201240546 發明說明： 【發明所屬之技術領域】 本發明係涉及—種多層板貼合震 置及其方法，特別係 指一種利用液態膠夾4铋 /、乃冶，特別係 方法。 备來進灯板材贴合的多層板貼合裳置及其 【先前技術】 中關於多層板。;以遍應用，其 後的多層板具有較高的透明度的話，目能讓固化 ^用液態膠來做為貼合的媒介。然 便 面:外;上液態膠的貼合品質也是^Γ: 面板、液日日顯示面板等)所注重的地方。因此， 控 已有多種技術可以用來減少氣泡產生 :產二 量的需求。 .仃0罨子產品質 進二=伽用液態膠的 歲-下从’，、 液㈣83來貼合—上基板81 基板‘貝占人。面r 5是先將液態膠83點膠塗佈於上 ，G β1 L 、占σ面811。接著，再將上基板81翻轉，讓上基 或數個庵的^%膠83能夠因重力作用而聚集，以形成—個 ^ ’再將上基板81靠近τ基板82，以讓液 ^ / >成的峰頂能夠與下基板82的貼合面821進# 點接觸的贴合，而讓氣泡能夠減少。 進仃 -T* ^此種利用點接觸方式來排出氣泡的貼合技術， ; 集時有可此有形成多個峰頂，因此在實際進行上 基板81及下基板82的接觸貼合時，還是需要留意是否有 4/20 201240546 氣泡產生。此外，本領域技術人員可以了解，在貼合越大 尺寸的基板時’其液態膠83的流動性要求就越高，而此一 點接觸方式之貼合技術的需求則是要求使用較低流動性的 液態膠83，否則液態膠83將無法持續接觸在翻轉後的上基 板81 ’因此點接觸方式之貼合技術僅適用於小尺寸基板的 貼合。 請再參考第二圖，為習知技術利用壓合角度差異進行 貼合的示意圖，其是用來貼合一上基板91與一下基板92 。其中，下基板92的貼合面921是進一步設計有一限位框 94(屬於中空態樣），以將液態膠93點膠於限位框94所框設 的範圍内。接著，通過調整上基板91與下基板92之間的 壓合角度D來讓上基板91靠抵下基板92，使得上基板91 的貼合面911在藉由調整上基板91與下基板％之間的壓 合角度D之下，能夠與液態膠93產生較少的貼合氣泡。 然而，此一技術必須另外在下基板92的貼合面921上 設計有限位框94，並且也就由於限位框94的設計，讓液態 膠93的塗佈範圍受到限制。 曰除了上迷兩種貼合製程之外，另外一種常見的製程就 是直接在真轉境下實現基板的貼合，以減少貼合時所會 但是’要建構真空的環境，在整體設備機構 的要求W上較高，並且在生產成本上也就相對提高。此 外合=於夜態膠的特性要求也較高，必須在低真空環境下 不曰有小分子產生，以及必須考慮在 要能避免液體形成沸騰的現象。 4狀心下， '尺 如此 由目則的液態膠貼合技術來看，在 寸的多層板時，往往需搭配特定的貼合設備及=杜 5/20 201240546 不僅無法有效降低生產成本，更會影響生產流程的制定。 因此，對於多層板的貼合設備及其製程方面，仍有進一步 改善的空間。 ’ 【發明内容】 有鑑於上述的技術問題，本發明是用來有效減少多層 板貼合製造時所會產生的氣泡。其中，本發明是控制上、 下基板之間具有一適當的小間隙，以用來在上、下基板之 間的小間隙中進行注射液態膠。換句話說，本發明^利用 液體在小面積接觸時不會產生氣泡的特性原理來進行塗佈 液態膠’進而完成多層板的貼合。 根據本發明所提出之一方案，提供一種多層板貼合裝 置’包括：-第-載具、一第二載具及至少一注膠褒置。 -中第-載具是承載_下基板，而第二載具是承载一上 基板，使上基板的貼合面得以面向下基板_合面，並且 在下基板與上基板之間是具有—間隙空間。注膠裝置是伸 二，空間’並相對靠近上基板之側來注射液態膠，使液 態膠疋先接觸上餘再下滴’並且該下滴後的㈣膠能夠 維持接觸上基板及下基板。 、根據本發明所提出之另—方案，提供-種多層板貼合 方法，其步驟包括：首先，控制—上基板的貼合面面向一 :基板的貼合面’以讓上基板及下基板之間是具有一間隙 空接著，控舰少一注膠裝置伸入間隙空，並且相 近上基板之側來注射—液態膠，讓液態膠是先接觸上 土板再下滴，並且該下滴後的液_得轉持接觸上基板 及下基板。 藉此本每明所能達成的功效在於，能在常溫常壓下 6/20 201240546 ，進行多層板的貼合而不會輕易產生貼合氣泡，並且在不 會大幅增加生產成本的條件下，有效提升生產良率。此外 ，更可以輕易地適用於不同尺寸基板的貼合製程，增加貼 合裝置的通用性及實用性。 以上之概述與接下來的詳細說明及附圖，皆是為了能 進一步說明本發明為達成預定目的所採取之方式、手段及 功效。而有關本發明的其他目的及優點，將在後續的說明 及圖式中加以闡述。 【實施方式】 本發明是利用液體在小面積接觸時不會產生氣泡的特 性原理所设计出的多層板貼合裝置及其方法，以讓多層板 的上基板及下基板的貼合面是在相面對的情況下來進行液 態膠的點膠塗佈。使得液態膠在剛出膠時，是直接接觸上 基板，並且在叉重力作用而下滴與下基板接觸時，液態膠 始終都此和上基板維持接觸。如此，才再進一步進行後續 的壓合及固化等動作流程。 所§胃的多層板是指至少兩層的合成板架構，例如：觸 控面板、液晶顯不面板、塑膠合成基板、玻璃合成基板等 產σσ。其中，不同層的板材並不侷限於同一材質，亦可分 別是不同材質的板材或者經過*同加1製程之後的板材來 相互貼合，本發㈣無加以限制。為了方便說明起見，以 下實施例巾㈣層板就例如是以觸控面板來進行說明。 請參考第三圖，為本發明多層板貼合裝置的架構實施 例側視不意圖。如圖所示，本實施例提供—種多層板貼合 裝置1，其包括：至少一注膠裝置10、一第一載具u、一 第二載具12。此外，由於本實施例之多層板貼合裝置1可 7/20 201240546 ’因此多層板貼合裝置！ -、第-载具11及第二載具12的運制=置 11及第二載且12县八具中，苐一载具 „' 刀別可以進行前後左右各方向的移動 1 = 7整的設計態樣。此外，控制器在實 方式來達到相同控制的目的 ^而的 則可由使用^二 制’⑽述的操作程序表 由使用者依據貫際製程需求來進行設定。 、膠裝置IGtc用來填裝—液態 謝以依據設計需求來採用一光固化液液，的 =膠、-濕氣固化液態膠或—複合:二;= ==方::進所r複•液態膠是指= 照固化或加熱固化的液態膠，或^用先 氣固化的液態膠等。 丨 σ…、*化或濕 面板基板2°若以電容式觸控 读明® #下基板可例如是經過塗佈至少—導雷 透^層、電極層等處理之後的基板4 = -步包含-第—治具⑴，第—治具⑴弟載具一 11進 一絲面’以用來固定下基板2的位:。此夕卜，：ί 丈具111是例如採用-夹扣漸201240546 DISCLOSURE OF THE INVENTION [Technical Field] The present invention relates to a multi-layer board bonding vibration and a method thereof, and in particular to a method using a liquid glue clamp 4, /, and a special method. The multi-layer board-fitted skirt which is provided for the light-panel sheet bonding and the prior art relating to the multi-layer board. After the application, the subsequent multi-layer board has a higher transparency, so that the liquid can be used as a suitable medium for curing. However, the surface quality of the liquid glue is also the place where the liquid glue is attached. Therefore, there are a variety of techniques that can be used to reduce the generation of bubbles: the demand for production. . 仃 0 罨 product quality into two = gamma with liquid glue aged - down from ',, liquid (four) 83 to fit - upper substrate 81 substrate ‘Bei Zhanren. The surface r 5 is first applied with a liquid glue 83 on the top, G β1 L , and the σ plane 811. Then, the upper substrate 81 is turned over again, so that the upper base or a plurality of enamel glues 83 can be aggregated by gravity to form a ^ ' and then the upper substrate 81 is brought close to the τ substrate 82 to allow the liquid ^ > The formed peak top can be brought into contact with the bonding surface 821 of the lower substrate 82, and the air bubbles can be reduced. Into the 仃-T* ^ such