns 1 to 35, the abrasive material component is comprised of a plurality of types of abrasives. A slurry of one of the particles is formed, and the abrasive particles are dispersed in the binder in an uncured or ungelatinized state. In the hardening or gelation, the abrasive material component is fixed, in other words, fixed in a predetermined shape and a predetermined structure. Regarding the mixing ratio of the abrasive particles to the binder in the abrasive material component, "about 5 parts by mass to about 1 part by mass of the abrasive particles in terms of mass, about 100 parts by weight of the binder, and In terms of mass, about 100 parts by weight of the abrasive particles in the range of about 100 parts to about 700 parts by mass are calculated. The ratio varies depending on the type and size of the abrasive particles used and the type of the binder. The abrasive component may contain materials other than abrasive particles and binders. For example, 'common additives include, but are not limited to, coupling agents, wetting agents, dyes, pigments, plasticizers, fillers, mold release agents, grinding aids, and mixtures thereof. 162637.doc • 12· 201240742 A light mixture which can be used in the present invention. The organic decane, aluminum wrong. The abrasive component can comprise a coupling agent. By adding the small viscosity of the slurry used to form the abrasive component. Suitable examples of a class of couplant include, but are not limited to: and titanates. The amount of the coupling agent is generally less than about 5 Torr. Hey. And specifically less than about 2 wt%. A plurality of grooves 6〇 of the three-dimensional structured abrasive material layer 80 of the cleaning tape are formed between the three-dimensional structure polishing protrusions 7〇. The grooves (10) have the same shape as the outer periphery of the three-dimensional structure polishing projections 7 on the top surface of the backing layer 9G. Since the depth of the grooves 60 is substantially the same as the depth of the truncated square cones, it is from about 2.2 _ to about 5, and specifically from about 0.3 mm to about 3 _ . Likewise, the width of the grooves is not less than about 0.3 mm, specifically, not less than about mm5 mm, and more specifically not less than about 1 mm. The groove size of the cleaning tape 11 of the glass substrate surface cleaning apparatus 1 according to the present invention is determined based on the size of the impurity 3 (mainly glass flakes) to be removed. Figures 6 and 7 schematically illustrate the relationship between the impurities 3 and the grooves 60 of the cleaning tape during operation of the glass substrate surface cleaning apparatus 100. As shown in FIG. 6, when the width of the groove is wider than the outer width dimension of the impurity 3 黏 adhered to the surface of the glass substrate 50, first, the impurity 3 on the bismuth glass substrate 5 〇〇 The top portion only contacts the top portion 72 of the plurality of three-dimensional structure polishing protrusions 70 (see FIG. 6A) constructed on the three-dimensional structure abrasive material layer 80, but by sliding the cleaning tape u on the glass substrate 50, due to the cleaning With the flexibility of the tape, the impurity 3 is contained in the groove 60 and becomes trapped in the groove 6 (see Fig. 162637.doc 201240742 6B). Here, "the impurity becomes trapped in the four grooves" means that at least a part of the top of the impurity 300 is contained in one of the grooves 60 formed between the three-dimensional structure polishing protrusions 70, and The sliding of 11 experiences a shearing force of one of the protrusions 70 by the three-dimensional structures in the second direction (N in Fig. 3). Then, the impurity 300 in the recess 60 collides against one of the sidewalls of the recess 60, in other words, maintains a good shape of one side wall of the three-dimensional abrasive material layer 80 (see FIG. 6C), and finally by the recess 60. After moving, the impurity 3 is wiped off and removed from the glass substrate 50 (see Fig. 6D). On the other hand, as illustrated in FIG. 7, when the groove width 62 is narrower than the outer width dimension of the impurity 300 adhered to the surface of the glass substrate, first from the top of the impurity 300 on the glass substrate 50. Contacting the state of the top portion 72 of the plurality of three-dimensional structure polishing protrusions 7 on the three-dimensional structure abrasive material layer 80. Then, even when the impurity 3〇〇 reaches a groove 60 due to the sliding of the cleaning tape, the impurity 300 is not included in the groove 6〇, but merely slides across the top of the abrasive laminate (three-dimensional structure polishing protrusion 7〇) and the impurity 300 remains on the glass substrate 5〇 without Wipe off from the glass substrate 50. The following is a specific