JP2014220495A - Foreign substance removal device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a foreign substance removal device capable of removing a foreign substance deposited to a substrate of an EUVL mask or nanoimprint lithography without damaging the substrate.SOLUTION: A foreign substance removal device 100 comprises: a stage 111 holding an EUVL mask blank 500; a foreign substance removal tape 122 for removing a foreign substance deposited to the EUVL mask blank 500, the hardness of particles contained in the foreign substance removal tape 122 being lower than the hardness of a surface to remove the foreign substance in the EUVL mask blank 500; a foreign substance removal part 120 for performing foreign substance removal processing on the EUVL mask blank 500 while running the foreign substance removal tape 122; and a foreign substance removal control part 180 which performs control to relatively move the EUVL mask blank 500 and the foreign substance removal part 120 in such a manner that the foreign substance removal tape 122 is abutted to the foreign substance.

Description

  The present invention relates to a foreign matter removing apparatus that removes foreign matter attached to a substrate such as a mask used in an exposure apparatus.

EUVL (Extreme Ultraviolet Lithography) is known as a technology for realizing further miniaturization of semiconductors.
In EUVL, a reflective EUVL mask is used. In EUVL masks, the minimum size of unacceptable defects is very small compared to conventional ArF masks. Therefore, even if slight foreign matter adheres to the EUVL mask, it becomes a defective product. The EUVL mask is very expensive and is also affected by the price reduction of semiconductor devices. When a defect is found in the EUVL mask, a technique for repairing the defect is desired.

In Patent Document 1, when there is a defect in which a portion that should be a bright portion of a pattern is a dark portion, the second multilayer film reflective layer at that portion is removed, and the portion is thus a bright portion. An EUVL mask capable of correcting defects is disclosed.
Patent Document 2 discloses a technique for reclaiming a substrate by peeling and removing a multilayer reflective film.

A technique called nanoimprint lithography (NIL) is also attracting attention as a technique for realizing further miniaturization of semiconductors.
In NIL, a desired shape is transferred to a resin on a substrate by placing a mold (original) on the substrate. At this time, if foreign matter is present on the substrate, the substrate becomes defective, and in the worst case, the mold may be damaged. Therefore, in the NIL, it is required to accurately remove foreign matters on the substrate. Here, in the foreign substance removal in the NIL, a process with higher accuracy than that in the case of the above-described EUVL mask is required. This is because the height of foreign matter allowed in the NIL is an order of magnitude smaller than the height of foreign matter allowed in the EUVL mask.
Patent Document 3 discloses a technique for removing foreign substances by polishing a substrate in NIL.

JP 2002-313694 A JP 2005-191352 A JP 2013-201424 A

The techniques disclosed in Patent Document 1 and Patent Document 2 described above are techniques for repairing defects on the multilayer reflective film side, that is, on the surface side of the EUVL mask. If there is a defect on the surface side of the EUVL mask, that is, the pattern surface, it becomes a pattern defect. Therefore, in Patent Document 1 and Patent Document 2 described above, this surface-side defect is repaired.
However, since the EUVL mask is used by adsorbing and holding the back surface thereof, if even a small amount of foreign matter adheres to the back surface, the EUVL mask may not be held correctly. In this case, distortion or misalignment occurs. For this reason, even when foreign matter adheres to the back surface of the EUVL mask, there is a problem that the EUVL mask becomes defective. Therefore, in the EUVL mask, when a foreign substance adheres to the back surface, a technique for removing the foreign substance and making the EUVL mask usable is desired.

  Further, the technique disclosed in Patent Document 3 is different from the conventional method for holding the substrate, and it is necessary to greatly change the configuration of the entire semiconductor manufacturing apparatus, and the versatility is low. Further, the technique disclosed in Patent Document 3 uses a liquid such as a polishing liquid or pure water as in conventional polishing when polishing a substrate, and is basically performed conventionally. It was the same as CMP. Therefore, even if CMP or the like is performed, the remaining minute foreign matters cannot be locally removed.

  The subject of this invention is providing the foreign material removal apparatus which can remove the foreign material adhering to board | substrates, such as EUVL mask and nanoimprint lithography, without scratching a board | substrate.

  The present invention solves the above problems by the following means. In addition, in order to make an understanding easy, although the code | symbol corresponding to embodiment of this invention is attached | subjected and demonstrated, it is not limited to this.

  The invention of claim 1 includes a holding portion (111, 1111) for holding a substrate (500, 1500), a foreign matter removing tape (122, 1122) that contains particles and scrapes and removes the foreign matter attached to the substrate. The foreign substance removing unit (120, 1120) that performs the foreign substance removing process on the substrate while running the foreign substance removing tape, and the substrate and the foreign substance removing unit are relatively arranged so that the foreign substance removing tape contacts the foreign substance. And a foreign matter removing apparatus (100, 1100) including a control unit (180, 1180) for controlling the movement to be moved.

  The invention of claim 2 is a holding part (111) for holding the substrate (500) and a foreign matter removing tape for scraping and removing foreign matter adhering to the substrate, the hardness of the particles contained in the foreign matter removing tape. A foreign matter removing tape (122) having a lower surface hardness than the surface for removing foreign matters on the substrate, a foreign matter removing portion (120) for performing a foreign matter removing process on the substrate while running the foreign matter removing tape, A foreign matter removing apparatus (100) comprising: a control unit (180) that controls the relative movement of the substrate and the foreign matter removing unit so that the foreign matter removing tape contacts the foreign matter.

  The invention of claim 3 is the foreign matter removing apparatus according to claim 2, wherein the substrate (500) is an EUVL (Extreme Ultra Violet Lithography) mask or an EUVL mask blank, and the foreign matter removing portion (120) is: A foreign matter removing apparatus (100), wherein foreign matter attached to a back surface opposite to a reflective surface of the EUVL mask or the EUVL mask blank is removed with a foreign matter removing tape (122).

A fourth aspect of the present invention is the foreign matter removing apparatus (100) according to the _{third aspect} , wherein the particles are aluminum oxide (Al ₂ O ₃ ).

  According to a fifth aspect of the present invention, in the foreign matter removing apparatus according to any one of the second to fourth aspects, the surface of the substrate (500) from which the foreign matter is removed is a chromium nitride (CrN) film (505). The foreign substance removing device (100) is characterized in that the particle has a hardness lower than that of the chromium nitride film.

  The invention of claim 6 comprises a holding portion (1111) for holding a substrate (1500), a foreign matter removing tape (1122) containing particles and scraping and removing foreign matter adhering to the substrate, and the foreign matter removing tape. A foreign matter removing unit (1120) that performs a foreign matter removing process on the substrate while running, and the substrate and the foreign matter removing unit are controlled to move relative to each other so that the foreign matter removing tape contacts the foreign matter. A foreign matter removing apparatus comprising a control unit (1180), wherein the substrate is a silicon wafer (1500) used for nanoimprint lithography, and the foreign matter removing unit removes foreign matter attached to the silicon wafer. A foreign matter removing device (1100) characterized by being removed with a tape.

  A seventh aspect of the present invention is the foreign matter removing apparatus according to the sixth aspect, wherein the particles have a hardness capable of removing foreign matter contained in at least each layer (1502) formed on the silicon wafer (1500). It is a foreign material removal apparatus (1100) characterized by having.

  The invention of claim 8 is the foreign matter removing apparatus (1100) according to claim 7, wherein the particles are aluminum oxide (Al2O3).