a bonding technique for discharging air bubbles by the point contact method, and a plurality of peaks may be formed at the time of collection, so when the contact bonding of the upper substrate 81 and the lower substrate 82 is actually performed, Still need to pay attention to whether there is 4/20 201240546 bubble generation. In addition, those skilled in the art can understand that the liquidity requirement of the liquid glue 83 is higher when the larger-sized substrate is attached, and the contact technology of the contact method requires the use of lower fluidity. The liquid glue 83, otherwise the liquid glue 83 will not be able to continuously contact the inverted upper substrate 81'. Therefore, the point-contact bonding technique is only suitable for the bonding of small-sized substrates. Referring to the second figure, a schematic view of the conventional technique for bonding by the difference in the pressing angle is used to attach an upper substrate 91 and a lower substrate 92. The bonding surface 921 of the lower substrate 92 is further provided with a limiting frame 94 (in a hollow state) to glue the liquid glue 93 within the range framed by the limiting frame 94. Next, the upper substrate 91 is pressed against the lower substrate 92 by adjusting the pressing angle D between the upper substrate 91 and the lower substrate 92, so that the bonding surface 911 of the upper substrate 91 is adjusted by adjusting the upper substrate 91 and the lower substrate. Below the press angle D, it is possible to produce fewer conforming bubbles with the liquid glue 93. However, this technique must additionally design the limit frame 94 on the abutment surface 921 of the lower substrate 92, and also because of the design of the limit frame 94, the coating range of the liquid glue 93 is limited. In addition to the two bonding processes, another common process is to achieve the bonding of the substrate directly under the real transition, so as to reduce the environment when the bonding is required, but the environment to be vacuumed, in the overall equipment mechanism. The requirement is higher on W, and the production cost is relatively higher. In addition, the characteristics of the night gel are also high, and it is necessary to produce small molecules in a low vacuum environment, and it must be considered to avoid boiling of the liquid. Under the shape of the 4th heart, 'the rule of the liquid glue bonding technology from the point of view, in the case of the multi-layer board, it is often necessary to match the specific bonding equipment and = Du 5/20 201240546 not only can not effectively reduce the production cost, but Will affect the development of the production process. Therefore, there is still room for further improvement in the bonding equipment of the multilayer board and its process. SUMMARY OF THE INVENTION In view of the above technical problems, the present invention is for effectively reducing air bubbles generated during the manufacture of a multi-layer board. Among other things, the present invention controls a suitable small gap between the upper and lower substrates for injecting liquid glue in a small gap between the upper and lower substrates. In other words, the present invention utilizes the principle that the liquid does not generate bubbles upon contact in a small area to apply the liquid glue' to complete the lamination of the multilayer board. According to one aspect of the present invention, a multi-layer board bonding apparatus is provided which includes: a - a carrier, a second carrier, and at least one glue placement. - the middle first carrier is a carrier _ lower substrate, and the second carrier is an upper substrate, such that the bonding surface of the upper substrate faces the lower substrate _ sided surface, and has a gap between the lower substrate and the upper substrate space. The glue injection device is extended to the space 'and relatively close to the side of the upper substrate to inject the liquid glue, so that the liquid glue first contacts the upper and lower drops' and the (4) glue after the drop can maintain contact with the upper