example of a method of cleaning the surface of the glass substrate 50. The glass substrate surface cleaning apparatus according to the present invention operates by the following procedure. (1) First, sampling of an impurity generation state of one of the glass substrates of the same manufacturing lot as the glass substrate 5 is performed, and from the sampling, the number of particles of the impurity and the external size of the impurity are investigated. Get information about the impurities in the I62637.doc. 14 201240742. Here, investigation using one of the optical microscopes or using one of the image processing elements or such an object can be performed as the impurity generation state investigation. (2) for the manufacturing lot, predicting the maximum value of the outer width dimension of the impurity 300 in the sliding direction (second direction) of the cleaning tape and selecting one of the groove widths not less than the value of the cleaning With u, the cleaning tape U is fitted to the cleaning device. (3) after the first glass substrate 5 is placed on the glass substrate supporting and transporting mechanism 20, the sliding direction of the cleaning tape is determined based on the operational efficiency of the surface cleaning of the glass substrate, etc. (second direction) In Fig. 3, the condition is opposite to the transport direction (the first direction, μ in Fig. 3). (4) The cleaning strip π is brought into close contact with one end of the glass substrate 5 in the longitudinal direction. Then, the glass substrate 50 is transported in the transport direction (first direction, M in FIG. 3), and the cleaning tape is slid in the sliding direction (the second direction 'N in FIG. 3). (5) After the surface of the glass substrate of the first glass substrate 50 is cleaned, the second glass substrate and the subsequent glass substrate are placed on the glass substrate supporting and transporting mechanism 20, and the above (3) and (the above) are repeated. 4) Next, an example of the present invention will be explained in conjunction with a comparative example. Example Test Sample Preparation Examples 1 and 2 are produced by the following method for use in the surface cleaning method of the glass substrate according to the present invention. Three-dimensional structure One of the layers of abrasive material is cleaned 162637.doc 201240742. The abrasive application liquid having the composition shown in Table 1 is applied to a polypropylene forming film (2MM-3〇•υ〇) using a knife applicator. To form a truncated square square cone (a pattern of a square square cone head body having a height of about 0.5 mm and having _π + on the top, and one of the sides of the square shape having a length of about 2 mm) 'And one of the sides on the side of the top square is about 2 mm ' and the distance between the truncated square squares (the truncated body of the square pyramid) is about 1 · 6 mm, mounting ~ looking for the top Laminating a 125 μm polyester film which is treated to facilitate the adhesion of the α “slip coating”, which has a non-slip coating comprising calcium carbonate particulate ester resin on the rear surface thereof, which is hardened by ultraviolet radiation. And the polishing film rrL Yu and the 々 々 挺 ... ... ... ... ... 《 《 《 《 《 热处理 热处理 热处理 热处理 热处理 热处理 热处理 热处理 热处理 热处理 热处理 热处理 热处理 热处理 热处理 热处理 热处理 热处理 热处理 热处理 热处理 热处理 热处理 热处理 热处理 热处理 热处理 热处理 热处理 热处理 热处理 热处理 热处理 热处理Used for easy bonding Primer coating with hexene acrylate copolymer Table 1 Component 1 - r -~~~~ Quality----- 100.0 ----- 30.0 200 Alumina abrasive particles JIS WA#4000 (Nanko Grinding monoacrylate monomer M-101A (East Asia Synthetic System ~- Monoacrylate monomer R-551 (Sakamoto Chemical Co., Ltd.) ~ Photopolymerization initiator Irgacure 907 (BASF) 0.5 SI base 2 Oxypropyl propyl trimethoxy sulphate ^ 1- ^ 1-503 (曰本信越社) She on | ~ 一·----- 1.0 ST ~~-------- 151.5 Example 3, Comparative Example 1 Sumitomo Corporation 3M Co., Ltd. manufactured sandstone wound film, 5 mm 3 micro 162637.doc 201240742 m, alumina type 2. The abrasive material has a layer of abrasive material on the same membrane substrate material as the example crucible, which has a height of about 0.35 mm and a truncated square square cone with a square top surface (a truncated body of a square square cone) One of the surface shapes 'and the top surface of the A has a side of about 13 __, and the length between the truncated square square cones (the truncated body of the square pyramid) is about 0.5 mm, and includes 3 μm One of the average particle diameters of alumina abrasive particles. Evaluating Test Methods and Evaluating Test Results 1) Preparing a glass substrate such that the edges of the two glass substrates are rubbed together on the glass substrates to produce glass shards that fall onto the glass substrates, which are then left The glass shards are adhered for a period of time. The glass substrate is divided into a group of the glass shards adhered to the glass substrate (the outer width dimension) of not more than 15 mm and not less than one group of the 05 claws (7) and the glass shards having a size smaller than 0. 