  A ninth aspect of the present invention is the foreign matter removing apparatus according to any one of the first to eighth aspects, further comprising a foreign matter detection unit for detecting foreign matter attached to the substrate (500, 1500), The foreign matter removing apparatus (100, 1100) is characterized in that the control unit is controlled based on the coordinates of the foreign matter obtained by the foreign matter detecting unit.

  A tenth aspect of the present invention is the foreign matter removing apparatus according to any one of the first to ninth aspects, wherein the inspection result of the foreign matter inspection device for detecting the foreign matter attached to the substrate (500, 1500) is obtained. A foreign matter removing device (100, 1100) having a receiving unit (182, 1182) for receiving and controlling the control unit (180, 1180) based on the coordinates of the foreign matter obtained by the receiving unit. It is.

  The eleventh aspect of the present invention is the foreign matter removing apparatus according to the ninth aspect, further comprising a determination unit that determines whether or not foreign matter removal is necessary from the size of the foreign matter obtained by the foreign matter detection unit. The foreign matter removing apparatus (100, 1100) is characterized in that the foreign matter removing process is performed on the substrate (500, 1500) based on a determination result.

  A twelfth aspect of the present invention is the foreign substance removing apparatus according to any one of the first to eleventh aspects, further comprising a foreign substance measuring unit (130) for measuring the shape of the foreign substance existing on the substrate (500, 1500). , 1130) and a determination unit (182, 1182) for determining whether or not the foreign matter needs to be removed from the measurement result of the foreign matter measurement unit, and the foreign matter removal process for the substrate based on the determination result of the determination unit. It is a foreign substance removal apparatus (100, 1100) characterized by performing.

  The invention of claim 13 is the foreign matter removing apparatus according to claim 12, wherein the foreign matter measuring section (130, 1130) is a shape measuring system using a confocal optical system. , 1100).

  A fourteenth aspect of the present invention is the foreign matter removing apparatus according to any one of the first to thirteenth aspects, wherein the reference surface measuring unit measures the position of the reference surface for removing the foreign matter on the substrate (500, 1500). (140, 1140), and the control unit (180, 1180) includes the foreign matter removal tape (122, 1122) based on the position of the foreign matter removal target reference surface of the substrate measured by the reference surface measurement unit. The foreign matter removing apparatus (100, 1100) is characterized by relatively moving the substrate and the foreign matter removing portion (120, 1120) to a position where the substrate comes into contact with the foreign matter removal target reference surface of the substrate.

  A fifteenth aspect of the present invention is the foreign matter removing apparatus according to any one of the first to fourteenth aspects, wherein the foreign matter removing portion (1120) includes the substrate (1500) and the foreign matter removing tape (1122). Has a head (1300) provided on the opposite side of the substrate with the foreign matter removing tape interposed therebetween, and the foreign matter removing tape is floated a predetermined distance from the head. A foreign matter removing device (1100) characterized by having a floating structure.

  According to a sixteenth aspect of the present invention, in the foreign matter removing apparatus according to the fifteenth aspect, the floating structure allows the foreign matter to be removed from the head by flowing a gas between the head (1300) and the foreign matter removing tape (1122). A foreign matter removing device (1100) characterized in that a removing tape is floated at a predetermined distance.

  According to a seventeenth aspect of the present invention, in the foreign matter removing apparatus according to any one of the first to sixteenth aspects, the foreign matter removing tape (1122) is planar at a position in contact with the substrate (1500). It is the foreign material removal apparatus (1100) characterized by having been developed in this.

  According to the present invention, the foreign matter removing apparatus can remove foreign matter attached to a substrate such as an EUVL mask or nanoimprint lithography without damaging the substrate.

It is a figure which shows embodiment of the foreign material removal apparatus 100 by this invention. It is a figure which shows the structure of the periphery of the foreign material removal part 120 in detail. 5 is a control block diagram of a portion related to a foreign matter removal control unit 180. FIG. It is sectional drawing which shows the layer structure of EUVL mask blank 500. FIG. It is a figure which shows the example of the observation image by the optical head 130 when a foreign material removal process is actually performed using the foreign material removal apparatus 100 of 1st Embodiment. It is a figure which shows the other example of the observation image by the optical head 130 when a foreign material removal process is actually performed using the foreign material removal apparatus 100 of 1st Embodiment. It is a figure which shows 2nd Embodiment of the foreign material removal apparatus 1100 by this invention. It is a figure which shows the structure of the periphery of the foreign material removal part 1120 in detail. It is the perspective view which expanded the head 1300 and the foreign material removal tape 1122 of 2nd Embodiment, and was seen from the foreign material removal object side. It is the perspective view which expanded the head 1300 of 2nd Embodiment and was seen from the foreign material removal object side. It is sectional drawing which cut | disconnected the head 1300 and the foreign material removal tape 1122 of 2nd Embodiment along the foreign material removal tape 1122, and showed typically. It is a figure explaining the compressed air supply structure with which the foreign material removal apparatus 1100 of 2nd Embodiment is provided. FIG. 10 is a control block diagram of a portion related to a foreign matter removal control unit 1180. 6 is a cross-sectional view showing a state in which foreign matter is attached to a silicon wafer 1500. FIG.

  The best mode for carrying out the present invention will be described below with reference to the drawings.

(First embodiment)
FIG. 1 is a diagram showing a first embodiment of a foreign matter removing apparatus 100 according to the present invention.
In addition, each figure shown below including FIG. 1 is the figure shown typically, and the magnitude | size and shape of each part are exaggerated suitably for easy understanding.
In the following description, specific numerical values, shapes, materials, and the like are shown and described, but these can be changed as appropriate.

The foreign matter removing apparatus 100 according to the first embodiment is a device that removes foreign matter (particles) attached to an EUVL (Extreme Ultra Violet Lithography) mask blank 500. The term “substrate” used as a generic term for foreign object removal targets in the present invention is not limited to the EUVL mask blank described above, and includes, for example, an EUV mask as a foreign object removal target. It is not limited.
The foreign matter removal apparatus 100 of the first embodiment includes an XY stage 110, a foreign matter removal unit 120, an optical head 130, a displacement meter 140, a computer 150, a monitor 160, an XY stage control unit 170, and foreign matter removal control. Part 180.

The XY stage 110 includes a stage 111 and ball screw mechanisms 112 and 113.
The stage 111 is a holding unit configured to hold the EUVL mask blank 500 that is a foreign matter removal target on its upper surface and to be independently movable in the X direction and the Y direction by the ball screw mechanisms 112 and 113.
Each of the ball screw mechanisms 112 and 113 includes a motor provided on a frame (not shown), a screw shaft that rotates in synchronization with the rotation shaft of the motor, and a nut provided on the stage 111. , And a mechanism that can move independently in the Y direction.
The XY stage 110 is provided with an encoder (not shown), and is controlled so as to accurately move to a designated position by control of a computer 150 described later.