substrate and the lower substrate. According to another aspect of the present invention, a multi-layer board bonding method is provided, the method comprising: first, controlling a bonding surface of the upper substrate to face: a bonding surface of the substrate to allow the upper substrate and the lower substrate There is a gap between the air, and the control ship has one injection device that protrudes into the gap space, and is close to the side of the substrate to inject the liquid glue, so that the liquid glue first contacts the soil plate and then drops, and the lower drop The liquid _ has to be transferred to contact the upper substrate and the lower substrate. The effect that can be achieved by this is that it can be laminated at 6/20 201240546 under normal temperature and normal pressure without easily forming a bonding bubble, and without greatly increasing the production cost. Effectively increase production yield. In addition, it can be easily applied to the bonding process of different size substrates, increasing the versatility and practicability of the bonding device. The above summary, the following detailed description and the annexed drawings are intended to further illustrate the manner, the Other objects and advantages of the present invention will be described in the following description and drawings. [Embodiment] The present invention is a multilayer board bonding apparatus and a method thereof designed by utilizing a characteristic principle that a liquid does not generate bubbles when contacted in a small area, so that the bonding surface of the upper substrate and the lower substrate of the multilayer board is The dispensing of the liquid glue is carried out in the face of the situation. When the liquid glue is just out of the glue, it directly contacts the upper substrate, and when the fork is in contact with the lower substrate by the gravity of the fork, the liquid glue always maintains contact with the upper substrate. In this way, the subsequent press-fitting and curing processes are further carried out. The multi-layer board of the stomach refers to a composite board structure of at least two layers, such as a touch panel, a liquid crystal display panel, a plastic composite substrate, a glass composite substrate, and the like. Among them, the plates of different layers are not limited to the same material, and may be plated with different materials or plates after the same plus one process, and the present invention (4) is not limited. For convenience of explanation, the following embodiment (4) laminate is described, for example, by a touch panel. Referring to the third figure, the architectural embodiment of the multilayer board bonding apparatus of the present invention is not considered in the side view. As shown in the figure, the present embodiment provides a multi-layer board bonding apparatus 1 comprising at least one glue injection device 10, a first carrier u, and a second carrier 12. Further, since the multilayer board bonding apparatus 1 of the present embodiment can be 7/20 201240546', the multilayer board bonding apparatus! -, the transport of the first carrier 11 and the second carrier 12 = set 11 and the second load and 12 counties in the 12 counties, the first one of the vehicles „' knife can move in the front, rear, left and right directions 1 = 7 In addition, the controller can achieve the same control purpose in real mode, and can be set by the user according to the requirements of the continuous process using the operation program table described in (2). (Glue device IGtc) Used to fill-liquid to use a light-curing liquid according to the design requirements, = glue, - moisture-curing liquid glue or - compound: two; = = = side:: into the r complex liquid glue means = Liquid glue that is cured or heat-cured, or liquid glue that has been cured by gas, etc. 丨σ..., * or wet panel substrate 2° If capacitive touch-reading® #下基板 can be coated, for example The substrate 4 = -step comprises - the first fixture (1), and the first fixture (1) the carrier has a 11 into a filament surface for fixing the lower substrate 2 Bit: This is the:, ί, the fixture 111 is for example