5 mm. . 2) The abrasive films of Examples 1, 2 and 3 and Comparative Example 1 were processed into endless tapes having a width of about 3 mm and a length of 2080 mm to form the cleaning tapes. The cleaning belts are fitted to a cleaning device, and the intersection angle θ (Fig. 3) is set to 80°. The belt sliding speed is set to 1 〇〇m/min, and the glass substrate is made 6 m/min. A transport speed passes under the cleaning belt such that the surface to which the debris adheres contacts the surface of the abrasive material. At this time, water is supplied to the rear surface of the belt at a pressure of about 0.1 MPa so that a load is supplied to the belt and the surface of the abrasive material is pressed against the glass substrate to the surface, and the water is also The surface of the glass substrate is supplied such that the adhered debris is cleaned from the surface. Table 2 shows the amount of debris remaining on the glass surface after cleaning 162637.doc 201240742. Table 2 Example 1 Example 2 Example 3 Comparative Example 1 Shaped square square cone truncated cone square truncated cone square truncated cone truncated square square cone truncated square square conical frustum top Surface shape square, 2 mm square on the side, 2 mm square on the side, 1.3 mm square on the side, 1.3 mm on the side. Height of the truncated body of the square pyramid 0.5 mm 0.5 mm 0.35 mm 0.35 mm Width of the groove 1.6 mm 1.6 Mm 0.5 mm 0.5 mm Glass chip size (outer width dimension) Less than 0.5 mm Not more than 1.5 mm and not less than 0.5 mm Less than 0.5 mm Not more than 1.5 mm and not less than 0.5 mm Debris removal efficiency 5 5 5 3 Glass chip removal efficiency Evaluation 1 barely removed glass shards. 2 reduce the amount of residual glass fragments, but not fully reduced. 3 Greatly reduce the amount of residual glass shards, but sometimes it reaches the problematic level. 4 The amount of residual glass fragments is small. 5 No residual glass fragments were detected. While the invention has been described with respect to the preferred embodiments, the embodiments of the invention may be BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing a configuration of a total of 162637.doc • 18· 201240742 of a glass substrate surface cleaning apparatus according to the present invention; FIG. 2 is a diagram showing the surface cleaning of the glass substrate according to the present invention. 1 is a front elevational view of the overall configuration of the device; FIG. 3 is a diagram illustrating a transport direction (first direction, M) of a glass substrate and a sliding direction of the cleaning tape in the surface cleaning device of the glass substrate according to the present invention (No. a plan view of a relationship between the two directions 'N); FIG. 4 is a plan view showing one of the three-dimensional structure abrasive material layers having the two-dimensional structure abrasive material layer provided in the glass substrate surface cleaning device according to the present invention a plurality of three-dimensional structure grinding protrusions on the surface of the cleaning tape; FIG. 5 is a cross-sectional view along the cross-sectional line of FIG. 4; FIG. 6a to FIG. 6d are diagrams of the surface adhered to a glass substrate. The impurity (glass shard) is between the grooves provided in the layer of the three-dimensional structured abrasive material of the cleaning tape, and the width of one of the grooves is wider than the outer width of the impurity. Schematic cross-sectional view of the behavioral relationship of the time; and Figures 7a to 7d illustrate the impurities (glass shards) adhered to the surface of a glass substrate and the layers of the three-dimensional structured abrasive material provided in the cleaning tape A schematic cross-sectional view of the behavior of the grooves between the widths of one of the grooves being narrower than the outer width of the one of the impurities. [Main component symbol description] 10 Glass substrate surface cleaning mechanism 11 Cleaning tape 12 Driving guide pulley 13 Driven guide pulley 162637.doc 201240742 14 Driven guide pulley 15 Driven guide pulley 18 Drive motor 20 Glass substrate support and transport mechanism 21 Entrance Roller 22 Outlet Roller 23 Guide 30 Load Element 50 Glass Substrate 60 Groove 62 Width of Groove 60 70 Three-Dimensional Structure Grinding Protrusion 72 Three-Dimensional Structure Grinding Top 74 Three-Dimensional Structure Grinding Bottom 80 Three-Dimensional Structure Abrasive Material Layer 90 Backing Layer 100 Glass substrate surface cleaning device 300 Impurity 162637.doc -20-