The foreign matter removal unit 120 performs foreign matter removal processing on the EUVL mask blank 500 held on the stage 111.
FIG. 2 is a diagram showing the configuration around the foreign matter removing unit 120 in more detail.
The foreign matter removing unit 120 includes a fixed base member 190 connected to a frame (not shown). The fixed base member 190 is provided with two guide rails 191a and 191b extending in the Z-axis direction. A movable base member 121 is connected to the guide rails 191a and 191b so as to be movable up and down. A Z-axis motor 192 is attached to the fixed base member 190. The Z-axis motor 192 is connected to a screw shaft that constitutes a ball screw 193 that functions as a moving unit that relatively moves the EUVL mask blank 500 and the foreign matter removing unit 120 so that the foreign matter removing tape 122 contacts the foreign matter. Yes. A nut attached to the movable base member 121 is movably mounted on the screw shaft of the ball screw 193. Therefore, the movable base member 121 can freely move up and down along the Z-axis direction by driving the Z-axis motor 192. Various drive mechanisms other than the combination of a motor and a ball screw may be used as the Z-axis drive device.

  A tape cassette 125 is mounted on the movable base member 121 in a replaceable state. The tape cassette 125 includes a supply reel 123 and a take-up reel 124 around which the foreign matter removing tape 122 is wound.

The supply reel 123 is a reel on the side where the foreign matter removing tape 122 is fed, and a tension motor 212 (see FIG. 3) is connected to the supply reel 123.
The tension motor 212 is a motor with an encoder having an encoder (not shown). The tension motor 212 obtains information about its own rotation speed from the encoder and outputs it.

  The take-up reel 124 is a reel on the side where the foreign matter removing tape 122 is taken up, and is connected to a take-up motor 211 (see FIG. 3). The winding motor 211 is constituted by a pulse motor.

  The foreign matter removing tape 122 is mounted between two reels via, for example, four guide rollers and a head chip 126. Details of the foreign matter removing tape 122 will be described later.

  In addition, a rotary encoder 127 is provided in one of the guide rollers, and the amount of movement of the foreign matter removing tape 122 in the travel route can be detected.

  During the foreign matter removal process, the foreign matter removal tape 122 travels from the supply reel 123 toward the take-up reel 124 by the driving force generated by the take-up motor 211. At this time, the CPU 185 and the computer 150, which will be described later, perform control so as to run at a constant speed while a certain tension is applied to the foreign matter removal tape 122. This control uses information detected by the three encoders of the supply reel 123 and the rotary encoder 127. Further, the traveling speed of the foreign matter removing tape 122 can be changed in units of 1 mm / sec, for example.

  The optical head 130 is a foreign matter measurement unit (shape measurement system) that is provided on the movable base member 121 and can measure the height of foreign matter attached to the EUVL mask blank 500 and observe foreign matter. The optical head 130 has an imaging device configured by a confocal optical system. This imaging apparatus includes an illumination optical system that generates a focused line-shaped light beam, a scanning system that scans the surface of the work with the line-shaped light beam, and a line sensor that receives reflected light from the work surface. The optical head 130 scans the observation surface of the EUVL mask blank 500 with a focused line-shaped light beam and captures a two-dimensional confocal image of the observation surface of the EUVL mask blank 500. The output signal from the line sensor is output as a two-dimensional image signal of the observation surface of the EUVL mask blank 500, and a two-dimensional image of the observation surface of the EUVL mask blank 500 is displayed on the monitor 160. Therefore, the operator can grasp the shape of the foreign matter by observing the image of the foreign matter via the optical head 130. Further, the operator can grasp the state of the EUVL mask blank 500 after removing the foreign matter by observing with the optical head 130, and can determine whether or not the foreign matter has been appropriately removed by one removal process. When the operator determines that the removal of the foreign matter is insufficient based on the observation result by the optical head 130, the operator can perform the foreign matter removal process again on the same foreign matter.

  As a characteristic of the confocal optical system, when the Z-axis scanning is performed by continuously displacing the focusing point of the illumination beam with respect to the surface to be measured, if the focusing point (focal point) is located on the sample surface, The maximum luminance value is detected. Therefore, the height of the foreign matter can be measured by performing signal processing using the position information when the focal point is located on the surface to be measured and the positional information when the focal point is located on the surface of the foreign matter. .

  The displacement meter 140 is a reference surface measurement unit that is provided on the movable base member 121 and can detect the position of the foreign matter removal unit 120 in the Z-axis direction with respect to the foreign matter removal target reference surface of the EUVL mask blank 500. The displacement meter 140 according to the first embodiment irradiates the reference surface of the foreign substance removal target surface of the EUVL mask blank 500 with the laser beam, receives the reflected laser light reflected from the reference surface of the foreign substance removal target, and measures the distance. Laser displacement meter to perform. The displacement meter is not limited to the laser displacement meter, and may be another type of displacement meter such as a displacement meter using an encoder. The position information read by the displacement meter 140 is used as position information in the Z-axis direction of the foreign substance removal unit 120 with respect to the reference coordinate system.

  The computer 150 functions as a control unit that performs overall control of the operation of the foreign matter removing apparatus 100 and receives user operations. A monitor 160 is connected to the computer 150, and various information such as an observation image by the optical head 130 can be displayed.

  The XY stage control unit 170 controls the operation of the XY stage 110 in accordance with an instruction from the computer 150.

The foreign matter removal control unit 180 controls the operation of the foreign matter removal unit 120.
FIG. 3 is a control block diagram of a portion related to the foreign matter removal control unit 180.
The foreign matter removal control unit 180 includes a position control unit 181 and a tape travel control unit 184.

  The position control unit 181 includes a CPU 182 and a PLD unit 183.

  The CPU 182 mainly performs control related to the position of the foreign matter removing unit 120.

  A PLD (Programmable Logic Device) unit 183 is connected to the CPU 182, the Z-axis motor driver 191, the optical head 130, the displacement meter 140, and the load cell 200. Here, the load cell 200 measures a load acting on the foreign matter removing unit 120 (head chip 126) in a state where the foreign matter removing tape 122 is pressed against the EUVL mask blank 500 during the foreign matter removing process.

  The tape running control unit 184 includes a CPU 185 and a PLD unit 186, and is connected to the winding motor 211, the tension motor 212, the rotary encoder 127, and the tape end sensor 213.

  The tape end sensor 213 detects that the foreign matter removing tape 122 wound around the supply reel 123 is lost. The tape end sensor 213 may directly detect the amount of the foreign matter removal tape 122 wound around the supply reel 123 by an optical sensor or the like, or may use various marks (magnetic or reflective) provided at the terminal portion of the foreign matter removal tape 122. Member etc.) may be detected. Further, the tape end may be detected using the encoder output of the supply reel 123 without providing the tape end sensor 213 as a dedicated independent sensor. When the tape end sensor 213 detects that the foreign matter removing tape 122 has run out, this is displayed on the monitor 160 and prompts the operator to replace the tape.

FIG. 4 is a cross-sectional view showing the layer structure of the EUVL mask blank 500.
In the first embodiment, an EUVL mask blank that is formed in a square having a side of 152 mm and has a thickness of 6.35 mm is used as the EUVL mask blank 500 that is a foreign object removal target.
The EUVL mask blank 500 has a plurality of layers stacked on the basis of a substrate 501 made of low thermal expansion glass.
On the surface side of the substrate 501, a multilayer film 502, a protective film 504, and an absorber 503 are laminated in this order from the substrate 501 toward the surface side. A back surface protective film 505 is laminated on the back surface side of the substrate 501.