面板2載用來承载—上基板3。若以電容式觸控 紛麻看基板3是做為一保護層，因此可例如是經過 1、抗眩抗菌等加卫處理之後的基板。第二载具U 201240546 進第_治具121,以固定下基板2。由於第二載 具12是用來承载上基板3，讓上基板3的貼合面是面向下 基板2的貼合面，因此第二治具121可例如是設置於第二 載具12的下表面’並且採用…及附裝置的設計，以利用吸 風附著的方式來承載及©定上基板3。當然，第二載具12 承载上基板3的手段並非侷限於此，任何可以達到讓上基 板3的貼合面是面向下基板2的貼合面的承載方式 ^ 本發明所保護的範圍。 人穴，且呢明的是，本實施例的控制器是控制第一 -1 具12，關整上基板3及下基板2之間是相距 裝；的特性及注膠 θ — θ 八·1求5又疋間隙空間ί的大小。附帶一提的 是以t實施例所舉例的觸控面板來講，該間隙空間I k吊是屬於毫米(mm)的距離。 此^卜’控制器進—步控制注膠裝置1G位於上基板3及 “ Ί _ _空間1 ’並且在位置上相對是靠近上基 反3之側來活動地(_卿)注射液轉g。盆中，本實施 膠-裝置1G方便地進人並活動於間隙空間1， 管^、壬叙進步包含—針狀注射管101，以由針狀注射 1活動於間隙空間1，並注射塗佈液態膠G。 大亍一:2第三A圖’為第三圖的八部分的局部放 押：= 態膠G在嶋間的狀況。其中， 進行轉塗佈液態膠G時，針狀 ^ Γ鄉测上基板 之本實施例所調整的上基板3及下基板2 、曰I’輪下崎的液得以維持接觸上 9/20 201240546 基板3及下基板2。藉此，本發明得以利用小間隙來注射液 態膠G，並且通過液體在小面積接_林會產生氣泡的原 理來有效降低貼合時產生氣泡的機率。 總而5之，在至少要能讓注膠裝置進入間隙空間工 的條件下，本實施例的控制器是依據液態膠G的流動性之 特性來設定_空間I，並且該_空間〗是能讓所注射出 的液態膠G’不管是在出膠瞬間或者是因重力作用而下滴 與下基板2接觸之後，都能持續地與上基板3維持接觸。 舉例來講，假設所使用的液態膠G的流動性較高的話，則 間I是設定為較小的距離，以避免下滴後的液態膠g 成脫離的情形；反之，若液態膠G的流動性 ^的話，則相較起來間隙空則可以不需設定為過小的距 離，以在精細度的校正上較容易控制。 相對常注膠裝置1〇在注膠初期的注膠量 地進行貼合製程之控制為了要更精確 及正常注膠時期的:=離讓==膠初期以 離是小於正常、=離，使得注膠初期所調整的距 疋⑺正吊/主膠時期的所調整的 的態膠G是能維持與上基板3接觸的要出 注膠初期及正常注膠時期 、中’有關 =膠裝置W的注膠σ徑尺;:賴:;則是依據實 设定，在此並無加以限制。 、夕、特性等來調整 的二1體為本發明多層赠置 4。本貧施例是進—步針對多層板 201240546 貼合裝置1的整體架構來進行說明。如圖所示，多層板貼 合裝置1除了包含前述提過的注膠裝置10、第一載具11、 第二载具12及控制器13之外，更可進一步包含：一升降 壓合機構14、一導出機構15、一入料機構16、一清潔滾輪 17、一光學定位裝置18及一定位固化裝置〗9。其中，本實 • 施例的控制器〗3是例如採用本地端控制的設計，以依據操 • 作程序表來進行動作流程之控制，並且顯示相對應的資訊 〇 升降壓合機構14是電性連接控制器13,並且固接第二 載具12，用來控制第二載具a的垂直位移，以實現調整該 間隙空間I以及控制上基板3壓合於下基板2的功能。導出 機構15是電性連接控制器13，並且設置於第一載具u的 下游，用來導出上基板3及下基板2壓合後所形成的多層 板。 入料機構16是設置於第二載具12的上游，電性連接 控制器13，用來輸送上基板3至第二载具12。並且，入料 機構16所輸送的上基板3可例如是以貼合面向下的方式來 進行輸送，以方便後續進行貼合。清潔滾輪17是架設於入 料機構W用來清潔入料機構16上所輪送的上基板3的貼 ‘ 纟面’以讓上基板3的貼合面在貼合前能進-步進行清潔 。當然，所屬技術領域具有通常知識者可以了解，在多層 板貼合裝置i的設計上，上基板3的入料方式、清潔方^ 以及控制上基板3貼合面面向下基板2貼合面的方式，並 非僅偈限於本實施例。 此外，第-載具11及第二载具12除了是上述架構所 述的分別透過第-治具m及第二治具121來初步固定下 11/20 201240546 基板2及上基板3的位置之外，本實施例更是進一步設計 了光學定位裝置〗8，如：電荷耦合元件(Charge c〇upled Device，CCD)，其是電性連接控制器13，用來搭配第一載 具11及第二載具12可前後左右調整的設計，以執行一光 學定位程序來進一步精確地定位上基板3及下基板2之間 的相對貼合位置。當然，若考量成本因素的話，當多層板 貼合裝置1增設了光學定位裝置18之後，第一載具n及 第一載具12即可分別省去使用第一治具ηι及第二治具 121的設計，以直接由光學定位裝置18來定位上基板3及 下基板2之間的相對貼合位置。 定位固化裝置19是電性連接控制器13,用來在上基板 3壓合於下基板2並且液態膠G進行溢膠之後，執行一固 定程序，以採用定點或全面固化方式來固化上基板3及下 基板2之間的液態膠G。藉以避免第二載具12在脫離上基 板3時，因液態膠G尚未固化而導致上基板3與下基板1 產生位置偏移。其中，定位裝置19是依據實際^態膠 G，種類來制不同的設計’可例如是光照裝置或加熱裝 置夺。 附帶說明的是，多層板貼合裝置丨可例如是〜一 無塵環境，以避免落塵產生，提高生產良率。當然^若多 層板貼合裝置1是架設於一般環境的容置空間中的話，= 可以在該容置空間中進一步增設一空氣淨化裝置，以淨化 該容置空間中的空氣，以盡可能避免落塵產生。 進一步說明的是，當升降壓合機構14壓合上基板3及 下基板2來擴散液態膠G的過程中，為了避免溢膠不良而 產生包圍氣泡的情形，本實施例更可因應不同的基板形狀 12/20 201240546 來塗佈不同的圖形。換 ,a, 奐勹5舌§兒，控制器13可以依據一圖形 座才示值來控制注膠裳置丨π 上基板3。 置m鱗G，以塗佈-圖形於 :料考第五圖，為本發明轉裝置所塗佈的圖形 貫把飾4圖。本實施例是例如將液_ G塗佈在方形 上來進订㈣’如圖所示，轉me較佳是採用米 :土的主佈方式來塗佈液態膠G，以當上基板3麼合於下 土板2而讓液轉G進行郷時，得赠低產生包圍氣泡 的機會。 除上返的米字型塗佈之外，在實際應用上，假設是採 用搞，形基板來設計的話，則注縣置iQ所塗佈的圖形可 例如是直接在基板的中心部分塗佈一直線即可。然而，在 此，須說明的是，由於本發明是針對轉貼合時來降低貼 。氣泡產生的機率，因此，在實際液態膠G的塗佈圖形方 面’本發明並無加以限制。 最後’為了更具體地說明本發明實際進行貼合時的動 作流程，請進一步參考第六圖，為本發明多層板貼合方法 的實施例流程圖。如圖所示，本實施例提供一種多層板貼 合方法’其步驟包括：首先，提供一上基板及一下基板(S6〇 j) ’並且控制上基板的貼合面是面向下基板的貼合面（S6〇3) 接下來’調整上基板及下基板之間是具有一間隙空間 (S605) ’並且控制至少一注膠裝置活動地伸縮於間隙空間， 且相對靠近上基板之側(S607)。在步驟(S607)完成之後的條 件狀況下，便可開始依據一圖形座標值來控制注膠裝置注 射一液態膠，以塗佈一圖形於上基板(S609)。透過本實施例 13/20 201240546 的設計，該注射出的液態膠是會先接觸上基板再下滴，並 且该下滴後的液態膠是會維持接觸上基板及下基板。 接著，判斷該圖形是否塗佈完成(S611)。若步驟(S611) 的判斷結果為否，表示注膠裝置尚未塗佈完該圖形，於是 重複步驟(S609)及(S611)，直到步驟(8611)的判斷結果為是 時，則代表注膠裝置已塗佈完成該圖形。此時便可控制注 膠裝置離開間隙空間(S613)。 等到注膠裝置抽離間隙空間後，便進行垂直壓合上基 板及下基板(S615)，使上基板及下基板之間所注射的液態膠 開始進行溢膠。補充說明的是，在步驟(S6〇1)進行入料上基 板及^基板至步驟(S615)進行壓合上基板及下基板的期間 内，任一步驟執行之後，為了確保上基板及下基板之間的 相對貼合位置能齡持不變’冑可選擇性地執行一光學定 位知序，用以矯正上基板及下基板之間的相對貼合位置。 藉此，得以確保上基板及下基板之間的相對貼合位置是不 變的。 此外，待步驟(S615)溢膠完成之後，可以進一步執行一 固=程序(S616)，讓上純及下基板之間所㈣的液態膠能 夠定點或全面地固化，以避免後續製程直接或間接導致上 基板及下基板產生位置偏移的情形。 在步驟(S616)之後，便執行一導出程序，以導出上基板 及下基板壓合後所成型的多層板(S617)。最後，執行一固化 程士(S619)，以©化上基板及下基板之間的液轉。藉此， 以實現多層板的貼合及固化之製作流程。 綜上所述，本發明利用液體在小面積接觸時不會產生 氣泡的特性原理所設計出的多層板貼合裝置及其方法，可 14/20 201240546 大巾祝修改生產流程之下，有效地降低貼合氣泡 的產生，提升多層板的生產良率。並且本發明可以直 常溫常壓下，進行多層板的貼合，避Μ建構複雜的生產 環境而增加生產成本。此外’本發明更可以輕易地適用於 不同尺寸基板的貼合製程，增加多層板貼合裝置的通用性 及實用性。 惟，以上所述，僅為本發明的具體實施例之詳細說明 及圖式而已，並非用以限制本發明，本發明之所有範圍應 以下述之申請專利範圍為準，任何熟悉該項技藝者在本發 明之領域内，可輕易思及之變化或修飾皆可涵蓋在以下本 案所界定之專利範圍。 