  The multilayer film 502 is a layer that is provided on the substrate 501 and functions as a reflection mirror for EUV light. The multilayer film 502 usually has a structure in which several tens of layers of molybdenum and silicon are alternately stacked. With this structure, about 65% of EUV light having a wavelength of 13.5 nm incident perpendicularly to the multilayer film 502 can be reflected. 4 expresses that the multilayer film 502 has a multilayer structure, the number of layers of the multilayer film 502 shown in FIG. 4 is simplified and is different from the actual one.

  The protective film 504 is provided between the absorber 503 and the multilayer film 502, and protects the multilayer film 502 when the absorber 503 is etched. The protective film 504 is also called a buffer layer or a capping layer.

The absorber 503 is provided on the surface side of the protective film 504 and absorbs EUV light.
Note that a resist pattern is formed on the absorber 503 in order to manufacture an EUVL mask that is actually used for exposure. Then, by performing etching using the resist pattern as a mask, a patterned EUVL mask is completed.

  The back surface protective film 505 is a hard coating film provided to protect the back surface of the substrate 501. The back surface protective film 505 of the first embodiment is formed of a chromium nitride (CrN) film. The hardness of the back surface protective film 505 formed of the chromium nitride film is 1800 Hv or more.

Here, the foreign substance removal processing using the foreign substance removal tape 122 will be described.
The foreign matter removing tape 122 is based on a PET (Polyethylene terephthalate) tape, and aluminum oxide (Al ₂ O ₃ ) particles are bound on the tape using a synthetic resin as a binder. The foreign matter removing tape 122 is for removing the foreign matter by scraping with particles contained in the foreign matter removing tape 122 by contacting the foreign matter while being run. The foreign matter removing tape 122 of the first embodiment is configured by a weight ratio of PET: 78% or more, aluminum oxide: 14% or more, and synthetic resin: 8% or less. The foreign matter removing tape 122 has a width of 3.8 mm, a thickness of 28 μm, and a plurality of types can be used with a surface roughness Ra between 0.07 μm and 0.26 μm.
In the first embodiment, the surface from which foreign matter is to be removed (foreign matter removal target reference surface) is the back surface protective film 505 of the EUVL mask blank 500, and the hardness of the chromium nitride film that forms this is 1800 Hv or higher as described above. is there.
Therefore, the foreign matter removing tape 122 of the first embodiment uses aluminum oxide having a hardness Hv = 1500 selected as particles. Here, an important point is that the foreign matter removing tape 122 is used in which the hardness of the contained particles is lower than the hardness of the surface from which the foreign matter of the EUVL mask blank 500 is removed. As a result, even if the foreign matter removing process is performed in which the foreign matter removing tape 122 is brought into contact with the back surface protective film 505 of the EUVL mask blank 500 to travel, the back surface protective film 505 of the EUVL mask blank 500 is not damaged.

  Since the hardness of aluminum oxide has a width of about 1400 Hv to 1800 Hv, here, aluminum oxide of 1500 Hv or less is selected and used.

In the first embodiment, a material used as an abrasive tape is used as the foreign matter removing tape 122 that satisfies the above conditions. The foreign matter removing tape 122 is not limited to a polishing tape, and other types of tape may be used as long as the hardness of the particles contained in the foreign matter removing tape is lower than the hardness of the surface from which the foreign matter is removed. Good.
For example, when a tape having an overcoating structure of spherical particles and a binder material is used, the aggression on a foreign matter removal target can be alleviated and the possibility of damaging the foreign matter removal target can be reduced.

Next, the operation of the foreign substance removal process of the foreign substance removal apparatus 100 of the first embodiment will be described.
The EUVL mask blank 500 in which foreign matter is detected as a result of foreign matter inspection using a separately prepared foreign matter inspection apparatus is held on the stage 111 of the foreign substance removal apparatus 100. Then, the CPU 182 receives the defect coordinate information (XY coordinate value) obtained by the foreign object inspection apparatus as an inspection result as a reception unit. Then, according to the defect coordinate information, the optical head 130 is moved near the foreign matter. Then, the height of the foreign matter is measured while the back surface of the EUVL mask blank 500 is automatically scanned in the Z-axis direction by the optical head 130 at the XY coordinate position within the range where the foreign matter is present. This height measurement is performed by moving the XY coordinate position in accordance with the inspection result coordinates within a range where the foreign matter exists, and confirms the height of the foreign matter.
Next, the EUVL mask blank 500 is moved together with the stage 111 by the XY stage 110 so that the head chip 126 of the foreign matter removing unit 120 is directly above the detected foreign matter.
Next, the distance from the tip of the head chip 126 to the upper surface of the back surface protective film 505 of the EUVL mask blank 500 is measured by the displacement meter 140.

  In accordance with the distance measurement result by the displacement meter 140, the foreign matter removing unit 120 is lowered, and when the distance between the foreign matter and the head chip 126 becomes a predetermined distance or less, the foreign matter removing tape 122 starts to travel. If the foreign matter removing portion 120 continues to descend while the foreign matter removing tape 122 is running, the foreign matter removing tape 122 comes into contact with the foreign matter and the foreign matter can be removed. Note that the foreign matter removal processing is not finished in one operation, but the foreign matter removal unit 120 is lowered to a position where the foreign matter and the foreign matter removal tape 122 are in contact with each other by a predetermined amount, for example, and the first treatment is finished. The operator then re-observes the position where the foreign matter is present by the optical head 130 and determines whether or not to perform the second foreign matter removal process. As a result, if necessary, the foreign substance removal unit 120 may be further lowered and the second and subsequent processes may be performed compared to the first process.

  In addition, the load acting on the head chip 126 during the foreign substance removal process is monitored by the load cell 200, and load control is also performed so that the load does not exceed a predetermined value. For example, when an abnormal load occurs In this case, a security measure such as stopping the lowering of the foreign substance removing unit 120 together with a warning is performed.

  Here, as described above, the hardness of the particles contained in the foreign matter removal tape 122 is lower than the hardness of the surface from which the foreign matter is removed. Therefore, if the foreign matter cannot be completely removed by several foreign matter removal processes, the foreign matter removal tape 122 may be run while contacting the back surface protective film 505 of the EUVL mask blank 500 to perform the foreign matter removal process. Good. Even if a foreign matter removal process is performed in which the foreign matter removal tape 122 is brought into contact with the back surface protective film 505 of the EUVL mask blank 500 and travels, there is a difference in hardness between the back surface protective film 505 and the foreign matter removal tape 122. The back surface protective film 505 of the blank 500 is not damaged. Moreover, since the load control described above is also performed, the risk of damaging the back surface protective film 505 of the EUVL mask blank 500 is further reduced.

FIG. 5 is a diagram illustrating an example of an observation image by the optical head 130 when the foreign matter removal processing is actually performed using the foreign matter removal apparatus 100 of the first embodiment.
FIG. 5A shows an image before the foreign matter removal process, and FIG. 5B shows an image after the foreign matter removal process.
Before the foreign substance removal process, a foreign substance having a length of about 50 μm and a height of about 14 μm from the reference surface for foreign substance removal adhered to the back surface protective film 505. However, after the foreign substance removal process, the foreign substance is completely removed. It is.

FIG. 6 is a diagram illustrating another example of an image observed by the optical head 130 when the foreign matter removal processing is actually performed using the foreign matter removal apparatus 100 of the first embodiment.
6A shows an image before the foreign matter removal process, FIG. 6B shows an image after the first foreign matter removal process, and FIG. 6C shows the second time. FIG. 6D shows an image after the foreign matter removal process is performed, and FIG. 6D shows an image after the third foreign matter removal process.
Prior to the foreign matter removal process, a foreign matter having a length of about 35 μm and a height of about 2 μm from the reference surface for foreign matter removal adhered to the back surface protective film 505. In this example, the foreign matter was completely removed by performing the foreign matter removing process three times in total.

  As described above, according to the first embodiment, the hardness of the particles contained in the foreign material removal tape 122 is set lower than the hardness of the back surface protective film 505 that is the target surface from which the foreign material of the EUVL mask blank 500 is removed. . Therefore, even if the foreign matter removing process is performed in which the foreign matter removing tape 122 is brought into contact with the back surface protective film 505 of the EUVL mask blank 500 to travel, the back surface protective film 505 of the EUVL mask blank 500 is not damaged. Further, since the foreign matter removing tape 122 can be moved while being in contact with the back surface protective film 505 of the EUVL mask blank 500, the probability that foreign matter can be removed becomes very high.

(Second Embodiment)
FIG. 7 is a view showing a second embodiment of the foreign matter removing apparatus 1100 according to the present invention.
In addition, each figure shown below including FIG. 7 is the figure typically shown, and the magnitude | size and shape of each part are exaggerated suitably for easy understanding.
In the following description, specific numerical values, shapes, materials, and the like are shown and described, but these can be changed as appropriate.

The foreign matter removing apparatus 1100 of the second embodiment is an apparatus that removes foreign matter (particles) attached to the silicon wafer 1500 and each film layer used in nanoimprint lithography (NIL).
The foreign matter removal apparatus 1100 of the second embodiment includes an XY stage 1110, a foreign matter removal unit 1120, an optical head 1130, a displacement meter 1140, a computer 1150, a monitor 1160, an XY stage control unit 1170, and foreign matter removal control. Part 1180.

The XY stage 1110 has a stage 1111 and ball screw mechanisms 1112 and 1113.
The stage 1111 is a holding unit configured to hold a silicon wafer 1500 that is a foreign object removal target on its upper surface and to be moved independently in the X direction and the Y direction by the ball screw mechanisms 1112 and 1113.
Each of the ball screw mechanisms 1112 and 1113 includes a motor provided on a frame (not shown), a screw shaft that rotates in synchronization with the rotation shaft of the motor, and a nut provided on the stage 1111. , And a mechanism that can move independently in the Y direction.
The XY stage 1110 is provided with an encoder (not shown), and is controlled so as to accurately move to a designated position under the control of a computer 1150 described later.

The foreign matter removal unit 1120 performs foreign matter removal processing on the silicon wafer 1500 held on the stage 1111.
FIG. 8 is a diagram showing the configuration around the foreign matter removing unit 1120 in more detail.
The foreign matter removing unit 1120 includes a fixed base member 1190 connected to a frame (not shown). The fixed base member 1190 is provided with two guide rails 1191a and 1191b extending in the Z-axis direction. A movable base member 1121 is connected to the guide rails 1191a and 1191b so as to be movable up and down. A Z-axis motor 1192 is attached to the fixed base member 1190. The Z-axis motor 1192 is connected to a screw shaft that forms a ball screw 1193 that functions as a moving unit that relatively moves the silicon wafer 1500 and the foreign matter removing unit 1120 so that the foreign matter removing tape 1122 contacts the foreign matter. . A nut attached to the movable base member 1121 is movably attached to the screw shaft of the ball screw 1193. Therefore, the movable base member 1121 can freely move up and down along the Z-axis direction by driving the Z-axis motor 1192. Various drive mechanisms other than the combination of a motor and a ball screw may be used as the Z-axis drive device.

  A tape cassette 1125 is mounted on the movable base member 1121 in a replaceable state. The tape cassette 1125 includes a supply reel 1123 and a take-up reel 1124 around which the foreign matter removing tape 1122 is wound.

The supply reel 1123 is a reel on the side where the foreign matter removing tape 1122 is fed, and is connected to a tension motor 1212 (see FIG. 13).
The tension motor 1212 is a motor with an encoder having an encoder (not shown). The tension motor 1212 obtains information about its own rotation speed from the encoder and outputs it.

  The take-up reel 1124 is a reel on the side where the foreign matter removing tape 1122 is taken up, and is connected to a take-up motor 1211 (see FIG. 13). The winding motor 1211 is constituted by a pulse motor.

  The foreign matter removing tape 1122 is mounted between two reels via, for example, four guide rollers and a head 1300. Details of the foreign matter removing tape 1122 will be described later.

  In addition, a rotary encoder 1127 is provided in one of the guide rollers, and the amount of movement of the foreign matter removing tape 1122 in the travel path can be detected.

FIG. 9 is an enlarged perspective view of the head 1300 and the foreign matter removal tape 1122 according to the second embodiment as seen from the foreign matter removal target side.
FIG. 10 is an enlarged perspective view of the head 1300 according to the second embodiment viewed from the foreign object removal target side.
FIG. 11 is a cross-sectional view schematically showing the head 1300 and the foreign matter removal tape 1122 of the second embodiment cut along the foreign matter removal tape 1122.
The head 1300 includes a head main body 1301, a lid member 1302, and a supply pipe 1303.

The head main body 1301 includes a flat portion 1301a, a concave portion 1301b, a groove portion 1301c, an orifice portion 1301d, a guide groove 1301e, and a chamber 1301f.
The flat portion 1301a is a surface that faces the silicon wafer 1500, which is a foreign object removal target, in parallel. The foreign matter removing tape 1122 removes foreign matters while running along the flat portion 1301a. In the second embodiment, since the foreign matter removing tape 1122 travels along the flat portion 1301a, the foreign matter removing tape 1122 is developed in a planar shape at a position where it comes into contact with the silicon wafer 1500. Therefore, the contact area of the foreign matter removal tape 1122 with respect to the silicon wafer 1500 is increased, and the pressure on the contact surface can be reduced.

  The concave portion 1301b is formed in a counterbore shape lower than the flat portion 1301a at the position where the foreign matter removing tape 1122 passes.

  The groove part 1301c is formed in the two edge parts which the recessed part 1301b opposes. The direction in which the groove portion 1301c extends is a direction orthogonal to the direction in which the foreign matter removing tape 1122 travels.

  The orifice part 1301d is a through-hole formed through the center part of the recess 1301b up to the chamber 1301f.

  The guide groove 1301e is a groove formed at the end of the flat portion 1301a, and guides the traveling of the foreign matter removing tape 1122.

  The chamber 1301f is a space formed inside the head main body 1301, and the compressed air supplied from the supply pipe 1303 temporarily stays there.

  The lid member 1302 is a member that covers the chamber 1301 f of the head main body 1301.

  The supply pipe 1303 is inserted into the chamber 1301f, and supplies compressed air that has passed through a filter, which will be described later, into the chamber 1301f.

  The head 1300 of the second embodiment has a floating structure in which the foreign matter removing tape 1122 is lifted by a predetermined distance from the head 1300 by the above-described configuration.