【圖式簡單說明】 第一圖係習知技術利用液態膠的點接觸方式進行貼合的 示意圖； 第二圖係習知技術利用壓合角度差異進行貼合的示意圖； 第二圖係本發明多層板貼合農置的架構實施例側視示意 圖； 第三Α圖係第三圖的Α部分的局部放大示意圖； 第四圖係本發明多層板貼合裝置的實施例立體架構示意 圖； 第五圖係本發明注膠裝置所塗佈的圖形的實施例示意圖 ;及 第六圖係本發明多層板貼合方法的實施例流程圖。 【主要元件符號說明】 [習知技術] 81 ’ 91上基板 15/20 201240546 811，911上基板的貼合面 82，92下基板 821，921下基板的貼合面 83，93液態膠 94限位框 [本發明] 1多層板貼合裝置 10注膠裝置 101針狀注射管. 11第一載具 111第一治具 12第二載具 121第二治具 13控制器 14升降壓合機構 15導出機構 16入料機構 17清潔滾輪 18光學定位裝置 19定位固化裝置 2下基板 3上基板 G液態膠 I間隙空間 S601至S619流程圖步驟說明 16/20The panel 2 is loaded to carry the upper substrate 3. If the substrate 3 is used as a protective layer by capacitive touch, it can be, for example, a substrate after being treated by anti-glare, antibacterial or the like. The second carrier U 201240546 is inserted into the jig 121 to fix the lower substrate 2. Since the second carrier 12 is for carrying the upper substrate 3 and the bonding surface of the upper substrate 3 is a bonding surface facing the lower substrate 2, the second jig 121 can be disposed, for example, under the second carrier 12. The surface 'and the design of the device and the attached device are used to carry and secure the substrate 3 by means of suction adhesion. Of course, the means for carrying the upper substrate 3 of the second carrier 12 is not limited thereto, and any manner of supporting the bonding surface of the upper substrate 3 to face the bonding surface of the lower substrate 2 is within the scope of the present invention. The human hole, and it is clear that the controller of the embodiment controls the first -1 12, and the separation between the upper substrate 3 and the lower substrate 2 is the distance between the assembly and the injection of the θ - θ 八·1 Find 5 and the size of the gap space ί. Incidentally, in the case of the touch panel exemplified in the t embodiment, the gap space I k is a distance of millimeters (mm). The controller further controls the glue injection device 1G to be located on the upper substrate 3 and " Ί _ _ space 1 ' and is relatively close to the side of the upper base 3 in the position (_ qing) injection to g In the basin, the glue-device 1G of the present embodiment conveniently enters and moves in the interstitial space 1, and the tube and the sputum advance include a needle-shaped injection tube 101 to move into the interstitial space 1 by the needle-like injection 1 and to inject the coating. Cloth liquid glue G. Datong 1: 2, the third A picture 'is the partial release of the eight parts of the third figure: = the state of the state G in the day. Among them, when the liquid glue G is applied, the needle is ^ The liquid of the upper substrate 3 and the lower substrate 2 and the lower substrate 2 and the lower substrate 2 adjusted in this embodiment of the substrate are maintained in contact with the upper 9/20 201240546 substrate 3 and the lower substrate 2. Thereby, the present invention is utilized A small gap is used to inject the liquid glue G, and the probability of generating bubbles when the liquid is applied in a small area is effectively reduced by the principle that the bubble is generated in a small area. In general, at least the glue injection device must be allowed to enter the gap space. Under the condition, the controller of the embodiment is set according to the characteristics of the fluidity of the liquid glue G_ The space I, and the _space, is such that the injected liquid glue G' can maintain continuous contact with the upper substrate 3 even after it is contacted with the lower substrate 2 at the instant of dispensing or by gravity. For example, if the fluidity of the liquid glue G used is high, then the distance I is set to a small distance to avoid the liquid glue g after the drop is detached; otherwise, if the liquid glue G If the fluidity is ^, the clearance gap can be set to an excessively small distance, so that it is easier to control in the correction of the fineness. The relative injection molding apparatus 1 performs the injection amount at the initial stage of injection molding. The control of the bonding process is to be more precise and normal in the period of injection: ========================================================================================= The adjusted state glue G is a glue injection σ diameter rule for maintaining the initial contact with the upper substrate 3 and the normal glue injection period, and the related 'adhesive device W'; There is no restriction here. The two bodies of the adjustment, the characteristics, etc. Invention of the multi-layered gift 4. This embodiment of the invention is further described with respect to the overall structure of the multi-layer board 201240546 laminating apparatus 1. As shown, the multi-layer board laminating apparatus 1 comprises the above-mentioned injection molding apparatus 10 in addition to the above. The first carrier 11 , the second carrier 12 and the controller 13 further include: a lifting and lowering pressing mechanism 14 , a guiding mechanism 15 , a feeding mechanism 16 , a cleaning roller 17 , and an optical positioning The device 18 and a positioning curing device are 9. The controller 3 of the embodiment is, for example, a design controlled by a local end, to control the action flow according to the operation table, and display the corresponding The information 〇 lifting and lowering mechanism 14 is electrically connected to the controller 13 and is fixed to the second carrier 12 for controlling the vertical displacement of the second carrier a to adjust the gap space I and control the upper substrate 3 to be pressed. The function of the lower substrate 2. The derivation mechanism 15 is electrically connected to the controller 13, and is disposed downstream of the first carrier u for guiding the multilayer board formed by pressing the upper substrate 3 and the lower substrate 2. The feeding mechanism 16 is disposed upstream of the second carrier 12 and electrically connected to the controller 13 for conveying the upper substrate 3 to the second carrier 12. Further, the upper substrate 3 conveyed by the feeding mechanism 16 can be conveyed, for example, in a manner that the bonding surface faces downward to facilitate subsequent bonding. The cleaning roller 17 is mounted on the feeding mechanism W for cleaning the upper surface of the upper substrate 3 which is rotated on the feeding mechanism 16 so that the bonding surface of the upper substrate 3 can be cleaned before being fitted. . Of course, those skilled in the art can understand that in the design of the multi-layer board bonding apparatus i, the feeding mode of the upper substrate 3, the cleaning method, and the bonding surface of the upper substrate 3 are controlled to face the bonding surface of the lower substrate 2. The manner is not limited to this embodiment. In addition, the first carrier 11 and the second carrier 12 are initially fixed to the lower 11/20 201240546 substrate 2 and the upper substrate 3 by the first jig m and the second jig 121 respectively. In addition, the embodiment further designs an optical positioning device 8, such as a charge coupled device (CCD), which is an electrical connection controller 13 for matching the first carrier 11 and the first The two carriers 12 are designed to be adjusted back and forth, left and right, to perform an optical positioning process to further accurately position the relative bonding positions between the upper substrate 3 and the lower substrate 2. Of course, if the cost factor is taken into consideration, after the optical positioning device 18 is added to the multi-layer board bonding apparatus 1, the first carrier n and the first carrier 12 can respectively dispense with the use of the first fixture ηι and the second fixture. The design of 121 is to directly position the relative bonding position between the upper substrate 3 and the lower substrate 2 by the optical positioning device 18. The positioning curing device 19 is an electrical connection controller 13 for performing a fixing process to cure the upper substrate 3 by using a fixed point or a full curing method after the upper substrate 3 is pressed against the lower substrate 2 and the liquid glue G is overflowed. And a liquid glue G between the lower substrate 2. By avoiding the second carrier 12 from being detached from the upper substrate 3, the upper substrate 3 and the lower substrate 1 are displaced