FIG. 12 is a diagram illustrating a compressed air supply structure provided in the foreign matter removing apparatus 1100 according to the second embodiment.
The foreign matter removing apparatus 1100 includes an air source 1401, a regulator 1402, a solenoid valve 1403, and a filter 1404 in addition to the configuration described above.
The air source 1401 is configured by, for example, an air compressor, a gas cylinder, or the like. The compressed air supplied from the air source 1401 is sent to the regulator 1402.
The regulator 1402 adjusts (depressurizes) the pressure of the compressed air to a necessary pressure.
The electromagnetic valve 1403 opens and closes the flow path in accordance with an instruction from a PLD 1186 described later.
The filter 1404 removes dust and moisture contained in the compressed air that has passed through the electromagnetic valve 1403. The compressed air that has passed through the filter 1404 is supplied to the head 1300 through the supply pipe 1303.

Here, the operation of floating the foreign matter removing tape 1122 will be described.
During the foreign substance removal process, the compressed air supplied to the head 1300 through the supply pipe 1303 accumulates at a predetermined pressure in the chamber 1301f. Further, a part of the compressed air in the chamber 1301f passes through the orifice part 1301d, is increased in speed, and is jetted to the concave part 1301b, and flows between the flat part 1301a and the foreign matter removing tape 1122 at a high speed. At this time, according to Bernoulli's law, the air pressure between the flat portion 1301a and the foreign matter removing tape 1122 is reduced from the atmospheric pressure. As a result, the foreign matter removing tape 1122 generates a force F1 that is pressed against the head 1300. By appropriately setting the balance between the force F1, the dead weight of the foreign matter removing tape 1122, and the tension F2 acting on the foreign matter removing tape 1122, the foreign matter removing tape 1122 is located at a position away from the head 1300 by a predetermined distance. It will be in a floating state.

  In the foreign matter removal process, the foreign matter removal tape 1122 travels from the supply reel 1123 to the take-up reel 1124 side by the driving force generated by the take-up motor 1211. At this time, the CPU 1185 and the computer 1150, which will be described later, perform control so as to run at a constant speed while a constant tension is applied to the foreign matter removal tape 1122. For this control, information detected by the three encoders of the supply reel 1123 and the rotary encoder 1127 is used. Further, the traveling speed of the foreign matter removing tape 1122 can be changed, for example, in units of 1 mm / sec.

The optical head 1130 is provided on the movable base member 1121 and is a foreign matter measuring unit (shape measurement system) capable of measuring the height of foreign matter attached to the silicon wafer 1500 and observing the foreign matter. The optical head 1130 has an imaging device configured by a confocal optical system. This imaging apparatus includes an illumination optical system that generates a focused line-shaped light beam, a scanning system that scans the surface of the work with the line-shaped light beam, and a line sensor that receives reflected light from the work surface. The optical head 1130 scans the observation surface of the silicon wafer 1500 with a focused line-shaped light beam and captures a two-dimensional confocal image of the observation surface of the silicon wafer 1500. The output signal from the line sensor is output as a two-dimensional image signal of the observation surface of the silicon wafer 1500, and a two-dimensional image of the observation surface of the silicon wafer 1500 is displayed on the monitor 1160. Therefore, the operator can grasp the shape of the foreign matter by observing the image of the foreign matter via the optical head 1130. Further, the operator can grasp the state of the silicon wafer 1500 after removing the foreign matter by observing with the optical head 1130 and can determine whether or not the foreign matter has been properly removed by one removal process. When the operator determines that the removal of the foreign matter is insufficient based on the observation result by the optical head 1130, the operator can perform the foreign matter removal process again on the same foreign matter.
In addition, the foreign matter removal processing again may be performed based on numerical slice judgment from the height measurement value or foreign matter trace judgment by image processing in addition to the judgment by the operator.

  As a characteristic of the confocal optical system, when the Z-axis scanning is performed by continuously displacing the focusing point of the illumination beam with respect to the surface to be measured, if the focusing point (focal point) is located on the sample surface, The maximum luminance value is detected. Therefore, the height of the foreign matter can be measured by performing signal processing using the position information when the focal point is located on the surface to be measured and the positional information when the focal point is located on the surface of the foreign matter. .

  The displacement meter 1140 is provided on the movable base member 1121 and is a reference surface measurement unit that can detect the position of the foreign matter removal unit 1120 in the Z-axis direction with respect to the foreign matter removal target reference surface of the silicon wafer 1500. The displacement meter 1140 according to the second embodiment irradiates a laser beam on a foreign object removal target reference surface of the silicon wafer 1500, receives the reflected laser light reflected from the foreign matter removal target reference surface, and performs distance measurement. It is a laser displacement meter. The displacement meter is not limited to the laser displacement meter, and may be another type of displacement meter such as a displacement meter using an encoder. The position information read by the displacement meter 1140 is used as position information in the Z-axis direction of the foreign substance removing unit 1120 with respect to the reference coordinate system.

  The computer 1150 functions as a control unit that performs overall control of the operation of the foreign matter removing apparatus 1100 and receives user operations. A monitor 1160 is connected to the computer 1150, and various information such as an observation image can be displayed by the optical head 1130.

  The XY stage control unit 1170 controls the operation of the XY stage 1110 according to an instruction from the computer 1150.

The foreign matter removal control unit 1180 controls the operation of the foreign matter removal unit 1120.
FIG. 13 is a control block diagram of a portion related to the foreign matter removal control unit 1180.
The foreign matter removal control unit 1180 includes a position control unit 1181 and a tape travel control unit 1184.

  The position control unit 1181 has a CPU 1182 and a PLD unit 1183.

  The CPU 1182 mainly performs control related to the position of the foreign matter removing unit 1120.

  A PLD (Programmable Logic Device) unit 1183 is connected to the CPU 1182, the Z-axis motor driver 1191, the optical head 1130, the displacement meter 1140, and the load cell 1200. Here, the load cell 1200 measures a load acting on the foreign matter removing unit 1120 (head 1300) in a state where the foreign matter removing tape 1122 is pressed against the silicon wafer 1500 during the foreign matter removing process.

  The tape running control unit 1184 includes a CPU 1185 and a PLD unit 1186, and is connected to a winding motor 1211, a tension motor 1212, a rotary encoder 1127, a tape end sensor 1213, and an electromagnetic valve 1403.

  The tape end sensor 1213 detects that the foreign matter removal tape 1122 wound around the supply reel 1123 has been lost. The tape end sensor 1213 may directly detect the amount of the foreign matter removing tape 1122 wound around the supply reel 1123 by using an optical sensor or the like, or may use various marks (magnetic or reflective) provided at the terminal portion of the foreign matter removing tape 1122. Member etc.) may be detected. Further, the tape end may be detected using the encoder output of the supply reel 1123 without providing the tape end sensor 1213 as a dedicated independent sensor. When the tape end sensor 1213 detects that the foreign matter removing tape 1122 has run out, the fact is displayed on the monitor 1160 to prompt the operator to replace the tape.

FIG. 14 is a cross-sectional view showing a state in which foreign matter is attached to the silicon wafer 1500.
The silicon wafer 1500 includes a silicon wafer main body 1501 and a planarization layer 1502. Further, a multilayer film may be formed between the silicon wafer body 1501 and the planarization layer 1502.
The planarization layer 1502 is formed in order to flatten the surface of the silicon wafer body 1501 having unevenness when a circuit is formed, for example, when a circuit of a plurality of layers is formed on the silicon wafer body 1501. The planarization layer 1502 is in a state of being polished by CMP processing. However, even if the CMP process is performed, foreign matter that is taken in and protrudes into the planarization layer 1502 or each film layer may remain. FIG. 14 schematically shows the remaining foreign matter d.
In the foreign matter removing apparatus 1100 of the second embodiment, for example, when the height h of the foreign matter d is 100 nm or more, it is used to remove this, and the height h of the foreign matter d is suppressed to less than 100 nm. This is because if the height h of the foreign matter d is 100 nm or more, the mold (original plate) may be damaged in the NIL.