due to the fact that the liquid glue G has not yet solidified. Among them, the positioning device 19 is different in design according to the actual glue G, and can be, for example, an illumination device or a heating device. Incidentally, the multi-layer board bonding apparatus can be, for example, a dust-free environment to avoid dust generation and improve production yield. Of course, if the multi-layer board bonding apparatus 1 is installed in a accommodating space of a general environment, an air purifying device may be further added to the accommodating space to purify the air in the accommodating space to avoid as much as possible. Dust is produced. Further, in the process of pressing the upper substrate 3 and the lower substrate 2 to diffuse the liquid glue G in the process of pressing the upper and lower substrates 3 and the lower substrate 2 to form a surrounding bubble, the present embodiment can further respond to different substrates. Shape 12/20 201240546 to coat different graphics. For the change, a, 奂勹5 tongue §, the controller 13 can control the injection molding 丨 π upper substrate 3 according to the value of a graphic holder. The m scale G is set to be coated-patterned in the fifth figure of the material test, which is a figure 4 of the graphic design of the transfer device of the present invention. In this embodiment, for example, the liquid _G is coated on a square to be ordered (4). As shown in the figure, it is preferable to apply the liquid glue G by using a main cloth of rice: soil to make the upper substrate 3 When the liquid is transferred to the lower earth plate 2 and the liquid is turned to G, it is given a low chance of enclosing the air bubbles. In addition to the upper rice-shaped coating, in practical applications, if it is designed by using a shaped substrate, the pattern coated by the iQ can be coated directly on the center of the substrate, for example. Just fine. However, it should be noted here that the present invention is directed to lowering the sticker for the purpose of rewinding. The probability of bubble generation, therefore, is not limited in the invention of the coating pattern of the actual liquid glue G. Finally, in order to more specifically describe the operation flow when the present invention is actually bonded, please refer to the sixth drawing to further illustrate a flow chart of an embodiment of the method for laminating a multi-layer board according to the present invention. As shown in the figure, the present embodiment provides a method for laminating a multi-layer board, the steps of which include: firstly, providing an upper substrate and a lower substrate (S6〇j)' and controlling the bonding surface of the upper substrate to be a bonding to the lower substrate. Surface (S6〇3) Next, 'the adjustment between the upper substrate and the lower substrate has a gap space (S605)' and controls at least one glue injection device to flexibly expand and contract in the gap space, and is relatively close to the side of the upper substrate (S607) . In the condition after the completion of the step (S607), it is possible to start controlling the glue injection device to inject a liquid glue according to a graphic coordinate value to apply a pattern on the upper substrate (S609). Through the design of the embodiment 13/20 201240546, the injected liquid glue will contact the upper substrate first and then drop, and the liquid glue after the drop will maintain contact with the upper substrate and the lower substrate. Next, it is judged whether or not the pattern is coated (S611). If the result of the determination in the step (S611) is NO, it indicates that the glue injection device has not finished coating the pattern, and then the steps (S609) and (S611) are repeated until the judgment result of the step (8611) is YES, which represents the glue injection device. The graphic has been coated. At this time, the glue device can be controlled to leave the clearance space (S613). After the glue injection device is pulled out of the gap space, the upper substrate and the lower substrate are vertically pressed (S615), so that the liquid