Here, the foreign matter removal processing using the foreign matter removal tape 1122 will be described.
The foreign matter removing tape 1122 is based on a PET (Polyethylene terephthalate) tape, and aluminum oxide (Al ₂ O ₃ ) particles are bound on the tape using a synthetic resin as a binder. The foreign matter removing tape 1122 is for scraping and removing foreign matter by particles contained in the foreign matter removing tape 1122 by contacting the foreign matter while being run.
In the second embodiment, a material used as an abrasive tape is used as the foreign matter removing tape 1122 that satisfies the above conditions.

Next, the operation of the foreign substance removal processing of the foreign substance removal apparatus 1100 of the second embodiment will be described.
As a result of the foreign substance inspection using a separately prepared foreign substance inspection apparatus, the silicon wafer 1500 from which the foreign substance d is detected is held on the stage 1111 of the foreign substance removal apparatus 1100. Then, the CPU 1182 receives the defect coordinate information (XY coordinate value) obtained by the foreign substance inspection apparatus as an inspection result as a reception unit. Then, according to the defect coordinate information, the optical head 1130 is moved near the foreign object d. Then, the height of the foreign matter d is measured while the silicon wafer 1500 is automatically scanned in the Z-axis direction by the optical head 1130 at the XY coordinate position within the range where the foreign matter d exists. This height measurement is performed by moving the XY coordinate position in accordance with the inspection result coordinates within the range where the foreign matter d exists, and the height of the foreign matter d is confirmed.
Next, the silicon wafer 1500 is moved together with the stage 1111 by the XY stage 1110 so that the head 1300 of the foreign matter removing unit 1120 is directly above the detected foreign matter d.
Next, the distance from the tip of the head 1300 to the upper surface of the silicon wafer 1500 is measured by the displacement meter 1140.

  In accordance with the distance measurement result by the displacement meter 1140, the foreign matter removing unit 1120 is lowered, and when the distance between the foreign matter d and the head 1300 becomes equal to or less than a predetermined distance, the foreign matter removing tape 1122 starts to travel. At this time, the foreign substance removal tape 1122 travels in a state of floating from the head 1300. If the lowering of the foreign matter removing portion 1120 is continued while the foreign matter removing tape 1122 is running, the foreign matter removing tape 1122 comes into contact with the foreign matter d, and the foreign matter d can be removed.

  Here, even if the parallelism between the foreign matter removal tape 1122 and the surface of the silicon wafer 1500 is low and the portion other than the foreign matter on the silicon wafer 1500 and the foreign matter removal tape 1122 come into contact with each other, the foreign matter removal tape 1122 As a result, the silicon wafer 1500 can be prevented from being seriously damaged.

  Note that the foreign matter removal processing is not finished in one operation, but, for example, the foreign matter removal unit 1120 is lowered to a position where the foreign matter d and the foreign matter removal tape 1122 are in contact with each other by a predetermined amount, and the first processing is finished. . The operator then re-observes the position where the foreign substance d exists by the optical head 1130 and determines whether or not to perform the second foreign substance removal process. As a result, if necessary, the foreign substance removal unit 1120 may be further lowered and the second and subsequent processes may be performed as compared with the first process.

  Further, the load acting on the head 1300 during the foreign substance removal processing is monitored by the load cell 1200, and load control is also performed so that the load does not exceed a predetermined value. For example, when an abnormal load occurs. Performs security measures such as stopping the descent of the foreign substance removing unit 1120 together with a warning.

  As described above, according to the second embodiment, the foreign matter removing tape 1122 travels in a state of floating from the head 1300 and removes the foreign matter, so that the foreign matter removing tape is as if the silicon wafer 1500 is gently stroked. 1122 contacts the silicon wafer 1500. In addition, since the foreign matter removing tape 1122 travels along the flat portion 1301a, the pressure on the contact surface can be kept low. Therefore, even if the foreign matter removing tape 1122 comes into contact with a portion on the silicon wafer 1500 where no foreign matter is present, the silicon wafer 1500 is not significantly damaged. Therefore, the foreign matter removing apparatus 1100 according to the second embodiment can remove fine foreign matters, for example, having a foreign matter height of about 100 nm, which cannot be realized in the past, without damaging the silicon wafer 1500. it can.

(Deformation)
The present invention is not limited to the embodiment described above, and various modifications and changes are possible, and these are also within the scope of the present invention.

(1) In each embodiment, as an operation of the foreign matter removal process, an example in which the position where the foreign matter removal unit 120 (or the foreign matter removal unit 1120) is lowered is changed stepwise has been described. For example, as a foreign matter removal processing operation, the foreign matter removal tape 122 (or the foreign matter removal tape 1122) is brought into contact with the back surface protective film 505 (or the silicon wafer 1500) of the EUVL mask blank 500 from the first time. You may make it drive | work.

(2) In each embodiment, the foreign matter removing tape 122 (or the foreign matter removing portion 1120) has been described with an example having aluminum oxide particles. For example, the foreign matter removal tape may have silicon dioxide (SiO ₂ ) as foreign matter removal particles.

(3) In each embodiment, an example in which the substrate for removing foreign matter is an EUVL mask or an EUVL mask blank (or a silicon wafer 1500) has been described. For example, the substrate from which foreign matter is to be removed may be a glass substrate for a liquid crystal display device or other types of substrates. For example, in the second embodiment, as an example of the substrate for removing foreign matter, the planarization layer 1502 of the silicon wafer 1500 has been described as an example. However, a silicon oxide film, a silicon nitride film, and a silicon-based film are used. A foreign substance contained in each film layer may be removed. In these cases, the particles of the foreign matter removal tape may be appropriately selected and used to have a hardness that can remove the foreign matter to be removed. In addition, when the board | substrate of the foreign material removal object differs from the said embodiment, it is necessary to use the thing whose particle | grain hardness which a foreign material removal tape has is lower than the hardness of a board | substrate.

(4) In each embodiment, the example which performs a foreign material removal based on the result of having performed a foreign material inspection using the foreign material inspection apparatus prepared separately was explained. However, the present invention is not limited to this. For example, the foreign matter removing apparatus may further include a foreign matter detecting unit that detects foreign matter attached to the substrate. In this case, the foreign substance removal process may be performed based on the coordinates of the foreign substance obtained by the foreign substance detection unit. As a result, it is possible to omit the substrate replacement work and the like, and the work can be performed more efficiently. In this case, for example, the CPU 182 (or CPU 1182) may be provided with a function as a determination unit that determines whether or not foreign matter removal is necessary from the size of the foreign matter obtained by the foreign matter detection unit. In this case, the foreign substance removal process can be performed on the substrate based on the determination result of the determination unit (CPU 182 (or CPU 1182)), and the burden on the operator can be reduced.

(5) In the second embodiment, an example in which compressed air is used to float the foreign matter removing tape 1122 has been described. For example, other gases such as nitrogen may be used.

  In addition, although embodiment and a deformation | transformation form can also be used in combination as appropriate, detailed description is abbreviate | omitted. Further, the present invention is not limited by the embodiments described above.