glue injected between the upper substrate and the lower substrate starts to overflow. In addition, in the step (S6〇1), during the process of feeding the upper substrate and the substrate to the step (S615), the upper substrate and the lower substrate are pressed, and after the step is performed, the upper substrate and the lower substrate are ensured. The relative bonding position between the two can be kept unchanged. The optical positioning can be selectively performed to correct the relative bonding position between the upper substrate and the lower substrate. Thereby, it is ensured that the relative bonding position between the upper substrate and the lower substrate is not changed. In addition, after the completion of the step (S615), the solid solution can be further performed (S616), so that the liquid glue between the upper and lower substrates can be fixed or fully cured to avoid direct or indirect subsequent processes. A situation in which the upper substrate and the lower substrate are displaced. After the step (S616), a derivation process is performed to derive the multilayer board formed by pressing the upper substrate and the lower substrate (S617). Finally, a curing process (S619) is performed to chemically transfer the liquid between the upper substrate and the lower substrate. Thereby, the manufacturing process of bonding and curing of the multilayer board is realized. In summary, the present invention utilizes the principle of the principle that the liquid does not generate bubbles when in contact with a small area, and the multi-layer board bonding apparatus and the method thereof can be effectively modified under the production process of 14/20 201240546 Reduce the generation of laminating bubbles and increase the production yield of the multi-layer board. Moreover, the present invention can perform the lamination of the multi-layer boards under normal temperature and normal pressure, thereby avoiding the construction of a complicated production environment and increasing the production cost. Further, the present invention can be easily applied to a bonding process of substrates of different sizes, and the versatility and practicability of the multilayer board bonding apparatus can be increased. However, the above description is only for the purpose of illustration and illustration of the embodiments of the present invention, and is not intended to limit the scope of the invention. Variations or modifications that may be readily conceived within the scope of the invention may be covered by the scope of the invention as defined in the following. BRIEF DESCRIPTION OF THE DRAWINGS The first figure is a schematic diagram of a conventional technique for bonding by means of a point contact method of a liquid glue; the second figure is a schematic view of a conventional technique for bonding by using a difference in a press angle; A side view of a structural embodiment of a multi-layered board-fitted agricultural system; a third enlarged view of a third part of the third embodiment; a fourth schematic view of a three-dimensional structure of the multi-layered board bonding apparatus of the present invention; BRIEF DESCRIPTION OF THE DRAWINGS Fig. is a schematic view showing an embodiment of a pattern coated by the gelling device of the present invention; and a sixth drawing showing a flow chart of an embodiment of the method for laminating a multilayer board of the present invention. [Description of main component symbols] [Prior Art] 81 '91 Upper substrate 15/20 201240546 811, 910 bonding surface 82 of the upper substrate, 92 lower substrate 821, 923 lower substrate bonding surface 83, 93 liquid glue 94 Position frame [Invention] 1 multi-layer plate bonding device 10 injection molding device 101 needle injection tube. 11 first carrier 111 first fixture 12 second carrier 121 second fixture 13 controller 14 lifting and lowering mechanism 15Extraction mechanism 16 Feeding mechanism 17 Cleaning roller 18 Optical positioning device 19 Positioning curing device 2 Lower substrate 3 Upper substrate G Liquid glue I Gap space S601 to S619 Flowchart Step description 16/20