DESCRIPTION OF SYMBOLS 100 Foreign material removal apparatus 110 XY stage 111 Stage 112, 113 Ball screw mechanism 120 Foreign material removal part 121 Movable base member 122 Foreign material removal tape 123 Supply reel 124 Take-up reel 125 Tape cassette 126 Head chip 127 Rotary encoder 130 Optical head 140 Displacement meter 150 Computer 160 Monitor 170 Stage Control Unit 180 Foreign Object Removal Control Unit 181 Position Control Unit 182 CPU
183 PLD unit 184 Tape running control unit 185 CPU
186 PLD section 190 Fixed base member 191 Z-axis motor driver 191a, 191b Guide rail 192 Z-axis motor 193 Ball screw 200 Load cell 211 Winding motor 212 Tension motor 213 Tape end sensor 500 EUVL mask blank 501 Substrate 502 Multilayer film 503 Absorber 504 Protection Film 505 Back surface protection film 1100 Foreign matter removing device 1110 XY stage 1111 Stage 1112 and 1113 Ball screw mechanism 1120 Foreign matter removing portion 1121 Movable base member 1122 Foreign matter removing tape 1123 Supply reel 1124 Take-up reel 1125 Tape cassette 1127 Rotary encoder 1130 Optical head 1140 Displacement meter 1150 Computer 1160 Monitor 1170 Stage control unit 1180 Foreign matter removal control unit 1 81 position controller 1182 CPU
1183 PLD unit 1184 Tape running control unit 1185 CPU
1186 PLD portion 1190 Fixed base member 1191 Z-axis motor driver 1191a, 1191b Guide rail 1192 Z-axis motor 1193 Ball screw 1200 Load cell 1211 Take-up motor 1212 Tension motor 1213 Tape end sensor 1300 Head 1301 Head main body 1301a Flat portion 1301b Recess 1301c Groove 1301d Orifice Portion 1301e Guide groove 1301f Chamber 1302 Cover member 1303 Supply pipe 1401 Air source 1402 Regulator 1403 Solenoid valve 1404 Filter 1500 Silicon wafer 1501 Silicon wafer main body 1502 Flattening layer d Foreign matter

Claims (17)

A holding unit for holding the substrate;
Foreign matter removing tape that contains particles and scrapes off and removes foreign matter attached to the substrate;
A foreign substance removing unit that performs a foreign substance removing process on the substrate while running the foreign substance removing tape;
A control unit for controlling the relative movement of the substrate and the foreign matter removing unit so that the foreign matter removing tape contacts the foreign matter;
Foreign matter removing apparatus comprising: A holding unit for holding the substrate;
A foreign matter removing tape that scrapes off and removes foreign matter adhering to the substrate, wherein the hardness of the particles contained in the foreign matter removal tape is lower than the hardness of the surface from which the foreign matter of the substrate is removed, and
A foreign substance removing unit that performs a foreign substance removing process on the substrate while running the foreign substance removing tape;
A control unit for controlling the relative movement of the substrate and the foreign matter removing unit so that the foreign matter removing tape contacts the foreign matter;
Foreign matter removing apparatus comprising: The foreign matter removing apparatus according to claim 2,
The substrate is an EUVL (Extreme Ultra Violet Lithography) mask or an EUVL mask blank,
The foreign matter removing portion removes the foreign matter attached to the back surface opposite to the reflective surface of the EUVL mask or the EUVL mask blank with a foreign matter removing tape;
Foreign matter removing device characterized by The foreign matter removing apparatus according to claim 3,
The particles are aluminum oxide (Al ₂ O ₃ );
Foreign matter removing device characterized by In the foreign matter removal apparatus according to any one of claims 2 to 4,
The surface of the substrate from which foreign matter is removed is formed with a chromium nitride (CrN) film,
The particles have a lower hardness than the chromium nitride film;
Foreign matter removing device characterized by A holding unit for holding the substrate;
Foreign matter removing tape that contains particles and scrapes off and removes foreign matter attached to the substrate;
A foreign substance removing unit that performs a foreign substance removing process on the substrate while running the foreign substance removing tape;
A control unit for controlling the relative movement of the substrate and the foreign matter removing unit so that the foreign matter removing tape contacts the foreign matter;
A foreign matter removing device comprising:
The substrate is a silicon wafer used for nanoimprint lithography,
The foreign matter removing portion removes the foreign matter attached to the silicon wafer with a foreign matter removing tape;
Foreign matter removing device characterized by The foreign matter removing apparatus according to claim 6,
The particles have a hardness capable of removing at least foreign substances contained in each layer formed on the silicon wafer;
Foreign matter removing device characterized by The foreign matter removing apparatus according to claim 7,
The particles are aluminum oxide (Al ₂ O ₃ );
Foreign matter removing device characterized by In the foreign matter removal apparatus according to any one of claims 1 to 8,
Furthermore, it has a foreign matter detection unit for detecting foreign matter attached to the substrate,
Based on the coordinates of the foreign matter obtained by the foreign matter detection unit,
A foreign matter removing apparatus that controls the control unit. The foreign matter removing apparatus according to any one of claims 1 to 9,
Furthermore, it has a receiving part for receiving the inspection result of the foreign substance inspection device for detecting the foreign substance adhering to the substrate,
Based on the coordinates of the foreign object obtained by the receiving unit,
A foreign matter removing apparatus that controls the control unit. The foreign matter removing apparatus according to claim 9,
Furthermore, it has a determination unit for determining the necessity of removing foreign matter from the size of the foreign matter obtained by the foreign matter detection unit,
A foreign matter removing apparatus that performs the foreign matter removing process on the substrate based on a judgment result of the judging section. In the foreign matter removal apparatus according to any one of claims 1 to 11,
Furthermore, a foreign matter measuring unit that measures the shape of the foreign matter present on the substrate,
A determination unit that determines whether or not the foreign matter needs to be removed from the measurement result of the foreign matter measurement unit;
A foreign matter removing apparatus that performs the foreign matter removing process on the substrate based on a judgment result of the judging section. The foreign matter removing apparatus according to claim 12,
The foreign matter removing apparatus, wherein the foreign matter measuring unit is a shape measuring system using a confocal optical system. In the foreign matter removal apparatus according to any one of claims 1 to 13,
A reference surface measurement unit that measures the position of the reference surface of the substrate for removing foreign matter,
Based on the position of the reference surface for foreign object removal of the substrate measured by the reference surface measurement unit, the control unit is configured to move the substrate and the foreign object to a position where the foreign material removal tape contacts the reference surface for foreign object removal of the substrate. Moving the removal part relatively,
Foreign matter removing device characterized by In the foreign matter removal apparatus according to any one of claims 1 to 14,
The foreign matter removing portion has a head provided on the opposite side of the substrate across the foreign matter removing tape at a portion where the substrate and the foreign matter removing tape are in contact with each other.
Having a floating structure in which the foreign matter removing tape is floated at a predetermined distance from the head;
Foreign matter removing device characterized by The foreign matter removing apparatus according to claim 15,
The floating structure is in a state where the foreign matter removing tape is floated at a predetermined distance from the head by flowing a gas between the head and the foreign matter removing tape,
Foreign matter removing device characterized by The foreign matter removing apparatus according to any one of claims 1 to 16,
The foreign matter removing tape is deployed in a planar shape at a position in contact with the substrate,
Foreign matter removing device characterized by